CN113498258A - Protection circuit board and electronic device - Google Patents

Protection circuit board and electronic device Download PDF

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Publication number
CN113498258A
CN113498258A CN202010260819.7A CN202010260819A CN113498258A CN 113498258 A CN113498258 A CN 113498258A CN 202010260819 A CN202010260819 A CN 202010260819A CN 113498258 A CN113498258 A CN 113498258A
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CN
China
Prior art keywords
protection circuit
circuit board
temperature sensing
battery
sensing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010260819.7A
Other languages
Chinese (zh)
Other versions
CN113498258B (en
Inventor
李建莲
卓加杰
宁顺刚
陈光辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Nvt Technology Co Ltd
Original Assignee
Dongguan Nvt Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Nvt Technology Co Ltd filed Critical Dongguan Nvt Technology Co Ltd
Priority to CN202010260819.7A priority Critical patent/CN113498258B/en
Publication of CN113498258A publication Critical patent/CN113498258A/en
Application granted granted Critical
Publication of CN113498258B publication Critical patent/CN113498258B/en
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Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H02H5/041—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature additionally responsive to excess current
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
    • H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
    • H02H5/047—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature using a temperature responsive switch
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Abstract

A protection circuit board and an electronic device are provided, wherein the protection circuit board comprises at least one circuit layer, at least one substrate layer and a temperature sensing element. The substrate layer is used for bearing the circuit layer. The temperature sensing element is embedded in the substrate layer. Wherein, the protection circuit board is provided with at least one first via hole. The first via hole penetrates through the circuit layer and is electrically connected to the circuit layer and the temperature sensing element, so that the occupation of the temperature sensing element on the surface space of the protection circuit board is reduced, and the design of the space of the circuit layer is optimized.

