CN113478463A - Manipulator and method for acquiring and transmitting wafer by using manipulator - Google Patents
Manipulator and method for acquiring and transmitting wafer by using manipulator Download PDFInfo
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- CN113478463A CN113478463A CN202110782710.4A CN202110782710A CN113478463A CN 113478463 A CN113478463 A CN 113478463A CN 202110782710 A CN202110782710 A CN 202110782710A CN 113478463 A CN113478463 A CN 113478463A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
The invention relates to the field of semiconductor equipment, and discloses a manipulator and a method for acquiring and transmitting wafers, wherein when wafers are transported in a transport channel, the wafers are pushed to a set position through a horizontal guide rail and a first infrared transmitting end and the like, so that the wafers can be conveniently and directly taken out by a subsequent mechanical claw, the relative position of the wafers can be prevented from being detected in real time during the transportation of the wafers in the transport channel, meanwhile, the wafers with different offset degrees can be prevented from being grabbed by adjusting the position of the mechanical claw, time and labor are wasted, the transport efficiency is reduced, if a clamping component fails in the process of transporting the wafers by the mechanical claw, the wafers can be offset, the relative position of the wafers can be detected and adjusted in real time in the process of operating the wafers by the mechanical claw through a second infrared transmitting end and the like, the operation of the mechanical claw can be prevented from stopping after accidental offset occurs, the delay reduces the operating rate of the gripper.
Description
Technical Field
The invention relates to the field of semiconductor equipment, in particular to a manipulator and a method for acquiring and transmitting a wafer by the manipulator.
Background
The yield is a key index pursued by wafer manufacturers, and directly influences the production efficiency and the company benefit. In the process of manufacturing the wafer, the yield is determined by various factors, and besides the influence of hardware factors such as a process chamber and the like and factors such as process conditions, the deviation and the slip of the wafer in the transmission process also have a crucial influence on the yield. The deviation refers to the deviation of the wafer from the center position in the reaction chamber, and the slip refers to the variation of the relative position of the wafer caused by improper transmission speed or insufficient friction force between the wafer and the robot arm during the transmission process. The deviation and slip sheet are liable to cause the difference between the expected process reaction condition and the expected process reaction condition, and the wafer may be broken due to the continuous sheet transmission, so that the wafer is damaged.
In the prior art, in patent document with publication number CN112249709A, a manipulator is proposed, which can detect whether a wafer is shifted in real time during the process of acquiring and transporting the wafer, and although a position detection unit is disposed on the manipulator, the manipulator stops working once the wafer is shifted in position due to unstable clamping when the manipulator transports the wafer, which seriously reduces the working efficiency; in addition, before the manipulator acquires the wafer, the position of the wafer in the conveying channel may deviate, and the manipulator detects that the relative position of the wafer on the conveying channel is changed before contacting the wafer, so as to adjust the acquiring position of the manipulator, which also greatly reduces the speed of the manipulator on the production line for acquiring the wafer.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the manipulator and the method for acquiring and transmitting the wafers by the manipulator, which have the advantages of stable transportation and the like and solve the series of problems of time and labor waste and the like in the operation of the traditional manipulator.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a manipulator comprises a manipulator body and a transportation channel, wherein the manipulator body comprises a base, a rotating assembly, a vertical assembly and a radial assembly, the rotating assembly is mounted on the base, the vertical assembly is fixedly connected onto the rotating assembly, the radial assembly is rotatably connected onto the vertical assembly, a mechanical claw is fixedly mounted at one end of the radial assembly, a clamping assembly, a second detection assembly and a return assembly are mounted on the mechanical claw, the clamping assembly is used for clamping a wafer, the second detection assembly is used for detecting whether the position of the wafer on the mechanical claw is changed, and the return assembly is used for enabling the wafer to return to the initial position on the mechanical claw;
the wafer conveying device comprises a conveying channel, a wafer conveying device and a mechanical claw, wherein the conveying channel is provided with a bearing assembly, a first detection assembly and a position correcting assembly, the bearing assembly is used for bearing and conveying wafers, the first detection assembly is used for detecting position changes of the wafers in the conveying channel, and the position correcting assembly is used for correcting the relative positions of the wafers in the conveying channel before the wafers contact the mechanical claw.
