CN113488427A - Automatic loading equipment for high-cleanliness semiconductor wafer - Google Patents
Automatic loading equipment for high-cleanliness semiconductor wafer Download PDFInfo
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- CN113488427A CN113488427A CN202111042813.3A CN202111042813A CN113488427A CN 113488427 A CN113488427 A CN 113488427A CN 202111042813 A CN202111042813 A CN 202111042813A CN 113488427 A CN113488427 A CN 113488427A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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Abstract
The invention relates to the technical field of semiconductors, and discloses high-cleanliness automatic semiconductor wafer loading equipment which comprises an electromechanical box, a main box body arranged on one side of the electromechanical box and an auxiliary box body arranged on the other side of the electromechanical box, wherein the upper end of the electromechanical box is provided with a taking mechanism, one side of the main box body is provided with a sealing mechanism and a conveying mechanism, one end of the conveying mechanism is connected with the inner wall of the main box body, a lifting mechanism is arranged inside the auxiliary box body, clamping plates are placed on two sides of a loading box group by utilizing the extension of a main telescopic rod, the loading box group is lifted upwards by utilizing a lifting rod, when the loading box group moves to a loosening opening, an electromagnetic disc is attached with the same magnetism, so that repulsion force can be generated, the two groups of clamping plates are separated, the loading box group can move upwards and pass through the loosening opening, and the loosening opening can only pass through from bottom to top, therefore, the loading preparation of the loading box group is realized, the automation degree is higher, and the labor is saved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to automatic loading equipment for a high-cleanliness semiconductor wafer.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the raw material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and doped into a silicon crystal seed crystal, then the silicon crystal seed crystal is slowly pulled out to form cylindrical monocrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely the wafer. At present, domestic wafer production lines are mainly 8 inches and 12 inches.
After the production of the wafer is completed, the wafer needs to be loaded, the automatic degree of the existing loading equipment is low in the working process, manual operation is excessive, so that the contact between the wafer and the outside is more, the overall quality of the wafer is affected, secondly, in the production process, some wafers have flaws and are difficult to find, the damaged wafers are packaged and used, and the use quality in the later period is affected.
Therefore, an automatic loading device for high-cleanliness semiconductor wafers is provided.
Disclosure of Invention
The invention aims to provide high-cleanliness automatic loading equipment for semiconductor wafers, which solves the problems that the conventional loading equipment in the background art has low automation degree and is slightly subjected to manual operation in the working process, so that the wafers are in more contact with the outside, the overall quality of the wafers is influenced, and secondly, in the production process, the damaged wafers are packaged and used due to the defects and are difficult to find, and the later use quality is influenced.
In order to achieve the purpose, the invention provides the following technical scheme: the automatic loading equipment for the high-cleanliness semiconductor wafer comprises an electromechanical box, a main box body and an auxiliary box body, wherein the main box body is arranged on one side of the electromechanical box, the auxiliary box body is arranged on the other side of the electromechanical box, a taking mechanism is arranged at the upper end of the electromechanical box, a sealing mechanism and a conveying mechanism are arranged on one side of the main box body, one end of the conveying mechanism is connected with the inner wall of the main box body, a lifting mechanism is arranged inside the main box body, and a lifting mechanism is arranged inside the auxiliary box body;
lift up the mechanism including setting up the one-level guide rail plate on vice box inner wall, set up the one-level guide block at one-level guide rail plate inside, main telescopic link and the lifter of setting on one-level guide block surface, and set up the second grade guide rail plate in main telescopic link one end, the inside of second grade guide rail plate is provided with butt joint spring and second grade guide block, the both ends of butt joint spring all are connected with the second grade guide block, be provided with splint on the surface of second grade guide block, one side of second grade guide block is provided with the electromagnetic disk, it is provided with two sets ofly to lift up the mechanism, and opposition sets up.
Further, the main tank body is including seting up the feeding notch in main tank body one side, set up the electromagnetism strip C in main tank body one side, set up the supporting spring on electric magnetic stripe C surface, and set up the face notch at the main tank body upper surface, the inside notch has been seted up to the inside of face notch, the inside of interior notch is provided with the shutoff board, the shutoff board is provided with two sets ofly, two sets of shutoff board opposition sets up, and two sets of shutoff board one side all is provided with the screens frid, the screens frid is the component that a sponge material made, the one end of shutoff board is connected with the catch bar that sets up in face notch inside.
