CN113481584A - Metal support polishing equipment and process - Google Patents
Metal support polishing equipment and process Download PDFInfo
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- CN113481584A CN113481584A CN202110778992.0A CN202110778992A CN113481584A CN 113481584 A CN113481584 A CN 113481584A CN 202110778992 A CN202110778992 A CN 202110778992A CN 113481584 A CN113481584 A CN 113481584A
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- polishing
- electrolytic
- metal
- control system
- metal support
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Abstract
The invention provides a metal support polishing device and a process, wherein the metal support polishing device comprises the following steps: an electronic control system; an electrolytic bath with a polishing solution therein; the electric control system is used for controlling the electrolytic polishing parameters in the polishing treatment, and the electrolytic polishing parameters comprise the temperature of the polishing liquid, the electrolytic polishing voltage and current of the metal support and the electrolytic polishing working mode. The technical scheme has the beneficial effects that the metal bracket can be directly subjected to electrolytic polishing without mechanical polishing, so that the time is saved, and the polishing efficiency is high; through the cooperation of the electric control system, the electrolytic bath and the polishing mechanism, the polished bracket has uniform size and bright surface and can achieve mirror surface effect; and various clamping tools and polishing modes are provided, and polishing processes can be reasonably selected according to different support structures.
Description
Technical Field
The invention relates to the technical field of electrochemical polishing, in particular to metal support polishing equipment and a metal support polishing process.
Background
The blood vessel stent used in the medical field is generally divided into a coronary stent, a renal artery stent, a cerebral vascular stent and a aortic blood vessel stent, a metal stent formed by a laser engraving process occupies a large proportion in the blood vessel stent, and after the metal stent is cut by laser or shaped by heat treatment, the surface of the metal stent has the defects of pits, scratches, burrs, an oxide layer and the like, and if the metal stent is directly implanted into a human body without treatment, the blood vessel stent can cause platelet adhesion in the blood vessel, easily forms thrombus and intimal hyperplasia, or easily scratches the blood vessel when the thrombus is mechanically removed by an intracranial thrombus removal stent. In particular, cardiac stents have a higher demand for surface roughness, and therefore, the cut or heat-treated stents need to be subjected to a polishing process. The traditional polishing mode is mechanical polishing, and the surface roughness of the bracket after mechanical polishing can not meet the requirement.
Disclosure of Invention
Aiming at the problems existing in the prior art for polishing the metal support, the metal support polishing equipment and the process aiming at improving the polishing efficiency are provided.
The specific technical scheme is as follows:
a metal carrier polishing apparatus, comprising:
an electronic control system;
an electrolytic bath with a polishing solution therein;
the electric control system is used for controlling the electrolytic polishing parameters in the polishing treatment, and the electrolytic polishing parameters comprise the temperature of the polishing liquid, the electrolytic polishing voltage and current of the metal support and the electrolytic polishing working mode.
Preferably, the electric control system comprises a refrigeration system, and the refrigeration system comprises a cooling tank, a circulating pipe and a temperature display;
the cooling tank can control the polishing liquid in the electrolytic tank to reach the polishing temperature required by the metal bracket by adjusting the temperature of the refrigerating liquid;
the circulating pipe is used for conveying the refrigerating fluid to the cooling tank and outputting the refrigerating fluid;
the temperature display is used for monitoring the temperature of the polishing solution in real time.
Preferably, the electric control system comprises a pulse power supply system, and the pulse power supply system is used for controlling the voltage and the current of the electrolytic polishing of the metal bracket.
Preferably, the electric control system comprises a parameter control system, and the parameter control system is used for adjusting the displacement of the polishing mechanism, the polishing time and polishing speed of the metal support, the current mode and the polishing working mode.
Preferably, the polishing mechanism is used for moving under the control of the electric control system, and comprises a cantilever and a clamping tool, wherein the cantilever is used for suspending the clamping tool, and the clamping tool is used for clamping the metal support.
Preferably, the clamping tool is any one of a clamp, a spring and a mandrel.
Preferably, the polishing device further comprises a stirrer, wherein the stirrer is matched with the electrolytic tank and is used for stirring the polishing solution in the electrolytic tank.
Preferably, the stirrer is a magnetic stirrer or a mechanical stirrer.
Preferably, the electrolytic cell is a single cell, a double cell or a triple cell.
