1334334 九、發明說明： 【發明所屬之技術領域】 本發明係種散熱模組，制是—種能姻風扇轉速來 調節入風口之開口大小的散熱模組。 【先前技術】 為了滿足現代人的需求’現行的電子裝置不斷的再做改進與1334334 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, which is a heat dissipation module capable of adjusting the opening size of an air inlet by a fan speed. [Prior Art] In order to meet the needs of modern people, the current electronic devices are constantly being improved.
優化’如：為了滿足現代人的視覺需求，t視螢幕的尺寸越做越 大；為了滿足忙碌的現代人，可攜式電子裝置越做越小功能也 越，越多樣化。而在不斷改進與優化電子裝置的功能的同時，伴 P通著大尺寸電子裝置所帶來的耗電量餘關題，還有小型電子 裝置因為體積縮小、树緊密聚集在—起，所產生的熱能都需要 靠散熱模組將裝置⑽熱能排出’以免電子裝置因為過熱而無法 運行。 T般電子裝置會在與風扇對應之電子裝置機殼上設計入風 鲁σ以進仃強制對流，達到散熱模組的熱交換功用。但是在長時 間的使用之下’環境中的灰塵將會被風扇經由人風口吸入電子裝 置機殼内’並累積附著在散熱鰭片及風扇扇葉上。如此一來將導 致電子裝置機舶的熱空氣無法糊排出，造成散熱效能降低， 並縮短了散熱模組的壽命。 【發明内容】 r:亡的問題’本發明提供一種散熱模組，該散熱模組用 中的灰塵經由入風口進入電子裝置機殼内之數量，並 又’、積附著在散熱模組上，達到延長散熱模組壽命作用， 1334334 同時可兼顧散熱效能之功效。 本發明之一種散熱模組係設置於具有入風口之電子裝置機殼 内’該散熱模組包含有風扇、開關閥與控制器。其中風扇對應入 風口。開關閥適於受到驅動而覆蓋入風口的部份。控制器與開關 闊電性連接，控制器係偵測風扇之轉速，並且依據風扇之轉速以 控制開關閥覆蓋入風口的程度。當控制器偵測到風扇之轉速增加 時，用以驅動開關閥作動在第一覆蓋位置以形成第一開口，控制 • 器偵測到風扇之轉速減少時，用以驅動開關閥作動在第二覆蓋位 置以形成第二開口，且第一開口係大於第二開口。本發明之開關 閥可以係電動光圈或電動閥。 本發明之另一種散熱模組係設置於具有入風口之電子裝置機 殼内’該散鋪組包含有風扇、開關與控㈣。其巾風扇對應 入風口。開關閥適於受到驅動而覆蓋入風口的部份。控制器與開 關閥電!·生連接控制II係控制風扇之轉速，並且依據風扇之轉速 以控制開«覆蓋人風σ的程度。當控㈣偵測到風扇之轉速辦 加時’用以鶴_閥作動在第—覆蓋位置以形成第—開口，:Optimization: For example, in order to meet the visual needs of modern people, the size of the screen is getting bigger and bigger; in order to satisfy the busy modern people, the portable electronic device is getting smaller and smaller, and the more diverse the function. While continuously improving and optimizing the functions of the electronic device, the power consumption of the large-sized electronic device is accompanied by the P, and the small electronic device is compacted and the tree is closely gathered. The thermal energy needs to be discharged from the heat energy of the device (10) by the heat dissipation module to prevent the electronic device from being unable to operate due to overheating. The T-like electronic device designs a wind σ on the electronic device casing corresponding to the fan to perform forced convection to achieve the heat exchange function of the heat dissipation module. However, under long-term use, the dust in the environment will be sucked into the casing of the electronic device through the human air vents and accumulated on the heat radiating fins and the fan blades. As a result, the hot air of the electronic device can not be discharged, which reduces the heat dissipation performance and shortens the life of the heat dissipation module. [Disclosed] r: The problem of death' The present invention provides a heat dissipation module in which the dust in the heat dissipation module enters the casing of the electronic device through the air inlet, and is attached to the heat dissipation module. To achieve the longevity of the thermal module, 1334334 can also take into account the effectiveness of heat dissipation. A heat dissipation module of the present invention is disposed in an electronic device casing having an air inlet. The heat dissipation module includes a fan, an on-off valve and a controller. The fan corresponds to the air inlet. The on-off valve is adapted to be driven to cover the portion of the tuyere. The controller is connected to the switch in a wide range. The controller detects the speed of the fan and controls the degree of the inlet valve to cover the air inlet according to the speed of the fan. When the controller