Description

Protection circuit board and electronic device
Technical Field
The invention relates to a protective circuit board and an electronic device.
Background
In the prior art, a mobile phone protection circuit board at least has two primary switching elements and two control chips. Along with the change of the demands of users, electronic elements on the mobile phone protection circuit board are gradually increased, and the size of the mobile phone protection circuit board is narrowed, so that the current on the mobile phone protection circuit board is increased and the temperature rise is faster, and how to solve the problems of space utilization and temperature rise protection of the mobile phone circuit board becomes urgent to be solved.
Disclosure of Invention
In view of the above, a protection circuit board and an electronic device are needed to solve the problems of space utilization and temperature rise protection of the protection circuit board in the prior art.
A protective circuit board, comprising:
at least one substrate layer;
at least one circuit layer carried on the substrate layer;
the temperature sensing element is embedded in the substrate layer;
the protection circuit board is provided with at least one first through hole; the first via hole penetrates through the circuit layer and is electrically connected to the circuit layer and the temperature sensing element.
In some embodiments of the present application, the protection circuit board is electrically connected to a battery and a load; the protection circuit board is provided with a first battery connecting terminal and a first load connecting terminal; the first battery connecting terminal is used for being electrically connected with the battery and the temperature sensing element; the first load connection terminal is electrically connected to the load and the temperature sensing element.
In some embodiments of the present application, the protection circuit board defines at least one second via; the second via hole penetrates through the circuit layer and is electrically connected to the first load connection terminal and the temperature sensing element.
In some embodiments of the present application, the substrate layer having the temperature sensing element embedded therein has a first surface and a second surface disposed opposite the first surface; a first bonding pad is arranged on the first surface; a second bonding pad is arranged on the second surface; the first pad is electrically connected to the temperature sensing element and the first via; the second pad is electrically connected to the temperature sensing element and the second via.
In some embodiments of the present application, the protection circuit board includes a plurality of the wiring layers; the substrate layer is arranged among the plurality of circuit layers; a plurality of the circuit layers are electrically connected; the first via hole penetrates through the substrate layers and the circuit layers and is electrically connected to the temperature sensing element; the substrate layer and the circuit layer which are penetrated by the first via holes are positioned above the substrate layer embedded with the temperature sensing element; the second via hole penetrates through the substrate layers and the circuit layers and is electrically connected to the temperature sensing element; the substrate layer penetrated by the second via hole and the line layer are positioned below the substrate layer embedded with the temperature sensing element.
In some embodiments of the present application, the protection circuit board is electrically connected to a battery and a load; the protection circuit board further comprises a first-stage protection circuit and a second-stage protection circuit; the first-stage protection circuit is used for cutting off the electric connection between the battery and the load when the charging of the battery is over current or the discharging of the battery is over voltage; the second-stage protection circuit is used for protecting the battery when the first-stage protection circuit is abnormal; the second-stage protection circuit comprises a second-stage control chip, a second-stage switching element and the temperature sensing element; the secondary control chip is used for sampling parameters of the battery to obtain sampling current when the primary protection circuit is abnormal; when the sampling current is larger than a preset value, the secondary control chip controls the secondary switching element to establish a first line and outputs sensing current through the first line; the temperature sensing element is used for sensing the temperature change caused by the sensing current and disconnecting the electric connection between the battery and the load when the temperature exceeds a preset temperature.
In some embodiments of the present application, the first circuit is disposed on the circuit layer and overlaps the temperature sensing element.
In some embodiments of the present application, the protection circuit board includes a plurality of the wiring layers; the first circuit is arranged on the circuit layer close to the substrate layer.
In some embodiments of the present application, the first stage protection circuit further includes a first stage control chip and a first stage switching element; the primary control chip is used for outputting a control signal to the primary switching element when the battery has charging overcurrent or discharging overvoltage; the primary switching element is used for cutting off the electric connection between the battery and the load according to the control signal.
An electronic device includes a battery, a load, and a protection circuit board; the protection circuit board includes:
at least one substrate layer;
at least one circuit layer carried on the substrate layer;
the temperature sensing element is embedded in the substrate layer;
the protection circuit board is provided with at least one first through hole; the first via hole penetrates through the circuit layer and is electrically connected to the circuit layer and the temperature sensing element.
The protection circuit board and the electronic device provided by the embodiment of the application have the advantages that the temperature sensing element is embedded in the substrate and is electrically connected to at least one circuit layer through the via hole, the occupation of the temperature sensing element on the space of the circuit layer is reduced, the space design of the circuit layer is optimized, meanwhile, the embedded mode is adopted, the manufacturing cost of the protection circuit board can be reduced, and the manufacturing process of the protection circuit board is simplified.
Drawings
Fig. 1 is a schematic block diagram of a protection circuit board according to a preferred embodiment of the invention.
Fig. 2 is a schematic block diagram of the protection circuit board shown in fig. 1.
Fig. 3 is a schematic circuit diagram of the protection circuit board in fig. 1.
Fig. 4 is a schematic cross-sectional view of the protection circuit board of fig. 1.
Fig. 5 is a schematic plan view of the wiring layer at the top layer in fig. 4.
Fig. 6 is a schematic plan view of the circuit layer disposed adjacent to the substrate layer in fig. 4.
Fig. 7 is a schematic plan view of the first surface of the substrate layer with embedded temperature sensing elements in fig. 4.
Fig. 8 is a schematic plan view of the second surface of the substrate layer with embedded temperature sensing elements in fig. 4.
Description of the main elements
Electronic device 100
Battery 10
Protection circuit board 20
Load 200
