CN113480951A - Refraction enhanced optical cement, display panel and preparation method thereof - Google Patents

Refraction enhanced optical cement, display panel and preparation method thereof Download PDF

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Publication number
CN113480951A
CN113480951A CN202110779816.9A CN202110779816A CN113480951A CN 113480951 A CN113480951 A CN 113480951A CN 202110779816 A CN202110779816 A CN 202110779816A CN 113480951 A CN113480951 A CN 113480951A
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light
layer
display panel
optical cement
emitting device
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邱晓华
万冲
秦凯
魏海燕
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Nantong Veeyeei New Material Technology Co ltd
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Nantong Veeyeei New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2244—Oxides; Hydroxides of metals of zirconium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention relates to a refraction-enhanced optical cement, a display panel and a preparation method thereof. The optical cement with high refractive index can be obtained by matching the optical cement main body with the filling medium, controlling the mass percent of the filling medium to be 1-80%, and selecting the filling medium from at least one of zirconia and titania according to the material selection and proportion. The optical cement is applied to the display panel, so that the light extraction rate of the display panel can be effectively improved. The display panel comprises a light-emitting device and an optical adhesive layer formed by the refraction enhanced optical adhesive, the optical adhesive layer covers the light-emitting surface of the light-emitting device, and the optical adhesive layer is formed on the light-emitting surface of the light-emitting device through the refraction enhanced optical adhesive, so that the refraction angle of light emitted by the pixel pits can be effectively improved, more light can escape into the air, and the light-emitting rate of the display panel is improved.

Description

Refraction enhanced optical cement, display panel and preparation method thereof
Technical Field
The invention relates to the technical field of display, in particular to a refraction-enhanced optical cement, a display panel and a preparation method thereof.
Background
Light emitting diodes are widely used in electronic products because of their advantages such as wide viewing angle, thinness, and thinness. When the organic light emitting diode is used to manufacture the display panel, a certain film layer is usually required to be formed on the surface of the light emitting device so that the light emitted from the light emitting device can be smoothly emitted. However, in the conventional display panel, when light is emitted from the light emitting device, most of the light is emitted at a large angle or is totally reflected on the surface of the device and cannot escape into the air due to the influence of reflection, refraction and other factors, so that the light emission rate of the light is reduced, the display efficiency of the display panel is reduced, and the power consumption of the display panel is increased.
Disclosure of Invention
Accordingly, there is a need for a refraction-enhanced optical adhesive capable of effectively improving the light-emitting rate of a display panel, a display panel including the optical adhesive, and a method for manufacturing the display panel.
In order to solve the problems, the technical scheme of the invention is as follows:
the refraction enhancement type optical cement comprises an optical cement main body and a filling medium, wherein the filling medium accounts for 1-80% of the refraction enhancement type optical cement by mass percent, and is at least one of zirconium oxide and titanium oxide.
In one embodiment, the particle size of the filling medium is 5nm to 5000 nm.
A display panel comprises a light-emitting device and an optical adhesive layer formed by the refraction enhanced optical adhesive in any embodiment, wherein the optical adhesive layer covers the light-emitting surface of the light-emitting device.
In one embodiment, the display panel further includes a planarization layer disposed between the light emitting device and the optical adhesive layer, and the planarization layer has a plurality of through holes.
In one embodiment, the through holes and the openings of the pixel pits of the light-emitting device correspond to each other one by one; or the through hole and the opening of the pixel pit of the light-emitting device are arranged in a staggered mode.
In one embodiment, the refractive index of the flat layer is 1.0-1.6;
and/or the thickness of the flat layer is 0.5-10 μm.
In one embodiment, the display panel further includes an encapsulation layer on a surface of the light emitting device, the encapsulation layer being closer to the planarization layer than the light emitting device.
In one embodiment, the refractive index of the optical adhesive layer is 1.5-2.5;
and/or the thickness of the optical adhesive layer is 5-50 μm.