Preferably, a controller is arranged on the mechanical claw, and the controller is electrically connected with the first detection assembly, the second detection assembly, the return assembly and the position correction assembly.
Preferably, the clamping assembly comprises a clamping cylinder and a rubber clamping block, the clamping cylinder is fixedly mounted on the mechanical claw, and the rubber clamping block attached to the wafer is fixedly connected to the bottom end of the output end of the clamping cylinder.
Preferably, the second detection assembly comprises a second infrared transmitting end and a second infrared receiving end, the four corners of the gripper are fixedly provided with the second infrared transmitting end and the second infrared receiving end which are matched with each other, and the positions of the four second infrared transmitting ends and the second infrared receiving end are tangent to the edge of the vertical projection of the wafer on the gripper.
Preferably, the return subassembly contains return cylinder and arc return ejector pad, the fixed slot has all been seted up, four in the four corners position of gripper equal fixed mounting has in the fixed slot the return cylinder, it is a plurality of the equal fixedly connected with of one end of the output of return cylinder the arc return ejector pad, it is a plurality of one side homoenergetic of arc return ejector pad can laminate mutually with the outer wall of wafer.
Preferably, the bearing component moves slider and fixed block, sliding mounting has four in the transfer passage move the slider, with two of one side be connected with same vertical plate on the removal slider, two the equal fixed mounting in one side that vertical plate is close to each other has a plurality ofly the fixed block, and a plurality ofly all set up the corresponding perforation in position on the fixed block.
Preferably, first detecting element contains first infrared emission end and first infrared receiving terminal, two at top all install on the fixed block first infrared emission end, and two of bottom all fixed mounting have with corresponding on the fixed block first infrared emission end looks adaptation first infrared receiving terminal, first detecting element is with a plurality of the fenestrate position is corresponding.
Preferably, the position correcting assembly comprises a position correcting cylinder and a position correcting push block, a plurality of position correcting cylinders are fixedly mounted on each of the two vertical plates and respectively located between the two adjacent fixed blocks, the position correcting push block is fixedly connected to one side of an output end of each of the position correcting cylinders, and one side of each of the position correcting push blocks is attached to the outer wall of the wafer;
the position correcting assembly further comprises a horizontal guide rail and a limiting sliding groove, wherein the horizontal guide rail and the limiting sliding groove are fixedly mounted on the inner walls of the two sides of the conveying channel, the horizontal guide rail and the limiting sliding groove are formed in one side of the horizontal guide rail, and the limiting sliding groove is matched with the outer wall of the wafer.
A method for acquiring and transmitting wafers by using a manipulator is characterized in that:
when the wafer is transmitted to a station to be clamped in a transport channel, infrared rays are transmitted through a first infrared transmitting end, if the first infrared receiving end successfully receives the wafer, the position of the wafer is not deviated, if the first infrared receiving end does not successfully receive an infrared signal, the wafer is deviated, at the moment, a position correcting cylinder is started, and position correcting push blocks are close to each other to restore the deviated wafer to a specified position;
after the wafer is positioned at a specified position in the transportation channel, the spatial position of the mechanical claw is adjusted through the rotating assembly, the vertical assembly and the radial assembly, the mechanical claw is driven to extend into the transportation channel, the wafer in the transportation channel is positioned between the plurality of arc-shaped return push blocks and the second infrared transmitting ends, infrared rays are transmitted through the plurality of second infrared transmitting ends, when the plurality of second infrared receiving ends successfully receive infrared signals, the horizontal position of the wafer in the mechanical claw is determined, at the moment, the vertical assembly drives the mechanical claw to jack the wafer upwards, the wafer is taken out of the transportation channel through the radial assembly, and wafer transmission is carried out;
in the process of transmitting the wafer through the mechanical claw, the plurality of second infrared transmitting ends continuously transmit infrared rays, if the plurality of second infrared receiving ends can continuously receive the infrared rays, the relative position of the wafer in the mechanical claw is not changed, if the second infrared receiving ends cannot receive the infrared rays, the wafer position is deviated to block an infrared passage between the corresponding second infrared transmitting ends and the second infrared receiving ends, and at the moment, the plurality of arc-shaped return push blocks are driven to be close to each other to push the wafer to the original position through the operation of the plurality of return cylinders, so that the wafer is reset.
