CN113523933A - Integrated device for wafer polishing and polishing - Google Patents

Integrated device for wafer polishing and polishing Download PDF

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Publication number
CN113523933A
CN113523933A CN202110857065.8A CN202110857065A CN113523933A CN 113523933 A CN113523933 A CN 113523933A CN 202110857065 A CN202110857065 A CN 202110857065A CN 113523933 A CN113523933 A CN 113523933A
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China
Prior art keywords
polishing
disc
grinding
wafer
cavity
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Granted
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CN202110857065.8A
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Chinese (zh)
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CN113523933B (en
Inventor
贺贤汉
佐藤泰幸
原英樹
杉原一男
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Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
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Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
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Priority to CN202110857065.8A priority Critical patent/CN113523933B/en
Publication of CN113523933A publication Critical patent/CN113523933A/en
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Publication of CN113523933B publication Critical patent/CN113523933B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses a wafer polishing and burnishing integrated device, which relates to the technical field of semiconductor manufacturing and comprises a cabinet, wherein a polishing and burnishing mechanism with a closed-loop structure is arranged in the cabinet; the grinding and polishing mechanism comprises an upper loading platform, a lower loading platform and a conveying disc, wherein conveying channels are arranged on inner rings of the upper loading platform and the lower loading platform, and a plurality of cavities are arranged on the upper loading platform and the lower loading platform on the conveying channels in a penetrating manner along the circumferential direction; the conveying disc is positioned in the conveying channel, and transfer positions corresponding to the plurality of cavities are arranged on the circumferential direction of the conveying disc; the two sides of the opening of the cavity body are respectively provided with a disk body, and the cavity body comprises a primary grinding cavity, an upper fine grinding cavity, a lower fine grinding cavity, an upper polishing cavity, a lower polishing cavity and a cleaning cavity which are distributed among the cavity bodies at equal intervals. The invention realizes the integrated processing of wafer grinding and polishing by a closed-loop transmission mode, has high processing efficiency, simple device structure and lower investment and subsequent maintenance cost, and is suitable for large-scale production.

Description

Integrated device for wafer polishing and polishing
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer polishing and burnishing integrated device.
Background
Wafers are silicon wafers used for manufacturing silicon semiconductor integrated circuits, and are called wafers because they are circular in shape, and various circuit element structures can be manufactured on silicon wafers, and thus they are attracting attention.
During the manufacturing process of silicon wafers, the wafers need to be ground and polished. The existing method for grinding and polishing the wafer usually adopts a step-by-step mode for processing, the wafer processed in the previous procedure is transferred to the next procedure by a worker according to an operation specification, the operation is complicated, the wafer is easy to damage in the transfer process, for example, scratch or edge breakage phenomenon is caused, in addition, when the wafer is ground or polished, due to the limitation of a processing technology, the wafer is usually processed by a single surface in grinding or polishing, the wafer processing efficiency is greatly reduced, although the efficiency can be relatively improved by processing the wafer double-surface grinding or polishing equipment, the equipment structure is complicated, the equipment is expensive, and the generation input cost is increased. Therefore, based on the existing problems, there is a need for an apparatus that can provide wafer grinding and polishing.
Disclosure of Invention
The invention aims to solve the defects that the prior art cannot efficiently process wafer grinding and polishing procedures and the equipment cost is high, and provides the wafer grinding and polishing integrated device.