Furthermore, the lifting mechanism comprises a bottom barrel arranged at the bottom of the main box body, a pneumatic telescopic pipe C arranged inside the bottom barrel and a placing plate arranged at the upper end of the pneumatic telescopic pipe C, wherein an installation column is arranged on the upper surface of the placing plate, and a detection meter is arranged on the outer surface of the installation column.
Further, the inside of detector is provided with processing module, processing module's inside is provided with pollutant detection module, one side of pollutant detection module is provided with slip line detection module, one side of slip line detection module is provided with mechanical damage detection module, one side signal connection of mechanical damage detection module has feedback module, detect whether there is granule or pollutant on the wafer surface through pollutant detection module, whether there is the defect in the slip line through slip line detection module detection wafer surface, whether there is the mar on wafer surface through mechanical damage detection module detection at last, recycle feedback module at last and feed back the result that detects to external removal end.
Further, conveying mechanism sets up the delivery board in curb plate one side including setting up the curb plate on the feeding notch inner wall, sets up the T type piece in the delivery board both sides to and run through the check lock lever of setting in the curb plate inside, the curb plate is connected with the feeding notch through the check lock lever, is provided with T type groove on the surface of curb plate, the delivery board passes through T type piece and T type groove swing joint.
Furthermore, the conveying mechanism further comprises a pneumatic telescopic pipe B arranged on one side of the T-shaped block, a gas collecting disc arranged at one end of the pneumatic telescopic pipe B and a connecting hose arranged on the outer surface of the gas collecting disc, the gas collecting disc is communicated with the pneumatic telescopic pipe C through the connecting hose, an electromagnetic cylinder is arranged at one end of the gas collecting disc, an extrusion spring is arranged inside the electromagnetic cylinder, one end of the extrusion spring is connected with the gas collecting disc, one side of the electromagnetic cylinder is connected with the inner wall of the main box body, and the electromagnetic cylinder is magnetically connected with the gas collecting disc.
Further, the taking mechanism comprises a rotating rod arranged on the upper surface of the motor case, a lantern ring sleeved on the outer surface of the rotating rod, a supporting rod arranged on the outer surface of the lantern ring, a sleeve arranged on the outer surface of the supporting rod, a connecting plate arranged at the lower end of the sleeve, and a telescopic taking pipe arranged at the lower end of the connecting plate, wherein a sucker is arranged at the lower end of the telescopic taking pipe, and the sucker is connected with an external air pump.
Furthermore, an electric push rod is arranged inside the supporting rod, a round magnetic disc is arranged at one end of the electric push rod and is magnetically connected with the sleeve, one end of the rotating rod is connected with a motor arranged inside the motor box, two groups of supporting rods are arranged, and the two groups of supporting rods correspond to the main box body and the auxiliary box body respectively.
Furthermore, the auxiliary box body comprises an auxiliary groove arranged on the upper surface of the auxiliary box body, a tightness opening arranged inside the auxiliary groove, and an overhauling notch arranged on the outer surface of the auxiliary box body, wherein a loading box group is arranged inside the auxiliary box body, and the auxiliary groove and the loading box group are arranged in the same vertical plane.
