CN218585311U - Capacitive screen, touch display module and display device - Google Patents
Capacitive screen, touch display module and display device Download PDFInfo
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- CN218585311U CN218585311U CN202222312950.0U CN202222312950U CN218585311U CN 218585311 U CN218585311 U CN 218585311U CN 202222312950 U CN202222312950 U CN 202222312950U CN 218585311 U CN218585311 U CN 218585311U
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Abstract
The utility model provides an electric capacity screen, touch-control display module assembly and display device, the electric capacity screen includes: the cover plate comprises a visible area and an edge shielding area; the first molding layer is positioned on the surface of one side of the cover plate, and a plurality of first grooves are formed in the first molding layer; the first circuit layer comprises a plurality of first conductive wires, the first conductive wires are positioned in the first grooves, and the first circuit layer comprises a first sensing area and a first lead area; the visible area and the first sensing area are arranged oppositely, and the edge shielding area and the first lead area are arranged oppositely; the second molding layer is provided with a plurality of second grooves; the second circuit layer comprises a plurality of second conductive wires, the second conductive wires are positioned in the second grooves, and the second circuit layer comprises a second sensing area and a second lead area; the first lead area and the second lead area are oppositely arranged, and the first sensing area and the second sensing area are oppositely arranged; and the flange frame layer is positioned between the first lead area and the edge shielding area. The capacitive screen is light and thin.
Description
Technical Field
The utility model relates to a show technical field, concretely relates to electric capacity screen, touch-control display module assembly and display device.
Background
A conventional capacitive screen, as shown in fig. 1, includes: a glass cover plate 40; a first substrate 10 positioned at one side of the cover plate 40, a first conductive layer 11 positioned at one side of the first substrate 10; the first conductive layer 11 is adhered to the cover plate 10 through a first optical adhesive 32; a second substrate 20, a second conductive layer 21 located on one side of the second substrate 20; the second conductive layer 21 is adhered to a surface of the first substrate 10 facing away from the first conductive layer 11 by a second optical adhesive 31.
In this electric capacity screen, be provided with two layers of base plates, two-layer optical cement and glass apron altogether, lead to the range upon range of thickness of rete great, the cost is higher, and the light transmissivity is relatively poor.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an electric capacity screen, touch-control display module assembly and display device to solve among the prior art electric capacity screen's the higher and relatively poor problem of light transmissivity of cost.
The utility model provides a capacitive screen, include: the cover plate comprises a visual area and an edge shielding area surrounding the visual area; the first molding layer is positioned on the surface of one side of the cover plate, and a plurality of first grooves are formed in the first molding layer; a first circuit layer including a number of first conductive lines in the first slot, the first circuit layer including a first sensing region and a first lead region surrounding the first sensing region; the visible area and the first sensing area are arranged oppositely, and the edge shielding area and the first lead wire area are arranged oppositely; the second molding layer is positioned on the surface of one side, away from the cover plate, of the first molding layer and the first circuit layer, and a plurality of second grooves are formed in the second molding layer; a second circuit layer comprising a plurality of second conductive lines, the second conductive lines being located in the second slots, the second circuit layer comprising a second sensing area and a second lead area surrounding the second sensing area; the first lead area and the second lead area are oppositely arranged, and the first sensing area and the second sensing area are oppositely arranged; and the shielding frame layer is positioned between the first lead area and the edge shielding area of the cover plate.
Optionally, the first molding layer is a first photosensitive adhesive molding layer or a first thermosensitive adhesive molding layer; the second molding layer is a second photosensitive adhesive molding layer or a second thermosensitive adhesive molding layer.
Optionally, the thickness of the first molding layer opposite to the visible region between the adjacent first conductive lines is 10 to 15 micrometers; a thickness of a second molding layer between adjacent ones of the second conductive lines opposite to the visible region is 8 to 9 micrometers.
Optionally, the first circuit layer includes a first sensing region and a first lead region surrounding the first sensing region; the second circuit layer includes a second sensing region and a second lead region surrounding the second sensing region, the first and second lead regions being disposed opposite each other, and the first and second sensing regions being disposed opposite each other.
Optionally, the cover plate includes a visible area and an edge shielding area surrounding the visible area; the visible area and the first sensing area are arranged oppositely, and the edge shielding area and the first lead wire area are arranged oppositely; the capacitive screen further comprises: and the shielding frame layer is positioned between the first lead area and the edge shielding area of the cover plate.
