CN113513713A

CN113513713A - Full-automatic disc type rubber-insulated-wire lamp string production device and production method thereof

Info

Publication number: CN113513713A
Application number: CN202110456085.4A
Authority: CN
Inventors: 许友兵
Original assignee: Linhai Binli Lighting Co ltd
Current assignee: Linhai Binli Lighting Co ltd
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-10-19

Abstract

The invention belongs to the field of decorative lamp production and manufacture, and particularly relates to a full-automatic disc type rubber-insulated-wire lamp string production device and a production method thereof. The production device and the production method can realize full-automatic production of the rubber-insulated-wire lamp string, are efficient and convenient, and save labor cost.

Description

Full-automatic disc type rubber-insulated-wire lamp string production device and production method thereof

Technical Field

The invention belongs to the field of decorative lamp production and manufacture, and particularly relates to a full-automatic disc type rubber-insulated-wire lamp string production device and a production method thereof.

Background

The rubber-insulated-wire lamp string is also called a PVC flexible-wire lamp string and is different from the traditional LED lamp string, each LED lamp unit in the traditional LED lamp string comprises a lamp cap and two covered wires connected with the lamp cap, the LED lamp units are connected in series to form the LED lamp string, and the rubber-insulated-wire lamp string is characterized in that the lamp cap and the two covered wires form a V-shaped structure, so that the lamp cap is relatively protruded and is not attractive enough. The rubber-insulated-wire lamp is characterized in that the lamp holder is hidden in the rubber-insulated wire, so that the rubber-insulated-wire lamp is more attractive and elegant in appearance. As shown in fig. 1-4, the covered wire lamp string 3 includes a copper wire 301, a covered wire 300 wrapped around the copper wire 301, and a chip 302 disposed in the covered wire 300 and soldered to the copper wire 301, and the lamp head is integrated on the chip 302. Fig. 1 and 2 show a covered wire light string 3 having two copper wires 301, and fig. 3 and 4 show a covered wire light string having three copper wires 301.

The traditional rubber-insulated-wire lamp string needs manual production, and the efficiency is too low. Based on the problem, the applicant provides a full-automatic disc type rubber-insulated-wire lamp string production device and a production method thereof.

Disclosure of Invention

In order to make up the defects of the prior art, the invention provides a full-automatic disc type rubber-insulated-wire lamp string production device and a technical scheme of a production method thereof.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized by comprising a disc clamping and conveying mechanism, and a wire mechanism, a cutting mechanism, a peeling mechanism, a chip welding module and a glue injection mechanism which are sequentially arranged around the disc clamping and conveying mechanism, wherein,

the disc clamping and conveying mechanism is used for clamping the rubber-covered wire and intermittently conveying the rubber-covered wire in a circumferential path;

the wire guide mechanism is used for guiding the rubber-covered wire to enter the disc clamping and conveying mechanism;

the cutting mechanism is used for cutting the leather threads;

the peeling mechanism is used for pressing down the cut covered wire to expose the copper wire in the covered wire;

the chip welding module is used for welding a chip on the copper wire;

the glue injection mechanism is used for injecting glue to the copper wires, so that the chips can be packaged.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized in that the disc clamping and conveying mechanism comprises a disc, a plurality of wire clamps annularly distributed on the disc and used for clamping rubber-insulated wires and a disc driving device used for driving the disc to rotate.

