CN113473735A - Production process for gold plating of single-sided PCB - Google Patents
Production process for gold plating of single-sided PCB Download PDFInfo
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- CN113473735A CN113473735A CN202110719887.XA CN202110719887A CN113473735A CN 113473735 A CN113473735 A CN 113473735A CN 202110719887 A CN202110719887 A CN 202110719887A CN 113473735 A CN113473735 A CN 113473735A
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- plate
- board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 68
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 239000010931 gold Substances 0.000 title claims abstract description 59
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 59
- 238000007747 plating Methods 0.000 title claims abstract description 56
- 238000011282 treatment Methods 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 31
- 230000007547 defect Effects 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 24
- 238000005406 washing Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 17
- 238000005554 pickling Methods 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000002791 soaking Methods 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 9
- 230000007797 corrosion Effects 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 7
- 230000003064 anti-oxidating effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 4
- 239000013072 incoming material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- HLLSOEKIMZEGFV-UHFFFAOYSA-N 4-(dibutylsulfamoyl)benzoic acid Chemical compound CCCCN(CCCC)S(=O)(=O)C1=CC=C(C(O)=O)C=C1 HLLSOEKIMZEGFV-UHFFFAOYSA-N 0.000 description 1
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a production process for gold plating of a single-sided PCB, which comprises the following steps: selecting a plate meeting the production requirement; carrying out horizontal microetching treatment on the plate, and detecting the plate surface condition of the plate; determining that the plate is subjected to outer layer dry film treatment according to the plate surface condition of the plate; carrying out gold plating treatment on the board to obtain a required PCB; wherein, according to the face condition of panel, confirm that panel carries out outer dry film and handles, include: if the board surface of the board has no defect, carrying out outer layer dry film treatment on the board; if the board surface of the board has the defect, the board is ground to enable the board surface of the board to have no defect, and the board is subjected to outer layer dry film treatment. By adopting the process, the scrap rate can be reduced, the production cost is reduced, and the product percent of pass is improved.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) production, in particular to a production process for gold plating of a single-sided PCB.
Background
The PCB surface treatment full-board gold plating process plays a role of an anti-corrosion layer in the whole PCB manufacturing process, is surface treatment at the same time, is simpler and more convenient than other surface treatments in the process and has high reliability. Because gold is not easy to corrode, the gold is only dissolved in aqua regia, has strong tolerance to severe environment, and is widely used for surface treatment of key equipment such as automobiles, communication, aerospace and the like. Compared with gold plating, gold plating has high hardness and is widely used for plugging and pulling and friction interfaces. The conductivity of gold is better in nature, and the conduction resistance is small, so that the gold is widely used for contact conduction. Especially for instruments and meters with high requirements on sensitivity. The gold salt used in the gold plating process is very expensive, and the product quality requirement is very strict (the sliding PAD position does not allow any defects such as scratch marks, copper particles, pits and the like), so that the product is directly scrapped and lost due to slight negligence, and the manufacturing difficulty is higher.
The common single-side full-board gold plating production flow is that copper-clad plate incoming materials are directly produced on outer-layer dry films, because the copper-clad plate incoming materials cannot avoid the defects of plate surface defects such as plate surface scratch marks, pits, deep oxidation marks and the like, the defects can not be completely identified by naked eyes, even after the plates are ground, the defects can not be completely treated and the plate falling defects can not be completely treated during the gold plating pretreatment if the incoming materials are directly produced in the outer-layer dry film process, and the produced products face direct scrapping.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a production process for gold plating of a single-sided PCB, which can reduce scrap, reduce production cost and improve product percent of pass.
The production process for gold plating of the single-sided PCB comprises the following steps:
selecting a plate meeting the production requirement;
carrying out horizontal microetching treatment on the plate, and detecting the plate surface condition of the plate;
determining that the plate is subjected to outer layer dry film treatment according to the plate surface condition of the plate;
carrying out gold plating treatment on the board to obtain a required PCB;
wherein, according to the face condition of panel, confirm that panel carries out outer dry film and handles, include:
if the board surface of the board has no defect, carrying out outer layer dry film treatment on the board;
if the board surface of the board has the defect, the board is ground to enable the board surface of the board to have no defect, and the board is subjected to outer layer dry film treatment.
The production process for gold plating of the single-sided PCB provided by the embodiment of the invention at least has the following beneficial effects: before the outer layer dry film treatment, the plate is subjected to horizontal micro-etching treatment to enable the anti-oxidation film on the plate to be corroded, the poor defects on the plate are exposed, then the plate is ground to remove the poor defects on the plate, then the outer layer dry film treatment and the gold plating treatment are sequentially carried out, and finally the required PCB is obtained. By adopting the process, the scrap rate can be reduced, the production cost is reduced, and the product percent of pass is improved.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, the step of carrying out horizontal microetching treatment on the board to detect the board surface condition of the board comprises the following steps:
soaking the plate for acid washing;
washing the plate with water;
drying the plate;
and detecting the plate surface condition of the plate.
