CN113468018A - Method, system, equipment and medium for monitoring service life of rubber nail - Google Patents
Method, system, equipment and medium for monitoring service life of rubber nail Download PDFInfo
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- CN113468018A CN113468018A CN202110679853.2A CN202110679853A CN113468018A CN 113468018 A CN113468018 A CN 113468018A CN 202110679853 A CN202110679853 A CN 202110679853A CN 113468018 A CN113468018 A CN 113468018A
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 49
- 239000003292 glue Substances 0.000 claims abstract description 286
- 230000017525 heat dissipation Effects 0.000 claims description 104
- 238000004590 computer program Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 5
- 230000007613 environmental effect Effects 0.000 description 20
- 238000010586 diagram Methods 0.000 description 9
- 230000001360 synchronised effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012417 linear regression Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3037—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/32—Monitoring with visual or acoustical indication of the functioning of the machine
- G06F11/324—Display of status information
- G06F11/327—Alarm or error message display
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention provides a method for monitoring the service life of a rubber nail, which comprises the following steps: establishing a first corresponding relation, wherein the first corresponding relation is the corresponding relation between the temperature of the radiating fins around the first rubber nails and the temperature of the chip corresponding to the radiating fins; periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life of the to-be-detected glue nail corresponding to the second temperature; if the current service life of the rubber nail to be detected is lower than the preset service life threshold value, an alarm is given, the invention also provides a monitoring system, equipment and medium for the service life of the rubber nail, so that the efficiency of monitoring the service life of the rubber nail is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by monitoring the rubber nail is avoided, and the hardware cost of monitoring is reduced.
Description
Technical Field
The invention relates to the field of computer chips, in particular to a method, a system, equipment and a medium for monitoring the service life of a rubber nail.
Background
A chip in a general computer or server uses a heat sink to assist heat dissipation, and the heat sink generally includes a plurality of heat dissipation fins, a glue nail (pushpin), and a heat conduction plate, and the glue nail is used to fix the plurality of heat dissipation fins and the heat conduction plate (heat conduction plate).
The material of rubber nail often can use the nylon to make, and this kind of material can lead to fatigue strength to reduce because the tensile stress concentration of spring can lead to under the state of high temperature for a long time easily for a long time, uses for a long time and causes the cracked risk of rubber nail, leads to the chip loss, pops out to go the spring electrically conductive machine short circuit damage that causes, causes serious loss.
One of the existing rubber nail service life monitoring is manual monitoring, and if the service time of the rubber nail reaches a certain range, the rubber nail is replaced, however, the method lacks a uniform judgment standard, and the influence of different temperatures on the service life in the use process of the rubber nail is easy to ignore, so that the reliability and the efficiency of the rubber nail service life monitoring are low; the other mode is that the service life of the rubber nails is judged by monitoring the temperature of the rubber nails, but the monitoring of the temperature of the rubber nails is not suitable for large-scale monitoring, so that the monitoring hardware cost is high, and the monitoring efficiency is not high.
Disclosure of Invention
The invention aims to solve the problems in the prior art, innovatively provides a method, a system, equipment and a medium for monitoring the service life of a rubber nail, effectively solves the problems of low monitoring efficiency and high cost caused by the existing rubber nail service life monitoring, effectively improves the efficiency of rubber nail service life monitoring, and reduces the hardware cost of monitoring.
The invention provides a method for monitoring the service life of a rubber nail in a first aspect, which comprises the following steps:
establishing a first corresponding relation, wherein the first corresponding relation is a corresponding relation between the temperature of the heat dissipation fins around the first glue nail and the temperature of the chip corresponding to the heat dissipation fin, the first glue nail is the glue nail with the highest temperature on the heat dissipation fin, the glue nail temperature is the temperature of the heat dissipation fins around the glue nail, and the heat dissipation fin at least comprises the first glue nail and a plurality of heat dissipation fins;
obtaining the service life of the rubber nail to be tested at different temperatures;
periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life corresponding to the second temperature, wherein the first temperature is normal temperature;
and if the current service life of the rubber nail is lower than a preset service life threshold value, alarming.
Optionally, the establishing of the first corresponding relationship specifically includes:
acquiring the temperature of a chip corresponding to a cooling fin under the conditions of different server environment temperatures or operating system pressures;
acquiring the temperature of the radiating fins in a preset range around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures;
and establishing a first corresponding relation between the temperature of the chip corresponding to the radiating fin under the conditions of different server environment temperatures or operating system pressures and the temperature of the radiating fin in a preset range around the first rubber nail corresponding to the radiating fin under the conditions of different server environment temperatures or operating system pressures through a regression equation.
Further, the obtaining of the temperature of the chip corresponding to the heat sink under the conditions of different server environment temperatures or operating system pressures is specifically: the temperature of the chip corresponding to the cooling fin under the conditions of different server environment temperatures or operating system pressures is obtained through the temperature sensor of the chip.
Optionally, the obtaining of the temperature of the heat dissipation fins within the preset range around the first glue nail corresponding to the heat dissipation fins under the conditions of different server environmental temperatures or operating system pressures specifically includes: and arranging a temperature acquisition module on the radiating fins in a preset range around different rubber nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures.
Furthermore, the temperature acquisition module includes thermocouple wire and temperature recorder, and the thermocouple wire is connected with the radiating fin in the preset range around the first glue nail that the fin corresponds, and the input of temperature recorder is connected with the output of thermocouple wire.
Optionally, according to the first service life that the to-be-tested glue nail corresponds at the first temperature and the second service life that the second temperature corresponds, it specifically is to determine the current service life of the to-be-tested glue nail:
obtaining a first service life of the to-be-tested glue nail at a first temperature and a third service life of the to-be-tested glue nail at normal temperature,
acquiring a second service life of the to-be-tested glue nail at a second temperature and a duration period of the to-be-tested glue nail at the second temperature;
the current service life of the to-be-tested glue nail is the first service life of the to-be-tested glue nail at the first temperature, namely the third service life of the to-be-tested glue nail at normal temperature, or the second service life of the to-be-tested glue nail at the second temperature, namely the duration cycle time of the to-be-tested glue nail at the second temperature.
