CN113459891B - Battery matrix temperature monitoring control system of electric automobile - Google Patents

Battery matrix temperature monitoring control system of electric automobile Download PDF

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Publication number
CN113459891B
CN113459891B CN202110754549.XA CN202110754549A CN113459891B CN 113459891 B CN113459891 B CN 113459891B CN 202110754549 A CN202110754549 A CN 202110754549A CN 113459891 B CN113459891 B CN 113459891B
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pin
processing unit
mcu
temperature detection
arithmetic processing
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CN113459891A (en
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饶生源
舒南翔
任建华
郭艳勤
李雪
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Anhui Jianghuai Automobile Group Corp
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Anhui Jianghuai Automobile Group Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L58/00—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles
    • B60L58/10—Methods or circuit arrangements for monitoring or controlling batteries or fuel cells, specially adapted for electric vehicles for monitoring or controlling batteries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Power Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Secondary Cells (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)

Abstract

The invention discloses a battery matrix temperature monitoring control system of an electric automobile, which comprises: the device comprises a plurality of battery pack temperature detection assemblies, a plurality of battery unit temperature detection assemblies and a current detection master control assembly, wherein each battery unit temperature detection assembly is respectively connected with the plurality of battery pack temperature detection assemblies and the current detection master control assembly, and each battery pack temperature detection assembly comprises a first MCU (microprogrammed control unit) operation processing unit, a first DC/DC (direct current/direct current) power supply management unit, an electrolytic capacitor, a plurality of single batteries, a plurality of single bus temperature sensors respectively embedded into the single batteries, a clock circuit capacitor, a first quartz crystal oscillator and a pulse filter capacitor. The temperature monitoring and controlling system for the battery matrix of the electric automobile can monitor and control the temperature of a single battery, which is generated by current factors, for 24 hours in a vertical mode, can adjust the charging current in real time during quick charging, and ensures the safety and the service life of the battery.

Description

Battery matrix temperature monitoring control system of electric automobile
Technical Field
The invention relates to the technical field of battery temperature monitoring, in particular to a battery matrix temperature monitoring control system of an electric automobile.
Background
In an electric vehicle, the number of battery packs is about several thousands, and it is very necessary to monitor charging and discharging in real time during driving and charging, and especially, it is very necessary to monitor and monitor each single battery, which plays a crucial role in monitoring and controlling in real time during rapid charging. The monitoring data can provide very important data support for the aspects of battery use, process improvement, use safety and the like.
The current battery temperature monitoring technology is only used for carrying out limited current monitoring on a battery pack, namely the battery pack consisting of dozens or hundreds of batteries cannot find the hidden danger of a single problem battery in time.
Therefore, a battery matrix temperature monitoring and controlling system for an electric vehicle is needed.
Disclosure of Invention
The invention aims to provide a battery matrix temperature monitoring and controlling system of an electric automobile, which is used for solving the problems in the prior art, can monitor and control the temperature of a single battery caused by current factors for 24 hours, can adjust the charging current in real time during quick charging, and ensures the safety and the service life of the battery.