detects that the speed of the fan increases, the controller is driven to actuate in the first covering position to form a first opening, and the controller detects that the speed of the fan decreases, and is used to drive the switching valve to act in the second The position is covered to form a second opening, and the first opening is larger than the second opening. The on-off valve of the present invention can be an electric aperture or an electric valve. Another heat dissipating module of the present invention is disposed in an electronic device casing having an air inlet. The scatter group includes a fan, a switch and a control (4). Its towel fan corresponds to the air inlet. The on-off valve is adapted to be driven to cover the portion of the tuyere. The controller and the switch valve are electrically connected. The raw connection control II controls the speed of the fan and controls the degree of the wind σ according to the speed of the fan. When the control (4) detects the speed of the fan, the valve is used to move the first-covering position to form the first opening:
有關本發明的特徵與實作 並避免灰塵累積附著在散熱模組上，達到 ’同時可兼顧散熱效能之功效。 -、只作，茲配合圖示作最佳實施例詳細說 1334334 明如下^ 【實施方式】 請參照「第1圖」，「第1圓总a於 ^ 圖」係為本發明之散熱模組第一實 施例不思圖。此散熱模組係應 簽㈣雷腦、τ接“ 电于衷置中，例如桌上型電腦、 : T攜式電子裝置等。本發明之散熱模組 入子裝麵㈣内，該絲做 開關閥24與控制器25。 , 旧23Regarding the features and implementations of the present invention and avoiding the accumulation of dust on the heat dissipating module, the effect of the heat dissipating efficiency can be achieved at the same time. - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The first embodiment is not considered. The heat-dissipating module is required to be signed (4) Thunderbolt and τ to be connected to the center, such as a desktop computer, a T-carrying electronic device, etc. The heat-dissipating module of the present invention is inserted into the sub-surface (4), and the wire is made. Switching valve 24 with controller 25., old 23
h 扃3係對應於入風口 21 ;開關閥24 =扇23與入風口 21之間，開謙4適於受到驅動而覆 盍 的部份；控制器25係與開關閥24電性連接，控制器 74 =机扇η之轉速’並且依據風扇23之轉速以控制開關閥 盍入風口 21的程度。當控制器25制到風扇之轉速增 加時’用以驅_關24作動在第—覆蓋位置以形成第一開口， 控制器25偏J到風扇23之轉速減少時，用以驅動開關閥24作動 在第-覆盘位置以形成第二開口，且第―開口係大於第二開口。 開關閥24可以係電動光圈或電動閥。當開關間％是電動光 ，26 〇月參考「第2Α圖」’「第2八圖」係電動光圈位於第一覆 蓋位置之示意®。該電動錢26係設置於風扇23與人風口 21之 間，且該電動光圈26包含有複數個葉片27。當電子裝置機殼22 内之溫度上升，使得電子裝置即控制風扇23之轉速增加此時該 控制器25即偵測到轉速之增加並驅動電動光圈26，使電動光圈 跖同時縮放複數個該葉片27至第一覆蓋位置烈以形成如圖所示 之第一開口。請參考「第2Β圖」’「第2Β圖」係電動光圈位於第 一覆蓋位置之示意圖。該電動光圈26係覆蓋於入風口 21，且該 !334334 電動光圈26包含右 下降，使得電子駐要個葉片27。當電子裝置機殼22内之溫度 制哭25 S即控制風扇23之轉速減少的同時，此時該控 同暗㈣到轉速之減少並驅動電動光圈26，使電動光圈26 ;^_個_ 27至第二覆蓋位置3_成如圖所示之 第開口。其中第―開口與第二開叫指人風口 a!被電動光圈 八風口 21此使空氣流通進入電子裝置機殼22内之面 ，大從「第Μ圖」與「第2β圖」中可以見悉，第一開口係 大於第二開口。 =由⑴述第開σ大於第二開^之設計，使得當風㈣轉速 ί低時’電動賴26位於第二覆蓋位錢，使得人風口 21被覆 ==，意即可供氣流流入的截面積變小，因此，能被氣 _進電子裝置的灰塵數量，相較於較大的開口狀態即較少，達 到本案之目的。 本發明之開關閥24也可以是電動閥32。請參考「第3α圖」， 「第3Α圖」係電動間位於第一覆蓋位置之示意圖。該電動閱& 係設置於風扇23與人風口 21之間，且該電_ &具有平板％ 與移動軌道34。當電子裝置機殼22内之溫度上升，使得電子農 置即控制風扇23之轉速增加的同時，此時該控制器25 _ 速之增加並驅動電_ 32，使電_ 32移動平板Μ於 Μ至第-覆蓋位置35以形成如圖所示之第一開口。請參考 3Β圖」’「第3Β圖」係電動閥位於第二覆蓋位置之示 動閥32係覆蓋於入風口 21，且該電動間 轨道Μ。當電子裝置機殼22内之溫度下降，使得電板子 1334334 制風扇23之轉速減少的同時，此時該控制@ 25細到轉速之減 少並驅動電動閥32，使電動閥32移動平板％於移動軌道％至 第二覆蓋位置37以形成如圖所示之第二開口。其中第一開口與第 二開口係指人風〇 21被電動閥32覆蓋後，人風〇 21能^空氣流 通進入電子裝置機殼22内之面積大小，從「第SA圖」與「第犯 圖」中可以見悉’第一開口大於第二開口。 藉由前述第大於第二開σ之設計’使得當風扇23轉速 降低時’電動闕32位於第二覆蓋位置37，使得入風口 21被覆蓋 =區域變大，意即可供紐紅__變小，因此，能被氣流 f進電子裝置喊塵數量，她於較大關吵科較少 本案之目的。 -月參考S4A圖」，「第4Α圖」係另一電動閥位於第一覆蓋 位置之示意圖。該電動閥32係設置於風扇23與入風口 Μ ^該電_2包含有具複__9之平板4g與飾執道Μ。 =風口 2i具有複數個散熱孔42。