CN113490395A - Integrated circuit board surface dust-free heat dissipation and cooling method - Google Patents
Integrated circuit board surface dust-free heat dissipation and cooling method Download PDFInfo
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- CN113490395A CN113490395A CN202110739522.3A CN202110739522A CN113490395A CN 113490395 A CN113490395 A CN 113490395A CN 202110739522 A CN202110739522 A CN 202110739522A CN 113490395 A CN113490395 A CN 113490395A
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- heat dissipation
- air
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- dust
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
- B01D46/12—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces in multiple arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/42—Auxiliary equipment or operation thereof
- B01D46/48—Removing dust other than cleaning filters, e.g. by using collecting trays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20181—Filters; Louvers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of circuit board heat dissipation, in particular to a dust-free heat dissipation and cooling method for the surface of an integrated circuit board, which comprises the following steps: step S1, the brushless fan runs at a constant speed, hot air in the heat dissipation box can be extruded to be discharged outwards under the action of the fan blades, and cold air can flow into the heat dissipation box again under the action of air pressure, so that the PCB can be cooled uninterruptedly; according to the integrated circuit board surface dust-free heat dissipation and cooling assembly, the brushless fan runs at a constant speed, cold air can flow through the heat dissipation box, so that the PCB is uninterruptedly cooled, different independent flow channels can be formed in the heat dissipation box due to the arrangement of the plurality of concave-shaped heat dissipation fins, the heat dissipation plates and the heat dissipation cover are clamped on the capacitors and the resistors on the PCB, so that high-temperature elements on the PCB can be intensively dissipated, and the uniform temperature state of the PCB can be kept.
Description
The application relates to another technical scheme of a dust-free heat dissipation and cooling method for the surface of an integrated circuit board, which is provided by the applicant in application No. CN2020112084450 filed 11/03/2020 and is separated from the above technical scheme, and therefore, the application belongs to the divisional application of the dust-free heat dissipation and cooling component for the surface of the integrated circuit board, which is provided by the applicant in original application No. CN 2020112084450.
Technical Field
The invention relates to the technical field of circuit board heat dissipation, in particular to a dust-free heat dissipation and cooling method for the surface of an integrated circuit board.
Background
The name of the circuit board is ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc., the circuit board makes the circuit miniaturized and visualized, plays an important role in the batch production of fixed circuit and the optimization of the layout of electric appliances, the circuit board can be called as printed circuit board or printed circuit board, and the FPC circuit board is also called as flexible circuit board, which is made of polyimide or polyester film as base material, has high reliability, excellent flexibility printed circuit board, has the characteristics of high wiring density, light weight, thin thickness and good bending property, while the prior art has promoted the new product of soft and hard combination board, namely flexible circuit board and hard circuit board, the circuit board with the FPC characteristic and the PCB characteristic is formed by combining the procedures of pressing and the like according to the relevant process requirements.
Can produce more operation heat in the circuit board operation process, for guaranteeing circuit board normal operating, high-end equipment must be equipped with circuit board radiator unit and just can guarantee the equipment permanent operation, and common circuit board radiating mode does not have non-water-cooling and forced air cooling two kinds of modes, with regard to the forced air cooling mode, the forced air cooling heat dissipation is even heat dissipation, and the calorific capacity of different components is different on the circuit board, not only can cause the waste of wind energy, also can lead to the local overheated condition to appear in the circuit board, the life of circuit board has seriously been influenced, furthermore, the wind-force of forced air cooling heat dissipation is slower, this leads to the dust to fall to the circuit board surface easily, the condition that seriously can cause the damage of circuit board short circuit, existing equipment lacks corresponding dust removal structure, be difficult to guarantee high-end equipment's operation safety.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a dust-free heat dissipation and cooling method for the surface of an integrated circuit board.