A preparation method of a display panel comprises the following steps:
the refraction-enhanced optical cement as described in any of the above embodiments is transferred to the light-emitting surface of the light-emitting device to form an optical cement layer, or the optical cement layer formed by the refraction-enhanced optical cement as described in any of the above embodiments is attached to the light-emitting surface of the light-emitting device.
In one embodiment, the method further comprises the following steps before forming the optical adhesive layer:
and forming a flat layer on the light-emitting surface of the light-emitting device, and forming a plurality of through holes on the flat layer.
In the refraction enhancement type optical cement, the mass percent of the filling medium is controlled to be 1-80% through the matching of the optical cement main body and the filling medium, and the filling medium is selected from at least one of zirconia and titania, so that the optical cement with higher refractive index can be obtained under the conditions of material selection and proportion. The optical cement is applied to the display panel, so that the light extraction rate of the display panel can be effectively improved.
The display panel comprises a light-emitting device and an optical adhesive layer formed by the refraction enhanced optical adhesive, wherein the optical adhesive layer covers the light-emitting surface of the light-emitting device. The optical adhesive layer is formed on the light-emitting surface of the light-emitting device through the refraction enhanced optical adhesive, so that the refraction angle of light emitted by the light-emitting device can be effectively improved, more light can escape into the air, and the light-emitting rate of the display panel is improved.
Furthermore, the display panel further comprises a flat layer, the flat layer is arranged between the pixel defining layer and the optical adhesive layer, and the flat layer is provided with a plurality of through holes. Through the setting of the flat layer that has a plurality of through-holes, make the optical cement layer form the microlens structure that the array was arranged in through-hole department, can further adjust the refraction direction of the light that the pixel hole sent, make more light in the position of predetermineeing escape to the air, can control the light like this more conveniently, realize the gathering or the divergence of light at the position of predetermineeing.
Drawings
FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
fig. 6 is a schematic diagram of light emission of a display panel in embodiment 6 of the present invention;
FIG. 7 is a schematic diagram of a display panel and its light-emitting pattern in comparative example 7.
The notation in the figure is:
100. a display panel; 101. a pixel defining layer; 1011. a red pixel pit; 1012. a blue pixel pit; 1013. a green pixel pit; 102. an optical adhesive layer; 1021. an optical cement body; 1022. filling a medium; 103. a planarization layer; 1031. a through hole; 104. a packaging layer; 105. a touch layer; 106. a TFT layer; 200. a display panel; 201. a pixel defining layer; 2011. a red pixel pit; 2012. a blue pixel pit; 2013. a green pixel pit; 202. a planarization layer; 203. a packaging layer; 204. a touch layer; 205. a TFT layer; 300. light rays.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
An embodiment of the invention provides a refraction-enhanced optical cement. The refraction enhancement type optical cement comprises an optical cement main body and a filling medium, wherein the filling medium accounts for 1-80% of the refraction enhancement type optical cement by mass percent, and is at least one of zirconium oxide and titanium oxide. In the refraction-enhanced optical cement of the embodiment, the mass percentage of the filling medium is controlled to be 1% -80% by matching the optical cement main body and the filling medium, and the filling medium is selected from at least one of zirconia and titania, so that the optical cement with a higher refractive index can be obtained by selecting materials and proportioning. The optical cement is applied to the display panel, so that the light extraction rate of the display panel can be effectively improved.
In a specific example, the mass fraction of the filling medium is 1% to 50% in terms of mass percentage of the refraction-enhanced optical cement. Furthermore, the mass fraction of the filling medium is 3-50% in terms of the mass percentage of the refraction enhancement type optical cement. Furthermore, the mass fraction of the filling medium is 5-40% in terms of the mass percentage of the refraction enhancement type optical cement.
Alternatively, the mass percent of the filling medium may be, but is not limited to, 1%, 2%, 5%, 8%, 10%, 12%, 15%, 18%, 20%, 23%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80% by mass of the refraction-enhancing optical cement. .
