CN111850669A - Electrochemical polishing device and polishing method for intravascular stent - Google Patents
Electrochemical polishing device and polishing method for intravascular stent Download PDFInfo
- Publication number
- CN111850669A CN111850669A CN202010826225.8A CN202010826225A CN111850669A CN 111850669 A CN111850669 A CN 111850669A CN 202010826225 A CN202010826225 A CN 202010826225A CN 111850669 A CN111850669 A CN 111850669A
- Authority
- CN
- China
- Prior art keywords
- polishing
- metal wire
- support frame
- stent
- blood vessel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/16—Polishing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Abstract
The invention relates to the technical field of polishing, and discloses an electrochemical polishing device and an electrochemical polishing method for an intravascular stent. The polishing device comprises a lifting assembly, an anode assembly, an adjusting assembly and a cathode assembly, wherein the lifting assembly comprises a lifting frame and a first driving mechanism; the anode assembly comprises an anode, an elastic part, a vibration source and a metal wire which are connected in sequence, the metal wire is used for installing the vascular stent, and the metal wire has a contraction state capable of being movably connected with the vascular stent and an expansion state capable of being fixedly connected with the vascular stent; the adjusting assembly comprises a first support frame and a second driving mechanism, the first support frame is connected with the metal wire, and the first support frame is provided with a vertical position capable of enabling the metal wire to be in a contraction state and a horizontal position capable of enabling the metal wire to be in an opening state; the cathode assembly is arranged below the anode assembly and comprises a polishing barrel containing polishing liquid and a cathode arranged in the polishing barrel. The polishing device has the advantages of simple and compact structure, convenience in operation, uniform polishing, good effect and high efficiency.
Description
Technical Field
The invention belongs to the technical field of polishing, and particularly relates to an electrochemical polishing device and method applied to a CoCr alloy intravascular stent.
Background
Interventional therapy is the main method for treating vascular occlusion diseases, and vascular stents are becoming the focus of research as key parts of interventional therapy. The CoCr alloy has the characteristics of good mechanical property, small specific gravity, light weight, stable chemical property and strong corrosion resistance, has no irritation to organisms, and can be used as a planting material. Therefore, the CoCr alloy is gradually becoming a new material for vascular stents.
The CoCr alloy blood vessel stent needs to be subjected to laser engraving in the production process of the blood vessel stent, a heat affected area and a recast layer are generated at the cutting position of the surface of the blood vessel stent, and the protruding molten fragments affect the surface smoothness of the blood vessel stent. After the vascular stent is implanted into a human body, intimal hyperplasia of blood vessels is stimulated, so that the risk of restenosis is increased, and therefore, the surface of the vascular stent needs to be polished after the vascular stent is formed. In the existing polishing method, the contact of the blood vessel stent is not uniform, the reaction of polishing solution and slag is not sufficient, and long-time reaction is needed to achieve an ideal effect, so that a large amount of energy and time are consumed in the whole polishing process, and the polishing effect is not ideal. For example, chinese patent CN106435706A discloses an electrochemical polishing method for a magnesium vascular stent, which mainly solves the problems that mechanical polishing cannot achieve polishing precision and consumes a lot of time and labor; the electrochemical polishing device for the blood vessel stent disclosed in the Chinese patent CN203890489U structurally comprises an automatic rotating device, and realizes the bidirectional polishing of the stent. Although the polishing step in the manufacturing process of the vascular stent is perfected and the polishing effect is improved, the vascular stent polishing method disclosed in the patent does not fundamentally solve the problems of low efficiency, uneven polishing, complex procedure, low automation degree and the like of the conventional vascular stent polishing device and polishing method.
Therefore, an electrochemical polishing device and a polishing method for vascular stents are needed to solve the above problems.
Disclosure of Invention
Based on the above, the invention aims to provide the electrochemical polishing device and the polishing method for the blood vessel stent, which are applied to the CoCr alloy blood vessel stent, have the advantages of reliable principle, simple operation, high polishing efficiency and good polishing effect.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides an electrochemical polishing device of a blood vessel stent, which comprises:
the lifting assembly comprises a lifting frame and a first driving mechanism, and the first driving mechanism is connected with the lifting frame and used for driving the lifting frame to move up and down along the vertical direction;
the anode assembly comprises an anode, an elastic part, a vibration source and a metal wire, wherein the anode is fixed on the lifting frame, the upper end of the elastic part is connected with the anode, the lower end of the elastic part is connected with the vibration source, the lower end of the vibration source is connected with the metal wire through a metal clip, the metal wire is used for installing a vascular stent, and the metal wire has a contraction state which can be movably connected with the vascular stent and an expansion state which can be fixedly connected with the vascular stent;
the adjusting assembly comprises a first support frame and a second driving mechanism, the first support frame is connected with the metal wire, and the first support frame is provided with a vertical position capable of enabling the metal wire to be in a contraction state and a horizontal position capable of enabling the metal wire to be in an opening state; the second driving mechanism is connected with the first support frame and used for driving the first support frame to switch between a vertical position and a horizontal position;
the cathode assembly is arranged below the anode assembly and comprises a polishing barrel containing polishing liquid and a cathode arranged in the polishing barrel.
