CN113468018B - Method, system, equipment and medium for monitoring service life of glue nail - Google Patents
Method, system, equipment and medium for monitoring service life of glue nail Download PDFInfo
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- CN113468018B CN113468018B CN202110679853.2A CN202110679853A CN113468018B CN 113468018 B CN113468018 B CN 113468018B CN 202110679853 A CN202110679853 A CN 202110679853A CN 113468018 B CN113468018 B CN 113468018B
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- 239000003292 glue Substances 0.000 title claims abstract description 399
- 238000012544 monitoring process Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 claims description 55
- 238000001816 cooling Methods 0.000 claims description 43
- 238000004590 computer program Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims 2
- 230000007613 environmental effect Effects 0.000 description 9
- 230000001360 synchronised effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000005291 magnetic effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 235000010987 pectin Nutrition 0.000 description 1
- 229920001277 pectin Polymers 0.000 description 1
- 239000001814 pectin Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3037—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/32—Monitoring with visual or acoustical indication of the functioning of the machine
- G06F11/324—Display of status information
- G06F11/327—Alarm or error message display
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Physics & Mathematics (AREA)
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- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention provides a method for monitoring the service life of a rubber nail, which comprises the following steps: establishing a first corresponding relation between the temperature of the radiating fins around the first glue nail and the temperature of the chip corresponding to the radiating fins; periodically acquiring the current temperature of the chip, determining the second temperature of the glue nail to be tested according to the first corresponding relation, and determining the current service life of the glue nail to be tested according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature; if the service life of the glue nail to be detected is lower than the preset service life threshold value, the invention also provides a glue nail service life monitoring system, equipment and medium, so that the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required for monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
Description
Technical Field
The invention relates to the field of computer chips, in particular to a method, a system, equipment and a medium for monitoring service life of a glue nail.
Background
A chip in a general computer or a server uses a heat sink to assist in heat dissipation, and the heat sink generally includes a plurality of heat dissipation fins, a glue pin (pushpin), and a heat conducting plate, where the glue pin is used to fix the plurality of heat dissipation fins and the heat conducting plate (heat conducting plate).
The material of glued nail often can use nylon to make, and this kind of material is because for a long time in the state of high temperature with the tensile stress concentration of spring can lead to fatigue strength reduction, and the long-time use leads to the fact the cracked risk of glued nail easily, leads to the chip loss, pops out and removes the spring and lead to the fact the machine short circuit damage, causes serious loss.
The existing monitoring of the service life of the glue nail is artificial, if the service life of the glue nail reaches a certain range, the glue nail is replaced, however, the mode lacks a unified judging standard, and the influence of different temperatures on the service life in the use process of the glue nail is easily ignored, so that the reliability and the efficiency of the monitoring of the service life of the glue nail are lower; in another mode, the service life of the glue nail is judged by monitoring the temperature of the glue nail, but the temperature monitoring of the glue nail is not suitable for large-scale monitoring, so that the cost of hardware for monitoring is high, and the monitoring efficiency is low.
Disclosure of Invention
In order to solve the problems in the prior art, the invention innovatively provides a method, a system, equipment and a medium for monitoring the service life of the adhesive nail, which effectively solve the problems of low monitoring efficiency and high cost caused by the existing adhesive nail service life monitoring, effectively improve the adhesive nail service life monitoring efficiency and reduce the monitoring hardware cost.
The first aspect of the invention provides a method for monitoring the service life of a rubber nail, which comprises the following steps:
establishing a first corresponding relation between the temperature of the radiating fins around the first glue nail and the chip temperature corresponding to the radiating fins, wherein the first glue nail is the glue nail with the highest temperature on the radiating fins, the glue nail temperature is the temperature of the radiating fins around the glue nail, and the radiating fins at least comprise the first glue nail and a plurality of radiating fins;
acquiring service lives of the glue nails to be tested at different temperatures;
periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-tested glue nail according to the first corresponding relation, and determining the current service life of the to-be-tested glue nail according to the first service life of the to-be-tested glue nail corresponding to the first temperature and the second service life of the to-be-tested glue nail corresponding to the second temperature, wherein the first temperature is normal temperature;
If the current service life of the pectin nail is lower than a preset service life threshold value, an alarm is given.
Optionally, the establishing the first correspondence is specifically:
acquiring the chip temperatures corresponding to the cooling fins under the conditions of different server environment temperatures or operating system pressures;
acquiring the temperatures of the radiating fins in a preset range around the first glue nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures;
and establishing a first corresponding relation between the temperature of the chip corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures and the temperature of the cooling fin in a preset range around the first glue nail corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures through a regression equation.
Further, the temperature of the chip corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures is specifically: and acquiring the temperatures of the chips corresponding to the cooling fins under the conditions of different server environment temperatures or operating system pressures through the temperature sensors of the chips.
Optionally, the temperatures of the heat dissipation fins in the preset range around the first glue nail corresponding to the heat dissipation fins under the conditions of different server environment temperatures or operating system pressures are specifically: and arranging a temperature acquisition module on the radiating fins in a preset range around different glue nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first glue nails corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures.
Further, the temperature acquisition module comprises a thermocouple wire and a temperature recorder, wherein the thermocouple wire is connected with the radiating fins in a preset range around the first glue nail corresponding to the radiating fins, and the input end of the temperature recorder is connected with the output end of the thermocouple wire.
Optionally, according to the first service life of the to-be-tested glue nail corresponding to the first temperature and the second service life of the to-be-tested glue nail corresponding to the second temperature, determining that the current service life of the to-be-tested glue nail is specifically:
obtaining a first service life of the glue nail to be tested at a first temperature and a third service life of the glue nail to be tested at normal temperature,
acquiring a second service life of the glue nail to be tested at a second temperature and a continuous period of the glue nail at the second temperature;
the current service life of the to-be-tested glue nail is the first service life of the to-be-tested glue nail at the first temperature, the third service life of the to-be-tested glue nail at the normal temperature, and the duration time of the to-be-tested glue nail at the second temperature.
