CN113473808A

CN113473808A - Electronic device

Info

Publication number: CN113473808A
Application number: CN202110770007.1A
Authority: CN
Inventors: 鲁进; 姜华文; 康南波; 陈欣; 朱义为
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2021-10-01

Abstract

The present disclosure belongs to the technical field of electronic equipment, and particularly relates to an electronic equipment, which includes: the antenna comprises an antenna, a heating piece, an insulating bracket, an insulating heat conducting piece and a heat dissipation heat sink, wherein the heating piece is arranged on one side of the antenna; the insulating bracket is connected with the heating part; the insulating heat-conducting piece is connected to the insulating support, at least part of an orthographic projection of the insulating heat-conducting piece on the heating piece is overlapped with the heating piece, and the heat conductivity coefficient of the insulating heat-conducting piece is larger than that of the insulating support; the heat dissipation heat sink is connected with one end of the heat conducting piece far away from the antenna. The heat conduction generated by the heating part can be accelerated, the heating part and the peripheral area thereof are prevented from being overhigh in temperature, and the heat dissipation performance of the electronic equipment is improved.

Description

Electronic device

Technical Field

The present disclosure relates to the technical field of electronic devices, and particularly, to an electronic device.

Background

With the development and progress of technology, the functional requirements of people on electronic devices such as mobile phones and the like are higher and higher. In order to enrich the functions of electronic equipment, it is necessary to integrate a variety of functional devices in the electronic equipment, and the space for accommodating the functional devices in the electronic equipment is limited. In an electronic device, an external audio power consumption member may be disposed near an antenna, and the external audio power consumption member may generate a large amount of heat during operation, thereby requiring heat dissipation. The heat dissipation part in the electronic equipment is usually a stainless steel part or a graphite part and other conductor devices, and when the radiation of the audio frequency power dissipation part is performed through the conductor devices, the conductor devices used for heat dissipation can affect the antenna, so that the heat dissipation can not be performed through the conductor devices, and the heat dissipation performance of the electronic equipment is poor.

It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.

Disclosure of Invention

The present disclosure is directed to an electronic device, and further, to improve the heat dissipation performance of the electronic device at least to a certain extent.

The present disclosure provides an electronic device, the electronic device including:

an antenna;

the heating piece is arranged on one side of the antenna;

the insulating support is connected with the heating piece;

the insulating heat-conducting piece is connected to the insulating support, at least part of an orthographic projection of the insulating heat-conducting piece on the heating piece is overlapped with the heating piece, and the heat conductivity coefficient of the insulating heat-conducting piece is larger than that of the insulating support;

and the heat dissipation heat sink is connected with one end of the heat conducting piece, which is far away from the antenna.

The electronic equipment provided by the embodiment of the disclosure conducts heat conducted to the insulating support by the heating piece to the heat sink through the insulating heat conducting piece, so that the conduction of heat generated by the heating piece can be accelerated, the heating piece and the peripheral area of the heating piece are prevented from being overhigh in temperature, and the heat dissipation performance of the electronic equipment is improved. Furthermore, heat is conducted through the insulating heat-conducting piece, and the influence of the conductor heat-conducting piece on the performance of the antenna is avoided.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.

Fig. 1 is a schematic structural diagram of an electronic device according to an exemplary embodiment of the present disclosure;

fig. 2 is an exploded schematic view of an electronic device provided in an exemplary embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of another electronic device provided in an exemplary embodiment of the present disclosure;

fig. 4 is a partial cross-sectional view of a first electronic device provided in an exemplary embodiment of the present disclosure;

fig. 5 is a partial cross-sectional view of a second electronic device provided in an exemplary embodiment of the present disclosure;

fig. 6 is a partial cross-sectional view of a third electronic device provided in an exemplary embodiment of the present disclosure;

fig. 7 is a temperature distribution diagram around a heat generating member according to an exemplary embodiment of the present disclosure;

fig. 8 is a temperature distribution diagram around another heat generating member provided by an exemplary embodiment of the present disclosure;

fig. 9 is a temperature diagram of an electronic device provided in the related art;

fig. 10 is a temperature diagram of an electronic device according to an exemplary embodiment of the disclosure.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.