Furthermore, the sealing mechanism comprises a sealing plate arranged on one side of the main box body, an electromagnetic bar B arranged on one side of the sealing plate and a sealing cover arranged on the other side of the sealing plate, the sealing plate is magnetically connected with the electromagnetic bar C through the electromagnetic bar B, and one end of the supporting spring is connected with the sealing plate.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention provides high-cleanliness automatic semiconductor wafer loading equipment, wherein a primary guide rail plate is arranged on the inner wall of a secondary box body, a primary guide block is arranged inside the primary guide rail plate, a main telescopic rod and a lifting rod are arranged on the outer surface of the primary guide block, a secondary guide rail plate is arranged at one end of the main telescopic rod, a butt joint spring and a secondary guide block are arranged inside the secondary guide rail plate, two ends of the butt joint spring are connected with the secondary guide block, a clamping plate is arranged on the outer surface of the secondary guide block, electromagnetic discs are arranged on one side of the secondary guide block, two groups of lifting mechanisms are arranged and are oppositely arranged, a secondary groove is arranged on the upper surface of the secondary box body, a loosening port is arranged inside the secondary groove, an overhauling notch is arranged on the outer surface of the secondary box body, a loading box group is arranged inside the secondary box body, the secondary groove and the loading box group are arranged in the same vertical plane, and the clamping plates are arranged on two sides of the loading box group by utilizing the extension of the main telescopic rod, the loading box set is lifted upwards by the aid of the lifting rod, the electromagnetic disc is attached with the same magnetism when the loading box set is moved to the elastic opening, so that repulsive force can be generated, two groups of clamping plates are separated, the loading box set can move upwards and penetrate through the elastic opening, the elastic opening can only penetrate from bottom to top, loading preparation of the loading box set is achieved, automation degree is high, and labor is saved.
2. The invention provides an automatic loading device for high-cleanliness semiconductor wafers, wherein a side plate is arranged on the inner wall of a feeding notch, a conveying plate is arranged on one side of the side plate, T-shaped blocks are arranged on two sides of the conveying plate, a locking rod penetrates through the inside of the side plate, the side plate is connected with the feeding notch through the locking rod, a T-shaped groove is arranged on the outer surface of the side plate, the conveying plate is movably connected with the T-shaped groove through the T-shaped block, a pneumatic telescopic pipe B is arranged on one side of the T-shaped block, an air collecting disc is arranged at one end of the pneumatic telescopic pipe B, a connecting hose is arranged on the outer surface of the air collecting disc, the air collecting disc is communicated with the pneumatic telescopic pipe C through the connecting hose, an electromagnetic cylinder is arranged at one end of the air collecting disc, an extrusion spring is arranged inside the electromagnetic cylinder, one end of the extrusion spring is connected with the air collecting disc, one side of the electromagnetic cylinder is connected with the inner wall of a main box body, and the electromagnetic cylinder is magnetically connected with the air collecting disc, a bottom cylinder is arranged at the bottom of the main box body, a pneumatic telescopic pipe C is arranged in the bottom cylinder, a placing plate is arranged at the upper end of the pneumatic telescopic pipe C, an installation column is arranged on the upper surface of the placing plate, a detection meter is arranged on the outer surface of the installation column, a wafer is placed on the upper surface of the conveying plate, the conveying plate moves towards the interior of the main box body by utilizing the contraction of the pneumatic telescopic pipe B, the gas in the pneumatic telescopic pipe B is extruded and can move towards the pneumatic telescopic pipe C, when the conveying plate corresponds to the placing plate, the magnetism of the electromagnetic cylinder disappears, the pneumatic telescopic pipe B and the gas collecting disc can be outwards bounced by the elasticity of an extrusion spring, meanwhile, the locking rod is released, the side plate can incline towards one side of the electromagnetic cylinder, the wafer on the surface of the conveying plate can fall onto the placing plate, finally, the wafer is adsorbed by utilizing a sucking disc, the taking of the wafer is completed, and the automation degree of the whole process is higher, the working time is saved, and the contact with the outside is less, so the probability of the wafer being polluted is lower.
3. The invention provides high-cleanliness automatic loading equipment for semiconductor wafers, wherein a sealing plate is arranged on one side of a main box body, an electromagnetic strip B is arranged on one side of the sealing plate, a sealing cover is arranged on the other side of the sealing plate, the sealing plate is magnetically connected with an electromagnetic strip C through the electromagnetic strip B, one end of a supporting spring is connected with the sealing plate, an inner notch is formed in the surface notch, two groups of sealing plates are arranged in the inner notch, the two groups of sealing plates are oppositely arranged, clamping groove plates are arranged on one sides of the two groups of sealing plates, each clamping groove plate is a component made of sponge materials, one end of each sealing plate is connected with a push rod arranged in the surface notch, the sealing plate is connected with the main box body in the working process, the sealing of a feeding notch is completed, the probability of contacting with the outside is reduced, the quality of the wafers is improved, and the sealing plates are contacted through the clamping groove plates, the two groups of plugging plates are more sealed, and the improvement of the quality of the wafer is facilitated.
