CN113473790A - 浸入式冷却系统 - Google Patents

浸入式冷却系统 Download PDF

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CN113473790A
CN113473790A CN202010178890.0A CN202010178890A CN113473790A CN 113473790 A CN113473790 A CN 113473790A CN 202010178890 A CN202010178890 A CN 202010178890A CN 113473790 A CN113473790 A CN 113473790A
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pipe
valve body
cooling system
delivery pipe
storage container
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CN113473790B (zh
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童凯炀
陈虹汝
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Inventec Pudong Technology Corp
Inventec Corp
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Inventec Corp
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

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Abstract

本发明公开了一种浸入式冷却系统，适用于储存用来冷却一热源的一冷却液。浸入式冷却系统包含一储液容器、一流管及一气体调节组件。储液容器用以储存用来冷却热源的冷却液。流管的一端连接于储液容器。气体调节组件位于流管上方并包含一阀体、一冷却器及一储气容器。阀体包含一第一输送管、一第二输送管及一第三输送管。阀体受切换而令第一输送管连通第二输送管或第三输送管。阀体的第一输送管通过冷却器连通流管。第二输送管连通于外，第三输送管连通于储气容器。

Description

浸入式冷却系统
技术领域
本发明关于一种冷却系统，特别是一种浸入式冷却系统。
背景技术
目前电子设备常利用热源浸泡于冷却液中的浸入式液冷系统达到散热的效果，以令冷却液可直接吸取热源的热量，并借由冷却液吸热后的相变化将热源的热量带离，而使得热源得以冷却。
由于浸入式液冷系统常需开盖维护，故浸入式液冷系统的盖体为非密封的设置，使得热源在启动的过程中，冷却液吸热后产生的冷却液蒸气迅速累积而使得浸入式液冷系统内部的压力增加，进而造成部分的冷却液蒸气逸漏于外部而损失。有鉴于此，厂商于浸入式液冷系统上方加装一储气容器，通过储气容器暂时储存汽化后的冷却液蒸汽。
然而，因目前储气容器的体积非常庞大，使得电子设备的排放密度受到大体积的储气容器的影响而大幅下降。因此，如何缩小储气容器的体积，以避免电子设备的排放密度因此下降，则为研发人员应解决的问题之一。
发明内容
本发明在于提供一种浸入式冷却系统，其主要目的是借以缩小气体调节组件中储气容器的体积，以进一步提升电子设备的热排放密度。
本发明另一目的是在兼顾系统压力的调节下，提供两段式冷却液回收以及释压的机制，以在释压过程中可以减少冷却液的散逸。
本发明再一目的是通过散热鳍片辅助散热或主动散热机制，以增进散热效率。
本发明又再一目的是通过冷却器的优化，以增进回收路径中的冷却液回流效率。
本发明的一实施例所公开的浸入式冷却系统，适用于储存用来冷却一热源的一冷却液。浸入式冷却系统包含一储液容器、一流管及一气体调节组件。储液容器用以储存用来冷却热源的冷却液。流管的一端连接于储液容器。气体调节组件位于流管上方并包含一阀体、一冷却器及一储气容器。阀体包含一第一输送管、一第二输送管及一第三输送管。阀体受切换而令第一输送管连通第二输送管或第三输送管。阀体的第一输送管通过冷却器连通流管。第二输送管连通于外，第三输送管连通于储气容器。
在本实施例中，冷却器还包含多个散热鳍片，这些散热鳍片连接这些导热管，以进一步提升冷却器的冷却效率。
根据上述实施例的浸入式冷却系统，通过一对多的阀体的设置，使得混合气体可依气态冷却液的浓度来决定排出于大气中，或是收容于储气容器中。如此一来，将可避免冷却液的损失。
此外，在阀体与流管间加装冷却器，使得冷却器可先将混合气体中部分的气态冷却液冷凝回液体冷却液，以进一步降低气态冷却液在混合气体中的浓度。也就是说，当要将混合气体从第三输送管排出于大气时，因为混合气体中气态冷却液的浓度降低了，故可进一步减少冷却液的损失。
以上关于本发明内容的说明及以下实施方式的说明用以示范与解释本发明的原理，并且提供本发明的专利申请范围更进一步的解释。
附图说明
图1为根据本发明第一实施例所述的浸入式冷却系统的立体示意图。图2为图1的局部放大示意图。
图3为图2的侧视示意图。
图4为图2的简易示意图。
图5为图2的冷却器的剖面示意图。
图6为根据本发明第二实施例所述的浸入式冷却系统的简易示意图。
附图标记说明：
10 浸入式冷却系统
100 储液容器
200 流管
300 气体调节组件
310 阀体
311 第一输送管
312 第二输送管
313 第三输送管
314 第四输送管
320 冷却器
321 第一导热壳体
3211 第一空间
3212 第一连通口
3213 导斜面
322 第二导热壳体
3221 第二空间
3222 第二连通口
323 导热管
324 散热鳍片
330 储气容器
340 风扇
350 外壳
351 通风槽体
352 通风盖体
D 直径
具体实施方式
请参阅图1。图1为根据本发明第一实施例所述的浸入式冷却系统的立体示意图。
本实施例的浸入式冷却系统10适用于储存用来冷却一热源(未绘示)的一冷却液(未绘示)。热源例如为服务器或主机组件。冷却液例如为水或冷媒。浸入式冷却系统10包含一储液容器100、一流管200及一气体调节组件300。储液容器100用以储存用来冷却热源的冷却液。流管200的一端连接于储液容器100，且流管200的另一端连接于气体调节组件300。
请参阅图2至图4。图2为图1的局部放大示意图。图3为图2的侧视示意图。图4为图2的简易示意图。气体调节组件300包含一阀体310、一冷却器320及一储气容器330。阀体310包含一第一输送管311、一第二输送管312及一第三输送管313。阀体310的第一输送管311通过冷却器320连通流管200。第二输送管312连通于外。第三输送管313连通于储气容器330。在本实施例中，储气容器330、阀体310与冷却器320三者的水平高度由高到低，即储气容器330内若有气体冷凝回液体，则液体会受重力自然先流至阀体310再流至冷却器320。
阀体310例如为电子阀，并可受电信号的切换而令第一输送管311连通第二输送管312或第三输送管313。举例来说，第一输送管311一开始先阻断第二输送管312并连通第三输送管313而连通于外，接着，阀体310受到电信号的切换时，第一输送管311变成阻断第三输送管313，并通过第二输送管312连通于储气容器330。
进一步来说，当储液容器100的冷却液接收热源传来的热量时，冷却液会逐渐由液态汽化成气态，并与储液容器100内的空气形成混合气体。在汽化初期时，因为混合气体中气态冷却液的含量极低，气态冷却液的损失尚可接受，故可选择让阀体310的第一输送管311连通于第三输送管313并阻断第二输送管312，先将储液容器100内的部分混合气体自然排出于大气中。再者，在汽化中、后期时，因为混合气体中气态冷却液的含量慢慢增加，故若持续让混合气体通过第三输送管313排出于大气中，则恐会造成大量冷却液的损失。因此，在汽化中、后期时，可选择让阀体310的第一输送管311连通于第二输送管312并阻断第三输送管313，以将含有气态冷却液的混合气体收容于储气容器330中，待气态冷却液重新冷凝回液态冷却液时，再回流至储液容器100。如此一来，除了可降低冷却液的损失外，又可大幅缩小储气容器330所需的容积，进而提升服务器或主机等热源的排列密度。
此外，虽然在汽化初期，混合气体中气态冷却液的含量极低，但将其排出大气仍然为不必要的损失。因此，在本实施例中，还在阀体310与流管200间加装冷却器320，使得冷却器320可先将混合气体中部分的气态冷却液冷凝回液态冷却液，以进一步降低气态冷却液在混合气体中的浓度。也就是说，当要将混合气体从第三输送管313排出于大气时，因为混合气体中气态冷却液的浓度降低了，故可进一步减少冷却液的损失。
在本实施例中，气体调节组件300还可以包含多个风扇340，这些风扇340位于冷却器320的一侧。当这些风扇340运转时产生一散热气流来对冷却器320进行散热。在本实施例中，这些风扇340例如为轴流式风扇340，但并不以此为限。在其他实施例中，这些风扇也可以为离心式风扇或鼓风机。
请参阅图1与图3。气体调节组件300还可以包含一外壳350，外壳350包含一通风槽体351及一通风盖体352，通风盖体352覆盖于通风槽体351，以令通风盖体352与通风槽体351共同将阀体310、冷却器320、储气容器330及这些风扇340包覆于内。
请参阅图5。图5为图2的冷却器的剖面示意图。冷却器320例如还可以包含一第一导热壳体321、一第二导热壳体322及多个导热管323。第一导热壳体321连接并连通于流管200，第二导热壳体322连接并连通阀体310的第一输送管311，这些导热管323的相对两端分别连通第一导热壳体321与第二导热壳体322。在本实施例中，第一导热壳体321包含一第一空间3211、一第一连通口3212及两个导斜面3213。第一空间3211通过第一连通口3212连通流管200的通道。两个导斜面3213分别连接于第一连通口3212的相对两侧，且两个导斜面3213靠近第一连通口3212的一侧的水平高度低于两个导斜面3213远离第一连通口3212的一侧的水平高度。第二导热壳体322包含一第二空间3221及一第二连通口3222。第二空间3221除了通过这些导热管323连通第一空间3211外，还通过第二连通口3222连通第一输送管311。
在本实施例中，这些导热管323例如为圆管，且导热管323的直径D例如介于4至8毫米之间，以避免于导热管323内形成阻碍流体流通的液膜。当然若导热管323的直径D在小于4毫米或大于8毫米时亦可避免于导热管323内形成阻碍流体流通的液膜，则导热管323的直径D亦可落在小于4毫米或大于8毫米的任一值。
在本实施例中，这些导热管323呈直条状，即这些导热管323是从第一导热壳体321直线延伸至第二导热壳体322，中间并无任何弯曲。如此一来，当储气容器330中的气体变回冷却液时，直条状的导热管323并不会阻碍储气容器330中的冷却液回流至储液容器100。
在本实施例中，这些导热管323内皆设有毛细结构，以进一步协助液体回流。毛细结构例如为沟槽式、网目式(编织)、纤维式及烧结式。
在本实施例中，冷却器320还包含多个散热鳍片324，这些散热鳍片324连接这些导热管323，以进一步提升冷却器320的冷却效率。
请参阅图6。图6为根据本发明第二实施例所述的浸入式冷却系统的简易示意图。在本实施例中，进一步包含一第四输送管314。第四输送管314连通于储气容器330。阀体310可受切换而令第四输送管314连通该第二输送管。当储气容器330的压力超过临界时，阀体310受切换而令第四输送管314连通该第二输送管312。储气容器330中汽化后的至少部分冷却液经由阀体310排放至浸入式冷却系统外部。
根据上述实施例的浸入式冷却系统，通过一对多的阀体的设置，使得混合气体可依气态冷却液的浓度来决定排出于大气中，或是收容于储气容器中。如此一来，将可避免冷却液的损失。
此外，在阀体与流管间加装冷却器，使得冷却器可先将混合气体中部分的气态冷却液冷凝回液体冷却液，以进一步降低气态冷却液在混合气体中的浓度。也就是说，当要将混合气体从第三输送管排出于大气时，因为混合气体中气态冷却液的浓度降低了，故可进一步减少冷却液的损失。
基于前述本发明的各实施例，其可应用于各种形式的电子计算机架构(ComputerArchitecture)，例如网络通信设备、工业电脑、服务器及其周边装置，并也可以进一步应用于人工智能(英语：Artificial Intelligence，简称AI)运算、边缘运算(edge computing)、云端运算服务器、云端存储服务器、5G服务器或车联网服务器使用。