The invention provides a system for monitoring the service life of a rubber nail, which comprises:
the device comprises an establishing unit and a radiating unit, wherein the establishing unit is used for establishing a first corresponding relation, the first corresponding relation is the corresponding relation between the temperature of radiating fins around a first rubber nail and the temperature of a chip corresponding to a radiating fin, the first rubber nail is the rubber nail with the highest temperature on the radiating fin, the temperature of the rubber nail is the temperature of the radiating fin around the rubber nail, and the radiating fin at least comprises the first rubber nail and a plurality of radiating fins;
the first acquisition unit is used for acquiring the service life of the to-be-detected glue nail at different temperatures;
the acquisition and determination unit is used for periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and the alarm unit is used for alarming if the current service life of the rubber nail to be detected is lower than a preset service life threshold value.
A third aspect of the present invention provides an electronic device comprising: a memory for storing a computer program; a processor for implementing the steps of the method for monitoring the service life of the glue nail according to the first aspect of the present invention when the computer program is executed.
A fourth aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements the steps of the method for monitoring the service life of a glue nail according to the first aspect of the present invention.
The technical scheme adopted by the invention comprises the following technical effects:
1. according to the invention, the first corresponding relation is established, the temperature of the to-be-detected glue nail is indirectly obtained by utilizing the original temperature sensor in the chip, and the current service life of the to-be-detected glue nail is periodically and continuously monitored and updated according to the influence of the temperature of the to-be-detected glue nail on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by the glue nail monitoring is avoided, and the monitoring hardware cost is reduced.
2. When the first corresponding relation is established, the glue nail with the highest temperature in one radiating fin is monitored in advance to serve as the first glue nail, the first corresponding relation is established through the ambient temperature of different servers, the temperature of radiating fins around the first glue nail under the pressure of an operating system and the temperature of a chip corresponding to the radiating fin, the first corresponding relation serves as the corresponding basis of the temperature of all the glue nails to be detected and the temperature of the chip, and the risk of breakage of the glue nails in the using process is further reduced.
3. According to the technical scheme, the current service life of the to-be-tested glue nail is determined according to the first service life corresponding to the first temperature and the second service life corresponding to the second temperature of the to-be-tested glue nail, and the corresponding relation between the current service life of the to-be-tested glue nail and the acquired current temperature of the chip is established, so that the current service life of the to-be-tested glue nail is further quantized, an alarm can be given according to the current service life of the to-be-tested glue nail, and the risk of breakage of the glue nail is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without any creative effort.
FIG. 1 is a schematic flow diagram of a process according to an embodiment of the present invention;
FIG. 2 is a diagram illustrating a heat sink (with a first glue pin secured from top to bottom) according to one embodiment of the present invention;
FIG. 3 is a diagram illustrating a heat sink (with a first glue nail fixed from bottom to top) according to a method of an embodiment of the present invention;
FIG. 4 is a block diagram of a glue nail (in a vertical position) in a method according to an embodiment of the present invention;
FIG. 5 is a block diagram of a glue nail (horizontal) in a method according to an embodiment of the present invention;
fig. 6 is a schematic flow chart illustrating step S1 in a method according to an embodiment of the present invention;
fig. 7 is a schematic flow chart illustrating step S3 in a method according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a second system according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of the establishing unit 101 in the second system according to the embodiment of the present invention;
fig. 10 is a schematic structural diagram of the acquisition and determination unit 103 in the second system according to the embodiment of the present invention;
fig. 11 is a schematic structural diagram of a third apparatus according to an embodiment of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
Example one
As shown in fig. 1 to 5, the present invention provides a method for monitoring the service life of a rubber nail, comprising:
s1, establishing a first correspondence relationship, where the first correspondence relationship is a correspondence relationship between temperatures of the heat dissipation fins around the first glue nail and temperatures of the chip corresponding to the heat dissipation plate, and the first glue nail is a glue nail with a highest temperature on the heat dissipation plate, where the glue nail temperature is the temperature of the heat dissipation fins around the glue nail, and the heat dissipation plate at least includes the first glue nail and a plurality of heat dissipation fins;
s2, obtaining the service life of the rubber nail to be tested at different temperatures;
s3, periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life of the to-be-detected glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
s4, judging whether the current service life of the to-be-detected glue nail is lower than a preset service life threshold value, if so, executing a step S5; if the judgment result is no, executing step S3;
and S5, alarming.
In step S1, as shown in fig. 6, the establishing the first corresponding relationship specifically includes:
s11, acquiring the chip temperature corresponding to the cooling fin under different server environment temperatures or operating system pressures;
s12, acquiring the temperature of the radiating fins within a preset range around the first rubber nail corresponding to the radiating fins under different server environment temperatures or operating system pressures;
and S13, establishing a first corresponding relation between the chip temperature corresponding to the radiating fin under different server environment temperatures or operating system pressures and the temperature of the radiating fin in a preset range around the first rubber nail corresponding to the radiating fin under different server environment temperatures or operating system pressures through a regression equation.
In step S11, the chip temperatures corresponding to the heat sinks under the conditions of obtaining different server environment temperatures or operating system pressures are specifically: the temperature sensor of the chip obtains the temperature of the chip corresponding to the radiating fin under the conditions of different server environment temperatures or operating system pressures. The specific implementation mode can be as follows: under different environmental temperatures, the same pressure is given to an operating system, and the higher the environmental temperature is, the higher the chip temperature is, and the higher the corresponding heat sink temperature is; or under the same environmental temperature, different pressures are given to the operating system, the higher the system pressure is, the higher the chip temperature is, the higher the corresponding heat sink temperature is, and the chip temperature is obtained through a temperature sensor carried by the chip; the system pressure may be 10% to 100%, which is adjusted according to actual conditions, or the chip temperature may be obtained at different environmental temperatures and different operating system pressures, as long as the chip temperature is affected differently, and a specific implementation manner is provided, which is not limited herein.