As a preferable scheme of the electrochemical polishing device for the blood vessel stent, the first support frame is a Y-shaped support frame, and comprises a main end, a first branch end and a second branch end, the main end is connected with the second driving mechanism, and the first branch end and the second branch end are respectively connected with the bottom end of the metal wire.
As a preferable scheme of the electrochemical polishing device for the blood vessel stent, the trunk end of the first support frame comprises a first arm and a second arm which are connected in an L shape, and the first arm is connected with the first branch end and the second branch end;
the second driving mechanism comprises a crank, a second support frame and a connecting rod, one end of the second support frame is fixed with the lifting frame, and the other end of the second support frame is movably connected with the first arm; the crank is connected with one end of the connecting rod, the other end of the connecting rod is connected with the second arm, and the first support frame can be switched between a vertical position and a horizontal position by rotating the crank.
As a preferable scheme of the electrochemical polishing device for the vascular stent, the cathode assembly further comprises a stirring mechanism for stirring the polishing solution, and the stirring mechanism comprises a magnetic rod arranged in the polishing barrel and a magnetic field device arranged below the polishing barrel. Preferably, the magnetic rod is in the shape of a shuttle.
As a preferable scheme of the electrochemical polishing device for the vascular stent, a thermostat is further arranged in the polishing barrel and is used for adjusting the temperature of polishing liquid in the polishing barrel.
As a preferable scheme of the electrochemical polishing device for the blood vessel stent, the cathode is cylindrical, and a plurality of liquid through holes are uniformly distributed on the wall surface of the cathode. Preferably, the diameter of the liquid through hole is 5-8 mm, and the hole distance is 10-15 mm.
As a preferable proposal of the electrochemical polishing device of the blood vessel stent, the metal wire is made of platinum wire; the material of the cathode was SUS 304.
Preferably, the anode is a platinum wire with the diameter range of 0.1-1.0 mm; the metal wire is a platinum wire with the diameter range of 0.1-0.5 mm.
As a preferred scheme of the electrochemical polishing device for the vascular stent, the first driving mechanism comprises a motor, a screw rod in transmission connection with the motor and a nut in threaded connection with the screw rod, and the nut is fixedly connected with the lifting frame.
The invention also provides a polishing method of the vascular stent, which comprises the following steps:
s1, mixing the required polishing solution in the polishing barrel according to the proportion, setting the polishing temperature, starting a stirring mechanism in the polishing barrel, and stirring the polishing solution in real time;
s2, removing the metal wire, sleeving the blood vessel support on the metal wire, and clamping the metal wire by the metal clamp at the bottom of the vibration source through tensioning the elastic part to complete the installation of the blood vessel support;
s3, twisting the crank to enable the first support frame to rotate 90 degrees anticlockwise to reach a vertical position, and enabling the blood vessel support to reach the bottom end of the metal wire; twisting the crank again to enable the first support frame to rotate 90 degrees clockwise to reach the horizontal position, enabling the metal wire to be in complete contact with the vascular stent, and placing the vascular stent into the polishing barrel;
s4, switching on a power supply, setting a voltage value, a current value and polishing time, and starting to polish the vascular stent;
s5, disconnecting the power supply, twisting the crank, enabling the first support frame to rotate 90 degrees anticlockwise to reach a vertical position, enabling the intravascular stent to be separated from the metal wire, starting the vibration source, and enabling the intravascular stent to rotate through vibration to change the electrified position;
s6, twisting the crank again to enable the first support frame to rotate 90 degrees clockwise to reach the horizontal position, and enabling the metal wire to be in full contact with the vascular stent;
and S7, repeating the steps S4-S6, and repeating the whole polishing process for n times until the required polishing precision is achieved.
As a preferable scheme of the polishing method of the blood vessel stent, the polishing solution comprises the following components in percentage by mass: sulfuric acid: 10-20%, methanol: 80-90%; the voltage value is 10-20V, the current value is 1.0-2.0A, and the polishing temperature is 5-10 ℃; the polishing time of each cycle is 10-20 seconds, and the whole polishing process is repeated 3-6 times by steps S4-S6.