First stage protection circuit 21
Second stage protection circuit 23
Second level control chip 232
Two-stage switching element 233
Temperature sensing element 234
First wiring 236
Primary control chip 214
Primary switching element 216
First battery connecting terminal B +
Second battery connection terminal B-
First load connection terminal P +
Second load connection terminal P-
Voltage terminal BS
Resistors R1-R5, RS1
Capacitor C1-C2
Line layer 201
Insulating layer 202
Substrate layer 203
First surface 203a
Second surface 203b
First via 204
Second via 205
Third via 206
First bonding pad 207
Second bonding pad 208
Connecting element 209
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the term "connected" is to be interpreted broadly, e.g. as a fixed connection, a detachable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be connected directly or indirectly through intervening elements, or may be connected through inter-element communication or may be in the interaction of two elements. To those of ordinary skill in the art, the above terms may be immediately defined in the present invention according to their specific meanings.
The terms "first", "second", and "third", etc. in the description of the present invention and the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprises" and any variations thereof, are intended to cover non-exclusive inclusions.
The following describes an embodiment of the electronic device 100 according to the present invention with reference to the drawings.
Please refer to fig. 1, which is a block diagram of an electronic device 100 according to a preferred embodiment of the invention. The electronic device 100 may be electrically connected to a load 200. The electronic device 100 may provide a voltage to the load 200, or may receive the voltage output by the load 200 for charging. In at least one embodiment of the present invention, the load 200 may be a mobile device such as a smart phone, a Personal Digital Assistant (PDA), a game machine, an intelligent wearable device, a navigation device, a POS machine, a handheld code scanning gun, a handheld printer, an electronic smoking set, a remote controller, or a bluetooth headset, and the like, but is not limited thereto. In other embodiments, the load 200 may also be a charging device.
The electronic device 100 includes a battery 10 and a protection circuit board 20.
The battery 10 is electrically connectable to the protection circuit board 20 and the load 200. The battery 10 may supply power to the load 200, and may also receive the voltage provided by the load 200 for charging. The protection circuit board 20 is electrically connectable to the battery 10 and the load 200. The protection circuit board 20 is used to monitor the charging and discharging of the battery 10 and the temperature in real time. The protection circuit board 20 breaks the electrical connection between the battery 10 and the load 200 when the battery 10 is subjected to charging overcurrent, discharging overvoltage, and excessive temperature.
Referring to fig. 2, fig. 2 is a schematic block diagram of the protection circuit board 20 according to the preferred embodiment of the present application.
The protection circuit board 20 includes a first-stage protection circuit 21 and a second-stage protection circuit 23.
The first-stage protection circuit 21 is electrically connected to the battery 10 and the load 200. The first stage protection circuit 21 is used to break the electrical connection between the battery 10 and the load 200 when the battery 10 generates charging overcurrent or discharging overvoltage.
The first stage protection circuit 21 includes a first stage control chip 214 and a first stage switching element 216.
The primary control chip 214 is electrically connected to the battery 10. The primary control chip 214 is configured to output a control signal to the primary switching element 216 when the charging overvoltage or the discharging overvoltage of the battery 10 is sensed.
The primary switching element 216 is electrically connected to the battery 10 and the load 200. The primary switching element 216 is configured to disconnect the electrical connection between the battery 10 and the load 200 according to the control signal output by the primary control chip 214.
The second-stage protection circuit 23 is configured to protect the battery 10 when the first-stage protection circuit 21 is abnormal.
The second-stage protection circuit 23 includes a second-stage control chip 232, a second-stage switching element 233, and a temperature sensing element 234.
The secondary control chip 232 is configured to sample parameters of the battery 10 to obtain a sampling current when the primary protection circuit 21 is abnormal. When the sampling current is greater than a predetermined value, the secondary control chip 232 outputs a control signal to the secondary switching element 233. In at least one embodiment of the invention, the parameter may be a voltage or a current.
The secondary switching element 233 is used to establish a first line 236 according to the control signal and generate a sensing current flowing through the first line 236. In at least one embodiment of the present invention, the secondary switching element 233 is a MOS transistor.
The temperature sensing element 234 is used to sense a temperature change caused by the sensing current and to break the electrical connection between the battery 10 and the load 200 when the temperature is greater than a predetermined temperature. In at least one embodiment of the present invention, the temperature sensing element 234 may be a positive temperature coefficient sensor.
Referring to fig. 3, fig. 3 is a circuit schematic diagram of the protection circuit board 20. A first pin of the primary control chip 214 is electrically connected to a voltage terminal BS through a resistor R5, a second pin of the primary control chip 214 is electrically connected to a second load connection terminal P "of the load 200 through a resistor R2, a third pin of the primary control chip 214 is electrically connected to the primary switching element 216, a fourth pin of the primary control chip 214 is electrically connected to the primary switching element 216, a fifth pin of the primary control chip 214 is electrically connected to the negative electrode of the battery 10, a sixth pin of the primary control chip 214 is electrically connected to the positive electrode of the battery 10 through a resistor R1, and a seventh pin of the primary control chip 214 is electrically connected to the negative electrode of the battery 10 through a resistor RS 1. The capacitor C1 is electrically connected to the fifth and sixth pins of the primary controller chip 214, and the capacitor C9 is electrically connected to the fifth and seventh pins of the primary controller chip 214.
A first pin of the secondary control chip 232 is electrically connected to the second load connection terminal P "of the load 200 through a resistor R9, a fifth pin of the secondary control chip 232 is electrically connected to the temperature sensing element 234 through a resistor R3, a third pin of the secondary control chip 232 is electrically connected to the control terminal of the secondary switching element 233 through a resistor R8, and a fourth pin of the secondary control chip 232 is grounded. The capacitor C2 is electrically connected to the fourth pin and the fifth pin of the secondary control chip 232. The resistor R4 is electrically connected to the control terminal and the first connection terminal of the secondary switching element 233. The first connection terminal of the secondary switching element 233 is electrically connected to the second load connection terminal P-of the load 200. A second connection terminal of the secondary switching element 233 is electrically connected to the first line 236. A first end of the temperature sensing element 234 is electrically connected to the positive electrode of the battery 10, and a second end of the temperature sensing element 234 is electrically connected to the first load connection terminal P +.