In another specific example, the refraction enhancement type optical cement is composed of an optical cement main body and a filling medium, wherein the mass percentage of the filling medium is 1% -80% of the mass percentage of the refraction enhancement type optical cement, and the filling medium is at least one of zirconium oxide and titanium oxide. In the example, the refraction-enhanced optical cement can be obtained only through the optical cement main body and the filling medium, and the optical cement with a higher refractive index can also be obtained, and the optical cement can be further applied to the display panel to effectively improve the light extraction rate of the display panel. Optionally, the mass fraction of the filling medium is 1% to 50% in terms of the mass percentage of the refraction-enhanced optical cement. Optionally, the mass fraction of the filling medium is 3% to 50% in terms of mass percentage of the refraction-enhanced optical cement. Furthermore, the mass fraction of the filling medium is 5-40% in terms of the mass percentage of the refraction enhancement type optical cement. Still further, the mass percent of the filling medium as a mass percent of the refraction enhancing optical glue may be, but is not limited to, 1%, 2%, 5%, 8%, 10%, 12%, 15%, 18%, 20%, 23%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80%. .
In particular, the zirconium oxide is of ZrxOyAt least one compound of formula (la) wherein x: y is 1: (1-2). Alternatively, x: y may be, but is not limited to, 1:1, 1:1.2, 1:1.5, 1:1.8, or 1: 2. It is understood that the zirconia may be of ZrxOyA mixture of any one or more of the compounds of formula (la). Preferably, x is 1. Further preferably, the zirconia is ZrO2。
Specifically, the titanium oxide is titanium oxide having TimOnAt least one compound of formula (la) wherein m: n is 1: (1-2). Alternatively, m: n can be, but is not limited to, 1:1, 1:1.2, 1:1.5, 1:1.8, 1: 2. It is understood that the titanium oxide may have TimOnA mixture of any one or more of the compounds of formula (la). Preferably, m is 1. Further preferably, the titanium oxide is TiO2。
It will be appreciated that during the preparation of the optical cement, a filling medium having a different refractive index than the bulk of the optical cement may be selected. Preferably, the filling medium is a nanoparticulate filling medium.
In a preferred embodiment, the particle size of the filling medium is 5nm to 5000 nm. Preferably, the particle size of the filling medium is between 5nm and 3000 nm. More preferably, the particle size of the filling medium is 5nm to 1000 nm. More preferably, the particle size of the filling medium is 5nm to 100 nm. It is understood that the particle size of the filling medium may be, but is not limited to, 5nm, 10nm, 15nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 50nm, 55nm, 60nm, 65nm, 70nm, 75nm, 80nm, 85nm, 90nm, 95nm, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, 450nm, 500nm, 550nm, 600nm, 650nm, 700nm, 750nm, 800nm, 850nm, 900nm, 950nm, 1000nm, 1500nm, 2500nm, 3000nm, 3500nm, 4000nm, 4500nm, or 5000 nm.
It is understood that in the refraction enhanced optical cement, as some specific choices of the optical cement body, the optical cement body is an OCA optical cement body or an OCR optical cement body.
In a specific example, as a method for preparing the above refraction-enhanced optical cement, it comprises the steps of: and uniformly mixing the filler medium and the optical cement main body. The filler medium and the optical main body are uniformly mixed to obtain the refraction-enhanced optical cement, and the preparation method is simple and feasible and is suitable for industrial popularization.
Referring to fig. 1, an embodiment of the invention provides a display panel 100, where the display panel 100 includes a light emitting device and an optical adhesive layer 102 formed by the refraction-enhanced optical adhesive, and the optical adhesive layer 102 covers a light emitting surface of the light emitting device. It is understood that the light emitting device includes the pixel defining layer 101 and the pixel pits defined by the pixel defining layer 101. Pixel pits are divided into red pixel pit 1011, blue pixel pit 1012, and green pixel pit 1013. A light emitting layer is arranged in the pixel pit. For example, a red light emitting layer is provided in red pixel hole 1011, a blue light emitting layer is provided in blue pixel hole 1012, and a green light emitting layer is provided in green pixel hole 1013. The opening of the pixel pit faces the light-emitting surface of the light-emitting device. In the display panel 100 of the embodiment, the optical adhesive layer 102 is formed on the light emitting surface of the light emitting device by the refraction enhanced optical adhesive, so that the refraction angle of light emitted from the pixel pits can be effectively improved, more light escapes to the air, and the light emitting rate of the display panel 100 is improved.