(III) advantageous effects
Compared with the prior art, the invention provides a manipulator and a method for acquiring and transmitting wafers by the manipulator, which have the following beneficial effects:
1. the manipulator and the method for acquiring and transmitting the wafer, when the wafer is transported in the transportation channel, the wafer can not deviate in the direction vertical to the moving direction of the wafer through the arrangement of the horizontal guide rail and the limiting sliding groove, when the wafer is transported to the final position in the transportation channel, the wafer is transmitted through the first infrared transmitting end and is received through the corresponding first infrared receiving ends, if the first infrared receiving end does not receive infrared information, the wafer deviates, at the moment, the position correcting push blocks are driven by the position correcting air cylinders to mutually approach, the wafer is pushed to the set position, the wafer can be directly taken out by the subsequent mechanical claw, so that the relative position of the wafer can not be detected in real time when the wafer is transported in the transportation channel, meanwhile, the wafer can be prevented from being grabbed by adjusting the position of the mechanical claw to adapt to different deviation degrees, the grabbing efficiency of the mechanical claw is improved.
2. The manipulator and the method for acquiring and transmitting the wafer thereof have the advantages that after the wafer is taken out from the conveying channel through the vertical component and the radial component, if the clamping component fails to work in the process of transferring the wafer by the mechanical claw, the wafer is continuously emitted by the second infrared emitting end, infrared information is received by the corresponding second infrared receiving end, if the second infrared receiving end cannot receive the infrared information, the position of the wafer is unexpectedly deviated, and the corresponding infrared information is blocked, at the moment, the plurality of return air cylinders are started to drive the plurality of arc-shaped return push blocks to mutually approach, the wafer is pushed to return to be positioned at the set position on the mechanical claw, further, the relative position of the wafer is detected in real time and adjusted in real time in the process of operating the mechanical claw on the wafer, and the normal operation of the mechanical claw does not need to stop even if the wafer is unexpectedly deviated, the running interest rate of the mechanical claw is ensured.
Drawings
FIG. 1 is a perspective view of a first embodiment of the present invention;
FIG. 2 is a perspective view of a second embodiment of the present invention;
FIG. 3 is a schematic perspective view of a portion of the present invention;
FIG. 4 is a schematic perspective view of a transportation channel according to the present invention;
FIG. 5 is a first perspective view of the gripper of the present invention;
FIG. 6 is a perspective view of a second embodiment of the gripper of the present invention;
fig. 7 is a schematic perspective view of a part of the transportation channel of the present invention.
In the figure: 1. a base; 2. a rotating assembly; 3. a vertical component; 4. a radial component; 5. a gripper; 6. a clamping cylinder; 7. a rubber clamping block; 8. a controller; 9. a second infrared emitting end; 10. a second infrared receiving end; 11. fixing grooves; 12. a return cylinder; 13. an arc-shaped return push block; 14. a transport channel; 15. moving the slide block; 16. a vertical plate; 17. a position correction cylinder; 18. a position correcting push block; 19. a fixed block; 20. perforating; 21. a first infrared emitting end; 22. a first infrared receiving end; 23. a horizontal guide rail; 24. and a limiting sliding groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the above technical problems, the present application provides a robot and a method for acquiring a transferred wafer thereof
In an exemplary embodiment of the present application, as shown in fig. 1 to 7, a robot includes a robot body and a transportation channel 14, the robot body includes a base 1, a rotation component 2, a vertical component 3 and a radial component 4, the base 1 is installed with the rotation component 2, the rotation component 2 is fixedly connected with the vertical component 3, the vertical component 3 is rotatably connected with the radial component 4, one end of the radial component 4 is fixedly installed with a gripper 5, the gripper 5 is installed with a clamping component, a second detection component and a return component, the clamping component is used for clamping a wafer, the second detection component is used for detecting whether a position of the wafer on the gripper 5 changes, and the return component is used for urging the wafer to return to an initial position on the gripper 5;
the transport path 14 is provided with a carrier assembly for carrying and transporting the wafer, a first detection assembly for detecting a position change of the wafer in the transport path 14, and a position correction assembly for correcting a relative position of the wafer in the transport path 14 before contacting the gripper 5.
