CN113496137B - Fingerprint identification device and access control terminal - Google Patents
Fingerprint identification device and access control terminal Download PDFInfo
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- CN113496137B CN113496137B CN202010189917.6A CN202010189917A CN113496137B CN 113496137 B CN113496137 B CN 113496137B CN 202010189917 A CN202010189917 A CN 202010189917A CN 113496137 B CN113496137 B CN 113496137B
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Abstract
The invention provides a fingerprint identification device and an access control terminal. Based on the invention, the fingerprint identification device adopts a split structure in which the fingerprint detection module and the infrared light-emitting module are independently and separately arranged with the panel packaging module, and a slot is not required to be formed in the panel packaging module for the installation of the fingerprint detection module and the infrared light-emitting module, so that the discretization of a duty space is facilitated, and the miniaturization of equipment integrating the fingerprint identification function is facilitated; in addition, the light sensing surface of the fingerprint detection module faces the touch area of the packaging module, the light emitting surface of the infrared light emitting module can deviate from the touch area, and the transmittance of infrared light in oblique incidence of the touch area is improved by means of the refraction adjustment module, so that the touch area of the panel packaging module can be allowed to be as small as possible, the panel space occupied by the panel packaging module for integrating the fingerprint identification function is saved, and the available area ratio of the panel packaging module, such as the screen occupation ratio of a display panel, is improved.
Description
Technical Field
The present invention relates to fingerprint recognition technology, and more particularly, to a fingerprint recognition device, an access control terminal using the fingerprint recognition device, and an electronic apparatus.
Background
Fingerprint identification is a common means of identification used for identity authentication, and more electronic devices are intended to integrate fingerprint identification functions.
Thus, the prior art seeks a fingerprint recognition device that can be integrated in an electronic device.
Disclosure of Invention
In one embodiment, there is provided a fingerprint recognition device including:
a panel packaging module having a touch region that is transmissive to infrared light;
the fingerprint detection module is arranged at intervals between the inner side of the panel packaging module and the panel packaging module, and the light sensitive surface of the fingerprint detection module is positioned in the direct projection range of the touch area;
the infrared light-emitting module is arranged at intervals with the panel packaging module on the inner side of the panel packaging module, and the light-emitting surface of the infrared light-emitting module deviates from the direct projection range of the touch area;
the refraction adjusting module is attached to the inner surface of the touch area at the inner side of the panel packaging module;
when the infrared light emitting module is electrified and infrared light is generated on the light emitting surface, the infrared light emitting module is powered on:
for the infrared light obliquely incident at a prescribed angle, the refraction adjusting module is formed to be a refraction that is a trend of total transmission in the touch area.
Optionally, the method further comprises: the light guide beam-shaped module is assembled on the light emitting surface of the infrared light emitting module, and the light guide beam-shaped module avoids a direct light path from the touch area to the light sensing surface of the fingerprint detection module; when the infrared light emitting module is electrified and infrared light is generated on the light emitting surface, the infrared light emitting module is powered on: and the infrared light scattered from the light emitting surface is converged and constrained by the light guide beam-shaped module to be obliquely projected to the touch area at the specified angle.
Optionally, the light guide beam shape module includes a light guide fiber, where the light guide fiber is bent from an optical axis direction of the light emitting surface to a direction where the specified angle is located.
Optionally, the infrared light emitting module includes a plurality of light emitting elements; the light guide beam-shaped module comprises a plurality of light guide fibers which are arranged in an alignment mode with each light-emitting element, wherein the light guide fibers are parallel to each other.
Optionally, a plurality of the light emitting elements of the light emitting module are arranged in an annular array; the light guide beam-shaped module further comprises a mounting cylinder, wherein the mounting cylinder is provided with a cylinder cavity which is bent from the optical axis direction of the light emitting surface to the direction of the designated angle, and a plurality of light guide fibers are distributed on the inner wall of the cylinder cavity.
Optionally, the refraction adjustment module includes at least two dielectric films, wherein refractive indexes of the at least two dielectric films are different from each other, and the refractive index of the at least two dielectric films is different from the refractive index of the touch area.