The invention has the beneficial effects that:
according to the polishing device for the vascular stent provided by the embodiment of the invention, when the metal wire is in an open state, the vascular stent is fixedly connected with the metal wire, so that the surface of the vascular stent can be stably polished; when the metal wire is in a contraction state, the vascular stent is movably connected with the metal wire, and the metal wire is driven to vibrate by the vibration source, so that the contact position of the vascular stent and the metal wire is changed, excessive polishing is prevented, and the polishing is more uniform; the invention polishes the intravascular stent step by adjusting the contact position of the intravascular stent and the metal wire, so that the polishing effect is better, and the quality of the intravascular stent is favorably improved. In addition, the lifting frame is driven by the first driving mechanism to move up and down along the vertical direction, so that the position of the anode assembly in the polishing barrel can be adjusted; the first support frame is driven to switch between a vertical position and a horizontal position through the second driving mechanism, so that the metal wire can be converted between a contraction state and an expansion state; the electrochemical polishing device is simple and compact in structure and convenient to operate, and avoids the complex procedures of the traditional electrochemical polishing device.
Compared with the existing vascular stent electrochemical polishing method, the polishing method provided by the embodiment of the invention realizes the step-by-step polishing of the vascular stent by intermittently changing the position direction of the vascular stent, can effectively remove an oxide layer and fragments generated by laser cutting on the surface of the vascular stent, enables the surface of the vascular stent to be polished more uniformly, and has the advantages of better polishing effect, simple operation, high polishing efficiency and high safety factor.
Drawings
FIG. 1 is a schematic structural diagram of an electrochemical polishing apparatus for a vascular stent provided in an embodiment of the present invention;
FIG. 2 is a partial structural view of an electrochemical polishing apparatus for a blood vessel stent according to a first embodiment of the present invention (first support frame is in a horizontal position);
FIG. 3 is a schematic view of a second partial structure of an electrochemical polishing apparatus for a blood vessel stent provided in an embodiment of the present invention (with a first support frame in a vertical position);
fig. 4 is a schematic structural diagram of a first support frame according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a cathode according to an embodiment of the present invention;
fig. 6 is a process diagram illustrating a polishing process of the vascular stent according to the second embodiment of the present invention.
The reference numbers in the figures are as follows:
1-an anode; 2-an elastic member; 3-a vibration source; 4-a wire; 5-a vascular stent; 6-polishing barrel; 7-a cathode; 71-liquid through hole; 8-polishing solution; 9-a first support frame; 91-trunk end; 911-first arm; 912-a second arm; 92-a first branch end; 93-a second branch end; 10-a second support; 11-a connecting rod; 12-a crank; 13-a lifting frame; 14-a magnetic rod; 15-a thermostat; 16-a first drive mechanism; 17-a controller; 18-switch.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
Example one
Fig. 1 is a schematic structural diagram of an electrochemical polishing apparatus for a vascular stent provided in this embodiment. Fig. 2 is a partial structural schematic view of the electrochemical polishing device for the blood vessel stent provided by the embodiment (the first support frame is in a horizontal position). Fig. 3 is a partial structural schematic view of the electrochemical polishing apparatus for vascular stents provided in this embodiment (the first support frame is in a vertical position). Fig. 4 is a schematic structural view of the first support frame 9 according to the present embodiment. Fig. 5 is a schematic structural view of the cathode 7 according to the present embodiment. As shown in fig. 1 to 5, the present embodiment provides an electrochemical polishing apparatus for an intravascular stent, which is used for electrochemically polishing the surface of the intravascular stent 5, and is particularly used for electrochemically polishing a heat affected zone, a recast layer, and the like formed on the surface of the intravascular stent 5 made of CoCr alloy after laser processing.
Referring to fig. 1, the polishing apparatus includes a lifting assembly, an anode assembly, an adjusting assembly and a cathode assembly, wherein the lifting assembly includes a lifting frame 13 and a first driving mechanism 16, the first driving mechanism 16 is connected with the lifting frame 13 and is used for driving the lifting frame 13 to move up and down along the vertical direction, so that the anode assembly can be put into the polishing solution 8 or be lifted out of the polishing solution 8, and the position of the anode assembly in the polishing barrel 6 can be adjusted. Preferably, the first driving mechanism 16 of the present embodiment includes a motor, a screw rod in transmission connection with the motor, and a nut in threaded connection with the screw rod, the nut is fixedly connected with the crane 13, the motor is connected with the controller 17, the above arrangement structure is simple, and the operation is reliable; the motor is controlled to operate by the controller 17, so that the lifting frame 13 can be precisely driven to ascend and descend.