Further, in above-mentioned scheme, be equipped with controller 8 on the gripper 5, controller 8 and first, second detection component and return subassembly, the equal electric connection of position correction subassembly, through setting up controller 8, a plurality of subassemblies of intelligent control of being convenient for cooperate each other.
Further, in above-mentioned scheme, clamping unit contains die clamping cylinder 6 and rubber clamp 7, and fixed mounting has die clamping cylinder 6 on the gripper 5, and the bottom fixedly connected with of die clamping cylinder 6's output and the rubber clamp 7 that the wafer laminated mutually are through setting up clamping unit, be convenient for press from both sides tightly it when gripper 5 transports the wafer, prevent that the skew from appearing in the wafer.
Further, in the above scheme, the second detection assembly includes a second infrared transmitting terminal 9 and a second infrared receiving terminal 10, the four corners of the gripper 5 are all fixedly provided with the second infrared transmitting terminal 9 and the second infrared receiving terminal 10 which are matched with each other, and the positions of the four second infrared transmitting terminals 9 and the second infrared receiving terminal 10 are all tangent to the edge of the vertical projection of the wafer on the gripper 5, so that the wafer position can be detected in real time when the gripper 5 transports the wafer, and the wafer position deviation can be found in time.
Further, in above-mentioned scheme, the return subassembly contains return cylinder 12 and arc return ejector pad 13, fixed slot 11 has all been seted up to gripper 5's four corners position, equal fixed mounting has return cylinder 12 in four fixed slots 11, the equal fixedly connected with arc return ejector pad 13 of the one end of the output of a plurality of return cylinders 12, one side homoenergetic of a plurality of arc return ejector pads 13 can laminate mutually with the outer wall of wafer, through setting up the return subassembly, be convenient for when the unexpected skew takes place for the wafer, resume the initial position on gripper 5 with the wafer.
Further, in the above scheme, the bearing assembly includes a movable slider 15 and a fixed block 19, four movable sliders 15 are slidably mounted in the transportation channel 14, the two movable sliders 15 on the same side are connected with the same vertical plate 16, a plurality of fixed blocks 19 are fixedly mounted on the side, close to each other, of the two vertical plates 16, and through holes 20 corresponding to the positions of the fixed blocks 19 are formed in the fixed blocks 19.
Further, in the above scheme, a first detection assembly includes a first infrared transmitting end 21 and a first infrared receiving end 22, the first infrared transmitting end 21 is installed on each of the two fixing blocks 19 at the top, the first infrared receiving ends 22 matched with the corresponding first infrared transmitting ends 21 are installed on the two fixing blocks 19 at the bottom, the first detection assembly corresponds to the positions of the plurality of through holes 20, and by setting the first detection assembly, whether the position of the wafer before contacting the gripper 5 is normal or not can be detected during wafer transportation.
Further, in the above scheme, the position correcting assembly includes a position correcting cylinder 17 and a position correcting push block 18, a plurality of position correcting cylinders 17 are fixedly mounted on the two vertical plates 16, the plurality of position correcting cylinders 17 are respectively located between the two adjacent fixed blocks 19, and one side of the output end of each of the plurality of position correcting cylinders 17 is fixedly connected with the position correcting push block 18, one side of each of the plurality of position correcting push blocks 18 is attached to the outer wall of the wafer, and by arranging the position correcting assembly, the wafer is conveniently and quickly located at the correct position when being transported to the final position of the transportation channel, so that the gripper 5 can be directly clamped;
the position correcting assembly further comprises a horizontal guide rail 23 and a limiting sliding groove 24, the horizontal guide rail 23 is fixedly mounted on the inner walls of the two sides of the conveying channel 14, the limiting sliding groove 24 is formed in one side of each of the two horizontal guide rails 23, the two limiting sliding grooves 24 are matched with the outer wall of the wafer, and the wafer cannot be subjected to two-side deviation when being transmitted in the conveying channel 14 through the limiting sliding grooves 24.