The second aspect of the invention provides a monitoring system for the service life of a glue nail, comprising:
the device comprises a building unit, a first correspondence relation, a second correspondence relation and a heat dissipation unit, wherein the first correspondence relation is a correspondence relation between the temperature of radiating fins around a first glue nail and the temperature of a chip corresponding to a radiating fin, the first glue nail is the glue nail with the highest temperature on the radiating fin, the temperature of the glue nail is the temperature of the radiating fin around the glue nail, and the radiating fin at least comprises the first glue nail and a plurality of radiating fins;
The first acquisition unit is used for acquiring the service lives of the glue nails to be tested at different temperatures;
the obtaining and determining unit is used for periodically obtaining the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life of the to-be-detected glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and the alarm unit is used for alarming if the service life of the glue nail to be tested is lower than the preset service life threshold value.
A third aspect of the present invention provides an electronic device, comprising: a memory for storing a computer program; and the processor is used for realizing the steps of the method for monitoring the service life of the rubber nail according to the first aspect of the invention when the computer program is executed.
A fourth aspect of the invention provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the method of monitoring the service life of a glue nail according to the first aspect of the invention.
The technical scheme adopted by the invention comprises the following technical effects:
1. According to the invention, the temperature of the glue nail to be detected is indirectly obtained by establishing the first corresponding relation and utilizing the original temperature sensor in the chip, and the current service life of the glue nail to be detected is periodically and continuously monitored and updated according to the influence of the temperature of the glue nail to be detected on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the efficiency of glue nail service life monitoring is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
2. When the first corresponding relation is established, the glue nail with the highest temperature in one cooling fin is monitored in advance to serve as the first glue nail, and the first corresponding relation is established through the ambient temperature of different servers, the temperature of the cooling fins around the first glue nail under the pressure of an operating system and the temperature of the chip corresponding to the cooling fin, and the first corresponding relation is used as the corresponding basis of the temperature of all glue nails to be detected and the temperature of the chip, so that the risk of breakage in the use process of the glue nail is further reduced.
3. According to the technical scheme, the current service life of the glue nail to be tested is determined according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, and the corresponding relation between the current service life of the glue nail to be tested and the acquired current temperature of the chip is established, so that the current service life of the glue nail to be tested is further quantized, an alarm can be given according to the current service life of the glue nail to be tested, and the breaking risk of the glue nail is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
For a clearer description of embodiments of the invention or of the solutions of the prior art, reference will be made to the accompanying drawings, which are used in the description of the embodiments or of the prior art, and it will be obvious to those skilled in the art that other drawings can be obtained from these without inventive labour.
FIG. 1 is a schematic flow chart of a method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat sink (first pins fixed from top to bottom) according to an embodiment of the present invention;
FIG. 3 is a schematic view of a heat sink (first glue nail from bottom to top) according to an embodiment of the present invention;
FIG. 4 is a block diagram of a tack (vertical) in a method of an embodiment of the invention;
FIG. 5 is a block diagram of a tack (horizontal) in a method of an embodiment of the invention;
FIG. 6 is a schematic flow chart of step S1 in a method according to an embodiment of the present invention;
FIG. 7 is a schematic flow chart of step S3 in a method according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a second system according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of the building unit 101 in the second system according to the embodiment of the present invention;
fig. 10 is a schematic structural diagram of the acquiring and determining unit 103 in the second system according to the embodiment of the present invention;
fig. 11 is a schematic structural diagram of a third device according to an embodiment of the present invention.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below with reference to the following detailed description and the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different structures of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted so as to not unnecessarily obscure the present invention.
Example 1
As shown in fig. 1 to 5, the present invention provides a method for monitoring the service life of a glue nail, comprising:
s1, establishing a first corresponding relation between the temperature of radiating fins around a first glue nail and the temperature of chips corresponding to radiating fins, wherein the first glue nail is the glue nail with the highest temperature on the radiating fins, the temperature of the glue nail is the temperature of the radiating fins around the glue nail, and the radiating fins at least comprise the first glue nail and a plurality of radiating fins;
s2, obtaining service lives of the glue nails to be tested at different temperatures;
s3, periodically acquiring the current temperature of the chip, determining the second temperature of the glue nail to be tested according to the first corresponding relation, and determining the current service life of the glue nail to be tested according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
s4, judging whether the current service life of the glue nail to be tested is lower than a preset service life threshold value, and if so, executing the step S5; if the judgment result is negative, executing the step S3;
s5, alarming.
In step S1, as shown in fig. 6, establishing the first correspondence specifically includes:
S11, acquiring the chip temperature corresponding to the cooling fin under the conditions of different server environment temperatures or operating system pressures;
s12, acquiring the temperatures of the radiating fins in a preset range around the first glue nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures;
s13, establishing a first corresponding relation between the chip temperature corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures and the temperature of the cooling fin in a preset range around the first glue nail corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures through a regression equation.
In step S11, the chip temperatures corresponding to the cooling fins under the conditions of different server environment temperatures or operating system pressures are specifically: and acquiring the chip temperature corresponding to the cooling fin under the conditions of different server environment temperatures or operating system pressures through the temperature sensor of the chip. The specific implementation method can be as follows: under different environmental temperatures, the same pressure is given to the operating system, and the higher the environmental temperature is, the higher the chip temperature is, and the higher the corresponding cooling fin temperature is; or under the same environment temperature, giving different pressures to the operation system, wherein the higher the system pressure is, the higher the chip temperature is, and the higher the corresponding cooling fin temperature is, and acquiring the chip temperature through a temperature sensor carried by the chip; the system pressure may be 10% -100%, and may be adjusted according to actual conditions, or the chip temperature may be obtained under different environmental temperatures and different operating system pressures, so long as the chip temperature is affected differently, and the specific implementation manner is not limited herein.