The metal support polishing method is also included, and comprises the following steps:
placing the metal bracket in an electrolytic bath with polishing solution;
and controlling the electropolishing parameters to carry out electropolishing treatment on the metal support, wherein the electropolishing parameters comprise the temperature of the polishing solution, the voltage and current of electropolishing the metal support, and the electropolishing working mode.
The technical scheme has the following advantages or beneficial effects:
the metal bracket can be directly subjected to electrolytic polishing without mechanical polishing, so that the time is saved, and the polishing efficiency is high;
through the cooperation of the electric control system, the electrolytic bath and the polishing mechanism, the polished bracket has uniform size and bright surface and can achieve mirror surface effect;
providing various clamping tools and polishing modes, and reasonably selecting a polishing process according to different support structures;
the polishing equipment for the metal bracket in the technical scheme has comprehensive functions and can sufficiently cover the metal brackets for different diseases;
furthermore, the polishing process and the operation in the technical scheme are simple and convenient.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a schematic structural diagram of a metal carrier polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a circular electrolytic bath with a magnetic stirrer according to an embodiment of the present invention;
FIG. 3 is a schematic view showing a square electrolytic bath and a mechanical stirrer in an embodiment of the metal carrier polishing apparatus of the present invention;
FIG. 4 is a schematic structural diagram of a first embodiment of a clamping tool in an embodiment of a metal carrier polishing apparatus according to the present invention;
FIG. 5 is a schematic structural diagram of a second embodiment of a clamping tool in an embodiment of a metal carrier polishing apparatus according to the present invention;
FIG. 6 is a schematic structural diagram of a third embodiment of a clamping tool in an embodiment of a metal carrier polishing apparatus according to the present invention;
fig. 7 is a schematic structural diagram of a fourth embodiment of a clamping tool in an embodiment of a metal holder polishing apparatus according to the present invention.
The above reference numerals denote:
1. a pulse power supply system; 2. a parameter control system; 3. a polishing mechanism; 4. a refrigeration system; 5. an electrolytic cell; 6. a stirrer; 31. a cantilever; 32. clamping a tool; 41. a temperature controller; 42. a cooling tank; 43. a circulation pipe;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The technical scheme of the invention comprises a metal bracket polishing device.
An embodiment of a metal carrier polishing apparatus as shown in fig. 1, comprises:
an electronic control system;
an electrolytic tank 5, which is filled with polishing liquid (the polishing liquid can be an acid-acid system, an acid-alcohol system, an alcohol-salt system or other solutions), wherein during electrolytic polishing, the electrolytic tank 5 is used as a cathode, the metal bracket is used as an anode, and after being electrified, anode dissolution is generated, and polishing parameters are adjusted to enable the surface of the bracket to achieve the effect of a mirror surface;
and the polishing mechanism 3 is used for clamping the metal support in the electrolytic bath 5 to carry out electrolytic polishing treatment, wherein the electric control system is used for controlling electrolytic polishing parameters in the polishing treatment, and the electrolytic polishing parameters comprise the temperature of the polishing liquid, the electrolytic polishing voltage and current of the metal support and the electrolytic polishing working mode.
Aiming at the following problems existing in the prior polishing treatment process of the metal bracket:
1) the existing equipment has single parameter and insufficient tool accessory function;
2) the polishing efficiency of the existing equipment and process is low;
3) the prior art still needs to mechanically polish the bracket and then carry out electrochemical polishing, and the process is complicated;
4) the prior bracket has uneven size and insufficiently bright surface after being polished.
In the technical scheme, the metal bracket can be directly electropolished by matching the electric control system with the electrolytic cell 5 and the polishing mechanism 3 without mechanical polishing, so that the time is saved, and the polishing efficiency is high.
On the basis of the technical scheme, the electric control system further comprises a refrigerating system 4, and the refrigerating system 4 comprises a cooling tank 42, a circulating pipe 43 and a temperature display;
the cooling tank 42 can control the polishing liquid in the electrolytic tank 5 to reach the polishing temperature required by the metal bracket by adjusting the temperature of the refrigerating liquid;
the circulating pipe 43 is used for conveying the refrigerant liquid to the cooling tank 42 and outputting the refrigerant liquid; the temperature display is used for monitoring the temperature of the polishing solution in real time.
