CN113507036A

CN113507036A - Semiconductor optical amplifier and optical module

Info

Publication number: CN113507036A
Application number: CN202110816909.4A
Authority: CN
Inventors: 柯健
Original assignee: Wuhan Yusheng Photoelectric Co ltd
Current assignee: Wuhan Yusheng Photoelectric Co ltd
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2021-10-15

Abstract

The invention provides a semiconductor optical amplifier and an optical module, wherein the semiconductor optical amplifier comprises a TO base, a refrigerator arranged on the TO base, a heat sink arranged on the cold surface of the refrigerator, a TO pipe cap externally sleeved on the TO base, a sleeve externally sleeved on the TO pipe cap, a ferrule adapter seat connected with the sleeve, an input assembly and an output assembly arranged at the same end of the TO base, a converging lens, an SOA chip substrate and a first collimating lens are arranged on a first workbench of the heat sink in sequence according TO an optical path, and a prism assembly is arranged on a second workbench. According TO the semiconductor optical amplifier, the prism assembly bends the light output by the SOA chip by 180 degrees, the input assembly and the output assembly are located at the same end of the TO base, and the insertion core adapter seat is provided with two insertion core fixing holes.

Description

Semiconductor optical amplifier and optical module

Technical Field

The invention relates to the technical field of optical devices, in particular to a semiconductor optical amplifier and an optical module.

Background

A semiconductor Optical amplifier, also called soa (semiconductor Optical amplifier), is a device for amplifying an Optical signal, and can be used to improve data transmission power and extend transmission distance. In optical fiber communication, the power of an optical signal after long-distance transmission is low, and the receiving requirement of a PD (photo diode) component cannot be met by too low optical signal power, so a semiconductor optical amplifier is often added in front of a receiving end to amplify the optical signal. The semiconductor optical amplifier is a common device in an optical module, and with the development of an optical communication technology, miniaturization is a development trend of the optical module.

The conventional semiconductor optical amplifier is packaged by a butterfly, and mainly structurally comprises a butterfly shell, an input assembly, an output assembly, a converging lens, an SOA chip, a first collimating lens, a refrigerator and the like, wherein the input assembly and the output assembly are respectively arranged at two ends of the butterfly shell, and the converging lens, the SOA chip, the first collimating lens, the refrigerator and the like are arranged in a cavity of the butterfly shell.

Disclosure of Invention

The inventor of the application finds that the butterfly-shaped packaging structure is adopted to cause the problem that the product size is large and the miniaturization requirement of the optical module is not easily met. In view of the above problems, it is necessary to provide a semiconductor optical amplifier to solve or partially solve the above problems, and the technical solution proposed by the present invention is as follows:

in one aspect, the present invention provides a semiconductor optical amplifier, including a TO base, a refrigerator arranged on the TO base, a heat sink arranged on a cold surface of the refrigerator, a TO cap externally sleeved on the TO base, a sleeve externally sleeved on the TO cap, a ferrule adapter seat connected with the sleeve, an input module and an output module arranged at the same end of the TO base, wherein:

the heat sink comprises a first workbench and a second workbench which are perpendicular to each other, a convergent lens, an SOA chip substrate and a first collimating lens are sequentially arranged on the first workbench according to a light path, the SOA chip substrate at least comprises an SOA chip, an optical axis of the convergent lens is coaxial with an optical input port of the SOA chip, and an optical axis of the first collimating lens is coaxial with an optical output port of the SOA chip; a prism assembly is arranged on the second workbench;

the prism assembly is used for folding the output light of the SOA chip by 180 degrees so as TO enable the output light of the SOA chip collimated by the first collimating lens TO be perpendicular TO the TO base and TO be reversely emitted TO the TO pipe cap;

the insertion core adapting seat is provided with two insertion core fixing holes for fixing the input assembly and the output assembly;

the input assembly is used for converging input light rays into parallel light and then entering the converging lens, and the central axis of the input assembly and the central axis of the converging lens are positioned on the same straight line;

the output assembly is used for converging the output light which is folded by 180 degrees through the prism assembly into an external output optical fiber.