In order to achieve the purpose of the invention, the invention adopts the following technical scheme:
a wafer grinding and polishing integrated device is designed, and comprises a cabinet, wherein a grinding and polishing mechanism with a closed-loop structure is fixedly arranged in the cabinet through an upright post;
the grinding and polishing mechanism comprises an upper carrying platform, a lower carrying platform and a conveying disc which are arranged up and down symmetrically, the upper carrying platform and the lower carrying platform are of annular structures, and connecting plates for fixing the upper carrying platform and the lower carrying platform are arranged at intervals in the circumferential direction of the upper carrying platform and the lower carrying platform; the inner rings of the loading platform and the downloading platform are provided with annular transmission channels which are embedded; the loading platform and the downloading platform are positioned on the transmission channel and are provided with a plurality of cavities in a penetrating manner along the circumferential direction; the conveying disc is positioned in the conveying channel, a conveying motor for driving the conveying disc to rotate is fixedly arranged at the axis position of the conveying disc, and conveying positions corresponding to the cavities are arranged on the periphery of the conveying disc; two sides of the opening of the cavity are respectively provided with a disk body for wafer processing, the disk bodies are matched with the inner diameter of the corresponding cavity, and the side parts of the cavity are respectively provided with a telescopic cylinder for driving the disk bodies to do linear motion up and down and a rotating motor for driving the disk bodies to rotate at a high speed; the cavity comprises a primary grinding cavity, an upper fine grinding cavity, a lower fine grinding cavity, an upper polishing cavity, a lower polishing cavity and cleaning cavities which are distributed at equal intervals; and a box body for cleaning the wafer is arranged below the cleaning cavity.
Compared with the prior art, the wafer polishing and polishing integrated device adopting the technical scheme has the following beneficial effects:
the integrated device for polishing and burnishing the wafer forms an embedded closed-loop transmission channel in the integrated device through the upper and lower bearing platforms which are butted, and a series of continuous processing procedures for polishing and burnishing the wafer are arranged on the channel, so that all processing of polishing and burnishing the wafer can be realized after the wafer is processed through the closed-loop channel, the wafer does not need to be transferred manually in the midway, the damage caused by transfer is reduced, the workload of workers is reduced, and the efficiency of polishing and burnishing the wafer is improved.
Secondly, the invention adopts a closed-loop continuous processing mode, and under the condition of normal operation, the device can finish a finished product of the polished and polished wafer after finishing one processing procedure every time the device operates, thereby providing the polishing and polishing efficiency of the wafer, which is 4-5 times of that of the traditional polishing and polishing.
The whole device is simple in structure, avoids the adoption of complex grinding and polishing equipment, greatly reduces investment and subsequent maintenance cost, and is suitable for large-scale production.
Further, the disk body that the primary grinding chamber corresponds is fixed with the grinding pad that is used for the two-sided corase grind of wafer including two primary grindstones that the symmetry set up in the quotation of primary grindstone, and primary grindstone plays to the section back, and the comparatively crude wafer in surface carries out preliminary polishing, polishes and gets rid of comparatively crude superficial layer, and when convenient follow-up meticulous polishing, the thickness error of polishing that the non-polishing face caused because of the roughness in surface is fixed and is reduced.
Furthermore, the disk body that goes up the finish grinding chamber and correspond includes last finish grinding disk and lower fixed disk that the symmetry set up, go up the finish grinding disk and be located the top in finish grinding chamber, be fixed with the grinding pad that is used for the wafer upper surface to grind finely in the quotation of going up the finish grinding disk, be fixed with the locating pad that is used for wafer lower surface to fix in the quotation of lower fixed disk.
Further, the disk body that the fine grinding chamber corresponds down includes last fixed disk and the fine grinding dish down that the symmetry set up, the fine grinding dish is located the below in fine grinding chamber down, be fixed with the locating pad that is used for wafer lower surface to fix in the quotation of last fixed disk, be fixed with the grinding pad that is used for wafer upper surface fine grinding down in the quotation of fine grinding dish.
The single-side step-by-step polishing of the top surface and the bottom surface is adopted in the polishing stage, on one hand, the complex structure of the equipment is simplified, on the other hand, the cost of the equipment and the subsequent maintenance can be reduced, although the single-side polishing of the wafer is adopted, the polishing of the single side is carried out synchronously relative to two wafers, the polishing of the double sides of the wafer is carried out substantially, and the polishing efficiency is not inferior to that of the double sides of the same wafer. In this process of polishing, at first adopt the meticulous benefit of polishing of wafer top surface to lie in, can reduce the bottom surface when polishing, the tiny granule of polishing causes the influence to the wafer face of having polished, if carry out meticulous polishing to the wafer bottom surface earlier, when polishing the brilliant round top surface, the tiny granule that the top surface was polished down just falls into easily on the wafer bottom surface, when getting into next process, these tiny granules that fall into, just can cause the damage to the wafer bottom surface of polishing, and polish the top surface earlier and polish the bottom surface again, alright the emergence of this kind of condition that significantly reduces.