It will be appreciated that the optical glue layer 102 includes an optical glue body 1021 and a fill medium 1022. Preferably, the filling medium 1022 is distributed inside the optical glue body 1021.
Referring to fig. 2, in a specific example, the display panel 100 further includes a planarization layer 103, the planarization layer 103 is disposed between the light emitting device and the optical adhesive layer 102, and the planarization layer 103 has a plurality of through holes 1031. Through the setting of the planarization layer 103 with a plurality of through holes 1031, the optical adhesive layer 102 forms the microlens structure arranged in an array at the through holes 1031, so that the refraction direction of light emitted by the pixel pits can be further adjusted, more light escapes to the air at a preset position, and thus, the light can be more conveniently controlled, and the light can be gathered or diffused at the preset position.
It will be appreciated that the predetermined position may refer to a position where light needs to be concentrated, or may refer to a position where light needs to be dispersed. In the design process of the display panel 100, a predetermined position of light concentration and/or light divergence may be formed by the cooperation of the through hole 1031 and the pixel pit opening.
For example, the via 1031 and the pixel pit opening correspond to each other. At this time, the positional relationship of the via hole 1031 and the pixel pit opening may be represented as shown in fig. 2 and 3. Under the condition, when the light emitted from the pixel pit escapes to the air at the through hole 1031, the light can be gathered at the through hole 1031, so that the light has a higher light extraction rate at the through hole 1031, and the display effect at the through hole 1031 is further improved. At this time, the light-emitting schematic diagram of the display panel 100 can be as shown in fig. 6. Specifically, after light emitted from red pixel pit 1011 passes through-hole 1031 and optical adhesive layer 102, a certain degree of focusing is performed at the position of through-hole 1031, and the display effect of light emission from red pixel pit 1011 can be improved. Light emitted from blue pixel pit 1012 passes through-hole 1031 and optical adhesive layer 102, and is collected to some extent at the position of through-hole 1031, whereby the display effect of light emission from blue pixel pit 1012 can be improved. Light emitted from green pixel well 1013 passes through via-hole 1031 and optical adhesive layer 102, and is collected to some extent at the position of via-hole 1031, so that the display effect of light emission from green pixel well 1013 can be improved.
For another example, the via 1031 and the pixel pit opening are offset from each other. At this time, the positional relationship of the via hole 1031 and the pixel pit opening may be represented as shown in fig. 4 and 5. Under the condition, the light emitted from the pixel pits is further refracted after passing through the through holes 1031 and the optical adhesive layer 102, and the light rays representing the positions on the surface of the display panel 100 corresponding to the pixel pits have a certain divergence tendency, so that the display effect of the light emission of the pixel pits can be adjusted.
It can be understood that, in the positional relationship between the through holes 1031 and the pixel pit openings, the through holes 1031 and the pixel pit openings may partially correspond to each other, or may correspond to each other one by one, so as to flexibly adjust the converging and diverging positions of the light rays. That is, when the through holes 1031 and the pixel pit openings are provided, the through holes 1031 and the pixel pit openings may be in one-to-one correspondence, or the through holes 1031 and the pixel pit openings may be partially staggered in correspondence. Preferably, the through holes 1031 correspond to the pixel pit openings one by one, or the through holes 1031 and the pixel pit openings are arranged in a staggered manner, and further, the through holes 1031 and the pixel pit openings are arranged in a staggered manner one by one.
In a specific example, the side of the optical glue layer 102 is flush with the side of the planarization layer 103 or the optical glue layer 102 entirely covers the planarization layer 103. In the design process of the display panel 100, the side surface of the optical adhesive layer 102 is flush with the side surface of the planarization layer 103 or the optical adhesive layer 102 entirely covers the planarization layer 103 according to the design requirement to achieve a good packaging effect.