Further, the prism assembly comprises: two 45 degree prisms, 45 degree prism level are placed on the second workstation, make the plane of reflection towards first collimating lens and be 45 degrees with the contained angle of second workstation place face, and the plane of reflection of two 45 degree prisms is first plane of reflection and second plane of reflection respectively, first plane of reflection and second plane of reflection set up and mirror image each other relatively.

Furthermore, the prism assembly is an isosceles trapezoid prism, the surface corresponding to the short bottom edge of the isosceles trapezoid prism is attached to the second workbench, and the two 45-degree reflecting surfaces of the isosceles trapezoid prism are respectively a first reflecting surface and a second reflecting surface.

Further, the prism assembly is positioned such that the first collimating lens optical axis passes through the center of the first reflective surface.

Furthermore, an included angle between the reflected light of the first reflecting surface and a plane of the first workbench for placing the SOA chip substrate is an acute angle.

Furthermore, a convergent lens height-matching cushion table and a first collimating lens height-matching cushion table are arranged on the first workbench.

Furthermore, a photoelectric chip is arranged on the second workbench, a pin is arranged on the TO base, the photoelectric chip is connected with the pin, and the pin is connected with an external stray light monitoring circuit.

Furthermore, the semiconductor optical amplifier further comprises a soft belt, wherein a pin is arranged on the TO base, and the soft belt is used for connecting the pin and an external circuit.

Furthermore, the input assembly adopts a first collimator with a tail fiber, the first collimator comprises a first sleeve, and a first optical fiber ferrule and a second collimating lens which are assembled in the first sleeve, the first sleeve is embedded in the ferrule fixing hole, the first optical fiber ferrule is connected with the tail fiber, and the second collimating lens is arranged close to one side of the sleeve.

Furthermore, the output assembly adopts a second collimator with a tail fiber, the second collimator comprises a second sleeve, and a second optical fiber ferrule and a third collimating lens which are assembled in the second sleeve, the second sleeve is embedded in the ferrule fixing hole, the second optical fiber ferrule is connected with the tail fiber, and the third collimating lens is arranged close to one side of the sleeve.

In another aspect, the present invention provides an optical module including the above semiconductor optical amplifier.

Based on the technical scheme, compared with the prior art, the invention has the beneficial effects that:

the invention provides a semiconductor optical amplifier, wherein input light of an input assembly penetrates through a TO pipe cap, is converged TO a SOA chip light input port through a converging lens, is output after being subjected TO light amplification through the SOA chip, is collimated into parallel light through a first collimating lens, and is reflected out of the TO pipe cap after being bent by 180 degrees through a prism and reaches an output assembly. According TO the semiconductor optical amplifier, the output light of the SOA chip is turned by 180 degrees through the prism assembly, so that the input assembly and the output assembly can be located at the same end of the TO base, the insertion core adapter base can be correspondingly provided with two insertion core fixing holes which are respectively used for fixing the input assembly and the output assembly, compared with a scheme that two insertion core adapter bases are needed for arranging the input assembly and the output assembly at two opposite ends in butterfly-shaped packaging, one insertion core adapter base is reduced, the space occupied for fixing the input assembly and the output assembly is reduced, the structure is more compact, the size of a device can be reduced TO a greater extent, and the requirement for miniaturization of an optical module is met.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor optical amplifier according to a first embodiment and a second embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a TO submount and related devices according TO a first embodiment of the invention;

FIG. 3 is a schematic diagram of a prism assembly according to a first embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a TO submount and related devices according TO a second embodiment of the invention;

fig. 5 is a schematic structural diagram and a schematic optical path diagram of a prism assembly according to a second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The refrigerator is a device for realizing refrigeration by using the thermoelectric effect of semiconductor materials, namely the Peltier effect, if two semiconductor materials (P type and N type) with different polarities are connected into a galvanic couple, energy transfer occurs when direct current flows, the current flows from the N type element to the P type element to absorb heat, the end face is a cold face, the current flows from the P type element to the N type element to release heat, and the end face is a hot face. TO (transistor outline), early transistors were mostly in coaxial packages, and later borrowed for optical communications, called TO packages, i.e., coaxial packages, where the coaxial lines from the laser, lens, and optical fiber were in the same line, so devices using TO packages were also called coaxial devices.