Claims (10)

1.一种浸入式冷却系统，适用于储存用来冷却一热源的一冷却液，该浸入式冷却系统包含：
一储液容器，用以储存用来冷却该热源的该冷却液；
一流管，该流管的一端连接于该储液容器；以及
一气体调节组件，位于该流管上方并该包含一阀体、一冷却器及一储气容器，该阀体包含一第一输送管、一第二输送管及一第三输送管，该阀体受切换而令该第一输送管连通该第二输送管或该第三输送管，该阀体的该第一输送管通过该冷却器连通该流管，该第二输送管连通于外，该第三输送管连通于该储气容器。
2.如权利要求1所述的浸入式冷却系统，其中该冷却器包含一第一导热壳体、一第二导热壳体及多个导热管，该第一导热壳体连接并连通于该流管，该第二导热壳体连接并连通该阀体的该第一输送管，该些导热管的相对两端分别连通该第一导热壳体与该第二导热壳体。
3.如权利要求2所述的浸入式冷却系统，其中该些导热管呈直条状。
4.如权利要求2所述的浸入式冷却系统，其中该些导热管内皆设有毛细结构。
5.如权利要求2所述的浸入式冷却系统，其中该第一导热壳体包含一第一空间、一第一连通口及两个导斜面，该第一空间通过该第一连通口连通该流管的通道，该两个导斜面分别连接于该第一连通口的相对两侧，且该两个导斜面靠近第一连通口的一侧的水平高度低于该两个导斜面远离第一连通口的一侧的水平高度。
6.如权利要求5所述的浸入式冷却系统，其中该储气容器、该阀体与该冷却器三者的水平高度由高到低。
7.如权利要求1所述的浸入式冷却系统，其中在该阀体受切换而令该第一输送管连通该第三输送管并阻断该第二输送管的状态中，该储液容器的部分该冷却液气化并经由该流管进入该气体调节组件；气化后的至少部分该冷却液在该气体调节组件的该冷却器中冷却并液化；气化后的至少部分该冷却液经由该阀体进入在该气体调节组件的该储气容器中；以及该冷却器中液化的该冷却液经该流管回流至该储液容器。
8.如权利要求7所述的浸入式冷却系统，其中气化后的至少部分该冷却液经由该阀体进入在该气体调节组件的该储气容器中冷却并液化；以及该储气容器中液化的该冷却液经该阀体进入该冷却器中。
9.如权利要求1所述的浸入式冷却系统，其中进一步包含一第四输送管，该第四输送管连通于该储气容器，该阀体受切换而进一步包含令该第四输送管连通该第二输送管；其中，在该阀体受切换而令该第四输送管连通该第二输送管；以及该储气容器中汽化后的至少部分该冷却液经由该阀体排放至该浸入式冷却系统外部。
10.如权利要求1所述的浸入式冷却系统，其中在该阀体受切换而令该第一输送管连通该第二输送管并阻断该第三输送管的状态中，该储液容器的部分该冷却液气化并经由该流管进入该气体调节组件；汽化后的至少部分该冷却液在该气体调节组件的该冷却器中冷却并液化；汽化后的至少部分该冷却液经由该阀体排放至该浸入式冷却系统外部；以及该冷却器中液化的该冷却液经该流管回流至该储液容器。
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