Optionally, the panel packaging module includes a glass cover plate for covering the display panel, the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch area is located at the extension portion of the glass cover plate.
Optionally, the epitaxial portion is coated with a barrier coating that is transmissive to infrared light and attenuates visible light transmittance.
In another embodiment, there is provided an electronic device including:
the fingerprint identification device as described above, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate at the inner side of the panel packaging module;
wherein the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch region is located at the extension portion of the glass cover plate.
Optionally, the epitaxial portion is coated with a barrier coating that is transmissive to infrared light and attenuates visible light transmittance.
In another embodiment, there is provided an access terminal including:
the detection authentication assembly at least comprises the fingerprint identification device, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate at the inner side of the panel packaging module;
wherein the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch region is located at the extension portion of the glass cover plate.
Based on the embodiment, the fingerprint identification device adopts a split structure in which the fingerprint detection module and the infrared light-emitting module are independently and separately arranged with the panel packaging module, and a slot is not required to be formed in the panel packaging module for mounting the fingerprint detection module and the infrared light-emitting module, so that discretization of a duty space is facilitated, and miniaturization of equipment integrating a fingerprint identification function is facilitated; in addition, the light sensing surface of the fingerprint detection module faces the touch area of the panel packaging module, the light emitting surface of the infrared light emitting module can deviate from the touch area and improve the transmittance of infrared light when the infrared light obliquely irradiates the touch area by means of the refraction adjusting module, so that the touch area of the panel packaging module can be allowed to be as small as possible, the panel space occupied by the panel packaging module for integrating the fingerprint identification function is saved, and the available area ratio of the panel packaging module, such as the screen occupation ratio of a display panel, is improved.
Drawings
The following drawings are only illustrative of the invention and do not limit the scope of the invention:
FIG. 1 is an exemplary structural diagram of a fingerprint recognition device in one embodiment;
FIG. 2 is a schematic diagram of a refraction principle of a refraction adjustment module in the fingerprint identification device shown in FIG. 1;
FIG. 3 is a schematic diagram of a first example of the fingerprint recognition device shown in FIG. 1;
FIG. 4 is a schematic diagram of a second example of the fingerprint recognition device shown in FIG. 1;
FIG. 5 is a schematic diagram of a third example of the fingerprint recognition device shown in FIG. 1;
FIG. 6 is a schematic diagram of an assembly structure of the infrared light emitting module in the third example structure shown in FIG. 5;
FIG. 7 is a schematic diagram showing an assembled structure of the light guide beam module in the third example structure shown in FIG. 5;
FIG. 8 is a schematic diagram of an exemplary architecture of an electronic device employing the fingerprint recognition device shown in FIG. 1;
FIG. 9 is a schematic diagram of the fingerprint recognition device in the electronic device shown in FIG. 8 in a third example configuration shown in FIG. 5;
FIGS. 10a and 10b are schematic diagrams of a first device example of the electronic device shown in FIG. 8;
fig. 11a and 11b are schematic diagrams of a second device example of the electronic device shown in fig. 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below by referring to the accompanying drawings and examples.
Fig. 1 is a schematic diagram of an exemplary structure of a fingerprint recognition device in one embodiment. Referring to fig. 1, in this embodiment, the fingerprint recognition device may include: the device comprises a panel packaging module 10, a fingerprint detection module 20, an infrared light emitting module 30 and a refraction adjusting module 40.
The panel package module 10 may have a touch area 100 that is transmissive to infrared light. For example, the panel package module 10 may include a glass cover plate for covering the display panel, and the glass cover plate may have an extension portion extending beyond the boundary of the display panel, and in this case, the touch region 100 may be located at the extension portion of the glass cover plate. Also, the epitaxial portion where the touch area 100 is located may be coated with a shielding coating (e.g., an ink coating) that is transmissive to infrared light and attenuates visible light transmittance.