Referring to fig. 4, fig. 4 is a schematic cross-sectional view of the protection circuit board 20. The protection circuit board 20 further includes at least one wiring layer 201, two insulating layers 202, and at least one base material layer 203. The plurality of circuit layers 201 are insulated from each other by the base material layer 203. One of the insulating layers 202 is disposed on the top circuit layer 201 in a covering manner, and the other insulating layer 202 is disposed on the bottom circuit layer 201 in a covering manner. In at least one embodiment of the present invention, the insulating layer 202 is made of ink.
The circuit layer 201 is made of a conductive material. In at least one embodiment of the present invention, the protection circuit board 20 includes six wiring layers 201. The three layers of the circuit layer 201 are arranged above the substrate layer 203 embedded with the temperature sensing element 234, and the other three layers of the circuit layer 201 are arranged below the substrate layer 203 embedded with the temperature sensing element 234. The substrate layer 203 is arranged between two adjacent circuit layers 201.
The first battery connection terminal B + and the first load connection terminal P + are exposed with respect to the insulating layer 202. That is, the first battery connection terminal B + and the first load connection terminal P + are not covered by the insulating layer 202. In at least one embodiment of the present invention, the first battery connection terminal B + is electrically connected to the positive electrode of the battery 10, and the first load connection terminal P + is electrically connected to the positive electrode of the load 200 and the temperature sensing element 234.
The protection circuit board 20 further includes a connection member 209. The connection element 209 is electrically connected to the temperature sensing element 234 and the first load connection terminal P +. In at least one embodiment of the present invention, the connecting element 209 is exposed with respect to the insulating layer 202 located at the lowermost portion. That is, the connection element 209 is not covered by the insulating layer 202.
The protection circuit board 20 further defines at least one first via 204, at least one second via 205, and at least one third via 206. The first via 204 penetrates through the substrate layers 203, the line layers 201, and the insulating layer 202. The substrate layer 203, the line layer 201 and the insulating layer 202 penetrated by the first via hole 204 are located above the substrate layer 203 embedded with the temperature sensing element 234. The first via 204 is electrically connected to the first battery connection terminal B + and the first end of the temperature sensing element 234. The second via 205 penetrates through the substrate layers 203, the line layers 201, and the insulating layer 202. The substrate layer 203, the line layer 201, and the insulating layer 202 penetrated by the second via 205 are located below the substrate layer 203 in which the temperature sensing element 234 is embedded. The second via 205 is electrically connected to the circuit layer 201 under the substrate layer 203. The third via 206 penetrates all of the line layer 201, all of the insulating layer 202, and all of the substrate layer 203, and electrically connects the second via 205 and the first load connection terminal P +, thereby electrically connecting the second end of the temperature sensing element 234 to the first load connection terminal P + located above the substrate layer 203 through the line layer 201 located below the substrate layer 203. In at least one embodiment of the present invention, a plurality of the circuit layers 201 are electrically connected to each other through vias (not shown).
Referring to fig. 5, fig. 5 is a schematic plan view of the circuit layer 201 on the top layer. The wiring layer 201 on the top layer is further provided with other electronic components such as a second battery connection terminal B-and a second load connection terminal P-, but not limited thereto.
Referring to fig. 6, fig. 6 is a schematic plan view of the circuit layer 201 close to the substrate layer 203. A first circuit 236 is disposed on the circuit layer 201 adjacent to the substrate layer 203. The first line 236 is arranged in a serpentine shape. In at least one embodiment of the present invention, a portion of the first line 236 may be arranged in a serpentine shape along a first direction X, and another portion of the first line 236 may be arranged in a serpentine shape along a second direction Y perpendicular to the first direction X.
The substrate layer 203 is made of an insulating material. The substrate layer 203 is used for supporting the circuit layer 201. In at least one embodiment of the present invention, the substrate layer 203 having the temperature sensing element 234 embedded therein includes a first surface 203a and a second surface 203b disposed opposite the first surface 203 a.
Referring to fig. 7, fig. 7 is a schematic plan view of the first surface 203 a. A first pad 207 is disposed on an upper surface of the first surface 203 a. The first pad 207 is electrically connected to the first via 204 and a first end of the temperature sensing element 234.
Referring to fig. 8, fig. 8 is a schematic plan view of the first surface 203 a. A second pad 208 is provided on the lower surface of the second surface 203 b. The second pad 208 is electrically connected to the second via 205 and the second end of the temperature sensing element 234. The first pad 207 and the second pad 208 are disposed to overlap each other, and are disposed to overlap the first line 236.
In other embodiments, when the protection circuit board 20 has one substrate layer 203, the first pad 207 and the second pad 208 are respectively disposed on two opposite surfaces of the substrate layer 203.
The temperature sensing element 234 is embedded in the substrate layer 203. In at least one embodiment of the present invention, the temperature sensing element 234 is embedded in the substrate layer 203.
In the protection circuit board 20 and the electronic device 100, the temperature sensing element 234 is embedded in the substrate layer 203, and the temperature sensing element 234 is electrically connected to the circuit layer 201 through the via hole, so that the occupation of the temperature sensing element 234 on the surface layer space of the protection circuit board is reduced. Meanwhile, the embedded mode can reduce the manufacturing cost of the protection circuit board 20 and simplify the manufacturing process of the protection circuit board 20. In addition, by providing the first wiring 236 on the wiring layer 201, the temperature sensing element 234 can break the electrical connection between the battery 10 and the load 200 when the temperature is too high, thereby implementing the temperature protection function.
It will be appreciated by those skilled in the art that the above embodiments are illustrative only and not intended to be limiting, and that suitable modifications and variations may be made to the above embodiments without departing from the true spirit and scope of the invention.