4. The invention provides high-cleanliness automatic semiconductor wafer loading equipment, wherein a processing module is arranged inside a detector, a pollutant detection module is arranged inside the processing module, a slip line detection module is arranged on one side of the pollutant detection module, a mechanical damage detection module is arranged on one side of the slip line detection module, a feedback module is connected with one side of the mechanical damage detection module through a signal, detecting whether particles or pollutants exist on the surface of the wafer through a pollutant detection module, detecting whether defects exist on slip lines on the surface of the wafer through a slip line detection module, finally detecting whether scratches exist on the surface of the wafer through a mechanical damage detection module, finally feeding back the detection result to an external moving end through a feedback module, and through detection, the quality of the whole wafer can be known quickly, and the damaged wafer is prevented from being accidentally put into the market for use in the loading process.
Drawings
FIG. 1 is a schematic diagram of the overall structure of an automatic high-cleanliness semiconductor wafer loading apparatus according to the present invention;
FIG. 2 is a schematic structural view of a main box of the automatic high-cleanliness wafer loading apparatus according to the present invention;
FIG. 3 is a schematic view of the structure of the sub-box of the automatic high-cleanliness wafer loading apparatus of the present invention;
FIG. 4 is a schematic view of the structure of the pick-up mechanism of the automatic high-cleanliness semiconductor wafer loading apparatus according to the present invention;
FIG. 5 is a schematic diagram of a lifting mechanism of the automatic high-cleanliness semiconductor wafer loading apparatus according to the present invention;
FIG. 6 is a schematic structural view of a conveying mechanism of an automatic high-cleanliness semiconductor wafer loading apparatus according to the present invention;
FIG. 7 is a schematic view of a lifting mechanism of the automatic high-cleanliness wafer loading apparatus according to the present invention;
FIG. 8 is a schematic diagram of a high-cleanliness semiconductor wafer loader enclosure according to the present invention;
FIG. 9 is an enlarged view of the high-cleanliness automatic loading apparatus for semiconductor wafers of the present invention as shown in FIG. 2A;
FIG. 10 is a block diagram of the process steps for a high-cleanliness semiconductor wafer auto-loader processing module according to the present invention.
In the figure: 1. a main box body; 11. a feed chute; 12. an electric magnetic stripe C; 13. a support spring; 14. a face notch; 141. an inner notch; 142. a plugging plate; 143. a clamping groove plate; 2. an auxiliary box body; 21. a secondary groove; 22. an elastic opening; 23. overhauling the notch; 24. loading a box group; 3. an electromechanical box; 4. a fetching mechanism; 41. a rotating rod; 42. a collar; 43. a strut; 431. an electric push rod; 432. a circular magnetic disk; 44. a sleeve; 45. a connecting plate; 46. a telescopic fetching tube; 47. a suction cup; 5. a sealing mechanism; 51. a closing plate; 52. a closure cap; 53. an electric magnetic stripe B; 6. a conveying mechanism; 61. a conveying plate; 62. a T-shaped block; 63. a side plate; 631. a T-shaped groove; 64. a locking lever; 65. a pneumatic telescopic pipe B; 66. a gas collecting tray; 67. a connecting hose; 68. an electromagnetic cylinder; 69. a compression spring; 7. a lifting mechanism; 71. a bottom cylinder; 72. a pneumatic telescopic pipe C; 73. placing the plate; 74. mounting a column; 75. a detector; 76. a processing module; 761. a contaminant detection module; 762. a slip line detection module; 763. a mechanical damage detection module; 764. a feedback module; 8. a lifting mechanism; 81. a first stage guide rail plate; 82. a first-stage guide block; 83. a main telescopic rod; 84. a lifting rod; 85. a secondary guide rail plate; 86. a docking spring; 87. a secondary guide block; 88. a splint; 89. an electromagnetic disk.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, an automatic loading device for high-cleanliness semiconductor wafers comprises an electromechanical box 3, a main box body 1 arranged on one side of the electromechanical box 3, and an auxiliary box body 2 arranged on the other side of the electromechanical box 3, wherein a taking mechanism 4 is arranged at the upper end of the electromechanical box 3, a sealing mechanism 5 and a conveying mechanism 6 are arranged on one side of the main box body 1, one end of the conveying mechanism 6 is connected with the inner wall of the main box body 1, a lifting mechanism 7 is arranged inside the main box body 1, and a lifting mechanism 8 is arranged inside the auxiliary box body 2.