A method for acquiring and transmitting wafers by using a manipulator is characterized in that:
when the wafer is transmitted to a station to be clamped in the transportation channel 14, infrared rays are transmitted through the first infrared transmitting end 21, if the first infrared receiving end 22 successfully receives the wafer, the position of the wafer is not deviated, and if the first infrared receiving end 22 does not successfully receive an infrared signal, the wafer is deviated, at this moment, the position correcting cylinder 17 is started, and the position correcting push blocks 18 approach to each other to restore the deviated wafer to the specified position;
after the wafer is positioned at a specified position in the transportation channel 14, the rotating assembly 2, the vertical assembly 3 and the radial assembly 4 are used for adjusting the spatial position of the mechanical claw 5 and driving the mechanical claw 5 to extend into the transportation channel 14, so that the wafer in the transportation channel 14 is positioned between the plurality of arc-shaped return push blocks 13 and the second infrared transmitting ends 9, infrared rays are transmitted through the plurality of second infrared transmitting ends 9, when the plurality of second infrared receiving ends 10 successfully receive infrared signals, the horizontal position of the wafer in the mechanical claw 5 is determined, at the moment, the vertical assembly 3 is used for driving the mechanical claw 5 to jack the wafer upwards, and the wafer is taken out of the transportation channel 14 through the radial assembly 4 for wafer transmission;
in the process of transmitting the wafer through the mechanical claw 5, the plurality of second infrared transmitting ends 9 continuously transmit infrared rays, if the plurality of second infrared receiving ends 10 can continuously receive the infrared rays, it is indicated that the relative position of the wafer in the mechanical claw 5 is not changed, if the second infrared receiving ends 10 cannot receive the infrared rays, it is indicated that the wafer position deviates to block an infrared passage between the corresponding second infrared transmitting ends 9 and the second infrared receiving ends 10, and at the moment, the plurality of arc-shaped return push blocks 13 are driven to mutually approach to push the wafer to the original position through the operation of the plurality of return cylinders 12, so that the wafer is reset.
The working principle is as follows: when the wafer is transported in the transportation channel 14, the horizontal guide rail 23 and the limit chute 24 are arranged, so that the wafer is not deviated in the direction vertical to the moving direction, when the wafer is transported to the final position in the transport passage 14, infrared rays are emitted through the first infrared emitting terminal 21, and receives infrared rays through a plurality of corresponding first infrared receiving terminals 22, and if the first infrared receiving terminals 22 do not receive infrared information, the wafer is deviated, and the position correcting cylinder 17 drives the position correcting push blocks 18 to approach each other to push the wafer to a predetermined position, so that the wafer can be taken out directly by the following mechanical gripper 5, thereby need not the wafer and detect relative position in real time to it when transmitting in the transfer passage, simultaneously, avoid snatching with the wafer that adapts to different skew degrees through the position of adjustment gripper, promote the efficiency of snatching of gripper.
After the wafer is taken out of the conveying channel 14 through the vertical component 3 and the radial component 4, in the process of transferring the wafer by the mechanical claw 5, if the clamping component fails to work, the wafer is subjected to position deviation, infrared rays are continuously emitted through the second infrared emitting end 9, infrared information is received through the corresponding second infrared receiving end 10, if the second infrared receiving end 10 cannot receive the infrared information, the wafer is subjected to unexpected position deviation, and the corresponding infrared information is blocked, at the moment, the plurality of return cylinders 12 are started to drive the plurality of arc-shaped return push blocks 13 to mutually approach, the wafer is pushed to return, so that the wafer is positioned at the set position on the mechanical claw 5, in the process of running the wafer by the mechanical claw 5, the relative position of the wafer is detected in real time and adjusted in real time, and the normal operation of the mechanical claw does not need to stop even if the wafer is unexpectedly deviated, the running interest rate of the mechanical claw is ensured.
