CN113496137A - Fingerprint identification device and entrance guard terminal - Google Patents
Fingerprint identification device and entrance guard terminal Download PDFInfo
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- CN113496137A CN113496137A CN202010189917.6A CN202010189917A CN113496137A CN 113496137 A CN113496137 A CN 113496137A CN 202010189917 A CN202010189917 A CN 202010189917A CN 113496137 A CN113496137 A CN 113496137A
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Abstract
The invention provides a fingerprint identification device and an entrance guard terminal. Based on the fingerprint identification device, the fingerprint detection module, the infrared light emitting module and the panel packaging module are arranged in an independent and separated split type structure, and the panel packaging module is not required to be grooved for installing the fingerprint detection module and the infrared light emitting module, so that the discretization of space occupation is facilitated, and the miniaturization of equipment integrating a fingerprint identification function is facilitated; and, the sensitization face of fingerprint detection module is to the touch area of encapsulation module, and the play plain noodles of infrared light-emitting module then can deviate from in touch area to adjust the transmissivity that the module improves infrared light when touch area strays with the help of the refraction, thereby, can allow the touch area of panel encapsulation module to be as little as possible, in order to save the panel space that occupies at panel encapsulation module for integrated fingerprint identification function, help improving the usable area ratio of panel encapsulation module, for example, the screen of display panel accounts for than.
Description
Technical Field
The present invention relates to fingerprint identification technologies, and in particular, to a fingerprint identification device, an access terminal using the fingerprint identification device, and an electronic device.
Background
Fingerprinting is a commonly used means of identification for identity authentication, and more electronic devices are intended to integrate fingerprint recognition functionality.
Accordingly, the prior art seeks to provide a fingerprint recognition device that can be integrated into an electronic device.
Disclosure of Invention
In one embodiment, there is provided a fingerprint recognition device including:
a panel package module having a touch area that is transmissive to infrared light;
the fingerprint detection module is arranged at the inner side of the panel packaging module at intervals with the panel packaging module, and the light sensing surface of the fingerprint detection module is positioned in the direct projection range of the touch area;
the infrared light-emitting modules are arranged at intervals with the panel packaging module at the inner side of the panel packaging module, and the light-emitting surfaces of the infrared light-emitting modules deviate from the direct projection range of the touch area;
the refraction adjusting module is attached to the inner surface of the touch area on the inner side of the panel packaging module;
when the infrared light-emitting module is powered on and generates infrared light on the light-emitting surface:
for infrared light obliquely incident at a specified angle, the refraction adjusting module forms refraction which tends to be full-transmission in the touch area.
Optionally, further comprising: the light guide beam-shaped module is assembled on the light emitting surface of the infrared light emitting module, and avoids a direct light path from the touch area to the photosensitive surface of the fingerprint detection module; when the infrared light-emitting module is powered on and generates infrared light on the light-emitting surface: and the infrared light scattered from the light-emitting surface is converged and restrained by the light guide beam-shaped module to be obliquely emitted to the touch area at the specified angle.
Optionally, the light guide beam-shaped module includes a light guide fiber, wherein the light guide fiber is bent from the optical axis direction of the light exit surface to the direction of the specified angle.
Optionally, the infrared light emitting module comprises a plurality of light emitting elements; the light guide beam shaping module comprises a plurality of light guide optical fibers which are arranged in an alignment mode with the light-emitting elements, wherein the light guide optical fibers are parallel to each other.
Optionally, a plurality of the light emitting elements of the light emitting module are arranged in a ring-shaped array; the light guide beam-shaped module further comprises an installation cylinder, wherein the installation cylinder is provided with a cylinder cavity which is bent from the direction of the optical axis of the light emergent surface to the direction of the specified angle, and the light guide optical fibers are arranged on the inner wall of the cylinder cavity.
Optionally, the refraction adjusting module includes at least two dielectric films, wherein refractive indexes of the at least two dielectric films are different from each other, and the refractive indexes of the at least two dielectric films are different from the refractive index of the touch area.
Optionally, the panel packaging module comprises a glass cover plate for covering the display panel, the glass cover plate has an extension part extending beyond the boundary of the display panel, and the touch area is located on the extension part of the glass cover plate.
