CN113481475A - Method for refining titanium target material grains and titanium target material - Google Patents
Method for refining titanium target material grains and titanium target material Download PDFInfo
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- CN113481475A CN113481475A CN202110758654.0A CN202110758654A CN113481475A CN 113481475 A CN113481475 A CN 113481475A CN 202110758654 A CN202110758654 A CN 202110758654A CN 113481475 A CN113481475 A CN 113481475A
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 137
- 239000010936 titanium Substances 0.000 title claims abstract description 137
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 137
- 239000013077 target material Substances 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000007670 refining Methods 0.000 title abstract description 9
- 238000005242 forging Methods 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 abstract description 21
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 239000002699 waste material Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 229910000914 Mn alloy Inorganic materials 0.000 description 5
- HPDFFVBPXCTEDN-UHFFFAOYSA-N copper manganese Chemical compound [Mn].[Cu] HPDFFVBPXCTEDN-UHFFFAOYSA-N 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Abstract
The invention provides a method for refining titanium target material grains and a titanium target material, wherein the method comprises the following steps: (1) preheating the titanium target material at 400-500 ℃; (2) performing three-way forging on the titanium target material obtained in the step (1); (3) and (3) cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 10-20 microns. The method provided by the invention is specially used for grain refinement of the titanium target, improves the sputtering performance and the sputtering environment of the titanium target, improves the coating quality, simplifies the process flow and reduces the processing cost.
Description
Technical Field
The invention belongs to the technical field of target manufacturing, relates to a method for refining target grains, and particularly relates to a method for refining titanium target grains and a titanium target.
Background
The magnetron sputtering technology is one of the key technologies for preparing the film material, and the high-purity titanium sputtering target material is a key material in the magnetron sputtering technology, so that the method has wide market application prospect. The titanium target material has strict requirements on chemical purity, structure performance and the like as a coating material with high added value. Wherein the grain size affects the quality of the coating film in addition to the sputtering rate.
CN 109338314a discloses a processing method of an ultra-fine grain copper-manganese alloy target, which mainly comprises the following steps: (1) carrying out high-temperature forging cogging on the copper-manganese alloy cast ingot; (2) performing multiple low-temperature three-way forging at the temperature of 150-; (3) carrying out recrystallization heat treatment on the material obtained in the step (2) at 425-475 ℃; (4) and (4) carrying out multiple times of cold deformation and recovery annealing on the product obtained in the step (3) to obtain the ultrafine-grained copper-manganese alloy target material. The service life of the copper-manganese alloy target material obtained by the invention can reach 3000kwh, the average grain size is below 1 mu m, the Vickers hardness exceeds 140HV, and the orientation percentage (220) exceeds 80%, thereby effectively improving the utilization rate of the target material and meeting the requirements of the integrated circuit process with the size of 28nm and below. However, the invention is only suitable for copper-manganese alloy targets and cannot be used for grain refinement of titanium targets.
CN 102002656A discloses a method for refining, separating out or dispersing and strengthening block copper alloy crystal grains, which comprises the steps of cutting a high-strength high-conductivity copper alloy cast ingot or a thermal deformation material into rectangular blocks, placing the rectangular blocks into a furnace, heating to 800 ℃ plus 860 ℃, keeping the temperature for 40-120min, water quenching, cooling, sequentially carrying out multi-pass and multi-shaft compression deformation along the three directions of the X axis, the Y axis and the Z axis of the rectangular blocks at room temperature, controlling the true strain of each pass to be 0.2-0.6, and carrying out annealing recrystallization at 600 ℃ plus 800 ℃ when the accumulated true strain reaches more than 1.2 so as to obtain the ultrafine crystal grain copper alloy blocks with the average size of 0.5-3 mu m. The invention effectively overcomes the problems of serious die damage, high power requirement and difficult preparation of block materials in the prior art when the high-strength and high-conductivity copper alloy crystal grains are refined; can be used for preparing large-piece compact ultrafine grain high-strength high-conductivity copper alloy materials and has good industrial application prospect. However, the invention also has the problem that the method can not be used for the grain refinement of the titanium target material, and the application range is limited.
Therefore, how to provide a method special for refining titanium target material grains, improve the sputtering performance and the sputtering environment of the titanium target material, simplify the process flow while improving the coating quality, and reduce the processing cost becomes a problem which needs to be solved urgently by technical personnel in the field at present.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a method for refining titanium target material grains and a titanium target material.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a method for grain refinement of a titanium target material, the method comprising the steps of:
(1) preheating the titanium target material at 400-500 ℃;
(2) performing three-way forging on the titanium target material obtained in the step (1);
(3) and (3) cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 10-20 microns.