In a specific example, the refractive index of the optical adhesive layer 102 is 1.5-2.5. The optical cement has a high refractive index through the matching of the filling medium 1022 and the optical cement main body 1021, and preferably, the refractive index of the optical cement layer 102 is 1.5-2.3. Alternatively, the refractive index of the optical glue layer 102 may be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, 1.75, 1.8, 1.85, 1.9, 1.95, 2, 2.05, 2.1, 2.15, 2.2, 2.25, 2.3, 2.35, 2.4, 2.45, or 2.5. .
Further, the thickness of the optical adhesive layer 102 is 5 μm to 50 μm. The optical adhesive layer 102 has a thickness in the range of 5 μm to 50 μm, and can achieve both a good microlens array effect and a suitable thickness of the display panel 100. It is understood that the thickness of the optical glue layer 102 may be, but is not limited to, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm, 48 μm, or 50 μm.
Further, the refractive index of the planarization layer 103 is 1.0 to 1.6. The refractive index of the planarization layer 103 is lower than that of the optical glue layer 102, so that the planarization layer 103 and the optical glue layer 102 are better adapted to enable light rays to be better concentrated or scattered at a predetermined position. It is understood that the refractive index of the planarization layer 103 can be, but is not limited to, 1.05, 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.45, 1.5, 1.55.
Further, the thickness of the planarization layer 103 is 0.5 μm to 10 μm. By means of a suitable thickness setting, the flat layer 103 and the optical glue layer 102 are better adapted, and the light can be gathered or diffused at a preset position more conveniently. Alternatively, the thickness of the planarization layer 103 can be, but is not limited to, 1 μm, 1.2 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm.
In a specific example, the width of the via 1031 is 5 μm to 50 μm. Alternatively, the width of the via 1031 may be, but is not limited to, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm.
It is understood that the width of the pixel pit opening refers to the width of one end of the pixel pit opening close to the light exit surface. The width of the via 1031 refers to the width of the via 1031 at the surface of the planarization layer 103 near the light emitting device. Preferably, the width of the via 1031 is greater than or equal to the width of the pixel pit opening. In an actual process, the width of the via hole 1031 is controlled to be greater than or equal to the width of the opening of the pixel pit, so that the pixel pit is completely exposed at the via hole 1031 corresponding thereto.
In one particular example, the display panel 100 further includes an encapsulation layer 104, the encapsulation layer 104 being positioned between the image light emitting device and the optical glue layer 102. Referring to fig. 2 to 5 again, the encapsulation layer 104 is further disposed on the surface of the light emitting device, and the encapsulation layer 104 is closer to the planarization layer 103 than the light emitting device.
In a specific example, the display panel 100 further includes a touch layer 105, and the touch layer 105 is located between the image light emitting device and the optical adhesive layer 102. Referring to fig. 3 or fig. 5 again, further, the touch layer 105 is disposed between the planarization layer 103 and the encapsulation layer 104.
It is understood that the display panel 100 further includes a TFT layer 106, and the light emitting device is disposed on a surface of the TFT layer.
Yet another embodiment of the present invention provides a method of manufacturing a display panel 100. The manufacturing method of the display panel 100 includes the following steps: the refraction-enhanced optical cement is transferred to the light-emitting surface of the light-emitting device to form the optical cement layer 102, or the refraction-enhanced optical cement is attached to the light-emitting surface of the light-emitting device to form the optical cement layer 102.
It is understood that the refraction-enhanced optical adhesive may be transferred to the light-emitting surface of the light-emitting device to form the optical adhesive layer 102. Or the refraction-enhanced optical cement may be formed into the optical cement layer 102 and then attached to the light-emitting surface of the light-emitting device.