The invention provides a battery matrix temperature monitoring and controlling system of an electric automobile, which comprises:
a plurality of battery package temperature detect subassembly, a plurality of battery unit temperature detect subassembly and the total control subassembly of current detection, each battery unit temperature detect subassembly and a plurality of battery package temperature detect subassembly is connected, the total control subassembly of current detection and each battery unit temperature detect subassembly is connected, wherein:
each battery pack temperature detection assembly comprises a first MCU (microprogrammed control unit) operation processing unit U1, a first DC/DC power supply management unit U2, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a plurality of single batteries, a plurality of single bus temperature sensors respectively embedded in the single batteries, a first clock circuit capacitor C1, a second clock circuit capacitor C2, a first quartz crystal oscillator Y1, a first power supply management circuit pulse filter capacitor C3 and a second power supply management circuit pulse filter capacitor C4, wherein one end of each single bus temperature sensor comprises the first clock circuit capacitor C1, the second clock circuit capacitor C2, the first quartz crystal oscillator Y1 and the first MCU operation processing unit U1 to form a first clock circuit, the first DC/DC power supply management unit U2, the first electrolytic capacitor E1 and the first power supply management circuit pulse filter capacitor C3 to form an input filter circuit, and the first DC/DC power supply management unit U2, the second electrolytic capacitor E2 and the second power supply management circuit pulse filter capacitor C4 to form an output filter circuit;
each battery unit temperature detection assembly comprises a second MCU operation processing unit U3, a second DC/DC power supply management unit U4, a second quartz crystal oscillator Y2, a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a seventh clock circuit capacitor C7, an eighth clock circuit capacitor C8, a ninth clock circuit capacitor C9, a tenth clock circuit capacitor C10, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a first inductor L1, the second MCU operation processing unit U3 is respectively connected with each battery pack temperature detection assembly, the fifth clock circuit capacitor C5, the sixth clock circuit capacitor C6, the second quartz crystal oscillator Y2 and the second MCU operation processing unit U3 constitute a second clock circuit, the second DC/DC power management unit U4, the first resistor R1, the third electrolytic capacitor E3 and the ninth clock circuit capacitor C9 constitute an input filter circuit, the second DC/DC power management unit U4, the first inductor L1 and the tenth clock circuit capacitor C10 constitute a filter circuit, the third resistor R3, the fourth resistor R4, the second resistor R2 and the second DC/DC power management unit U4 constitute a voltage output adjustment circuit, and the fourth electrolytic capacitor E4 and the eighth clock circuit capacitor C8 constitute an output filter circuit;
the current detection general control assembly comprises a third MCU operation processing unit U5, a third DC/DC power management unit U6, a third quartz crystal oscillator Y3, an eleventh clock circuit capacitor C11, a twelfth clock circuit capacitor C12, a thirteenth clock circuit capacitor C13, a fourteenth clock circuit capacitor C14, a fifteenth clock circuit capacitor C15, a sixteenth clock circuit capacitor C16, a fifth electrolytic capacitor E5, a sixth electrolytic capacitor E6, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8 and a second inductor L2, the third MCU operation processing unit U5 is respectively connected with the battery unit temperature detection assemblies, the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12, the third quartz crystal oscillator Y3, the third MCU operation processing unit U5, a third clock circuit, the third DC/DC power management unit U6, the fifth resistor R5, the fifth electrolytic capacitor E5, the fifteenth clock circuit capacitor C15, the sixth clock circuit capacitor R6, the sixteenth clock circuit capacitor R6, the eighth resistor R8 and the second inductor L2, the third DC/DC power management unit U6, the sixth DC/DC power management unit, the sixth capacitor R6, the sixth filter circuit output circuit, the sixth capacitor R6, the sixth filter circuit R2 and the sixth capacitor E2.
The temperature monitoring and controlling system for the battery matrix of the electric vehicle as described above, wherein preferably, the first MCU operation processing unit U1 comprises a domestic engien 8-bit single chip microcomputer with a model number of EN8P72, the second MCU operation processing unit U3, and/or the third MCU operation processing unit U5 comprises a domestic hua large semiconductor integrated circuit 32-bit single chip microcomputer with a model number of HC32F146 KATA; the first DC/DC power management unit U2, the second DC/DC power management unit U4 and/or the third DC/DC power management unit U6 comprise a Chinese large semiconductor integrated circuit DC/DC power manager with the model number of BL 8062; each single-bus temperature sensor comprises a single-bus temperature sensor of the Yinhuake of Beijing Zhongke of GX18B20, and has 64-bit ID address codes.
The battery matrix temperature monitoring and control system of the electric vehicle as described above, preferably, the number of the single bus temperature sensors corresponding to each battery pack temperature detection assembly is 20, which are RS01 to RS20, respectively, the number of the battery pack temperature detection assemblies corresponding to each battery unit temperature detection assembly is 20, which are CT01 to CT20, respectively, and the number of the battery unit temperature detection assemblies is 5, which are BT-D1 to BT-D5, respectively.