The fingerprint detection module 20 is disposed at a distance from the panel packaging module 10 on the inner side of the panel packaging module 10 (for example, the fingerprint detection module may be mounted on the circuit board 80), and the light sensing surface of the fingerprint detection module 20 is located in the direct projection range of the touch area 100 of the panel packaging module 10;
the infrared light emitting module 30 is spaced apart from the panel packaging module 10 at an inner side of the panel packaging module 10 (for example, the infrared light emitting module 30 may be mounted on the circuit board 80), and a light emitting surface of the infrared light emitting module 30 deviates from a direct projection range of the touch area 100 of the panel packaging module 10;
the refraction adjusting module 40 is attached to the inner surface of the touch area 100 of the panel packaging module 10 at the inner side of the panel packaging module 10;
when the infrared light emitting module 20 is powered on and generates infrared light on the light emitting surface:
for the infrared light 310 obliquely incident at a given angle, the refraction adjusting module 40 may form refraction that tends to be transmitted through the touch area 100.
Refraction with the tendency of total transmission at the touch area 100 refers to: the infrared light 310 obliquely incident at a prescribed angle may be transmitted entirely from the refraction modulating module 40 and the touch area 100, or transmitted from the refraction modulating module 40 and the touch area 100 at a transmittance close to the total transmittance.
Since the main purpose of the transmission of the infrared light 310 from the refraction adjustment module 40 and the touch area 100 is to provide light source illumination, i.e. to provide illumination light 320 to the finger 90 touching the outside of the panel package module 10, the attention to the transmittance of the infrared light 310 is aimed at improving the light source utilization of the infrared light emitting module 30, and a certain reflectivity of the infrared light can be tolerated.
That is, for refraction that tends to be fully transmitted in the touch area 100, it may not be strictly required that the infrared light 310 must be fully transmitted from the refraction modulating module 40 and the touch area 100, and a certain difference in the transmittance of the infrared light 310 compared to the full transmittance may be tolerated.
In a specific implementation, refraction that tends to be total transmission in the touch region 100 may utilize the total transmission principle based on Brewster's angle. That is, when a light wave is incident on the interface of two media, its reflection coefficient can be considered to be zero if the incident angle is brewster's angle.
Fig. 2 is a schematic diagram of a refraction principle of a refraction adjusting module in the fingerprint identification device shown in fig. 1. Referring to fig. 2, the designated angle θ1 at which the infrared light 310 is incident may be set as the brewster angle of the refraction modulating module 40. When the infrared light 310 is incident on the refraction modulating module 40 at a specified angle θ1, it may be totally refracted, or nearly totally refracted, at the refraction modulating module 40 to be totally transmitted from the refraction modulating module 40, or to be transmitted from the refraction modulating module 40 with a transmittance approaching to the total transmission. And, the infrared light, which is totally refracted or approximately totally refracted by the refraction adjustment module 40, is incident on the touch area 100 of the panel package module 10 at an angle θ2.
In fig. 2, the refraction adjustment module 40 may be configured to make the incident angle θ2 of the refracted infrared light 310 at the touch area 100 be 0 degrees or an angle value approaching 0 degrees, so that the infrared light 310 may be transmitted at the touch area 100 in a direct manner or at the touch area 100 in an angle approaching 0 degrees with an effect similar to a direct manner.
In fig. 2, taking an example in which the refraction adjustment module 40 includes at least two dielectric films 41 and 42, the refractive indexes of the at least two dielectric films 41 and 42 may be different from each other, and the refractive indexes of the at least two dielectric films 41 and 42 are different from the refractive index of the panel package module 10 at the touch area 100.
Wherein, the refractive index of the first dielectric film 41 of the at least two dielectric films may be greater than the refractive index of the second dielectric film 42, and the refractive index of the first dielectric film 41 may be greater than the refractive index of the touch area 100, and the refractive index of the second dielectric film 42 may be less than the refractive index of the touch area 100.
For example, the touch area 100 may be made of glass material with a refractive index of 1.51, in this case, the first dielectric film 41 may be made of titanium dioxide with a refractive index of 2.25, and the second dielectric film 42 may be made of silicon dioxide with a refractive index of 1.45. Alternatively, zinc sulfide having a refractive index of 2.38 may be used for the first dielectric film 41, and cryolite having a refractive index of 1.25 may be used for the second dielectric film 42.
In addition, in the multilayer film structure of the refraction modulating module 40 shown in fig. 2, a plurality of first dielectric films 41 and a plurality of second dielectric films 42 may be alternately arranged, or other dielectric films other than the first dielectric films 41 and the second dielectric films 42 may be further introduced.
