CN113480950A - Pressure-sensitive adhesive, polaroid and display panel - Google Patents
Pressure-sensitive adhesive, polaroid and display panel Download PDFInfo
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- CN113480950A CN113480950A CN202110779814.XA CN202110779814A CN113480950A CN 113480950 A CN113480950 A CN 113480950A CN 202110779814 A CN202110779814 A CN 202110779814A CN 113480950 A CN113480950 A CN 113480950A
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- sensitive adhesive
- pressure
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- display panel
- emitting device
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 149
- 239000010410 layer Substances 0.000 claims abstract description 159
- 238000011049 filling Methods 0.000 claims abstract description 52
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 23
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 15
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 238000012938 design process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004568 cement Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2244—Oxides; Hydroxides of metals of zirconium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2429/00—Presence of polyvinyl alcohol
- C09J2429/006—Presence of polyvinyl alcohol in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Polarising Elements (AREA)
Abstract
The invention relates to a pressure-sensitive adhesive, a polaroid and a display panel. In the pressure-sensitive adhesive, the mass percent of the filling medium is controlled to be 1-80% through the matching of the pressure-sensitive adhesive main body and the filling medium, and the filling medium is selected from at least one of zirconium oxide and titanium oxide, so that the pressure-sensitive adhesive with higher refractive index can be obtained under the conditions of material selection and proportion. The light-emitting rate of the display panel can be effectively improved by applying the pressure-sensitive adhesive to the display panel. The polaroid can obtain obvious refraction enhancement effect while maintaining the basic performance of the polaroid through the matching of the polarizing film, the phase difference film and the pressure-sensitive adhesive layer. In the display panel, the polaroid is arranged on the light-emitting surface of the light-emitting device, and the pressure-sensitive adhesive of the polaroid covers the light-emitting surface of the light-emitting device, so that the refraction angle of light emitted by the light-emitting device can be effectively improved, the proportion of light rays subjected to total reflection is reduced, more light rays can be emitted into the air, and the light-emitting rate of the display panel is further improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a pressure-sensitive adhesive, a polarizer and a display panel.
Background
The display panel is a product which is widely used at present, and can present diversified display pictures through a photoelectric conversion principle. Among the components of the display panel, the light emitting diode has been widely used as a light emitting device because of its advantages of wide viewing angle, thinness, and the like. In general, when a display panel is manufactured by using a light emitting diode as a light emitting device, a functional film layer is formed on a surface of the light emitting device so that light emitted from the light emitting device can be smoothly emitted. However, in the conventional display panel, a large amount of light is totally reflected, so that a part of light cannot be emitted into the air, and thus the overall light-emitting rate of the display panel is low, and the display efficiency of the display panel is reduced.
Disclosure of Invention
Accordingly, it is desirable to provide a pressure-sensitive adhesive capable of effectively improving the light-emitting rate of a display panel, a polarizer including a pressure-sensitive adhesive layer formed by the pressure-sensitive adhesive, and a display panel including the polarizer.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the pressure-sensitive adhesive comprises a pressure-sensitive adhesive main body and a filling medium, wherein the filling medium accounts for 1-80% of the pressure-sensitive adhesive by mass, and is at least one of zirconium oxide and titanium oxide.
In one embodiment, the zirconia is of ZrxOyAt least one compound of formula (la) wherein x: y is 1: (1-2).
In one embodiment, the titanium oxide is titanium oxide having TimOnAt least one compound of formula (la) wherein m: n is 1: (1-2).
In one embodiment, the particle size of the filling medium is 5nm to 5000 nm.
A polarizer comprising a polarizing film, a phase difference film, and a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive as described in any of the above embodiments; the phase difference film is covered on one surface of the pressure-sensitive adhesive layer, and the polarizing film is covered on the surface, far away from the pressure-sensitive adhesive layer, of the phase difference film.
In one embodiment, the refractive index of the pressure-sensitive adhesive layer is 1.5-2.5;
and/or the thickness of the pressure-sensitive adhesive layer is 10-100 mu m.
A display panel comprises a light-emitting device and the polarizer in any embodiment, wherein the pressure-sensitive adhesive layer of the polarizer covers the light-emitting surface of the light-emitting device.