The anode assembly comprises an anode 1, an elastic part 2, a vibration source 3 and a metal wire 4, wherein the anode 1 is fixed on the lifting frame 13 and is connected with the anode of the power supply, and the anode 1 can move up and down along with the lifting frame 13; the upper end of the elastic member 2 is connected to the anode 1, the lower end of the elastic member 2 is connected to the vibration source 3, the elastic member 2 is used to straighten the wire 4, and preferably, the elastic member 2 is a spring. The lower end of the vibration source 3 is connected with the metal wire 4 through a metal clip, and the vibration source 3 is used for changing the contact point of the metal wire 4 and the blood vessel support 5 through vibration energy, so that the blood vessel support 5 can rotate and slightly move up and down relative to the metal wire 4 to prevent over-polishing.
The metal wire 4 is used for installing the blood vessel stent 5, as shown in fig. 1, the metal wire 4 can be a platinum wire in an annular structure, the upper end of the metal wire is hung on the metal clip, the lower end of the metal wire 4 is provided with two connecting points, when the two connecting points are horizontally arranged, the lower end of the metal wire 4 is spread, at the moment, the metal wire 4 is in an open state, and the blood vessel stent 5 can be clamped on the metal wire 4; when these two tie points are vertical the arranging, the lower extreme of wire 4 is closed, and wire 4 is in the shrink state this moment, and vascular support 5 can slide along wire 4 under the effect of gravity or vibrating force, can rotate 4 emergence relatively simultaneously. The adjusting assembly comprises a first support frame 9 and a second driving mechanism, the first support frame 9 is connected with the metal wire 4, and the first support frame 9 is provided with a vertical position which can enable the metal wire 4 to be in a contraction state and a horizontal position which can enable the metal wire 4 to be in an opening state; the second driving mechanism is connected with the first supporting frame 9 and used for driving the first supporting frame 9 to switch between a vertical position and a horizontal position, and further the metal wire 4 is switched between a contraction state and an expansion state. The cathode assembly is arranged below the anode assembly and comprises a polishing barrel 6 containing polishing liquid 8 and a cathode 7 fixed at the bottom of the polishing barrel 6, and the cathode 7 is connected with the negative electrode of the power supply.
In this embodiment, when the metal wire 4 is in the expanded state, the blood vessel stent 5 is fixedly connected with the metal wire 4, so that the surface of the blood vessel stent 5 can be stably polished; when the metal wire 4 is in the contraction state, the blood vessel support 5 is movably connected with the metal wire 4, and the metal wire 4 is driven to vibrate through the vibration source 3, so that the contact position of the blood vessel support 5 and the metal wire 4 is changed, excessive polishing is prevented, and the polishing is more uniform. According to the invention, the contact position of the blood vessel support 5 and the metal wire 4 is adjusted to polish the blood vessel support 5 step by step, so that the polishing effect is better, and the surface quality of the blood vessel support 5 is favorably improved. The polishing device provided by the embodiment has the advantages of simple and compact structure, convenience in operation, capability of effectively removing the oxide layer and the fragments generated by laser cutting on the surface of the intravascular stent 5, good polishing effect and high polishing efficiency, and avoids the complicated procedures of the traditional electrochemical polishing device.
Preferably, referring to fig. 4, the first support frame 9 of this embodiment is a "Y" shaped support frame, and includes a trunk end 91, a first branch end 92 and a second branch end 93, the trunk end 91 is connected to the second driving mechanism, and the first branch end 92 and the second branch end 93 are connected to two connection points at the bottom end of the metal wire 4; the above arrangement enables the first branch end 92 and the second branch end 93 to rotate when the second driving mechanism drives the trunk end 91 to rotate, so that the two connection points of the first branch end 92 and the second branch end 93 to the wire 4 can be arranged in the horizontal direction or in the vertical direction. Further, the trunk end 91 of the first support frame 9 comprises a first arm 911 and a second arm 912 connected in an L shape, wherein the first arm 911 is connected with the first branch end 92 and the second branch end 93, and the second arm 912 is perpendicular to the first arm 911. As shown in fig. 1-3, preferably, the second driving mechanism of the present embodiment includes a crank 12, a second support frame 10 and a connecting rod 11, one end of the second support frame 10 is fixed to a crane 13, and the other end is movably connected to the first arm 911; one end of a crank 12 is rotatably connected with the support frame 10, and the other end is connected with one end of a connecting rod 11; the other end of the connecting rod 11 is fixedly connected with the second arm 912, the arrangement structure is simple, the operation is convenient, and the position direction of the first support frame 9 can be changed by twisting the crank 12, so that the switching between the vertical position and the horizontal position is realized.