The full-automatic disc type covered wire lamp string production device is characterized in that the wire clamping device comprises a fixed clamping plate, a movable clamping plate which is in rotating fit with the fixed clamping plate and a spring which is used for pressing the movable clamping plate tightly and enabling the movable clamping plate and the fixed clamping plate to clamp the covered wire together; the production device further comprises a thread loosening mechanism, and the thread loosening mechanism is used for pressing down the movable clamping plate and enabling the thread clamping device to be opened.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized in that the chip welding module comprises a tin feeding mechanism, an automatic chip mounting mechanism and a welding mechanism which are sequentially arranged, wherein the tin feeding mechanism is used for coating tin paste on a bare copper wire and comprises a tin storage container, a tin fishing assembly and a tin dipping assembly, the tin storage container is used for storing the tin paste, the tin fishing assembly is used for fishing the tin paste in the tin storage container, and the tin dipping assembly is used for dipping the tin paste fished by the tin fishing assembly and coating the dipped tin paste on the copper wire; the automatic chip mounting mechanism is used for grabbing chips onto the copper wire one by one; the welding mechanism is used for rapidly heating the solder paste to enable the chip to be welded on the copper wire after the solder paste is solidified.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized in that the tin fishing component comprises a tin fishing disc for fishing tin and a tin fishing transmission structure for driving the tin fishing disc to lift; the tin pick-up component comprises a tin pick-up executing part for tin pick-up and a tin pick-up transmission structure for driving the tin pick-up executing part to move.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized in that the automatic chip mounting mechanism comprises a vacuum suction nozzle used for grabbing a chip and an automatic chip mounting mechanical arm used for driving the vacuum suction nozzle to move.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized in that the welding mechanism comprises a rapid heater for heating solder paste, a rapid heating transmission structure for driving the rapid heater to move, a welding auxiliary part for limiting the chip during welding and a welding auxiliary transmission structure for driving the welding auxiliary part to lift.

The full-automatic disc type covered wire lamp string production device is characterized in that the peeling mechanism comprises a peeling pressing executing part used for pressing down the covered wire and a peeling transmission structure used for driving the peeling pressing executing part to lift.

The full-automatic disc type rubber-insulated-wire lamp string production device is characterized by further comprising a curing mechanism, wherein the curing mechanism is used for curing glue injection on the copper wire.

The production method of the leather-covered wire lamp string is characterized by adopting the production device, and the production method comprises the following steps:

step 1: clamping the rubber-covered wire on a disc clamping and conveying mechanism and conveying the rubber-covered wire through the disc clamping and conveying mechanism;

step 2: cutting the leather threads;

and step 3: peeling the covered wire to expose the copper wire in the covered wire;

and 4, step 4: coating solder paste on the copper wire;

and 5: mounting the chip on the solder paste;

step 6: heating the solder paste to weld the chip on the copper wire;

and 7: dispensing the chip and the copper wire to package the chip;

and 8: and cooling and solidifying the glue layer.

Compared with the prior art, the invention has the beneficial effects that:

1) the production device and the production method can realize full-automatic production of the rubber-insulated-wire lamp string, are efficient and convenient, and save labor cost;

2) the production device adopts an annular production assembly line, can produce any number of rubber-insulated-wire lamp strings, is not limited by the length of the assembly line, and can reduce the occupied space of equipment;

3) the production device is provided with the disc clamping and conveying mechanism, can automatically clamp the rubber-covered wire and intermittently convey the rubber-covered wire in a circumferential route, and is powerful in function;

4) the production device is provided with the tin feeding mechanism, the tin paste is fished by the tin fishing assembly, and then the fished tin paste is coated on the copper wire by the tin sticky assembly, so that compared with the traditional spraying mode, the raw materials are saved, the cost is reduced, and the production device is cleaner and more environment-friendly;

5) the production device is provided with the welding mechanism, the solder paste is heated by the rapid heater, the heating range is small, the precision is high, the solder paste can be rapidly melted, the surrounding rubber wires are not affected, the melted solder paste can be rapidly solidified, excessive waiting time is not needed, and the efficiency is improved.

Drawings

FIG. 1 is a schematic view of a first leather ray lamp string;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

FIG. 3 is a schematic view of a second leather ray lamp string;

FIG. 4 is a cross-sectional view taken along line B-B of FIG. 3;

FIG. 5 is a schematic structural diagram of a production apparatus according to the present invention;

FIG. 6 is a schematic view of a structure of a disk clamping and conveying mechanism and a lead structure in the production apparatus of the present invention;

FIG. 7 is an enlarged view at C of FIG. 6;

FIG. 8 is a schematic view of the internal structure of the production apparatus of the present invention;

FIG. 9 is an enlarged view of FIG. 8 at D;

FIG. 10 is a second schematic structural diagram of a production apparatus according to the present invention;

FIG. 11 is an enlarged view at E of FIG. 10;

FIG. 12 is an enlarged view at F of FIG. 10;

FIG. 13 is an enlarged view at G of FIG. 10;

FIG. 14 is a third schematic view of the production apparatus of the present invention;

FIG. 15 is an enlarged view at H in FIG. 14;

FIG. 16 is a fourth schematic view of the production apparatus of the present invention;

FIG. 17 is an enlarged view taken at I in FIG. 14;

FIG. 18 is a fifth schematic view of the production apparatus of the present invention;

FIG. 19 is a schematic view of a structure of a disk clamping and conveying mechanism and a welding mechanism in the production apparatus of the present invention;

FIG. 20 is a second schematic view of the internal structure of the production apparatus of the present invention;

FIG. 21 is a flow chart of the production method of the present invention.