In step S12, the temperatures of the heat dissipation fins in the preset range around the first glue nail corresponding to the heat dissipation fins under the conditions of different server environment temperatures or operating system pressures are specifically: and arranging a temperature acquisition module on the radiating fins in a preset range around different glue nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first glue nails corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures. The specific implementation method can be as follows: under different environment temperatures, the same pressure is given to an operating system, the higher the environment temperature is, the higher the chip temperature is, the higher the temperature of the radiating fins around the radiating fins is, the corresponding glue nail with the highest temperature of the radiating fins in a preset range around the radiating fins is selected as a first glue nail from different glue nails corresponding to the radiating fins, and the temperature of the radiating fins in the preset range around the first glue nail is used as the temperature of the first glue nail; or under the same environment temperature, giving different pressures to an operating system, wherein the higher the system pressure is, the higher the chip temperature is, the higher the temperature of the radiating fins around the radiating fins is, the corresponding glue nails with the highest temperature of the radiating fins in a preset range around the radiating fins are selected as first glue nails from different glue nails corresponding to the radiating fins, and the temperature of the radiating fins in the preset range around the first glue nails is used as the temperature of the first glue nails; the system pressure may be 10% -100%, and may be adjusted according to actual conditions, or may be obtained under different environmental temperatures and different operating system pressures, where the temperatures of the heat dissipation fins around different glue nails corresponding to the heat dissipation fins are selected from different glue nails corresponding to the heat dissipation fins, the glue nail corresponding to the highest temperature of the heat dissipation fins in a peripheral preset range is selected as the first glue nail, and the temperature of the heat dissipation fins in the peripheral preset range of the first glue nail is selected as the temperature of the first glue nail, so long as the temperature of the chip (the heat dissipation fins in the heat dissipation fins corresponding to the chip) is affected differently, and the specific implementation manner of the invention is not limited herein. The heat sink at least comprises a first glue nail and a plurality of heat sink fins, and can also comprise other glue nails or heat conducting fins, etc., and the invention is not limited herein.
Specifically, the temperature acquisition module may include a thermocouple wire and a temperature recorder, where the thermocouple wire is connected to the heat dissipation fins around the first glue nail corresponding to the heat dissipation fin in a preset range, specifically, the connection mode may be adhesive bonding through adhesive tape or glue, or other connection modes. Specifically, in the present solution, among the heat dissipation fins in the preset range around the first glue nail or the heat dissipation fins in the preset range around other glue nails, the preset range may be the heat dissipation fin nearest to the glue nail, or may be the heat dissipation fin far from the glue nail in the preset distance, and the temperature of the heat dissipation fins around the same glue nail may be negligible even if the temperature is different, so that in order to reduce the error, the average value may be obtained for the temperature of the different heat dissipation fins far from the glue nail in the preset distance, and the average value may be used as the temperature of the heat dissipation fins around the glue nail.
In step S13, the chip temperature and the temperature of the heat dissipation fins around the first glue nail are different under different server environment temperatures or operating system pressures, for example, the chip temperature is high when the server environment temperature is high and/or the operating system pressure is high, the temperature of the heat dissipation fins around the first glue nail is also high, the chip temperature is low when the server environment temperature is low and/or the operating system pressure is low, and the temperature of the heat dissipation fins around the first glue nail is also low. Under different conditions, the chip has different temperatures A1, A2, A3 and …, and also has different temperatures B1, B2 and B3 corresponding to the heat sink around the first glue nail, and in rectangular coordinate system, (A1, B1), (A2, B2), (A3 and B3), each point can be continuous to find a relation between the chip temperature a and the heat sink around the first glue nail.
Specifically, a relation between the chip temperature a and the temperature B of the heat dissipation fins around the first glue nail can be found through an Excel regression mode, if the relation is a linear relation, the relation can be directly fitted through a linear equation, and functions such as regression in Excel can be utilized, for example, b=ka+c, wherein k and c are constants; if the relation is nonlinear, a relation can be found by using an excel regression mode, and nonlinear regression is performed by using excel software (or other data analysis software) so as to obtain a relation between the chip temperature A and the temperature B of the radiating fins around the first adhesive nail.
In step S2, the service lives of the glue nails at different temperatures are obtained, specifically: and acquiring the service life test data of the glue nails (made of the same material) to be tested under different temperature conditions by a glue nail manufacturer.
In step S3, as shown in fig. 7, specifically, the method includes:
s31, periodically acquiring the current temperature of the chip;
s32, determining a second temperature of the glue nail to be tested according to the first corresponding relation,
s33, acquiring a first service life of the glue nail to be tested at a first temperature and a third service life of the glue nail to be tested at normal temperature;
s34, acquiring the second service life of the glue nail to be tested at the second temperature and the duration time of the glue nail to be tested at the second temperature;
And S35, the current service life of the to-be-tested glue nail is the service life of the to-be-tested glue nail at the first temperature, namely the third service life of the to-be-tested glue nail at the normal temperature, or the duration of the to-be-tested glue nail at the second temperature.
In step S31, the current temperature of the chip is periodically obtained, and the period may be 1 hour, 1 minute, or other time.
In step S32, the determining, according to the first correspondence, the second temperature of the glue nail to be tested is specifically: and determining the current temperature of the radiating fins around the glue nail to be detected according to the first corresponding relation of the first glue nail, and setting the current temperature of the radiating fins around the glue nail to be detected as the second temperature of the glue nail to be detected.