Referring to fig. 5, the lifting mechanism 8 includes a first-stage guide rail plate 81 disposed on the inner wall of the sub-housing 2, a first-stage guide block 82 disposed inside the first-stage guide rail plate 81, a main telescopic rod 83 and a lifting rod 84 disposed on the outer surface of the first-stage guide block 82, and a second-stage guide rail plate 85 disposed at one end of the main telescopic rod 83, a docking spring 86 and a second-stage guide block 87 are disposed inside the second-stage guide rail plate 85, the two ends of the docking spring 86 are connected to the second-stage guide block 87, a clamping plate 88 is disposed on the outer surface of the second-stage guide block 87, an electromagnetic disc 89 is disposed at one side of the second-stage guide block 87, two sets of lifting mechanisms 8 are oppositely disposed, the clamping plates 88 are disposed at both sides of the loading box set 24 by the extension of the main telescopic rod 83, the loading box set 24 is lifted upward by the lifting rod 84, the electromagnetic disc 89 is attached with the same magnetism when moving to the position of the slack opening 22, thereby generating a repulsive force, make the separation of two sets of splint 88 for loading box group 24 can the rebound, and pass elasticity mouth 22, and elasticity mouth 22 can only pass from bottom to top, thereby realizes loading box group 24's loading preparation, and degree of automation is higher, saves labour.
Referring to fig. 2, 7, 9 and 10, the main body 1 includes a feed slot 11 formed at one side of the main body 1, an electromagnetic bar C12 disposed at one side of the main body 1, a support spring 13 disposed on the outer surface of the electromagnetic bar C12, and a face slot 14 disposed at the upper surface of the main body 1, an inner slot 141 is formed in the face slot 14, a blocking plate 142 is disposed in the inner slot 141, two sets of blocking plates 142 are disposed, the two sets of blocking plates 142 are oppositely disposed, a blocking slot plate 143 is disposed at one side of each of the two sets of blocking plates 142, the blocking slot plate 143 is a member made of sponge material, one end of the blocking plate 142 is connected to a push rod disposed in the face slot 14, the lifting mechanism 7 includes a bottom cylinder 71 disposed at the bottom of the main body 1, a pneumatic telescopic tube C72 disposed in the bottom cylinder 71, and a placing plate 73 disposed at the upper end of the pneumatic telescopic tube C72, the upper surface of the placing plate 73 is provided with a mounting column 74, the outer surface of the mounting column 74 is provided with a detector 75, the inside of the detector 75 is provided with a processing module 76, the inside of the processing module 76 is provided with a pollutant detection module 761, one side of the pollutant detection module 761 is provided with a slip line detection module 762, one side of the slip line detection module 762 is provided with a mechanical damage detection module 763, one side of the mechanical damage detection module 763 is in signal connection with a feedback module 764, whether particles or pollutants exist on the surface of the wafer through the pollutant detection module 761, whether the slip line on the surface of the wafer is defective through the slip line detection module 762 is detected, whether scratches exist on the surface of the wafer through the mechanical damage detection module 763 is detected, the detection result is fed back to an external moving end through the feedback module 764, the overall quality of the wafer can be rapidly known through detection, and the damaged wafers are prevented from being accidentally put into the market during the loading process.