Further, before the refraction-enhanced optical cement is transferred to the light-emitting surface of the light-emitting device to form the optical cement layer 102, or the optical cement layer formed by attaching the refraction-enhanced optical cement to the light-emitting surface of the light-emitting device further includes the following steps: a planarization layer 103 is formed on a light emitting surface of the light emitting device, and a plurality of via holes 1031 are formed on the planarization layer 103. It is understood that the via 1031 may be formed on the planarization layer 103 by etching. It is also understood that the via 1031 may be formed on the planarization layer 103 by a patterning method including exposure, etching, and the like, and then the planarization layer 103 having a surface topography may be obtained.
Further, when the via holes 1031 are formed on the planarization layer 103, the control via holes 1031 and the pixel pit openings correspond to each other one by one. Alternatively, when the via hole 1031 is formed on the planarization layer 103, the via hole 1031 is controlled to be disposed in a position shifted from the pixel pit opening.
In a specific example, before the planarization layer 103 is formed on the light emitting surface of the light emitting device, the method further includes the following steps: a package layer 104 is formed on the light emitting surface of the light emitting device.
In another specific example, before the planarization layer 103 is formed on the light emitting surface of the light emitting device, the method further includes the following steps: a touch layer 105 is formed on the light emitting surface of the light emitting device.
In another specific example, before the planarization layer 103 is formed on the light emitting surface of the light emitting device, the method further includes the following steps: a touch layer 105 is formed on the surface of the encapsulation layer 104 away from the light emitting device.
In another specific example, before the optical adhesive layer 102 is formed on the light emitting surface of the light emitting device, the method further includes the following steps: the light emitting device is mounted to the surface of the TFT layer 106.
It is understood that the thickness of the optical adhesive layer 102 is controlled to be 10 μm to 50 μm when the optical adhesive layer 102 is formed. When the flat layer 103 is formed on the light emitting surface of the light emitting device, the thickness of the flat layer 103 is controlled to be 1 μm to 5 μm. The width of the via-hole 1031 is controlled to be 5 μm to 50 μm when the via-hole 1031 is formed on the planarization layer 103.
The following are specific examples.
Examples 1 to 5 and comparative examples 1 to 2
In the optical cement of the embodiment 1-the embodiment 5 and the comparative example 1-the comparative example 2, the optical cement main body is OCA optical cement. The filling medium and the mass percent thereof are shown in table 1, wherein the mass percent is calculated by the mass percent of the refraction enhancement type optical cement. The refractive index of the optical cement is shown in table 1. The particle size of the filling medium is 5 nm-50 nm.
TABLE 1
Filling medium Mass percent Refractive index of optical cement
Example 1 ZrO2 5％ 1.51
Example 2 ZrO2 20％ 1.56
Example 3 ZrO2 40％ 1.62
Example 4 TiO2 20％ 1.58
Example 5 TiO2 40％ 1.68
Comparative example 1 ZrO2 0.5％ 1.47
Comparative example 2 TiO2 0.5％ 1.48
As can be seen from Table 1, the optical pastes of examples 1 to 5 have higher refractive indexes than those of comparative examples 1 to 2. TiO 22Filling ratio ZrO2The effect of filling on improving the refractive index is better, and is limited by the performance of the filling medium, TiO2Filled optical cement ratio ZrO2Filled withThe optical cement has a slightly lower transmittance.
Example 6
The structure of the display panel in this embodiment is shown in fig. 5, and the light-emitting schematic diagram is shown in fig. 6. The display panel comprises an optical adhesive layer, a flat layer with a plurality of through holes, a touch layer, an encapsulation layer, a light-emitting device with pixel pits and a TFT layer which are sequentially stacked. The pixel pits are divided into red pixel pits, blue pixel pits, and green pixel pits. The through holes correspond to the pixel pit openings one to one.
Wherein, the optical adhesive layer is the optical adhesive layer formed by the optical adhesive in the embodiment 3. The thickness of the optical adhesive layer is 20 μm, the thickness of the planarization layer is 5 μm, and the refractive index of the planarization layer is 1.1. The width of the via hole is equal to the width of the opening of the pixel pit, and the width of the via hole is 40 μm.