In step S33, a first service life of the glue nail to be tested at a first temperature, that is, a first service life of the glue nail to be tested at an initial temperature of a current period (a temperature before the current period starts) is obtained, and when monitoring is just started, the first temperature is normal temperature, that is, in step S33, the first service life is the same as the third service life, the normal temperature is generally 25 ℃, and the corresponding third service life at the normal temperature is the longest service life of the glue nail to be tested.
In step S34, a second temperature of the glue nail to be tested is determined according to the current temperature of the ground chip obtained periodically, and a second service life of the glue nail to be tested at the second temperature and a duration time of the glue nail to be tested at the second temperature are obtained.
In step S35, the current service life of the to-be-tested glue nail is the service life of the to-be-tested glue nail at the first temperature-the service life of the to-be-tested glue nail at the first temperature/the service life of the to-be-tested glue nail at the second temperature. To more clearly illustrate the calculation of the current service life of the glue nail, it is specifically illustrated that: for example, the life of the glue nail to be tested is 10000 hours (also can be converted into minutes or other time units) at 50 ℃, the life of the glue nail to be tested is 12000 hours (also can be converted into minutes or other time units) at 40 ℃, the life of the glue nail to be tested is 24000 hours (also can be converted into minutes or other time units) at normal temperature, if the glue nail to be tested is monitored to last for one hour at 50 ℃ (can be one monitoring time period or can be the sum of a plurality of monitoring time periods),specific values are 23997.6, i.e. deducting the life value of 2.4 hours; the next monitoring period monitors that the glue nail to be tested lasts for one hour at 40 ℃ (one monitoring time period can be one or the sum of a plurality of monitoring time periods), and the glue nail to be tested is- > A specific value is 23995.6, i.e. the life value is subtracted again for 2 hours, and so on, periodic cycle monitoring is performed. The first temperature is the initial temperature of the current period, and the second temperature is the current temperature.
In the steps S4-S5, if the current service life of the glue nail to be tested is judged to be lower than the preset service life threshold value, an alarm is given. The preset service life threshold value can be adjusted according to actual conditions, if the risk requirement is high, the preset service life threshold value can be properly increased, and if the risk requirement is low (not easy to replace), the preset service life threshold value can be properly reduced, and the invention is not limited herein.
In the embodiment of the invention, because the temperature of the first glue nail and the temperature of the glue nail to be detected are inconvenient to directly obtain, the temperature of the first glue nail is set as the temperature of the radiating fins around the first glue nail, namely the first glue nail is used as the reference glue nail, the first corresponding relation established according to the temperature of the radiating fins around the first glue nail is applied to all actual glue nails to be detected, namely the temperature of the radiating fins around the glue nail to be detected, namely the temperature of the glue nail to be detected, the temperature of the glue nail to be detected in the radiating fins corresponding to the chip can be determined according to the temperature of the chip which is periodically monitored through the first corresponding relation established in advance, so that the hardware such as a large number of temperature sensors or temperature recorders is needed when the service life of the existing glue nail is monitored, and the hardware cost is reduced.
It should be noted that, in the present invention, the periodic monitoring of the temperature of the chip may be a BMC (Baseboard Management Controller ), or other types of chips, and the alarm may be that the BMC sends alarm information to the manager to realize the alarm, or may be that the alarm is performed by an indicator lamp or a buzzer, which is not limited herein.
It should be noted that, in the technical solution of the present invention, steps S1 to S5 may all be implemented by hardware or software language programming, and the concept of programming corresponds to the specific steps in the embodiment, and may also be implemented by other modes, which is not limited herein.
According to the invention, the temperature of the glue nail to be detected is indirectly obtained by establishing the first corresponding relation and utilizing the original temperature sensor in the chip, and the current service life of the glue nail to be detected is periodically monitored and updated according to the influence of the temperature of the glue nail to be detected on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the efficiency of glue nail service life monitoring is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one cooling fin is monitored in advance to serve as the first glue nail, and the first corresponding relation is established through the ambient temperature of different servers, the temperature of the cooling fins around the first glue nail under the pressure of an operating system and the temperature of the chip corresponding to the cooling fin, and the first corresponding relation is used as the corresponding basis of the temperature of all glue nails to be detected and the temperature of the chip, so that the risk of breakage in the use process of the glue nail is further reduced.
According to the technical scheme, the current service life of the glue nail to be tested is determined according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, and the corresponding relation between the current service life of the glue nail to be tested and the acquired current temperature of the chip is established, so that the current service life of the glue nail to be tested is further quantized, an alarm can be given according to the current service life of the glue nail to be tested, and the breaking risk of the glue nail is reduced.
Example two
As shown in fig. 8, the technical scheme of the present invention further provides a monitoring system for service life of a glue nail, including:
the method comprises the steps of establishing a unit 101, wherein a first corresponding relation is established between the temperature of radiating fins around a first glue nail and the temperature of a chip corresponding to a radiating fin, the first glue nail is the glue nail with the highest temperature on the radiating fin, the glue nail temperature is the temperature of the radiating fins around the glue nail, and the radiating fin at least comprises the first glue nail and a plurality of radiating fins;
The first acquisition unit 102 acquires the service lives of the glue nails to be tested at different temperatures;
the acquiring and determining unit 103 periodically acquires the current temperature of the chip, determines the second temperature of the to-be-tested glue nail according to the first corresponding relation, and determines the current service life of the to-be-tested glue nail according to the first service life of the to-be-tested glue nail corresponding to the first temperature and the second service life of the to-be-tested glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and the alarm unit 104 alarms if the current service life of the glue nail to be tested is lower than the preset service life threshold value.