Furthermore, the disk body that the upper polishing chamber corresponds includes upper polishing dish and lower polishing sucking disc that the symmetry set up, upper polishing dish is located the top in upper polishing chamber, fixed being equipped with the polishing pad that is used for wafer upper surface polishing on the quotation of upper polishing dish.
Further, the disk body that the lower polishing chamber corresponds includes last polishing sucking disc and the lower polishing dish that the symmetry set up, lower polishing dish is located the below in lower polishing chamber, fixed being equipped with the polishing pad that is used for the polishing of wafer lower surface on the quotation of lower polishing dish.
Like the above wafer polishing method, the polishing of the wafer also adopts single-side step polishing of the top surface and the bottom surface, on one hand, the complex structure of the equipment is simplified, on the other hand, the cost of the equipment and the subsequent maintenance can be reduced, and meanwhile, the high efficiency of the double-side polishing equipment is kept. In the polishing process, the upper surface of the wafer is polished first, and then the lower surface of the wafer is polished, so that the damage to the polished surface caused by residual micro grinding particles is still avoided.
Further, the disk body that the washing chamber corresponds including the symmetry set up wash the dish with wash the dish down on, go up wash the dish by telescopic cylinder and rotating electrical machines order about, it sets up to wash the dish down in the box, be equipped with the telescopic support arm that is used for elastic support to wash the dish down on the axis position of box, be equipped with the spring that is used for washing down the dish and resets in the telescopic support arm, the lateral part of box still is equipped with water inlet and the delivery port that is used for the mobile change washing liquid.
The rear parts of the primary grinding cavity, the upper fine grinding cavity, the lower fine grinding cavity, the upper polishing cavity and the lower polishing cavity of the wafer are respectively provided with a cleaning cavity, so that the processed wafer is cleaned, and residual micro particles on the surface of the wafer are removed, thereby reducing the damage of the micro particles to the surface of the polished and polished wafer.
Further, the position that transfer passage's epitaxial week upwards corresponds just to grind the chamber, go up the correct grinding chamber and finely grind the chamber down is equipped with the dust removal mouth, and the external dust collecting equipment of dust removal mouth is provided with the dust removal mouth on just grinding the chamber, going up the correct grinding chamber and finely grinding the chamber down, and its purpose is in order to clear away the tiny particle under in time will polishing.
Furthermore, the position of the extension circumference of the conveying channel, which corresponds to the upper polishing cavity and the lower polishing cavity, is provided with an oil supply port, the oil supply port is externally connected with a polishing oil pump, and the oil supply port is used for feeding polishing oil into the upper polishing cavity and the lower polishing cavity, so that the polishing of the wafer is favorably realized.
Furthermore, the position that the epitaxial circumference of transfer passage upwards corresponds the washing chamber is equipped with the stoving mouth, the external hot air blower of stoving mouth sets up the purpose of stoving mouth, is in order to carry out drying process to the wafer after the washing, gets rid of the adnexed water in surface, avoids adnexed water to bring unnecessary trouble to the subsequent handling.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an exploded view of the polishing mechanism of the present invention;
FIG. 3 is a schematic view of the internal structure of the polishing mechanism according to the present invention;
FIG. 4 is an enlarged schematic view of point A in the present invention;
FIG. 5 is a schematic view of the internal structure of the primary grinding chamber of the present invention;
figure 6 is a schematic view of the inner structure of the upper refining chamber according to the invention;
figure 7 is a schematic view of the inner structure of the lower refining chamber according to the invention;
FIG. 8 is a schematic view showing an internal structure of an upper polishing chamber according to the present invention;
FIG. 9 is a schematic view of the internal structure of the lower polishing chamber according to the present invention;
FIG. 10 is a schematic view of the internal structure of the cleaning chamber according to the present invention;
labeled as: the machine cabinet 1, the grinding and polishing mechanism 2, the primary grinding disc 201, the upper fine grinding disc 202, the lower fixed disc 203, the upper fixed disc 204, the lower fine grinding disc 205, the upper polishing disc 206, the lower polishing suction disc 207, the upper polishing suction disc 208, the lower polishing disc 209, the upper cleaning disc 210, the lower loading table 21, the primary grinding cavity 211, the upper fine grinding cavity 212, the lower fine grinding cavity 213, the upper polishing cavity 214, the lower polishing cavity 215, the cleaning cavity 216, the upper loading table 22, the connecting plate 23, the conveying channel 24, the conveying disc 25, the transfer position 251, the dust outlet 252, the conveying motor 253, the dust removing port 261, the oil supply port 262, the drying port 263, the telescopic cylinder 27, the rotating motor 28, the box body 29, the water inlet 291, the water outlet 292, the lower cleaning disc 293, the telescopic support arm 294, the spring 295 and the upright column 3.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. These examples are intended to illustrate the invention and are not intended to limit the scope of the invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided" and "connected" are to be interpreted broadly, e.g. as a fixed connection, a detachable connection or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The structural features of the present invention will now be described in detail with reference to the accompanying drawings.