Further, the cathode assembly further comprises a stirring mechanism for stirring the polishing solution 8, the stirring mechanism enables the polishing solution 8 in the polishing barrel 6 to be uniform in chemical substances, the current density in the solution is prevented from changing too much, the polishing quality is prevented from being influenced, meanwhile, the temperature of each part of the solution in the polishing barrel 6 is balanced, and the polishing effect is improved. Preferably, the stirring mechanism of the embodiment includes a magnetic rod 14 disposed in the polishing barrel 6 and a magnetic field device disposed below the polishing barrel 6, wherein the magnetic rod 14 is suspended below the polishing solution 8 and can rotate under the magnetic field of the magnetic field device, so as to stir the polishing solution 8. When the stirring is needed, the magnetic rod 14 is only required to be placed into the polishing solution 8, and the polishing solution is simple in structure, convenient to install and use, and convenient to clean and maintain. Further preferably, the magnetic rod 14 of the embodiment is in a shuttle shape, and the shuttle-shaped magnetic rod 14 has good balance and small motion resistance, is easy to suspend in the center of the polishing barrel 6, and effectively improves the stirring uniformity. Of course, in other embodiments, other stirring devices may be used, such as a motor driving a stirring blade to stir, which is not limited to this embodiment.
Further, a thermostat 15 is disposed in the polishing barrel 6 of the present embodiment, and the thermostat 15 is preferably fixed at the bottom of the polishing barrel 6 and is used for adjusting the temperature of the polishing solution 8 in the polishing barrel 6; by arranging the thermostat 15, the polishing solution 8 is kept at the optimal polishing temperature, which is beneficial to improving the polishing efficiency and the polishing quality.
Preferably, in this embodiment, as shown in fig. 5, the cathode 7 is cylindrical, and a plurality of liquid through holes 71 are uniformly distributed on the wall surface of the cathode 7. Since the stent 5 to be polished is cylindrical, the cathode 7 is also cylindrical in shape in the present embodiment, so that when the stent 5 is immersed in the polishing solution 8 and located in the middle of the cathode 7, the same distance from the peripheral wall of the cathode 7 to the peripheral wall of the stent 5 can be ensured, thereby enabling the current density in the polishing solution 8 to be uniform and improving the dimensional accuracy of the polishing of the stent 5. The liquid through holes 71 are arranged to communicate the solutions inside and outside the cathode 7, so that the components of the inside and outside solutions are kept uniform, and the polishing effect is improved. Preferably, the diameter of the liquid through holes 71 is 5-8 mm, and the hole pitch is 10-15 mm.
In the invention, because the anode 1 does not enter into the polishing solution during polishing, and no electrochemical reaction is generated, the material of the anode 1 only needs to be selected from conductive metal. Preferably, in the embodiment, the anode 1 is a platinum wire with a diameter range of 0.1-1.0 mm, so as to prolong the service life of the anode 1. Further, since the metal wire 4 enters the polishing solution 8 together with the stent during polishing and generates electrochemical reaction, the material of the metal wire 4 needs to have certain corrosion resistance, and in order to improve the service life, a platinum wire is preferably used in this embodiment. More preferably, the metal wire 4 is a platinum wire with a diameter ranging from 0.1 mm to 0.5 mm. The platinum wire has good corrosion resistance in electrochemical reaction and long service life compared with other materials, thereby avoiding the trouble of frequently replacing the metal wire 4. Further, the cathode 7 of the present embodiment is made of SUS304 (i.e., 304 stainless steel), which has high corrosion resistance and can effectively prolong the service life of the cathode 7.
Example two
Fig. 6 is a process diagram illustrating a polishing process of the blood vessel stent according to the present embodiment. As shown in fig. 6, the present embodiment provides a polishing method of a blood vessel stent, which is applied to the electrochemical polishing apparatus of the blood vessel stent in the first embodiment. The polishing method specifically comprises the following steps:
s1, first, the required polishing solution 8 is proportioned in the polishing barrel 6. In this embodiment, preferably, the polishing solution 8 includes, by mass: sulfuric acid: 10-20%, methanol: 80-90%, the polishing solution 8 can effectively polish the melted fragments on the surface of the intravascular stent 5, and the surface smoothness of the intravascular stent 5 is improved. Of course, in other embodiments, the suitable polishing liquid 8 can be flexibly selected according to the requirement, which is not limited to this embodiment. After the polishing solution 8 is prepared, the polishing temperature is set, and the magnetic field device below the polishing barrel 6 is started to drive the magnetic rod 14 to rotate, so that the polishing solution 8 is stirred in real time. In the embodiment, the polishing temperature is preferably 5-10 ℃, and the efficient polishing of the vascular stent 5 can be realized at the temperature, so that the polishing quality and efficiency are improved.
