CN113516913A - Cover plate assembly, manufacturing method thereof and display device - Google Patents
Cover plate assembly, manufacturing method thereof and display device Download PDFInfo
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- CN113516913A CN113516913A CN202110369191.9A CN202110369191A CN113516913A CN 113516913 A CN113516913 A CN 113516913A CN 202110369191 A CN202110369191 A CN 202110369191A CN 113516913 A CN113516913 A CN 113516913A
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Images
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/40—Printing on bodies of particular shapes, e.g. golf balls, candles, wine corks
Abstract
The application discloses a cover plate assembly and a manufacturing method thereof as well as a display device, wherein the cover plate assembly comprises a transparent substrate layer, an ink layer and an adhesive layer, the transparent substrate layer is provided with a first surface and a second surface which are oppositely arranged, the transparent substrate layer comprises a plane area and an arc area which is positioned on at least one side of the plane area, the transparent substrate layer further comprises a groove, and the groove is positioned on the arc area and concavely arranged on the first surface; the ink layer is arranged in the groove, and the sum of the thickness of the transparent substrate layer positioned in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer positioned in the plane area; and the adhesive layer covers the first surface and covers the surface of the ink layer far away from the transparent base material layer. The cover plate assembly, the manufacturing method of the cover plate assembly and the display device are used for avoiding the problem that bubbles are generated at the section difference position of the ink layer and the optical cement.
Description
Technical Field
The application relates to the technical field of display, in particular to a cover plate assembly, a manufacturing method of the cover plate assembly and a display device.
Background
Along with the continuous development of flexible display device, in order to realize display device's waterfall screen, prior art is laminating flexible display screen and the apron of curved surface each other. However, in order to shield the cover plate from the non-display area of the display screen, four-side black edge (ink) printing is often required, and when the cover plate is attached to the display screen by the optical adhesive, bubbles are easily generated at the step difference between the ink and the cover plate.
In order to reduce bubbles generated during cover plate attachment, the conventional high-temperature and high-pressure defoaming needs at least 30 minutes, and the manufacturing capacity of the module is seriously affected. And, for ultra-thin display module assembly, when the optical cement thickness attenuate to a certain extent, even carry out the deaeration after the apron laminating and also can't eliminate the bubble of segment difference department.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The embodiment of the application provides a cover plate assembly and a manufacturing method thereof, which are used for avoiding the problem that bubbles are generated at the section difference position of an ink layer and optical cement.
An embodiment of the present application provides a cover plate assembly, includes:
the transparent substrate layer is provided with a first surface and a second surface which are oppositely arranged, the transparent substrate layer comprises a plane area and an arc area positioned on at least one side of the plane area, and the transparent substrate layer also comprises a groove which is positioned on the arc area and concavely arranged on the first surface;
the ink layer is arranged in the groove, and the sum of the thickness of the transparent substrate layer positioned in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer positioned in the plane area;
and the adhesive layer covers the first surface and covers the surface of the ink layer far away from the transparent base material layer.
In the cover plate assembly provided by the embodiment of the application, the depth of the groove is between 5 microns and 20 microns.
In the cover plate assembly provided by the embodiment of the application, the ink layer is arranged in the groove through screen printing or pad printing.
In the cover plate assembly provided by the embodiment of the application, the transparent base material layer positioned on the arc surface area is provided with a contraposition mark, and the contraposition mark is used for contraposition with a display screen.
In the cover plate assembly provided by the embodiment of the application, the arc surface area is located on two sides of the plane area.
In the cover plate assembly provided by the embodiment of the application, the arc surface area is located on the periphery of the plane area.
In the cover plate assembly provided in the embodiments of the present application, the light transmittance of the adhesive layer is greater than or equal to 90%.
The embodiment of the application further provides a manufacturing method of the cover plate assembly, which comprises the following steps:
forming a transparent substrate layer, wherein the transparent substrate layer is provided with a first surface and a second surface which are oppositely arranged, the transparent substrate layer comprises a plane area and an arc area which is positioned on at least one side of the plane area, the transparent substrate layer also comprises a groove, and the groove is positioned on the arc area and concavely arranged on the first surface;
forming an ink layer in the groove, wherein the ink layer is arranged in the groove, and the sum of the thickness of the transparent substrate layer in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer in the plane area;
and forming an adhesive layer on the first surface and one surface of the ink layer far away from the transparent base material layer.