The anti-oxidation film on the plate is removed by pickling the plate, and then the pickling solution on the plate is removed by washing, so that the plate is prevented from being corroded again by the pickling solution, scrapping is reduced, and the production cost is reduced.
According to the production process for gold plating of the single-sided PCB, in the step of soaking the board for acid washing, a solution adopted by the acid washing is composed of the following components in concentration: 3-8% of sulfuric acid; 80-120 g/L of sodium persulfate; the balance of water, so that the pickling solution has a better corrosion effect.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, in the step of soaking and acid washing the board, the soaking time of the acid washing is 50-60 seconds, so that the problem that the bad defects on the board cannot be completely exposed due to the too short acid washing time is prevented, meanwhile, the phenomenon that the board is thinned and is easy to crack and scrap due to the too long acid washing time is also prevented, the scrap is reduced, and the production cost is reduced.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, in the process of pickling the plate by soaking, the corrosion amount of the pickling is 1-2 microns, so that the plate is prevented from being broken due to excessive micro-corrosion thinning, the scrappage is reduced, and the production cost is reduced.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, in the step of washing the board with water, the production process comprises the following steps:
and carrying out overflow cleaning and clear water cleaning on the plate in sequence.
Overflow cleaning is carried out firstly, so that the water overflow of the acid-washing solution on the plate is removed, and then cleaning is carried out, thereby improving the water-washing effect of the plate.
According to the production process for gold plating of the single-sided PCB, the drying of the board comprises the following steps:
and (4) drying the plate by strong wind and hot wind in sequence.
The board drying process sequentially comprises strong wind drying and hot wind drying, so that the drying speed of the board can be increased to a low speed, the gradual principle of the process is met, and the product quality is improved.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, the selection of the board meeting the production requirement comprises the following steps:
selecting a base material;
cutting the base material to obtain a plate with the size according with the size;
and drilling the plate to enable the plate to have the aperture meeting the production requirement.
The base material is cut into the board with the size according with the size, so that the waste of the board is reduced, and the production cost is reduced; and then, drilling treatment is carried out, so that the PCB can be electrically connected with different circuit layers in the subsequent process, the process is simple, and the operation is simple and convenient.
According to the production process for gold plating of the single-sided PCB, provided by the embodiment of the invention, the board is subjected to gold plating treatment to obtain the required PCB, and the production process comprises the following steps:
carrying out gold plating treatment on the plate to enable the plate to be provided with a gold plating surface;
etching the plate to remove the metal conductive layer deposited on the gold-plated surface;
carrying out solder mask treatment on the plate to enable the plate to be provided with a solder mask layer;
processing and detecting the shape of the board to obtain a required PCB;
and removing the metal conducting layer deposited outside the gold-plated surface by etching treatment, so as to prevent the redundant metal conducting layer from influencing the conducting performance of the PCB. Through increasing the solder mask, prevent that the metal conducting layer of PCB board from directly exposing in the air, have certain guard action, improve product quality.
According to the production process for gold plating of the single-sided PCB, the method for gold plating of the single-sided PCB further comprises the following steps of carrying out etching treatment on the board to remove the metal conductive layer deposited outside the gold plating surface:
and carrying out AOI scanning detection on the plate to determine that the plate meets the production requirement.
The AOI scanning is adopted to detect the plate, so that the detection efficiency can be improved, the product quality is improved, and the production cost is reduced.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flow chart of a production process for gold plating of a single-sided PCB according to some embodiments of the present invention;
FIG. 2 is a flow chart of a production process for gold plating of a single-sided PCB according to some embodiments of the present invention;
FIG. 3 is a flow chart of a production process for gold plating of a single-sided PCB according to some embodiments of the present invention;
FIG. 4 is a flow chart of a production process for gold plating of a single-sided PCB board according to some embodiments of the present invention;
FIG. 5 is a flow chart of a production process for gold plating of a single-sided PCB board according to some embodiments of the present invention;
FIG. 6 is a flow chart of a production process for gold plating of a single-sided PCB board according to some embodiments of the present invention;
FIG. 7 is a flow chart of a manufacturing process for gold plating of a single-sided PCB board according to some embodiments of the present invention;
FIG. 8 is a flow chart of a production process for gold plating of a single sided PCB board according to some embodiments of the present invention;
fig. 9 is a flow chart of a production process for gold plating of a single-sided PCB board according to some embodiments of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the present number, and larger, smaller, inner, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, an embodiment of the present invention provides a production process for gold plating of a single-sided PCB, including, but not limited to, step S110, step S120, step S130, and step S140.