The technical scheme adopted by the invention for solving the technical problems is as follows: a dust-free heat dissipation and cooling method for the surface of an integrated circuit board comprises the following steps:
step S1, the brushless fan runs at a constant speed, hot air in the heat dissipation box can be extruded to be discharged outwards under the action of the fan blades, and cold air can flow into the heat dissipation box again under the action of air pressure, so that the PCB can be cooled uninterruptedly;
step S2, the brushless fan can drive the first gear to rotate, the toothed plate can be meshed with the toothed plate to slide along the sliding rod, the return spring is compressed, after the meshed tooth surface of the first gear is far away from the toothed plate, the toothed plate can slide quickly to be meshed with the second gear under the action of the elastic force of the return spring, and the toothed plate can drive the second gear, the second rotating shaft and the driven fan to rotate at a high speed through quick rebounding of the return spring, so that the rotation of the driven fan is accelerated, and air can be extruded quickly to enter the heat dissipation box;
step S3, when the return spring pushes the toothed plate to rebound, the rebound speed of the toothed plate is lower due to the resistance of the driven fan, and the second gear, the second rotating shaft and the driven fan are pushed to rotate in the same direction through the reciprocating motion of the toothed plate;
s4, the first rotating shaft rotates to drive the first connecting rod to rotate and further to pull the second connecting rod to move, so that the sealing plate moves linearly along the positioning pin, the sealing plate can block the air outlet when air enters the heat dissipation box quickly, high-pressure air can push the first elastic sheet open, high-pressure air flow can be blown out from one end of the heat dissipation box to the other end quickly, possible fine dust on the surface of the PCB can be driven quickly under the action of the air flow, the second elastic sheet can be opened temporarily, and the dust and air with higher pressure can be effectively discharged,
step S5, the sealing plate is far away from the air outlet, the first gear is meshed with the toothed plate at a constant speed again, cold air can normally flow through the heat dissipation box, the plurality of heat dissipation plates can form different independent flow channels in the heat dissipation box, and the heat dissipation plates and the heat dissipation cover are clamped on capacitors and resistors on the PCB, so that high-temperature elements on the PCB can be intensively dissipated;
s6, arranging single-loop negative temperature coefficient thermistors on the PCBs in different independent flow channels, and increasing the resistance of the negative temperature coefficient thermistors when the temperature in the independent flow channels rises, so that the resistance of the negative temperature coefficient thermistors can be reduced, the energizing current of the corresponding electromagnets can be increased, the electromagnets can generate stronger magnetism, and accordingly the electromagnets can be adsorbed and blocked, the conical spring is in a further compression state, the opening of the second flow channel can be increased, the ventilation quantity of the corresponding flow channel can be increased in such a way, the temperature equalization among different flow channels can be kept, the local overheating phenomenon of the PCBs can be avoided, and the service life of the PCBs can be effectively prolonged;
the integrated circuit board surface dust-free heat dissipation and cooling method in the step S1-step S6 specifically comprises an integrated circuit board surface dust-free heat dissipation and cooling assembly, wherein the integrated circuit board surface dust-free heat dissipation and cooling assembly comprises a PCB, a heat dissipation box, an air box and an adjuster, the heat dissipation box is fixed on the PCB through screws, the heat dissipation box and the air box are fixedly connected into an integral structure, the adjuster is further arranged in the air box, a plurality of heat dissipation plates are fixedly connected in the heat dissipation box, adaptive grooves and heat dissipation covers are arranged on the heat dissipation plates, a first pressure relief hole is formed in the front ends of the heat dissipation plates, a first elastic sheet is fixedly connected to the edge of the first pressure relief hole, a plurality of second pressure relief holes are formed in the middle of each heat dissipation plate and one side of the heat dissipation box, a second elastic sheet is fixedly connected to the edge of each second pressure relief hole, an air inlet and an air outlet are further symmetrically formed in the heat dissipation box, a positioning pin is fixedly connected to one side of the air inlet and positioned on the heat dissipation box;
the air box is provided with a first mounting groove and a second mounting groove, a first filter screen and a brushless fan are arranged in the first mounting groove, the middle part of the brushless fan is fixedly connected with a first rotating shaft, the outer wall of one end of the first rotating shaft is fixedly connected with a first gear, one end of the first rotating shaft is fixedly connected with a first connecting rod, one end of the first connecting rod is rotatably connected with a second connecting rod, one end of the second connecting rod is rotatably connected with a sealing plate, one side of the sealing plate is provided with a chute, a sliding rod is fixedly connected between the inner walls of the two sides of the air box, a toothed plate is sleeved outside the sliding rod in a sliding manner, a return spring is sleeved on one side of the toothed plate and positioned outside the sliding rod, a driven fan and a second filter screen are arranged in the second mounting groove, one end of the driven fan is fixedly connected with a second rotating shaft, and one end of the second rotating shaft is fixedly connected with a second gear;
the regulator comprises guide pillars, a first flow passage, a second flow passage, a pressure regulating cavity, a conical spring, a seal plug, an electromagnet and a connecting plate, wherein the connecting plate is fixedly connected with a plurality of guide pillars;
the first elastic sheet and the second elastic sheet are made of elastic metal materials, one end of the first elastic sheet is fixedly connected to the edge of the first pressure relief hole, and one end of the second elastic sheet is fixedly connected to the edge of the second pressure relief hole.
Specifically, the heating panel all is "concave" font structure, the heating panel is made for the copper material, the resistance, the electric capacity outside at the PCB board are established to the heat exchanger cover.
Specifically, a gear and No. two gears all are connected with the pinion rack meshing, reset spring sets up in the one side of keeping away from the air intake, a gear is incomplete gear.
Specifically, the tip of locating pin is the rectangle structure, locating pin and spout inner wall sliding connection, the shrouding sets up with the air outlet is corresponding.