On the basis of the technical scheme, the electric control system further comprises a pulse power supply system 1, and the pulse power supply system 1 is used for controlling the voltage and the current of the electrolytic polishing of the metal bracket.
In the technical scheme, the corresponding voltage and current can be controlled in a targeted manner aiming at the metal supports with different appearances. Further, the pulse power supply system 1 includes a frequency for adjusting the number of times of effective discharge occurring in the discharge gap per unit time, a voltage and a current for controlling the magnitude of the voltage and the current at the time of stent polishing, and a duty ratio for adjusting the proportion of the energization time of the stent within the set polishing time.
On the basis of the technical scheme, the electric control system further comprises a parameter control system 2, and the parameter control system 2 is used for adjusting the displacement of the polishing mechanism 3, the polishing time and polishing speed of the metal support, the current mode and the polishing working mode.
In the technical scheme, the electric control system comprises a displacement adjusting function, a polishing time adjusting function, a polishing speed adjusting function, a current mode and a polishing mode, wherein the current mode is generally divided into a voltage stabilizing mode and a current stabilizing mode, the voltage stabilizing mode is that the adjusting voltage is kept unchanged, the current is compensated along with the surface state (roughness) of the polishing support, the current stabilizing mode is that the adjusting current is kept unchanged, and the voltage is compensated along with the surface state of the polishing support; the polishing mode comprises static polishing and moving polishing, wherein the static polishing refers to that the support is statically polished in the polishing solution, and the moving polishing refers to that the support can move up and down in the polishing solution for polishing.
Furthermore, different clamping tools 32 can be selected according to the structure of the support, and parameters such as the polishing time, the polishing temperature, the position of the support in the electrolytic bath 5, the polishing voltage, the polishing current, the polishing speed and the like of the support can be adjusted, so that the metal support with uniform size and good mirror surface effect can be obtained
In a preferred embodiment, the polishing mechanism 3 is configured to move under the control of the electronic control system, specifically under the control of the parameter control system 2, and the polishing mechanism 3 includes a cantilever 31 and a clamping tool 32, the cantilever 31 is configured to hang the clamping tool 32, and the clamping tool 32 is configured to clamp the metal bracket.
In a preferred embodiment, as shown in FIG. 4, the clamping fixture 32 is a clip.
In the technical scheme, when the clamp is used for clamping the metal support for polishing, the clamping force of the clamp needs to be larger than the clamping force required for clamping the metal support, so that the support can be ensured to be uniform in light conduction;
in a preferred embodiment, as shown in fig. 5, the clamping fixture 32 is a spring.
Among the above-mentioned technical scheme, when using spring or dabber to polish, spring or dabber diameter need with the support adaptation.
In a preferred embodiment, as shown in fig. 6, the clamping fixture 32 is a mandrel.
In a preferred embodiment, as shown in FIG. 7, the holding fixture 32 is a lapping plate.
In a preferred embodiment, the gripping tool 32 may also be selected as a filament.
In the technical scheme, when the filaments are used for polishing, the diameter of the filaments is generally 1/8-1/10 of the diameter of the stent, the filaments are penetrated in the stent during polishing, in order to ensure uniform electrification, an inclined plate with an inclination angle of 30-60 degrees is laid in the electrolytic bath 5, and the stent is polished by rolling the filaments on the inclined plate and attaching the inclined plate; the charge concentration point is generally at the open ring when the open ring nitinol stent is electropolished, so the clamping fixture 32 can be spring or cylinder.
On the basis of the above technical scheme, further, the clamping tool 32 is made of materials with strong acid corrosion resistance and good conductivity, such as pure titanium, nickel titanium, platinum iridium and the like.
On the basis of the technical scheme, the polishing device further comprises a stirrer 6, wherein the stirrer 6 is matched with the electrolytic tank 5 and is used for stirring the polishing solution in the electrolytic tank 5.
In a preferred embodiment, as shown in fig. 2, the electrolytic tank 5 is circular and the stirrer 6 is a magnetic stirrer, the stirrer 6 comprises a magneton and a regulator, before polishing the nickel-titanium stent, the rotor is placed at the central position of the bottom of the electrolytic tank 5 containing the polishing solution, and then the rotation speed of the magneton is regulated by the regulator, so that the polishing solution is stirred more uniformly.