In one embodiment, the display panel further includes a planarization layer disposed between the light emitting device and the polarizer, the planarization layer having a plurality of through holes.
In one embodiment, the through holes and the openings of the pixel pits of the light-emitting device correspond to each other one by one; or the through hole and the opening of the pixel pit of the light-emitting device are arranged in a staggered mode.
A display panel comprises a light-emitting device and a pressure-sensitive adhesive layer formed by the pressure-sensitive adhesive in any one of the embodiments, wherein the pressure-sensitive adhesive layer covers the light-emitting surface of the light-emitting device.
In the pressure-sensitive adhesive, the mass percent of the filling medium is controlled to be 1-80% through the matching of the pressure-sensitive adhesive main body and the filling medium, and the filling medium is selected from at least one of zirconium oxide and titanium oxide, so that the pressure-sensitive adhesive with higher refractive index can be obtained under the conditions of material selection and proportion. The light-emitting rate of the display panel can be effectively improved by applying the pressure-sensitive adhesive to the display panel.
The polaroid comprises a polarizing film, a phase difference film and a pressure-sensitive adhesive layer formed by the pressure-sensitive adhesive. The phase difference film is covered on one surface of the pressure-sensitive adhesive layer, and the polarizing film is covered on the surface of the phase difference film far away from the pressure-sensitive adhesive layer. The polaroid can obtain an obvious refraction enhancement effect while maintaining the basic performance of the polaroid through the matching of the polarizing film, the phase difference film and the pressure-sensitive adhesive layer.
The display panel comprises a light-emitting device and the polarizer, wherein the pressure-sensitive adhesive layer of the polarizer covers the light-emitting surface of the light-emitting device. The polaroid is arranged on the light-emitting surface of the light-emitting device, and the pressure-sensitive adhesive of the polaroid covers the light-emitting surface of the light-emitting device, so that the refraction angle of light emitted by the light-emitting device can be effectively improved, the proportion of light rays subjected to total reflection is reduced, more light rays can be emitted into the air, and the light-emitting rate of the display panel is further improved.
Furthermore, the display panel further comprises a flat layer, the flat layer is arranged between the light-emitting device and the polarizer, and the flat layer is provided with a plurality of through holes. The arrangement of the flat layer with the through holes enables the polaroid to form the micro-lens structure arranged in an array at the through hole, especially enables the pressure-sensitive adhesive of the polaroid to form the micro-lens structure arranged in an array at the through hole, can further adjust the refraction direction of light emitted by the pixel pit, enables more light to escape to the air at a preset position, can more conveniently control light rays, and realizes the gathering or the dispersing of the light rays at the preset position.
Drawings
FIG. 1 is a schematic structural diagram of a polarizer according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a polarizer according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a display panel according to another embodiment of the present invention;
fig. 8 is a schematic diagram of light emission of a display panel in embodiment 6 of the present invention;
FIG. 9 is a schematic diagram of a display panel and its light emission in comparative example 7 of the present invention.
The notation in the figure is:
100. a polarizer; 101. a pressure sensitive adhesive layer; 1011. a pressure sensitive adhesive body; 1012. filling a medium; 102. a phase difference film; 103. a polarizing film; 104. a polarizing film protective film; 200. a display panel; 201. a pixel defining layer; 2011. a red pixel pit; 2012. a blue pixel pit; 2013. a green pixel pit; 202. a planarization layer; 2021. a through hole; 203. a packaging layer; 204. a touch layer; 205. a TFT layer; 300. a display panel; 301. a pixel defining layer; 3011. a red pixel pit; 3012. a blue pixel pit; 3013. a green pixel pit; 302. a planarization layer; 303. a packaging layer; 304. a touch layer; 305. a TFT layer; 400. light rays.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
One embodiment of the invention provides a pressure-sensitive adhesive. The pressure-sensitive adhesive comprises a pressure-sensitive adhesive main body and a filling medium, wherein the filling medium accounts for 1-80% of the pressure-sensitive adhesive by mass, and is at least one of zirconium oxide and titanium oxide. In the pressure-sensitive adhesive of the embodiment, the mass percent of the filling medium is controlled to be 1% -80% by matching the pressure-sensitive adhesive main body with the filling medium, and the filling medium is selected from at least one of zirconium oxide and titanium oxide, so that the pressure-sensitive adhesive with higher refractive index can be obtained by selecting materials and proportioning. The light-emitting rate of the display panel can be effectively improved by applying the pressure-sensitive adhesive to the display panel. Preferably, the mass percent of the filling medium is 1-50% of the mass percent of the pressure-sensitive adhesive, more preferably, the mass percent of the filling medium is 3-50% of the mass percent of the pressure-sensitive adhesive, and even more preferably, the mass percent of the filling medium is 5-40% of the mass percent of the pressure-sensitive adhesive.