The battery matrix temperature monitoring and controlling system of the electric vehicle as described above, wherein preferably, the 1 st pin GND of each of the single-bus temperature sensors RS01-RS20 is connected to the ground GND, the 3 rd pin VDD of the single-bus temperature sensors RS1-RS20 is connected to the 3 rd pin power voltage stabilizing output terminal of the first DC/DC power management unit U2, the 2 nd pin of the first single-bus temperature sensor RS1 is connected to the 27 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the second single-bus temperature sensor RS2 is connected to the 26 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the third single-bus temperature sensor RS3 is connected to the 25 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the fourth single-bus temperature sensor RS4 is connected to the 24 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the fifth single-bus temperature sensor RS5 is connected to the 23 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of a sixth single-bus temperature sensor RS6 is connected with the 22 nd pin of the first MCU operation processing unit U1, the 2 nd pin of a seventh single-bus temperature sensor RS7 is connected with the 21 st pin of the first MCU operation processing unit U1, the 2 nd pin of an eighth single-bus temperature sensor RS8 is connected with the 18 th pin of the first MCU operation processing unit U1, the 2 nd pin of a ninth single-bus temperature sensor RS9 is connected with the 17 th pin of the first MCU operation processing unit U1, the 2 nd pin of a tenth single-bus temperature sensor RS10 is connected with the 16 th pin of the first MCU operation processing unit U1, the 2 nd pin of an eleventh single-bus temperature sensor RS11 is connected with the 15 th pin of the first MCU operation processing unit U1, the 2 nd pin of a twelfth single-bus temperature sensor RS12 is connected with the 14 th pin of the first MCU operation processing unit U1, the 2 nd pin of a thirteenth single-bus temperature sensor RS13 is connected with the 13 th pin of the first MCU operation processing unit U1, the 2 nd pin of a fourteenth single-bus temperature sensor RS14 is connected with the 12 th pin of a first MCU operation processing unit U1, the 2 nd pin of a fifteenth single-bus temperature sensor RS15 is connected with the 11 th pin of the first MCU operation processing unit U1, the 2 nd pin of a sixteenth single-bus temperature sensor RS16 is connected with the 7 th pin of the first MCU operation processing unit U1, the 2 nd pin of a seventeenth single-bus temperature sensor RS17 is connected with the 6 th pin of the first MCU operation processing unit U1, the 2 nd pin of an eighteenth single-bus temperature sensor RS18 is connected with the 5 th pin of the first MCU operation processing unit U1, the 2 nd pin of a nineteenth single-bus temperature sensor RS19 is connected with the 4 th pin of the first MCU operation processing unit U1, the 2 nd pin of a twentieth single-bus temperature sensor RS20 is connected with the 3 rd pin of the first MCU operation processing unit U1, the 2 nd pin of the first MCU operation processing unit U1 is connected with the data operation processing unit Ct input port of a second MCU operation processing unit U3-01-order MCU operation processing unit, and the data processing unit Ct interface U1-01-Ct data processing unit Ct interface unit Ct and a second MCU operation processing unit Ct interface 28.
The battery matrix temperature monitoring and controlling system of the electric vehicle as described above, preferably, the first clock circuit capacitor C1, the second clock circuit capacitor C2, and the first quartz crystal oscillator Y1 are respectively connected to the 9 th pin and the 10 th pin of the first MCU arithmetic processing unit U1 to form a first crystal oscillation circuit with a frequency of 8MHz, the second electrolytic capacitor E2, and the fourth power management circuit pulse filter capacitor C4 are connected to the 3 rd pin of the first DC/DC power management unit U2 to form an output filter circuit, and the first electrolytic capacitor E1, the third power management circuit pulse filter capacitor C3 are connected to the 1 st pin of the first DC/DC power management unit U2 to form an input filter circuit.