Referring to fig. 1, a wafer is polished, integrative device is handled to polishing, including rack 1, rack 1 adopts the top to be the transparent structure cabinet body that glass or organic glass made, make things convenient for the inside of rack 1 to observe, the fixed grinding and polishing mechanism 2 that is equipped with closed loop structure through stand 3 in the rack 1, grinding and polishing mechanism 2 includes upload platform 22 and download platform 21 and the delivery disc 25 that the longitudinal symmetry set up, upload platform 22 and download platform 21 are the loop configuration, its interval is equipped with in the circumference and is used for the connecting plate 23 of uploading, downloading platform 22, 21 fixed, upload platform 22 and download platform 21 adopt the mode of assembling to make up, reducible equipment production and processing technology, also make things convenient for the inside maintenance of going equipment afterwards.
Referring to fig. 2-4, the inner rings of the upper stage 22 and the lower stage 21 are provided with a ring-shaped and embedded conveying channel 24, the upper stage 22 and the lower stage 21 are located on the conveying channel 24 and provided with a plurality of cavities along the circumferential direction, the conveying disc 25 is located in the conveying channel 24, a conveying motor 253 for driving the conveying disc 25 to rotate is fixedly arranged at the axial position of the conveying disc 25, transfer positions 251 corresponding to the plurality of cavities are arranged on the circumferential direction of the conveying disc 25, the conveying disc 25 can realize intermittent motion under the driving of the conveying motor 253, so that the transfer positions 251 on the conveying disc 25 intermittently correspond to the next cavity position, the wafers are continuously and intermittently conveyed by the transfer positions 251, and once conveying is performed after each process is completed.
Referring to fig. 2-3, two sides of the opening of the cavity are respectively provided with a disk body for wafer processing, the disk bodies are adapted to the inner diameter of the corresponding cavity, the side portions of the cavity are respectively provided with a telescopic cylinder 27 for driving the disk bodies to move up and down linearly and a rotating motor 28 for driving the rotating motor to rotate at a high speed, and the telescopic cylinder 27 realizes the up-and-down displacement of the disk bodies so that the disk bodies on the two sides of the loading and unloading tables 22, 21 are in butt joint.
Referring to fig. 2, the cavities include a primary grinding cavity 211, an upper fine grinding cavity 212, a lower fine grinding cavity 213, an upper polishing cavity 214, a lower polishing cavity 215, and a cleaning cavity 216 equidistantly distributed among the cavities, and the arrangement can realize double-sided coarse grinding, cleaning, upper-sided fine grinding, cleaning, lower-sided grinding, cleaning, upper-sided polishing, cleaning, lower-sided polishing, and cleaning of the wafer, and a plurality of processes are synchronously completed in a closed loop, so that the grinding and polishing efficiency of the wafer can be effectively improved.