S2, removing the metal wire 4, fitting the blood vessel stent 5 on the metal wire 4, and clamping the metal wire 4 by the metal clip at the bottom of the vibration source 3 by tensioning the elastic member 2 to complete the installation of the blood vessel stent 5, as shown in fig. 6 a.
S3, the crank 12 is twisted to rotate the first supporting frame 9 counterclockwise by 90 ° to the vertical position, and the stent 5 reaches the bottom end of the wire 4 under the action of gravity, as shown in fig. 6 b. Then, the crank 12 is turned again, rotating the first support frame 9 clockwise by 90 ° to the horizontal position, bringing the wire 4 into full contact with the stent 5, as shown in detail in the c-diagram of fig. 6. The vascular stent 5 is then placed into the polishing barrel 6 by the lifting assembly.
S4, the switch 18 on the controller 17 is actuated to turn on the power supply, and the voltage value, the current value and the polishing time are set at the same time, and the polishing of the blood vessel stent 5 is started. Preferably, in this embodiment, the voltage is set to 10-20V, the current is set to 1.0-2.0A, and the polishing time per cycle is set to 10-20 seconds.
S5, closing the switch 18 on the controller 17 to disconnect the power supply; then the crank 12 is turned to rotate the first supporting frame 9 counterclockwise by 90 degrees to a vertical position, so that the blood vessel stent 5 is movably connected with the metal wire 4, as shown in a d diagram in fig. 6; and then the vibration source 3 is started to rotate the blood vessel stent 5 through vibration so as to change the contact position of the blood vessel stent 5 and the metal wire 4 and prevent the blood vessel stent 5 from being over polished due to long-time electrification at the same position.
S6, the crank 12 is twisted again to rotate the first supporting frame 9 clockwise by 90 ° to reach the horizontal position, so that the wire 4 is fully contacted with the blood vessel stent 5, as shown in e diagram in fig. 6.
And S7, repeating the steps S4-S6, namely, electrifying and polishing the blood vessel stent 5 again, and adjusting the relative position of the blood vessel stent 5 and the metal wire 4 again until the required polishing precision is achieved. Preferably, the whole polishing process is repeated 3-6 times.
Compared with the existing vascular stent electrochemical polishing method, the polishing method provided by the embodiment of the invention realizes the step-by-step polishing of the vascular stent 5 by intermittently changing the position direction of the vascular stent 5, can effectively remove the oxide layer and fragments generated by laser cutting on the surface of the vascular stent 5, enables the surface of the vascular stent 5 to be polished more uniformly, has better polishing effect, and is simple to operate, high in polishing efficiency and high in safety factor. After the CoCr alloy tube is cut into the vascular stent 5 by laser, the surface of the vascular stent can completely achieve the mirror effect by the electrochemical polishing method of the embodiment, and the surface roughness is Ra < 0.2.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. An electrochemical polishing device for a blood vessel stent is characterized by comprising:
the lifting assembly comprises a lifting frame (13) and a first driving mechanism (16), and the first driving mechanism (16) is connected with the lifting frame (13) and is used for driving the lifting frame (13) to move up and down along the vertical direction;
the anode assembly comprises an anode (1), an elastic part (2), a vibration source (3) and a metal wire (4), wherein the anode (1) is fixed on the lifting frame (13), the upper end of the elastic part (2) is connected with the anode (1), the lower end of the elastic part (2) is connected with the vibration source (3), the lower end of the vibration source (3) is connected with the metal wire (4) through a metal clip, the metal wire (4) is used for installing a vascular stent (5), and the metal wire (4) has a contraction state capable of being movably connected with the vascular stent (5) and an expansion state capable of being fixedly connected with the vascular stent (5);
the adjusting assembly comprises a first support frame (9) and a second driving mechanism, the first support frame (9) is connected with the metal wire (4), and the first support frame (9) is provided with a vertical position capable of enabling the metal wire (4) to be in a contraction state and a horizontal position capable of enabling the metal wire (4) to be in an opening state; the second driving mechanism is connected with the first support frame (9) and is used for driving the first support frame (9) to switch between a vertical position and a horizontal position;
the cathode assembly is arranged below the anode assembly and comprises a polishing barrel (6) containing polishing liquid (8) and a cathode (7) arranged in the polishing barrel (6).