In the manufacturing method of the cover plate assembly provided in the embodiment of the present application, the step of forming the transparent substrate layer includes:
cutting the substrate to form the groove in the arc surface area, wherein the groove is concavely arranged on the first surface;
and under a preset temperature of between 500 and 900 ℃, carrying out thermal bending treatment on the substrate with the groove by using a hot-pressing die so as to form the transparent base material layer.
The embodiment of the application further provides a display device, which comprises a display screen and the cover plate assembly, wherein the cover plate assembly is attached to the display screen.
The embodiment of the application provides a cover plate assembly and a manufacturing method thereof, and a display device, in the cover plate assembly provided by the embodiment of the application, the cover plate assembly comprises a transparent substrate layer, an ink layer and a bonding layer, the ink layer is filled in a groove of the transparent substrate layer, in addition, the sum of the thickness of the transparent substrate layer of an arc surface area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer positioned in a plane area, the section difference between the bonding layer and the first surface of the transparent substrate layer is eliminated by the setting mode, and the problem of bubbles generated between the bonding layer and the first surface of the transparent substrate layer is avoided.
In order to make the aforementioned and other objects of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a top view of a display device provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a manufacturing method of a display device according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present disclosure;
FIG. 5 is a flowchart illustrating steps of a method for fabricating a cover plate assembly according to an embodiment of the present disclosure;
FIG. 6 is a flowchart illustrating a step B1 in the method for manufacturing a cover plate assembly according to an embodiment of the present disclosure;
FIG. 7 is a schematic view of step B1 in the method for manufacturing a cover plate assembly according to the present application;
fig. 8 is a schematic view illustrating a step B2 in the method for manufacturing a cover plate assembly according to the embodiment of the present application.
Detailed Description
For purposes of clarity, technical solutions and advantages of the present application, the present application will be described in further detail with reference to the accompanying drawings, wherein like reference numerals represent like elements throughout the several views, and the following description is based on the illustrated embodiments of the present application and should not be construed as limiting the other embodiments of the present application which are not detailed herein. The word "embodiment" as used herein means an example, instance, or illustration.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being directly adjacent or may comprise the first and second features being not in direct contact but in contact with each other by means of further features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 and fig. 2, fig. 1 is a top view of a display device according to an embodiment of the present disclosure; fig. 2 is a schematic structural diagram of a display device according to an embodiment of the present application. The embodiment of the present application provides a display device, and the display device 100 includes a cover plate assembly 10 and a display screen 20, wherein the cover plate assembly 10 is attached to the display screen 20. The cover plate assembly 10 includes a transparent substrate layer 101, an ink layer 102, and an adhesive layer 103. The adhesive layer 103 serves to attach the cover plate assembly 10 and the display screen 20, preventing the display device 100 from warping.
The display Device 100 is formed by aligning the cover assembly 10 and the display screen 20 using a Charge Coupled Device (CCD) alignment process. The charge coupled device is a silicon wafer for detecting light, changes of a semiconductor potential well are generated and controlled by clock pulse voltage, and a solid-state electronic device for storing and transmitting charge signals is realized.
It should be noted that the display screen in this embodiment may be an Active Light Emitting display screen, such as an Organic Light-Emitting Diode (OLED) display screen, an Active-matrix Organic Light-Emitting Diode (AMOLED) display screen, a Passive-matrix Organic Light-Emitting Diode (Passive OLED) display screen, a Quantum Dot Organic Light-Emitting Diode (QLED) display screen, and the like. The display screen of the embodiment of the present application may also be a liquid crystal display screen, and the present application does not limit the type of the liquid crystal display screen, and the liquid crystal display screen may be a Vertical electric Field type liquid crystal display screen, such as a Twisted Nematic (TN) type liquid crystal display screen, a Multi-domain Vertical Alignment (MVA) type liquid crystal display screen, or a horizontal electric Field type liquid crystal display screen, such as a Fringe Field Switching (FFS) type liquid crystal display screen or an In-Plane Switching (IPS) type liquid crystal display screen.