The terms "a," "an," "the," "said," and "at least one" are used to indicate the presence of one or more elements/components/parts/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first," "second," and "third," etc. are used merely as labels, and are not limiting on the number of their objects.

First, an electronic device is provided in an exemplary embodiment of the present disclosure, fig. 1 is a schematic view of an electronic device provided in an exemplary embodiment of the present disclosure, as shown in fig. 1, the electronic device includes an antenna 110, a heating element 120, an insulating support 130, an insulating heat conducting element 140, and a heat sink 150, the heating element 120 is disposed on one side of the antenna 110; the insulating support 130 is connected with the heating member 120; the insulating heat-conducting member 140 is connected to the insulating support 130, and at least part of the orthographic projection of the heating member 120 is overlapped with the heating member 120, and the heat conductivity coefficient of the insulating heat-conducting member 140 is greater than that of the insulating support 130; the heat sink 150 is coupled to an end of the thermal conductor member remote from the antenna 110.

The electronic device provided by the embodiment of the present disclosure conducts the heat of the heating element 120 conducted to the insulating support 130 to the heat sink 150 through the insulating heat conducting element 140, so as to accelerate the conduction of the heat generated by the heating element, avoid the heating element and the peripheral area thereof from having too high temperature, and improve the heat dissipation performance of the electronic device. Further, the heat is conducted through the insulating heat-conducting member 140, so that the influence of the conductive heat-conducting member on the performance of the antenna 110 is avoided.

Further, as shown in fig. 2, the electronic device provided by the embodiment of the disclosure may further include a main board 160, wherein the main board 160 is connected to the insulating support 130 and forms a containing portion with the insulating support 130, and the heat generating member 120 is disposed in the containing portion.

The following describes portions of an electronic device provided in an embodiment of the present disclosure in detail:

the antenna 110 is an antenna radiator of the electronic device, and the antenna 110 may be disposed on a frame 180 of the electronic device, or the antenna 110 is disposed on a rear cover 170 of the electronic device, or the antenna 110 may be disposed on a motherboard 160 of the electronic device.

When the antenna 110 is disposed on the frame 180 of the electronic device, the frame 180 of the electronic device may be a metal frame 180, for example, the frame 180 may be a stainless steel frame 180 or an aluminum alloy frame 180. The antenna 110 may be a metal stub on the metal bezel 180. For example, the antenna 110 may be a metal stub located on top of the electronic device bezel 180.

When the antenna 110 is disposed on the rear cover 170 of the electronic device, the rear cover 170 of the electronic device has at least one metal branch. The back cover 170 of the electronic device may be a metal back cover 170, and the metal back cover 170 is divided into a plurality of metal branches. Or the rear cover 170 of the electronic device is the insulating rear cover 170, and metal branches are embedded in the insulating rear cover 170 and serve as the antenna 110. For example, the antenna 110 may be a metal stub located near the top of the electronic device back cover 170.

When the antenna 110 is disposed on the main board 160 of the electronic device, the material of the bezel 180 and the rear cover 170 of the electronic device may be an insulating material. The antenna 110 is a metal segment disposed on the main board 160, the metal segment on the main board 160 receives and transmits electromagnetic signals, and the frame 180 and the rear cover 170 made of insulating materials can allow the electromagnetic signals to pass through, so as to prevent the rear cover 170 and the frame 180 from shielding the electromagnetic signals.

The antenna 110 may be coupled to a radio frequency module of the electronic device. The antenna 110 and the rf module may be directly connected or coupled. The radio frequency module can comprise a radio frequency transceiving circuit, a power amplifying circuit and a radio frequency switch circuit. The radio frequency transceiver circuit is used for receiving and transmitting radio frequency signals, the power amplification circuit is connected with the radio frequency transceiver module, and the power amplification circuit is used for amplifying signals output by the radio frequency transceiver circuit. The rf switch circuit is connected to the antenna 110, the power amplifier, and the rf transceiver circuit, and the rf switch circuit is used to separate multiple signals. For example, the rf switch circuit may include multiplexers respectively connected to the antenna 110, the power amplifier and the rf transceiver circuit.