Through setting up die clamping cylinder 6 and rubber clamp 7, detect through second infrared transmitting terminal 9 and second infrared receiving terminal 10 that the wafer is located the correct position on gripper 5 after, die clamping cylinder 6 drives rubber clamp 7 and presss from both sides the tight wafer tightly, reduces the possibility that the unexpected skew takes place for the wafer in the operation process, does benefit to gripper 5 and realizes quick the transportation to a plurality of wafers.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a manipulator, includes manipulator body and transfer passage (14), the manipulator body contains base (1), rotating assembly (2), perpendicular subassembly (3) and radial subassembly (4), install on base (1) rotating assembly (2), fixedly connected with on rotating assembly (2) perpendicular subassembly (3), rotate on perpendicular subassembly (3) and be connected with radial subassembly (4), the one end fixed mounting of radial subassembly (4) has gripper (5), its characterized in that: the mechanical claw (5) is provided with a clamping component, a second detection component and a return component, the clamping component is used for clamping a wafer, the second detection component is used for detecting whether the position of the wafer on the mechanical claw (5) is changed, and the return component is used for promoting the wafer to return to the initial position on the mechanical claw (5);
the conveying channel (14) is provided with a bearing assembly, a first detection assembly and a position correction assembly, the bearing assembly is used for bearing and conveying the wafer, the first detection assembly is used for detecting the position change of the wafer in the conveying channel (14), and the position correction assembly is used for correcting the relative position of the wafer in the conveying channel (14) before the wafer contacts the mechanical claw (5).
2. A manipulator according to claim 1, wherein: and a controller (8) is arranged on the mechanical claw (5), and the controller (8) is electrically connected with the first detection assembly, the second detection assembly, the return assembly and the position correction assembly.
3. A manipulator according to claim 1, wherein: the clamping assembly comprises a clamping cylinder (6) and a rubber clamping block (7), the mechanical claw (5) is fixedly provided with the clamping cylinder (6), the bottom end of the output end of the clamping cylinder (6) is fixedly connected with the rubber clamping block (7) which is attached to the wafer.
4. A manipulator according to claim 3, wherein: the second detection assembly comprises a second infrared transmitting end (9) and a second infrared receiving end (10), wherein the four corners of the mechanical claw (5) are fixedly provided with the second infrared transmitting end (9) and the second infrared receiving end (10) in a matched mode, and the positions of the second infrared transmitting end (9) and the second infrared receiving end (10) are tangent to the edge of the vertical projection of the wafer on the mechanical claw (5).
5. A manipulator according to claim 4, wherein: the return subassembly contains return cylinder (12) and arc return ejector pad (13), fixed slot (11), four have all been seted up to the four corners position of gripper (5) equal fixed mounting has in fixed slot (11) return cylinder (12), it is a plurality of the equal fixedly connected with of one end of the output of return cylinder (12) arc return ejector pad (13), it is a plurality of one side homoenergetic of arc return ejector pad (13) can laminate mutually with the outer wall of wafer.
6. A manipulator according to claim 1, wherein: bearing assembly removes slider (15) and fixed block (19), slidable mounting has four in transfer passage (14) remove slider (15), two with one side be connected with same vertical plate (16) on removing slider (15), two the equal fixed mounting in one side that vertical plate (16) are close to each other has a plurality ofly fixed block (19), and a plurality of corresponding perforation (20) in position all have been seted up on fixed block (19).
7. A manipulator according to claim 6, wherein: first detecting element contains first infrared emission end (21) and first infrared receiving terminal (22), two at top all install on fixed block (19) first infrared emission end (21), and two of bottom equal fixed mounting has and corresponds on fixed block (19) first infrared emission end (21) looks adaptation first infrared receiving terminal (22), first detecting element is with a plurality of the position of perforation (20) is corresponding.
8. A manipulator according to claim 7, wherein: the position correcting assembly comprises a position correcting cylinder (17) and a position correcting push block (18), a plurality of position correcting cylinders (17) are fixedly mounted on the two vertical plates (16), the position correcting cylinders (17) are respectively positioned between the two adjacent fixed blocks (19), the position correcting push block (18) is fixedly connected to one side of the output end of each position correcting cylinder (17), and one side of each position correcting push block (18) is attached to the outer wall of a wafer;
the position correcting assembly further comprises a horizontal guide rail (23) and a limiting sliding groove (24), wherein the horizontal guide rail (23) and the limiting sliding groove (24) are fixedly mounted on the inner walls of the two sides of the conveying channel (14), the two horizontal guide rails (23) are arranged on one side of the horizontal guide rail (23), the limiting sliding groove (24) is formed in the two sides of the conveying channel, and the two limiting sliding grooves (24) are matched with the outer wall of the wafer.