Referring to fig. 6, the conveying mechanism 6 includes a side plate 63 disposed on an inner wall of the feeding slot 11, a conveying plate 61 disposed on one side of the side plate 63, T-shaped blocks 62 disposed on both sides of the conveying plate 61, and a locking rod 64 penetrating the side plate 63, the side plate 63 is connected to the feeding slot 11 through the locking rod 64, a T-shaped slot 631 is disposed on an outer surface of the side plate 63, the conveying plate 61 is movably connected to the T-shaped slot 631 through the T-shaped block 62, the conveying mechanism 6 further includes a pneumatic extension tube B65 disposed on one side of the T-shaped block 62, a gas collection tray 66 disposed at one end of the pneumatic extension tube B65, and a connection hose 67 disposed on an outer surface of the gas collection tray 66, the gas collection tray 66 is communicated with the pneumatic extension tube C72 through the connection hose 67, an electromagnetic cylinder 68 is disposed at one end of the gas collection tray 66, an extrusion spring 69 is disposed inside the electromagnetic cylinder 68, one end of the extrusion spring 69 is connected to the gas collection tray 66, one side of the electromagnetic cylinder 68 is connected with the inner wall of the main box body 1, the electromagnetic cylinder 68 is magnetically connected with the gas collecting disc 66, the wafer is placed on the upper surface of the conveying plate 61, the conveying plate 61 moves towards the inner part of the main box body 1 by utilizing the contraction of the pneumatic telescopic pipe B65, and the gas in pneumatic bellows B65 is squeezed to move into pneumatic bellows C72, when the conveying plate 61 corresponds to the placing plate 73, the magnetism of the electromagnetic cylinder 68 is lost, the pneumatic telescopic tube B65 and the air collecting tray 66 are outwardly sprung by the elastic force of the pressing spring 69, meanwhile, the locking rod 64 is released, the side plate 63 inclines to one side of the electromagnetic cylinder 68, the wafer on the surface of the conveying plate 61 falls onto the placing plate 73, finally the wafer is absorbed by the suction cup 47, the wafer is taken, the automation degree of the whole process is higher, the working time is saved, and the contact with the outside is less, so the probability of the wafer being polluted is lower.
Referring to fig. 3, 4 and 8, the taking mechanism 4 includes a rotating rod 41 disposed on the upper surface of the electronic box 3, a sleeve ring 42 sleeved on the outer surface of the rotating rod 41, a support rod 43 disposed on the outer surface of the sleeve ring 42, a sleeve 44 disposed on the outer surface of the support rod 43, a connecting plate 45 disposed at the lower end of the sleeve 44, and a telescopic taking pipe 46 disposed at the lower end of the connecting plate 45, a suction cup 47 is disposed at the lower end of the telescopic taking pipe 46, the suction cup 47 is connected with an external air pump, an electric push rod 431 is disposed inside the support rod 43, a circular disk 432 is disposed at one end of the electric push rod 431, the circular disk 432 is magnetically connected with the sleeve 44, one end of the rotating rod 41 is connected with a motor disposed inside the electronic box 3, and two sets of the support rods 43 are disposed, the two sets of the support rods 43 respectively correspond to the main box 1 and the auxiliary box 2, the auxiliary box 2 includes an auxiliary groove 21 disposed on the upper surface of the auxiliary box 2, a tension opening 22 arranged inside the auxiliary tank 21 and an inspection notch 23 arranged on the outer surface of the auxiliary tank 2, a loading box group 24 is arranged inside the auxiliary tank 2, the auxiliary tank 21 and the loading box group 24 are arranged in the same vertical plane, the sealing mechanism 5 comprises a sealing plate 51 arranged on one side of the main tank 1 and an electromagnetic strip B53 arranged on one side of the sealing plate 51, and a closing cover 52 disposed at the other side of the closing plate 51, the closing plate 51 being magnetically connected to an electromagnetic bar C12 through an electromagnetic bar B53, one end of the supporting spring 13 being connected to the closing plate 51, in the working process, the closing plate 51 is connected with the main box body 1 to complete the closing of the feeding notch 11, reduce the probability of contacting with the outside, improve the quality of the wafer, and the plugging plates 142 are contacted through the clamping groove plate 143, so that the two groups of plugging plates 142 are more sealed, and the improvement of the wafer quality is also facilitated to a certain extent.