The heating member 120 is disposed at one side of the antenna 110, and a distance between the heating member 120 and the antenna radiator is less than a preset distance. The heat generating member 120 is at least partially located in a keep-out region of the antenna 110, and when a conductor device is disposed in the keep-out region, the conductor device may affect the communication performance of the antenna 110. That is, the predetermined distance is such that at least a portion of the heat generating element 120 is located in a clearance area of the antenna 110, that is, the conductor is disposed within the predetermined distance, which affects the communication performance of the antenna 110.

When the antenna 110 is disposed on the frame 180 of the electronic device, the heating element 120 is disposed on the main board 160, and the heating element 120 is disposed on a side of the antenna 110 near the inside of the electronic device. The distance between the heating element 120 and the top of the frame 180 is smaller than a preset distance, so that the internal compactness of the electronic equipment can be improved, and the internal cloth space of the electronic equipment can be saved.

When the antenna 110 is disposed on the rear cover 170 of the electronic device, the heat generating element 120 is disposed on the main board 160, and an orthographic projection of the antenna 110 on the main board 160 is located on a side of the heat generating element near a top end of the electronic device. And the distance between the orthographic projections of the heating element 120 and the antenna 110 on the main board 160 is smaller than the preset distance, so that the internal compactness of the electronic equipment can be improved, and the internal cloth space of the electronic equipment can be saved.

When the antenna 110 is disposed on the main board 160 of the electronic device, the heat generating element 120 is disposed on the main board 160, and the heat generating element 120 is disposed on a side of the antenna 110 away from the frame 180. The distance between the heating element 120 and the antenna 110 is smaller than the preset distance, so that the space on the main board 160 can be saved, the internal compactness of the electronic device is improved, and the internal cloth space of the electronic device is saved.

It should be noted that, in the embodiment of the present disclosure, the conductor device disposed on the heat generating member 120 affects the communication performance more than a preset degree. For example, the effect of the conductor device on the communication performance of the antenna 110 is greater than 10% or 20% when the conductor device is disposed on the heat generating member 120.

For example, the heat generating member 120 may be an external audio power consumption unit, which is disposed at one side of the antenna 110 and connected to the insulating support 130. The insulating heat-conducting member 140 is disposed on a side of the insulating support 130 away from the heat generating member 120. Of course, in practical applications, the heat generating component 120 may also be other power consuming devices, such as a processor, and the embodiment of the disclosure is not limited thereto.

The external audio power consumption unit may include a case and a sound generating device, the sound generating device being installed in the case, the sound generating device being for generating sound in response to the excitation signal, the case being for protecting the sound generating device. The housing may be made of an insulating material, for example, the material of the housing may be plastic, rubber, or ceramic. The case made of the insulating material can prevent the external audio power consumption unit from affecting the communication performance of the antenna 110.

It should be noted that, in the embodiment of the disclosure, the specific gravity of the conductor element in the heat generating member 120 is smaller than the preset ratio, or the conductor element in the heat generating member 120 may be located on a side of the heat generating member 120 away from the antenna 110. Thereby preventing the conductor element in the heat generating member 120 from affecting the communication performance of the antenna 110.

The insulating support 130 and the main board 160 are connected, and the insulating support 130 and the main board 160 form a receiving part in which the heat generating member 120 is disposed. The insulating support 130 may be made of an insulating material such as plastic, ceramic, or glass, and the insulating support 130 is made of an insulating material, so that the insulating support 130 can prevent the communication performance of the antenna 110 from being affected.