Step S110: and selecting the plate meeting the production requirement.
The board meeting the production requirements is selected for production, so that the waste of the board is reduced, and the production cost is reduced.
Referring to fig. 2, fig. 2 is a schematic diagram of an embodiment of a refinement process of step S110 in fig. 1, where step S110 includes, but is not limited to:
step S210: selecting a base material;
step S220: cutting the base material to obtain a plate with the size according with the size;
step S230: and drilling the plate to make the plate have a hole diameter meeting the production requirement.
In one embodiment, the base material is cut into the plate with the size meeting the size, so that the waste of the plate can be reduced, and the production cost is reduced; and then, drilling is carried out on the board for realizing the electrical connection of different circuit layers of the PCB in the subsequent process, the process is simple, and the operation is simple and convenient.
Step S120: and carrying out horizontal microetching treatment on the plate, and detecting the plate surface condition of the plate.
The anti-oxidation film on the plate is corroded away by carrying out horizontal micro-etching treatment on the plate, the bad defects on the plate are exposed at the moment, and the plate is subjected to subsequent treatment according to the plate surface condition of the plate.
Referring to fig. 3, fig. 3 is a schematic diagram of an embodiment of a refinement procedure of step S120 in fig. 1, where step S120 includes, but is not limited to:
step S310: soaking the plate for acid washing;
step S320: washing the plate with water;
step S330: drying the plate;
step S340: and detecting the plate surface condition of the plate.
Acid cleaning is carried out on the plate, an anti-oxidation film on the plate is removed, and the bad defects on the plate are exposed, so that the plate can be treated in a later process; then removing the acid-washing solution on the plate by water washing, preventing the acid-washing solution from corroding the plate again, and preventing the plate from being thinned, cracked and scrapped due to secondary corrosion; and then drying the plate to enable the plate to reach the finished product level. By the process, scrap can be reduced, and production cost is reduced.
In some embodiments, the solution used for acid washing consists of the following concentrations of ingredients: 3-8% of sulfuric acid; 80-120 g/L of sodium persulfate; the balance of water, so that the pickling solution has a better corrosion effect.
In some embodiments, the pickling time is 50-60 seconds, so that the problem that the poor defects on the plate cannot be completely exposed due to too short pickling time is prevented, the plate is thinned and easily cracked and scrapped due to too long pickling time is also prevented, scrapping is reduced, and the production cost is reduced.
In some embodiments, the corrosion amount of the pickling is 1-2 um, so that the situation that the plate is thinned and easily cracked and scrapped due to corrosion of the plate is prevented, scrapping is reduced, and the production cost is reduced.
Referring to fig. 4, fig. 4 is a schematic diagram of an embodiment of a refinement procedure of step S320 in fig. 3, where the step S320 includes, but is not limited to:
step S410: and (4) performing overflow cleaning and clear water cleaning on the plate in sequence.
In some embodiments, the plate is subjected to overflow cleaning to remove the water overflow of the pickling solution on the plate, and then is subjected to cleaning water, so that the water cleaning effect of the plate is improved.
Referring to fig. 5, fig. 5 is a schematic diagram of an embodiment of the refinement procedure of step S330 in fig. 3, where step S320 includes, but is not limited to:
step S510: and (4) drying the plate by strong wind and hot wind in sequence.
The board drying process sequentially comprises strong wind drying and hot wind drying, so that the drying speed of the board can be increased to a low speed, the gradual principle of the process is met, and the product quality is improved.
Step S130: and determining the plate to carry out outer layer dry film treatment according to the plate surface condition of the plate.
Specifically, referring to fig. 6 and 7, fig. 6 and 7 are schematic diagrams of an embodiment of a refinement process of step S130 in fig. 1, respectively, where the step S130 includes but is not limited to:
step S610: if the surface of the plate has no defect, carrying out outer layer dry film treatment on the plate;
step S620: if the surface of the plate has a defect, the plate is ground to ensure that the surface of the plate has no defect, and the plate is subjected to outer layer dry film treatment.
In some embodiments, after the plate is subjected to horizontal micro-etching treatment, the anti-oxidation film on the plate is corroded off, and if no bad defects exist on the plate, the plate can be directly subjected to outer layer dry film treatment; if the plate has the bad defects, the bad defects are exposed, then the plate grinding treatment is carried out, the bad defects on the plate are wiped off, then the outer dry film treatment is carried out, the scrappage can be reduced, the production cost is reduced, and the product percent of pass is improved.
Step S140: and carrying out gold plating treatment on the board to obtain the required PCB.
The gold plating treatment is carried out on the board, so that the gold plating layer is formed on the board, the welding performance of the PCB is improved, and the welding effect is improved.