Optionally, the shielding frame layer comprises an ink shielding layer.
Optionally, the sum of the depth of the first groove and the thickness of the shielding frame layer is less than the thickness of a first molding layer between adjacent first conductive lines and opposite to the visible area.
Optionally, the method further includes: and the hardening film is positioned on the surface of one side, away from the first molding layer, of the cover plate, and the hardness of the hardening film is greater than that of the cover plate.
Optionally, the cover sheet comprises a PET cover sheet.
The utility model also provides a touch-control display module assembly, include: a display screen; the utility model discloses an electric capacity screen, electric capacity screen is located display screen's display surface one side, the apron is located second molding layer and second circuit layer deviate from one side of display screen.
The utility model also provides a display device, include the utility model discloses a touch-control display module assembly.
The utility model provides a technical scheme has following effect:
the utility model discloses technical scheme provides a capacitive screen, the first conductor wire on first circuit layer is arranged in the first groove of first shaping layer, and the second conductor wire on second circuit layer is arranged in the second groove of second shaping layer. Thus, the first circuit layer and the second circuit layer are arranged on the same side of the cover plate through the first molding layer and the second molding layer. Set up first circuit layer and second circuit layer in one side of apron, utilize the apron as the base plate on first circuit layer and second circuit layer, need not additionally to set up the base plate. Therefore, the capacitive screen is light and thin.
Secondly, first molding layer will shelter from the frame layer and cover completely, and first conductor wire setting need not to carry out the climbing on the surface that shelters from the frame layer like this in the first groove, avoids first conductor wire to open circuit like this.
Further, the capacitive screen still includes: and the hardening film is positioned on the surface of one side, away from the first molding layer, of the cover plate, and the hardness of the hardening film is greater than that of the cover plate. Scratch on the surface of the cover plate in touch operation is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art capacitive screen;
fig. 2 is a schematic cross-sectional view of a capacitive screen according to the present invention;
fig. 3 is a schematic back view of a capacitive screen according to the present invention;
fig. 4 to fig. 8 are schematic structural diagrams of the manufacturing process of the capacitive screen of the present invention.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
The present embodiment provides a capacitive screen, referring to fig. 2 and 3, including:
a cover plate 100, said cover plate 100 comprising a visible area and an edge obscuring area surrounding said visible area;
a first molding layer 120 on one side surface of the cap plate 100, the first molding layer 120 having a plurality of first grooves therein;
a first circuit layer including a number of first conductive lines 121, the first conductive lines 121 being located in the first trenches; the first circuit layer comprises a first sensing area and a first lead area surrounding the first sensing area; the visible area and the first sensing area are arranged oppositely, and the edge shielding area and the first lead wire area are arranged oppositely;
a second molding layer 130 located on the first molding layer 120 and a side surface of the first conductive mesh layer facing away from the cover plate 100, the second molding layer 130 having a plurality of second grooves therein;
a second circuit layer including a plurality of second conductive wires 131, the second conductive wires 131 being located in the second grooves, the second circuit layer including a second sensing region 131a (refer to fig. 3) and a second lead region 131b (refer to fig. 3) surrounding the second sensing region 131a, the first and second lead regions 131b being disposed opposite to each other, the first and second sensing regions 131a being disposed opposite to each other;
and a shielding frame layer 110, wherein the shielding frame layer 110 is located between the first lead area and the edge shielding area of the cover plate 100.
In this embodiment, the first conductive lines 121 of the first wiring layer are positioned in the first grooves of the first molding layer 120, and the second conductive lines 131 of the second wiring layer are positioned in the second grooves of the second molding layer 130. This places the first and second wiring layers on the same side of the cap plate 100 through the first and second molding layers 120 and 130. The first circuit layer and the second circuit layer are arranged on one side of the cover plate 100, and the cover plate 100 is used as a substrate of the first circuit layer and the second circuit layer, so that the substrate does not need to be additionally arranged. Therefore, the capacitive screen is light and thin.
The cover plate 100 includes a flexible cover plate or a hard cover plate. The flexible cover sheet comprises a PET (polyethylene terephthalate) cover sheet.
In one embodiment, the cover plate 100 has a thickness of 125-188 microns.
The first molding layer 120 is a first photosensitive adhesive molding layer or a first thermosensitive adhesive molding layer; the second molding layer 130 is a second photosensitive paste molding layer or a second thermal paste molding layer. In this embodiment, the first molding layer 120 is a first photosensitive paste molding layer, and the second molding layer 130 is a second photosensitive paste molding layer.