As shown in fig. 3, the insulating bracket 130 may include a frame 132 and a connecting plate 131, wherein the frame 132 is connected to the main board 160; the connecting plate 131 is connected to the frame 132, the heating element 120 is disposed between the connecting plate 131 and the main board 160, and the insulating heat-conducting element 140 is disposed at an end of the connecting plate 131 away from the heating element 120.

The frame 132 may be a rectangular frame 132, the frame 132 includes a first side, a second side, a third side, and a fourth side connected end to end, and the frame 132 has an accommodating space therein. The first edge may be one edge near the top of the electronic device and the antenna 110 may be adjacent to the first edge. The connecting plate 131 is located in the accommodating space of the frame 132, and the connecting plate 131 is connected to the frame 180. The connecting plate 131 and the frame 180 may be integrally formed, for example, the connecting plate 131 and the frame 180 may be integrally formed by injection molding. Or the frame 180 and the connecting plate 131 may be formed separately and then connected by means of plugging or bolting, which is not specifically limited in the embodiment of the present disclosure.

The connection plate 131 may be provided with one or more notches, and the notches in the connection plate 131 are used for exposing corresponding devices. For example, the connection plate 131 may be provided with a first notch for exposing the heat sink 150 and a second notch for forming an installation space of the battery 190.

The insulating heat-conducting member 140 is connected to the insulating support 130, and an orthographic projection of the insulating heat-conducting member 140 on the heat generating member 120 at least partially coincides with the heat generating member 120. The insulating heat-conducting member 140 is further connected to the heat sink 150, and the insulating heat-conducting member 140 transmits the heat generated by the heat generating member 120 to the heat sink 150.

The thermal conductivity of the insulating thermal conductive member 140 is greater than that of the insulating support 130, so that the thermal efficiency of the insulating thermal conductive member 140 is greater than that of the insulating support 130, and the heat dissipation of the heating member 120 can be accelerated by the insulating thermal conductive member 140, thereby reducing the temperature of the electronic device.

The dielectric constant of the material of the insulating and heat conducting member 140 is less than or equal to 5, and the heat conductivity coefficient of the insulating and heat conducting material is greater than or equal to 10W/m.degree. For example, the material of the insulating and heat-conducting member 140 may be h-BN (hexagonal boron nitride) or an intrinsic polymer having a highly ordered structure, such as a high crystallinity PE fiber woven film material. In the h-BN plane, B, N atoms form a graphite-like structure in an SP2 hybrid form, and the graphite-like structure has high heat conduction property. Of course, in practical applications, other materials may be used for the insulating and heat conducting member 140, and the embodiments of the present disclosure are not limited thereto.

The insulating heat-conducting member 140 may be a thin film structure, and the thin film structure may be attached to the insulating support 130 or directly attached to a side of the heat-generating member 120 away from the main board 160. For example, the insulating thermal conductive film is attached to an end of the insulating support 130 away from the heat generating element 120. Or the insulating heat conducting film is attached to the surface of the heat generating element 120 away from the main board 160.

In one possible embodiment of the present disclosure, as shown in fig. 4, the heat generating member 120 is located at one side of the insulating support 130, and the insulating heat conducting member 140 is located at the other side of the insulating support 130. The heat generating member 120 is connected to the insulating support 130, for example, the heat generating member 120 may be in direct contact with the insulating support 130, or the heat generating member 120 may be connected to the insulating support 130 through a heat dissipating adhesive. The insulating thermal conductive member 140 is in contact with the insulating support 130, for example, the insulating thermal conductive member 140 is directly connected to the insulating support 130, or the insulating thermal conductive member 140 and the insulating support 130 are connected by a heat dissipation adhesive. At this time, the heat dissipation path of the heat generated by the heat generating member 120 is: a heat generating member 120, an insulating support 130, an insulating heat conducting member 140, and a heat sink 150.