The battery matrix temperature monitoring and controlling system of the electric vehicle as described above, wherein preferably, the 2 nd pin GND of each battery pack temperature detecting component CT01-CT20 is connected to the ground GND, the 1 st pin VDD of each battery pack temperature detecting component CT01-CT20 is connected to the voltage stabilizing integrated circuit for stabilizing the voltage and outputting, and is connected to the fourth electrolytic capacitor E4, the third resistor R3, the first inductor L1 and the 1 st, 32 th, 33 th and 34 th pins of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01 of the first battery pack temperature detecting component CT01 is connected to the 7 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the first battery pack temperature detecting component CT01 is connected to the 6 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the second battery pack temperature detecting component CT02 is connected to the 5 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the second battery pack temperature detection component CT02 is connected with the 4 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the third battery pack temperature detection component CT03 is connected with the 3 rd pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the third battery pack temperature detection component CT03 is connected with the 2 nd pin of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01data of the fourth battery pack temperature detection component CT04 is connected with the 63 rd pin of the second MCU arithmetic processing unit U3, the 63 th pin CT-01clock of the fourth battery pack temperature detection component CT04 is connected with the 62 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fifth battery pack temperature detection component CT05 is connected with the 61 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifth battery pack temperature detection component CT05 is connected with the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the sixth battery pack temperature detection component CT06 is connected with the 59 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixth battery pack temperature detection component CT06 is connected with the 58 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the seventh battery pack temperature detection component CT07 is connected with the 57 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the seventh battery pack temperature detection component CT07 is connected with the 56 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the eighth battery pack temperature detection component CT08 is connected with the 55 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the eighth battery pack temperature detection component CT08 is connected with the 54 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the ninth battery pack temperature detection component CT09 is connected with the 53 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the ninth battery pack temperature detection component CT09 is connected with the 52 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the tenth battery pack temperature detection component CT10 is connected with the 51 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the tenth battery pack temperature detection component CT10 is connected with the 50 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the eleventh battery pack temperature detection component CT11 is connected with the 40 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the eleventh battery pack temperature detection component CT11 is connected with the 39 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the twelfth battery pack temperature detection component CT12 is connected with the 38 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the twelfth battery pack temperature detection component CT12 is connected with the second MCU operation processing unit U3 37 pins are connected, the 3 rd pin At1-01data of the thirteenth battery pack temperature detection component CT13 is connected with the 36 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the thirteenth battery pack temperature detection component CT13 is connected with the 35 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fourteenth battery pack temperature detection component CT14 is connected with the 29 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fourteenth battery pack temperature detection component CT14 is connected with the 28 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fifteenth battery pack temperature detection component CT15 is connected with the 27 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifteenth battery pack temperature detection component CT15 is connected with the 26 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixteenth battery pack temperature detection component CT16 is connected with the seventeenth battery pack temperature detection component CT1-01clock of the seventeenth battery pack temperature detection component CT 3, the seventeenth battery pack temperature detection component CT16 is connected with the seventeenth battery pack temperature detection component MCU arithmetic processing unit U3, the seventeenth pin CT 18-17, the seventeenth pin CT16 of the seventeenth battery pack temperature detection component CT16 is connected with the second MCU arithmetic processing unit U3, the seventeenth battery pack temperature detection component CT16 of the seventeenth battery pack CT16, the 4 th pin CT-01clock of the nineteenth battery pack temperature detection component CT19 is connected with the 10 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the twentieth battery pack temperature detection component CT20 is connected with the 9 th pin of the second MCU arithmetic processing unit U3, and the 4 th pin CT-01clock of the twentieth battery pack temperature detection component CT20 is connected with the 8 th pin of the second MCU arithmetic processing unit U3.
The battery matrix temperature monitoring and control system of the electric vehicle as described above, wherein preferably, a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a second quartz crystal oscillator Y2, a pin 17 and a pin 18 of a second MCU arithmetic processing unit U3 constitute a second clock circuit with a frequency of 8MHz, a pin 48 of the second MCU arithmetic processing unit U3 is connected to a clock output interface terminal, a pin 49 of the second MCU arithmetic processing unit U3 is connected to a data output interface terminal, a pin 3 of a second DC/DC power management unit U4 constitutes an input filter circuit with a first resistor R1, a third electrolytic capacitor E3, and a ninth clock circuit capacitor C9, a pin 2 of the second DC/DC power management unit U4 constitutes a filter circuit with a first inductor L1, a tenth clock circuit capacitor C10, a third resistor R3, a fourth resistor R4, a second resistor R2, and a pin 4 of the second DC/DC power management unit U4 constitute a voltage adjustment circuit with a pin 4, and an eighth clock output capacitor E2 and an eighth clock output filter circuit constitute an electrolytic capacitor E8.