In a preferred embodiment, as shown in FIG. 3, the electrolytic bath is square and the agitator 6 is a mechanical agitator, and more specifically, the polishing liquid is agitated by a triangular prism suspended above the electrolytic bath 5 at a constant speed by controlling the triangular prism through a circuit, thereby achieving the purpose of agitating the polishing liquid.
In a preferred embodiment, the electrolytic cell 5 is a single cell.
In a preferred embodiment, the electrolytic cell 5 is a double cell.
In a preferred embodiment, the electrolytic cell 5 is a triple cell.
Implement one
An embodiment of a metal carrier polishing apparatus, comprising:
the electronic control system, wherein the electronic control system can specifically include: the pulse power supply system 1 comprises frequency, voltage, current and duty ratio, and can support adjustment of discharge times, electrification proportion, voltage or current;
the parameter control system 2, the parameter control system 2 includes displacement regulating function, polishing time regulating function, polishing speed regulating function, current mode, polishing mode, users can adjust the corresponding parameter according to the support structure in order to obtain the good polishing effect;
the refrigerating system 4, the refrigerating system 4 also includes the temperature controller 41, the cooling tank 42 and the circulating pipe 43, the refrigerating system 4 is used for regulating the temperature of the polishing liquid;
the polishing equipment also comprises an electrolytic tank 5, 51, the structure of the electrolytic tank 5 can be a circular electrolytic tank 5 or a square electrolytic tank 5, the size of the electrolytic tank 5 is 1/4-3/4 (volume) of the cooling tank 42, the electrolytic tank 5 is used for containing polishing liquid, the electrolytic tank 5 is used as a cathode and the bracket is used as an anode during electrolytic polishing, and after electrification, anode dissolution is generated and polishing parameters are adjusted to enable the surface of the bracket to achieve the effect of a mirror surface;
the electrolytic bath 5 is filled with polishing solution, the electrolytic bath 5 is used as a cathode and the bracket is used as an anode during electrolytic polishing, anode dissolution is generated after electrification, and polishing parameters are adjusted to enable the surface of the bracket to achieve the effect of a mirror surface;
and the polishing mechanism 3 is used for clamping the metal support in the electrolytic bath 5 to carry out electrolytic polishing treatment, wherein the electric control system is used for controlling electrolytic polishing parameters in the polishing treatment, and the electrolytic polishing parameters comprise the temperature of the polishing liquid, the electrolytic polishing voltage and current of the metal support and the electrolytic polishing working mode.
Wherein, polishing mechanism 3 includes cantilever 31, support polishing centre gripping frock 32 dabber, spring, roll polishing board, chuck.
Optionally, the user can select the mandrel, the spring, the rolling polishing plate, the chuck and the transverse or vertical polishing (transverse or vertical placement) process of the bracket polishing clamping tool 32 according to the bracket structure and the polishing effect.
Example two
The technical scheme of the invention also comprises a metal bracket polishing method.
A metal support polishing method is implemented, wherein the method comprises the following steps:
s1, placing the metal bracket in an electrolytic bath 5 with polishing solution;
and S2, controlling the electropolishing parameters to carry out electropolishing treatment on the metal support, wherein the electropolishing parameters comprise the temperature of the polishing solution, the voltage and current for electropolishing the metal support, and the electropolishing working mode. Specifically, in the above technical solution, the electropolishing process of steps S1-S2 is performed by using the above metal holder polishing apparatus.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A metal carrier polishing apparatus, comprising:
an electronic control system;
an electrolytic bath with a polishing solution therein;
the electric control system is used for controlling the electrolytic polishing parameters in the polishing treatment, and the electrolytic polishing parameters comprise the temperature of the polishing liquid, the electrolytic polishing voltage and current of the metal support and the electrolytic polishing working mode.
2. The metal holder polishing apparatus according to claim 1, wherein the electrical control system comprises a refrigeration system, the refrigeration system comprising a cooling tank, a circulation pipe, a temperature display;
the cooling tank can control the polishing liquid in the electrolytic tank to reach the polishing temperature required by the metal bracket by adjusting the temperature of the refrigerating liquid;
the circulating pipe is used for conveying the refrigerating fluid to the cooling tank and outputting the refrigerating fluid;
the temperature display is used for monitoring the temperature of the polishing solution in real time.
3. The metal carrier polishing apparatus as set forth in claim 1, wherein the electrical control system comprises a pulsed power supply system for controlling the voltage and current levels of electropolishing of the metal carrier.