Alternatively, as a mass percentage of some of the filling media, the mass percentage of the filling media may be, but is not limited to, 1%, 2%, 5%, 8%, 10%, 12%, 15%, 18%, 20%, 23%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80% in terms of mass percentage of the pressure sensitive adhesive.
In a specific example, the pressure-sensitive adhesive consists of a pressure-sensitive adhesive main body and a filling medium, wherein the filling medium accounts for 1-80% of the pressure-sensitive adhesive by mass percent, and the filling medium is at least one of zirconium oxide and titanium oxide. In the example, the pressure-sensitive adhesive can be obtained only through the pressure-sensitive adhesive main body and the filling medium, and the pressure-sensitive adhesive with higher refractive index can also be obtained, and the light-emitting rate of the display panel can be effectively improved by further applying the pressure-sensitive adhesive to the display panel. Optionally, the mass fraction of the filling medium is 1% to 50% in terms of mass percentage of the pressure-sensitive adhesive. Further, the mass fraction of the filling medium is 3-50% in terms of the mass percentage of the pressure-sensitive adhesive. Further, the mass fraction of the filling medium is 5-40% in terms of the mass percentage of the pressure-sensitive adhesive. Still further, the mass percent of the filling medium may be, but is not limited to, 1%, 2%, 5%, 8%, 10%, 12%, 15%, 18%, 20%, 23%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80% by mass percent of the pressure sensitive adhesive.
In particular, the zirconium oxide is of ZrxOyAt least one compound of formula (la) wherein x: y is 1: (1-2). Alternatively, x: y may be, but is not limited to, 1:1, 1:1.2, 1:1.5, 1:1.8, or 1: 2. It is understood that the zirconia may be of ZrxOyA mixture of any one or more of the compounds of formula (la). Preferably, x is 1. Further preferably, the zirconia is ZrO2。
Specifically, the titanium oxide is titanium oxide having TimOnAt least one compound of formula (la) wherein m: n is 1: (1-2). Alternatively, m: n can be, but is not limited to, 1:1, 1:1.2, 1:1.5, 1:1.8, 1: 2. It is understood that the titanium oxide may have TimOnA mixture of any one or more of the compounds of formula (la). Preferably, m is 1. Further preferably, the titanium oxide is TiO2。
It will be appreciated that during the preparation of the pressure sensitive adhesive, a filling medium having a different refractive index than the bulk of the pressure sensitive adhesive may be selected. Preferably, the filling medium is a nanoparticulate filling medium.
As an alternative to the particle size of the filling medium, the particle size of the filling medium is between 5nm and 5000 nm. Preferably, the particle size of the filling medium is between 5nm and 3000 nm. More preferably, the particle size of the filling medium is 5nm to 1000 nm. More preferably, the particle size of the filling medium is 5nm to 100 nm. It is understood that the particle size of the filling medium may be, but is not limited to, 5nm, 10nm, 15nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 50nm, 55nm, 60nm, 65nm, 70nm, 75nm, 80nm, 85nm, 90nm, 95nm, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, 450nm, 500nm, 550nm, 600nm, 650nm, 700nm, 750nm, 800nm, 850nm, 900nm, 950nm, 1000nm, 1500nm, 2500nm, 3000nm, 3500nm, 4000nm, 4500nm, or 5000 nm.