The system for monitoring and controlling the battery matrix temperature of the electric vehicle as described above, wherein preferably, the 2 nd pin BT _ GND of each battery unit temperature detection assembly BT-D1-BT-D5 is connected to the ground GND, the 1 st pin BT _ VCC of each battery unit temperature detection assembly BT-D1-BT-D5 is connected to the voltage stabilizing integrated circuit for voltage stabilization, the sixth electrolytic capacitor E6, the seventh resistor R7, the second inductor L2 and the 1 st, 32 nd, 33 rd and 34 th pins of the third MCU calculation processing unit U5 are connected, the 3 rd pin BC _ DATA of the first battery unit temperature detection assembly BT-D1 is connected to the 12 th pin of the third MCU calculation processing unit U5, the 4 th pin BC _ clock of the first battery unit temperature detection assembly BT-D1 is connected to the 11 th pin of the third MCU calculation processing unit U5, the 3 rd pin BC _ DATA of the second battery unit temperature detection assembly BT-D2 is connected to the 3 rd pin BC _ DATA of the third MCU calculation processing unit BT-D5, the third pin BT-D5 is connected to the third MCU calculation processing unit BT _ BC _ DATA 23, the third MCU 3 th pin BT-D3 th pin BC _ DATA of the third MCU calculation processing unit BT-D5 is connected to the third MCU 3 th pin BT-BC calculation processing unit BT-D5, the third MCU 3 detection assembly BT-D23 is connected to the third MCU 3 th pin BC _ DATA of the third MCU calculation processing unit BT-D5, the 4 th pin BC _ clock of the fifth battery cell temperature detection unit BT-D5 is connected to the 27 th pin of the third MCU arithmetic processing unit U5.
In the above-mentioned electric vehicle battery matrix temperature monitoring control system, preferably, the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12 and the third quartz crystal oscillator Y3 form a third clock circuit with a frequency of 8MHz with the 17 th pin and the 18 th pin of the third MCU arithmetic processing unit U5, the 48 th pin display _ DATA of the third MCU arithmetic processing unit U5 is connected to the display driving output interface terminal, the 47 th pin display _ clock of the third MCU arithmetic processing unit U5 is connected to the display clock interface terminal, the 46 th pin control _ DATA of the third MCU arithmetic processing unit U5 is connected to the control DATA port, the 45 th pin control _ clock of the third MCU arithmetic processing unit U5 is connected to the control clock interface terminal, the 44 th pin drive _ DATA of the third MCU arithmetic processing unit U5 is connected to the driving DATA port, and the 43 th pin drive _ clock of the third MCU arithmetic processing unit U5 is connected to the driving clock interface.
The system for monitoring and controlling the temperature of the battery matrix of the electric vehicle as described above, preferably, the first MCU operation processing unit U1 and the second MCU operation processing unit U3 are used to transmit data and clock signals between the battery pack temperature detection assembly and the battery unit temperature detection assembly, and the second MCU operation processing unit U3 and the third MCU operation processing unit U5 are used to transmit data and clock signals between the battery unit temperature detection assembly and the current detection general control assembly.
The invention provides a battery matrix temperature monitoring and controlling system of an electric vehicle, which can monitor and control the temperature of a single battery caused by current factors in a charging mode, a discharging mode and a parking mode for 24 hours through a battery pack temperature detecting assembly, a battery unit temperature detecting assembly and a current detecting master control assembly which are vertically arranged, can adjust the charging current in real time during quick charging, and ensures the safety and the service life of the battery.
Drawings
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described with reference to the accompanying drawings, in which:
FIG. 1 is a block diagram of an embodiment of a battery matrix temperature monitoring and controlling system of an electric vehicle according to the present invention;
FIG. 2 is a circuit diagram of an embodiment of a battery pack temperature detection assembly of the battery matrix temperature monitoring and control system of an electric vehicle according to the present invention;
FIG. 3 is a circuit diagram of an embodiment of a battery cell temperature detection assembly of the electric vehicle battery matrix temperature monitoring and control system according to the present invention;
fig. 4 is a circuit diagram of an embodiment of a current detection master control component of the electric vehicle battery matrix temperature monitoring control system provided by the invention.
Detailed Description
Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the disclosure, its application, or uses. The present disclosure may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments are to be construed as merely illustrative, and not as limitative, unless specifically stated otherwise.