Example one

The present embodiment provides a semiconductor optical amplifier, which is shown in fig. 1 and fig. 2, and includes a TO base 10, a refrigerator 30 disposed on the TO base 10, a heat sink 40 disposed on a cold surface of the refrigerator 30, a TO cap 20 externally covering the TO base 10, a sleeve 90 externally covering the TO cap 20, a ferrule adapter 100 connected TO the sleeve 90, and an input module 110 and an output module 120 disposed at the same end of the TO base 10, wherein:

the heat sink 40 comprises a first workbench 41 and a second workbench 42 which are perpendicular to each other, a converging lens 50, an SOA chip substrate 60 and a first collimating lens 70 are sequentially attached to the first workbench 41 according to an optical path, the SOA chip substrate 60 at least comprises an SOA chip 61, the optical axis of the converging lens 50 is coaxial with the optical input port of the SOA chip 61, and the optical axis of the first collimating lens 70 is coaxial with the optical output port of the SOA chip 61; the second stage 42 is provided with a prism assembly 80. After the mounting is completed, the TO cap 20 covers the converging lens 50, the SOA chip substrate 60 and the first collimating lens 70 therein, and is packaged together with the TO base 10. The heat sink 40 may be L-shaped as shown in fig. 2, but of course, other shapes are possible provided that a horizontal plane and a vertical plane are satisfied.

The prism assembly 80 is used TO fold the SOA chip 61 output light 180 degrees so that the SOA chip 61 output light collimated by the first collimating lens 70 is perpendicular TO the TO base 10 and is directed back towards the TO cap 20. As shown in fig. 2 and 3, the prism assembly 80 includes: two 45 degree prisms, 45 degree prism level are placed on second workstation 42, make the plane of reflection towards first collimating lens 70 and be 45 degrees with the contained angle of second workstation 42 place face, and the plane of reflection of two 45 degree prisms is first plane of reflection 81 and second plane of reflection 82 respectively, first plane of reflection 81 and second plane of reflection 82 set up relatively and mirror image each other, first collimating lens 70 optical axis passes the center of first plane of reflection 81. Because the output light of the SOA chip 61 is collimated by the first collimating lens 70 to form a group of parallel light, and the optical axis of the first collimating lens 70 passes through the center of the first reflecting surface 81, it can be ensured that all light rays of the group of parallel light can be reflected by the first reflecting surface 81. The light output by the SOA chip 61 is converted from vertical light into horizontal light by the first reflecting surface 81, and then enters the second reflecting surface 82 to be converted from horizontal light into vertical light, so that 180-degree turning of the light output by the SOA chip 61 is realized.

The ferrule adapter 100 is provided with two ferrule fixing holes 101 for fixing the input assembly 110 and the output assembly 120.

The input assembly 110 is used for converging the input light into parallel light and entering the converging lens 50, and the central axis of the input assembly 110 is aligned with the central axis of the converging lens 50. In some embodiments, the input assembly 110 may employ a first collimator with a pigtail, the first collimator includes a first sleeve 111, and a first fiber ferrule 112 and a second collimating lens 113 that are assembled in the first sleeve 111, the first sleeve 111 is embedded in the ferrule fixing hole 101, the first fiber ferrule 112 is connected with the pigtail, and the second collimating lens 113 is disposed near one side of the sleeve 90 and is used to collimate the input light of the first fiber ferrule 112 into parallel light to enter the converging lens 50, and the first collimator can better guarantee the coaxiality of the optical paths. In other embodiments, the first collimator may further include a first pigtail, the first pigtail is connected to the first fiber stub 112 through a fiber, the first pigtail may be an SC-APC (single carrier cable-optical protection cable) pigtail, and the first pigtail is connected to the external fiber interface in use.