當電子袭置機殼^内之溫度 制電子裝置即控制風扇23之轉速增加的同時，此時該控 ^ 狀增織鶴電_ 32，㈣關％移動且 複數個開孔39之平板4〇於働贿41 位置之示音g 「第4B圖」係另一電動間位於第二覆蓋 且該電動錢胁顺23與錢σ 之間， 當電子=有具複數綱孔39之平板4G與移動軌道41。 裝置糾22内之溫度顶，使得電子裝轉控制風扇η 二此時該控㈣25侧到轉速之減少並驅動電 W 5笛 移動具複數個開孔39之平板40於移動執 二形成如:覆蓋位置45 ’以使複數個開孔39與複數個散熱孔42 义口日21、/^雷所不之第二開口。其中第一開口與第二開口係指入 二2^動閥32 後，入風口 21 _空氣流通進入電子裝 f機内之面積大小’從「第4Α圖」與「第4Β圖」中可以 見悉，第一開口大於第二開口。 藉由前述第1 π大於第二開σ之設計，使得#風扇23轉速 降低時’電動閥32位於第二覆蓋位置45，使得入風口 21被覆蓋 的區域I大忍即可供氣流流入的截面積變小，因此，能被氣流 带進電子裝置的灰塵數量’相較於較大的開口狀態即較少達到 本案之目的。 本發明之散熱模組係應用於電子裝置中，例如桌上型電腦、 筆記型電腦、可献電子裝置等。t電子裝殼a内溫度升 高、風扇23轉速加快時，此時控制器25偵測到轉速之增加並驅 動開關閥24，使開關閥24將開口增大，讓較多的外界低溫空氣 被風扇23帶動進入電子裝置機殼22内，並跟電子裝置機殼22内 之高溫空氣進行熱對流，達成散熱之功效；當電子裝置機殼22内 溫度降低、風扇23轉速減慢時，此時控制器25偵測到轉速之減 少並驅動開關閥24 ’使開關闕24將開口縮小，使得入風口 21被 覆蓋的區域變大’意即可供氣流流入的截面積變小，因此，能被 氣流帶進電子裝置的灰塵數量，相較於較大的開口狀態即較少， 達到本案之目的。 1334334 »月參,，、、第5圖」’「第5圖」係為本發明之散熱模組第二實 施例示賴。本發明第二實施例與第—實施例之主要差別在於本 實施例之入風口 21係位於風扇23與開關間24之間，且入風口 21倾開關閥24所覆蓋。其他特徵與功能與第一實施例相同， . 在此不做贅述。 請參照「第6圖」，「第6圖」係為本發明之散熱模組第三實 施解·。此散賴_應胁電子裝置巾，例如桌上型電腦、 #筆記型電腦、可攜式電子裝置等。本發明之散熱模組設置於具有 入風口 51之電子裝置機殼52内，該散熱模組包含有：風扇幻、 •開關閥54與控制器55。風扇％係對應於入風口 51 ;開關間54 係設置於風扇53與入風口 51之間，開關間54適於受到驅動而覆 蓋入風口 51的部份。控制器55係與開關閥54電性連接，控制器 55係债測風扇53之轉速，並且依據風扇53之轉速以控制開關閱 54覆盍入風口 51的程度。當控制器55偵測到風扇53之轉速增 φ 加時，用以驅動開關閥54作動在第一覆蓋位置以形成第一開口， 控制益55偵測到風扇53之轉速減少時，用以驅動開關閥54作動 在第二覆蓋位置以形成第二開口，且第一開口係大於第二開口。 其中開關閥54如同第一實施例中所述之開關閥24，可以是 電動光圈26(參照「第2Α圖」、「第2Β圖」）或電動閥32(參照「第 3Α圖」、「第3Β圖」或「第4Α圖」、「第4Β圖」）。 本發明之散熱模組係應用於電子裝置中，例如桌上型電腦、 筆記型電腦、可攜式電子裝置等。控制器55係當電子裝置内元件 之工作頻率過高或電子裝置機殼52内溫度升高時，由控制器55 1334334 驅動風扇53，使風4 53之轉速增加，此時該控制器55同時驅動 開關閥54作動’使開關閥54將開口增大，讓較多的外界低溫空 氣被風扇53帶動進入電子裝置機殼52内，並跟電子裝置機殼％ 内之高溫故進行絲流，達紐熱之功效；當電子裝置機殼52 .内溫度降低，由控制器55驅動風扇53 ’使風扇53之轉速減少， 此哺控勤55同軸綱關54作動，賴關54將開口縮 小’使知人風α 21被覆蓋的區域變大，意即可供氣流流入的截面 • 積變小，因此，能被氣流帶進電子裝置的灰塵數量，相較於較大 的開口狀態即較少，達到本案之目的。 請參照「第7圖」’「第7圖」係為本發明之散熱模組第四實 施例示意I本發明細實施例與第三實施例之主要差別在於本 實施例之人風口 51係位於縣53細關54之間，且入風口 51係被_閥54所覆蓋。其他特徵與魏與第三實施例相同， 在此不做贅述。 籲〜雖然本發明以前述之較佳實施例揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍 内田可作些許之更動與潤飾，因此本發明之專利保護範圍須視 本說明書所附之申請專利範圍所界定者為準。 、 【圖式簡單說明】 第1圖係為本發明之散熱模組第-實施例示意圖； 第2Α圖係電動光圈位於第一覆蓋位置之示意圖； 第2Β圖係電動光圈位於第二覆蓋位置之示意圖； 第3Α圖係電動閥位於第一覆蓋位置之示意圖； 1334334 第3B圖係電動閥位於第二覆蓋位置之示意圖； 第4A圖係另一電動閥位於第一覆蓋位置之示意圖； 第4B圖係另一電動閥位於第二覆蓋位置之示意圖； 第5圖係為本發明之散熱模組第二實施例示意圖； 第6圖係為本發明之散熱模組第三實施例示意圖；以及 第7圖係為本發明之散熱模組第四實施例示意圖。 【主要元件符號說明】h 扃 3 corresponds to air inlet 21; switch valve 24 = between fan 23 and air inlet 21, Kai Qian 4 is adapted to be driven to cover the part; controller 25 is electrically connected to the on-off valve 24, control The controller 74 = the rotational speed of the fan η' and according to the rotational speed of the fan 23 to control the degree to which the on-off valve 21 is plunged into the tuyere 21. When the controller 25 makes the speed of the fan increase, 'the drive-off 22 operates in the first-covering position to form the first opening, and the controller 25 biases the J to the speed of the fan 23 to reduce the speed of the fan 23 to drive the on-off valve 24 to actuate. The second opening is formed at the first-covering position, and the first opening is larger than the second opening. The on-off valve 24 can be an electric aperture or an electric valve. When the % of the switch is electric light, refer to "2nd map" and "2nd 8th" for the 26th month. The electric aperture is located at the first cover position. The electric money 26 is disposed between the fan 23 and the person vent 21, and the electric diaphragm 26 includes a plurality of blades 27. When the temperature in the electronic device casing 22 rises, the speed of the electronic device, that is, the control fan 23, increases. At this time, the controller 25 detects an increase in the rotational speed and drives the electric aperture 26, so that the electric aperture 跖 simultaneously scales the plurality of blades. 