Optionally, the epitaxial portion is coated with a masking coating that is transmissive to infrared light and attenuates visible light transmission.
In another embodiment, there is provided an electronic device including:
the fingerprint identification device as described above, wherein the panel package module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate on the inner side of the panel packaging module;
wherein the glass cover has an extension portion extending beyond a boundary of the display panel, and the touch area is located at the extension portion of the glass cover.
Optionally, the epitaxial portion is coated with a masking coating that is transmissive to infrared light and attenuates visible light transmission.
In another embodiment, there is provided an access terminal including:
the detection and authentication assembly at least comprises the fingerprint identification device, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate on the inner side of the panel packaging module;
wherein the glass cover has an extension portion extending beyond a boundary of the display panel, and the touch area is located at the extension portion of the glass cover.
Based on the above embodiment, the fingerprint identification device adopts the split structure that the fingerprint detection module and the infrared light emitting module are independently separated from the panel packaging module, and the panel packaging module is not required to be grooved for the installation of the fingerprint detection module and the infrared light emitting module, so that the discretization of the space occupied by the fingerprint detection module and the infrared light emitting module is facilitated, and the miniaturization of the equipment integrating the fingerprint identification function is facilitated; moreover, the photosensitive surface of the fingerprint detection module faces the touch area of the panel packaging module, the light-emitting surface of the infrared light-emitting module can deviate from the touch area, and the transmittance of infrared light in oblique incidence of the touch area is improved by means of the refraction adjusting module, so that the touch area of the panel packaging module can be allowed to be as small as possible, the panel space occupied by the panel packaging module for integrating the fingerprint identification function is saved, and the improvement of the available area ratio of the panel packaging module is facilitated, for example, the screen occupation ratio of a display panel is increased.
Drawings
The following drawings are only schematic illustrations and explanations of the present invention, and do not limit the scope of the present invention:
FIG. 1 is a schematic diagram of an exemplary configuration of a fingerprint recognition device in one embodiment;
FIG. 2 is a schematic view of a refraction adjusting module of the fingerprint identification device shown in FIG. 1;
FIG. 3 is a schematic diagram of a first example of the fingerprint identification device shown in FIG. 1;
FIG. 4 is a schematic diagram of a second example of the fingerprint identification device shown in FIG. 1;
FIG. 5 is a schematic diagram of a third example of the fingerprint identification device shown in FIG. 1;
FIG. 6 is a schematic view of an assembly structure of an infrared light emitting module in a third example structure shown in FIG. 5;
FIG. 7 is a schematic diagram of an assembled structure of a light guide beam shaping module in the third exemplary structure shown in FIG. 5;
FIG. 8 is a schematic diagram of an exemplary structure of an electronic device to which the fingerprint recognition device shown in FIG. 1 is applied;
FIG. 9 is a diagram illustrating a fingerprint identification device in the electronic device shown in FIG. 8 according to a third exemplary configuration shown in FIG. 5;
FIGS. 10a and 10b are schematic diagrams of a first device example of the electronic device shown in FIG. 8;
fig. 11a and 11b are schematic diagrams of a second device example of the electronic device shown in fig. 8.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and examples.
Fig. 1 is a schematic diagram of an exemplary structure of a fingerprint recognition device in one embodiment. Referring to fig. 1, in this embodiment, the fingerprint recognition device may include: panel encapsulation module 10, fingerprint detection module 20, infrared light-emitting module 30 and refraction regulation module 40.
The panel package module 10 may have a touch area 100 that is transmissive to infrared light. For example, the panel encapsulation module 10 may include a glass cover plate for covering the display panel, and the glass cover plate may have an extension portion extending beyond the boundary of the display panel, in which case the touch area 100 may be located at the extension portion of the glass cover plate. Also, the extended portion where the touch area 100 is located may be coated with a masking coating (e.g., an ink coating) that transmits infrared light and attenuates visible light transmission.