Specifically, referring to fig. 8, fig. 8 is a schematic diagram of an embodiment of a refinement procedure of step S140 in fig. 1, where the step S140 includes, but is not limited to:
step S710: carrying out gold plating treatment on the plate to enable the plate to be provided with a gold plating surface;
step S720: etching the plate to remove the metal conductive layer deposited on the gold-plated surface;
step S730: carrying out solder mask treatment on the plate to enable the plate to be provided with a solder mask layer;
step S740: processing and detecting the shape of the board to obtain a required PCB;
wherein, the etching treatment is to etch the copper layer at the non-circuit part by using a chemical reaction method. By etching the board, the metal conducting layer deposited outside the gold-plated surface can be removed, the influence of the redundant metal conducting layer on the conducting performance of the PCB is prevented, and the product quality is improved. The resistance welding treatment is to print all the places of the plate with the resistance welding oil, then place the resistance welding film on the plate covered with the resistance welding oil, then place the plate on an exposure machine for exposure, and the plate can expose the required holes and pads after development. Through resistance welding treatment, the metal conducting layer of the PCB is prevented from being directly exposed in the air, a certain protection effect is achieved, and the product quality is improved.
Referring to fig. 9, after step S710 in fig. 8 is completed, the method further includes the following steps:
step S810: and carrying out AOI scanning detection on the plate to determine that the plate meets the production requirements.
In some embodiments, the AOI scanning and scanning equipment is used to scan and analyze the sheet material, so as to determine whether the sheet material meets the production requirements according to the analysis result. By adopting AOI scanning to detect the plate, the detection efficiency can be improved, the product quality is improved, and the production cost is reduced.
According to the production process for gold plating of the single-sided PCB, disclosed by the embodiment of the invention, before the outer layer dry film treatment, the board is subjected to horizontal micro-etching treatment to enable the anti-oxidation film on the board to be corroded away, so that the poor defect on the board is exposed, then the board grinding treatment is carried out to remove the poor defect on the board, then the outer layer dry film treatment and the gold plating treatment are sequentially carried out, and finally the required PCB is obtained. By adopting the process, the scrap rate can be reduced, the production cost is reduced, and the product percent of pass is improved.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A production process for gold plating of a single-sided PCB board is characterized by comprising the following steps:
selecting a plate meeting the production requirement;
carrying out horizontal microetching treatment on the plate, and detecting the plate surface condition of the plate;
determining that the plate is subjected to outer layer dry film treatment according to the plate surface condition of the plate;
carrying out gold plating treatment on the board to obtain a required PCB;
wherein, according to the face condition of panel, confirm that panel carries out outer dry film and handles, include:
if the board surface of the board has no defect, carrying out outer layer dry film treatment on the board;
if the board surface of the board has the defect, the board is ground to enable the board surface of the board to have no defect, and the board is subjected to outer layer dry film treatment.
2. The production process for gold plating of a single-sided PCB as recited in claim 1, wherein the step of subjecting the board to horizontal microetching to detect the board surface condition of the board comprises:
soaking the plate for acid washing;
washing the plate with water;
drying the plate;
and detecting the plate surface condition of the plate after the plate is cooled.
3. The process according to claim 2, wherein in the step of pickling the plate by soaking, the pickling solution comprises the following components in concentration: 3-8% of sulfuric acid; 80-120 g/L of sodium persulfate; the balance being water.
4. The production process for gold plating of a single-sided PCB as recited in claim 2, wherein the soaking time of the acid washing in the acid washing of the plate material is 50-60 seconds.
5. The production process for gold plating of a single-sided PCB as recited in claim 2, wherein the amount of corrosion of the pickling is 1-2 um in the pickling of the plate by soaking.
6. The process according to claim 2, wherein the step of washing the plate material with water comprises:
and carrying out overflow cleaning and clear water cleaning on the plate in sequence.
7. The process according to claim 2, wherein the step of drying the plate material comprises the following steps:
and (4) drying the plate by strong wind and hot wind in sequence.
8. The process of claim 1, wherein the selecting of the board material meeting the production requirement comprises:
selecting a base material;
cutting the base material to obtain a plate with the size according with the size;
and drilling the plate to enable the plate to have the aperture meeting the production requirement.
9. The process according to claim 1, wherein the step of gold-plating the plate material to obtain the desired PCB plate comprises:
carrying out gold plating treatment on the plate to enable the plate to be provided with a gold plating surface;
etching the plate to remove the metal conductive layer deposited on the gold-plated surface;
carrying out solder mask treatment on the plate to enable the plate to be provided with a solder mask layer;
and carrying out appearance processing and detection on the board to obtain the required PCB.
10. The process according to claim 9, wherein said etching of said board material to remove the conductive layer deposited on the gold plating surface further comprises:
and carrying out AOI scanning detection on the plate to determine that the plate meets the production requirement.
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