The orthographic projection of the insulating heat-conducting member 140 on the heat generating member 120 at least partially covers the heat generating member 120, so that the insulating heat-conducting member 140 can conduct the heat generating member 120 to the insulating support 130 for rapid heat absorption. The orthographic projection of the insulating heat-conducting member 140 on the heat sink 150 at least partially coincides with the heat sink 150, so that the heat on the insulating heat-conducting member 140 can be quickly conducted to the heat sink 150.

As an example, the orthographic projection of the insulating heat-conducting member 140 on the heat generating member 120 completely covers the heat generating member 120, and the heat generated by the heat generating member 120 can be quickly conducted to the insulating heat-conducting member 140 by the insulating support 130. The side of the heating element 120 away from the main board 160 is completely covered by the connecting plate 131, and the insulating heat-conducting element 140 covers the side of the connecting plate 131 away from the heating element 120.

It is understood that providing a conductor at a portion of the heat generating member 120 close to the antenna 110 may affect the communication performance of the antenna 110. Therefore, the heat dissipation can be performed by using the insulating support 130 and the insulating heat-conducting member 140 at the portion of the heating member 120 close to the antenna 110, and the heat dissipation can be performed by using the heat sink 150 at the portion of the heating member 120 far from the antenna 110.

For example, as shown in fig. 5, the heat generating member 120 has a first region and a second region, the second region is located on a side of the first region away from the antenna 110, the insulating support 130 is opposite to the first region, the heat sink 150 is opposite to the second region, and the insulating heat conducting member 140 is located on a side of the insulating support 130 away from the heat generating member 120.

The connection plate 131 of the insulating bracket 130 is provided with a connection portion, and the connection portion is in contact with the first region of the heat generating member 120, for example, the connection portion is directly connected with the first region of the heat generating member 120, or the connection portion is connected with the first region of the heat generating member 120 through a heat dissipating adhesive.

The portion of the insulating support 130 corresponding to the second area is a hollow structure, and the heat sink 150 extends into the hollow structure and contacts with the second area of the heat generating member 120, for example, the second area of the heat generating member 120 may be directly connected to the heat sink 150, or the second area of the heat generating member 120 may be connected to the heat sink 150 through a heat dissipating adhesive.

The insulating bracket 130 is provided with a first gap, the heat sink 150 is exposed in the first gap, and the insulating heat-conducting member 140 is inserted into the first gap and connected with the heat sink 150. The first notch may be disposed in a projection area of the second region on the insulating support 130.

The heat of the first region of the heat generating member 120 is conducted through the insulating heat conductive member 140, and the second region of the heat generating member 120 is directly connected through the heat sink 150 to dissipate the heat. On the one hand, the insulating heat-conducting member 140 can dissipate heat of the first area of the heating member 120 on the basis of ensuring the communication performance of the antenna 110, and on the other hand, the heat sink 150 dissipates heat of the second area of the heating member 120, so that the heat dissipation efficiency of the second area of the heating member 120 can be improved, and the temperature of the electronic device is further reduced.

In another possible embodiment of the present disclosure, as shown in fig. 6, a mounting through hole may be provided on the insulating support 130, and the mounting through hole may be provided in an orthographic projection area of the heat generating member 120 on the insulating support 130. The insulating heat-conductive member 140 may be mounted to the mounting through-hole such that the insulating heat-conductive member 140 contacts the heat generating member 120. At this time, the heat dissipation path of the heat generated by the heat generating member 120 is: a heating member 120, an insulating heat-conducting member 140, and a heat sink 150.

The insulating heat-conducting member 140 may partially cover the heat generating member 120 or completely cover the heat generating member 120, so that heat generated from the heat generating member 120 can be conducted to the insulating heat-conducting member 140. The insulating heat-conducting member 140 extends from the heat generating member 120 to the heat-dissipating heat sink 150, and the heat-dissipating heat sink 150 absorbs heat of the insulating heat-conducting member 140.

Illustratively, one end of the heat generating member 120 away from the main board 160 contacts the insulating heat conducting member 140, and the insulating heat conducting member 140 completely covers the surface of the heat generating member 120 away from the main board 160. The heat sink 150 is disposed at an end of the heat generating member 120 away from the antenna 110, an end of the insulating heat conducting member 140 away from the antenna 110 is connected to the heat sink 150, and the insulating heat conducting member 140 partially overlaps the heat sink 150.