4. The metal carrier polishing apparatus as set forth in claim 1, wherein the electrical control system includes a parameter control system for adjusting the displacement of the polishing mechanism, the polishing time and polishing speed of the metal carrier, the current mode, and the polishing mode.
5. The metal support polishing device according to claim 1, wherein the polishing mechanism is configured to move under the control of the electronic control system, and the polishing mechanism includes a cantilever and a clamping tool, the cantilever is configured to hang the clamping tool, and the clamping tool is configured to clamp the metal support.
6. The metal support polishing device according to claim 1, wherein the clamping tool is any one of a clip, a spring and a mandrel.
7. The metal holder polishing apparatus according to claim 1, further comprising an agitator cooperating with said electrolytic bath for agitating said polishing liquid in said electrolytic bath.
8. The metal holder polishing apparatus according to claim 7, wherein said agitator is a magnetic agitator or a mechanical agitator.
9. The metal holder polishing apparatus according to claim 1, wherein the electrolytic bath is a single bath, or a double bath, or a triple bath.
10. A metal stent polishing method is characterized by comprising the following steps:
placing the metal bracket in an electrolytic bath with polishing solution;
and controlling the electropolishing parameters to carry out electropolishing treatment on the metal support, wherein the electropolishing parameters comprise the temperature of the polishing solution, the voltage and current of electropolishing the metal support, and the electropolishing working mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110778992.0A CN113481584A (en) | 2021-07-09 | 2021-07-09 | Metal support polishing equipment and process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110778992.0A CN113481584A (en) | 2021-07-09 | 2021-07-09 | Metal support polishing equipment and process |
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| CN113481584A true CN113481584A (en) | 2021-10-08 |
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| CN202110778992.0A Pending CN113481584A (en) | 2021-07-09 | 2021-07-09 | Metal support polishing equipment and process |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102251268A (en) * | 2010-05-19 | 2011-11-23 | 易生科技(北京)有限公司 | Bracket polishing device and method for electrochemical polish |
| CN203220870U (en) * | 2013-04-23 | 2013-10-02 | 宁波市派特勒粉末涂料有限公司 | Stirring device of powder coating gelling time determinator |
| CN203890489U (en) * | 2013-12-27 | 2014-10-22 | 易生科技(北京)有限公司 | Vascular stent electrochemical polishing device |
| CN105386117A (en) * | 2015-11-24 | 2016-03-09 | 常州乐奥医疗科技有限公司 | Electrochemical polishing device and method for support |
| CN207933554U (en) * | 2018-03-13 | 2018-10-02 | 山东吉威医疗制品有限公司 | A kind of angiocarpy bracket electrochemical polish tooling |
| CN109267143A (en) * | 2018-07-25 | 2019-01-25 | 哈尔滨工业大学（深圳） | A kind of automatic control electric current, voltage and the chemical polishing appts and its method of time |
| CN111850669A (en) * | 2020-08-17 | 2020-10-30 | 内蒙古工业大学 | Electrochemical polishing device and polishing method for intravascular stent |
-
2021
- 2021-07-09 CN CN202110778992.0A patent/CN113481584A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102251268A (en) * | 2010-05-19 | 2011-11-23 | 易生科技(北京)有限公司 | Bracket polishing device and method for electrochemical polish |
| CN203220870U (en) * | 2013-04-23 | 2013-10-02 | 宁波市派特勒粉末涂料有限公司 | Stirring device of powder coating gelling time determinator |
| CN203890489U (en) * | 2013-12-27 | 2014-10-22 | 易生科技(北京)有限公司 | Vascular stent electrochemical polishing device |
| CN105386117A (en) * | 2015-11-24 | 2016-03-09 | 常州乐奥医疗科技有限公司 | Electrochemical polishing device and method for support |
| CN207933554U (en) * | 2018-03-13 | 2018-10-02 | 山东吉威医疗制品有限公司 | A kind of angiocarpy bracket electrochemical polish tooling |
| CN109267143A (en) * | 2018-07-25 | 2019-01-25 | 哈尔滨工业大学（深圳） | A kind of automatic control electric current, voltage and the chemical polishing appts and its method of time |
| CN111850669A (en) * | 2020-08-17 | 2020-10-30 | 内蒙古工业大学 | Electrochemical polishing device and polishing method for intravascular stent |
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Application publication date: 20211008 |