Specifically, thermistors are arranged between the adjacent heat dissipation plates and on the PCB, and loops are formed between the electromagnets and different thermistors.
Specifically, the connecting plate is fixedly connected to the edge of the air outlet, the sealing plug is opposite to the second flow channel, and the first flow channel is communicated with the air outlet.
The utility model discloses a filter screen, filter screen include filter screen outer lane, pivot, scrape dirt fan, storage dirt groove, a filter screen is fixed in the middle part of filter screen outer lane, the filter screen outer lane sets up to the ring structure, filter screen outer lane fixed mounting is in a mounting groove, a filter screen middle part fixed mounting has the pivot, the outer disc of pivot rotates and is connected with the dirt fan of scraping that the equidistance distributes, each flabellum of scraping the dirt fan all is the arc bending, it is the crooked willow leaf piece in both ends to scrape each flabellum cross sectional shape of dirt fan, and the bottom surface of each flabellum all laminates with the terminal surface of a filter screen, each flabellum top of scraping the dirt fan all stretches into in the filter screen outer lane, just filter screen outer lane inner wall sets up the sunken storage dirt groove of round along the outer disc of each flabellum of scraping the dirt fan.
The invention has the beneficial effects that:
1. according to the integrated circuit board surface dust-free heat dissipation and cooling method, the brushless fan operates at a constant speed, cold air can flow through the heat dissipation box, so that the PCB is uninterruptedly cooled, different independent flow channels can be formed in the heat dissipation box due to the arrangement of the plurality of concave-shaped heat dissipation fins, the heat dissipation plates and the heat dissipation cover are clamped on the capacitors and the resistors on the PCB, so that high-temperature elements on the PCB can be intensively dissipated, and the uniform temperature state of the PCB can be kept.
2. According to the integrated circuit board surface dust-free heat dissipation and cooling method, the first gear can be meshed with the toothed plate to be far away from the second gear, and after the meshed tooth surface of the first gear is far away from the toothed plate, the toothed plate is quickly pushed to reset by the reset spring, so that the toothed plate pushes the second gear to rotate at a high speed, high-speed airflow can be formed, the first connecting rod and the second connecting rod can also pull the sealing plate to seal the air outlet, the elastic pieces can be opened under the action of the high-speed airflow, air exhaust and dust exhaust are carried out, and the problem that uniform airflow cannot achieve the dust prevention effect is solved.
3. The surfaces of the first filter screen and the second filter screen of the invention are both provided with rotating dust scraping fans, the power of the dust scraping fans generates thrust through the rotation of the brushless fans, the dust scraping fans on the first filter screen and the second filter screen are pushed to rotate by utilizing the flow of air flow, dust particles outside the bellows are blocked by the first filter screen and the second filter screen, the dust particles are blocked on the surface of the corresponding filter screen, the bottom surface of each fan blade is attached to the end surface of the corresponding filter screen by utilizing the rotation of the dust scraping fans on the surface of the corresponding filter screen, the dust particles adhered on the surface of the filter screen are scraped by the fan blades in the rotating process, each fan blade is curved in an arc shape, when the fan blade rotates, the dust particles are guided by the curved fan blade, and the dust particles are pushed to the edge to enter the outer ring of the filter screen by matching with the pushing in the rotating process of the fan blade, collect the dust particle through storing up the dirt groove, and then improve the air permeability of a filter screen and No. two filter screens, improve the mobility of air, reduce the hindrance to the air, make the air dispel the heat the incasement more smoothly, improve the radiating effect.
4. According to the integrated circuit board surface dust-free heat dissipation and cooling method, the negative temperature coefficient thermistors of the independent loops are arranged on the PCB in different independent runners, the negative temperature coefficient thermistors can change the resistance under the influence of the temperatures of the different runners, the magnetism of different electromagnets can be correspondingly changed, the air induction effect of the brushless fan can be redistributed, the cold air waste condition of the low-temperature runner can be avoided, the heat dissipation effect of the high-temperature runner can be enhanced, and the service life of the PCB can be prolonged.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a structural exploded view of an integrated circuit board surface dust-free heat dissipation and cooling assembly according to the present invention;
FIG. 2 is a structural exploded view of an air box in the integrated circuit board surface dust-free heat dissipation and cooling assembly according to the present invention;
fig. 3 is a schematic diagram of an arrangement structure of a heat dissipation plate in the integrated circuit board surface dust-free heat dissipation cooling assembly provided by the invention;
fig. 4 is a schematic view of a connection structure of a sealing plate in the integrated circuit board surface dust-free heat dissipation and cooling assembly provided in the present invention;
FIG. 5 is a schematic sectional view of a regulator in an integrated circuit board surface dust-free heat dissipation and cooling assembly according to the present invention;
fig. 6 is an external schematic view of an integrated circuit board surface dust-free heat dissipation and cooling assembly according to the present invention.