Illustratively, the heat generating member 120 has a first region and a second region, the second region is located on a side of the first region away from the antenna 110, the insulating heat conducting member 140 is in contact with the first region, and the heat sink 150 is in contact with the second region.

The connection plate 131 of the insulating support 130 is provided with a connection through-hole facing the first region of the heat generating member 120, and the insulating heat-conductive member 140 is provided in the connection through-hole and connected to the heat generating member 120. For example, the insulating heat-conducting member 140 and the first region of the heat generating member 120 are directly connected, or the insulating heat-conducting member 140 and the first region of the heat generating member 120 are connected by heat-dissipating glue.

The heat sink 150 may be a graphite heat sink or a stainless steel heat sink, the heat sink 150 is connected to the insulating heat-conducting member 140, and the insulating heat-conducting member 140 forms a bridge for heat transfer between the heat generating member 120 and the heat sink 150 to reduce the heat of the heat generating member 120.

The end of the heat sink 150 away from the motherboard 160 may be connected to the rear cover 170 of the electronic device, for example, the side of the heat sink 150 away from the motherboard 160 contacts the rear cover 170 of the electronic device, or the side of the heat sink 150 away from the motherboard 160 is connected to the rear cover 170 of the electronic device through a heat sink adhesive (such as heat sink foam).

The heat sink 150 may include a first heat sink 151 and a second heat sink 152, the first heat sink 151 and the second heat sink 152 at least partially overlapping, the first heat sink 151 may be a stainless steel heat sink, and the second heat sink 152 may be a graphite heat sink. The second heat sink 152 may be attached to the rear cover 170 of the electronic device by heat dissipation glue or the like.

It should be noted that the heat sink 150 in the embodiment of the disclosure can be used to dissipate heat not only from the heat generating element 120 around the antenna 110, but also from the heat generating element 120 at other positions on the motherboard 160 and the heat generating element 120 outside the motherboard 160. For example, the heat-dissipating heat sink 150 may include a first heat-dissipating portion and a second heat-dissipating portion, the first heat-dissipating portion and the second heat-dissipating portion being connected. The first heat sink member may be opposite to the main plate 160, and the second heat sink member may be opposite to the battery 190.

In the embodiment of the present disclosure, the shape of the insulating and heat-conducting member 140 may be determined according to the temperature distribution of the electronic device during use. The area of the electronic device adjacent to the heat generating member 120 includes a first temperature zone 11 and a second temperature zone 12, when the electronic device is operated, the temperature of the first temperature zone 11 is lower than that of the second temperature zone 12, and the insulating heat conductive member 140 extends from the area corresponding to the heat generating member 120 to the first temperature zone 11.

The first temperature zone 11 may be any one of the areas of the electronic device adjacent to the heat generating member 120, the second temperature zone 12 may be any one of the areas of the electronic device adjacent to the heat generating member 120, and the first temperature zone 11 and the second temperature zone 12 are different.

For example, the electronic device may be divided into grids, and the temperature of each grid region may be detected when the electronic device is operated. The first temperature zone 11 is a region having the lowest temperature among the plurality of mesh zones. When the mesh is divided, the size of the mesh may be determined according to the size of the insulating and heat-conducting member 140. For example, the width of the mesh may be the same as or slightly larger than the width of the insulating and heat-conducting member 140. When the antenna 110 is disposed above the heating member, the grid regions are disposed on both sides of the heating member or at the bottom of the heating member.

The insulating heat-conducting member 140 may include a first heat-conducting portion and a second heat-conducting portion from the heat-generating member 120 to the heat-dissipating heat sink 150, the first heat-conducting portion and the second heat-conducting portion are connected, the second heat-conducting portion is attached to the heat-dissipating heat sink 150, and the first heat-conducting portion extends from the heat-generating member 120 to the second heat-conducting portion. The first heat conduction portion may extend from an area where the temperature around the heat generating member 120 is low to the heat-dissipating heat sink 150, and the second heat conduction portion may be provided at an area where the temperature of the heat-dissipating heat sink 150 is low.