Referring to fig. 5, the disc body corresponding to the primary grinding cavity 211 comprises two primary grinding discs 201 which are symmetrically arranged, and grinding pads for rough grinding of the double surfaces of the wafer are fixed on the disc surfaces of the primary grinding discs 201. The first grinding disc 211 plays a role in preliminary grinding of the rough wafer after slicing, and the rough surface layer is removed by grinding, so that the grinding thickness error caused by rough surface is reduced and fixed on the non-grinding surface when subsequent fine grinding is facilitated.
Referring to fig. 6-7, the disc body corresponding to the upper refining chamber 212 comprises an upper refining disc 202 and a lower refining disc 203 which are symmetrically arranged, the upper refining disc 202 is positioned above the upper refining chamber 212, a grinding pad for fine grinding of the upper surface of the wafer is fixed on the disc surface of the upper refining disc 202, the grinding pad on the upper refining disc 202 is in a concave form, the design can effectively grind the edge of the wafer, and a positioning pad for fixing the lower surface of the wafer is fixed on the disc surface of the lower refining disc 203. The disc body corresponding to the lower refining chamber 213 comprises an upper fixed disc 204 and a lower refining disc 205 which are symmetrically arranged, the lower refining disc 205 is positioned below the lower refining chamber 213, a positioning pad for fixing the lower surface of the wafer is fixed on the disc surface of the upper fixed disc 204, and a grinding pad for finely grinding the upper surface of the wafer is fixed on the disc surface of the lower refining disc 205. And in the grinding stage, single-side stepped grinding of the top surface and the bottom surface of the wafer is adopted, so that on one hand, the complex structure of the equipment is simplified, and on the other hand, the cost of the equipment and the subsequent maintenance can be reduced. In the process of polishing, at first adopt the meticulous polishing of wafer top surface, when can reducing the bottom surface and polish, the tiny granule of polishing causes the influence to the wafer face of having polished, if carry out the meticulous polishing to the wafer bottom surface earlier, when polishing the wafer dome face, the tiny granule that the top surface was polished down just falls into on the wafer bottom surface easily, when getting into next process, these tiny granules that fall into, just can cause the damage to the wafer bottom surface of polishing well, and polish the top surface earlier and polish the bottom surface again, alright the emergence of this kind of condition that significantly reduces, carrying out the meticulous stage of polishing, no matter be the above-mentioned meticulous polishing of wafer or the following meticulous polishing of wafer, all adopt two upper and lower motors to carry out synchronous incorgruous drive, can effectively improve the rotational speed of polishing like this, and then improve the efficiency of polishing, and have fine energy-conserving effect.
Referring to fig. 8-9, the corresponding plate body of the upper polishing chamber 214 includes an upper polishing plate 206 and a lower polishing chuck 207, which are symmetrically disposed, the upper polishing plate 206 is located above the upper polishing chamber 214, a polishing pad for polishing the upper surface of the wafer is fixedly disposed on the plate surface of the upper polishing plate 206, and the polishing pad of the upper polishing plate 206 is designed to be concave, so that the edge of the wafer can be effectively polished when the upper surface of the wafer is polished. The corresponding disk body of the lower polishing cavity 215 comprises an upper polishing suction cup 208 and a lower polishing disk 209 which are symmetrically arranged, the lower polishing disk 209 is positioned below the lower polishing cavity 215, and a polishing pad for polishing the lower surface of the wafer is fixedly arranged on the disk surface of the lower polishing disk 209. The polishing of the wafer is also single-side stepped polishing of the top surface and the bottom surface in the same way as the wafer polishing mode is adopted in the wafer polishing stage, on one hand, the complex structure of the equipment is simplified, on the other hand, the cost of the equipment and the subsequent maintenance can be reduced, and meanwhile, the high efficiency of the double-side polishing equipment is kept. In the polishing process, the upper surface of the wafer is polished first, and then the lower surface of the wafer is polished, so that the damage to the polished surface caused by residual micro grinding particles is still avoided. In the polishing stage, the upper motor and the lower motor are also adopted for synchronous anisotropic driving, so that the polishing rotating speed can be effectively improved, the polishing efficiency is further improved, and a good energy-saving effect is achieved.