FIG. 7 is a schematic top view of a filter screen according to the present invention;
FIG. 8 is a schematic cross-sectional view of a filter screen of the present invention;
in the figure: 1. a PCB board; 2. a heat dissipation box; 201. a heat dissipation plate; 202. an adaptation groove; 203. a heat dissipation cover; 204. a first pressure relief hole; 205. a first elastic sheet; 206. a second pressure relief hole; 207. a second elastic sheet; 208. an air inlet; 209. an air outlet; 210. positioning pins; 3. an air box; 301. a first mounting groove; 302. a brushless fan; 303. a first rotating shaft; 304. a first filter screen; 3041. the outer ring of the filter screen; 3042. a rotating shaft; 3043. a dust scraping fan; 3044. a dust storage tank; 305. a first gear; 306. mounting grooves II; 307. a passive fan; 308. a second rotating shaft; 309. a second gear; 310. a second filter screen; 311. a slide bar; 312. a toothed plate; 313. a return spring; 314. a first connecting rod; 315. a second connecting rod; 316. closing the plate; 317. a chute; 4. a regulator; 401. a guide post; 402. a first flow channel; 403. a second flow channel; 404. a pressure regulating cavity; 405. a conical spring; 406. blocking; 407. an electromagnet; 408. a connecting plate.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in FIGS. 1-8, the integrated circuit board surface dust-free heat dissipation and cooling assembly of the present invention comprises a PCB 1, a heat dissipation case 2, an air box 3 and an adjuster 4, wherein the PCB 1 is screwed with the heat dissipation case 2, the heat dissipation case 2 is fixedly connected with the air box 3 into an integral structure, the adjuster 4 is further arranged in the air box 3, a plurality of heat dissipation plates 201 are fixedly connected in the heat dissipation case 2, the heat dissipation plates 201 are respectively provided with an adapting groove 202 and a heat dissipation cover 203, the front ends of the heat dissipation plates 201 are respectively provided with a first pressure relief hole 204, the edges of the first pressure relief holes 204 are fixedly connected with a first elastic sheet 205, the middle parts of the heat dissipation plates 201 and one side of the heat dissipation case 2 are respectively provided with a plurality of second pressure relief holes 206, the edges of the second pressure relief holes 206 are respectively fixedly connected with a second elastic sheet 207, the heat dissipation case 2 is further symmetrically provided with an air inlet 208 and an air outlet 209, one side of the air inlet 208 is fixedly connected with a positioning pin 210 on the heat dissipation case 2, the heat dissipation box 2 can cover the running surface of the PCB 1, so that the air flow passes through the gap between the PCB 1 and the heat dissipation box 2, and the running heat of the PCB 1 can be taken away quickly.
Specifically, a first mounting groove 301 and a second mounting groove 306 are formed in the bellows 3, a first filter screen 304 and a brushless fan 302 are mounted in the first mounting groove 301, a first rotating shaft 303 is fixedly connected to the middle of the brushless fan 302, a first gear 305 is fixedly connected to the outer wall of one end of the first rotating shaft 303, a first connecting rod 314 is fixedly connected to one end of the first rotating shaft 303, a second connecting rod 315 is rotatably connected to one end of the first connecting rod 314, a sealing plate 316 is rotatably connected to one end of the second connecting rod 315, a sliding chute 317 is formed in one side of the sealing plate 316, a sliding rod 311 is fixedly connected between the inner walls of two sides of the bellows 3, a toothed plate 312 is slidably sleeved on the outer side of the sliding rod 311, a return spring 313 is sleeved on one side of the sliding rod 312 and positioned on the outer side of the sliding rod 311, a driven fan 307 and a second filter screen 310 are mounted in the second mounting groove 306, and a second rotating shaft 308 is fixedly connected to one end of the driven fan 307, one end of the second rotating shaft 308 is fixedly connected with a second gear 309, the bellows 3 is used for active heat dissipation, and the airflow strength can be effectively increased on the basis of uniform air induction, so that the accumulated dust on the PCB 1 can be blown away by the airflow.
Specifically, the regulator 4 includes a guide post 401, a first flow channel 402, a second flow channel 403, a pressure regulating cavity 404, a conical spring 405, a plugging plug 406, an electromagnet 407 and a connecting plate 408, the connecting plate 408 is fixedly connected with a plurality of guide posts 401, the electromagnet 407 and the pressure regulating cavity 404 are arranged in the guide posts 401, the pressure regulating cavity 404 is respectively communicated with the first flow channel 402 and the second flow channel 403, one side of the pressure regulating cavity 404 is fixedly connected with the conical spring 405, one end of the conical spring 405 is fixedly connected with the plugging plug 406, and the regulator 4 is used for adjusting ventilation of different flow channels, so that the purpose of maintaining uniform heat dissipation of the PCB 1 can be achieved.