Alternatively, the refraction adjustment module 40 may be configured such that the incident angle θ2 of the infrared light 310 in the touch area 100 is the brewster angle of the panel packaging module 10 in the touch area 100, so that after the infrared light 310 is fully refracted or approximately fully refracted by the refraction adjustment module 40, the infrared light 310 can still be fully refracted or approximately fully refracted again in the touch area 100 of the panel packaging module 10, so that the infrared light 310 can be fully transmitted in the touch area 100 through the full refraction or can be transmitted in the touch area 100 with a refractive effect approaching the full refraction.
For the alternatives described above, the refraction modulating module 40 may also be a multilayer film structure.
As can be seen from the above, after the infrared light 310 incident obliquely at a given angle is refracted by the refraction adjustment module 40, the infrared light can be fully transmitted in the touch area 100 or have a transmittance approaching to the full transmission, so as to provide the illuminating light 320 for the finger 90 touching the outside of the panel packaging module 10.
Therefore, the image reflected light 330 of the fingerprint pattern of the finger 90 can be directly projected on the photosensitive surface of the fingerprint detection module 20 from the touch area 100, so that the fingerprint detection module 20 can perform fingerprint identification by detecting the fingerprint pattern.
Based on the above embodiment, the fingerprint recognition device adopts a split structure in which the fingerprint detection module 20 and the infrared light emitting module 30 are separately arranged from the panel packaging module 10, and the panel packaging module 10 is not required to be slotted for mounting the fingerprint detection module 20 and the infrared light emitting module 30, so that discretization of a duty space is facilitated, and miniaturization of equipment integrating fingerprint recognition functions is facilitated; moreover, the light-sensitive surface of the fingerprint detection module 20 faces the touch area 100 of the panel packaging module 10, and the light-emitting surface of the infrared light-emitting module 30 can deviate from the touch area 100 of the panel packaging module 10, and the transmittance of the infrared light in the oblique incidence of the touch area 100 is improved by means of the refraction adjustment module 40, so that the touch area 100 of the panel packaging module 10 can be allowed to be as small as possible, the panel space occupied by the panel packaging module 10 for integrating the fingerprint recognition function is saved, and the usable area ratio of the panel packaging module 10, such as the screen occupation ratio of the display panel, can be improved.
In order to better increase the intensity of the infrared light 310 incident on the refraction modulating module 40 at a given angle, several example structures are provided below.
Fig. 3 is a schematic structural diagram of a first example of the fingerprint recognition device shown in fig. 1. Referring to fig. 3, in the first example structure, the infrared light emitting module 30' may have a light emitting surface 300' inclined with respect to the refraction modulating module 40 and the contact region 100, and the inclination of the light emitting surface 300' may be achieved by providing the shape of the infrared light emitting module 30', i.e., the bottom surface of the infrared light emitting module 30' may be mounted on the circuit board 80 parallel to the refraction modulating module 40 and the contact region 100, and the light emitting surface 300' of the infrared light emitting module 30' is disposed on the top surface inclined with respect to the bottom surface.
Based on the first example structure, the inclination angle of the light-emitting surface 300' may be such that the optical axis is arranged in the direction of a specified angle (e.g., θ1 shown in fig. 2). Thus, the infrared light 310 incident on the refraction modulating module 40 at a specified angle may have a greater intensity than if the light emitting surface is parallel to the refraction modulating module 40 and the contact region 100 to emit heat.
Fig. 4 is a schematic diagram of a second example structure of the fingerprint recognition device shown in fig. 1. Referring to fig. 4, in the first example structure, the infrared light emitting module 30″ may also have a light emitting surface 300″ inclined with respect to the refraction modulating module 40 and the contact region 100, unlike the first example structure: the tilting of the light emitting surface 300 "may be achieved by the overall tilting of the infrared light emitting module 30", i.e., the infrared light emitting module 30 "may be arranged to be overall tilted, for example, by the support member 70 being tilted to be supported parallel to the refraction modulating module 40 and the circuit board 80 of the contact region 100, so that the light emitting surface 300" is tilted.