Referring to fig. 10, a box 29 for cleaning wafers is arranged below a cleaning chamber 216, the tray body corresponding to the cleaning chamber 216 includes an upper cleaning tray 210 and a lower cleaning tray 293 which are symmetrically arranged, the upper cleaning tray 210 is driven by a telescopic cylinder 27 and a rotating motor 28, the lower cleaning tray 293 is arranged in the box 29, a telescopic support arm 294 for elastically supporting the lower cleaning tray 293 is arranged at an axial position of the box 29, a spring 295 for returning the lower cleaning tray 293 is arranged in the telescopic support arm 294, a water inlet 291 and a water outlet 292 for flowing and replacing a cleaning liquid are further arranged at a side portion of the box 29, when a wafer is cleaned, the wafer enters the cleaning chamber 216 under the driving of a conveying tray 25, at this time, the lower cleaning tray 293 is kept flush with the lower surface of the conveying channel 24 so as to facilitate the smooth entering and exiting of the wafer, after the wafer is positioned, the upper cleaning tray 210 is pressed down to clamp the wafer between the upper cleaning tray 210 and the lower cleaning tray 293, and enter the inside of the box 29, at this moment, the telescopic supporting arm 294 is compressed, the box 29 has a cleaning solution that circulates, the upper cleaning disc 210 rotates at a high speed under the driving of the rotating motor 28, one side of the upper cleaning disc 210 and the lower cleaning disc 293 corresponding to the wafer is provided with a soft cleaning surface, so as to realize the double-sided cleaning of the wafer, and the cleaning surface should have a certain bump supporting structure, so as to facilitate the drying operation of the surface of the wafer after cleaning.
Referring to fig. 5 to 7, the outer extension circumference of the conveying channel 24 is provided with dust removing ports 261 at positions corresponding to the primary grinding chamber 211, the upper refining chamber 212 and the lower refining chamber 213, the dust removing ports 261 are externally connected with dust suction equipment, and the dust removing ports 261 are provided on the primary grinding chamber 211, the upper refining chamber 212 and the lower refining chamber 213 for the purpose of timely removing the fine particles which are ground.
Referring to fig. 8-9, an oil supply port 262 is provided on the outer circumference of the transfer passage 24 at a position corresponding to the upper polishing chamber 214 and the lower polishing chamber 215, and the oil supply port 262 is externally connected to the polishing oil pump. The oil feed port 262 is used to feed polishing oil into the upper and lower polishing chambers 214 and 215, advantageously providing polishing of the wafers.
Referring to fig. 10, a drying port 263 is disposed on the outer circumference of the conveying channel 24 corresponding to the cleaning cavity 216, and the drying port 263 is externally connected to a hot air blower. Drying equipment can be externally connected through the drying port 263, for example, a hot air blower, so as to dry the cleaned wafer, remove the water attached to the surface, avoid the unnecessary trouble brought to the subsequent processes by the attached water, and ensure that the wafer entering each station is dry through the arrangement of the drying port 263.
According to the integrated device for polishing and grinding the wafer, an embedded closed-loop transmission channel 24 is formed in the integrated device through the upper and lower carrying tables 21 and 22 which are in butt joint, a series of continuous processing procedures for polishing and grinding the wafer are arranged on the channel, all the processing procedures of polishing and grinding the wafer can be realized after the wafer is processed through the closed-loop channel, the wafer does not need to be manually transferred midway, accordingly, damage caused by transfer is reduced, the workload of workers is reduced, and the efficiency of polishing and grinding the wafer is improved. In addition, a closed-loop continuous processing mode is adopted, under the condition of normal operation, a finished product of the polished and polished wafer can be finished after the device is operated to finish a processing procedure, so that the wafer polishing and polishing efficiency is improved, and the wafer polishing and polishing efficiency is 4-5 times that of the traditional polishing and polishing. Moreover, the whole device is simple in structure, avoids the adoption of complex grinding and polishing equipment, greatly reduces the investment and the subsequent maintenance cost, and is suitable for large-scale production.