In step S12, the temperature of the heat dissipation fins within the preset range around the first glue nail corresponding to the heat dissipation fins at different server environmental temperatures or operating system pressures is specifically obtained as follows: and arranging a temperature acquisition module on the radiating fins in a preset range around different rubber nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures. The specific implementation mode can be as follows: under different environmental temperatures, the same pressure is given to an operating system, the higher the environmental temperature is, the higher the chip temperature is, and the higher the temperature of the radiating fins around the rubber nails corresponding to the radiating fins is, the rubber nails corresponding to the radiating fins with the highest temperature in the preset range around the radiating fins are selected from different rubber nails corresponding to the radiating fins as first rubber nails, and the temperature of the radiating fins in the preset range around the first rubber nails is taken as the temperature of the first rubber nails; or under the same environmental temperature, giving different pressures to the operating system, wherein the higher the system pressure is, the higher the chip temperature is, and the higher the temperature of the heat dissipation fins around the glue nail corresponding to the heat dissipation fin is, selecting the glue nail corresponding to the highest temperature of the heat dissipation fins in the preset range around the glue nail as the first glue nail from the different glue nails corresponding to the heat dissipation fin, and taking the temperature of the heat dissipation fins in the preset range around the first glue nail as the temperature of the first glue nail; the system pressure may be 10% to 100%, which is adjusted according to an actual situation, or the temperatures of the heat dissipation fins around different glue nails corresponding to the heat dissipation fins are obtained under different environmental temperatures and different operating system pressures, the glue nail corresponding to the highest temperature of the heat dissipation fins in a preset range around the heat dissipation fin is selected from the different glue nails corresponding to the heat dissipation fin as the first glue nail, and the temperature of the heat dissipation fins in the preset range around the first glue nail is used as the temperature of the first glue nail, as long as the temperature of the chip (the temperature of the heat dissipation fins in the heat dissipation fin corresponding to the chip) is affected differently, which is not limited herein. The heat sink includes at least a first glue nail and a plurality of heat dissipation fins, and may further include other glue nails or heat conduction fins, etc., and the invention is not limited herein.
Specifically, the temperature acquisition module may include a thermocouple wire and a temperature recorder, the thermocouple wire is connected to the heat dissipation fins within a preset range around the first glue nail corresponding to the heat dissipation fin, specifically, the connection mode may be through adhesive tape or glue bonding, or other connection modes. Specifically, in the present scheme, among the heat dissipation fins within the preset range around the first glue nail or the heat dissipation fins within the preset range around other glue nails, the preset range may be the heat dissipation fins closest to the glue nail, or the heat dissipation fins within the preset distance from the glue nail, and the temperature of the heat dissipation fins around the same glue nail is extremely small difference even if different, and can be ignored, and in order to reduce errors, the average value may be obtained for the temperatures of the different heat dissipation fins within the preset distance from the glue nail, and the average value is used as the temperature of the heat dissipation fins around the glue nail.
In step S13, the temperature of the chip and the temperature of the heat dissipation fins around the first glue pin are different when the server environment temperature or the operating system pressure is different, for example, when the server environment temperature is higher and/or the operating system pressure is higher, the temperature of the chip is higher and the temperature of the heat dissipation fins around the first glue pin is higher, and when the server environment temperature is lower and/or the operating system pressure is lower, the temperature of the chip is lower and the temperature of the heat dissipation fins around the first glue pin is lower. Under different conditions, the chip has different temperatures a1, a2, A3 …, and also has different temperatures B1, B2, B3 corresponding to the heat fins around the first glue nail, and in a rectangular coordinate system, (a1, B1), (a2, B2), (A3, B3), each point can be continued to find a relation between the chip temperature a and the heat fins temperature B around the first glue nail.
Specifically, a relational expression between the chip temperature a and the temperature B of the heat dissipation fins around the first rubber pin can be found in an Excel regression manner, and if the relational expression is a linear relation, the relational expression can be directly fitted through a linear equation and realized by utilizing functions such as regression in Excel, for example, B ═ kA + c, where k and c are constants; if the relationship is a non-linear relationship, an excel regression method can be used to find the relationship, and the excel software (or other data analysis software) is used to perform the non-linear regression so as to obtain the relationship between the chip temperature a and the temperature B of the heat dissipation fins around the first glue pins.
In step S2, the service life of the glue nail at different temperatures is obtained, specifically: and acquiring the service life test data of the to-be-tested rubber nails (made of the same material) at different temperatures by a rubber nail manufacturer.
In step S3, as shown in fig. 7, the method specifically includes:
s31, periodically acquiring the current temperature of the chip;
s32, determining the second temperature of the glue nail to be measured according to the first corresponding relation,
s33, acquiring a first service life of the to-be-tested glue nail at a first temperature and a third service life of the to-be-tested glue nail at normal temperature;
s34, acquiring a second service life of the to-be-tested glue nail at a second temperature and the duration time of the to-be-tested glue nail at the second temperature;
and S35, wherein the current service life of the to-be-tested glue nail is the service life of the to-be-tested glue nail at the first temperature, namely the third service life of the to-be-tested glue nail at normal temperature/the second service life of the to-be-tested glue nail at the second temperature and the duration time of the to-be-tested glue nail at the second temperature.
In step S31, the period of the current temperature of the chip is periodically obtained, which may be 1 hour, 1 minute, or other time, and the present invention is not limited herein.