The output assembly 120 is used for converging the output light which is bent by 180 degrees through the prism assembly 80 into an external output optical fiber, and the central axis of the output assembly 120 and the center of the second reflecting surface 82 are positioned on the same straight line. In some embodiments, the output assembly 120 may employ a second collimator with a pigtail, the second collimator includes a second sleeve 121, and a second fiber ferrule 122 and a third collimating lens 123 that are assembled in the second sleeve 121, the second sleeve 121 is embedded in the ferrule fixing hole 101, the second fiber ferrule 122 is connected with the pigtail, and the third collimating lens 123 is disposed near one side of the sleeve 90 and is used for converging the output light that is turned by 180 degrees through the prism assembly 80 to the second fiber ferrule 122 for output, and the second collimator can better guarantee the coaxiality of the optical paths. In other embodiments, the second collimator may further include a second pigtail, the second pigtail is connected to the second fiber stub 112 through a fiber, the second pigtail may be an SC-APC splice, and the second pigtail is connected to the external fiber interface in use.

The working principle of the semiconductor optical amplifier is as follows: the input light of the input component 110 penetrates through the TO pipe cap 20, is converged TO the light input port of the SOA chip 61 through the converging lens 50, is output after being subjected TO light amplification through the SOA chip 61, is collimated into parallel light through the first collimating lens 70, and is reflected out of the TO pipe cap 20 after being bent by 180 degrees through the prism and reaches the output component 120.

According TO the semiconductor optical amplifier provided by the embodiment of the invention, the prism assembly 80 is used for folding the light output by the SOA chip 61 by 180 degrees, so that the input assembly 110 and the output assembly 120 can be positioned at the same end of the TO base 10, and the ferrule adapter 100 can be correspondingly provided with the two ferrule fixing holes 101, so that compared with a scheme that two ferrule adapter 100 are needed for arranging the input assembly 110 and the output assembly 120 at two opposite ends in a butterfly package, one ferrule adapter 100 is reduced, the space occupied for fixing the input assembly 110 and the output assembly 120 is reduced, the structure is more compact, the size of a device can be reduced TO a greater extent, and the requirement for miniaturization of an optical module is met.

In some embodiments, in order to separate the input light and the output light of the SOA chip 61 as far as possible and avoid crosstalk caused by mutual influence, the angle between the reflected light of the first reflecting surface 81 and the plane where the SOA chip substrate 60 is placed on the first stage is an acute angle, so that the manufacturing is facilitated. Specifically, as shown in fig. 2, an included angle between planes of the first workbench for reflecting light of the first reflecting surface 81 and the SOA chip substrate is 45 degrees, that is, after parallel light emitted from the first collimating lens 70 enters the first reflecting surface 81 along a vertical direction, the reflected light is horizontally emitted from a direction away from the SOA chip 61 with an included angle of 45 degrees with the planes of the first workbench and the SOA chip substrate 60, so that a distance between input light and output light is increased, and crosstalk caused by mutual influence is avoided; in addition, the output light is far away from the SOA chip substrate 60, so that the output light can be prevented from being shielded by other components to cause optical power loss.

In some embodiments, in order TO meet the requirement of optical path matching, the central axes of the convergent lens 50 and the first collimating lens 70 are respectively aligned with the central axis of the input component 110 and the optical output port of the SOA chip 61, as shown in fig. 2, the first worktable 41 is provided with a corresponding convergent lens heightening pad 412 and a corresponding first collimating lens heightening pad 411, which can save the cost of each gasket and the positioning and mounting process, simplify the production process and improve the efficiency, and in addition, the space required for mounting the gasket does not need TO be reserved, the structure of the TO pipe cap 20 can be more compact and smaller, thereby reducing the overall size of the semiconductor optical amplifier.