2. The electrochemical polishing device for blood vessel support of claim 1, wherein the first support frame (9) is a "Y" shaped support frame, and comprises a main end (91), a first branch end (92) and a second branch end (93), the main end (91) is connected with the second driving mechanism, and the first branch end (92) and the second branch end (93) are respectively connected with the bottom end of the metal wire (4).
3. The electrochemical polishing device for the vascular stent of claim 2, wherein the trunk end (91) of the first support frame (9) comprises a first arm (911) and a second arm (912) which are connected in an L shape, and the first arm (911) is connected with the first branch end (92) and the second branch end (93);
the second driving mechanism comprises a crank (12), a second supporting frame (10) and a connecting rod (11), one end of the second supporting frame (10) is fixed with the lifting frame (13), and the other end of the second supporting frame is movably connected with the first arm (911); the crank (12) is connected with one end of the connecting rod (11), the other end of the connecting rod (11) is connected with the second arm (912), and the first support frame (9) can be switched between a vertical position and a horizontal position by rotating the crank (12).
4. The electrochemical polishing device for the vascular stent as defined in claim 1, wherein the cathode assembly further comprises a stirring mechanism for stirring the polishing solution (8), the stirring mechanism comprising a magnetic rod (14) disposed in the polishing barrel (6) and a magnetic field device disposed below the polishing barrel (6).
5. The electrochemical polishing device for the vascular stent as defined in claim 1, wherein a thermostat (15) is further disposed in the polishing barrel (6) for adjusting the temperature of the polishing solution (8) in the polishing barrel (6).
6. The electrochemical polishing device for the vascular stent as defined in any one of claims 1-5, wherein the cathode (7) is cylindrical, and a plurality of liquid through holes (71) are uniformly distributed on the wall surface of the cathode (7).
7. The electrochemical polishing device for the vascular stent as defined in any one of claims 1-5, wherein the material of the metal wire (4) is a platinum wire; the material of the cathode (7) is SUS 304.
8. The electrochemical polishing device for the blood vessel stent of any one of claims 1 to 5, wherein the first driving mechanism (16) comprises a motor, a screw rod in transmission connection with the motor and a nut in threaded connection with the screw rod, and the nut is fixedly connected with the lifting frame (13).
9. A method of polishing a vascular stent, comprising:
s1, preparing the required polishing solution (8) in the polishing barrel (6) in proportion, setting the polishing temperature, starting a stirring mechanism in the polishing barrel (6), and stirring the polishing solution (8) in real time;
s2, removing the metal wire (4), sleeving the blood vessel support (5) on the metal wire (4), and clamping the metal wire (4) by a metal clamp at the bottom of the vibration source (3) through tensioning the elastic part (2) to finish the installation of the blood vessel support (5);
s3, twisting the crank (12) to enable the first support frame (9) to rotate 90 degrees anticlockwise to reach a vertical position, and enabling the blood vessel support (5) to reach the bottom end of the metal wire (4); rotating the crank (12) again to enable the first support frame (9) to rotate clockwise by 90 degrees to reach a horizontal position, enabling the metal wire (4) to be in complete contact with the vascular stent (5), and placing the vascular stent (5) into the polishing barrel (6);
s4, switching on a power supply, setting a voltage value, a current value and polishing time, and starting to polish the vascular stent (5);
s5, disconnecting the power supply, rotating the crank (12), enabling the first support frame (9) to rotate 90 degrees anticlockwise to reach a vertical position, enabling the blood vessel support (5) to be separated from the metal wire (4), starting the vibration source (3), and enabling the blood vessel support (5) to rotate through vibration to change the electrified position;
s6, rotating the crank (12) again to enable the first support frame (9) to rotate clockwise by 90 degrees to reach a horizontal position, and enabling the metal wire (4) to be in full contact with the blood vessel stent (5);
and S7, repeating the steps S4-S6, and repeating the whole polishing process for n times until the required polishing precision is achieved.