The invention refines the grain size of the titanium target material to 10-20 μm through preheating, three-dimensional forging and cooling in sequence, has simple process flow, improves the processing efficiency, reduces the processing cost, realizes the full preheating of the titanium target material at the preheating temperature of 400 plus one 500 ℃, avoids the resource waste caused by overhigh temperature, improves the sputtering performance and the sputtering environment of the obtained titanium target material, and improves the film coating quality.
In the present invention, the temperature of the preheating in step (1) is 400-500 ℃, and may be, for example, 400 ℃, 410 ℃, 420 ℃, 430 ℃, 440 ℃, 450 ℃, 460 ℃, 470 ℃, 480 ℃, 490 ℃ or 500 ℃, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
In the present invention, the grain size of the titanium target obtained in step (3) is 10 to 20 μm, and may be, for example, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm, but is not limited to the values listed, and other values not listed in the numerical range are also applicable.
Preferably, the titanium target material in step (1) has a grain size of 20-30 μm, such as 20 μm, 21 μm, 22 μm, 23 μm, 24 μm, 25 μm, 26 μm, 27 μm, 28 μm, 29 μm or 30 μm, but is not limited to the values listed, and other values not listed in the range of values are also applicable.
Preferably, the preheating of step (1) is performed in a resistance heating furnace.
Preferably, the preheating in step (1) is performed for 5-30min, such as 5min, 6min, 8min, 10min, 12min, 14min, 16min, 18min, 20min, 22min, 24min, 26min, 28min or 30min, but not limited to the recited values, and other values not recited in the range of values are also applicable.
In the invention, the preheating heat preservation time is adapted to the preheating temperature, and within the range of 400-.
Preferably, the three-way forging of step (2) includes 2 to 5 processing cycles, for example, 2, 3, 4 or 5 processing cycles, and each processing cycle includes a first pass, a second pass and a third pass performed in sequence.
Preferably, the first pass is to upset the titanium target material along the X-axis direction to a first deformation amount and then draw to the original size.
Preferably, the first deformation is 40-60%, for example 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58% or 60%, but is not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the second pass is to upset the titanium target material along the Y-axis direction to a second deformation amount and then draw to the original size.
Preferably, the second deformation is 40-60%, for example 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58% or 60%, but is not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the third pass is to upset the titanium target material along the Z-axis direction to a third deformation amount and then draw to the original size.
Preferably, the third deformation is 40-60%, for example, 40%, 42%, 44%, 46%, 48%, 50%, 52%, 54%, 56%, 58% or 60%, but not limited to the recited values, and other values not recited within the range of values are equally applicable.
Preferably, the cooling manner in step (3) includes water cooling and/or air cooling.
As a preferred technical solution of the first aspect of the present invention, the method comprises the steps of:
(1) preheating a titanium target material with the grain size of 20-30 mu m in a resistance heating furnace at 400-500 ℃ for 5-30 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 2-5 processing cycles, wherein each processing cycle comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation amount is 40-60%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 40-60%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 40-60%, and then drawing to the original size;
(3) and (3) cooling the titanium target material obtained in the step (2) by water and/or air to obtain the titanium target material with the grain size of 10-20 microns.
In a second aspect, the present invention provides a titanium target material obtained by grain refinement using the method according to the first aspect.
Compared with the prior art, the invention has the beneficial effects that:
the invention refines the grain size of the titanium target material to 10-20 μm through preheating, three-dimensional forging and cooling in sequence, has simple process flow, improves the processing efficiency, reduces the processing cost, realizes the full preheating of the titanium target material at the preheating temperature of 400 plus one 500 ℃, avoids the resource waste caused by overhigh temperature, improves the sputtering performance and the sputtering environment of the obtained titanium target material, and improves the film coating quality.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments.
Example 1
The embodiment provides a method for grain refinement of a titanium target material, which comprises the following steps:
(1) preheating a titanium target material with the grain size of 25 mu m in a resistance heating furnace at 450 ℃ for 15 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 3 processing periods, wherein each processing period comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation is 50%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 50%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 50%, and then drawing the titanium target material to the original size;
(3) and (3) water-cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 15 microns.
According to the embodiment, the grain size of the titanium target is refined from 25 mu m to 15 mu m by preheating, three-way forging and cooling in sequence, the process flow is simple, the processing efficiency is improved, the processing cost is reduced, the titanium target is fully preheated at the preheating temperature of 450 ℃, the resource waste caused by overhigh temperature is avoided, the sputtering performance and the sputtering environment of the obtained titanium target are improved, and the coating quality is improved.