In step S32, determining the second temperature of the to-be-tested glue nail according to the first corresponding relationship is specifically: and determining the current temperature of the heat dissipation fins around the rubber nail to be tested according to the first corresponding relation of the first rubber nail, and setting the current temperature of the heat dissipation fins around the rubber nail to be tested as the second temperature of the rubber nail to be tested.
In step S33, a first service life of the to-be-tested adhesive nail at the first temperature is obtained, that is, the first service life of the to-be-tested adhesive nail at the initial temperature of the current cycle (the temperature before the current cycle starts), when monitoring starts, the first temperature is normal temperature, that is, in step S33, the first service life is the same as the third service life, the normal temperature is generally 25 ℃, and the third service life at the normal temperature is the longest service life of the to-be-tested adhesive nail.
In step S34, a second temperature of the to-be-tested glue nail is determined according to the current temperature of the ground chip obtained periodically, and a second service life and a duration of the to-be-tested glue nail at the second temperature are obtained.
In step S35, the current service life of the to-be-tested glue nail is the service life of the to-be-tested glue nail at the first temperature — the service life of the to-be-tested glue nail at the first temperature/the service life of the to-be-tested glue nail at the second temperature — the duration time at the second temperature. In order to more clearly illustrate the calculation of the current service life of the glue nail, the following is specifically illustrated: for example, the life of the to-be-tested nail at 50 ℃ is 10000 hours (which can also be converted into minutes or other time units), the life of the to-be-tested nail at 40 ℃ is 12000 hours (which can also be converted into minutes or other time units), the life of the to-be-tested nail at normal temperature is 24000 hours (which can also be converted into minutes or other time units), and if the to-be-tested nail at 50 ℃ is monitored for one hour (which can be a monitoring time period, or multiple time periods)The sum of the monitoring time periods),
the specific value is 23997.6, i.e. the life value minus 2.4 hours; the next monitoring period monitors that the rubber nail to be detected lasts for one hour at 40 ℃ (which can be one monitoring time period or the sum of a plurality of monitoring time periods),
the specific value is 23995.6, i.e. the life value of 2 hours is deducted again, and so on, and periodic cycle monitoring is carried out. The first temperature is the initial temperature of the current period, and the second temperature is the current temperature.
In the steps S4-S5, the current service life of the to-be-tested glue nail is judged to be lower than the preset service life threshold value, and then an alarm is given. The preset service life threshold value may be adjusted according to actual conditions, and if the risk requirement is high, the preset service life threshold value may be appropriately increased, and if the risk requirement is low (not easy to replace), the preset service life threshold value may be appropriately decreased, which is not limited herein.
In the embodiment of the invention, because the temperatures of the first glue nail and the glue nail to be detected are inconvenient to directly obtain, the temperature of the first glue nail is set to be the temperature of the heat dissipation fins around the first glue nail, namely the first glue nail is used as a reference glue nail, a first corresponding relation established according to the temperature of the heat dissipation fins around the first glue nail is applied to all actual glue nails to be detected, namely the temperature of the heat dissipation fins around the glue nail to be detected, namely the temperature of the glue nail to be detected, and the temperature of the glue nail to be detected in the heat dissipation sheet corresponding to the chip can be determined according to the temperature of the chip periodically monitored through the pre-established first corresponding relation of the first glue nail, so that the problem that a large amount of hardware such as a temperature sensor or a temperature recorder is needed during the service life monitoring of the existing glue nail is solved, and the hardware cost is reduced.
It should be noted that, the temperature of the chip periodically monitored in the present invention may be a BMC (Baseboard Management Controller) or other types of chips, and the alarm may be that the BMC sends an alarm message to a manager to implement the alarm, or that the alarm is given through an indicator light or a buzzer, which is not limited herein.
It should be noted that, in the technical solution of the present invention, steps S1-S5 may all be implemented by hardware or software language programming, and the programming idea corresponds to the specific steps in this embodiment, and may also be implemented by other manners, which is not limited herein.
According to the invention, the first corresponding relation is established, the temperature of the to-be-detected glue nail is indirectly acquired by utilizing the original temperature sensor in the chip, and the current service life of the to-be-detected glue nail is periodically monitored and updated according to the influence of the temperature of the to-be-detected glue nail on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by the glue nail monitoring is avoided, and the monitoring hardware cost is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one radiating fin is monitored in advance to serve as the first glue nail, the first corresponding relation is established through the ambient temperature of different servers, the temperature of radiating fins around the first glue nail under the pressure of an operating system and the temperature of a chip corresponding to the radiating fin, the first corresponding relation serves as the corresponding basis of the temperature of all the glue nails to be detected and the temperature of the chip, and the risk of breakage of the glue nails in the using process is further reduced.
According to the technical scheme, the current service life of the to-be-tested glue nail is determined according to the first service life corresponding to the first temperature and the second service life corresponding to the second temperature of the to-be-tested glue nail, and the corresponding relation between the current service life of the to-be-tested glue nail and the acquired current temperature of the chip is established, so that the current service life of the to-be-tested glue nail is further quantized, an alarm can be given according to the current service life of the to-be-tested glue nail, and the risk of breakage of the glue nail is reduced.
Example two
As shown in fig. 8, the technical solution of the present invention further provides a system for monitoring the service life of a nail, including:
the method comprises the steps of establishing a unit 101, establishing a first corresponding relation, wherein the first corresponding relation is the corresponding relation between the temperature of radiating fins around a first rubber nail and the temperature of a chip corresponding to a radiating fin, the first rubber nail is the rubber nail with the highest temperature on the radiating fin, the temperature of the rubber nail is the temperature of the radiating fins around the rubber nail, and the radiating fin at least comprises the first rubber nail and a plurality of radiating fins;
the first acquisition unit 102 is used for acquiring the service life of the to-be-detected glue nail at different temperatures;
the obtaining and determining unit 103 is used for periodically obtaining the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life of the to-be-detected glue nail corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and the alarm unit 104 is used for alarming if the current service life of the rubber nail to be detected is lower than a preset service life threshold value.