The fingerprint detection module 20 is spaced apart from the panel package module 10 at the inner side of the panel package module 10 (for example, the fingerprint detection module may be mounted on the circuit board 80), and the light-sensing surface of the fingerprint detection module 20 is located in the direct projection range of the touch area 100 of the panel package module 10;
the infrared light emitting module 30 is spaced apart from the panel package module 10 at an inner side of the panel package module 10 (for example, the infrared light emitting module 30 may be mounted on the circuit board 80), and a light emitting surface of the infrared light emitting module 30 deviates from a direct projection range of the touch area 100 of the panel package module 10;
the refraction adjusting module 40 is attached to the inner surface of the touch area 100 of the panel packaging module 10 at the inner side of the panel packaging module 10;
when the infrared light emitting module 20 is powered on and generates infrared light on the light emitting surface:
for infrared light 310 incident obliquely at a specified angle, the refraction adjusting module 40 may form refraction tending to be fully transmitted in the touch area 100.
Refraction tending to be fully transmissive in the touch area 100 means: the infrared light 310, which is obliquely incident at a designated angle, may be transmitted from the refraction adjusting module 40 and the touch area 100 at full transmittance or at transmittance close to full transmittance.
Since the main purpose of the infrared light 310 transmitted from the refraction adjusting module 40 and the touch area 100 is to provide light source illumination, i.e. the illumination light 320 provided to the finger 90 pressed on the outer side of the panel packaging module 10, the attention on the transmittance of the infrared light 310 aims to improve the utilization rate of the light source of the infrared light emitting module 30, and a certain reflectance of the infrared light can be tolerated.
That is, for refraction tending to be fully transmissive at the touch area 100, there may be less stringent requirements that the infrared light 310 must be fully transmissive from the refraction modulating module 40 and the touch area 100, and certain differences in the transmittance of the infrared light 310 compared to full transmission may be tolerated.
In a particular implementation, refraction tending to be fully transmissive at touch area 100 can utilize the principles of full transmission based on Brewster's angle. That is, when a light wave is incident on the interface of two media, its reflection coefficient can be considered to be zero if the incident angle is the brewster angle.
Fig. 2 is a schematic view illustrating a refraction principle of the refraction adjusting module in the fingerprint identification device shown in fig. 1. Referring to fig. 2, the designated angle θ 1 at which the infrared light 310 is incident can be set to the brewster angle of the refraction adjusting module 40. When the infrared light 310 is incident to the refraction adjusting module 40 at the designated angle θ 1, it may be totally refracted, or nearly totally refracted, at the refraction adjusting module 40, to be totally transmitted from the refraction adjusting module 40, or to be transmitted from the refraction adjusting module 40 with a transmittance close to the total transmittance. The infrared light totally or approximately totally refracted by the refraction adjusting module 40 is incident on the touch area 100 of the panel package module 10 at an angle θ 2.
In fig. 2, the refraction adjusting module 40 may be configured to make the incident angle θ 2 of the refracted infrared light 310 in the touch area 100 be 0 degree or an angle value close to 0 degree, so that the infrared light 310 may be fully transmitted in a direct manner in the touch area 100, or may be transmitted in the touch area 100 in an angle close to 0 degree with an effect close to direct in the touch area 100.
In fig. 2, taking the example that the refraction adjusting module 40 includes at least two dielectric films 41 and 42, the refractive indexes of the at least two dielectric films 41 and 42 may be different from each other, and the refractive indexes of the at least two dielectric films 41 and 42 are different from the refractive index of the panel package module 10 in the touch region 100.
The refractive index of the first dielectric film 41 in the at least two dielectric films may be greater than the refractive index of the second dielectric film 42, and the refractive index of the first dielectric film 41 may be greater than the refractive index of the touch area 100, and the refractive index of the second dielectric film 42 may be smaller than the refractive index of the touch area 100.
For example, the touch area 100 may be made of glass with a refractive index of 1.51, in which case the first dielectric film 41 may be made of titanium dioxide with a refractive index of 2.25, and the second dielectric film 42 may be made of silicon dioxide with a refractive index of 1.45. Alternatively, the first dielectric film 41 may be made of zinc sulfide having a refractive index of 2.38, and the second dielectric film 42 may be made of cryolite having a refractive index of 1.25.
Further, the multilayer film structure of the refraction adjusting module 40 shown in fig. 2 may be a lamination manner in which a plurality of first dielectric films 41 and a plurality of second dielectric films 42 are alternately arranged, or a dielectric film other than the first dielectric films 41 and the second dielectric films 42 may be further introduced.