Example 2
The embodiment provides a method for grain refinement of a titanium target material, which comprises the following steps:
(1) preheating a titanium target material with the grain size of 22 mu m in a resistance heating furnace at 425 ℃ for 18 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 3 processing periods, wherein each processing period comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation amount is 45%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation amount is 45%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation amount is 45%, and then drawing the titanium target material to the original size;
(3) and (3) air-cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 12 microns.
According to the embodiment, the grain size of the titanium target is refined from the original 22 mu m to 12 mu m through preheating, three-way forging and cooling in sequence, the process flow is simple, the processing efficiency is improved, the processing cost is reduced, the titanium target is fully preheated at the preheating temperature of 425 ℃, the resource waste caused by overhigh temperature is avoided, the sputtering performance and the sputtering environment of the obtained titanium target are improved, and the coating quality is improved.
Example 3
The embodiment provides a method for grain refinement of a titanium target material, which comprises the following steps:
(1) preheating a titanium target material with the grain size of 28 mu m in a resistance heating furnace at 475 ℃ for 10 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 4 processing periods, and each processing period comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation is 55%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 55%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 55%, and then drawing the titanium target material to the original size;
(3) and (3) water-cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 18 microns.
According to the embodiment, the grain size of the titanium target material is refined to 18 microns from the original 28 microns through preheating, three-way forging and cooling in sequence, the process flow is simple, the processing efficiency is improved, the processing cost is reduced, the titanium target material is fully preheated at the preheating temperature of 475 ℃, meanwhile, the resource waste caused by overhigh temperature is avoided, the sputtering performance and the sputtering environment of the obtained titanium target material are improved, and the coating quality is improved.
Example 4
The embodiment provides a method for grain refinement of a titanium target material, which comprises the following steps:
(1) preheating a titanium target material with the grain size of 20 mu m in a resistance heating furnace at 400 ℃ for 30 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 2 processing periods, wherein each processing period comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation is 40%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 40%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 40%, and then drawing the titanium target material to the original size;
(3) and (3) water-cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 10 microns.
According to the embodiment, the grain size of the titanium target is refined from 20 microns to 10 microns by preheating, three-way forging and cooling in sequence, the process flow is simple, the processing efficiency is improved, the processing cost is reduced, the titanium target is fully preheated at the preheating temperature of 400 ℃, the resource waste caused by overhigh temperature is avoided, the sputtering performance and the sputtering environment of the obtained titanium target are improved, and the coating quality is improved.
Example 5
The embodiment provides a method for grain refinement of a titanium target material, which comprises the following steps:
(1) preheating a titanium target material with the grain size of 30 mu m in a resistance heating furnace at 500 ℃ for 5 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 5 processing periods, wherein each processing period comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation is 60%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 60%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 60%, and then drawing the titanium target material to the original size;
(3) and (3) air-cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 20 microns.
According to the embodiment, the grain size of the titanium target is refined from 30 microns to 20 microns by preheating, three-way forging and cooling in sequence, the process flow is simple, the processing efficiency is improved, the processing cost is reduced, the titanium target is fully preheated at the preheating temperature of 500 ℃, the resource waste caused by overhigh temperature is avoided, the sputtering performance and the sputtering environment of the obtained titanium target are improved, and the coating quality is improved.
Example 6
This embodiment provides a method for grain refinement of a titanium target, which is the same as embodiment 1 except that the processing cycle in step (2) is changed to 1, and thus, the description thereof is omitted here.
Compared with example 1, the grain size of the finally obtained titanium target material is 20 μm, and the refinement degree is reduced, because the grains in the titanium target material cannot be sufficiently refined due to too few processing cycles.
Example 7
This embodiment provides a method for grain refinement of a titanium target, which is the same as embodiment 1 except that the processing cycle in step (2) is changed to 6, and thus, the description thereof is omitted here.
Compared with the embodiment 1, the grain size of the finally obtained titanium target material in this embodiment is 14 μm, the refinement effect is not significantly improved, and the excessive machining period causes unnecessary extension of the machining time to a certain extent, which is not favorable for improving the machining efficiency.
Comparative example 1
This comparative example provides a method for grain refinement of a titanium target, which is the same as example 1 except that the preheating temperature in step (1) is reduced to 350 ℃, and thus, the details are not repeated herein.
Compared with the embodiment 1, the grain size of the finally obtained titanium target material in the comparative example is 23 μm, and the refinement degree is obviously reduced, because the titanium target material is not fully preheated due to too low temperature, and the subsequent three-way forging effect is further influenced.