The working principle is as follows: the wafer is placed on the upper surface of the conveying plate 61, the conveying plate 61 moves towards the interior of the main box body 1 by utilizing the contraction of the pneumatic telescopic pipe B65, the gas in the pneumatic telescopic pipe B65 moves towards the pneumatic telescopic pipe C72 by being extruded, when the conveying plate 61 corresponds to the placing plate 73, the magnetism of the electromagnetic cylinder 68 disappears, the pneumatic telescopic pipe B65 and the air collecting tray 66 bounce outwards by the elasticity of the extrusion spring 69, simultaneously the locking rod 64 is loosened, the side plate 63 inclines towards one side of the electromagnetic cylinder 68, the wafer on the surface of the conveying plate 61 falls onto the placing plate 73, finally the wafer is adsorbed by the sucking disc 47 to finish the taking of the wafer, the clamping plates 88 are placed on the two sides of the loading box group 24 by utilizing the extension of the main telescopic rod 83, the loading box group 24 is lifted upwards by utilizing the lifting rod 84, when the conveying plate 61 moves to the loosening port 22, the electromagnetic disc 89 is attached with the same magnetism, thus, repulsion force is generated, the two groups of clamping plates 88 are separated, the loading box group 24 can move upwards and pass through the elastic opening 22, the elastic opening 22 can only pass through from bottom to top, loading preparation of the loading box group 24 is realized, and finally the rotating rod 41 is rotated, so that wafers fall into the loading box group 24 to complete integral loading.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. The utility model provides a high cleanliness factor semiconductor wafer automatic loading equipment, includes electromechanical case (3), sets up main tank (1) in electromechanical case (3) one side to and set up vice box (2) in electromechanical case (3) opposite side, its characterized in that: a taking mechanism (4) is arranged at the upper end of the electromechanical box (3), a sealing mechanism (5) and a conveying mechanism (6) are arranged on one side of the main box body (1), one end of the conveying mechanism (6) is connected with the inner wall of the main box body (1), a lifting mechanism (7) is arranged inside the main box body (1), and a lifting mechanism (8) is arranged inside the auxiliary box body (2);
lifting mechanism (8) including setting up one-level guide rail plate (81) on auxiliary box (2) inner wall, set up one-level guide block (82) inside one-level guide rail plate (81), main telescopic link (83) and lifter (84) of setting on one-level guide block (82) surface, and set up second grade guide rail plate (85) in main telescopic link (83) one end, the inside of second grade guide rail plate (85) is provided with butt joint spring (86) and second grade guide block (87), the both ends of butt joint spring (86) all are connected with second grade guide block (87), be provided with splint (88) on the surface of second grade guide block (87), one side of second grade guide block (87) is provided with electromagnetic disc (89), it is provided with two sets ofly to lift mechanism (8), and the opposition sets up.
2. The apparatus of claim 1, wherein: the main box body (1) comprises a feeding notch (11) formed in one side of the main box body (1), an electric magnetic stripe C (12) arranged on one side of the main box body (1), a supporting spring (13) arranged on the outer surface of the electric magnetic stripe C (12), and a face notch (14) arranged on the upper surface of the main box body (1), an inner notch (141) is formed in the face notch (14), plugging plates (142) are arranged in the inner notch (141), the plugging plates (142) are provided with two groups, the two groups of plugging plates (142) are oppositely arranged, clamping groove plates (143) are arranged on one sides of the two groups of plugging plates (142), the clamping groove plates (143) are members made of sponge materials, and one end of each plugging plate (142) is connected with a push rod arranged in the face notch (14).
3. The apparatus of claim 2, wherein: the lifting mechanism (7) comprises a bottom barrel (71) arranged at the bottom of the main box body (1), a pneumatic telescopic pipe C (72) arranged inside the bottom barrel (71), and a placing plate (73) arranged at the upper end of the pneumatic telescopic pipe C (72), wherein an installation column (74) is arranged on the upper surface of the placing plate (73), and a detector (75) is arranged on the outer surface of the installation column (74).
4. A high-cleanliness automatic semiconductor wafer loading apparatus as claimed in claim 3, wherein: the inside of detection meter (75) is provided with processing module (76), the inside of processing module (76) is provided with pollutant detection module (761), one side of pollutant detection module (761) is provided with slip line detection module (762), one side of slip line detection module (762) is provided with mechanical damage detection module (763), one side signal connection of mechanical damage detection module (763) has feedback module (764), detect whether there is granule or pollutant on the wafer surface through pollutant detection module (761), whether there is the defect in the slip line through slip line detection module (762) detection wafer surface, whether there is the mar on the wafer surface through mechanical damage detection module (763) detection at last, recycle feedback module (764) at last and feed back the result of detecting to external removal end.