As an alternative, the refraction adjusting module 40 may be configured to make the incident angle θ 2 of the infrared light 310 at the touch area 100 be the brewster angle of the panel packaging module 10 at the touch area 100, so that the infrared light 310 can be fully refracted or approximately fully refracted by the refraction adjusting module 40 and still be fully refracted or approximately fully refracted again at the touch area 100 of the panel packaging module 10, and thus, the infrared light 310 can be fully transmitted at the touch area 100 by full refraction, or transmitted at the touch area 100 with a transmittance approaching full transmission by a refraction effect approaching full refraction.
For the above alternatives, the refraction adjusting module 40 may also adopt a multi-layer film structure.
As can be seen from the above, the infrared light 310 obliquely incident at a specific angle is refracted by the refraction adjusting module 40, and then can be fully transmitted or have a transmittance approaching to the full transmission in the touch area 100, so as to provide the illuminating light 320 for the finger 90 pressed on the outer side of the panel package module 10.
Thereby, the image reflection light 330 of the fingerprint line of finger 90 can be from the photosurface of the direct projection of the touch area 100 at the fingerprint detection module 20, so as to provide the fingerprint detection module 20 to carry out fingerprint identification through the detection of the fingerprint line.
Based on the above embodiment, the fingerprint identification device adopts the split structure that the fingerprint detection module 20 and the infrared light emitting module 30 are independently separated from the panel packaging module 10, and does not need to be grooved in the panel packaging module 10 for the installation of the fingerprint detection module 20 and the infrared light emitting module 30, so that the discretization of the space occupied by the fingerprint detection module is facilitated, and the miniaturization of the equipment integrating the fingerprint identification function is facilitated; moreover, the light-sensing surface of the fingerprint detection module 20 faces the touch area 100 of the panel packaging module 10, and the light-emitting surface of the infrared light-emitting module 30 can deviate from the touch area 100 of the panel packaging module 10, and the transmittance of infrared light in the oblique direction of the touch area 100 is improved by the refraction adjusting module 40, so that the touch area 100 of the panel packaging module 10 can be allowed to be as small as possible, the panel space occupied by the panel packaging module 10 for integrating the fingerprint identification function is saved, and the improvement of the available area ratio of the panel packaging module 10, such as the screen occupation ratio of a display panel, is facilitated.
To better increase the light intensity of infrared light 310 incident on refraction adjusting module 40 at a given angle, several example structures are provided below.
Fig. 3 is a schematic diagram of a first example of the fingerprint identification device shown in fig. 1. Referring to fig. 3, in the first example structure, the infrared light emitting module 30 ' may have a light emitting surface 300 ' inclined with respect to the refraction adjusting module 40 and the contact area 100, and the inclination of the light emitting surface 300 ' may be realized by arranging the shape of the infrared light emitting module 30 ', that is, the bottom surface of the infrared light emitting module 30 ' may be mounted on the circuit board 80 parallel to the refraction adjusting module 40 and the contact area 100, and the light emitting surface 300 ' of the infrared light emitting module 30 ' is disposed on the top surface inclined with respect to the bottom surface.
Based on the first example structure, the inclination angle of the light exit surface 300' may be such that the optical axis is arranged along a direction of a specified angle (e.g., θ 1 shown in fig. 2). Therefore, the infrared light 310 incident on the refraction adjusting module 40 at a specific angle can have a greater intensity than the case where the light-emitting surface is parallel to the refraction adjusting module 40 and the contact area 100 for heat dissipation and light emission.
Fig. 4 is a schematic structural diagram of a second example of the fingerprint identification device shown in fig. 1. Referring to fig. 4, in the first example structure, the infrared light emitting module 30 ″ may also have the light emitting surface 300 ″ inclined with respect to the refraction adjusting module 40 and the contact area 100, which is different from the first example structure: the inclination of the light emitting surface 300 "may be achieved by the overall inclination of the infrared light emitting module 30", that is, the infrared light emitting module 30 "may be integrally arranged obliquely, for example, being obliquely supported by the supporting member 70 on the circuit board 80 parallel to the refraction adjusting module 40 and the contact area 100, so as to incline the light emitting surface 300".
Based on the second example structure, the inclination angle of the light exit surface 300 ″ may be such that the optical axis is arranged along a direction of a specified angle (e.g., θ 1 shown in fig. 2). Therefore, the infrared light 310 incident on the refraction adjusting module 40 at a specific angle can have a greater intensity than the case where the light-emitting surface is parallel to the refraction adjusting module 40 and the contact area 100 for heat dissipation and light emission.
Fig. 5 is a schematic structural diagram of a third example of the fingerprint identification device shown in fig. 1. Referring to fig. 5, in the third example structure, the angles of the light-emitting surface 300 of the infrared light-emitting module 30 may be arbitrarily arranged, that is, the light-emitting surface 300 is not required to be arranged obliquely to the first example structure shown in fig. 3 and the second example structure shown in fig. 4, and in order to embody this non-necessity, the light-emitting surface 300 is illustrated in fig. 5 as being parallel to the refraction adjusting module 40 and the contact area 100.
Also, in the third example structure shown in fig. 5, the fingerprint recognition device may further include a light guide beam shaping module 50.
The light guide beam shaping module 50 can be installed on the light emitting surface 300 of the infrared light emitting module 30, and the light guide beam shaping module 50 avoids a direct light path from the touch area 100 to the light sensing surface 200 of the fingerprint detection module 20;
when the infrared light emitting module 30 is powered on and generates infrared light on the light emitting surface 300:
the infrared light scattered from the light emitting surface 300 can be converged and constrained by the light guiding beam shaping module 50 to be obliquely emitted toward the touch area at a specified angle (e.g., θ 1 shown in fig. 2).
That is, the light guide beam shaping module 50 has a function of shaping the scattered infrared light beam into a parallel beam of a prescribed angle.
In order to achieve the above-mentioned beam shaping effect, the light guide beam shaping module 50 may include a light guide fiber 500, wherein the light guide fiber 500 may be bent from the optical axis direction of the light exit surface 300 to the direction of a specified angle (e.g., θ 1 in fig. 2).
The third example structure can make the structure of the infrared light emitting module 30 simpler than the first example structure; the third example structure can simplify the mounting of the infrared light emitting module 30 on the circuit board 80, compared to the second example structure.
Moreover, the third example structure is superior to the first and second example structures in that the beam shape of the infrared light 310 is improved by introducing the light guide beam shaping module 50, so that all or most of the light beams generated by the infrared light emitting module 30 are transmitted at the refraction adjusting module 40 at a specific angle, thereby significantly increasing the intensity of the infrared light 310 incident at the refraction adjusting module 40 at the specific angle compared to the first and second example structures.
In order to reduce the light guiding loss rate of the light guiding beam shaping module 50, the light guiding fiber 500 may be disposed in alignment with the light emitting element 30a in the infrared light emitting module 30. That is, the infrared light emitting module 30 may include a plurality of light emitting elements 30a, and the light guide beam shaping module 50 may include a plurality of light guide fibers 500 arranged in alignment with each of the light emitting elements 30a, wherein the plurality of light guide fibers 500 may be parallel to each other.
Fig. 6 is a schematic view of an assembly structure of the infrared light emitting module in the third example structure shown in fig. 5. A relatively simple mounting structure for infrared light emitting module 30 is shown in figure 6,
in the mounting structure, the infrared light emitting module 30 may include a plurality of light emitting elements 30a, and the plurality of light emitting elements 30a may be arranged in a circular array.
In the assembly structure, the infrared light emitting module 30 may further include a base 30b, the base 30b may have a ring shape adapted to the ring arrangement of the plurality of light emitting elements 30, and the base 30b may be a heat conducting base for facilitating heat dissipation of the light emitting elements 30a, for example, the base 30b may be a metal material such as aluminum.
Thus, the light-emitting surface 300 of the infrared light-emitting module 30 can be formed by the plurality of light-emitting elements 30a annularly arranged on the same side surface of the base 30 b.
Fig. 7 is a schematic view of an assembly structure of a light guide beam shaping module in the third example structure shown in fig. 5. Referring to fig. 7 and referring back to fig. 5, in order to adapt to the structure in which the plurality of light emitting elements 30a are arranged in a circular array, the light guide beam shaping module 50 may include a mounting cylinder 510, wherein the mounting cylinder 510 has a cylinder cavity that is bent from the optical axis direction of the light emitting surface 300 of the infrared light emitting module 30 to the direction of a specified angle (e.g., θ 1 shown in fig. 2), and the plurality of light guide fibers 500 are arranged on the inner wall of the cylinder cavity of the mounting cylinder 510.