Based on the second example structure, the inclination angle of the light-emitting surface 300″ may be such that the optical axis is arranged in the direction of a specified angle (e.g., θ1 shown in fig. 2). Thus, the infrared light 310 incident on the refraction modulating module 40 at a specified angle may have a greater intensity than if the light emitting surface is parallel to the refraction modulating module 40 and the contact region 100 to emit heat.
Fig. 5 is a schematic structural diagram of a third example of the fingerprint recognition device shown in fig. 1. Referring to fig. 5, in the third example structure, the angle of the light emitting surface 300 of the infrared light emitting module 30 may be arbitrarily arranged, that is, it is not required that the light emitting surface 300 be inclined toward the first example structure as shown in fig. 3 and the second example structure as shown in fig. 4, and in order to embody such a non-necessity, the light emitting surface 300 is illustrated in fig. 5 as being parallel to the refraction adjusting module 40 and the contact region 100.
Also, in a third example structure as shown in fig. 5, the fingerprint recognition device may further include a light guide beam shape module 50.
The light guide beam module 50 may be mounted on the light emitting surface 300 of the infrared light emitting module 30, and the light guide beam module 50 avoids a direct light path from the touch area 100 to the light sensing surface 200 of the fingerprint detection module 20;
when the infrared light emitting module 30 is powered on and generates infrared light on the light emitting surface 300:
the infrared light scattered from the light-emitting surface 300 may be converged and constrained by the light guide beam shape module 50 to be obliquely incident to the touch area at a specified angle (e.g., θ1 shown in fig. 2).
That is, the beam guide module 50 has a function of shaping the scattered infrared light beam into a parallel beam of a prescribed angle.
In order to achieve the above-mentioned beam shaping effect, the beam shaping module 50 may include a light guiding fiber 500, wherein the light guiding fiber 500 may be bent from the optical axis direction of the light emitting surface 300 to a direction at a specified angle (e.g., θ1 in fig. 2).
The third example structure may make the structure of the infrared light emitting module 30 simpler than the first example structure; the third example structure can simplify the mounting of the infrared light emitting module 30 on the circuit board 80 as compared to the second example structure.
Also, it is preferable that the third example structure improves the beam shape of the infrared light 310 by introducing the light guide beam shape module 50 so that all or most of the light beams generated by the infrared light emitting module 30 are transmitted at a specified angle to the refraction modulating module 40, and thus the infrared light 310 incident at the specified angle to the refraction modulating module 40 can be more significantly enhanced than the first and second example structures.
In order to reduce the light guiding loss rate of the light guiding beam-shaped module 50, the light guiding optical fiber 500 may be aligned with the light emitting element 30a in the infrared light emitting module 30. That is, the infrared light emitting module 30 may include a plurality of light emitting elements 30a, and the light guide beam shape module 50 may include a plurality of light guide fibers 500 arranged in alignment with each of the light emitting elements 30a, wherein the plurality of light guide fibers 500 may be parallel to each other.
Fig. 6 is a schematic diagram of an assembly structure of the infrared light emitting module in the third example structure shown in fig. 5. A relatively simple assembly structure of the infrared light module 30 is shown in figure 6,
in this assembled structure, the infrared light emitting module 30 may include a plurality of light emitting elements 30a, and the plurality of light emitting elements 30a may be arranged in an annular array.
In the assembly structure, the infrared light emitting module 30 may further include a base 30b, the base 30b may be adapted to have a ring shape in an annular arrangement of the plurality of light emitting elements 30, and the base 30b may be a heat conductive base that facilitates heat dissipation of the light emitting elements 30a, for example, the base 30b may be a metal material such as aluminum.
Thus, the light emitting elements 30a annularly arranged on the same side surface of the base 30b can form the light emitting surface 300 of the infrared light emitting module 30.
Fig. 7 is a schematic diagram of an assembly structure of the light guide beam module in the third example structure shown in fig. 5. Referring to fig. 7 and referring back to fig. 5, in order to adapt to a structure in which the plurality of light emitting elements 30a are arranged in an annular array, the light guide beam shape module 50 may include a mounting cylinder 510, wherein the mounting cylinder 510 has a cylinder cavity bent from an optical axis direction of the light emitting surface 300 of the infrared light emitting module 30 to a direction in which a specified angle (e.g., θ1 shown in fig. 2) is located, and the plurality of light guide fibers 500 are disposed on an inner wall of the cylinder cavity of the mounting cylinder 510.