As shown in fig. 9, the establishing unit 101 specifically includes:
a first obtaining subunit 1011, obtaining chip temperatures corresponding to the cooling fins under different server environment temperatures or operating system pressures;
a second obtaining subunit 1012, configured to obtain temperatures of the heat dissipation fins in a preset range around the first glue corresponding to the heat dissipation fins under different server environment temperatures or operating system pressures;
and establishing a subunit 1013, namely establishing a first corresponding relation by using a regression equation between the chip temperature corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures and the temperature of the cooling fin in a preset range around the first glue nail corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures.
In the first obtaining subunit 1011, the temperatures of the chips corresponding to the cooling fins under the conditions of obtaining the environmental temperatures or the operating system pressures of different servers are specifically: and acquiring the chip temperature corresponding to the cooling fin under the conditions of different server environment temperatures or operating system pressures through the temperature sensor of the chip. The specific implementation method can be as follows: under different environmental temperatures, the same pressure is given to the operating system, and the higher the environmental temperature is, the higher the chip temperature is, and the higher the corresponding cooling fin temperature is; or under the same environment temperature, giving different pressures to the operation system, wherein the higher the system pressure is, the higher the chip temperature is, and the higher the corresponding cooling fin temperature is, and acquiring the chip temperature through a temperature sensor carried by the chip; the system pressure may be 10% -100%, and may be adjusted according to actual conditions, or the chip temperature may be obtained under different environmental temperatures and different operating system pressures, so long as the chip temperature is affected differently, and the specific implementation manner is not limited herein.
In the second obtaining subunit 1012, the temperatures of the heat dissipation fins in the preset range around the first glue nail corresponding to the heat dissipation fins under the conditions of different server environment temperatures or operating system pressures are specifically: and arranging a temperature acquisition module on the radiating fins in a preset range around different glue nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first glue nails corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures. The specific implementation method can be as follows: under different environment temperatures, the same pressure is given to an operating system, the higher the environment temperature is, the higher the chip temperature is, the higher the temperature of the radiating fins around the radiating fins is, the corresponding glue nail with the highest temperature of the radiating fins in a preset range around the radiating fins is selected as a first glue nail from different glue nails corresponding to the radiating fins, and the temperature of the radiating fins in the preset range around the first glue nail is used as the temperature of the first glue nail; or under the same environment temperature, giving different pressures to an operating system, wherein the higher the system pressure is, the higher the chip temperature is, the higher the temperature of the radiating fins around the radiating fins is, the corresponding glue nails with the highest temperature of the radiating fins in a preset range around the radiating fins are selected as first glue nails from different glue nails corresponding to the radiating fins, and the temperature of the radiating fins in the preset range around the first glue nails is used as the temperature of the first glue nails; the system pressure may be 10% -100%, and may be adjusted according to actual conditions, or may be obtained under different environmental temperatures and different operating system pressures, where the temperatures of the heat dissipation fins around different glue nails corresponding to the heat dissipation fins are selected from different glue nails corresponding to the heat dissipation fins, the glue nail corresponding to the highest temperature of the heat dissipation fins in a peripheral preset range is selected as the first glue nail, and the temperature of the heat dissipation fins in the peripheral preset range of the first glue nail is selected as the temperature of the first glue nail, so long as the temperature of the chip (the heat dissipation fins in the heat dissipation fins corresponding to the chip) is affected differently, and the specific implementation manner of the invention is not limited herein. The heat sink at least comprises a first glue nail and a plurality of heat sink fins, and can also comprise other glue nails or heat conducting fins, etc., and the invention is not limited herein.
Specifically, the temperature acquisition module may include a thermocouple wire and a temperature recorder, where the thermocouple wire is connected to the heat dissipation fins around the first glue nail corresponding to the heat dissipation fin in a preset range, specifically, the connection mode may be adhesive bonding through adhesive tape or glue, or other connection modes. Specifically, in the present solution, among the heat dissipation fins in the preset range around the first glue nail or the heat dissipation fins in the preset range around other glue nails, the preset range may be the heat dissipation fin nearest to the glue nail, or may be the heat dissipation fin far from the glue nail in the preset distance, and the temperature of the heat dissipation fins around the same glue nail may be negligible even if the temperature is different, so that in order to reduce the error, the average value may be obtained for the temperature of the different heat dissipation fins far from the glue nail in the preset distance, and the average value may be used as the temperature of the heat dissipation fins around the glue nail.
In the building subunit 1013, the chip temperature and the temperature of the heat dissipation fins around the first glue nail are different under different server environment temperatures or operating system pressures, for example, the chip temperature is high when the server environment temperature is high and/or the operating system pressure is high, the temperature of the heat dissipation fins around the first glue nail is also high, the chip temperature is low when the server environment temperature is low and/or the operating system pressure is low, and the temperature of the heat dissipation fins around the first glue nail is also low. Under different conditions, the chip has different temperatures A1, A2, A3 and …, and also has different temperatures B1, B2 and B3 corresponding to the heat sink around the first glue nail, and in rectangular coordinate system, (A1, B1), (A2, B2), (A3 and B3), each point can be continuous to find a relation between the chip temperature a and the heat sink around the first glue nail.
Specifically, a relation between the chip temperature a and the temperature B of the heat dissipation fins around the first glue nail can be found through an Excel regression mode, if the relation is a linear relation, the relation can be directly fitted through a linear equation, and functions such as regression in Excel can be utilized, for example, b=ka+c, wherein k and c are constants; if the relation is nonlinear, a relation can be found by using an excel regression mode, and nonlinear regression is performed by using excel software (or other data analysis software) so as to obtain a relation between the chip temperature A and the temperature B of the radiating fins around the first adhesive nail.
In the first obtaining unit 102, the service lives of the glue nails to be tested at different temperatures are obtained, specifically: and acquiring the service life test data of the glue nails (made of the same material) to be tested under different temperature conditions by a glue nail manufacturer.