In a specific example, as a preparation method of the above pressure-sensitive adhesive, it includes the steps of: and uniformly mixing the filler medium and the pressure-sensitive adhesive main body. The filler medium and the pressure-sensitive adhesive main body are uniformly mixed to obtain the pressure-sensitive adhesive, and the preparation method is simple and feasible and is suitable for industrial popularization. It is understood that the particle size of the filling medium means the particle size of the filling medium before mixing with the pressure sensitive adhesive body.
Referring to FIG. 1, an embodiment of the invention provides a polarizer 100. The polarizer 100 includes a polarizing film 103, a phase difference film 102, and a pressure-sensitive adhesive layer 101 formed of the above pressure-sensitive adhesive; a phase difference film 102 is covered on one surface of the pressure-sensitive adhesive layer 101, and a polarizing film 103 is covered on the surface of the phase difference film 102 remote from the pressure-sensitive adhesive layer 101. The polarizer 100 in this embodiment can obtain a significant refraction enhancement effect while maintaining the basic performance of the polarizer 100 through the cooperation of the polarizing film 103, the phase difference film 102, and the pressure-sensitive adhesive layer 101.
It is understood that the pressure sensitive adhesive layer 101 includes a pressure sensitive adhesive body 1011 and a filling medium 1012. Preferably, the filling medium 1012 is distributed inside the pressure sensitive adhesive body 1011.
In one specific example, the polarizing film 103 is a polyvinyl alcohol polarizing film. It is understood that the polyvinyl alcohol polarizer film may be selected from conventional polyvinyl alcohol polarizer films.
In a specific example, the pressure-sensitive adhesive layer 101 has a refractive index of 1.5 to 2.5. The pressure-sensitive adhesive layer 101 can have a high refractive index through the matching of the filling medium 1012 and the pressure-sensitive adhesive main body 1011, and preferably, the refractive index of the pressure-sensitive adhesive layer 101 is 1.5-2.3. Alternatively, the refractive index of the pressure sensitive adhesive layer 101 may be, but is not limited to, 1.5, 1.55, 1.6, 1.65, 1.7, 1.75, 1.8, 1.85, 1.9, 1.95, 2, 2.05, 2.1, 2.15, 2.2, 2.25, 2.3, 2.35, 2.4, 2.45, or 2.5.
Further, the thickness of the pressure-sensitive adhesive layer 101 is 10 μm to 100 μm. The pressure sensitive adhesive layer 101 has a thickness of 10 μm to 100 μm, and can achieve both a good refraction effect and an appropriate thickness. It is understood that the thickness of the pressure-sensitive adhesive layer 101 may be, but is not limited to, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 38 μm, 40 μm, 42 μm, 45 μm, 48 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, or 100 μm.
Referring to fig. 2, in a specific example, the polarizer 100 further includes a polarizing film protective film 104, and the polarizing film protective film 104 is located on a surface of the polarizing film 103 away from the phase difference film 102. The polarizing film protective film 104 can provide good protection for the polarizing film 103, so that the polarizing film 103 can maintain stable structure and performance. At this time, the polarizer 100 includes a pressure-sensitive adhesive layer 101, a phase difference film 102, a polarizing film 103, and a polarizing film protective film 104, which are sequentially stacked.
Referring to fig. 3 to 6, a display panel 200 according to another embodiment of the present invention is provided. The display panel 200 includes a light emitting device and the polarizer 100, and the pressure sensitive adhesive layer 101 of the polarizer 100 covers the light emitting surface of the light emitting device.
It is understood that the light emitting device includes the pixel defining layer 201 and the pixel pits defined by the pixel defining layer 201. The pixel pits are divided into red pixel pit 2011, blue pixel pit 2012, and green pixel pit 2013. A light emitting layer is arranged in the pixel pit. For example, a red light emitting layer is provided in the red pixel pit 2011, a blue light emitting layer is provided in the blue pixel pit 2012, and a green light emitting layer is provided in the green pixel pit 2013. The opening of the pixel pit faces the light-emitting surface of the light-emitting device. In the display panel 200 of the embodiment, the polarizer 100 is disposed on the light emitting surface of the light emitting device, and the pressure sensitive adhesive layer 101 of the polarizer 100 covers the light emitting surface of the light emitting device, so that the refraction angle of light emitted by the light emitting device can be effectively improved, the ratio of total reflected light is reduced, more light can be emitted into the air, and the light emitting rate of the display panel 200 is further improved.