The mounting cylinder 510 shown in fig. 7 has an inlet section 510a and an outlet section 510b. Wherein:
the leading-in end surface 511 of the leading-in section 510a is in butt joint with the light-emitting surface 300 of the infrared light-emitting module 30, and the leading-in section 510a extends along the optical axis direction of the light-emitting surface 300 of the infrared light-emitting module 30;
the lead-out section 510b is bent with respect to the lead-in section 510a and extends in a direction at a predetermined angle (e.g., θ1 shown in fig. 2), and the lead-out end face 512 of the lead-out section 510b is inclined toward the refraction adjustment module 40.
Accordingly, the plurality of light guide fibers 500 extend from the lead-in end surface 511 to the lead-out end surface 512 through the tube cavity of the mounting tube 510.
Thus, when the infrared light emitting module 30 is powered on and generates infrared light on the light emitting surface 300:
the infrared light generated by each light emitting element 30a may enter from one end of the corresponding light guiding fiber 500 at the lead-in end face 511, and be incident to the refraction modulating module 40 at a prescribed angle (e.g., θ1 shown in fig. 2) through the other end of the light guiding fiber 500 at the lead-out end face 512.
Fig. 8 is a schematic diagram of an exemplary structure of an electronic device to which the fingerprint recognition device shown in fig. 1 is applied. Referring to fig. 8, in another embodiment, an electronic device is provided, which may include a fingerprint recognition device as shown in fig. 1, and a display panel 60.
The panel package module 10 of the fingerprint recognition device may include a glass cover plate 110.
The display panel 60 may be a panel member having an energizing display function, such as an LCD (Liquid Crystal Display ), and the display panel 60 may be attached to an inner surface of the glass cover plate 110 inside the panel package module 100.
Wherein the glass cover plate 110 has a main body portion Am covering the display panel 60, i.e., the display panel 60 may be side-attached to an inner surface of the main body portion Am of the glass cover plate 110.
Also, the glass cover plate 110 may further have an extension portion Ae extending beyond the boundary of the display panel 60, and the touch area 100 may be located at the extension portion Ae.
In practical use, the epitaxial portion Ae may be coated with a masking coating (e.g., an ink coating) that is transmissive to infrared light and attenuates visible light transmittance, and the color of the masking coating may be the same as the surface color when the display panel 60 is not energized.
Fig. 9 is a schematic view of the fingerprint recognition device in the electronic apparatus shown in fig. 8 when the third example structure shown in fig. 5 is adopted. Referring to fig. 9, taking a third example structure as an example, when the fingerprint authentication device shown in fig. 1 is applied to an electronic device, it can adopt the above-mentioned various example structures.
Fig. 10a and 10b are schematic diagrams of a first device example of the electronic device shown in fig. 8. Referring to fig. 10a and 10b, in a first device example, the electronic device may be a door access terminal that may include a display screen 60 and a detection authentication component.
The detection authentication component may include a fingerprint authentication device (only the position of the touch area 100 is shown in fig. 10a and 10 b) as shown in fig. 1, and the detection authentication component may further include a camera 61, a light supplement lamp 62 for providing photographing light supplement for the camera 61, and a radio frequency card reading module 63.
As can be seen from fig. 10a and 10b, the entrance guard terminal integrates various detection authentication elements or modules, thus resulting in a compact layout of panel space, while the touch area 100 of the fingerprint authentication device occupies only a small panel space outside the edge of the display panel 60, thus contributing to an increase in the screen ratio of the display panel 60.
It can also be seen from fig. 10a and 10b that the touch area 100 of the fingerprint authentication device is adjustable beyond different side edges of the display panel 60 for different layouts of the various detection authentication elements or modules.
Fig. 11a and 11b are schematic diagrams of a second device example of the electronic device shown in fig. 8. Referring to fig. 11a and 11b, in a second device example, the electronic device may still be a door access terminal, which may include a display 60 and a detection authentication component.