As shown in fig. 7, the temperature of the region of the side of the heat generating member 120 away from the antenna 110 is the lowest when the electronic device is in operation, and the insulating heat conducting member 140 extends from the heat generating member 120 to the side of the heat generating member 120 away from the antenna 110 and is connected to the heat sink 150. As shown in fig. 8, the right region of the heat generating member 120 has the lowest temperature when the electronic device is in operation, and the insulating heat conductive member 140 extends from the heat generating member 120 to the right region of the heat generating member 120 and is thermally connected to the heat sink.

The shape of the insulating heat-conducting member 140 in the embodiment of the present disclosure can be adjusted according to the temperature distribution of the electronic device, so as to transmit the heat of the heat-generating member 120 to the area with the lower temperature of the heat sink 150, thereby speeding up the heat dissipation.

The electronic device provided by the embodiment of the disclosure transmits the heat of the heating element 120 to the heat sink 150 through the insulating heat-conducting element 140, so that the heat dissipation efficiency of the heating element 120 can be improved, and the temperature of the heating element 120 of the electronic device can be reduced. In the related art, as shown in fig. 9, the temperature at the heat generating member 120 of the electronic device is 45.88 degrees celsius. In the embodiment of the present disclosure, as shown in fig. 10, the temperature at the heat generating member 120 of the electronic device is 43.63 degrees celsius. As can be seen from the temperature distribution diagrams of fig. 9 and 10, the temperature at the heat generating member 120 of the electronic device provided by the embodiment of the disclosure is effectively reduced.

Further, the electronic device provided by the embodiment of the present disclosure may further include a display screen 180 and a battery 190, where the display screen 180 forms a front shell of the electronic device, and the display screen 180, the frame 180 and the rear cover 170 form an inner accommodating space of the electronic device. The main board 160, the heat generating member 120, the insulating bracket 130, the insulating heat conducting member 140, the heat sink 150 and the battery 190 are disposed in the internal accommodating space.

A glass cover plate may be disposed on the display screen 180. The glass cover plate can cover the display screen 180 to protect the display screen 180 and prevent the display screen 180 from being scratched or damaged by water. The display screen 180 may include a display area as well as a non-display area. Wherein the display area performs the display function of the display screen 180 for displaying information such as images, text, etc. The non-display area does not display information. The non-display area can be used for arranging functional modules such as a camera, a receiver, a proximity sensor and the like. In some embodiments, the non-display area may include at least one area located at an upper portion and a lower portion of the display area.

The display screen 180 may be a full-face screen. At this time, the display screen 180 may display information in a full screen, so that the electronic device has a large screen occupation ratio. The display screen 180 includes only a display area and does not include a non-display area. At this time, functional modules such as a camera and a proximity sensor in the electronic device may be hidden under the display screen 180, and the fingerprint identification module of the electronic device may be disposed on the back of the electronic device.

The frame 180 may be a hollow frame structure. The material of the frame 180 may include metal or plastic. The main board 160 is installed inside the receiving space. For example, the main board 160 may be mounted on the frame 180 and received in the receiving space together with the frame 180. The main board 160 is provided with a grounding point to realize grounding of the main board 160. One or more of a motor, a microphone, a speaker, a receiver, an earphone interface, a universal serial bus interface (USB interface), a camera, a proximity sensor, an ambient light sensor, a gyroscope, and a processor may be integrated on the main board 160. Meanwhile, the display screen 180 may be electrically connected to the main board 160. One or more metal branches in the bezel 180 may serve as the antenna 110, or the antenna 110 may be disposed on the motherboard 160 or the rear cover 170.