Referring to fig. 3 again, the display panel 200 further includes a planarization layer 202, the planarization layer 202 is disposed between the light emitting device and the polarizer 100, and the planarization layer 202 has a plurality of through holes 2021. Through the arrangement of the flat layer 202 with the through holes 2021, the polarizer 100 forms the microlens structures arranged in an array at the through holes 2021, especially the pressure-sensitive adhesive layer 101 of the polarizer 100 forms the microlens structures arranged in an array at the through holes 2021, the refraction direction of light emitted by the pixel pits can be further adjusted, more light can escape to the air at the preset position, and thus, the light can be more conveniently controlled, and the light can be gathered or diffused at the preset position.
It will be appreciated that the predetermined position may refer to a position where light needs to be concentrated, or may refer to a position where light needs to be dispersed. In the design process of the display panel 200, a predetermined position for light concentration and/or light divergence can be formed by the cooperation of the through hole 2021 and the pixel pit opening.
For example, the via 2021 and the pixel pit opening correspond to each other. At this time, the positional relationship of the via 2021 and the pixel pit opening can be expressed as shown in fig. 3 and 4. Under the condition, when the light emitted from the pixel pit escapes to the air at the through hole 2021, the light can be gathered at the through hole 2021, so that the light has a higher light-emitting rate at the through hole 2021, the display effect at the through hole 2021 is further improved, and the light-emitting rate at the position corresponding to the pixel pit on the display panel 200 is improved. At this time, the light-emitting schematic diagram of the display panel 200 can be as shown in fig. 8. Specifically, light emitted from red pixel pit 2011 is collected to some extent at the position of through hole 2021 after passing through hole 2021 and pressure-sensitive adhesive layer 101, and the display effect of light emission from red pixel pit 2011 can be improved. After light emitted from blue pixel pit 2012 passes through via hole 2021 and pressure-sensitive adhesive layer 101, a certain degree of aggregation is performed at the position of via hole 2021, and the display effect of light emission from blue pixel pit 2012 can be improved. Light emitted from the green pixel pits 2013 is collected to some extent at the position of the through hole 2021 after passing through the through hole 2021 and the pressure-sensitive adhesive layer 101, and the display effect of light emission from the green pixel pits 2013 can be improved.
For another example, the via 2021 and the pixel pit opening are offset from each other. At this time, the positional relationship of the via 2021 and the pixel pit opening can be expressed as shown in fig. 5 and 6. Under the condition, the light emitted by the pixel pits is further refracted after passing through the through holes 2021 and the pressure sensitive adhesive layer 101, and the light rays representing the positions of the surface of the display panel 200 corresponding to the pixel pits have a certain divergence tendency, so that the display effect of the light emission of the pixel pits can be adjusted.
It can be understood that, in the positional relationship between the through hole 2021 and the pixel pit opening, the through hole 2021 and the pixel pit opening may partially correspond to each other, or may correspond to each other one by one, so as to flexibly adjust the converging and diverging positions of the light. That is, when the through hole 2021 and the pixel pit opening are provided at the positions, the through hole 2021 and the pixel pit opening may be in one-to-one correspondence, or the through hole 2021 and the pixel pit opening may be partially shifted in correspondence. Preferably, the through holes 2021 and the pixel pit openings correspond to each other one by one, or the through holes 2021 and the pixel pit openings are arranged by being shifted, and further, the through holes 2021 and the pixel pit openings are arranged by being shifted one by one. That is, the through holes 2021 correspond to the openings of the pixel pits of the light emitting device one to one; or the via 2021 is disposed to be offset from the opening of the pixel pit of the light emitting device.
In a specific example, the side of the pressure sensitive adhesive layer 101 is flush with the side of the planarization layer 202 or the pressure sensitive adhesive layer 101 entirely covers the planarization layer 202. In the design process of the display panel 200, the side surface of the pressure sensitive adhesive layer 101 is flush with the side surface of the flat layer 202 or the pressure sensitive adhesive layer 101 entirely covers the flat layer 202 according to the design requirement to achieve a good packaging effect.