Unlike the first device example, the second device example replaces the rf card reader module 63 with the keyboard module 65.
It follows that the use of a fingerprint authentication device as shown in fig. 1 is versatile for detecting different functional combinations of authentication components.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather to enable any modification, equivalent replacement, improvement or the like to be made within the spirit and principles of the invention.
Claims (11)
1. A fingerprint recognition device, comprising:
a panel packaging module having a touch region that is transmissive to infrared light;
the fingerprint detection module is arranged at intervals between the inner side of the panel packaging module and the panel packaging module, and the light sensitive surface of the fingerprint detection module is positioned in the direct projection range of the touch area;
the infrared light-emitting module is arranged at intervals with the panel packaging module on the inner side of the panel packaging module, and the light-emitting surface of the infrared light-emitting module deviates from the direct projection range of the touch area;
the refraction adjusting module is attached to the inner surface of the touch area at the inner side of the panel packaging module;
when the infrared light emitting module is electrified and infrared light is generated on the light emitting surface, the infrared light emitting module is powered on:
for the infrared light obliquely incident at a prescribed angle, the refraction adjusting module is formed to be a refraction that is a trend of total transmission in the touch area.
2. The fingerprint recognition device of claim 1, further comprising:
the light guide beam-shaped module is assembled on the light emitting surface of the infrared light emitting module, and the light guide beam-shaped module avoids a direct light path from the touch area to the light sensing surface of the fingerprint detection module;
when the infrared light emitting module is electrified and infrared light is generated on the light emitting surface, the infrared light emitting module is powered on:
and the infrared light scattered from the light emitting surface is converged and constrained by the light guide beam-shaped module to be obliquely projected to the touch area at the specified angle.
3. The fingerprint recognition device according to claim 2, wherein the light guide beam-shaped module includes a light guide fiber, wherein the light guide fiber is bent from an optical axis direction of the light exit surface to a direction in which the specified angle is located.
4. The fingerprint recognition device according to claim 3, wherein,
the infrared light-emitting module comprises a plurality of light-emitting elements;
the light guide beam-shaped module comprises a plurality of light guide fibers which are arranged in an alignment mode with each light-emitting element, wherein the light guide fibers are parallel to each other.
5. The fingerprint recognition device according to claim 4, wherein,
the light emitting elements of the light emitting module are arranged in an annular array;
the light guide beam-shaped module further comprises a mounting cylinder, wherein the mounting cylinder is provided with a cylinder cavity which is bent from the optical axis direction of the light emitting surface to the direction of the designated angle, and a plurality of light guide fibers are distributed on the inner wall of the cylinder cavity.
6. The fingerprint recognition device of claim 1, wherein the refraction adjustment module comprises at least two dielectric films, wherein the refractive indices of the at least two dielectric films are different from each other, and the refractive index of the at least two dielectric films is different from the refractive index of the touch area.
7. The fingerprint recognition device of claim 1, wherein the panel package module includes a glass cover plate for covering a display panel, the glass cover plate having an extension portion extending beyond a boundary of the display panel, and wherein the touch area is located at the extension portion of the glass cover plate.
8. The fingerprint recognition device according to claim 7, wherein the extension portion is coated with a shielding coating that is transmissive to infrared light and attenuates visible light transmittance.
9. An electronic device, comprising:
the fingerprint recognition device of any one of claims 1-6, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate at the inner side of the panel packaging module;
wherein the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch region is located at the extension portion of the glass cover plate.
10. The electronic device of claim 9, wherein the epitaxial portion is coated with a masking coating that is transmissive to infrared light and attenuates visible light transmittance.
11. An access terminal, comprising:
a detection authentication assembly comprising at least a fingerprint recognition device according to any one of claims 1 to 6, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate at the inner side of the panel packaging module;
wherein the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch region is located at the extension portion of the glass cover plate.
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| CN202010189917.6A CN113496137B (en) | 2020-03-18 | 2020-03-18 | Fingerprint identification device and access control terminal |
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| CN202010189917.6A CN113496137B (en) | 2020-03-18 | 2020-03-18 | Fingerprint identification device and access control terminal |
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