In some embodiments, the semiconductor optical amplifier further includes a soft tape, and the TO base 10 is provided with a pin, and the soft tape is used for connecting the pin and an external circuit (such as a stray light monitoring circuit, a control circuit, a power supply circuit, and the like). Soft area and TO base 10 on the pin connect, use soft area after, pin length on the TO base 10 can shorten, just enough with soft area connect can, soft area is connected more in a flexible way, does not need too big connection headspace TO also can reduce the volume of device, be favorable TO satisfying the miniaturized demand of device.

In some embodiments, as shown in fig. 2, a photoelectric chip 130 is disposed on the second working platform 42, pins are disposed on the TO base, the photoelectric chip 130 is connected TO the pins, the pins are connected TO an external stray light monitoring circuit, and the photoelectric chip 130 is used for monitoring stray light during production TO assist optical path coupling. The photo chip 130 receives the light and generates a photo current, which varies with the received light. In the present embodiment, stray light refers to invalid light that cannot be used in a coupling manner, such as light generated by reflection from the surface of an optical element or light that deviates from a predetermined optical path due to positional misalignment. For example, if the optical element is misaligned, light may deviate from a designated light path, and is not reflected by the first reflection surface 81 and is received by the photoelectric chip 130, the photoelectric chip 130 converts the received light into a corresponding electrical signal and sends the electrical signal to the external stray light monitoring circuit through a pin, the external stray light monitoring circuit preliminarily determines how much stray light is according to the current value or the voltage value of the electrical signal, and if more stray light is detected, it indicates that the coupling position needs to be adjusted. The external stray light monitoring circuit may adopt a specific structure in the prior art, and is not described herein again.

Example two

The present embodiment provides another semiconductor optical amplifier, as shown in fig. 1 and fig. 4, including a TO base 10, a refrigerator 30 disposed on the TO base 10, a heat sink 40 disposed on a cold surface of the refrigerator 30, a TO cap 20 externally covering the TO base 10, a sleeve 90 externally covering the TO cap 20, a ferrule adapter 100 connected TO the sleeve 90, an input module 110 and an output module 120 disposed at the same end of the TO base 10, wherein:

the heat sink 40 comprises a first workbench 41 and a second workbench 42 which are perpendicular to each other, a converging lens 50, an SOA chip substrate 60 and a first collimating lens 70 are sequentially attached to the first workbench 41 according to an optical path, the SOA chip substrate 60 at least comprises an SOA chip 61, the optical axis of the converging lens 50 is coaxial with the optical input port of the SOA chip 61, and the optical axis of the first collimating lens 70 is coaxial with the optical output port of the SOA chip 61; the second stage 42 is provided with a prism assembly 80. After the mounting is completed, the TO cap 20 covers the converging lens 50, the SOA chip substrate 60 and the first collimating lens 70 therein, and is packaged together with the TO base 10. The heat sink 40 may be L-shaped as shown in fig. 4, but of course, other shapes are possible if a horizontal plane and a vertical plane are satisfied.

The prism assembly 80 is used TO fold the SOA chip 61 output light 180 degrees so that the SOA chip 61 output light collimated by the first collimating lens 70 is perpendicular TO the TO base 10 and is directed back towards the TO cap 20. As shown in fig. 4 and 5, the prism assembly 80 is an isosceles trapezoid prism, the surface corresponding to the short bottom edge of the isosceles trapezoid prism is attached to the second worktable 42, the two 45-degree reflection surfaces of the isosceles trapezoid prism are respectively a first reflection surface 81 and a second reflection surface 82, and the optical axis of the first collimating lens 70 passes through the center of the first reflection surface 81. Because the output light of the SOA chip 61 is collimated by the first collimating lens 70 to form a group of parallel light, and the optical axis of the first collimating lens 70 passes through the center of the first reflecting surface 81, it can be ensured that all light rays of the group of parallel light can be reflected by the first reflecting surface 81. The light output by the SOA chip 61 is converted from vertical light into horizontal light by the first reflecting surface 81, and then enters the second reflecting surface 82 to be converted from horizontal light into vertical light, so that 180-degree turning of the light output by the SOA chip 61 is realized.