As can be seen from fig. 6, the light 300 is significantly refracted at the through hole, so that the light is concentrated at the through hole, which is represented by the light being concentrated at the area of the surface of the display panel corresponding to the pixel pits.
Comparative example 3
The difference of comparative example 3 compared with example 6 is that the optical adhesive layer is the optical adhesive layer formed by the optical adhesive in comparative example 1.
Comparative example 4
Comparative example 4 differs from example 6 in that no filling medium is added to the optical cement.
Comparative example 5
The structure of the display panel 200 and the light extraction diagram thereof in this comparative example are shown in fig. 7. The display panel 200 includes a planarization layer 202, a touch layer 204, an encapsulation layer 203, a light emitting device having a pixel pit, and a TFT layer 205, which are sequentially stacked. The light emitting device includes a pixel defining layer 201, and the pixel defining layer 201 defines a pixel pit. The pixel pits are divided into red pixel pit 2011, blue pixel pit 2012, and green pixel pit 2013. The planarization layer 202 has no vias.
The thickness of the planarization layer 202 is 5 μm, and the refractive index of the planarization layer 202 is 1.1. The width of the pixel pit opening was 40 μm.
As can be seen from fig. 7, the light 300 is not concentrated on the area of the surface of the display panel 200 corresponding to the pixel pits.
Test example
The light-emitting rates of the display panels of example 6 and comparative examples 5 to 7 were respectively characterized by performing a luminous intensity test. The test results are shown in table 2.
TABLE 2
Example 6 Comparative example 3 Comparative example 4 Comparative example 5
Luminous intensity (cd) 58 44 41 40
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims, and the description and the drawings can be used for explaining the contents of the claims.

Claims (10)

1. The refraction enhancement type optical cement is characterized by comprising an optical cement main body and a filling medium, wherein the filling medium accounts for 1-80% of the refraction enhancement type optical cement by mass percent, and is at least one of zirconium oxide and titanium oxide.
2. The refraction-enhanced optical cement of claim 1, wherein the particle size of the filling medium is between 5nm and 5000 nm.
3. A display panel, comprising a light emitting device and the refraction-enhanced optical cement of any one of claims 1-2 to form an optical cement layer, wherein the optical cement layer covers the light emitting surface of the light emitting device.
4. The display panel of claim 3, further comprising a planarization layer disposed between the light emitting device and the optical adhesive layer, the planarization layer having a plurality of through holes.
5. The display panel according to claim 4, wherein the through holes and the openings of the pixel pits of the light emitting devices correspond one to each other; or the through hole and the opening of the pixel pit of the light-emitting device are arranged in a staggered mode.
6. The display panel according to any one of claims 4 to 5, wherein the flat layer has a refractive index of 1.0 to 1.6;
and/or the thickness of the flat layer is 0.5-10 μm.
7. The display panel according to any one of claims 4 to 5, further comprising an encapsulation layer on a surface of the light emitting device, the encapsulation layer being closer to the planarization layer than the light emitting device.
8. The display panel according to any one of claims 3 to 5, wherein the optical adhesive layer has a refractive index of 1.5 to 2.5;
and/or the thickness of the optical adhesive layer is 5-50 μm.
9. A preparation method of a display panel is characterized by comprising the following steps:
transferring the refraction enhancement type optical cement as defined in any one of claims 1-2 on the light-emitting surface of a light-emitting device to form an optical cement layer, or attaching the refraction enhancement type optical cement as defined in any one of claims 1-2 on the light-emitting surface of the light-emitting device to form an optical cement layer.
10. The method for manufacturing a display panel according to claim 9, further comprising the steps of, before forming the optical adhesive layer:
and forming a flat layer on the light-emitting surface of the light-emitting device, and forming a plurality of through holes on the flat layer.
CN202110779816.9A 2021-07-09 2021-07-09 Refraction enhanced optical cement, display panel and preparation method thereof Pending CN113480951A (en)

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Application publication date: 20211008