As shown in fig. 9, the establishing unit 101 specifically includes:
a first obtaining subunit 1011, obtaining the chip temperature corresponding to the heat sink under different server environment temperatures or operating system pressures;
a second obtaining subunit 1012, configured to obtain temperatures of the heat dissipation fins within a preset range around the first glue nail corresponding to the heat dissipation fins at different server environment temperatures or operating system pressures;
the establishing unit 1013 is configured to establish a first corresponding relationship between the chip temperature corresponding to the heat sink under different server environmental temperatures or operating system pressures and the temperature of the heat sink fins within a preset range around the first glue pin corresponding to the heat sink under different server environmental temperatures or operating system pressures by using a regression equation.
In the first obtaining sub-unit 1011, the temperature of the chip corresponding to the heat sink under the condition of obtaining different server environment temperatures or operating system pressures is specifically: the temperature sensor of the chip obtains the temperature of the chip corresponding to the radiating fin under the conditions of different server environment temperatures or operating system pressures. The specific implementation mode can be as follows: under different environmental temperatures, the same pressure is given to an operating system, and the higher the environmental temperature is, the higher the chip temperature is, and the higher the corresponding heat sink temperature is; or under the same environmental temperature, different pressures are given to the operating system, the higher the system pressure is, the higher the chip temperature is, the higher the corresponding heat sink temperature is, and the chip temperature is obtained through a temperature sensor carried by the chip; the system pressure may be 10% to 100%, which is adjusted according to actual conditions, or the chip temperature may be obtained at different environmental temperatures and different operating system pressures, as long as the chip temperature is affected differently, and a specific implementation manner is provided, which is not limited herein.
In the second obtaining subunit 1012, the specific temperature of the heat dissipation fins in the preset range around the first glue nail corresponding to the heat dissipation fins under different server environment temperatures or operating system pressures is obtained as follows: and arranging a temperature acquisition module on the radiating fins in a preset range around different rubber nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures. The specific implementation mode can be as follows: under different environmental temperatures, the same pressure is given to an operating system, the higher the environmental temperature is, the higher the chip temperature is, and the higher the temperature of the radiating fins around the rubber nails corresponding to the radiating fins is, the rubber nails corresponding to the radiating fins with the highest temperature in the preset range around the radiating fins are selected from different rubber nails corresponding to the radiating fins as first rubber nails, and the temperature of the radiating fins in the preset range around the first rubber nails is taken as the temperature of the first rubber nails; or under the same environmental temperature, giving different pressures to the operating system, wherein the higher the system pressure is, the higher the chip temperature is, and the higher the temperature of the heat dissipation fins around the glue nail corresponding to the heat dissipation fin is, selecting the glue nail corresponding to the highest temperature of the heat dissipation fins in the preset range around the glue nail as the first glue nail from the different glue nails corresponding to the heat dissipation fin, and taking the temperature of the heat dissipation fins in the preset range around the first glue nail as the temperature of the first glue nail; the system pressure may be 10% to 100%, which is adjusted according to an actual situation, or the temperatures of the heat dissipation fins around different glue nails corresponding to the heat dissipation fins are obtained under different environmental temperatures and different operating system pressures, the glue nail corresponding to the highest temperature of the heat dissipation fins in a preset range around the heat dissipation fin is selected from the different glue nails corresponding to the heat dissipation fin as the first glue nail, and the temperature of the heat dissipation fins in the preset range around the first glue nail is used as the temperature of the first glue nail, as long as the temperature of the chip (the temperature of the heat dissipation fins in the heat dissipation fin corresponding to the chip) is affected differently, which is not limited herein. The heat sink includes at least a first glue nail and a plurality of heat dissipation fins, and may further include other glue nails or heat conduction fins, etc., and the invention is not limited herein.
Specifically, the temperature acquisition module may include a thermocouple wire and a temperature recorder, the thermocouple wire is connected to the heat dissipation fins within a preset range around the first glue nail corresponding to the heat dissipation fin, specifically, the connection mode may be through adhesive tape or glue bonding, or other connection modes. Specifically, in the present scheme, among the heat dissipation fins within the preset range around the first glue nail or the heat dissipation fins within the preset range around other glue nails, the preset range may be the heat dissipation fins closest to the glue nail, or the heat dissipation fins within the preset distance from the glue nail, and the temperature of the heat dissipation fins around the same glue nail is extremely small difference even if different, and can be ignored, and in order to reduce errors, the average value may be obtained for the temperatures of the different heat dissipation fins within the preset distance from the glue nail, and the average value is used as the temperature of the heat dissipation fins around the glue nail.
In the building subunit 1013, when the server environment temperature or the operating system pressure is different, the chip temperature and the temperature of the heat dissipation fins around the first glue nail are different, for example, when the server environment temperature is higher and/or the operating system pressure is higher, the chip temperature is higher, the temperature of the heat dissipation fins around the first glue nail is higher, when the server environment temperature is lower and/or the operating system pressure is lower, the chip temperature is lower, and the temperature of the heat dissipation fins around the first glue nail is lower. Under different conditions, the chip has different temperatures a1, a2, A3 …, and also has different temperatures B1, B2, B3 corresponding to the heat fins around the first glue nail, and in a rectangular coordinate system, (a1, B1), (a2, B2), (A3, B3), each point can be continued to find a relation between the chip temperature a and the heat fins temperature B around the first glue nail.