The mounting cylinder 510 shown in fig. 7 has an inlet section 510a and an outlet section 510 b. Wherein:
the lead-in end surface 511 of the lead-in section 510a is abutted with the light-emitting surface 300 of the infrared light-emitting module 30, and the lead-in section 510a extends along the optical axis direction of the light-emitting surface 300 of the infrared light-emitting module 30;
the lead-out section 510b is bent with respect to the lead-in section 510a and extends in a direction at a predetermined angle (e.g., θ 1 shown in fig. 2), and a lead-out end surface 512 of the lead-out section 510b is inclined toward the refraction adjusting module 40.
Accordingly, the plurality of light guide fibers 500 extend from the introduction end surface 511 to the discharge end surface 512 through the cylinder cavity of the mounting cylinder 510.
Thus, when the infrared light emitting module 30 is energized and generates infrared light on the light emitting surface 300:
the infrared light generated by each light emitting element 30a can enter from one end of the corresponding light guiding fiber 500 at the introduction end surface 511 and enter the refraction adjusting module 40 at a specified angle (e.g., θ 1 shown in fig. 2) through the other end of the light guiding fiber 500 at the derivation end surface 512.
Fig. 8 is a schematic diagram of an exemplary structure of an electronic device to which the fingerprint recognition device shown in fig. 1 is applied. Referring to fig. 8, in another embodiment, an electronic device is provided, which may include the fingerprint recognition device shown in fig. 1, and a display panel 60.
The panel package module 10 of the fingerprint recognition device may include a glass cover plate 110.
The Display panel 60 may be a panel member having a power-on Display function, such as an LCD (Liquid Crystal Display), and the Display panel 60 may be attached to an inner surface of the glass cover plate 110 inside the panel package module 100.
The glass cover plate 110 has a main portion Am covering the display panel 60, that is, the display panel 60 may be laterally attached to an inner surface of the main portion Am of the glass cover plate 110.
Also, the glass cover 110 may further have an extension Ae extending beyond the boundary of the display panel 60, and the touch area 100 may be located at the extension Ae.
In practical applications, the extended portion Ae may be coated with a masking coating (e.g., an ink coating) that is transmissive to infrared light and attenuates visible light transmission, and the color of the masking coating may be the same as the surface color of the display panel 60 when not energized.
Fig. 9 is a schematic diagram of the fingerprint identification device in the electronic device shown in fig. 8, which adopts the third example structure shown in fig. 5. Referring to fig. 9, taking the third example structure as an example, when the fingerprint authentication device shown in fig. 1 is applied to an electronic device, it may adopt various example structures mentioned above.
Fig. 10a and 10b are schematic diagrams of a first device example of the electronic device shown in fig. 8. Referring to fig. 10a and 10b, in a first example of the device, the electronic device may be an access terminal, and the access terminal may include a display screen 60 and a detection and authentication component.
The detection and authentication component may include a fingerprint authentication device as shown in fig. 1 (only the position of the touch area 100 is shown in fig. 10a and 10 b), and the detection and authentication component may further include a camera 61, a supplementary lighting lamp 62 for providing supplementary lighting for shooting for the camera 61, and a radio frequency card reading module 63.
As can be seen from fig. 10a and 10b, the entrance guard terminal integrates various detection authentication elements or modules, thereby resulting in a compact layout of panel space, while the touch area 100 of the fingerprint authentication device occupies only a small panel space outside the edge of the display panel 60, thereby contributing to an increase in screen occupation ratio of the display panel 60.
As can also be seen from fig. 10a and 10b, the touch area 100 of the fingerprint authentication device can be adjusted outside different side edges of the display panel 60 for different layouts of the various detection authentication elements or modules.
Fig. 11a and 11b are schematic diagrams of a second device example of the electronic device shown in fig. 8. Referring to fig. 11a and 11b, in the second example, the electronic device may still be an access terminal, and the access terminal may include a display screen 60 and a detection and authentication component.