As used in this disclosure, "first", "second": and the like, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element preceding the word covers the element listed after the word, and does not exclude the possibility that other elements are also covered. "upper", "lower", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In the present disclosure, when a specific component is described as being positioned between a first component and a second component, there may or may not be an intervening component between the specific component and the first component or the second component. When it is described that a specific component is connected to other components, the specific component may be directly connected to the other components without having an intervening component, or may be directly connected to the other components without having an intervening component.
All terms (including technical or scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
As shown in fig. 1, the present invention further provides a temperature monitoring and controlling system for a battery matrix of an electric vehicle, comprising:
a plurality of battery package temperature detect subassembly (C layer) 1, a plurality of battery unit temperature detect subassembly (B layer) 2 and the total subassembly of current detection (A layer) 3, each battery unit temperature detect subassembly 2 and a plurality of battery package temperature detect subassembly 1 is connected, the total subassembly of current detection 3 and each battery unit temperature detect subassembly 2 is connected, wherein:
as shown in fig. 2, each battery pack temperature detection assembly 1 includes a first MCU operation processing unit U1, a first DC/DC power management unit U2, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a plurality of single batteries, a plurality of single bus temperature sensors respectively embedded in each single battery, a first clock circuit capacitor C1, a second clock circuit capacitor C2, a first quartz crystal oscillator Y1, a first power management circuit pulse filter capacitor C3, a second power management circuit pulse filter capacitor C4, a first clock circuit capacitor C1, a second clock circuit capacitor C2, a first quartz crystal oscillator Y1, and a first MCU operation processing unit U1 at one end of each single bus temperature sensor, an input filter circuit composed of the first DC/DC power management unit U2, the first electrolytic capacitor E1, the first power management circuit pulse filter capacitor C3, and an output filter circuit composed of the first DC/DC power management unit U2, the second electrolytic capacitor E2, and the second power management circuit pulse filter capacitor C4;
as shown in fig. 3, each of the battery unit temperature detection assemblies 2 includes a second MCU operation processing unit U3, a second DC/DC power management unit U4, a second quartz crystal oscillator Y2, a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a seventh clock circuit capacitor C7, an eighth clock circuit capacitor C8, a ninth clock circuit capacitor C9, a tenth clock circuit capacitor C10, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, and a first inductor L1, the second MCU operation processing unit U3 is connected to each of the battery pack temperature detection assemblies, the fifth clock circuit capacitor C5, the sixth clock circuit capacitor C6, the second quartz crystal oscillator Y2, and the second MCU operation processing unit U3 constitute a second clock circuit, the second DC/DC power management unit U4, the first DC/DC power adjustment unit U1, the third clock circuit capacitor E3, the ninth clock circuit capacitor E9, the fourth clock circuit capacitor R4, the fourth resistor R4, the eighth DC/DC power management unit U4, the fourth clock circuit R4, the fifth clock circuit, the eighth clock circuit R2, the fourth capacitor C4, the fifth DC/DC power adjustment unit U4, the fourth capacitor C4, the fifth clock circuit C2, the sixth clock circuit C4, the fourth capacitor C2, the fifth DC/DC power management unit R2, the fifth DC power management unit C4, the sixth clock circuit, and the sixth clock circuit C4, the fifth DC power management unit C4, the output management circuit, the output management unit C4, and the output management circuit, the fourth DC power management circuit, the fourth DC/DC power management unit C4, and the fourth DC power management unit C4, the output management unit C4, and the fourth DC power management circuit, and the sixth power management unit C4;
as shown in fig. 4, the current detection general control component 3 includes a third MCU operation processing unit U5, a third DC/DC power management unit U6, a third quartz crystal oscillator Y3, an eleventh clock circuit capacitor C11, a twelfth clock circuit capacitor C12, a thirteenth clock circuit capacitor C13, a fourteenth clock circuit capacitor C14, a fifteenth clock circuit capacitor C15, a sixteenth clock circuit capacitor C16, a fifth electrolytic capacitor E5, a sixth electrolytic capacitor E6, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8 and a second inductor L2, the third MCU operation processing unit U5 is connected to each of the battery unit temperature detection components, the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12, the third quartz crystal oscillator Y3, the third MCU operation processing unit U5 form a third clock circuit, the third DC/DC power management unit U6, the fifth resistor R5, the fifth electrolytic capacitor E5, the fifth quartz crystal oscillator Y15, the fifteenth clock circuit capacitor C6, the sixteenth clock circuit capacitor R6, the sixteenth clock circuit output filter circuit C6, the fourteenth clock circuit output filter circuit C6, the sixth DC/DC power management unit C6, the sixteenth clock circuit R2, the sixth clock circuit output filter circuit C6, the sixth capacitor C6, the sixth inductor L2, the sixth capacitor C6, the sixth inductor L2, and the sixth inductor L2.