The main board 160 is provided with a display control circuit. The display control circuit outputs an electrical signal to the display screen 180 to control the display screen 180 to display information. The display control circuit can also be used as the heat generating element 120, and the insulating heat conducting element 140 can be connected to the display control circuit.

The battery 190 is installed inside the receiving space. For example, the battery 190 may be mounted on the frame 180 and received in the receiving space together with the frame 180. The battery 190 may be electrically connected to the motherboard 160 to enable the battery 190 to power the electronic device. The main board 160 may be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery 190 to the various electronic components in the electronic device.

The battery 190 also generates heat during the charging process, so that the battery 190 contacts the heat sink 150 to dissipate the heat of the battery 190 through the heat sink 150.

The rear cover 170 serves to form an outer contour of the electronic device. The rear cover 170 may be integrally formed. In the molding process of the rear cover 170, structures such as a rear camera hole, a fingerprint identification module mounting hole, etc. may be formed on the rear cover 170. The heat sink 150 and the back cover 170 are connected, for example, the heat sink 150 and the back cover 170 may be connected by a heat sink foam.

The electronic device provided by the embodiment of the disclosure conducts the heat of the heating member 120 conducted to the insulating support 130 to the heat sink 150 through the insulating heat-conducting member 140, so that the conduction of the heat generated by the heating member 120 can be accelerated, the heating member 120 and the peripheral area thereof are prevented from being over-high in temperature, and the heat dissipation performance of the electronic device is improved. Further, the heat is conducted through the insulating heat-conducting member 140, so that the influence of the conductive heat-conducting member on the performance of the antenna 110 is avoided.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

Claims

1. An electronic device, characterized in that the electronic device comprises:

an antenna;

the heating piece is arranged on one side of the antenna;

the insulating support is connected with the heating piece;

2. The electronic device according to claim 1, wherein an orthographic projection of the insulating heat-conducting member on the heat generating member completely covers the heat generating member.

3. The electronic device of claim 2, wherein an orthographic projection of the insulating heat-conducting member on the heat-dissipating heat sink at least partially coincides with the heat-dissipating heat sink.

4. The electronic device of claim 1, wherein the heat generating element has a first region and a second region, the second region is located on a side of the first region away from the antenna, the insulating support is opposite to the first region, the heat sink is opposite to the second region, and the insulating thermal conductor is disposed on a side of the insulating support away from the heat generating element.

5. The electronic device of claim 4, wherein the insulating support is provided with a first notch, the heat sink is exposed to the first notch, and the insulating heat conducting member is disposed through the first notch and connected with the heat sink.

6. The electronic device according to claim 1, wherein the insulating support is provided with a mounting through hole, the mounting through hole is located in a projection area of the heat generating member on the insulating support, the insulating heat-conducting member is provided in the mounting through hole, and the insulating heat-conducting member and the heat generating member are connected.

7. The electronic device of claim 1, wherein the electronic device further comprises:

the mainboard, the mainboard with the insulation support is connected to with the insulation support forms holding portion, generate heat the piece and locate holding portion.

8. The electronic device of claim 7, wherein the insulating support comprises:

the frame body is connected with the main board;

the connecting plate, the connecting plate connect in the framework, the piece that generates heat is located the connecting plate with between the mainboard, insulating heat-conducting element is located the connecting plate is kept away from the one end of the piece that generates heat.

9. The electronic device according to claim 1, wherein a region of the electronic device adjacent to the heat generating member includes a first temperature region and a second temperature region, the first temperature region having a temperature lower than that of the second temperature region when the electronic device is in operation, the insulating heat conductive member extending from a region corresponding to the heat generating member to the first temperature region.

10. The electronic device according to any one of claims 1 to 9, wherein the heat generating member is an external audio power consumption member, and the external audio power consumption member is disposed at one side of the antenna and connected to the insulating support.

11. The electronic device according to any one of claims 1 to 9, wherein the insulating and heat-conducting member is made of a material having a dielectric constant of 5 or less, and the insulating and heat-conducting member has a thermal conductivity of 10 w/m-degree or more.