Unlike the first device example, the second device example replaces the radio frequency card reading module 63 with the keyboard module 65.
It follows that the use of the fingerprint authentication device as shown in figure 1 has versatility for detecting different combinations of functions of the authentication component.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (11)
1. A fingerprint recognition device, comprising:
a panel package module having a touch area that is transmissive to infrared light;
the fingerprint detection module is arranged at the inner side of the panel packaging module at intervals with the panel packaging module, and the light sensing surface of the fingerprint detection module is positioned in the direct projection range of the touch area;
the infrared light-emitting modules are arranged at intervals with the panel packaging module at the inner side of the panel packaging module, and the light-emitting surfaces of the infrared light-emitting modules deviate from the direct projection range of the touch area;
the refraction adjusting module is attached to the inner surface of the touch area on the inner side of the panel packaging module;
when the infrared light-emitting module is powered on and generates infrared light on the light-emitting surface:
for infrared light obliquely incident at a specified angle, the refraction adjusting module forms refraction which tends to be full-transmission in the touch area.
2. The fingerprint recognition device according to claim 1, further comprising:
the light guide beam-shaped module is assembled on the light emitting surface of the infrared light emitting module, and avoids a direct light path from the touch area to the photosensitive surface of the fingerprint detection module;
when the infrared light-emitting module is powered on and generates infrared light on the light-emitting surface:
and the infrared light scattered from the light-emitting surface is converged and restrained by the light guide beam-shaped module to be obliquely emitted to the touch area at the specified angle.
3. The fingerprint recognition device according to claim 2, wherein the light guide beam shaping module comprises a light guide fiber, wherein the light guide fiber is bent from an optical axis direction of the light exit surface to a direction of the designated angle.
4. The fingerprint recognition device according to claim 3,
the infrared light-emitting module comprises a plurality of light-emitting elements;
the light guide beam shaping module comprises a plurality of light guide optical fibers which are arranged in an alignment mode with the light-emitting elements, wherein the light guide optical fibers are parallel to each other.
5. The fingerprint recognition device according to claim 4,
the plurality of light-emitting elements of the light-emitting module are arranged in an annular array;
the light guide beam-shaped module further comprises an installation cylinder, wherein the installation cylinder is provided with a cylinder cavity which is bent from the direction of the optical axis of the light emergent surface to the direction of the specified angle, and the light guide optical fibers are arranged on the inner wall of the cylinder cavity.
6. The fingerprint identification device according to claim 1, wherein the refraction adjusting module comprises at least two dielectric films, wherein the refractive indexes of the at least two dielectric films are different from each other, and the refractive indexes of the at least two dielectric films are different from the refractive index of the touch area.
7. The fingerprint recognition device of claim 1, wherein the panel packaging module comprises a glass cover plate for covering the display panel, the glass cover plate has an extension portion extending beyond a boundary of the display panel, and the touch area is located on the extension portion of the glass cover plate.
8. The fingerprint recognition device of claim 7, wherein the extension portion is coated with a masking coating that is transmissive to infrared light and attenuates visible light transmission.
9. An electronic device, comprising:
the fingerprint identification device of any one of claims 1-6, wherein the panel encapsulation module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate on the inner side of the panel packaging module;
wherein the glass cover has an extension portion extending beyond a boundary of the display panel, and the touch area is located at the extension portion of the glass cover.
10. The electronic device of claim 9, wherein the extension portion is coated with a masking coating that is transmissive to infrared light and attenuates visible light transmission.
11. An access terminal, comprising:
the fingerprint identification device of any one of claims 1 to 6, wherein the panel packaging module comprises a glass cover plate;
the display panel is attached to the inner surface of the glass cover plate on the inner side of the panel packaging module;
wherein the glass cover has an extension portion extending beyond a boundary of the display panel, and the touch area is located at the extension portion of the glass cover.
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| CN202010189917.6A CN113496137B (en) | 2020-03-18 | 2020-03-18 | Fingerprint identification device and access control terminal |
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| CN202010189917.6A CN113496137B (en) | 2020-03-18 | 2020-03-18 | Fingerprint identification device and access control terminal |
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| CN113496137B (en) | 2023-07-14 |
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