In another specific example, the refractive index of the planarization layer 202 is 1.0 to 1.6. Alternatively, the refractive index of the planarization layer 202 may be, but is not limited to, 1.1, 1.15, 1.2, 1.25, 1.3, 1.35, 1.4, 1.45, 1.5, 1.55, or 1.6. Preferably, the refractive index of the flattening layer 202 is lower than that of the pressure-sensitive adhesive layer 101, so that the flattening layer 202 and the pressure-sensitive adhesive layer 101 are better adapted to enable light rays to be better concentrated or dispersed at predetermined positions.
Further, the thickness of the planarization layer 202 is 0.5 μm to 10 μm. Alternatively, the thickness of the planarization layer 202 can be, but is not limited to, 1 μm, 1.2 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, or 10 μm. Preferably, the thickness of the planarization layer 202 is 1 μm to 5 μm. It will be appreciated that the flat layer 202 and the pressure sensitive adhesive layer 101 are better adapted to facilitate the collection or diffusion of light at a predetermined position by setting appropriate thicknesses during the design process of the display panel 200.
In a specific example, the width of the via 2021 is 5 μm to 50 μm. Alternatively, the width of the via 2021 may be, but is not limited to, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm.
It is understood that the width of the pixel pit opening refers to the width of one end of the pixel pit opening close to the light exit surface. The width of the via 2021 refers to the width of the via 2021 at the surface of the planarization layer 202 near the light emitting device. Preferably, the width of the via 2021 is greater than or equal to the width of the pixel pit opening. In the actual process, the width of the via hole 2021 is controlled to be greater than or equal to the width of the opening of the pixel pit, so that the pixel pit is completely exposed at the via hole 2021 corresponding to the pixel pit.
In a specific example, the display panel 200 further includes an encapsulation layer 203, and the encapsulation layer 203 is positioned between the image light emitting device and the pressure sensitive adhesive layer 101. Further, referring to fig. 3 to 6 again, the encapsulation layer 203 is located on the light emitting surface of the light emitting device, and the encapsulation layer 203 is closer to the planarization layer 202 than the light emitting device.
Further, the display panel 200 further includes a touch layer 204, and the touch layer 204 is located between the light emitting device and the pressure sensitive adhesive layer 101. Referring to fig. 3 or fig. 5 again, further, the touch layer 204 is disposed between the planarization layer 202 and the encapsulation layer 203.
Further, the display panel 200 further includes a TFT layer 205, and the light emitting device is provided on a surface of the TFT layer 205.
Referring to fig. 7, a display panel 200 according to another embodiment of the present invention is provided. The display panel 200 includes a light emitting device and a pressure sensitive adhesive layer 101 formed by the pressure sensitive adhesive, and the pressure sensitive adhesive layer 101 covers a light emitting surface of the light emitting device. The pressure sensitive adhesive layer 101 is formed on the light emitting surface of the light emitting device through the pressure sensitive adhesive, so that the refraction angle of light emitted by the light emitting device can be effectively improved, more light can escape into the air, and the light emitting rate of the display panel 200 is improved.
Yet another embodiment of the present invention provides a method for manufacturing a display panel 200. The manufacturing method of the display panel 200 includes the following steps: the polarizer 100 is attached to the light-emitting surface of the light-emitting device, and the pressure-sensitive adhesive layer 101 of the polarizer 100 covers the light-emitting surface of the light-emitting device.
Further, before attaching the polarizer 100, the following steps are included: a planarization layer 202 is formed on the light emitting surface of the light emitting device, and a plurality of through holes 2021 are formed on the planarization layer 202. It is understood that the via 2021 may be formed on the planarization layer 202 by etching. It is also understood that the via 2021 may be formed on the planarization layer 202 by a patterning method including exposure, etching, and the like.
Further, when the via holes 2021 are formed in the planarization layer 202, the control via holes 2021 and the pixel pit openings correspond to each other one by one. Alternatively, when the via hole 2021 is formed in the planarization layer 202, the control via hole 2021 is disposed to be offset from the pixel pit opening.