When the display panel 20 is an active light emitting display panel, the display panel 20 includes a substrate (not shown), a driving circuit layer (not shown) disposed on the substrate, and a light emitting functional layer (not shown) and an encapsulation layer (not shown) electrically connected to the driving circuit layer. The light emitting function layer may include an anode, a light emitting layer, a cathode, and a hole injection layer, a hole transport layer, an electron injection layer, and the like. The encapsulation layer comprises at least one inorganic layer and at least one organic layer which are alternately stacked. The inorganic layer may be selected from inorganic materials of alumina, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, zinc oxide, and the like. The organic layer is an organic material selected from epoxy resin, Polyimide (PI), polyethylene terephthalate (PET), Polycarbonate (PC), Polyethylene (PE), polyacrylate, and the like. For example, the encapsulation layer has a laminated structure of an alumina film, a polypropylene film, and a silicon nitride film, which are laminated in this order.
When the display panel 20 is a liquid crystal display panel, the liquid crystal display panel includes an array substrate and an opposite substrate which are oppositely disposed, and a liquid crystal layer disposed between the array substrate and the opposite substrate. In this embodiment, the substrate is an array substrate, and the opposite substrate is a color filter substrate. The application also does not limit the types of the array substrate and the opposite substrate. In other embodiments of the present disclosure, the array substrate and the opposite substrate may be coa (color filter on array) type array substrate and opposite substrate.
The display device can be an electronic device with a display function, such as a mobile phone, a tablet computer, a notebook computer, a game machine, a digital camera, a vehicle-mounted navigator, an electronic billboard, an automatic teller machine and the like.
Correspondingly, the embodiment of the application also provides a manufacturing method of the display device. Referring to fig. 3, fig. 3 is a method for manufacturing a display device according to an embodiment of the present disclosure.
The manufacturing method of the display device 100 includes the steps of:
first, the transparent base material layer 101 filled with the ink layer 102, the adhesive layer 103, and the display panel 20 are set between the hot press molds M. The adhesive layer 103 is bonded to the display panel 20, the transparent base layer 101 is placed on the side close to the upper mold M1, and the display panel 20 is placed on the side close to the lower mold M2. Then, the temperature raising process is performed on the display panel 20 and the adhesive layer 103 by a heater, so that the edges of the display panel 20 and the adhesive layer 103 are softened. Next, applying pressure to the lower mold M2 in the temperature rising process, so that the lower surface of the upper mold M1 and the upper surface of the lower mold M2 are pressed as much as possible under the pressure action, thereby completing the attaching process of the display screen 20 and the cover plate assembly 10; finally, the hot press mold M is cooled to lower the temperature of the display screen 20 and the cover plate assembly 10 to room temperature, thereby forming the display device 100.
Next, the cover plate assembly 10 provided in the embodiment of the present application will be described in detail.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a cover plate assembly according to an embodiment of the present disclosure. The cover plate assembly 10 includes a transparent base material layer 101, an ink layer 102, and an adhesive layer 103.
Specifically, the transparent substrate layer 101 has a first surface 1011 and a second surface 1012 which are arranged oppositely, the transparent substrate layer 101 includes a planar area 101a and an arc area 101b located on at least one side of the planar area 101a, the transparent substrate layer 101 further includes a groove 101b1, and the groove 101b1 is located on the arc area and concavely arranged on the first surface 1011.
The transparent substrate layer 101 may be formed of Glass (Glass), polymethyl methacrylate (PMMA), Polycarbonate (PC), and the like, and the material of the transparent substrate layer 101 is not limited in the present application.
The arc area 101b is located on at least one side of the plane area 101a, and is curved to an arc surface toward one side surface of the plane area 101a, and the curved angle is usually less than or equal to 90 degrees, which can be set according to the requirement.
In some embodiments, the arc area 101b is located on both sides of the planar area 101a, for example, the arc area 101b is located on the left and right sides or the upper and lower sides of the planar area 101 a. Alternatively, the arc areas 101b are located around the planar area 101a, that is, the arc areas 101b are located on the left and right sides and the upper and lower sides of the planar area 101 a. That is, when the arc area 101b is located on both sides of the plane area 101a, the cover assembly 10 is generally used to fit a display screen having a two-sided waterfall screen; the cover assembly 10 is generally adapted to fit a display screen having a four-sided waterfall screen when the arcuate region 101b is positioned about the planar region 101 a.
In some embodiments, the depth of the groove 101b1 is between 5 microns and 20 microns. For example, the depth of the groove 101b1 is any one of 5 microns, 8 microns, 10 microns, 13 microns, 15 microns, 18 microns, or 20 microns. When the depth of the groove 101b1 is between 5 micrometers and 20 micrometers, on one hand, the transparent substrate layer 101 located in the arc region 101b is not easily broken during the thermal bending process; on the other hand, the ink layer 102 formed in the groove 101b1 has better light-shielding effect.