It should be noted that the photosensitive glue mentioned in this embodiment refers to the UV glue.
In one embodiment, the thickness of the first molding layer 120 opposite to the visible region between adjacent first conductive lines 121 is 10 to 15 micrometers; the thickness of the second molding layer 130 between the adjacent second conductive lines 131 opposite to the visible region is 8 to 9 micrometers.
In this embodiment, the first groove extends from a side surface of the first molding layer 120 facing away from the cover plate 100 to a partial thickness of the first molding layer 120. The second grooves extend from a side surface of the second molding layer 130 facing away from the cover plate 100 into a partial thickness of the second molding layer 130.
In other embodiments, the first trench extends through the first molding layer 120 and the second trench extends through the second molding layer 130.
The first circuit layer is a Metal Mesh layer, and the second circuit layer is a Metal Mesh layer. The first circuit layer does not extend to the surface of the first molding layer on the side away from the cover plate, that is, the position of the first circuit layer is completely limited by the first groove. The second circuit layer does not extend to the side surface of the second molding layer facing away from the cover plate, that is, the position of the second circuit layer is completely limited by the second groove.
The first circuit layer is a sensing circuit layer, the second circuit layer is a driving circuit layer, or the first circuit layer is a driving circuit layer, and the second circuit layer is a sensing circuit layer.
In one embodiment, the first line layer has a thickness of 3 to 5 micrometers. The thickness of the second circuit layer is 3 to 5 micrometers.
A portion of the first lead region serves as a first bonding region. The second molding layer 130 covers the first lead region and the first sensor region outside the first bonding region and exposes the first bonding region. A portion of the second lead region serves as a second bonding region.
In this embodiment, the method further includes: the first flexible circuit board is connected with the first binding region in a binding mode; and the second flexible circuit board is connected with the second binding region in a binding manner.
The shielding frame layer 110 includes an ink shielding layer, and the material of the ink shielding layer includes black ink.
In one embodiment, the thickness of the shadow frame layer 110 is 5 to 8 microns.
In this embodiment, the distance from the surface of the first molding layer 120 facing away from the cover plate 100 to the cover plate 100 between the adjacent first grooves is uniform. The first molding layer 120 covers the shielding frame layer 110 completely, so that the first conductive line 121 is disposed in the first groove, and thus the first conductive line 121 does not need to climb on the surface of the shielding frame layer 110, thereby preventing the first conductive line 121 from being broken.
In one embodiment, a sum of a depth of the first groove and a thickness of the shielding bezel layer is less than a thickness of a first molding layer between the adjacent first conductive lines opposite to the visible region. That is, the first groove opposite to the edge shielding region does not extend to contact with the shielding bezel layer.
In one embodiment, the capacitive screen further comprises: and the hardening film 140 is positioned on the surface of the cover plate 100, which faces away from the first molding layer 120, and the hardness of the hardening film 140 is greater than that of the cover plate 100. Scratch on the surface of the cover plate in touch operation is avoided.
The capacitive screen of this embodiment is frivolous, is close to only one deck PET plate thickness and weight, has really accomplished the extremely thickness that makes of outer hanging capacitive touch screen, still has advantage in the cost, because the frivolous so material cost and manufacturing cost that has reduced of capacitive screen.
In the prior art, the thickness of a used glass cover plate is generally 8-24 times of that of a PET plate, the thickness of each layer of optical adhesive layer is close to that of the PET plate, and the thickness of a conventional capacitive touch screen is 1.5-3.5 mm.
The thickness of one layer of PET cover plate of the capacitive screen of the embodiment is 125-188 micrometers, the total thickness of the first molding layer 120, the second molding layer 130 and the hardened film 140 is less than 30um, and the total thickness of the capacitive screen is less than 218um. The thickness of the capacitive screen of the embodiment is reduced by 85% -94% compared with the thickness of the capacitive screen of the prior conventional technical scheme, and the capacitive screen of the embodiment and the capacitive screen of the prior conventional technical scheme are greatly different in weight. Therefore, the capacitive screen of the embodiment has absolute advantages in light and thin aspects, and besides light and thin aspects, the cost of the capacitive screen of the embodiment is also greatly reduced, and the competitiveness of the whole product can be greatly improved.