Comparative example 2
The comparative example provides a method for grain refinement of a titanium target, which is the same as example 1 except that the preheating temperature in step (1) is raised to 550 ℃, and thus, the detailed description is omitted.
Compared with the embodiment 1, the grain size of the finally obtained titanium target material in the comparative example is 14 μm, the refining effect is not remarkably improved, and the preheating temperature is too high, so that the resource waste is caused to a certain extent, and the processing cost is not favorably saved.
Therefore, the invention refines the grain size of the titanium target material to 10-20 μm through preheating, three-dimensional forging and cooling in sequence, has simple process flow, improves the processing efficiency, reduces the processing cost, realizes the full preheating of the titanium target material at the preheating temperature of 400 plus one 500 ℃, avoids the resource waste caused by overhigh temperature, improves the sputtering performance and the sputtering environment of the obtained titanium target material and improves the film coating quality.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A method for grain refinement of a titanium target, comprising the steps of:
(1) preheating the titanium target material at 400-500 ℃;
(2) performing three-way forging on the titanium target material obtained in the step (1);
(3) and (3) cooling the titanium target material obtained in the step (2) to obtain the titanium target material with the grain size of 10-20 microns.
2. The method according to claim 1, wherein the grain size of the titanium target material in the step (1) is 20-30 μm.
3. The method of claim 1 or 2, wherein said preheating of step (1) is performed in a resistance furnace;
preferably, the preheating in the step (1) is kept for 5-30 min.
4. The method according to any one of claims 1 to 3, wherein the three-way forging of step (2) comprises 2 to 5 working cycles, each working cycle comprising a first pass, a second pass and a third pass performed in sequence.
5. The method as claimed in claim 4, wherein the first pass is specifically upsetting the titanium target material along the X-axis direction to a first deformation amount, and then drawing to an original size;
preferably, the first deformation amount is 40-60%.
6. The method according to claim 4 or 5, wherein the second pass is specifically upsetting the titanium target material to a second deformation amount along the Y-axis direction, and then drawing to the original size;
preferably, the second deformation amount is 40-60%.
7. The method according to any one of claims 4 to 6, wherein the third pass is to upset the titanium target material to a third deformation amount along the Z-axis direction and then draw the titanium target material to the original size;
preferably, the third deformation amount is 40-60%.
8. The method according to any one of claims 1 to 7, wherein the cooling in step (3) comprises water cooling and/or air cooling.
9. Method according to any of claims 1-8, characterized in that the method comprises the steps of:
(1) preheating a titanium target material with the grain size of 20-30 mu m in a resistance heating furnace at 400-500 ℃ for 5-30 min;
(2) performing three-way forging on the titanium target material obtained in the step (1); the three-way forging comprises 2-5 processing cycles, wherein each processing cycle comprises a first pass, a second pass and a third pass which are sequentially carried out; the first step is specifically that the titanium target material is upset along the X-axis direction until the deformation amount is 40-60%, and then is drawn to the original size; in the second pass, the titanium target material is upset along the Y-axis direction until the deformation is 40-60%, and then is drawn to the original size; the third step is to upset the titanium target material along the Z-axis direction until the deformation is 40-60%, and then drawing to the original size;
(3) and (3) cooling the titanium target material obtained in the step (2) by water and/or air to obtain the titanium target material with the grain size of 10-20 microns.
10. A titanium target material obtained by grain refinement by the method according to any one of claims 1 to 9.
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| CN202110758654.0A CN113481475A (en) | 2021-07-05 | 2021-07-05 | Method for refining titanium target material grains and titanium target material |
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| CN202110758654.0A CN113481475A (en) | 2021-07-05 | 2021-07-05 | Method for refining titanium target material grains and titanium target material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114657345A (en) * | 2022-03-31 | 2022-06-24 | 先导薄膜材料（广东）有限公司 | Iron target, iron-nickel alloy target and grain refining method of target |
| CN115341161A (en) * | 2022-08-22 | 2022-11-15 | 宁波江丰电子材料股份有限公司 | Copper-aluminum alloy target material and preparation method and application thereof |
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| US20120060981A1 (en) * | 2010-09-15 | 2012-03-15 | Ati Properties, Inc. | Processing Routes for Titanium and Titanium Alloys |
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| CN115341161A (en) * | 2022-08-22 | 2022-11-15 | 宁波江丰电子材料股份有限公司 | Copper-aluminum alloy target material and preparation method and application thereof |
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