The working principle of the semiconductor optical amplifier is as follows: the input light of the input component 110 penetrates through the TO pipe cap 20, is converged TO the light input port of the SOA chip 61 through the converging lens, is output after being subjected TO light amplification through the SOA chip 61, is collimated into parallel light through the first collimating lens 70, and is reflected out of the TO pipe cap 20 after being bent by 180 degrees through the prism and reaches the output component 120.

According TO the semiconductor optical amplifier provided by the embodiment of the invention, the prism assembly 80 is used for folding the light output by the SOA chip 61 by 180 degrees, so that the input assembly 110 and the output assembly 120 are positioned at the same end of the TO base 10, and the ferrule adapter base 100 is provided with the two ferrule fixing holes 101, so that compared with a scheme that two ferrule adapter bases 100 are required for arranging the input assembly 110 and the output assembly 120 at two opposite ends in butterfly-shaped packaging, one ferrule adapter base 100 is reduced, the space required for fixing the input assembly 110 and the output assembly 120 is reduced, the structure is more compact, the size of a device can be reduced TO a greater extent, and the requirement for miniaturization of an optical module is met.

In some embodiments, in order to separate the input light and the output light of the SOA chip 61 as far as possible and avoid crosstalk caused by mutual influence, the angle between the reflected light of the first reflecting surface 81 and the plane where the SOA chip substrate 60 is placed on the first stage is an acute angle, so that the manufacturing is facilitated. Specifically, as shown in fig. 4, an included angle between planes of the first workbench for reflecting light of the first reflecting surface 81 and the SOA chip substrate is 45 degrees, that is, after parallel light emitted from the first collimating lens 70 enters the first reflecting surface 81 along a vertical direction, the reflected light is horizontally emitted from a direction away from the SOA chip 61 with an included angle of 45 degrees with the planes of the first workbench and the SOA chip substrate 60, so that a distance between input light and output light is increased, and crosstalk caused by mutual influence is avoided; in addition, the output light is far away from the SOA chip substrate 60, so that the output light can be prevented from being shielded by other components to cause optical power loss.

In some embodiments, in order TO meet the requirement of optical path matching, the central axes of the convergent lens 50 and the first collimating lens 70 are respectively aligned with the central axis of the input component 110 and the optical output port of the SOA chip 61, as shown in fig. 4, the first worktable 41 is provided with a corresponding convergent lens heightening pad 412 and a corresponding first collimating lens heightening pad 411, which can save the cost of each gasket and the positioning and mounting process, simplify the production process and improve the efficiency, and in addition, the space required for mounting the gasket does not need TO be reserved, the structure of the TO pipe cap 20 can be more compact and smaller, thereby reducing the overall size of the semiconductor optical amplifier.

In some embodiments, as shown in fig. 4, a photoelectric chip 130 is disposed on the second working platform 42, pins are disposed on the TO base, the photoelectric chip 130 is connected TO the pins, the pins are connected TO an external stray light monitoring circuit, and the photoelectric chip 130 is used for monitoring stray light during production TO assist optical path coupling. The photo chip 130 receives the light and generates a photo current, which varies with the received light. In the present embodiment, stray light refers to invalid light that cannot be used in a coupling manner, such as light generated by reflection from the surface of an optical element or light that deviates from a predetermined optical path due to positional misalignment. For example, if the optical element is misaligned, light may deviate from a designated light path, and is not reflected by the first reflection surface 81 and is received by the photoelectric chip 130, the photoelectric chip 130 converts the received light into a corresponding electrical signal and sends the electrical signal to the external stray light monitoring circuit through a pin, the external stray light monitoring circuit preliminarily determines how much stray light is according to the current value or the voltage value of the electrical signal, and if more stray light is detected, it indicates that the coupling position needs to be adjusted. The external stray light monitoring circuit may adopt a specific structure in the prior art, and is not described herein again.