9. A method of acquiring a transferred wafer by a robot hand according to any one of claims 1 to 8, characterized in that:
when the wafer is transmitted to a station to be clamped in a conveying channel (14), infrared rays are transmitted through a first infrared transmitting end (21), if a first infrared receiving end (22) successfully receives the wafer, the position of the wafer is not deviated, if the first infrared receiving end (22) does not successfully receive an infrared signal, the wafer is deviated, at the moment, a position correcting cylinder (17) is started, and position correcting push blocks (18) are close to each other to restore the deviated wafer to a specified position;
after the wafer is positioned at a specified position in the transportation channel (14), the spatial position of the mechanical claw (5) is adjusted through the rotating assembly (2), the vertical assembly (3) and the radial assembly (4) and the mechanical claw (5) is driven to extend into the transportation channel (14), so that the wafer in the transportation channel (14) is positioned between the plurality of arc-shaped return push blocks (13) and the second infrared emission ends (9), infrared rays are emitted through the plurality of second infrared emission ends (9), when the plurality of second infrared receiving ends (10) successfully receive infrared signals, the horizontal position of the wafer in the mechanical claw (5) is determined, the vertical assembly (3) drives the mechanical claw (5) to jack the wafer upwards, and the radial assembly (4) takes the wafer out of the transportation channel (14) to transmit the wafer;
in the process of transmitting the wafer through the mechanical claw (5), the plurality of second infrared transmitting ends (9) continuously transmit infrared rays, if the plurality of second infrared receiving ends (10) can continuously receive the infrared rays, the relative position of the wafer in the mechanical claw (5) is not changed, if the second infrared receiving ends (10) cannot receive the infrared rays, the wafer position is deviated to block an infrared passage between the corresponding second infrared transmitting ends (9) and the second infrared receiving ends (10), and at the moment, the plurality of arc-shaped return push blocks (13) are driven to mutually approach to push the wafer to the original position through the operation of the plurality of return cylinders (12), so that the wafer is reset.
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| CN202110782710.4A CN113478463A (en) | 2021-07-12 | 2021-07-12 | Manipulator and method for acquiring and transmitting wafer by using manipulator |
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| CN202110782710.4A CN113478463A (en) | 2021-07-12 | 2021-07-12 | Manipulator and method for acquiring and transmitting wafer by using manipulator |
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| CN116405043A (en) * | 2023-04-13 | 2023-07-07 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
| CN116552012A (en) * | 2023-07-12 | 2023-08-08 | 固安林科特生物工程有限公司 | Operation detection method, system, equipment and medium for paper pulp molding compound mechanism |
| CN116581084A (en) * | 2023-07-14 | 2023-08-11 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm for wafer conveying and control method thereof |
| CN117476523A (en) * | 2023-12-25 | 2024-01-30 | 浙江果纳半导体技术有限公司 | Wafer transmission method and wafer front end transmission device |
-
2021
- 2021-07-12 CN CN202110782710.4A patent/CN113478463A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114220748A (en) * | 2022-02-23 | 2022-03-22 | 杭州众硅电子科技有限公司 | Dynamic detection device and chemical mechanical planarization equipment |
| CN116405043A (en) * | 2023-04-13 | 2023-07-07 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
| CN116405043B (en) * | 2023-04-13 | 2023-10-31 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
| CN116552012A (en) * | 2023-07-12 | 2023-08-08 | 固安林科特生物工程有限公司 | Operation detection method, system, equipment and medium for paper pulp molding compound mechanism |
| CN116552012B (en) * | 2023-07-12 | 2023-09-19 | 固安林科特生物工程有限公司 | Operation detection method, system, equipment and medium for paper pulp molding compound mechanism |
| CN116581084A (en) * | 2023-07-14 | 2023-08-11 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm for wafer conveying and control method thereof |
| CN116581084B (en) * | 2023-07-14 | 2023-09-29 | 泓浒(苏州)半导体科技有限公司 | Mechanical arm for wafer conveying and control method thereof |
| CN117476523A (en) * | 2023-12-25 | 2024-01-30 | 浙江果纳半导体技术有限公司 | Wafer transmission method and wafer front end transmission device |
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Application publication date: 20211008 |