10. The polishing method of the blood vessel stent according to claim 9, wherein the polishing solution (8) comprises the following components in percentage by mass: sulfuric acid: 10-20%, methanol: 80-90%; the voltage value is 10-20V, the current value is 1.0-2.0A, and the polishing temperature is 5-10 ℃; the polishing time of each cycle is 10-20 seconds, and the whole polishing process is repeated 3-6 times by steps S4-S6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010826225.8A CN111850669A (en) | 2020-08-17 | 2020-08-17 | Electrochemical polishing device and polishing method for intravascular stent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010826225.8A CN111850669A (en) | 2020-08-17 | 2020-08-17 | Electrochemical polishing device and polishing method for intravascular stent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111850669A true CN111850669A (en) | 2020-10-30 |
Family
ID=72968773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010826225.8A Pending CN111850669A (en) | 2020-08-17 | 2020-08-17 | Electrochemical polishing device and polishing method for intravascular stent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111850669A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626605A (en) * | 2020-12-07 | 2021-04-09 | 北京泰杰伟业科技有限公司 | Clamp capable of continuously processing electrochemical polishing anode electrode |
| CN113481584A (en) * | 2021-07-09 | 2021-10-08 | 上海心玮医疗科技股份有限公司 | Metal support polishing equipment and process |
| CN113897662A (en) * | 2021-11-11 | 2022-01-07 | 浙江工业大学 | Device and method for moving type electrolytic polishing of TC4 titanium alloy |
| CN114990684A (en) * | 2022-06-13 | 2022-09-02 | 深圳市金瑞凯利生物科技有限公司 | Electrochemical polishing device and polishing method for tubular support |
-
2020
- 2020-08-17 CN CN202010826225.8A patent/CN111850669A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112626605A (en) * | 2020-12-07 | 2021-04-09 | 北京泰杰伟业科技有限公司 | Clamp capable of continuously processing electrochemical polishing anode electrode |
| CN112626605B (en) * | 2020-12-07 | 2022-01-14 | 北京泰杰伟业科技有限公司 | Clamp capable of continuously processing electrochemical polishing anode electrode |
| CN113481584A (en) * | 2021-07-09 | 2021-10-08 | 上海心玮医疗科技股份有限公司 | Metal support polishing equipment and process |
| CN113897662A (en) * | 2021-11-11 | 2022-01-07 | 浙江工业大学 | Device and method for moving type electrolytic polishing of TC4 titanium alloy |
| CN114990684A (en) * | 2022-06-13 | 2022-09-02 | 深圳市金瑞凯利生物科技有限公司 | Electrochemical polishing device and polishing method for tubular support |
| CN114990684B (en) * | 2022-06-13 | 2023-09-26 | 深圳市金瑞凯利生物科技有限公司 | Electrochemical polishing device and polishing method for tubular support |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111850669A (en) | Electrochemical polishing device and polishing method for intravascular stent | |
| US7776189B2 (en) | Method and apparatus for electropolishing metallic stents | |
| CA2545365A1 (en) | Electropolishing apparatus and method for medical implants | |
| CN102251268B (en) | Bracket polishing device and method for electrochemical polish | |
| US20220364256A1 (en) | Device for the electropolishing of multiple free-moving items by means of solid electrolytes | |
| AU2008351701B2 (en) | Improvements in electropolishing apparatus | |
| CN212610979U (en) | Electrochemical polishing device for intravascular stent | |
| CN105714367A (en) | Electrolytic polishing device | |
| CN102356185B (en) | Method, apparatus and solution for electropolishing metallic stents | |
| CN109402715B (en) | Porous metal electrodeposition device with in-situ measurement function and electrodeposition process thereof | |
| CN102356184B (en) | Method and solution for electropolishing stents made of high strength medical alloys | |
| KR101147310B1 (en) | Barrel assembly for plating | |
| CN114717632B (en) | Micro-arc oxidation device for 3D printing of porous surface titanium alloy | |
| CN219808029U (en) | Electrochemical polishing device for tubular implant | |
| WO2001048271A1 (en) | Method of producing metal ferrules, and device therefor | |
| JP2006514712A (en) | Electro-polishing method for nickel-titanium alloy dental instruments | |
| CN113481584A (en) | Metal support polishing equipment and process | |
| CN210560865U (en) | Electrochemical polishing structure of intracranial open-loop stent | |
| CN217399037U (en) | Blood vessel support electrochemical polishing positive pole frock and polishing equipment | |
| CN114113176B (en) | Preparation method of titanium alloy EBSD sample | |
| CN112095139A (en) | Cathode structure, electrochemical polishing tank and electrochemical polishing equipment | |
| CN216378474U (en) | Novel electrochemical polishing equipment | |
| JP2002144152A (en) | Device and method for electrolytic polishing of round bar specimen | |
| CN213827360U (en) | Electrochemical machining device based on magnetic deformation electrode | |
| CN219772294U (en) | Anodic oxidation treatment device for metal surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |