CN113510634B - Porous groove white pad for polishing and grinding and production method thereof - Google Patents
Porous groove white pad for polishing and grinding and production method thereof Download PDFInfo
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- CN113510634B CN113510634B CN202110348378.0A CN202110348378A CN113510634B CN 113510634 B CN113510634 B CN 113510634B CN 202110348378 A CN202110348378 A CN 202110348378A CN 113510634 B CN113510634 B CN 113510634B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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Abstract
The invention discloses a porous groove white pad for polishing and grinding and a production method thereof, belonging to the technical field of white pads. The horn-shaped through hole with the narrow upper part and the wide lower part is arranged on the white pad, and the local high temperature caused by friction is reduced by utilizing the through hole for heat dissipation, so that the service life of the white pad is prolonged, and the polishing quality of the white pad is improved; the white pad is tightly attached to an object to be polished, the polishing surface layer and the abrasive layer are bent and deformed towards one side of the abrasive layer, and then the outward port of the through hole is enlarged, so that the chip removal amount of the through hole is increased.
Description
Technical Field
The invention relates to the technical field of white pads, in particular to a porous groove white pad for polishing and grinding and a production method thereof.
Background
The polishing pad is also called polishing leather, polishing cloth, polishing sheet and important auxiliary materials for determining the surface quality in chemical mechanical polishing. Patent No. cn201911081582.x discloses a polishing white pad with micro-holes and a production method thereof, and the polishing white pad with the micro-holes comprises a polishing pad, an adhesive layer and a supporting layer: the polishing pad, the bonding layer and the supporting layer are sleeved with a locking ring, the bonding layer and the supporting layer are fixedly overlapped, the outer ring is bonded together and can be peeled off from the supporting layer, the polishing pad, the bonding layer and the supporting layer are fixedly overlapped, the locking ring is sleeved on the outer ring, the edges of the polishing pad, the bonding layer and the supporting layer are fixed by the locking ring, the top of the locking ring protrudes in a standard mode of the polishing pad, the locking ring surrounds the polishing pad to frame, the outer ring rotates around the inner ring until the outlet corresponds to the liquid flow port, the polishing liquid flows out through the liquid flow port and the outlet, the outer ring rotates around the inner ring until the outlet is staggered with the liquid flow port, the liquid flow port is blocked, and the polishing liquid can be stored.
However, the polishing pad in the above patent cannot remove the debris generated by polishing in time, thereby reducing the polishing quality, and the polishing pad is very easy to generate local high temperature due to high polishing speed during the polishing process, thereby reducing the polishing quality due to the local high temperature and affecting the service life of the polishing pad.
Disclosure of Invention
The invention aims to provide a porous groove white pad for polishing and grinding and a production method thereof, wherein a trumpet-shaped through hole with a narrow upper part and a wide lower part is arranged on the white pad, and the through hole is used for dissipating heat, so that the local high temperature caused by friction is reduced, the service life of the white pad is prolonged, and the polishing quality is improved; the white pad is tightly attached to an object to be polished, the polishing surface layer and the abrasive layer are bent and deformed towards one side of the abrasive layer, the outward port of the through hole is enlarged, and the chip removal amount of the through hole is increased so as to solve the problem in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a polishing is ground and is filled up with porous groove white, includes by high elastic layer, transition layer, polishing surface course and the abrasive material layer that sets gradually from bottom to top, high elastic layer, transition layer, polishing surface course and abrasive material layer are in the same place in compound connection in proper order, and is provided with a plurality of narrow wide through-holes down after high elastic layer, transition layer and polishing surface course overlap each other, each composition parts by weight ratio of the used raw materials of high elastic layer is as follows:
20-40 parts of first silica gel;
2-25 parts of first nitrile rubber;
10-55 parts of a first thermoplastic resin;
3-5 parts of a first auxiliary additive;
wherein, the nitrile rubber is composed of butadiene and acrylonitrile, the content of the acrylonitrile accounts for 36 percent to 41 percent, and the thermoplastic resin is any one or the mixture of more than two of PE-polyethylene, PP-polypropylene, PVC-polyvinyl chloride, PS-polystyrene, PA-polyamide, POM-polyformaldehyde, PC-polycarbonate, polyphenyl ether and polysulfone; the auxiliary agent is 2-mercaptobenzothiazole or sulfenamide derivative.
Further, the transition layer comprises the following raw materials in parts by weight:
5-15 parts of second silica gel;
2-8 parts of second nitrile rubber
30-60 parts of a second aqueous epoxy resin adhesive;
10-50 parts of second polyurethane;
1-3 parts of a second auxiliary additive;
wherein, the nitrile rubber is composed of butadiene and acrylonitrile, the content of the acrylonitrile accounts for 36 percent to 41 percent, and the thermoplastic resin is any one or the mixture of more than two of PE-polyethylene, PP-polypropylene, PVC-polyvinyl chloride, PS-polystyrene, PA-polyamide, POM-polyformaldehyde, PC-polycarbonate, polyphenyl ether and polysulfone; the auxiliary agent is 2-mercaptobenzothiazole or sulfenamide derivative; the water-based epoxy resin adhesive is formed by grafting acrylic acid and maleic anhydride monomers in an epoxy resin molecular chain, containing tertiary amine or quaternary ammonium base in the epoxy resin molecular chain or connecting a hydrophilic polyoxyethylene group on the epoxy resin molecular chain and ensuring that the epoxy resin adhesive contains two or more epoxy groups; the polyurethane is a polyurethane glue containing at least one urethane group, isocyanate group or isocyano group and urethane group.
Furthermore, a high-damping rubber strip is embedded in the transition layer.
Further, the abrasive layer is in a grid shape.
Further, the polishing surface layer and the grinding material layer are prepared from the following raw materials in parts by weight:
20-60 parts of a third aqueous epoxy resin adhesive;
10-40 parts of third polyurethane;
3-5 parts of third filler
1-10 parts of third nano aggregate particles;
wherein, the water-based epoxy resin glue is formed by grafting acrylic acid and maleic anhydride monomers in an epoxy resin molecular chain, containing tertiary amine or quaternary ammonium base in the epoxy resin molecular chain or connecting hydrophilic polyoxyethylene groups on the epoxy resin molecular chain and ensuring that the epoxy resin glue contains two or more epoxy groups; the polyurethane is a polyurethane glue containing at least one urethane group, isocyanate group or isocyano group and urethane group; the filler can be one or a mixture of more than two of organic silicon resin, silicon powder, graphene, polyamide-6 or 66 synthetic fibers, the size of the nano aggregated particles is 0.01-50 microns, and the nano aggregated particles are a mixture of titanium dioxide, zinc oxide, calcium carbonate and aluminum oxide, wherein the titanium dioxide accounts for 10% -20%, the aluminum oxide accounts for 20% -30%, and the zinc oxide accounts for 5% -30%.
Furthermore, a circle of anti-slip glue layer is arranged at the edge of the through hole.
Further, the raw materials of the anti-slip glue layer comprise the following components in parts by weight:
30-50 parts of natural rubber;
10-23 parts of chlorosulfonated polyethylene rubber;
13-21 parts of polyethylene;
17-21 parts of carbon black;
5-16 parts of magnesium oxide;
2-8 parts of calcium oxide.
According to another aspect of the present invention, a method for producing a porous grooved white pad for polishing and grinding is disclosed, comprising the steps of:
s101: uniformly mixing the second silica gel, the second nitrile rubber, the second waterborne epoxy resin adhesive, the second polyurethane and the second auxiliary additive in proportion, and banburying at 80-200 ℃ for 5-10 minutes to obtain a transition layer;
s102: coating the raw materials of the high-elasticity layer on one side of the transition layer after proportioning, sequentially coating the raw materials of the polishing surface layer and the grinding material layer on the other side of the transition layer after proportioning, then placing the transition layer and the grinding material layer in an oven for vulcanization at the temperature of 100-160 ℃ for 5-10 minutes, and obtaining the white pad without the hole groove after vulcanization;
s103: and (3) forming a horn-shaped through hole with a narrow upper part and a wide lower part on the nonporous slot white pad, coating an anti-slip glue layer in a ratio of raw materials at the edge of the upper end of the through hole, and vulcanizing at the temperature of 100-160 ℃ for 5-20 minutes to obtain the porous slot white pad.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a porous groove white pad for polishing and grinding and a production method thereof.A trumpet-shaped through hole with a narrow upper part and a wide lower part is arranged on the white pad, and the through hole is utilized for heat dissipation, so that the local high temperature caused by friction is reduced, the service life of the white pad is prolonged, and the polishing quality is improved; the white pad is tightly attached to an object to be polished, the polishing surface layer and the abrasive layer are bent and deformed towards one side of the abrasive layer, and then the outward port of the through hole is enlarged, so that the chip removal amount of the through hole is increased.
Drawings
FIG. 1 is an overall view of a porous grooved white pad for polishing and polishing according to the present invention;
FIG. 2 is a flow chart of the production of the porous grooved white pad for polishing and grinding according to the present invention.
In the figure: 1. a high elastic layer; 2. a transition layer; 3. polishing the surface layer; 4. an abrasive layer; 5. a through hole; 6. and (4) an anti-slip adhesive layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, the porous groove white pad for polishing and grinding comprises a high-elasticity layer 1, a transition layer 2, a polishing surface layer 3 and an abrasive layer 4 which are sequentially arranged from bottom to top, wherein the high-elasticity layer 1, the transition layer 2, the polishing surface layer 3 and the abrasive layer 4 are sequentially and compositely connected together, a plurality of narrow-upper and wide-lower through holes 5 are formed after the high-elasticity layer 1, the transition layer 2 and the polishing surface layer 3 are mutually overlapped, and the raw materials used by the high-elasticity layer 1 are prepared from the following components in parts by weight:
20 parts of first silica gel;
20 parts of first nitrile rubber;
55 parts of a first thermoplastic resin;
5 parts of a first auxiliary additive;
wherein, the nitrile rubber is composed of butadiene and acrylonitrile, the content of the acrylonitrile accounts for 36 percent to 41 percent, and the thermoplastic resin is any one or the mixture of more than two of PE-polyethylene, PP-polypropylene, PVC-polyvinyl chloride, PS-polystyrene, PA-polyamide, POM-polyformaldehyde, PC-polycarbonate, polyphenyl ether and polysulfone; the auxiliary agent is 2-mercaptobenzothiazole or sulfenamide derivative.
The transition layer 2 comprises the following raw materials in parts by weight:
15 parts of second silica gel;
5 portions of second nitrile rubber
60 parts of a second aqueous epoxy resin adhesive;
18 parts of second polyurethane;
2 parts of a second auxiliary additive;
wherein, the nitrile rubber is composed of butadiene and acrylonitrile, the content of the acrylonitrile accounts for 36 percent to 41 percent, and the thermoplastic resin is any one or the mixture of more than two of PE-polyethylene, PP-polypropylene, PVC-polyvinyl chloride, PS-polystyrene, PA-polyamide, POM-polyformaldehyde, PC-polycarbonate, polyphenyl ether and polysulfone; the auxiliary additive is 2-mercaptobenzothiazole or sulfenamide derivative; the water-based epoxy resin adhesive is formed by grafting acrylic acid and maleic anhydride monomers in an epoxy resin molecular chain, containing tertiary amine or quaternary ammonium base in the epoxy resin molecular chain or connecting a hydrophilic polyoxyethylene group on the epoxy resin molecular chain and ensuring that the epoxy resin adhesive contains two or more epoxy groups; the polyurethane is a polyurethane glue containing at least one urethane group, isocyanate group or isocyano group and urethane group.
The transition layer 2 is embedded with high damping rubber strips, the grinding material layer 4 is in a grid shape, and the polishing surface layer 3 and the grinding material layer 4 are prepared from the following raw materials in parts by weight:
55 parts of a third aqueous epoxy resin adhesive;
35 parts of third polyurethane;
third filling material 5 parts
5 parts of third nano aggregation particles;
wherein, the water-based epoxy resin glue is formed by grafting acrylic acid and maleic anhydride monomers in an epoxy resin molecular chain, containing tertiary amine or quaternary ammonium base in the epoxy resin molecular chain or connecting hydrophilic polyoxyethylene groups on the epoxy resin molecular chain and ensuring that the epoxy resin glue contains two or more epoxy groups; the polyurethane is a polyurethane glue containing at least one urethane group, isocyanate group or isocyano group and urethane group; the filler can be one or a mixture of more than two of organic silicon resin, silicon powder, graphene, polyamide-6 or 66 synthetic fibers, the size of the nano aggregated particles is 0.01-50 microns, and the nano aggregated particles are a mixture of titanium dioxide, zinc oxide, calcium carbonate and aluminum oxide, wherein the titanium dioxide accounts for 10% -20%, the aluminum oxide accounts for 20% -30%, and the zinc oxide accounts for 5% -30%.
The edge of the through hole 5 is provided with a circle of anti-skid glue layer 6, and the anti-skid glue layer 6 comprises the following raw materials in parts by weight:
40 parts of natural rubber;
15 parts of chlorosulfonated polyethylene rubber;
15 parts of polyethylene;
18 parts of carbon black;
7 parts of magnesium oxide;
5 parts of calcium oxide.
Referring to fig. 2, in order to better show the production process of the porous grooved white pad for polishing and grinding, the present embodiment now proposes a production method of the porous grooved white pad for polishing and grinding, which comprises the following steps:
s101: uniformly mixing the second silica gel, the second nitrile rubber, the second waterborne epoxy resin adhesive, the second polyurethane and the second auxiliary additive in proportion, and banburying at 80-200 ℃ for 5-10 minutes to obtain a transition layer 2;
s102: coating the raw materials of the high-elasticity layer 1 on one side of the transition layer 2 after proportioning, sequentially coating the raw materials of the polishing surface layer 3 and the grinding material layer 4 on the other side of the transition layer 2 after proportioning, then placing the obtained product in an oven for vulcanization, wherein the oven temperature is 100-160 ℃, and the time is 5-10 minutes, and obtaining the white pad without the hole groove after vulcanization;
s103: and (3) forming a horn-shaped through hole 5 with a narrow upper part and a wide lower part on the white pad without the hole, coating an anti-slip adhesive layer 6 according to the raw material ratio at the edge of the upper end of the through hole 5, and vulcanizing at the temperature of 100-160 ℃ for 5-20 minutes to obtain the white pad with the hole.
Example two
The difference between this embodiment and the first embodiment is only that the raw material composition ratio of the high elastic layer 1 is different, and the raw materials used for the high elastic layer 1 in this embodiment are as follows in parts by weight:
40 parts of first silica gel;
20 parts of first nitrile rubber;
35 parts of a first thermoplastic resin;
5 parts of a first auxiliary additive;
wherein, the weight part of the first silica gel is increased to 40 parts, the weight part of the first thermoplastic resin is correspondingly reduced to 35 parts, and the elasticity index of the high-elasticity layer 1 is adjusted by changing the weight parts of the components so as to adapt to the high deformation of the white pad.
EXAMPLE III
The difference between this embodiment and the first embodiment is only that the raw material of the transition layer 2 has a different mixture ratio, and in this embodiment, the raw materials of the transition layer 2 have the following mixture ratios in parts by weight:
15 parts of second silica gel;
second nitrile rubber 5 parts
30 parts of a second aqueous epoxy resin adhesive;
48 parts of second polyurethane;
2 parts of a second auxiliary additive;
the hardness and elasticity of the transition layer 2 are both between the high-elasticity layer 1 and the polishing surface layer 3, and when the white pad bends and deforms towards the polishing surface layer 3, the white pad is pulled up and down to connect the polishing surface layer 3 with low deformation and the high-elasticity layer 1 with high deformation.
Comparative example 1
The comparative example and the first example are different only in that the third step is not performed in the process of producing the white mat, and thus, the present example is a non-porous white mat.
Comparative example No. two
The difference between the comparative example and the first example is only in the production of the shape of the through hole 5 and the structure layer of the white pad, the through hole 5 of the white pad with the middle hole groove is the through hole 5 with the same upper and lower pore diameters, the structure layer of the white pad is the polishing surface layer 3 and the grinding material layer 4 which are coated with a certain proportion on the surface of the base layer, the white pad is placed in an oven for vulcanization, the temperature of the oven is 100-160 ℃, the time is 5-10 minutes, and the white pad in the comparative example is obtained after vulcanization.
Examples 1-3 and comparative examples 1-2 were tested: the test was carried out according to the regulations of GB/T3354-2014. The white pads in examples 1-3 and comparative examples 1-2 were prepared respectively, 30 white pads of the same length were cut out in the width direction, the white pads were pressed from the rear to the front by 40N pressing force and attached to a spherical iron block to be polished, the polishing surface layer 3 and the abrasive layer 4 were closely attached to the surface of the iron block, the spherical iron block was rotated 50 cycles clockwise, the chip removal amount of the through-hole 5, the local temperature during polishing and the deformation amount of the high elastic layer during polishing were measured, and the rebound amount of the high elastic layer after loosening the white pads.
TABLE 1
As can be seen from table 1 above, the white pad structure layers in example 1 and comparative example 1 are the same, and the components of the respective structure layers are the same, but example 1 does not generate local high temperature during grinding compared to the white pad in comparative example 1, and therefore, the through-holes 5 can reduce the local high temperature generated during grinding, and the chip removal amount is extremely low, and comparative example 3 reduces the deformation amount, the rebound amount, and the chip removal amount of the white pad in comparative example 3 compared to example 1.
In summary, the following steps: the invention provides a porous groove white pad for polishing and grinding and a production method thereof.A trumpet-shaped through hole 5 with a narrow upper part and a wide lower part is arranged on the white pad, and the through hole 5 is used for heat dissipation, thereby reducing local high temperature caused by friction, prolonging the service life of the white pad and improving the polishing quality; on hugging closely the object of treating polishing with the white pad, polishing surface course 3 and abrasive material layer 4 towards this abrasive material layer 4 one side bending deformation, then 5 ports towards the outside of through-hole enlarge, improve 5 chip removal volumes of through-hole.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (4)
1. The utility model provides a polishing is ground and is used white pad of porous groove, its characterized in that includes by high elasticity layer (1), transition layer (2), polishing surface course (3) and abrasive material layer (4) that set gradually on going, high elasticity layer (1), transition layer (2), polishing surface course (3) and abrasive material layer (4) are in the same place in compound connection in proper order, and is provided with under a plurality of narrow wide through-holes (5) after high elasticity layer (1), transition layer (2) and polishing surface course (3) overlap each other, it has high damping rubber strip to embed in transition layer (2), abrasive material layer (4) are latticed, the edge of through-hole (5) is provided with round non-slip glue layer (6), each component weight share ratio of the used raw materials of high elasticity layer (1) is as follows:
20-40 parts of first silica gel;
2-25 parts of first nitrile rubber;
10-55 parts of a first thermoplastic resin;
3-5 parts of a first auxiliary additive;
wherein, the nitrile rubber is composed of butadiene and acrylonitrile, the content of the acrylonitrile accounts for 36 percent to 41 percent, and the thermoplastic resin is any one or the mixture of more than two of PE-polyethylene, PP-polypropylene, PVC-polyvinyl chloride, PS-polystyrene, PA-polyamide, POM-polyformaldehyde, PC-polycarbonate, polyphenyl ether and polysulfone; the auxiliary additive is 2-mercaptobenzothiazole or sulfenamide derivative;
the transition layer (2) comprises the following raw materials in parts by weight:
5-15 parts of second silica gel;
2-8 parts of second nitrile rubber
30-60 parts of a second aqueous epoxy resin adhesive;
10-50 parts of second polyurethane;
1-3 parts of a second auxiliary agent.
2. The porous trough white pad for polishing and grinding as claimed in claim 1, wherein the polishing surface layer (3) and the abrasive layer (4) are prepared from the following raw materials in parts by weight:
20-60 parts of a third aqueous epoxy resin adhesive;
10-40 parts of third polyurethane;
3-5 parts of third filler
1-10 parts of third nano aggregate particles;
wherein, the water-based epoxy resin adhesive is formed by grafting acrylic acid and maleic anhydride monomers in an epoxy resin molecular chain, containing tertiary amine or quaternary ammonium base in the epoxy resin molecular chain or connecting a hydrophilic polyoxyethylene group on the epoxy resin molecular chain and ensuring that the epoxy resin adhesive contains two or more than two epoxy groups; the polyurethane is a polyurethane glue containing at least one urethane group, isocyanate group or isocyano group and urethane group; the filler can be one or a mixture of more than two of organic silicon resin, silicon powder, graphene, polyamide-6 or 66 synthetic fibers, the size of the nano aggregated particles is 0.01-50 microns, and the nano aggregated particles are a mixture of titanium dioxide, zinc oxide, calcium carbonate and aluminum oxide, wherein the titanium dioxide accounts for 10% -20%, the aluminum oxide accounts for 20% -30%, and the zinc oxide accounts for 5% -30%.
3. The porous grooved white pad for polishing and grinding as claimed in claim 1, wherein the raw materials of the anti-slip glue layer (6) comprise the following components in parts by weight:
30-50 parts of natural rubber;
10-23 parts of chlorosulfonated polyethylene rubber;
13-21 parts of polyethylene;
17-21 parts of carbon black;
5-16 parts of magnesium oxide;
2-8 parts of calcium oxide.
4. A method for producing a porous grooved white pad for polishing and grinding according to any one of claims 1 to 3, characterized by comprising the steps of:
s101: uniformly mixing the second silica gel, the second nitrile rubber, the second waterborne epoxy resin adhesive, the second polyurethane and the second auxiliary additive in proportion, and banburying at 80-200 ℃ for 5-10 minutes to obtain a transition layer (2);
s102: the method comprises the following steps of mixing raw materials of a high-elasticity layer (1) and then coating the raw materials on one side of a transition layer (2), mixing raw materials of a polishing surface layer (3) and a grinding material layer (4) in sequence and then coating the raw materials on the other side of the transition layer (2), then placing the raw materials in a drying oven for vulcanization, wherein the temperature of the drying oven is 100-160 ℃, the time is 5-10 minutes, and obtaining the white pad without the hole groove after vulcanization;
s103: and (2) forming a horn-shaped through hole (5) with a narrow upper part and a wide lower part on the nonporous groove white pad, coating an anti-slip adhesive layer (6) which is prepared according to the raw material ratio at the edge of the upper end of the through hole (5), and vulcanizing at the temperature of 100-160 ℃ for 5-20 minutes to obtain the porous groove white pad.
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| CN115194642B (en) * | 2022-07-29 | 2023-08-11 | 安徽禾臣新材料有限公司 | Wax-free pad for preventing wafer from stripping for wafer polishing and production process thereof |
| CN116160355B (en) * | 2023-04-19 | 2023-07-18 | 上海芯谦集成电路有限公司 | Heat dissipation polishing pad and preparation method thereof |
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| JPH08195525A (en) * | 1995-01-18 | 1996-07-30 | Nec Corp | Semiconductor laser |
| JP2014037052A (en) * | 2013-08-21 | 2014-02-27 | Ritsumeikan | Workpiece polishing method and polishing liquid |
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| JP4009237B2 (en) * | 2003-09-08 | 2007-11-14 | 東邦エンジニアリング株式会社 | Fine groove processing machine for pads for semiconductor CMP processing |
| CN101100047A (en) * | 2006-07-04 | 2008-01-09 | 张占发 | Sand leaf-disk for machining metal workpiece |
| CN201267772Y (en) * | 2008-09-16 | 2009-07-08 | 沈志荣 | Abrasive disc |
| CN101817172B (en) * | 2010-04-12 | 2012-01-25 | 南京航空航天大学 | Grinding and polishing pad for cured grinding material based on thermal initiation curing and preparation method thereof |
| CN201881282U (en) * | 2010-09-24 | 2011-06-29 | 江苏东光微电子股份有限公司 | Silicon slice polishing disk |
| CN201989057U (en) * | 2010-10-09 | 2011-09-28 | 珠海市世创金刚石工具制造有限公司 | Ceramic tile grinding wheel with multiple rings |
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| JPH08195525A (en) * | 1995-01-18 | 1996-07-30 | Nec Corp | Semiconductor laser |
| JP2014037052A (en) * | 2013-08-21 | 2014-02-27 | Ritsumeikan | Workpiece polishing method and polishing liquid |
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