As shown in fig. 10, the acquiring and determining unit 103 specifically includes:
a third acquiring subunit 1031 periodically acquires the current temperature of the chip;
a first determining subunit 1032 for determining a second temperature of the glue nail to be tested according to the first corresponding relation;
a fourth obtaining subunit 1033 for obtaining a first service life of the glue nail to be tested at the first temperature and a third service life at the normal temperature,
A fifth obtaining subunit 1034 for obtaining a second service life of the glue nail to be tested at the second temperature and a duration time at the second temperature;
the second determining subunit 1035, where the current service life of the to-be-measured glue nail is the first service life of the to-be-measured glue nail at the first temperature, the third service life of the to-be-measured glue nail at the normal temperature, and the second service life of the to-be-measured glue nail at the second temperature.
In the third acquiring subunit 1031, the period may be 1 hour, 1 minute, or other time in periodically acquiring the current temperature of the chip, which is not limited herein.
In the first determining subunit 1032, determining the second temperature of the glue nail to be tested according to the first correspondence is specifically: and determining the current temperature of the radiating fins around the glue nail to be detected according to the first corresponding relation of the first glue nail, and setting the current temperature of the radiating fins around the glue nail to be detected as the second temperature of the glue nail to be detected.
In the fourth obtaining subunit 1033, a first service life of the glue nail to be tested at a first temperature is obtained, that is, the first service life of the glue nail to be tested at an initial temperature of a current period (a temperature before the current period starts), and when monitoring is started, the first temperature is normal temperature, that is, in the fourth obtaining subunit 1033, the first service life is the same as the third service life, the normal temperature is generally 25 ℃, and the corresponding third service life is the longest service life of the glue nail to be tested.
In the fifth acquiring subunit 1034, a second temperature of the glue nail to be measured is determined according to the current temperature of the ground chip acquired periodically, and a second service life of the glue nail to be measured at the second temperature and a duration time at the second temperature are acquired.
In the second determining subunit 1035, the current service life of the glue nail to be tested is the service life of the glue nail to be tested at the first temperature, and the service life of the glue nail to be tested at the second temperature. To more clearly illustrate the calculation of the current service life of the glue nail, it is specifically illustrated that: for example, the life of the glue nail to be tested is 10000 hours (also can be converted into minutes or other time units) at 50 ℃, the life of the glue nail to be tested is 12000 hours (also can be converted into minutes or other time units) at 40 ℃, the life of the glue nail to be tested is 24000 hours (also can be converted into minutes or other time units) at normal temperature, if the glue nail to be tested is monitored to last for one hour at 50 ℃ (can be one monitoring time period or can be the sum of a plurality of monitoring time periods),specific values are 23997.6, i.e. deducting the life value of 2.4 hours; the next monitoring period monitors that the glue nail to be tested lasts for one hour at 40 ℃ (one monitoring time period can be used or the sum of a plurality of monitoring time periods can be used), A specific value is 23995.6, i.e. the life value is subtracted again for 2 hours, and so on, periodic cycle monitoring is performed. The first temperature is the initial temperature of the current period, and the second temperature is the current temperature.
In the alarm unit 104, it is determined that if the current service life of the glue nail to be tested is lower than the preset service life threshold value, an alarm is given. The preset service life threshold value can be adjusted according to actual conditions, if the risk requirement is high, the preset service life threshold value can be properly increased, and if the risk requirement is low (not easy to replace), the preset service life threshold value can be properly reduced, and the invention is not limited herein.
In the embodiment of the invention, because the temperature of the first glue nail and the temperature of the glue nail to be detected are inconvenient to directly obtain, the temperature of the first glue nail is set as the temperature of the radiating fins around the first glue nail, namely the first glue nail is used as the reference glue nail, the first corresponding relation established according to the temperature of the radiating fins around the first glue nail is applied to all actual glue nails to be detected, namely the temperature of the radiating fins around the glue nail to be detected, namely the temperature of the glue nail to be detected, the temperature of the glue nail to be detected in the radiating fins corresponding to the chip can be determined according to the temperature of the chip which is periodically monitored through the first corresponding relation established in advance, so that the hardware such as a large number of temperature sensors or temperature recorders is needed when the service life of the existing glue nail is monitored, and the hardware cost is reduced.
According to the invention, the temperature of the glue nail to be detected is indirectly obtained by establishing the first corresponding relation and utilizing the original temperature sensor in the chip, and the current service life of the glue nail to be detected is periodically monitored and updated according to the influence of the temperature of the glue nail to be detected on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the efficiency of glue nail service life monitoring is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one cooling fin is monitored in advance to serve as the first glue nail, and the first corresponding relation is established through the ambient temperature of different servers, the temperature of the cooling fins around the first glue nail under the pressure of an operating system and the temperature of the chip corresponding to the cooling fin, and the first corresponding relation is used as the corresponding basis of the temperature of all glue nails to be detected and the temperature of the chip, so that the risk of breakage in the use process of the glue nail is further reduced.
According to the technical scheme, the current service life of the glue nail to be tested is determined according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, and the corresponding relation between the current service life of the glue nail to be tested and the acquired current temperature of the chip is established, so that the current service life of the glue nail to be tested is further quantized, an alarm can be given according to the current service life of the glue nail to be tested, and the breaking risk of the glue nail is reduced.
Example III
As shown in fig. 11, the technical solution of the present invention further provides an electronic device, including: a memory 201 for storing a computer program; a processor 202 for implementing the steps of the method for monitoring the service life of the glue pin according to the first embodiment when executing the computer program.