Detailed Description

The invention will be further explained with reference to the drawings.

As shown in fig. 1-20, a full-automatic disc type rubber-insulated-wire lamp string production device comprises a disc clamping and conveying mechanism 1, a wire mechanism 2, a cutting mechanism 11, a peeling mechanism 5, a chip welding module, a glue injection mechanism 9 and a workbench 12 for supporting and mounting the mechanisms, wherein the wire mechanism 2, the cutting mechanism 11, the peeling mechanism 5, the chip welding module and the glue injection mechanism 9 are sequentially arranged around the disc clamping and conveying mechanism 1,

the disc clamping and conveying mechanism is used for clamping the rubber-covered wire 300 and intermittently conveying the rubber-covered wire 300 in a circumferential path;

the wire guiding mechanism 2 is used for guiding the rubber-covered wire 300 to enter the disc clamping and conveying mechanism 1;

the cutting mechanism 11 is used for cutting the covered wire 300, only the covered wire 300 is cut off during cutting, and the copper wire 301 is not cut off;

the peeling mechanism 5 is used for pressing down the cut covered wire 300 to expose the copper wire 301 in the covered wire 300;

the die bonding module is used for bonding a die 302 to a copper wire 301;

the glue injection mechanism 9 is used for injecting glue to the copper wire 301, so that the chip 302 can be packaged.

As an optimization: the disc clamping and conveying mechanism 1 comprises a disc 100, a plurality of wire clamps 101 annularly distributed on the disc 100 and used for clamping the rubber-covered wire 300, and a disc driving device used for driving the disc 100 to rotate.

Further, the wire clamping device 101 comprises a fixed clamping plate 1010, a movable clamping plate 1011 which is rotatably matched with the fixed clamping plate 1010, and a spring 1012 which is used for pressing the movable clamping plate 1011 and enabling the movable clamping plate 1011 and the fixed clamping plate 1010 to clamp the rubber-covered wire 300 together. Wherein, the middle part of fixed splint 1010 and the middle part normal running fit of activity splint 1011, the front end of fixed splint 1010 and the front end of activity splint 1011 are used for pressing from both sides tight rubber-insulated-wire 300 together, the cooperation of spring 1012 is connected between fixed splint 1010 rear end and activity splint 1011 rear end.

On the basis of the structure, the wire releasing mechanism 4 is further included, the wire releasing mechanism 4 is used for driving the wire clamping device 101 to open, the wire releasing mechanism comprises a pressing piece 400 and a pressing piece pressing-down transmission structure, the pressing piece 400 is used for pressing down the movable clamping plate 1011 and enabling the movable clamping plate 1011 to rotate relative to the fixed clamping plate 1010 so as to open the wire clamping device 101, and the pressing piece pressing-down transmission structure is used for driving the pressing piece 400 to lift. Specifically, the wire feeding assembly 4 further includes a supporting frame 401 for mounting and supporting the pressing member 400, and the pressing member pressing transmission structure may be a known structure capable of driving the supporting frame 401 and the pressing member 400 to move up and down, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

Further, the disc drive is a conventional intermittent cam divider, and in addition, the disc drive may also be a conventional indexing disc mechanism.

As an optimization: the wire guiding mechanism 2 comprises a plurality of upper guide wheels 200 arranged in a row and a plurality of lower guide wheels 201 arranged in a row, and the upper guide wheels 201 and the lower guide wheels 202 are arranged in a vertically staggered manner so as to achieve the purpose of guiding and straightening the leather wire 300. Specifically, the wire guiding mechanism 2 further comprises an upper mounting bracket 202 for mounting the upper guide wheel 200 and a lower mounting bracket 203 for mounting the lower guide wheel 201.

Based on the above structure, the lead mechanism 2 further includes a lead frame 204, and the lead frame 204 has a lead hole for passing through a rubber-insulated wire. The guide frame 204 is located at an end of the wire guide mechanism 2 near the disc 100.

As an optimization: the cutting mechanism 11 includes an automatic cutting knife 1100 and a cutting transmission structure 1101 for driving the automatic cutting knife 1100 to work, and the structure of the automatic cutting knife 1100 is known in the art and is not described in detail. The cutting transmission structure 1101 can be a known structure that can drive the automatic scissors 1100 to open and close, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

As an optimization: the peeling mechanism 5 comprises a peeling pressing executing member 500 for pressing the covered wire 300 and a peeling transmission structure 501 for driving the peeling pressing executing member 500 to ascend and descend. Specifically, the peeling mechanism 5 further comprises a peeling mounting frame 502 for mounting the peeling push-down actuator 500, and the peeling mounting frame 502 is mounted in cooperation with the peeling transmission structure 501.

In the above structure, the peeling transmission structure 501 may be a known structure that can drive the peeling push-down actuator 500 to lift, such as an air cylinder, an oil cylinder, an electric cylinder, a slider-crank pair, and the like.

As an optimization: chip welding module is including last tin mechanism 6, automatic paster mechanism 7 and the welding mechanism 8 that sets gradually, last tin mechanism 6 is used for coating the tin cream on naked copper line 301, automatic paster mechanism 7 is used for grabbing chip 302 one by one on copper line 301, welding mechanism 8 is used for carrying out rapid heating to the tin cream, makes chip 302 weld on copper line 301 after the tin cream solidification.

Further, go up tin mechanism 6 including storing up tin container 600, dragging for tin subassembly and tin sticky component, it is used for storing the tin cream to store up tin container 600, drag for the tin subassembly and be used for dragging for the tin cream in storing up tin container 600, the tin sticky component is used for being stained with to be dragged for the tin cream that is dragged for the tin subassembly and will be stained with the tin cream of getting and coat on copper line 301. The tin scooping assembly comprises a tin scooping disc 601 for scooping tin and a tin scooping transmission structure 602 for driving the tin scooping disc 601 to lift, the tin wetting assembly comprises a tin wetting execution piece 603 for wetting tin and a tin wetting transmission structure 604 for driving the tin wetting execution piece 603 to move, and the tin wetting execution piece 603 is a rod.

Furthermore, the tin fishing assembly further comprises a tin fishing disk mounting rack 605 for mounting the tin fishing disk 601, and the tin fishing transmission structure 602 is mounted in cooperation with the tin fishing disk mounting rack 605. The tin pick-up assembly further comprises a tin pick-up mounting rack 606 for mounting the tin pick-up actuator 603, and the tin pick-up transmission structure 604 and the tin pick-up mounting rack 606 are mounted in a matching manner. The tin-wetting transmission structure 604 has a lifting function structure and a transverse movement function structure.

In the above structure, the tin scooping transmission structure 602 may be a known structure capable of driving the tin scooping disc 601 to ascend and descend, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

In the above structure, the tin-wetting transmission structure 604 may be a known structure capable of driving the tin-wetting executing component 603 to move up and down and horizontally, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

Further, the automatic chip mounting mechanism 7 includes a vacuum nozzle 700 for grasping the chip 302 and an automatic chip mounting robot 701 for moving the vacuum nozzle 700.

In the above structure, the automatic chip mounter manipulator 701 realizes the lifting and traversing function by adopting a nut and screw structure. The structure of the manipulator and the vacuum suction nozzle 700 is well known in the art and will not be described in detail.

In the above-described configuration, the chips 302 may be additionally transported by a conventional feeding mechanism, such as a conveyor belt or a chain, so that the chips 302 are individually gripped by the automatic chip mounter 7.

Further, the soldering mechanism 8 includes a fast heater 800 for heating solder paste, a fast heating transmission structure for driving the fast heater 800 to move, a soldering auxiliary 802 for limiting the chip 302 during soldering, and a soldering auxiliary transmission structure 803 for driving the soldering auxiliary 802 to move up and down. The fast heater 800 is an ultra-high frequency electromagnetic induction heater, and is provided with a coil heating head 8000, and the ultra-high frequency electromagnetic induction heater can rapidly heat and rapidly cool and solidify the melted solder paste. The rapid heating transmission structure comprises a heater base 8010 for slidably mounting the rapid heater 800, a linear sliding rail 8011 is arranged on the heater base 8010 in a matching manner, and a linear sliding block 8012 for slidably mounting the linear sliding rail 8011 is arranged at the bottom of the rapid heater 800 in a matching manner.