27 to the first covering position to form a first opening as shown. Please refer to "2nd Diagram" and "2nd Diagram" for a schematic view of the electric aperture in the first coverage position. The electric aperture 26 is covered by the air inlet 21, and the !334334 electric aperture 26 includes a right drop such that the electrons occupy a blade 27. When the temperature in the casing 22 of the electronic device is crying for 25 S, that is, the rotation speed of the control fan 23 is decreased, the control is simultaneously dark (four) to decrease the rotation speed and drive the electric aperture 26 to make the electric aperture 26; ^__ 27 To the second cover position 3_ into the first opening as shown. The first opening and the second opening refer to the human air outlet a! The air is circulated into the surface of the electronic device casing 22 by the electric aperture eight air outlet 21, which can be seen from the "second map" and the "second beta map". It is understood that the first opening is larger than the second opening. = The design of the first opening σ is greater than the second opening by (1), so that when the wind (four) speed ί is low, the electric traction 26 is located in the second coverage position, so that the human air outlet 21 is covered ==, meaning that the airflow can flow in. The area becomes smaller, and therefore, the amount of dust that can be taken into the electronic device is less than that of the larger opening state, and the object of the present invention is achieved. The on-off valve 24 of the present invention may also be an electric valve 32. Please refer to "3α map", "3rd map" is a schematic diagram of the electric room located at the first coverage position. The electric reading & setting is disposed between the fan 23 and the human air outlet 21, and the electric_& has a flat panel % and a moving rail 34. When the temperature in the electronic device casing 22 rises, so that the electronic farm controls the speed of the fan 23 to increase, the controller 25 _ speed increases and drives the electric _ 32, so that the electric _ 32 moves the slab to the Μ The first to cover position 35 is formed to form a first opening as shown. Please refer to Fig. 3'''''''''''''''''' When the temperature in the electronic device casing 22 drops, the rotation speed of the electric fan 1334334 is reduced, and at this time, the control @25 is reduced to the rotation speed and drives the electric valve 32, so that the electric valve 32 moves the plate to move. Track % to second cover position 37 to form a second opening as shown. The first opening and the second opening refer to the size of the area in which the air vent 21 can be circulated into the casing 22 of the electronic device after the human air vent 21 is covered by the electric valve 32, from the "SA map" and the "first sin" It can be seen in the figure that 'the first opening is larger than the second opening. By the design of the first larger than the second opening σ, when the rotation speed of the fan 23 is lowered, the electric cymbal 32 is located at the second covering position 37, so that the air inlet 21 is