5. The apparatus of claim 4, wherein: conveying mechanism (6) are including setting up curb plate (63) on feed slot opening (11) inner wall, set up delivery board (61) in curb plate (63) one side, set up T type piece (62) in delivery board (61) both sides, and run through and set up check lock lever (64) inside at curb plate (63), curb plate (63) are connected with feed slot opening (11) through check lock lever (64), be provided with T type groove (631) on the surface of curb plate (63), delivery board (61) are through T type piece (62) and T type groove (631) swing joint.
6. The apparatus of claim 5, wherein: the conveying mechanism (6) further comprises a pneumatic telescopic pipe B (65) arranged on one side of the T-shaped block (62), an air collecting disc (66) arranged at one end of the pneumatic telescopic pipe B (65), and a connecting hose (67) arranged on the outer surface of the air collecting disc (66), wherein the air collecting disc (66) is communicated with a pneumatic telescopic pipe C (72) through the connecting hose (67), one end of the air collecting disc (66) is provided with an electromagnetic cylinder (68), an extrusion spring (69) is arranged inside the electromagnetic cylinder (68), one end of the extrusion spring (69) is connected with the air collecting disc (66), one side of the electromagnetic cylinder (68) is connected with the inner wall of the main box body (1), and the electromagnetic cylinder (68) is magnetically connected with the air collecting disc (66).
7. The apparatus of claim 1, wherein: the taking mechanism (4) comprises a rotating rod (41) arranged on the upper surface of the electromechanical box (3), a sleeve ring (42) sleeved on the outer surface of the rotating rod (41), a support rod (43) arranged on the outer surface of the sleeve ring (42), a sleeve (44) arranged on the outer surface of the support rod (43), a connecting plate (45) arranged at the lower end of the sleeve (44), and a telescopic taking pipe (46) arranged at the lower end of the connecting plate (45), wherein a sucking disc (47) is arranged at the lower end of the telescopic taking pipe (46), and the sucking disc (47) is connected with an external air pump.
8. The apparatus of claim 7, wherein: an electric push rod (431) is arranged inside the support rod (43), a round disc (432) is arranged at one end of the electric push rod (431), the round disc (432) is magnetically connected with the sleeve (44), one end of the rotating rod (41) is connected with a motor arranged inside the electromechanical box (3), two groups of support rods (43) are arranged, and the two groups of support rods (43) respectively correspond to the main box body (1) and the auxiliary box body (2).
9. The apparatus of claim 1, wherein: the auxiliary box body (2) comprises an auxiliary groove (21) arranged on the upper surface of the auxiliary box body (2), a tightness opening (22) arranged inside the auxiliary groove (21), and an overhaul notch (23) arranged on the outer surface of the auxiliary box body (2), wherein a loading box group (24) is arranged inside the auxiliary box body (2), and the auxiliary groove (21) and the loading box group (24) are arranged in the same vertical plane.
10. The apparatus of claim 2, wherein: the closing mechanism (5) comprises a closing plate (51) arranged on one side of the main box body (1), an electromagnetic bar B (53) arranged on one side of the closing plate (51) and a closing cover (52) arranged on the other side of the closing plate (51), the closing plate (51) is magnetically connected with the electromagnetic bar C (12) through the electromagnetic bar B (53), and one end of the supporting spring (13) is connected with the closing plate (51).
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| CN113488427B (en) | 2021-11-02 |
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Effective date of registration: 20220630 Address after: 226406 room 432, No. 42, Guangzhou road, Zhongxing Street, development zone, Nantong, Jiangsu Province Patentee after: Nantong Yumi Laser Technology Co.,Ltd. Address before: 226000 No. 8, Yuanyuan Road, development zone, Nantong City, Jiangsu Province Patentee before: Jiangsu Yujing Photoelectric Technology Co.,Ltd. |