The utility model discloses another embodiment still provides a touch-control display module assembly, include: a display screen; the utility model discloses an above-mentioned embodiment have electric capacity screen, electric capacity screen is located display screen's display surface one side, the apron is located second molding layer and second circuit layer deviate from one side of display screen.
The second molding layer and the second circuit layer deviate from one side surface of the cover plate and are attached to the display surface of the display screen through an optical adhesive layer (OCA).
Another embodiment of the present invention further provides a display device, including: the touch display module of the above embodiment.
The following describes the manufacturing method of the capacitive screen of the present invention.
Referring to fig. 4, a cover plate 100 is provided.
The cover plate 100 includes a visible area a and an edge occlusion area B surrounding the visible area a.
Referring to fig. 5, a hardened film 140 is formed on one side surface of the cap plate 100, and the hardness of the hardened film 140 is greater than that of the cap plate 100.
Specifically, a hardening film 140 is provided, and the hardening film 140 is attached to one side surface of the cover plate 100.
Referring to fig. 6, a first molding layer 120 is formed on the other side of the cap plate 100, and the first molding layer 120 has a plurality of first grooves 121 therein.
In one embodiment, the first molding layer 120 is a first photosensitive glue molding layer, and the method for forming the first molding layer 120 includes: coating a first initial photosensitive film on one side surface of the cover plate 100, the first initial photosensitive film being uncured and fluid; arranging a first mold on one side of the first initial photosensitive film, which is far away from the cover plate 100, and stamping the first initial photosensitive film by adopting the first mold; and then, carrying out light curing treatment on the first initial photosensitive film so that the first initial photosensitive film forms a first molding layer, wherein the first molding layer is provided with a plurality of first grooves. In one embodiment, the photo-curing treatment of the first initial photosensitive film employs ultraviolet light. The first mold has a first pattern therein.
In one embodiment, the first molding layer 120 is a first thermal paste molding layer, and the method of forming the first molding layer 120 includes: coating a first initial thermosensitive film on one side surface of the cover plate 100; and carrying out hot-pressing treatment on the first initial heat-sensitive film so that the first initial heat-sensitive film forms a first molding layer, wherein the first molding layer is provided with a plurality of first grooves.
In this embodiment, the method further includes: before the first molding layer 120 is formed, a shielding frame layer 110 is formed on one side of the edge shielding region B of the cover plate 100, and the shielding frame layer 110 does not cover the visible region a. After the first molding layer 120 is formed, the first molding layer 120 covers the shielding frame layer 110. The shielding frame layer 110 includes an ink shielding layer, and the material of the ink shielding layer includes black ink. The thickness of the shielding border layer 110 is described with reference to the foregoing.
The distance from the surface of the first molding layer 120 facing away from the cover plate 100 to the cover plate 100 between the adjacent first grooves is uniform.
Referring to fig. 7, after forming the first molding layer 120, a first line layer including a plurality of first conductive lines 121 is formed, the step of forming the first line layer including: a first conductive line 121 is formed in the first trench.
The first molding layer 120 completely covers the shielding frame layer 110, and the first conductive line 121 is disposed in the first groove, so that the first conductive line 121 does not need to climb on the surface of the shielding frame layer 110, thereby preventing the first conductive line 121 from being broken.
Specifically, the conductive paste is coated in the first trench and cured to form the first conductive line 121.
The first circuit layer includes a first sensing region and a first lead region surrounding the first sensing region. A portion of the first lead region serves as a first bonding region.
Referring to fig. 8, a second molding layer 130 is formed on the first molding layer 120 and a side surface of the first wiring layer facing away from the cap plate 100, and the second molding layer 130 has second grooves therein.
The second molding layer 130 covers the first lead region and the first sensor region outside the first bonding region and exposes the first bonding region.
In one embodiment, the second molding layer 130 is a second photosensitive paste molding layer, and the method of forming the second molding layer 130 includes: coating a second initial photosensitive film on the surface of the first molding layer 120 and the first circuit layer on the side facing away from the cover plate 100, wherein the second initial photosensitive film is uncured and has fluidity; arranging a second mold on one side, away from the cover plate, of the second initial photosensitive film, and stamping the second initial photosensitive film by using the second mold; and then, carrying out light curing treatment on the second initial photosensitive film so that the second initial photosensitive film forms a second molding layer, wherein a plurality of second grooves are formed in the second molding layer. In one embodiment, the photo-curing treatment of the second initial photosensitive film employs ultraviolet light. The second mold has a second pattern therein. The first binding region needs to be avoided during the coating of the second initial photosensitive film.