The memory 201 in the embodiments of the present application is used to store various types of data to support the operation of the electronic device. Examples of such data include: any computer program for operating on an electronic device. It will be appreciated that memory 201 may be volatile memory or nonvolatile memory, and may include both volatile and nonvolatile memory. Wherein the nonvolatile Memory may be Read Only Memory (ROM), programmable Read Only Memory (PROM, programmable Read-Only Memory), erasable programmable Read Only Memory (EPROM, erasable Programmable Read-Only Memory), electrically erasable programmable Read Only Memory (EEPROM, electrically Erasable Programmable Read-Only Memory), magnetic random access Memory (FRAM, ferromagnetic random access Memory), flash Memory (Flash Memory), magnetic surface Memory, optical disk, or compact disk Read Only Memory (CD-ROM, compact Disc Read-Only Memory); the magnetic surface memory may be a disk memory or a tape memory. The volatile memory may be a random access memory (RAM, randomAccessMemory) that acts as an external cache. By way of example, and not limitation, many forms of RAM are available, such as static random access memory (SRAM, static RandomAccess Memory), synchronous static random access memory (SSRAM, synchronous Static Random Access Memory), dynamic random access memory (DRAM, dynamic RandomAccess Memory), synchronous dynamic random access memory (SDRAM, synchronousDynamic RandomAccess Memory), double data rate synchronous dynamic random access memory (ddr sdram, double Data Rate Synchronous Dynamic Random Access Memory), enhanced synchronous dynamic random access memory (ESDRAM, enhanced Synchronous Dynamic Random Access Memory), synchronous link dynamic random access memory (SLDRAM, syncLink Dynamic Random Access Memory), direct memory bus random access memory (DRRAM, direct Rambus RandomAccess Memory). The memory 201 described in the embodiments of the present application is intended to comprise, without being limited to, these and any other suitable types of memory. The methods disclosed in the embodiments of the present application may be applied to the processor 202 or implemented by the processor 202. The processor 202 may be an integrated circuit chip with signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuitry in hardware in the processor 202 or by instructions in software. The processor 202 may be a general purpose processor, a DSP (Digital Signal Processing, meaning a chip capable of implementing digital signal processing techniques), or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. Processor 202 may implement or perform the methods, steps, and logic blocks disclosed in embodiments of the present application. The general purpose processor may be a microprocessor or any conventional processor or the like. The steps of the method disclosed in the embodiments of the present application may be directly embodied in a hardware decoding processor or implemented by a combination of hardware and software modules in the decoding processor. The software modules may be located in a storage medium in the memory 201 and the processor 202 reads the program in the memory 201 to perform the steps of the method described above in connection with its hardware. The processor 202 implements corresponding flows in the methods of the embodiments of the present application when executing the program, and for brevity, will not be described in detail herein.
According to the invention, the temperature of the glue nail to be detected is indirectly obtained by establishing the first corresponding relation and utilizing the original temperature sensor in the chip, and the current service life of the glue nail to be detected is periodically monitored and updated according to the influence of the temperature of the glue nail to be detected on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the efficiency of glue nail service life monitoring is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one cooling fin is monitored in advance to serve as the first glue nail, and the first corresponding relation is established through the ambient temperature of different servers, the temperature of the cooling fins around the first glue nail under the pressure of an operating system and the temperature of the chip corresponding to the cooling fin, and the first corresponding relation is used as the corresponding basis of the temperature of all glue nails to be detected and the temperature of the chip, so that the risk of breakage in the use process of the glue nail is further reduced.
According to the technical scheme, the current service life of the glue nail to be tested is determined according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, and the corresponding relation between the current service life of the glue nail to be tested and the acquired current temperature of the chip is established, so that the current service life of the glue nail to be tested is further quantized, an alarm can be given according to the current service life of the glue nail to be tested, and the breaking risk of the glue nail is reduced.
Example IV
The technical scheme of the invention also provides a computer readable storage medium, wherein the computer readable storage medium is stored with a computer program, and the computer program realizes the steps of the method for monitoring the service life of the glue nail according to the first embodiment when being executed by a processor.
For example comprising a memory 201 storing a computer program executable by a processor 202 to perform the steps of the method described above. The computer readable storage medium may be FRAM, ROM, PROM, EPROM, EEPROM, flash Memory, magnetic surface Memory, optical disk, or CD-ROM.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware associated with program instructions, where the foregoing program may be stored in a computer readable storage medium, and when executed, the program performs steps including the above method embodiments; and the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code. Alternatively, the integrated units described above may be stored in a computer readable storage medium if implemented in the form of software functional modules and sold or used as a stand-alone product. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially or partly contributing to the prior art, and the computer software product may be stored in a storage medium, and include several instructions to cause an electronic device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code.
According to the invention, the temperature of the glue nail to be detected is indirectly obtained by establishing the first corresponding relation and utilizing the original temperature sensor in the chip, and the current service life of the glue nail to be detected is periodically monitored and updated according to the influence of the temperature of the glue nail to be detected on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the efficiency of glue nail service life monitoring is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the glue nail is avoided, and the hardware cost of monitoring is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one cooling fin is monitored in advance to serve as the first glue nail, and the first corresponding relation is established through the ambient temperature of different servers, the temperature of the cooling fins around the first glue nail under the pressure of an operating system and the temperature of the chip corresponding to the cooling fin, and the first corresponding relation is used as the corresponding basis of the temperature of all glue nails to be detected and the temperature of the chip, so that the risk of breakage in the use process of the glue nail is further reduced.
According to the technical scheme, the current service life of the glue nail to be tested is determined according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature, and the corresponding relation between the current service life of the glue nail to be tested and the acquired current temperature of the chip is established, so that the current service life of the glue nail to be tested is further quantized, an alarm can be given according to the current service life of the glue nail to be tested, and the breaking risk of the glue nail is reduced.