Specifically, when the device is used, after each procedure is completed, the wafer is put into the primary grinding cavity 211 in a manual or automatic feeding mode, and the wafer which is positioned in the last cleaning cavity 216 and is subjected to grinding and polishing is taken out, wherein after the primary putting, the wafer is subjected to double-sided rough grinding, cleaning, upper-single-sided fine grinding, cleaning, lower-single-sided grinding, cleaning, upper-single-sided polishing, cleaning, lower-single-sided polishing and cleaning in sequence, and ten procedures are used for finishing the grinding and polishing treatment of the wafer.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A wafer grinding and polishing integrated device comprises a cabinet (1), and is characterized in that a grinding and polishing mechanism (2) with a closed-loop structure is fixedly arranged in the cabinet (1) through an upright post (3);
the grinding and polishing mechanism (2) comprises an upper carrying platform (22), a lower carrying platform (21) and a conveying disc (25), which are arranged up and down symmetrically, the upper carrying platform (22) and the lower carrying platform (21) are of annular structures, and connecting plates (23) for fixing the upper and lower carrying platforms (22, 21) are arranged at intervals in the circumferential direction of the upper carrying platform (22) and the lower carrying platform (21);
the inner rings of the loading platform (22) and the downloading platform (21) are provided with annular embedded transmission channels (24);
the loading platform (22) and the downloading platform (21) are positioned on the transmission channel (24) and are provided with a plurality of cavities in a penetrating manner along the circumferential direction;
the conveying disc (25) is positioned in the conveying channel (24), a conveying motor (253) for driving the conveying disc (25) to rotate is fixedly arranged at the axis position of the conveying disc, and transfer positions (251) corresponding to the cavities are arranged on the circumferential direction of the conveying disc (25);
two sides of the opening of the cavity are respectively provided with a disk body for wafer processing, the disk bodies are matched with the inner diameter of the corresponding cavity, and the side parts of the cavity are respectively provided with a telescopic cylinder (27) for driving the disk body to do linear motion up and down and a rotating motor (28) for driving the disk body to rotate at a high speed;
the cavity bodies comprise a primary grinding cavity (211), an upper fine grinding cavity (212), a lower fine grinding cavity (213), an upper polishing cavity (214), a lower polishing cavity (215) and a cleaning cavity (216) which are distributed among the cavity bodies at equal intervals;
a box body (29) for cleaning the wafer is arranged below the cleaning cavity (216).
2. The wafer grinding and polishing integrated device as claimed in claim 1, wherein the disc body corresponding to the primary grinding cavity (211) comprises two primary grinding discs (201) which are symmetrically arranged, and grinding pads for rough grinding of the double surfaces of the wafer are fixed on the disc surfaces of the primary grinding discs (201).
3. The wafer grinding and polishing integrated device as claimed in claim 1, wherein the corresponding disc body of the upper fine grinding chamber (212) comprises an upper fine grinding disc (202) and a lower fixed disc (203) which are symmetrically arranged, the upper fine grinding disc (202) is located above the upper fine grinding chamber (212), a grinding pad for fine grinding of the upper surface of the wafer is fixed on the disc surface of the upper fine grinding disc (202), and a positioning pad for fixing the lower surface of the wafer is fixed on the disc surface of the lower fixed disc (203).
4. The wafer grinding and polishing integrated device as claimed in claim 1, wherein the disc body corresponding to the lower polishing chamber (213) comprises an upper fixed disc (204) and a lower polishing disc (205) which are symmetrically arranged, the lower polishing disc (205) is located below the lower polishing chamber (213), a positioning pad for fixing the lower surface of the wafer is fixed on the disc surface of the upper fixed disc (204), and a grinding pad for finely grinding the upper surface of the wafer is fixed on the disc surface of the lower polishing disc (205).
5. The integrated wafer grinding and polishing device as claimed in claim 1, wherein the corresponding disc body of the upper polishing chamber (214) comprises an upper polishing disc (206) and a lower polishing suction disc (207) which are symmetrically arranged, the upper polishing disc (206) is located above the upper polishing chamber (214), and a polishing pad for polishing the upper surface of the wafer is fixedly arranged on the disc surface of the upper polishing disc (206).