EXAMPLE III

The present embodiment discloses an optical module, which can use the semiconductor optical amplifier described in the first embodiment or the second embodiment.

In the optical module disclosed in this embodiment, the semiconductor optical amplifier of the optical module folds the output light of the SOA chip 61 by 180 degrees through the prism assembly 80, so that the input assembly 110 and the output assembly 120 are located at the same end of the TO base 10, and the ferrule adapter 100 can be correspondingly provided with two ferrule fixing holes 101, compared with a scheme in which the input assembly 110 and the output assembly 120 are arranged at two opposite ends in a butterfly package, the ferrule fixing holes 101 for fixing the input assembly 110 and the output assembly 120 are located on the ferrule adapter 100 at the same end of the TO base 10, so that the space occupied by fixing the input assembly 110 and the output assembly 120 is reduced, the structure is more compact, the size of a device can be reduced TO a greater extent, and the miniaturization requirement of the optical module is met.

In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the invention.

What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or".

Claims

1. The utility model provides a semiconductor optical amplifier, its characterized in that, includes the TO base, sets up the refrigerator on the TO base, sets up the heat sink on the refrigerator cold side, overlaps in the TO pipe cap of TO base, overlaps in the sleeve pipe of TO pipe cap, with bushing's lock pin adaptation seat, sets up input module, the output module of TO base with one end, wherein:

2. A semiconductor optical amplifier according to claim 1 wherein the prism assembly comprises: two 45 degree prisms, 45 degree prism level are placed on the second workstation, make the plane of reflection towards first collimating lens and be 45 degrees with the contained angle of second workstation place face, and the plane of reflection of two 45 degree prisms is first plane of reflection and second plane of reflection respectively, first plane of reflection and second plane of reflection set up and mirror image each other relatively.

3. The semiconductor optical amplifier according to claim 1, wherein the prism assembly is an isosceles trapezoid prism, a surface corresponding to a short base of the isosceles trapezoid prism is attached to the second stage, and two 45-degree reflecting surfaces of the isosceles trapezoid prism are a first reflecting surface and a second reflecting surface, respectively.

4. A semiconductor optical amplifier according to claim 2 or 3 wherein the prism assembly is positioned such that the optical axis of the first collimating lens passes through the centre of the first reflective surface.

5. A semiconductor optical amplifier according to claim 2 or 3 wherein the angle between the light reflected from the first reflecting surface and the plane of the first platform on which the SOA chip substrate is placed is acute.

6. A semiconductor optical amplifier according to claim 1, wherein the first stage is provided with a convergent lens elevation pad and a first collimating lens elevation pad.

7. A semiconductor optical amplifier according TO claim 1, further comprising a flexible tape, wherein said TO base has a pin thereon, said flexible tape being adapted TO connect said pin TO an external circuit.

8. A semiconductor optical amplifier according to claim 1, wherein the input module employs a first collimator with a pigtail, the first collimator includes a first sleeve, and a first optical fiber ferrule and a second collimating lens assembled in the first sleeve, the first sleeve is embedded in the ferrule fixing hole, the first optical fiber ferrule is connected to the pigtail, and the second collimating lens is disposed near one side of the sleeve.

9. A semiconductor optical amplifier according to claim 1, wherein the output module employs a second collimator with a pigtail, the second collimator includes a second sleeve, and a second optical fiber ferrule and a third collimating lens assembled in the second sleeve, the second sleeve is embedded in the ferrule fixing hole, the second optical fiber ferrule is connected to the pigtail, and the third collimating lens is disposed near one side of the sleeve.

10. An optical module comprising a semiconductor optical amplifier according to any one of claims 1 to 9.