In a specific example, before the planarization layer 202 is formed on the light emitting surface of the light emitting device, the following steps are further included: the encapsulation layer 203 is formed on the light emitting surface of the light emitting device. It is understood that the planarization layer 202 is formed on the surface of the encapsulation layer 203 away from the light emitting device after the encapsulation layer 203 is formed.
In another specific example, before the planarization layer 202 is formed on the light emitting surface of the light emitting device, the following steps are further included: a touch layer 204 is formed on the light emitting surface of the light emitting device.
In another specific example, before the planarization layer 202 is formed on the light emitting surface of the light emitting device, the following steps are further included: a touch layer 204 is formed on the surface of the encapsulation layer 203 away from the light emitting device.
In another specific example, before the pressure-sensitive adhesive layer is formed on the light emitting surface of the light emitting device, the method further comprises the following steps: a light emitting device is mounted to the surface of the TFT layer 205.
It is understood that the thickness of the pressure-sensitive adhesive layer 101 is controlled to be 10 μm to 100 μm when the pressure-sensitive adhesive layer 101 is formed. When the flat layer 202 is formed on the light emitting surface of the light emitting device, the thickness of the flat layer 202 is controlled to be 0.5 μm to 10 μm. The width of the via hole 2021 is controlled to be 5 μm to 50 μm when the via hole 2021 is formed on the planarization layer 202.
Yet another embodiment of the present invention provides a method for manufacturing a display panel 200. The manufacturing method of the display panel 200 includes the following steps: the pressure-sensitive adhesive is transferred on the light-emitting surface of the light-emitting device to form the pressure-sensitive adhesive layer 101, or the pressure-sensitive adhesive layer 101 is formed by adhering the pressure-sensitive adhesive on the light-emitting surface of the light-emitting device.
It is understood that the pressure sensitive adhesive may be transferred to the light emitting surface of the light emitting device to form the pressure sensitive adhesive layer 101. The pressure-sensitive adhesive may be formed into the pressure-sensitive adhesive layer 101 and then attached to the light emitting surface of the light emitting device.
The following are specific examples.
Examples 1 to 5 and comparative examples 1 to 4
In the pressure-sensitive adhesives of examples 1 to 5 and comparative examples 1 to 4, the filling medium and the mass percentage thereof are shown in table 1, wherein the mass percentage is in terms of mass percentage of the pressure-sensitive adhesive. The refractive index of the pressure sensitive adhesive is shown in table 1. The particle size of the filling medium is 5 nm-50 nm.
TABLE 1
| Filling medium | Mass percent | Refractive index of pressure-sensitive adhesive | |
| Example 1 | ZrO2 | 5％ | 1.52 |
| Example 2 | ZrO2 | 20％ | 1.55 |
| Example 3 | ZrO2 | 40％ | 1.63 |
| Example 4 | TiO2 | 20％ | 1.56 |
| Example 5 | TiO2 | 40％ | 1.67 |
| Comparative example 1 | ZrO2 | 0.5％ | 1.45 |
| Comparative example 2 | TiO2 | 0.5％ | 1.47 |
As can be seen from Table 1, the optical pastes of examples 1 to 5 have higher refractive indexes than those of comparative examples 1 to 2. TiO 22Filling ratio ZrO2The effect of filling on improving the refractive index is better, and is limited by the performance of the filling medium, TiO2Filled optical cement ratio ZrO2The filled optical cement has a slightly lower transmittance.
Example 6
The structure of the display panel in this embodiment is shown in fig. 3, and the light-emitting schematic diagram is shown in fig. 8. The display panel comprises a polarizing film protective film, a polarizing film, a phase difference film, a pressure-sensitive adhesive layer, a flat layer with a plurality of through holes, a touch layer, a packaging layer, a light-emitting device with pixel pits and a TFT layer which are sequentially stacked. The pixel pits are divided into red pixel pits, blue pixel pits, and green pixel pits. The through holes correspond to the pixel pit openings one to one.
