CN113474307A - 带胶粘层的光学构件和发光装置 - Google Patents

带胶粘层的光学构件和发光装置 Download PDF

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Publication number
CN113474307A
CN113474307A CN202080016070.XA CN202080016070A CN113474307A CN 113474307 A CN113474307 A CN 113474307A CN 202080016070 A CN202080016070 A CN 202080016070A CN 113474307 A CN113474307 A CN 113474307A
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CN
China
Prior art keywords
optical member
adhesive layer
light
glass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080016070.XA
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English (en)
Chinese (zh)
Inventor
染谷武纪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN113474307A publication Critical patent/CN113474307A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/068—Glass compositions containing silica with less than 40% silica by weight containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Led Device Packages (AREA)
CN202080016070.XA 2019-02-28 2020-02-21 带胶粘层的光学构件和发光装置 Pending CN113474307A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019036763 2019-02-28
JP2019-036763 2019-02-28
PCT/JP2020/007184 WO2020175396A1 (ja) 2019-02-28 2020-02-21 接着層付き光学部材および発光装置

Publications (1)

Publication Number Publication Date
CN113474307A true CN113474307A (zh) 2021-10-01

Family

ID=72240030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080016070.XA Pending CN113474307A (zh) 2019-02-28 2020-02-21 带胶粘层的光学构件和发光装置

Country Status (5)

Country Link
US (1) US20210384391A1 (https=)
JP (1) JPWO2020175396A1 (https=)
CN (1) CN113474307A (https=)
TW (1) TW202103342A (https=)
WO (1) WO2020175396A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7838487B2 (ja) * 2020-12-18 2026-04-01 Ａｇｃ株式会社 接合体、接合体の製造方法、及び発光装置
CN116583400A (zh) * 2020-12-18 2023-08-11 Ａｇｃ株式会社 接合体、接合体的制造方法以及发光装置
CN115893866B (zh) * 2022-10-28 2025-02-21 四川旭虹光电科技有限公司 一种连续制备ag膜、ar膜和af膜的方法和系统
DE102024108625A1 (de) 2023-03-27 2024-10-02 Nichia Corporation Lichtemittierende vorrichtung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064038A (ja) * 1999-08-30 2001-03-13 Hoya Corp ガラス材およびそれを用いたガラスファイバ
US20050032257A1 (en) * 2000-09-12 2005-02-10 Camras Michael D. Method of forming light emitting devices with improved light extraction efficiency
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
WO2015083616A1 (ja) * 2013-12-03 2015-06-11 旭硝子株式会社 光学ガラス、プレス成形用プリフォームおよび光学素子
JP2016052971A (ja) * 2014-09-04 2016-04-14 株式会社オハラ ガラスの製造方法およびガラス
WO2017222328A1 (ko) * 2016-06-23 2017-12-28 주식회사 엘엠에스 자외선 차단 기능이 우수한 점착 조성물, 점착 시트 및 이를 포함하는 디스플레이 장치
JP2018035046A (ja) * 2016-09-01 2018-03-08 セントラル硝子株式会社 光源用封止材及び光源用封止材用のガラス材料
CN108172676A (zh) * 2018-01-25 2018-06-15 研创光电科技（赣州）有限公司 一种led陶瓷复合封装基板及其生产工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008035283A2 (en) * 2006-09-22 2008-03-27 Koninklijke Philips Electronics N.V. Light emitting device with tension relaxation
CN101548397B (zh) * 2006-11-17 2011-12-21 3M创新有限公司 用于led光源的光学粘合组合物
TW201403885A (zh) * 2012-07-06 2014-01-16 隆達電子股份有限公司 發光二極體裝置
US9401465B2 (en) * 2014-10-17 2016-07-26 High Power Opto. Inc. Light emitting diode having mirror protection layer and method for manufacturing mirror protection layer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001064038A (ja) * 1999-08-30 2001-03-13 Hoya Corp ガラス材およびそれを用いたガラスファイバ
US20050032257A1 (en) * 2000-09-12 2005-02-10 Camras Michael D. Method of forming light emitting devices with improved light extraction efficiency
US20060231737A1 (en) * 2005-04-15 2006-10-19 Asahi Glass Company, Limited Light emitting diode element
WO2015083616A1 (ja) * 2013-12-03 2015-06-11 旭硝子株式会社 光学ガラス、プレス成形用プリフォームおよび光学素子
JP2016052971A (ja) * 2014-09-04 2016-04-14 株式会社オハラ ガラスの製造方法およびガラス
WO2017222328A1 (ko) * 2016-06-23 2017-12-28 주식회사 엘엠에스 자외선 차단 기능이 우수한 점착 조성물, 점착 시트 및 이를 포함하는 디스플레이 장치
JP2018035046A (ja) * 2016-09-01 2018-03-08 セントラル硝子株式会社 光源用封止材及び光源用封止材用のガラス材料
CN108172676A (zh) * 2018-01-25 2018-06-15 研创光电科技（赣州）有限公司 一种led陶瓷复合封装基板及其生产工艺

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
康俊勇, 厦门大学出版社 *

Also Published As

Publication number Publication date
US20210384391A1 (en) 2021-12-09
WO2020175396A1 (ja) 2020-09-03
JPWO2020175396A1 (https=) 2020-09-03
TW202103342A (zh) 2021-01-16

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