Specifically, a shell fragment 205 and No. two shell fragments 207 are elastic metal material and make, the one end fixed connection of a shell fragment 205 is at a pressure release hole 204 edge, the one end fixed connection of No. two shell fragments 207 is at a pressure release hole 206 edge, a shell fragment 205 and No. two shell fragments 207 are equivalent to the effect of check valve, when local atmospheric pressure rose in the heat dissipation case 2, then can be under the effect of pressure differential for a shell fragment 205 and No. two shell fragments 207 are short-term to be opened, and after atmospheric pressure effect disappeared, a shell fragment 205 and No. two shell fragments 207 will reset under self elasticity effect.
It is specific, heating panel 201 all is "concave" font structure, heating panel 201 is copper material and makes, the resistance at PCB board 1 is established to heat exchanger 203 cover, the electric capacity outside, copper material has stronger heat conductivility, and it has heat conduction silica gel to bond between heating panel 201 and the 1 contact site of PCB board, thereby can avoid heating panel 201 to cause the influence to the operation of PCB board 1, heat exchanger 203 is that a plurality of interconnect's "concave" font card strip combination forms, can effectively increase resistance, the heat radiating area and the effect of electric capacity.
Specifically, a gear 305 and No. two gears 309 all are connected with pinion rack 312 meshing, reset spring 313 sets up the one side of keeping away from air intake 208, a gear 305 is incomplete gear, a gear 305 can mesh pinion rack 312 rectilinear movement, the rodent face of a gear 305 is kept away from behind pinion rack 312, under reset spring 313's elasticity effect, pinion rack 312 will slide fast and mesh as to No. two gears 309, and then can drive No. two gears 309, No. two pivot 308 and driven fan 307 high-speed rotations, thereby can produce stronger air current.
Specifically, locating pin 210's tip is the rectangle structure, locating pin 210 and the corresponding setting of air outlet 209, shrouding 316 and pivot 303 rotate, can drive connecting rod 314 and rotate No. one, and then can stimulate connecting rod 315 position and remove No. two for shrouding 316 makes linear motion along locating pin 210, thereby when the air got into heat dissipation box 2 fast, shrouding 316 can shutoff air outlet 209, avoids the reverse circulation of dust removal air current.
Specifically, thermistors are arranged between adjacent heat dissipation plates 201 and on the PCB 1, and a loop is formed between the electromagnet 407 and different thermistors, so that when the temperature in the independent flow channel rises, the resistance of the negative temperature coefficient thermistor decreases, and the current flowing through the corresponding electromagnet 407 can be increased, whereas when the temperature in the independent flow channel decreases, the resistance of the negative temperature coefficient thermistor increases, and the current flowing through the corresponding electromagnet 407 can be decreased.
Specifically, connecting plate 408 fixed connection is at air outlet 209 edge, it is just right to seal up 406 and No. two runners 403, runner 402 communicates with air outlet 209, the air current of air outlet 209 can be redistributed by regulator 4, electro-magnet 407 receives negative temperature coefficient thermistor to influence and produces different magnetism, with this can produce different adsorption affinity to shutoff stopper 406, make conical spring 405 be in different compression state, No. two runners 403's opening will change, can adjust the air volume that corresponds the runner through this kind of mode, make the air flow in the higher temperature runner bigger, the radiating effect is better.
The first filter screen 304 and the second filter screen 310 are provided with rotary dust scraping fans (3043) on the surfaces thereof, the power of the dust scraping fans 3043 generates thrust by the rotation of the brushless fan 302, the dust scraping fans 3043 on the first filter screen 304 and the second filter screen 310 are pushed to rotate by the flow of air flow, dust particles outside the bellows are blocked by the first filter screen 304 and the second filter screen 310, the dust particles are blocked on the corresponding filter screen surface, the dust scraping fans 3043 rotate on the corresponding filter screen surface, the bottom surface of each fan blade is attached to the corresponding filter screen end surface, the fan blades scrape the dust particles adhered on the filter screen surface during the rotation process, each fan blade of the dust scraping fans (3043) is curved in an arc shape, when the fan blade rotates, the dust particles are guided by the curved fan blade, and the pushing during the rotation process of the fan blade is matched, make the dust granule pushed in the flabellum border gets into filter screen outer lane (3041), collect the dust granule through storing up dirt groove (3044), and then improve the air permeability of filter screen 304 and No. two filter screens 310, improve the mobility of air, reduce the hindrance to the air, make the air more smooth and easy in the air cooling case 2, improve the radiating effect.