covered = the area becomes larger, that is, the available red __ Small, therefore, can be called by the airflow f into the electronic device to shout the amount of dust, she is less in the case of the case. - month reference S4A diagram", "4th diagram" is a schematic diagram of another electric valve in the first coverage position. The electric valve 32 is disposed on the fan 23 and the air inlet Μ ^ The electric circuit 2 includes a flat plate 4g having a complex __9 and a decorative raft. The tuyere 2i has a plurality of heat dissipation holes 42. When the temperature of the electronic device in the electronic device casing is controlled to increase the rotational speed of the fan 23, at this time, the control device is woven, and the plate is moved to a plurality of openings 39. The sound of the position of the bribe 41 is "4B". The other electric room is located between the second cover and the electric money is between the 23 and the money σ. When the electron = the plate 4G with the plurality of holes 39 and the movement Track 41. The temperature top in the device correction 22 causes the electronic loading control fan η to control the (four) 25 side to the rotation speed and drive the electric W 5 flute to move the flat plate 40 with the plurality of openings 39 to form, for example, cover The position 45' is such that the plurality of openings 39 and the plurality of heat dissipation holes 42 are not open to the second opening. After the first opening and the second opening are directed into the two-way valve 32, the size of the air inlet 21 _ air circulated into the electronic device f can be seen from the "4th drawing" and "4th drawing" The first opening is larger than the second opening. By the design that the first π is larger than the second opening σ, when the speed of the fan 23 is lowered, the electric valve 32 is located at the second covering position 45, so that the area I covered by the air inlet 21 is too large to be supplied. The area becomes smaller, and therefore, the amount of dust that can be brought into the electronic device by the airflow is less than the purpose of the present case. The heat dissipation module of the present invention is applied to an electronic device, such as a desktop computer, a notebook computer, an electronic device, and the like. When the temperature inside the electronic package a rises and the rotation speed of the fan 23 increases, the controller 25 detects an increase in the rotational speed and drives the on-off valve 24, so that the opening and closing valve 24 increases the opening, so that more external low-temperature air is The fan 23 is driven into the casing 22 of the electronic device, and is convected with the high temperature air in the casing 22 of the electronic device to achieve the effect of dissipating heat; when the temperature in the casing 22 of the electronic device is lowered and the rotation speed of the fan 23 is slowed down, The controller 25 detects the decrease in the rotational speed and drives the on-off valve 24' to cause the switch 阙24 to reduce the opening so that the area where the air inlet 21 is covered becomes larger, meaning that the cross-sectional area for the inflow of the airflow becomes smaller, and therefore, The amount of dust that the airflow brings into the electronic device is less than that of the larger opening state, achieving the purpose of the present case. 1334334 »月参,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The main difference between the second embodiment of the present invention and the first embodiment is that the air inlet 21 of the present embodiment is located between the fan 23 and the switch room 24, and the air inlet port 21 is covered by the switch valve 24. Other features and functions are the same as those of the first embodiment, and will not be described herein. Please refer to "Figure 6", "Figure 6" is the third implementation of the thermal module of the present invention. This is a scatter-based electronic device towel, such as a desktop computer, a #note computer, a portable electronic device, and the like. The heat dissipation module of the present invention is disposed in an electronic device casing 52 having an air inlet 51. The heat dissipation module includes: a fan, an on/off valve 54 and a controller 55. The fan % corresponds to the air inlet 51; the switch room 54 is disposed between the fan 53 and the air inlet 51, and the switch room 54 is adapted to be driven to cover the portion of the air inlet 51. The controller 55 is electrically connected to the on-off valve 54. The controller 55 is configured to measure the rotational speed of the fan 53, and according to the rotational speed of the fan 53, controls the switch to cover the degree of the air inlet 51. When the controller 55 detects that the rotation speed of the fan 53 is increased by φ, the driving switch 54 is actuated to operate at the first covering position to form a first opening, and the control benefit 55 detects that the rotation speed of the fan 53 is reduced to drive The switching valve 54 is actuated in the second covering position to form a second opening, and the first opening is larger than the second opening. The on-off valve 54 may be an electric aperture 26 (see "second diagram" or "second diagram") or an electric valve 32 (refer to "third diagram", "first" as in the first embodiment. 3Β图” or “4Α图”, “第4Β图”). The heat dissipation module of the present invention is applied to an electronic device, such as a desktop computer, a notebook computer, a portable electronic device, and the like. The controller 55 drives the fan 53 by the controller 55 1334334 to increase the rotational speed of the wind 4 53 when the operating frequency of the components in the electronic device is too high or the temperature in the electronic device casing 52 rises. At this time, the controller 55 simultaneously Actuating the on-off valve 54 to actuate' causes the on-off valve 54 to increase the opening, so that more external low-temperature air is driven by the fan 53 into the electronic device casing 52, and the wire flows with the high temperature within the electronic device casing. The effect of Newheat; when the internal temperature of the electronic device casing 52 is lowered, the fan 53 is driven by the controller 55 to reduce the rotation speed of the fan 53, and the control 55 is operated by the coaxial coaxial 54, and the Laiguan 54 reduces the opening. The area covered by the obscurant wind α 21 becomes larger, meaning that the cross section of the airflow can be reduced. Therefore, the amount of dust that can be brought into the electronic device by the airflow is less than that of the larger opening state. The purpose of this case. Please refer to "FIG. 7" and "FIG. 7" for the fourth embodiment of the heat dissipation module of the