While the foregoing description of the embodiments of the present invention has been presented in conjunction with the drawings, it should be understood that it is not intended to limit the scope of the invention, but rather, it is intended to cover all modifications or variations within the scope of the invention as defined by the claims of the present invention.
Claims (8)
1. The method for monitoring the service life of the glue nail is characterized by comprising the following steps of:
establishing a first corresponding relation between the temperature of the radiating fins around the first glue nail and the temperature of the chip corresponding to the radiating fins, wherein the first glue nail is the glue nail with the highest temperature on the radiating fins, the temperature of the glue nail is the temperature of the radiating fins around the glue nail, and the radiating fins at least comprise the first glue nail and a plurality of radiating fins;
acquiring service lives of the glue nails to be tested at different temperatures;
periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-tested glue nail according to the first corresponding relation, and determining the current service life of the to-be-tested glue nail according to the first service life of the to-be-tested glue nail corresponding to the first temperature and the second service life of the to-be-tested glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period; wherein, according to the first life that the gluey nail that awaits measuring corresponds at first temperature and the second life that the second temperature corresponds, confirm that the gluey nail that awaits measuring current life specifically is:
Acquiring a first service life of a glue nail to be tested at a first temperature and a third service life of the glue nail to be tested at normal temperature;
acquiring the second service life of the glue nail to be tested at the second temperature and the duration time of the glue nail to be tested at the second temperature;
the current service life of the to-be-tested glue nail is the first service life of the to-be-tested glue nail at the first temperature, the third service life of the to-be-tested glue nail at the normal temperature, and the duration time of the to-be-tested glue nail at the second temperature;
and if the service life of the to-be-tested glue nail is lower than the preset service life threshold value, alarming.
2. The method for monitoring the service life of a rubber nail according to claim 1, wherein the establishing of the first correspondence is specifically:
acquiring the chip temperatures corresponding to the cooling fins under the conditions of different server environment temperatures or operating system pressures;
acquiring the temperatures of the radiating fins in a preset range around the first glue nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures;
and establishing a first corresponding relation between the chip temperature corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures and the temperature of the cooling fin in a preset range around the first glue nail corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures through a regression equation.
3. The method for monitoring the service life of the adhesive nail according to claim 2, wherein the obtaining of the temperature of the chip corresponding to the cooling fin under the condition of different server environment temperatures or operating system pressures is specifically: and acquiring the temperatures of the chips corresponding to the cooling fins under the conditions of different server environment temperatures or operating system pressures through the temperature sensors of the chips.
4. The method for monitoring the service life of a glue nail according to claim 2, wherein the temperature of the heat dissipation fins in the preset range around the first glue nail corresponding to the heat dissipation fins under the conditions of different server environment temperatures or operating system pressures is specifically: and arranging a temperature acquisition module on the radiating fins in a preset range around different glue nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first glue nails corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures.
5. The method for monitoring the service life of a glue nail according to claim 4, wherein the temperature acquisition module comprises a thermocouple wire and a temperature recorder, the thermocouple wire is connected with the heat radiation fins in a preset range around the first glue nail corresponding to the heat radiation fins, and the input end of the temperature recorder is connected with the output end of the thermocouple wire.
6. A monitoring system for service life of a rubber nail is characterized by comprising:
the device comprises a building unit, a first correspondence relation, a second correspondence relation and a heat dissipation unit, wherein the first correspondence relation is a correspondence relation between the temperature of radiating fins around a first glue nail and the temperature of a chip corresponding to a radiating fin, the first glue nail is the glue nail with the highest temperature on the radiating fin, the temperature of the glue nail is the temperature of the radiating fins around the glue nail, and the radiating fin at least comprises the first glue nail and a plurality of radiating fins;
the first acquisition unit is used for acquiring the service lives of the glue nails to be tested at different temperatures;
the obtaining and determining unit is used for periodically obtaining the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life of the to-be-detected glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period; wherein, according to the first life that the gluey nail that awaits measuring corresponds at first temperature and the second life that the second temperature corresponds, confirm that the gluey nail that awaits measuring current life specifically is:
acquiring a first service life of a glue nail to be tested at a first temperature and a third service life of the glue nail to be tested at normal temperature;
Acquiring the second service life of the glue nail to be tested at the second temperature and the duration time of the glue nail to be tested at the second temperature;
the current service life of the to-be-tested glue nail is the first service life of the to-be-tested glue nail at the first temperature, the third service life of the to-be-tested glue nail at the normal temperature, and the duration time of the to-be-tested glue nail at the second temperature;
and the alarm unit is used for alarming if the service life of the glue nail to be tested is lower than the preset service life threshold value.
7. An electronic device, comprising: a memory for storing a computer program; a processor for implementing the steps of the method for monitoring the service life of a glue pin according to any one of claims 1 to 5 when executing said computer program.
8. A computer readable storage medium, characterized in that it has stored thereon a computer program which, when executed by a processor, implements the steps of the method for monitoring the service life of a glue as claimed in any one of claims 1 to 5.
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| CN110427083A (en) * | 2019-06-28 | 2019-11-08 | 联想(北京)有限公司 | A kind of control method, device and storage medium |
| CN111060835A (en) * | 2019-12-31 | 2020-04-24 | 湖州师范学院 | Method and system for predicting remaining life of lithium battery and readable storage medium |
| CN111258856A (en) * | 2020-02-16 | 2020-06-09 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for monitoring running state of solid state disk |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110427083A (en) * | 2019-06-28 | 2019-11-08 | 联想(北京)有限公司 | A kind of control method, device and storage medium |
| CN111060835A (en) * | 2019-12-31 | 2020-04-24 | 湖州师范学院 | Method and system for predicting remaining life of lithium battery and readable storage medium |
| CN111258856A (en) * | 2020-02-16 | 2020-06-09 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for monitoring running state of solid state disk |
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