In order to block the non-display area of the display screen, the ink layer 102 is further disposed in the embodiment of the application. The ink layer 102 is disposed in the groove 101b1, and the sum d1 of the thickness of the transparent substrate layer 101 in the arc region 101b and the thickness of the ink layer 102 is equal to the thickness d2 of the transparent substrate layer 101 in the planar region 101 a. In some embodiments, ink layer 102 is disposed within recess 101b1 by screen printing or pad printing. The material of the ink layer 102 may be black ink, which is used to block the non-display area of the display screen. In a specific embodiment, the black ink comprises the following raw materials in percentage by mass: 40-60% of glass-based glaze, 13-33% of varnish and 17-37% of melanin.
The adhesive layer 103 covers the first surface 1011 and the surface of the ink layer 102 away from the transparent base layer 101. The thickness of the adhesion layer 103 is less than or equal to 200 micrometers. For example, the adhesive layer 103 has a thickness of any one of 10 microns, 35 microns, 60 microns, 95 microns, 110 microns, 135 microns, 165 microns, 180 microns, or 200 microns. The thickness of the adhesive layer 103 in the embodiment of the application is small, which is beneficial to realizing an ultrathin display device.
In some embodiments, the material of the Adhesive layer 103 comprises an optical Clear Adhesive (optical Adhesive) material. The optical adhesive material may be one of an ultraviolet curing adhesive or a thermosetting curing adhesive. The optical adhesive material can be used for cementing transparent optical elements and comprises at least one of organic silica gel, acrylic resin, unsaturated polyester, polyurethane, epoxy resin and other adhesives. In the embodiment of the present application, the light transmittance of the adhesive layer 103 is greater than 90%.
In some embodiments, the transparent substrate layer 101 located in the arc region 101b is provided with a registration mark, and the registration mark is used for being registered with the display screen. Specifically, an alignment mark may be disposed on the second surface 1012 of the transparent substrate layer 101 located in the arc region 101b for aligning the cover plate assembly 10 with the display screen in the subsequent process of manufacturing the display module.
The embodiment of the application provides a cover plate assembly, wherein the cover plate assembly is used for being attached to a display screen. The apron subassembly that this application embodiment provided includes transparent substrate layer, printing ink layer and bond line, and the printing ink layer is filled in transparent substrate layer's recess, and, the thickness sum of the thickness of the transparent substrate layer of arc district and the printing ink layer equals the thickness that is located the transparent substrate layer of plane district, and the section difference between the first face of bond line and transparent substrate layer has been eliminated to this setting mode, has avoided producing the problem of bubble between the first face of bond line and transparent substrate layer.
In addition, the thickness of the transparent substrate layer of the arc area is smaller than that of the transparent substrate layer positioned in the plane area, so that the transparent substrate layer of the arc area is not easy to break when the transparent substrate layer of the arc area is subjected to a hot bending process.
Moreover, because the section difference between the first face of bond line and transparent substrate layer has been eliminated to this mode of setting, the adhesion degree of apron subassembly with the display screen has further been promoted to display device's stability has been improved.
The cover plate assembly in the embodiment of the application can also perform ultrathin design on the bonding layer, so that the thickness of the display device is reduced.
The embodiment of the application also provides a manufacturing method of the cover plate assembly. Referring to fig. 5, fig. 5 is a flowchart illustrating a method for manufacturing a cover plate assembly according to an embodiment of the present disclosure.
The manufacturing method of the cover plate assembly comprises the following steps:
step B1: the transparent substrate layer is formed and provided with a first face and a second face which are arranged oppositely, the transparent substrate layer comprises a plane area and an arc face area located on at least one side of the plane area, the transparent substrate layer further comprises a groove, and the groove is located on the arc face area and concavely arranged on the first face.
Referring to fig. 6, in some embodiments, step B1 includes:
step B11: and cutting the substrate to form a groove in the arc surface area, wherein the groove is concavely arranged on the first surface.
Specifically, a large substrate may be first cut into a substrate of a size corresponding to the display screen by blanking. Then, the substrate is cut by CNC (Computer Numerical Control), and the outline of the substrate is processed to form a groove 101b1 located in the arc region 101b, and the groove 101b1 is recessed in the first surface 1011, as shown in fig. 7.