Claims (10)

1. A protective circuit board, comprising:
at least one substrate layer;
at least one circuit layer carried on the substrate layer;
the temperature sensing element is embedded in the substrate layer;
the protection circuit board is provided with at least one first through hole; the first via hole penetrates through the circuit layer and is electrically connected to the circuit layer and the temperature sensing element.
2. The protection circuit board of claim 1, wherein the protection circuit board is electrically connected to a battery and a load; the protection circuit board is provided with a first battery connecting terminal and a first load connecting terminal; the first battery connecting terminal is used for being electrically connected with the battery and the temperature sensing element; the first load connection terminal is electrically connected to the load and the temperature sensing element.
3. The protection circuit board of claim 2, wherein the protection circuit board defines at least one second via; the second via hole penetrates through the circuit layer and is electrically connected to the first load connection terminal and the temperature sensing element.
4. The protection circuit board of claim 3, wherein the substrate layer in which the temperature sensing element is embedded includes a first surface and a second surface disposed opposite the first surface; a first bonding pad is arranged on the first surface; a second bonding pad is arranged on the second surface; the first pad is electrically connected to the temperature sensing element and the first via; the second pad is electrically connected to the temperature sensing element and the second via.
5. The protection circuit board of claim 3, wherein the protection circuit board comprises a plurality of the wiring layers; the substrate layer is arranged among the plurality of circuit layers; a plurality of the circuit layers are electrically connected; the first via hole penetrates through the substrate layers and the circuit layers and is electrically connected to the temperature sensing element; the substrate layer and the circuit layer which are penetrated by the first via holes are positioned above the substrate layer embedded with the temperature sensing element; the second via hole penetrates through the substrate layers and the circuit layers and is electrically connected to the temperature sensing element; the substrate layer penetrated by the second via hole and the line layer are positioned below the substrate layer embedded with the temperature sensing element.
6. The protection circuit board of claim 1, wherein the protection circuit board is electrically connected to a battery and a load; the protection circuit board further comprises a first-stage protection circuit and a second-stage protection circuit; the first-stage protection circuit is used for cutting off the electric connection between the battery and the load when the charging of the battery is over current or the discharging of the battery is over voltage; the second-stage protection circuit is used for protecting the battery when the first-stage protection circuit is abnormal; the second-stage protection circuit comprises a second-stage control chip, a second-stage switching element and the temperature sensing element; the secondary control chip is used for sampling parameters of the battery to obtain sampling current when the primary protection circuit is abnormal; when the sampling current is larger than a preset value, the secondary control chip controls the secondary switching element to establish a first line and outputs sensing current through the first line; the temperature sensing element is used for sensing the temperature change caused by the sensing current and disconnecting the electric connection between the battery and the load when the temperature is higher than the preset temperature.
7. The protection circuit board of claim 6, wherein the first circuit is disposed on the circuit layer and overlaps the temperature sensing element.
8. The protection circuit board of claim 7, wherein the protection circuit board comprises a plurality of the wiring layers; the first circuit is arranged on the circuit layer close to the substrate layer.
9. The protection circuit board of claim 6, wherein the first stage protection circuit further comprises a first stage control chip and a first stage switching element; the primary control chip is used for outputting a control signal to the primary switching element when the battery has charging overcurrent or discharging overvoltage; the primary switching element is used for cutting off the electric connection between the battery and the load according to the control signal.
10. An electronic device, characterized in that the electronic device comprises a battery, a load and a protection circuit board according to any one of claims 1-9.
CN202010260819.7A 2020-04-03 2020-04-03 Protection circuit board and electronic device Active CN113498258B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010260819.7A CN113498258B (en) 2020-04-03 2020-04-03 Protection circuit board and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010260819.7A CN113498258B (en) 2020-04-03 2020-04-03 Protection circuit board and electronic device