The first filter screen 304 comprises a filter screen outer ring 3041, a rotating shaft 3042, a dust scraping fan 3043 and a dust storage tank 3044, the first filter screen 304 is fixed in the middle of the filter screen outer ring 3041, the filter screen outer ring 3041 is configured into a circular ring structure, the filter screen outer ring 3041 is fixedly installed in the first installation groove 301, the rotating shaft 3042 is fixedly installed in the middle of the first filter screen 304, the dust scraping fan 3043 is rotationally connected to the outer circular surface of the rotating shaft 3042 at equal intervals, each blade of the dust scraping fan 3043 is curved in an arc shape, the cross section of each blade of the dust scraping fan 3043 is in a shape of a willow blade with two curved ends, the bottom surface of each blade is attached to the end surface of the first filter screen 304, the top end of each blade of the dust scraping fan 3043 extends into the filter screen outer ring 3041, and the inner wall of the outer ring 3041 of the filter screen is provided with a circle of concave dust storage groove 3044 along the outer circumferential surface of each blade of the dust scraping fan 3043, and the second filter screen 310 and the first filter screen 304 are configured in the same structure.
Specifically, the surfaces of the first filter screen 304 and the second filter screen 310 are both provided with a rotating dust scraping fan 3043, the power of the dust scraping fan 3043 generates thrust by the rotation of the brushless fan 302, the dust scraping fans 3043 on the first filter screen 304 and the second filter screen 310 are pushed to rotate by the flow of air flow, dust particles on the dust outside the bellows are blocked by the first filter screen 304 and the second filter screen 310, the dust particles are blocked on the corresponding filter screen surface, the bottom surface of each fan blade is attached to the corresponding filter screen end surface by the rotation of the dust scraping fan 3043, the fan blade scrapes off the dust particles adhered on the filter screen surface during the rotation process, each fan blade is curved in an arc shape by the dust scraping fan 3043, when the fan blade rotates, the dust particles are guided by the curved fan blade, and the pushing during the rotation process of the fan blade is matched, make in the dust granule is pushed flabellum border entering filter screen outer lane 3041, collect the dust granule through dust storage groove 3044, and then improve the air permeability of filter screen 304 and No. two filter screens 310, improve the mobility of air, reduce the hindrance to the air, make the air dispel the heat in the case 2 more smoothly, improve the radiating effect.
The working principle is as follows: the brushless fan 302 operates at a constant speed, hot air in the heat dissipation box 2 can be extruded to be discharged outwards under the action of the fan blades, cold air can flow into the heat dissipation box 2 again under the action of air pressure, so that the PCB 1 can be cooled uninterruptedly, the brushless fan 302 can drive the first gear 305 to rotate, the toothed plate 312 can be meshed to slide along the sliding rod 311, the reset spring 313 is compressed, after the tooth surface of the first gear 305 is far away from the toothed plate 312, the toothed plate 312 can slide to be meshed with the second gear 309 quickly under the action of the elastic force of the reset spring 313, the toothed plate 312 can drive the second gear 309, the second rotating shaft 308 and the passive fan 307 to rotate at a high speed through the quick rebound of the reset spring 313, so that the rotation of the passive fan 307 is accelerated, air can be extruded into the heat dissipation box 2 quickly, and the reset spring 313 pushes the toothed plate 312 to rebound due to the resistance of the passive fan 307, the rebounding speed of the toothed plate 312 is relatively low, the second gear 309, the second rotating shaft 308 and the driven fan 307 are pushed to rotate in the same direction through the reciprocating motion of the toothed plate 312, the brushless fan 302 is used as a main driving part in the invention, the use of a motor is reduced, and the power loss is further saved, particularly, the first rotating shaft 303 rotates to drive the first connecting rod 314 to rotate, and further the second connecting rod 315 can be pulled to move, so that the sealing plate 316 linearly moves along the positioning pin 210, when air rapidly enters the heat dissipation box 2, the sealing plate 316 can seal the air outlet 209, high-pressure air can push the first elastic sheet 205 open, high-pressure air can be rapidly blown out from one end of the heat dissipation box 2 to the other end, possible fine dust on the surface of the PCB can be rapidly driven under the action of the air flow, the second elastic sheet 207 can be opened for a short time, and the dust and air with higher pressure can be effectively removed, afterwards, the sealing plate 316 is far away from the air outlet 209, and the first gear 305 is engaged with the toothed plate 312 at a constant speed again, so that the cold air can normally flow through the heat dissipation box 2, the plurality of heat dissipation plates 201 can form different independent flow channels in the heat dissipation box 2, the heat dissipation plates 201 and the heat dissipation cover 203 are clamped on the capacitor and the resistor on the PCB board 1, so as to intensively dissipate heat of the high temperature element on the PCB board 1, which is beneficial to maintaining the uniform temperature state of the PCB board 1, and the PCB board 1 in different independent flow channels is provided with the ntc thermistors of the independent loops, when the temperature in the independent flow channels rises, the resistance of the ntc thermistors will decrease, so that the energizing current of the corresponding electromagnet 407 can be increased, so that the electromagnet 407 generates stronger magnetism, so as to adsorb the blocking block 406, so that the conical spring 405 is in a further compression state, and the opening of the second flow channel 403 will be more, by adopting the mode, the ventilation quantity of the corresponding flow channels can be increased, so that the temperature equalization among different flow channels can be kept, and the PCB (printed circuit board) is prevented
Local overheating phenomenon occurs on the PCB 1, and the service life of the PCB 1 can be effectively prolonged.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the embodiments and descriptions given above are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A dust-free heat dissipation and cooling method for the surface of an integrated circuit board is characterized by comprising the following steps:
step S1, the brushless fan runs at a constant speed, hot air in the heat dissipation box can be extruded to be discharged outwards under the action of the fan blades, and cold air can flow into the heat dissipation box again under the action of air pressure, so that the PCB can be cooled uninterruptedly;
step S2, the brushless fan can drive the first gear to rotate, the toothed plate can be meshed with the toothed plate to slide along the sliding rod, the return spring is compressed, after the meshed tooth surface of the first gear is far away from the toothed plate, the toothed plate can slide quickly to be meshed with the second gear under the action of the elastic force of the return spring, and the toothed plate can drive the second gear, the second rotating shaft and the driven fan to rotate at a high speed through quick rebounding of the return spring, so that the rotation of the driven fan is accelerated, and air can be extruded quickly to enter the heat dissipation box;
step S3, when the return spring pushes the toothed plate to rebound, the rebound speed of the toothed plate is lower due to the resistance of the driven fan, and the second gear, the second rotating shaft and the driven fan are pushed to rotate in the same direction through the reciprocating motion of the toothed plate;
s4, the first rotating shaft rotates to drive the first connecting rod to rotate and further to pull the second connecting rod to move, so that the sealing plate moves linearly along the positioning pin, the sealing plate can block the air outlet when air enters the heat dissipation box quickly, high-pressure air can push the first elastic sheet open, high-pressure air flow can be blown out from one end of the heat dissipation box to the other end quickly, possible fine dust on the surface of the PCB can be driven quickly under the action of the air flow, the second elastic sheet can be opened temporarily, and the dust and air with higher pressure can be effectively discharged,
step S5, the sealing plate is far away from the air outlet, the first gear is meshed with the toothed plate at a constant speed again, cold air can normally flow through the heat dissipation box, the plurality of heat dissipation plates can form different independent flow channels in the heat dissipation box, and the heat dissipation plates and the heat dissipation cover are clamped on capacitors and resistors on the PCB, so that high-temperature elements on the PCB can be intensively dissipated;
s6, arranging single-loop negative temperature coefficient thermistors on the PCBs in different independent flow channels, and increasing the resistance of the negative temperature coefficient thermistors when the temperature in the independent flow channels rises, so that the resistance of the negative temperature coefficient thermistors can be reduced, the energizing current of the corresponding electromagnets can be increased, the electromagnets can generate stronger magnetism, and accordingly the electromagnets can be adsorbed and blocked, the conical spring is in a further compression state, the opening of the second flow channel can be increased, the ventilation quantity of the corresponding flow channel can be increased in such a way, the temperature equalization among different flow channels can be kept, the local overheating phenomenon of the PCBs can be avoided, and the service life of the PCBs can be effectively prolonged;
the integrated circuit board surface dust-free heat dissipation and cooling method in the step S1-step S6 specifically comprises an integrated circuit board surface dust-free heat dissipation and cooling assembly, wherein the integrated circuit board surface dust-free heat dissipation and cooling assembly comprises a PCB, a heat dissipation box, an air box and an adjuster, the heat dissipation box is fixed on the PCB through screws, the heat dissipation box and the air box are fixedly connected into an integral structure, the adjuster is further arranged in the air box, a plurality of heat dissipation plates are fixedly connected in the heat dissipation box, adaptive grooves and heat dissipation covers are arranged on the heat dissipation plates, a first pressure relief hole is formed in the front ends of the heat dissipation plates, a first elastic sheet is fixedly connected to the edge of the first pressure relief hole, a plurality of second pressure relief holes are formed in the middle of each heat dissipation plate and one side of the heat dissipation box, a second elastic sheet is fixedly connected to the edge of each second pressure relief hole, an air inlet and an air outlet are further symmetrically formed in the heat dissipation box, a positioning pin is fixedly connected to one side of the air inlet and positioned on the heat dissipation box;
the air box is provided with a first mounting groove and a second mounting groove, a first filter screen and a brushless fan are arranged in the first mounting groove, the middle part of the brushless fan is fixedly connected with a first rotating shaft, the outer wall of one end of the first rotating shaft is fixedly connected with a first gear, one end of the first rotating shaft is fixedly connected with a first connecting rod, one end of the first connecting rod is rotatably connected with a second connecting rod, one end of the second connecting rod is rotatably connected with a sealing plate, one side of the sealing plate is provided with a chute, a sliding rod is fixedly connected between the inner walls of the two sides of the air box, a toothed plate is sleeved outside the sliding rod in a sliding manner, a return spring is sleeved on one side of the toothed plate and positioned outside the sliding rod, a driven fan and a second filter screen are arranged in the second mounting groove, one end of the driven fan is fixedly connected with a second rotating shaft, and one end of the second rotating shaft is fixedly connected with a second gear;
the regulator comprises guide pillars, a first flow passage, a second flow passage, a pressure regulating cavity, a conical spring, a seal plug, an electromagnet and a connecting plate, wherein the connecting plate is fixedly connected with a plurality of guide pillars;
the first elastic sheet and the second elastic sheet are made of elastic metal materials, one end of the first elastic sheet is fixedly connected to the edge of the first pressure relief hole, and one end of the second elastic sheet is fixedly connected to the edge of the second pressure relief hole.
2. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: the heat dissipation plates are of concave structures, the heat dissipation plates are made of copper materials, and the heat dissipation cover covers the outer sides of the resistors and the capacitors of the PCB (1).
3. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: the first gear and the second gear are meshed with the toothed plate, the reset spring is arranged on one side of the first gear far away from the air inlet, and the first gear is an incomplete gear.
4. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: the tip of locating pin is the rectangle structure, locating pin and spout inner wall sliding connection, the shrouding sets up with the air outlet is corresponding.
5. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: thermistors are arranged between the adjacent heat dissipation plates and on the PCB, and loops are formed between the electromagnets and different thermistors.
6. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: the connecting plate is fixedly connected to the edge of the air outlet, the blocking plug is opposite to the second flow channel, and the first flow channel is communicated with the air outlet.
7. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 1, wherein: a filter screen includes filter screen outer lane, pivot, scrapes dirt fan, dust storage tank, a filter screen is fixed in the middle part of filter screen outer lane, the filter screen outer lane sets up to the ring structure, filter screen outer lane fixed mounting is in a mounting groove, a filter screen middle part fixed mounting has the pivot, the outer disc of pivot rotates the dirt fan of scraping that is connected with the equidistance and distributes, each flabellum of scraping the dirt fan all is the arc crooked, the shape of cross section of each flabellum of scraping the dirt fan is the crooked willow leaf piece in both ends, the bottom surface of each flabellum all laminates with the terminal surface of a filter screen, each flabellum top of scraping the dirt fan all stretches into in the filter screen outer lane, just filter screen outer lane inner wall sets up the sunken dust storage tank of round along the outer disc of each flabellum of scraping the dirt fan.
8. The integrated circuit board surface dust-free heat dissipation and temperature reduction method according to claim 7, wherein: no. two filter screens set up to the same structure with the filter screen.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110739522.3A CN113490395A (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation and cooling method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110739522.3A CN113490395A (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation and cooling method |
| CN202011208445.0A CN112261849B (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation cooling assembly |
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| CN202011208445.0A Division CN112261849B (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation cooling assembly |
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| CN113490395A true CN113490395A (en) | 2021-10-08 |
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| CN202011208445.0A Active CN112261849B (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation cooling assembly |
| CN202110739522.3A Withdrawn CN113490395A (en) | 2020-11-03 | 2020-11-03 | Integrated circuit board surface dust-free heat dissipation and cooling method |
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| CN114760826A (en) * | 2022-06-13 | 2022-07-15 | 南京博斯威尔工业通信技术有限公司 | New forms of energy station panorama monitor terminal device |
| CN116780038A (en) * | 2023-08-18 | 2023-09-19 | 深圳市凌鑫电子有限公司 | Lithium battery protection board and lithium battery device with same |
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| CN112946345A (en) * | 2021-01-25 | 2021-06-11 | 刘贺珍 | Power grid protection equipment |
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| CN204629866U (en) * | 2015-03-02 | 2015-09-09 | 佛山市大瀚风通风降温设备有限公司 | A kind of integrated form cooler |
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-
2020
- 2020-11-03 CN CN202011208445.0A patent/CN112261849B/en active Active
- 2020-11-03 CN CN202110739522.3A patent/CN113490395A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114760826A (en) * | 2022-06-13 | 2022-07-15 | 南京博斯威尔工业通信技术有限公司 | New forms of energy station panorama monitor terminal device |
| CN116780038A (en) * | 2023-08-18 | 2023-09-19 | 深圳市凌鑫电子有限公司 | Lithium battery protection board and lithium battery device with same |
| CN116780038B (en) * | 2023-08-18 | 2023-11-03 | 深圳市凌鑫电子有限公司 | Lithium battery protection board and lithium battery device with same |
| CN117825389A (en) * | 2024-01-09 | 2024-04-05 | 昱天(上海)新材料有限公司 | Plastic film optical detection instrument |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112261849A (en) | 2021-01-22 |
| CN112261849B (en) | 2021-11-09 |
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