Step B12: and performing thermal bending treatment on the substrate with the groove by using a hot-pressing mold at a predetermined temperature between 500 and 900 ℃ to form a transparent substrate layer.
Specifically, with continued reference to fig. 7, a substrate W is placed in the hot press mold M, i.e., the substrate W is placed between the upper mold M1 and the lower mold M2. Heating the substrate W by the heater to a softened state; then, applying pressure to the upper die M1 at any temperature of 500 to 900 ℃, so that the lower surface of the upper die M1 and the upper surface of the lower die M2 are pressed together as much as possible under the action of the pressure, and at this time, thermally bending the substrate W; finally, the substrate W is subjected to a cooling process to form the transparent substrate layer 101. In the process of fastening the upper mold M1 and the lower mold M2, the second surface 1012 of the transparent substrate layer 101 is attached to the upper mold M1, and the first surface 1011 of the transparent substrate layer 101 is attached to the lower mold M2.
In some embodiments, the hot-press mold M may be a graphite mold, and since the hot-press mold made of graphite has a good heat-conducting property, hot-press molding is fast, and the surface of the graphite material is polished with high precision, so as to ensure the flatness and smoothness of the surface of the finished product; and secondly, as the graphite material has high temperature resistance and very small thermal expansion coefficient, the hot-pressing die in the embodiment of the application adopts the graphite material, so that the service life can be prolonged.
In one embodiment, step B12 may include the following molding process: firstly, adjusting the temperature of a heater to 500 ℃ and maintaining the temperature for 30-90 seconds; secondly, regulating the temperature of the heater to 550 ℃, and maintaining for 30-90 seconds; thirdly, regulating the temperature of the heater to 650 ℃ and maintaining the temperature for 30-90 seconds; fourthly, regulating the temperature of the heater to 750 ℃ and maintaining the temperature for 30 to 90 seconds; fifthly, adjusting the temperature of the heater to 750 ℃, and adjusting the pressure of the hot-pressing die to 20N/cm2(ii) a Sixthly, adjusting the temperature of the heater to 770 ℃, and adjusting the pressure of the hot-pressing die to 30N/cm2(ii) a Seventhly, adjusting the temperature of the heater to 800 ℃, and adjusting the pressure of the hot-pressing die to 20N/cm2(ii) a Step eight, adjusting the temperature of the heater to 750 ℃; ninth, adjusting the temperature of the heater to 700 ℃; step ten, adjusting the temperature of the heater to 600 ℃; step ten, adjusting the temperature of a heater to 550 ℃; the latter may also include 4 steps of cooling to room temperature, and each step may be between 60 and 90 seconds. The embodiment of the application adopts a mode of gradually heating up, so that the process of heating the substrate W by the heater is slow, and the substrate W is bent in the heating process.
At this time, the material put into the hot press mold is heated, pressurized, and cooled sequentially by raising the temperature step by step, and the transparent base layer 101 having a good molding effect is obtained.
Step B2: and forming an ink layer in the groove, wherein the sum of the thickness of the transparent substrate layer in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer in the plane area.
Referring to fig. 8, the ink layer 102 is formed in the groove 101b1 by a screen printing process or a pad printing process, and a sum d1 of the thickness of the transparent substrate layer 101 in the arc-shaped area 101b and the thickness of the ink layer 102 is equal to the thickness d2 of the transparent substrate layer 101 in the planar area 101 a.
For example, in an embodiment, first, a screen plate is mounted on the first surface of the transparent substrate layer 101, wherein the screen plate corresponding to the planar area 101a is not permeable to ink, and the screen plate corresponding to the arc area 101b is permeable to ink. Secondly, ink is poured into one end of the screen printing plate, a scraper is used for applying certain pressure to the ink position on the screen printing plate, meanwhile, the ink moves towards the other end of the screen printing plate at a constant speed, and the ink is extruded into the groove 101b1 by the scraper in the moving process. Then, the ink material located in the groove 101b1 is dried to form the ink layer 102.
In some embodiments, in order to not overflow the outside of the groove 101b1 when the ink layer 102 is manufactured, the ink may be transferred into the groove 101b1 by a multiple screen printing process to form the ink layer 102.
Step B3: and forming an adhesive layer on the first surface and the surface of the ink layer far away from the transparent base material layer.
Specifically, referring to fig. 4, an optical adhesive material is coated on the first surface 1011 and the surface of the ink layer 102 away from the transparent substrate layer 101, and the optical adhesive material is cured to form the adhesive layer 103. In the present application, the optical adhesive material is cured by irradiating ultraviolet rays, or in another embodiment, the optical adhesive material may be cured by heating.