Furthermore, the rapid heating transmission structure further includes a connecting rod 8014 for driving the rapid heater 800 to move back and forth, a V-shaped rocker arm 8013 for driving the connecting rod 8014 to move, and a power source for driving the V-shaped rocker arm 8013 to rotate, where the power source may be a known structure capable of driving the V-shaped rocker arm 8013 to swing, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

In addition, the whole rapid heating transmission structure can also adopt a known structure which can drive the rapid heater 800 to slide back and forth, such as an air cylinder, an oil cylinder, an electric cylinder, a crank-slider pair and the like.

Furthermore, the soldering assistant 802 is an assistant pressing rod for pressing the chip 302 down to keep the chip 302 stable. Specifically, the welding mechanism 8 further includes a welding auxiliary mounting frame 804 for mounting the welding auxiliary 802, and the welding auxiliary transmission structure 803 is mounted in cooperation with the welding auxiliary mounting frame 804. The welding auxiliary transmission structure 803 may be a known structure that can drive the welding auxiliary 802 to move up and down, such as an air cylinder, an oil cylinder, an electric cylinder, a slider-crank pair, etc.

As an optimization: the glue injection mechanism 9 includes a glue injection machine 900 and a glue injection transmission structure 901 for driving the glue injection machine 900 to ascend and descend, the glue injection machine 900 injects glue on the copper wire 301 and the chip 302 to package the chip 302, and the glue injection transmission structure 901 may be a known structure capable of driving the glue injection machine 900 to ascend and descend, such as a cylinder, an oil cylinder, an electric cylinder, a crank-slider pair, and the like.

As an optimization: the invention further comprises a curing mechanism 10, wherein the curing mechanism 10 is positioned behind the glue injection mechanism 9, and is specifically a UV point light source curing system used for cooling and curing glue injection on the copper wire 301.

As an optimization: the invention may also include a testing mechanism for testing the performance of the finished string of covered wire lights 3, such as the conductivity of the string of covered wire lights 3.

The lifting structure and the horizontal moving structure can be provided with corresponding conventional sliding structures for assistance.

It should be noted that the pressing part pressing transmission structure, the cutting transmission structure 1101, the peeling transmission structure 501, the tin scooping transmission structure 602, the tin dipping transmission structure 604, the rapid heating transmission structure, the welding auxiliary transmission structure 803 and the glue injection transmission structure in the present invention can all be driven by a total transmission mechanism 13, the total transmission mechanism 13 is installed at the bottom of the table top of the working table 12, and includes a motor 1300, a gear box 1303 in transmission fit with the motor 1300, a main shaft 1301 in transmission fit with the gear box 1303 through a synchronous belt or a chain wheel mechanism, and a plurality of levers 1302, the main shaft 1301 and the levers 1302 are both rotatably installed at the bottom of the working table 12, a plurality of cams 1304 one-to-one corresponding to the levers 1302 are arranged along the length direction of the main shaft 1301, one end of the lever 1302 abuts against the upper end surface of the corresponding boss 1303 through a bearing 1304, all the levers 1302 correspond to one-to-all the transmission structures and are hinged through a connecting rod 1306, when the main transmission mechanism 13 works, the motor 1300 drives the gear box 1303 to work, the gear box 1303 drives the main shaft 1301 to rotate together with the cam 1304 on the main shaft 1301, the boss 1303 can drive the corresponding lever 1302 to swing intermittently when rotating, the lever 1302 drives the corresponding transmission structure to work through the connecting rod 1306, if the lifting action is realized, the connecting rod 1306 only needs to jack up the corresponding structure, if the transverse moving action is realized, the connecting rod 1306 needs to be matched with the V-shaped rocker arm 8013 in the welding mechanism 8, and when the connecting rod 1306 jacks up one end of the V-shaped swing arm 8013, the other end of the V-shaped swing arm 8013 can drive the corresponding structure to perform the corresponding transverse moving action, so that the transverse moving function is realized.