present invention. The main difference between the third embodiment of the present invention and the third embodiment is that the human air outlet 51 of the present embodiment is located. The county 53 is closed between the 54 and the air inlet 51 is covered by the _valve 54. Other features are the same as those of the third embodiment, and will not be described herein. The present invention has been described above with reference to the preferred embodiments thereof, and is not intended to limit the invention. Any skilled person can make some modifications and refinements without departing from the spirit and scope of the present invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a first embodiment of a heat dissipation module of the present invention; FIG. 2 is a schematic view of the electric aperture at a first coverage position; and FIG. 2 is an electric aperture of a second coverage position; Schematic diagram; Figure 3 is a schematic view of the electric valve in the first covering position; 1334334 Figure 3B is a schematic view of the electric valve in the second covering position; Figure 4A is a schematic view of the other electric valve in the first covering position; Figure 5 is a schematic view showing a second embodiment of the heat-dissipating module of the present invention; Figure 6 is a schematic view showing a third embodiment of the heat-dissipating module of the present invention; The figure is a schematic view of a fourth embodiment of the heat dissipation module of the present invention. [Main component symbol description]
21 .........................入風口 22 .........................電子裝置機殼 23 .........................風扇 24 .........................開關閥 25 .........................控制器 26 .........................電動光圈 27 .........................葉片 28 .........................第一覆蓋位置21 .........................Air inlet 22 ..................... ....Electronic device housing 23 .........................fan 24 .............. ........... Switching valve 25 .........................controller 26 ........ .................Electric aperture 27 .........................blade 28 ... ......................first coverage location
30.........................第二覆蓋位置 32 .........................電動閥 33 .........................平板 34 .........................移動軌道 35 .........................第一覆蓋位置 37.........................第二覆蓋位置 39 .........................開孔 40 .........................平板 13 1334334 41 .........................移動執道 42 .........................散熱孔 43 .........................第一覆蓋位置 45.........................第二覆蓋位置 51 .........................入風口 52 .........................電子裝置機殼 53 .........................風扇 54 .........................開關閥 55 控制器30.........................Second coverage position 32 ................... ... electric valve 33 ......................... flat 34 .............. ...........moving track 35 .........................first coverage position 37... ...................Second coverage position 39 ......................... Hole 40 ......................... Flat 13 1334334 41 ................... ... mobile obstruction 42 ......................... vents 43 ............ .............first coverage position 45.........................second coverage location 51.. .......................Air inlet 52 ........................ .Electronic device housing 53 .........................fan 54 ................. ........ switch valve 55 controller