6. The integrated wafer grinding and polishing device as claimed in claim 1, wherein the corresponding disc body of the lower polishing chamber (215) comprises an upper polishing suction cup (208) and a lower polishing disc (209) which are symmetrically arranged, the lower polishing disc (209) is located below the lower polishing chamber (215), and a polishing pad for polishing the lower surface of the wafer is fixedly arranged on the disc surface of the lower polishing disc (209).
7. A wafer grinding and polishing integrated device as claimed in claim 1, wherein the cleaning chamber (216) comprises an upper cleaning disc (210) and a lower cleaning disc (293) which are symmetrically arranged, the upper cleaning disc (210) is driven by the telescopic cylinder (27) and the rotating motor (28), the lower cleaning disc (293) is arranged in the box body (29), a telescopic support arm (294) for elastically supporting the lower cleaning disc (293) is arranged at an axial position of the box body (29), a spring (295) for returning the lower cleaning disc (293) is arranged in the telescopic support arm (294), and a water inlet (291) and a water outlet (292) for flowing and replacing cleaning liquid are further arranged at the side part of the box body (29).
8. The integrated wafer grinding and polishing device as claimed in claim 1, wherein a dust removing port (261) is formed in the position, corresponding to the primary grinding cavity (211), the upper fine grinding cavity (212) and the lower fine grinding cavity (213), of the extension circumference of the conveying channel (24), and the dust removing port (261) is externally connected with dust collecting equipment.
9. A wafer grinding and polishing integrated device as claimed in claim 1, wherein an oil supply port (262) is provided at a position corresponding to the upper polishing chamber (214) and the lower polishing chamber (215) in the outer circumferential direction of the transfer passage (24), and the oil supply port (262) is externally connected with a polishing oil pump.
10. A wafer grinding and polishing integrated device as claimed in claim 1, wherein a drying port (263) is arranged at a position corresponding to the cleaning cavity (216) in the outward extending circumferential direction of the conveying channel (24), and the drying port (263) is externally connected with a hot air fan.
CN202110857065.8A 2021-07-28 2021-07-28 Integrated device for polishing and polishing wafer Active CN113523933B (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025649A (en) * 1983-07-18 1985-02-08 Toshiba Mach Co Ltd One-side polishing device by double polishing device
JP2000033559A (en) * 1998-07-16 2000-02-02 Fujikoshi Mach Corp Double face polishing device
JP2014104522A (en) * 2012-11-26 2014-06-09 Sumitomo Metal Mining Co Ltd Single-side processing method of wafer and production method of wafer
CN105127881A (en) * 2015-07-30 2015-12-09 洛阳金诺机械工程有限公司 Bearing disc for wafer double-face grinding and polishing machine, grinding and polishing machine of wafers and grinding and polishing method for wafers
CN107671686A (en) * 2017-09-28 2018-02-09 东莞市佳顺达自动化精密机械有限公司 One kind efficiently clears off machine
CN112496872A (en) * 2020-11-27 2021-03-16 合肥德捷节能环保科技有限公司 Automatic feeding omnibearing valve plate polishing method
CN112658924A (en) * 2020-12-23 2021-04-16 济南金刚石科技有限公司 Diamond flake crystal polishing equipment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6025649A (en) * 1983-07-18 1985-02-08 Toshiba Mach Co Ltd One-side polishing device by double polishing device
JP2000033559A (en) * 1998-07-16 2000-02-02 Fujikoshi Mach Corp Double face polishing device
JP2014104522A (en) * 2012-11-26 2014-06-09 Sumitomo Metal Mining Co Ltd Single-side processing method of wafer and production method of wafer
CN105127881A (en) * 2015-07-30 2015-12-09 洛阳金诺机械工程有限公司 Bearing disc for wafer double-face grinding and polishing machine, grinding and polishing machine of wafers and grinding and polishing method for wafers
CN107671686A (en) * 2017-09-28 2018-02-09 东莞市佳顺达自动化精密机械有限公司 One kind efficiently clears off machine
CN112496872A (en) * 2020-11-27 2021-03-16 合肥德捷节能环保科技有限公司 Automatic feeding omnibearing valve plate polishing method
CN112658924A (en) * 2020-12-23 2021-04-16 济南金刚石科技有限公司 Diamond flake crystal polishing equipment

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