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Publication Number Publication Date
CN113498258A true CN113498258A (en) 2021-10-12
CN113498258B CN113498258B (en) 2022-07-22

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101091297A (en) * 2005-05-10 2007-12-19 松下电器产业株式会社 Protection circuit and battery pack
CN106063387A (en) * 2013-12-12 2016-10-26 At&S奥地利科技与系统技术股份公司 Method for embedding a component in a printed circuit board
JP2017506056A (en) * 2014-01-28 2017-02-23 グァンドン オッポ モバイル テレコミュニケーションズ コーポレーション リミテッド Overvoltage / overcurrent protection circuit and mobile terminal
CN108934122A (en) * 2017-05-24 2018-12-04 三星电机株式会社 The printed circuit board of built-in electronic component

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101091297A (en) * 2005-05-10 2007-12-19 松下电器产业株式会社 Protection circuit and battery pack
CN106063387A (en) * 2013-12-12 2016-10-26 At&S奥地利科技与系统技术股份公司 Method for embedding a component in a printed circuit board
JP2017506056A (en) * 2014-01-28 2017-02-23 グァンドン オッポ モバイル テレコミュニケーションズ コーポレーション リミテッド Overvoltage / overcurrent protection circuit and mobile terminal
CN108934122A (en) * 2017-05-24 2018-12-04 三星电机株式会社 The printed circuit board of built-in electronic component

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