In one embodiment, the second molding layer 130 is a second thermosensitive adhesive molding layer, and the method of forming the second molding layer 130 includes: coating a second initial thermosensitive film on the surfaces of the first molding layer 120 and the first circuit layer, which face away from the cover plate 100; and carrying out hot-pressing treatment on the second initial thermosensitive film, so that the second initial thermosensitive film forms a second molding layer, and the second molding layer is provided with a plurality of second grooves. The first binding region needs to be avoided during the coating of the second initial thermo-sensitive film.
With continued reference to fig. 8, a second circuit layer is formed, the second circuit layer including a number of second conductive lines 131, the step of forming the second circuit layer including: a second conductive line 131 is formed in the first trench.
Specifically, the conductive paste is coated in the second groove and cured to form the second conductive line 131.
The second circuit layer includes a second sensing region 130a and a second lead region 130b surrounding the second sensing region 130a, the first and second lead regions 130b being disposed opposite each other, and the first and second sensing regions 130a being disposed opposite each other.
A portion of the second lead region serves as a second bonding region.
In this embodiment, the method further includes: providing a first flexible circuit board and a second flexible circuit board, binding one end of the first flexible circuit board in a first binding area, and binding one end of the second flexible circuit board in a second binding area.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (9)
1. A capacitive screen, comprising:
the cover plate comprises a visible area and an edge shielding area surrounding the visible area;
the first molding layer is positioned on the surface of one side of the cover plate, and a plurality of first grooves are formed in the first molding layer;
a first circuit layer including a number of first conductive lines in the first slot, the first circuit layer including a first sensing region and a first lead region surrounding the first sensing region; the visible area and the first sensing area are arranged oppositely, and the edge shielding area and the first lead wire area are arranged oppositely;
the second molding layer is positioned on the surface of one side, away from the cover plate, of the first molding layer and the first circuit layer, and a plurality of second grooves are formed in the second molding layer;
a second circuit layer comprising a plurality of second conductive lines, the second conductive lines being located in the second slots, the second circuit layer comprising a second sensing area and a second lead area surrounding the second sensing area; the first lead area and the second lead area are oppositely arranged, and the first sensing area and the second sensing area are oppositely arranged;
and the shielding frame layer is positioned between the first lead area and the edge shielding area of the cover plate.
2. The capacitive screen of claim 1 wherein the first molding layer is a first photosensitive adhesive molding layer or a first thermo-sensitive adhesive molding layer; the second molding layer is a second photosensitive adhesive molding layer or a second thermosensitive adhesive molding layer.
3. A capacitive screen in accordance with claim 1 wherein the thickness of the first molding layer between adjacent ones of the first conductive lines opposite the viewing area is in the range of 10 microns to 15 microns; a thickness of a second molding layer between adjacent ones of the second conductive lines opposite to the visible region is 8 to 9 micrometers.
4. The capacitive screen of claim 1, wherein the shielding bezel layer comprises an ink shielding layer.
5. A capacitive screen according to any one of claims 1 to 4 wherein the sum of the depth of the first groove and the thickness of the masking border layer is less than the thickness of the first moulding layer between adjacent ones of the first conductive lines opposite the viewing area.
6. The capacitive screen of any one of claims 1 to 4, further comprising: and the hardening film is positioned on the surface of one side, away from the first molding layer, of the cover plate, and the hardness of the hardening film is greater than that of the cover plate.
7. A capacitive screen according to any one of claims 1 to 4 wherein the cover sheet comprises a PET cover sheet.
8. A touch display module, comprising: a display screen; the capacitive screen of any one of claims 1-7, the capacitive screen being located on a display surface side of the display screen, the cover plate being located on a side of the second molding layer and the second circuitry layer facing away from the display screen.
9. A display device, comprising: the touch display module of claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222312950.0U CN218585311U (en) | 2022-08-31 | 2022-08-31 | Capacitive screen, touch display module and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222312950.0U CN218585311U (en) | 2022-08-31 | 2022-08-31 | Capacitive screen, touch display module and display device |
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| CN218585311U true CN218585311U (en) | 2023-03-07 |
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| CN202222312950.0U Active CN218585311U (en) | 2022-08-31 | 2022-08-31 | Capacitive screen, touch display module and display device |
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