Wherein the pressure-sensitive adhesive layer is the pressure-sensitive adhesive layer formed by the pressure-sensitive adhesive in example 3. The thickness of the pressure-sensitive adhesive layer was 20 μm, the thickness of the planarization layer was 5 μm, and the refractive index of the planarization layer was 1.1. The width of the via hole is equal to the width of the opening of the pixel pit, and the width of the via hole is 40 μm.
As can be seen from fig. 8, the light 400 is significantly refracted at the through hole, so that the light is concentrated at the through hole, which is represented by the concentration of the light at the area of the surface of the display panel corresponding to the pixel pits.
Comparative example 3
Comparative example 3 is different from example 6 in that the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive in comparative example 1.
Comparative example 4
Comparative example 4 differs from example 6 in that no filling medium is added to the pressure sensitive adhesive.
Comparative example 5
The structure of the display panel 300 and the light extraction diagram thereof in this comparative example are shown in fig. 9. The display panel 300 includes a flat layer 302, a touch layer 304, an encapsulation layer 303, a light emitting device having a pixel pit, and a TFT layer 305, which are sequentially stacked. The light emitting device includes a pixel defining layer 301, and the pixel defining layer 301 defines a pixel pit. The pixel pits are divided into red pixel pits 3011, blue pixel pits 3012, and green pixel pits 3013. The planarization layer 302 has no vias.
The thickness of the planarization layer 302 is 5 μm, and the refractive index of the planarization layer 302 is 1.1. The width of the pixel pit opening was 40 μm.
As can be seen from fig. 7, the light 400 is not collected in the area corresponding to the pixel pits on the surface of the display panel 300, and there is a lot of light that is totally reflected and cannot exit into the air.
Test example
The light-emitting rates of the display panels 300 of example 6 and comparative examples 5 to 7 were respectively characterized by performing a luminous intensity test. The test results are shown in table 2.
TABLE 2
| Example 6 | Comparative example 5 | Comparative example 6 | Comparative example 7 | |
| Luminous intensity (cd) | 60 | 45 | 42 | 40 |
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims, and the description and the drawings can be used for explaining the contents of the claims.
Claims (10)
1. The pressure-sensitive adhesive is characterized by comprising a pressure-sensitive adhesive main body and a filling medium, wherein the filling medium accounts for 1-80% of the pressure-sensitive adhesive by mass, and is at least one of zirconium oxide and titanium oxide.
2. The pressure-sensitive adhesive of claim 1, wherein the zirconia is Zr-containingxOyAt least one compound of formula (la) wherein x: y is 1: (1-2).
3. The pressure-sensitive adhesive of claim 1, wherein the titanium oxide is Ti-containingmOnAt least one compound of formula (la) wherein m: n is 1: (1-2).
4. The pressure-sensitive adhesive according to any one of claims 1 to 3, wherein the particle size of the filling medium is 5nm to 5000 nm.
5. A polarizer comprising a polarizing film, a phase difference film, and a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive according to any one of claims 1 to 4; the phase difference film is covered on one surface of the pressure-sensitive adhesive layer, and the polarizing film is covered on the surface, far away from the pressure-sensitive adhesive layer, of the phase difference film.
6. The polarizer of claim 5, wherein the pressure-sensitive adhesive layer has a refractive index of 1.5 to 2.5;
and/or the thickness of the pressure-sensitive adhesive layer is 10-100 mu m.
7. A display panel, comprising a light emitting device and the polarizer of any one of claims 5 to 6, wherein the pressure sensitive adhesive layer of the polarizer covers the light emitting surface of the light emitting device.
8. The display panel of claim 7, further comprising a planarization layer disposed between the light emitting device and the polarizer, the planarization layer having a plurality of through holes.
9. The display panel according to claim 8, wherein the through holes and the openings of the pixel pits of the light emitting devices correspond one to each other; or the through hole and the opening of the pixel pit of the light-emitting device are arranged in a staggered mode.
10. A display panel, comprising a light emitting device and a pressure sensitive adhesive layer formed by the pressure sensitive adhesive according to any one of claims 1 to 4, wherein the pressure sensitive adhesive layer covers a light emitting surface of the light emitting device.
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