As shown in fig. 21, a leather line lamp string production method, which uses the production apparatus, comprises the following steps:

step 1: clamping the rubber-covered wire 300 on the disc clamping and conveying mechanism 1 and conveying the rubber-covered wire through the disc clamping and conveying mechanism 1;

step 2: cutting the covered wire 300;

and step 3: peeling off the covered wire 300 to expose the copper wire 301 in the covered wire 300;

and 4, step 4: coating solder paste on the copper wire 301;

and 5: mounting the chip 302 to a solder paste;

step 6: heating the solder paste to solder the chip 302 on the copper wire 301;

and 7: dispensing the chip 302 and the copper wire 301 to package the chip 302;

and 8: and cooling and solidifying the glue layer.

And step 9: the performance of the rubber-insulated-wire lamp string 3 is detected.

Further description of step 1: the rubber-covered wire 300 is guided to the disc clamping and conveying mechanism 1 by the wire guiding mechanism 2, the pressing piece 400 presses the rear end of the movable clamping plate 1011 of the wire clamping device 101 downwards, the wire clamping device 101 is opened, when the rubber-covered wire 300 is close to the wire clamping device 101, the pressing piece 400 moves upwards again, the spring 1012 resets the movable clamping plate 1011, the wire clamping device 101 clamps the rubber-covered wire 300, then the disc driving device drives the disc 100 to rotate together with the wire clamping device 101 on the disc, the wire clamping device 101 also plays a role in traction on the rubber-covered wire 300 when moving, and the rubber-covered wire 300 is clamped by the wire clamping device 1011 section by section, so that the wire inlet action is completed;

further description of step 2: the cutting transmission structure 1101 drives the automatic cutter 1100 to close, and the automatic cutter 1100 cuts the covered wire 300 but does not cut the copper wire 301;

further description of step 3: the peeling transmission structure 501 drives the peeling pressing executing piece 500 to move downwards, and the peeling pressing executing piece 500 presses the continuous covered wire 300 between two adjacent wire clamps 101 downwards in the downward moving process, so that the copper wire 301 at the end part of the covered wire 300 is exposed;

further description of step 4: the tin scooping transmission structure 602 drives the tin scooping disc 601 to move upwards, so that the tin scooping disc 601 scoops out the tin paste, the tin pick-up transmission structure 604 drives the tin pick-up executing part 603 to move downwards, the tin pick-up executing part 603 picks up the tin paste on the tin scooping disc 601, then the tin pick-up transmission structure 604 drives the tin pick-up executing part 603 to move up and down and move transversely, and finally the tin paste is coated on the bare copper wire 301;

further description of step 5: sucking the chip 302 by a vacuum suction nozzle 700, driving the vacuum suction nozzle 700 to move up and down and transversely by an automatic chip mounting manipulator 701, and finally mounting the chip 302 on solder paste;

further description of step 6: welding, wherein the solder paste is heated by a coil heating head 8000 of the quick heater 800 to be quickly melted, and after the solder paste is solidified, the chip 302 and the copper wire 301 are welded together;

further description of step 7: driving the glue injection machine 900 to move downwards and approach the target chip 302 through the glue injection transmission structure 901, and injecting glue on the copper wire 301 and the chip 302 through the glue injection machine 900 to enable the glue layer to wrap the copper wire 301 and the chip 302;

further description of step 8: cooling and solidifying the glue layer through a UV point light source solidifying system to obtain a finished product of the rubber-insulated-wire lamp string 3;

further description of step 9: the performance of the rubber-insulated-wire light string is tested by conventional testing equipment.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A full-automatic disc type rubber-insulated-wire lamp string production device is characterized by comprising a disc clamping and conveying mechanism (1), and a wire mechanism (2), a cutting mechanism (11), a peeling mechanism (5), a chip welding module and an adhesive injection mechanism (9) which are sequentially arranged on the periphery of the disc clamping and conveying mechanism (1),

the disc clamping and conveying mechanism is used for clamping the rubber-covered wire (300) and intermittently conveying the rubber-covered wire (300) in a circumferential path;

the wire guiding mechanism (2) is used for guiding the rubber-covered wire (300) to enter the disc clamping and conveying mechanism (1);

the cutting mechanism (11) is used for cutting the leather threads (300);

the peeling mechanism (5) is used for pressing down the cut covered wire (300) to expose the copper wire (301) in the covered wire (300);

the chip welding module is used for welding a chip (302) on a copper wire (301);

the glue injection mechanism (9) is used for injecting glue to the copper wires (301), so that the chips (302) can be packaged.