Specifically, a relational expression between the chip temperature a and the temperature B of the heat dissipation fins around the first rubber pin can be found in an Excel regression manner, and if the relational expression is a linear relation, the relational expression can be directly fitted through a linear equation and realized by utilizing functions such as regression in Excel, for example, B ═ kA + c, where k and c are constants; if the relationship is a non-linear relationship, an excel regression method can be used to find the relationship, and the excel software (or other data analysis software) is used to perform the non-linear regression so as to obtain the relationship between the chip temperature a and the temperature B of the heat dissipation fins around the first glue pins.
In the first obtaining unit 102, the service lives of the to-be-measured glue nails at different temperatures are obtained, specifically: and acquiring the service life test data of the to-be-tested rubber nails (made of the same material) at different temperatures by a rubber nail manufacturer.
As shown in fig. 10, the acquiring and determining unit 103 specifically includes:
a third obtaining subunit 1031, which periodically obtains the current temperature of the chip;
the first determining subunit 1032 determines the second temperature of the to-be-detected glue nail according to the first corresponding relation;
a fourth obtaining subunit 1033, for obtaining a first service life of the glue nail to be tested at the first temperature and a third service life at the normal temperature,
the fifth obtaining subunit 1034 obtains a second service life of the to-be-tested glue nail at the second temperature and a duration time at the second temperature;
and the second determining subunit 1035 is configured to determine, as the current service life of the to-be-tested nail, a first service life at the first temperature, a third service life at normal temperature, and a second service life at the second temperature, as well as a duration at the second temperature.
In the third obtaining subunit 1031, a period of periodically obtaining the current temperature of the chip may be 1 hour, 1 minute, or other times, which is not limited herein.
In the first determining subunit 1032, determining the second temperature of the to-be-detected glue nail according to the first corresponding relationship specifically includes: and determining the current temperature of the heat dissipation fins around the rubber nail to be tested according to the first corresponding relation of the first rubber nail, and setting the current temperature of the heat dissipation fins around the rubber nail to be tested as the second temperature of the rubber nail to be tested.
In the fourth obtaining subunit 1033, a first service life of the to-be-tested adhesive nail at the first temperature is obtained, that is, the first service life of the to-be-tested adhesive nail at the initial temperature of the current cycle (the temperature before the current cycle starts), when monitoring starts, the first temperature is normal temperature, that is, in the fourth obtaining subunit 1033, the first service life is the same as the third service life, the normal temperature is generally 25 ℃, and the third service life corresponding to the normal temperature is the longest service life of the to-be-tested adhesive nail.
In the fifth obtaining subunit 1034, the second temperature of the to-be-detected glue nail is determined according to the current temperature of the chip periodically obtained, and the second service life of the to-be-detected glue nail at the second temperature and the duration time of the to-be-detected glue nail at the second temperature are obtained.
In the second determining subunit 1035, the current service life of the to-be-tested nail is the service life of the to-be-tested nail at the first temperature — the service life of the to-be-tested nail at the second temperature — the duration of the to-be-tested nail at the second temperature. In order to more clearly illustrate the calculation of the current service life of the glue nail, the following is specifically illustrated: for example, the life of the to-be-tested nail at 50 ℃ is 10000 hours (or can be converted into minutes or other time units), the life of the to-be-tested nail at 40 ℃ is 12000 hours (or can be converted into minutes or other time units), the life of the to-be-tested nail at normal temperature is 24000 hours (or can be converted into minutes or other time units), and if the to-be-tested nail is monitored to be continuously at 50 ℃One hour (which may be one monitoring time period or the sum of a plurality of monitoring time periods),
the specific value is 23997.6, i.e. the life value minus 2.4 hours; the next monitoring period monitors that the rubber nail to be detected lasts for one hour at 40 ℃ (which can be one monitoring time period or the sum of a plurality of monitoring time periods),
the specific value is 23995.6, i.e. the life value of 2 hours is deducted again, and so on, and periodic cycle monitoring is carried out. The first temperature is the initial temperature of the current period, and the second temperature is the current temperature.
In the alarm unit 104, if the current service life of the to-be-tested glue nail is judged to be lower than the preset service life threshold value, an alarm is given. The preset service life threshold value may be adjusted according to actual conditions, and if the risk requirement is high, the preset service life threshold value may be appropriately increased, and if the risk requirement is low (not easy to replace), the preset service life threshold value may be appropriately decreased, which is not limited herein.
In the embodiment of the invention, because the temperatures of the first glue nail and the glue nail to be detected are inconvenient to directly obtain, the temperature of the first glue nail is set to be the temperature of the heat dissipation fins around the first glue nail, namely the first glue nail is used as a reference glue nail, a first corresponding relation established according to the temperature of the heat dissipation fins around the first glue nail is applied to all actual glue nails to be detected, namely the temperature of the heat dissipation fins around the glue nail to be detected, namely the temperature of the glue nail to be detected, and the temperature of the glue nail to be detected in the heat dissipation sheet corresponding to the chip can be determined according to the temperature of the chip periodically monitored through the pre-established first corresponding relation of the first glue nail, so that the problem that a large amount of hardware such as a temperature sensor or a temperature recorder is needed during the service life monitoring of the existing glue nail is solved, and the hardware cost is reduced.
According to the invention, the first corresponding relation is established, the temperature of the to-be-detected glue nail is indirectly acquired by utilizing the original temperature sensor in the chip, and the current service life of the to-be-detected glue nail is periodically monitored and updated according to the influence of the temperature of the to-be-detected glue nail on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by the glue nail monitoring is avoided, and the monitoring hardware cost is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one radiating fin is monitored in advance to serve as the first glue nail, the first corresponding relation is established through the ambient temperature of different servers, the temperature of radiating fins around the first glue nail under the pressure of an operating system and the temperature of a chip corresponding to the radiating fin, the first corresponding relation serves as the corresponding basis of the temperature of all the glue nails to be detected and the temperature of the chip, and the risk of breakage of the glue nails in the using process is further reduced.
According to the technical scheme, the current service life of the to-be-tested glue nail is determined according to the first service life corresponding to the first temperature and the second service life corresponding to the second temperature of the to-be-tested glue nail, and the corresponding relation between the current service life of the to-be-tested glue nail and the acquired current temperature of the chip is established, so that the current service life of the to-be-tested glue nail is further quantized, an alarm can be given according to the current service life of the to-be-tested glue nail, and the risk of breakage of the glue nail is reduced.
EXAMPLE III
As shown in fig. 11, the present invention also provides an electronic device, including: a memory 201 for storing a computer program; the processor 202 is configured to implement the steps of the method for monitoring the service life of the glue nail according to the first embodiment when executing the computer program.
The memory 201 in the embodiments of the present application is used to store various types of data to support the operation of the electronic device. Examples of such data include: any computer program for operating on an electronic device. It will be appreciated that the memory 201 can be either volatile memory or nonvolatile memory, and can include both volatile and nonvolatile memory. Among them, the nonvolatile Memory may be a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), a magnetic random access Memory (FRAM), a Flash Memory (Flash Memory), a magnetic surface Memory, an optical disk, or a Compact Disc Read-Only Memory (CD-ROM); the magnetic surface storage may be disk storage or tape storage. The volatile memory may be a Random Access Memory (RAM) which serves as an external cache. By way of illustration and not limitation, many forms of RAM are available, such as Static Random Access Memory (SRAM), Synchronous Static Random Access Memory (SSRAM), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate Synchronous Dynamic Random Access Memory (DDRSDRAM, Double Data Synchronous Random Access Memory), Enhanced Synchronous Dynamic Random Access Memory (ESDRAM, Enhanced Synchronous Dynamic Random Access Memory), Synchronous link Dynamic Random Access Memory (SLDRAM, Synchronous Dynamic Random Access Memory), Direct Memory (DRmb Random Access Memory, Random Access Memory). The memory 201 described in embodiments herein is intended to comprise, without being limited to, these and any other suitable types of memory. The method disclosed in the embodiments of the present application may be applied to the processor 202, or implemented by the processor 202. The processor 202 may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware or instructions in the form of software in the processor 202. The processor 202 may be a general-purpose processor, a DSP (Digital Signal Processing, i.e., a chip capable of implementing Digital Signal Processing), or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, etc. Processor 202 may implement or perform the methods, steps, and logic blocks disclosed in the embodiments of the present application. A general purpose processor may be a microprocessor or any conventional processor or the like. The steps of the method disclosed in the embodiments of the present application may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software modules may be located in a storage medium located in the memory 201, and the processor 202 reads the program in the memory 201 and performs the steps of the foregoing method in combination with its hardware. When the processor 202 executes the program, the corresponding processes in the methods according to the embodiments of the present application are realized, and for brevity, are not described herein again.
According to the invention, the first corresponding relation is established, the temperature of the to-be-detected glue nail is indirectly acquired by utilizing the original temperature sensor in the chip, and the current service life of the to-be-detected glue nail is periodically monitored and updated according to the influence of the temperature of the to-be-detected glue nail on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by the glue nail monitoring is avoided, and the monitoring hardware cost is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one radiating fin is monitored in advance to serve as the first glue nail, the first corresponding relation is established through the ambient temperature of different servers, the temperature of radiating fins around the first glue nail under the pressure of an operating system and the temperature of a chip corresponding to the radiating fin, the first corresponding relation serves as the corresponding basis of the temperature of all the glue nails to be detected and the temperature of the chip, and the risk of breakage of the glue nails in the using process is further reduced.
According to the technical scheme, the current service life of the to-be-tested glue nail is determined according to the first service life corresponding to the first temperature and the second service life corresponding to the second temperature of the to-be-tested glue nail, and the corresponding relation between the current service life of the to-be-tested glue nail and the acquired current temperature of the chip is established, so that the current service life of the to-be-tested glue nail is further quantized, an alarm can be given according to the current service life of the to-be-tested glue nail, and the risk of breakage of the glue nail is reduced.
Example four
The technical solution of the present invention further provides a computer-readable storage medium, where a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method for monitoring the service life of the glue nail according to the first embodiment are implemented.
For example, comprising a memory 201 storing a computer program executable by a processor 202 for performing the steps of the method as described above. The computer readable storage medium may be Memory such as FRAM, ROM, PROM, EPROM, EEPROM, Flash Memory, magnetic surface Memory, optical disk, or CD-ROM.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code. Alternatively, the integrated units described above in the present application may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as independent products. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or portions thereof that contribute to the prior art may be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling an electronic device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
According to the invention, the first corresponding relation is established, the temperature of the to-be-detected glue nail is indirectly acquired by utilizing the original temperature sensor in the chip, and the current service life of the to-be-detected glue nail is periodically monitored and updated according to the influence of the temperature of the to-be-detected glue nail on the service life, so that the problems of low monitoring efficiency and high hardware cost caused by the existing glue nail service life monitoring are effectively solved, the glue nail service life monitoring efficiency is effectively improved, the hardware cost of a plurality of temperature recorders or temperature sensors required by the glue nail monitoring is avoided, and the monitoring hardware cost is reduced.
When the first corresponding relation is established, the glue nail with the highest temperature in one radiating fin is monitored in advance to serve as the first glue nail, the first corresponding relation is established through the ambient temperature of different servers, the temperature of radiating fins around the first glue nail under the pressure of an operating system and the temperature of a chip corresponding to the radiating fin, the first corresponding relation serves as the corresponding basis of the temperature of all the glue nails to be detected and the temperature of the chip, and the risk of breakage of the glue nails in the using process is further reduced.