The material of the Adhesive layer 103 includes an optical Clear Adhesive (optical Adhesive) material. The optical adhesive material may be one of an ultraviolet curing adhesive or a thermosetting curing adhesive. The optical adhesive material can be used for cementing transparent optical elements and comprises at least one of organic silica gel, acrylic resin, unsaturated polyester, polyurethane, epoxy resin and other adhesives. In the embodiment of the present application, the light transmittance of the adhesive layer 103 is greater than 90%. The thickness of the adhesion layer 103 is less than or equal to 200 micrometers. The embodiment of the application provides a cover plate assembly and a manufacturing method thereof, and a display device, in the cover plate assembly provided by the embodiment of the application, the cover plate assembly comprises a transparent substrate layer, an ink layer and a bonding layer, the ink layer is filled in a groove of the transparent substrate layer, in addition, the sum of the thickness of the transparent substrate layer of an arc surface area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer positioned in a plane area, the section difference between the bonding layer and the first surface of the transparent substrate layer is eliminated by the setting mode, and the problem of bubbles generated between the bonding layer and the first surface of the transparent substrate layer is avoided.
In addition, the thickness of the transparent substrate layer of the arc area is smaller than that of the transparent substrate layer positioned in the plane area, so that the transparent substrate layer of the arc area is not easy to break when the transparent substrate layer of the arc area is subjected to a hot bending process.
Moreover, because the section difference between the first face of bond line and transparent substrate layer has been eliminated to this mode of setting, the adhesion degree of apron subassembly with the display screen has further been promoted to display device's stability has been improved.
The cover plate assembly in the embodiment of the application can also perform ultrathin design on the bonding layer, so that the thickness of the display device is reduced.
In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.
Claims (10)
1. A cover plate assembly, comprising:
the transparent substrate layer is provided with a first surface and a second surface which are oppositely arranged, the transparent substrate layer comprises a plane area and an arc area positioned on at least one side of the plane area, and the transparent substrate layer also comprises a groove which is positioned on the arc area and concavely arranged on the first surface;
the ink layer is arranged in the groove, and the sum of the thickness of the transparent substrate layer positioned in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer positioned in the plane area;
and the adhesive layer covers the first surface and covers the surface of the ink layer far away from the transparent base material layer.
2. The cover plate assembly of claim 1, wherein the depth of the groove is between 5 and 20 microns.
3. The cover assembly of claim 1, wherein the ink layer is disposed within the recess by screen printing or pad printing.
4. The cover plate assembly of claim 1, wherein the transparent substrate layer in the arc region is provided with alignment marks for aligning with a display screen.
5. The decking assembly defined in claim 1 wherein the arcuate sections are located on either side of the planar section.
6. The decking assembly defined in claim 1 wherein the arcuate zones are located around the planar zones.
7. The cover plate assembly of claim 1, wherein the adhesive layer has a light transmittance of greater than or equal to 90%.
8. A method of making a cover plate assembly, comprising the steps of:
forming a transparent substrate layer, wherein the transparent substrate layer is provided with a first surface and a second surface which are oppositely arranged, the transparent substrate layer comprises a plane area and an arc area which is positioned on at least one side of the plane area, the transparent substrate layer also comprises a groove, and the groove is positioned on the arc area and concavely arranged on the first surface;
forming an ink layer in the groove, wherein the ink layer is arranged in the groove, and the sum of the thickness of the transparent substrate layer in the arc area and the thickness of the ink layer is equal to the thickness of the transparent substrate layer in the plane area;
and forming an adhesive layer on the first surface and one surface of the ink layer far away from the transparent base material layer.
9. The method of making a cover plate assembly of claim 8, wherein the step of forming a transparent substrate layer comprises:
cutting the substrate to form the groove in the arc surface area, wherein the groove is concavely arranged on the first surface;
and under a preset temperature of between 500 and 900 ℃, carrying out thermal bending treatment on the substrate with the groove by using a hot-pressing die so as to form the transparent base material layer.
10. A display device comprising a display screen and a cover assembly according to any one of claims 1 to 7, the cover assembly being attached to the display screen.
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| CN202110369191.9A CN113516913A (en) | 2021-04-06 | 2021-04-06 | Cover plate assembly, manufacturing method thereof and display device |
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