2. The automatic disc type rubber-insulated-wire lamp string production device according to claim 1, wherein the disc clamping and conveying mechanism (1) comprises a disc (100), a plurality of wire clamps (101) annularly arranged on the disc (100) and used for clamping the rubber-insulated wire (300), and a disc driving device used for driving the disc (100) to rotate.

3. The full-automatic disc type rubber-insulated-wire lamp string production device of claim 2, characterized in that the wire clamper (101) comprises a fixed clamping plate (1010), a movable clamping plate (1011) rotationally matched with the fixed clamping plate (1010), and a spring (1012) for pressing the movable clamping plate (1011) and enabling the movable clamping plate (1011) and the fixed clamping plate (1010) to clamp the rubber-insulated wire (300) together; the production device further comprises a wire loosening mechanism (4), wherein the wire loosening mechanism (4) is used for pressing down a movable clamping plate (1011) and opening the wire clamp (101).

4. The full-automatic disc type rubber-insulated-wire lamp string production device according to claim 1, wherein the chip welding module comprises a tinning mechanism (6), an automatic chip mounting mechanism (7) and a welding mechanism (8) which are sequentially arranged, the tinning mechanism (6) is used for coating tin paste on the bare copper wire (301) and comprises a tin storage container (600), a tin fishing component and a tin dipping component, the tin storage container (600) is used for storing the tin paste, the tin fishing component is used for fishing the tin paste in the tin storage container (600), and the tin dipping component is used for dipping the tin paste fished by the tin fishing component and coating the dipped tin paste on the copper wire (301); the automatic chip mounting mechanism (7) is used for grabbing the chips (302) onto the copper wires (301) one by one; the welding mechanism (8) is used for rapidly heating the solder paste, so that the chip (302) is welded on the copper wire (301) after the solder paste is solidified.

5. The full-automatic disc type rubber-insulated-wire lamp string production device of claim 4, characterized in that the tin scooping assembly comprises a tin scooping plate (601) for scooping tin and a tin scooping transmission structure (602) for driving the tin scooping plate (601) to ascend and descend; the tin dipping component comprises a tin dipping execution piece (603) for tin dipping and a tin dipping transmission structure (604) for driving the tin dipping execution piece (603) to move.

6. The full-automatic disc type rubber-insulated-wire lamp string production device according to claim 4, wherein the automatic chip mounting mechanism (7) comprises a vacuum suction nozzle (700) for grabbing the chip (302) and an automatic chip mounting manipulator (701) for driving the vacuum suction nozzle (700) to move.

7. The automatic disc type rubber-insulated-wire lamp string production device according to claim 4, wherein the welding mechanism (8) comprises a rapid heater (800) for heating solder paste, a rapid heating transmission structure for driving the rapid heater (800) to move, a welding auxiliary member (802) for limiting the chip (302) during welding, and a welding auxiliary transmission structure (803) for driving the welding auxiliary member (802) to ascend and descend.

8. The full-automatic disc type rubber-insulated-wire lamp string production device according to any one of claims 1 to 7, wherein the peeling mechanism (5) comprises a peeling pressing actuator (500) for pressing down the rubber-insulated wire (300) and a peeling transmission mechanism (501) for driving the peeling pressing actuator (500) to ascend and descend.

9. The full-automatic disc type rubber-insulated-wire lamp string production device according to any one of claims 1 to 7, characterized by further comprising a curing mechanism (10), wherein the curing mechanism (10) is used for curing the glue injection on the copper wires (301).

10. A process for the production of leather-covered lamp strings, characterized in that a production apparatus according to any one of claims 1 to 9 is used, said process comprising the steps of:

step 1: clamping the rubber-covered wire (300) on a disc clamping and conveying mechanism (1) and conveying the rubber-covered wire through the disc clamping and conveying mechanism (1);

step 2: cutting the covered wire (300);

and step 3: peeling off the covered wire (300) to expose the copper wire (301) in the covered wire (300);

and 4, step 4: coating solder paste on the copper wire (301);

and 5: mounting the chip (302) to a solder paste;

step 6: heating the solder paste to enable the chip (302) to be soldered on the copper wire (301);

and 7: dispensing the chip (302) and the copper wire (301) to package the chip (302);

and 8: and cooling and solidifying the glue layer.