According to the technical scheme, the current service life of the to-be-tested glue nail is determined according to the first service life corresponding to the first temperature and the second service life corresponding to the second temperature of the to-be-tested glue nail, and the corresponding relation between the current service life of the to-be-tested glue nail and the acquired current temperature of the chip is established, so that the current service life of the to-be-tested glue nail is further quantized, an alarm can be given according to the current service life of the to-be-tested glue nail, and the risk of breakage of the glue nail is reduced.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (9)
1. A method for monitoring the service life of a rubber nail is characterized by comprising the following steps:
establishing a first corresponding relation, wherein the first corresponding relation is a corresponding relation between the temperature of the heat dissipation fins around the first glue nail and the temperature of the chip corresponding to the heat dissipation fin, the first glue nail is the glue nail with the highest temperature on the heat dissipation fin, the temperature of the glue nail is the temperature of the heat dissipation fins around the glue nail, and the heat dissipation fin at least comprises the first glue nail and a plurality of heat dissipation fins;
obtaining the service life of the rubber nail to be tested at different temperatures;
periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and if the current service life of the to-be-tested rubber nail is lower than a preset service life threshold value, alarming.
2. The method for monitoring the service life of the rubber nail according to claim 1, wherein the establishing of the first corresponding relation specifically comprises:
acquiring the temperature of a chip corresponding to a cooling fin under the conditions of different server environment temperatures or operating system pressures;
acquiring the temperature of the radiating fins in a preset range around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures;
and establishing a first corresponding relation between the chip temperature corresponding to the radiating fin under the condition of different server environment temperatures or operating system pressures and the temperature of the radiating fin in a preset range around the first rubber nail corresponding to the radiating fin under the condition of different server environment temperatures or operating system pressures through a regression equation.
3. The method for monitoring the service life of the glue nail according to claim 2, wherein the step of obtaining the temperature of the chip corresponding to the heat sink under the conditions of different server environment temperatures or operating system pressures is specifically as follows: the temperature of the chip corresponding to the cooling fin under the conditions of different server environment temperatures or operating system pressures is obtained through the temperature sensor of the chip.
4. The method for monitoring the service life of the rubber nail according to claim 2, wherein the step of acquiring the temperature of the radiating fins within the preset range around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures is specifically as follows: and arranging a temperature acquisition module on the radiating fins in a preset range around different rubber nails corresponding to the radiating fins, and acquiring the temperature of the radiating fins around the first rubber nail corresponding to the radiating fins under the conditions of different server environment temperatures or operating system pressures.
5. The method for monitoring the service life of the rubber nail according to claim 4, wherein the temperature acquisition module comprises a thermocouple wire and a temperature recorder, the thermocouple wire is connected with the radiating fins in the preset range around the first rubber nail corresponding to the radiating fins, and the input end of the temperature recorder is connected with the output end of the thermocouple wire.
6. The method for monitoring the service life of the glue nail according to claim 1, wherein the step of determining the current service life of the glue nail to be tested according to the first service life of the glue nail to be tested corresponding to the first temperature and the second service life of the glue nail to be tested corresponding to the second temperature specifically comprises the following steps:
acquiring a first service life of a to-be-tested rubber nail at a first temperature and a third service life of the to-be-tested rubber nail at normal temperature;
acquiring a second service life of the to-be-tested glue nail at a second temperature and the duration time of the to-be-tested glue nail at the second temperature;
the current service life of the to-be-tested glue nail is the first service life of the to-be-tested glue nail at the first temperature, namely the third service life of the to-be-tested glue nail at normal temperature, or the second service life of the to-be-tested glue nail at the second temperature, namely the duration time of the to-be-tested glue nail at the second temperature.
7. A monitoring system for the service life of a rubber nail is characterized by comprising:
the heat dissipation device comprises an establishing unit and a control unit, wherein the establishing unit is used for establishing a first corresponding relation, the first corresponding relation is the corresponding relation between the temperature of the heat dissipation fins around a first rubber nail and the temperature of a chip corresponding to a heat dissipation fin, the first rubber nail is the rubber nail with the highest temperature on the heat dissipation fin, the temperature of the rubber nail is the temperature of the heat dissipation fins around the rubber nail, and the heat dissipation fin at least comprises the first rubber nail and a plurality of heat dissipation fins;
the first acquisition unit is used for acquiring the service life of the to-be-detected glue nail at different temperatures;
the acquisition and determination unit is used for periodically acquiring the current temperature of the chip, determining the second temperature of the to-be-detected glue nail according to the first corresponding relation, and determining the current service life of the to-be-detected glue nail according to the first service life of the to-be-detected glue nail corresponding to the first temperature and the second service life corresponding to the second temperature, wherein the first temperature is the initial temperature of the current period;
and the alarm unit is used for alarming if the current service life of the rubber nail to be detected is lower than a preset service life threshold value.
8. An electronic device, comprising: a memory for storing a computer program; a processor for implementing the steps of the method for monitoring the service life of a glue nail according to any one of claims 1 to 6 when executing said computer program.
9. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, which computer program, when being executed by a processor, carries out the steps of the method for monitoring the service life of a glue nail according to any one of claims 1 to 6.
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| CN110427083A (en) * | 2019-06-28 | 2019-11-08 | 联想(北京)有限公司 | A kind of control method, device and storage medium |
| CN111060835A (en) * | 2019-12-31 | 2020-04-24 | 湖州师范学院 | Method and system for predicting remaining life of lithium battery and readable storage medium |
| CN111258856A (en) * | 2020-02-16 | 2020-06-09 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for monitoring running state of solid state disk |
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| CN110427083A (en) * | 2019-06-28 | 2019-11-08 | 联想(北京)有限公司 | A kind of control method, device and storage medium |
| CN111060835A (en) * | 2019-12-31 | 2020-04-24 | 湖州师范学院 | Method and system for predicting remaining life of lithium battery and readable storage medium |
| CN111258856A (en) * | 2020-02-16 | 2020-06-09 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for monitoring running state of solid state disk |
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