The first MCU arithmetic processing unit U1 comprises a domestic Enruien 8-bit singlechip with the model number EN8P72, the second MCU arithmetic processing unit U3 and/or the third MCU arithmetic processing unit U5 comprises a domestic Huada semiconductor integrated circuit 32-bit singlechip with the model number HC32F146 KATA; the first DC/DC power management unit U2, the second DC/DC power management unit U4 and/or the third DC/DC power management unit U6 comprise a Chinese large semiconductor integrated circuit DC/DC power manager with the model number of BL 8062; each single-bus temperature sensor comprises a Beijing Zhongke Galaxy core single-bus temperature sensor with the model of GX18B20 and 64-bit ID address codes, and chips adopted in the invention are all domestic chips, so that technical monopoly of other countries can be avoided.
Further, in the embodiment of the present invention, the number of the single bus temperature sensors corresponding to each battery pack temperature detection assembly is 20, which are RS01 to RS20, the number of the battery pack temperature detection assemblies corresponding to each battery unit temperature detection assembly is 20, which are CT01 to CT20, and the number of the battery unit temperature detection assemblies is 5, which are BT-D1 to BT-D5.
Further, as shown in fig. 2, the 1 st pin GND of each of the single-bus temperature sensors RS01-RS20 is connected to the ground GND, the 3 rd pin VDD of the single-bus temperature sensors RS1-RS20 is connected to the 3 rd pin power voltage stabilization output terminal of the first DC/DC power management unit U2, the 2 nd pin of the first single-bus temperature sensor RS1 is connected to the 27 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the second single-bus temperature sensor RS2 is connected to the 26 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the third single-bus temperature sensor RS3 is connected to the 25 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the fourth single-bus temperature sensor RS4 is connected to the 24 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of the fifth single-bus temperature sensor RS5 is connected to the 23 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin of a sixth single-bus temperature sensor RS6 is connected with the 22 nd pin of the first MCU operation processing unit U1, the 2 nd pin of a seventh single-bus temperature sensor RS7 is connected with the 21 st pin of the first MCU operation processing unit U1, the 2 nd pin of an eighth single-bus temperature sensor RS8 is connected with the 18 th pin of the first MCU operation processing unit U1, the 2 nd pin of a ninth single-bus temperature sensor RS9 is connected with the 17 th pin of the first MCU operation processing unit U1, the 2 nd pin of a tenth single-bus temperature sensor RS10 is connected with the 16 th pin of the first MCU operation processing unit U1, the 2 nd pin of an eleventh single-bus temperature sensor RS11 is connected with the 15 th pin of the first MCU operation processing unit U1, the 2 nd pin of a twelfth single-bus temperature sensor RS12 is connected with the 14 th pin of the first MCU operation processing unit U1, the 2 nd pin of a thirteenth single-bus temperature sensor RS13 is connected with the 13 th pin of the first MCU operation processing unit U1, the 2 nd pin of a fourteenth single-bus temperature sensor RS14 is connected with the 12 th pin of a first MCU operation processing unit U1, the 2 nd pin of a fifteenth single-bus temperature sensor RS15 is connected with the 11 th pin of the first MCU operation processing unit U1, the 2 nd pin of a sixteenth single-bus temperature sensor RS16 is connected with the 7 th pin of the first MCU operation processing unit U1, the 2 nd pin of a seventeenth single-bus temperature sensor RS17 is connected with the 6 th pin of the first MCU operation processing unit U1, the 2 nd pin of an eighteenth single-bus temperature sensor RS18 is connected with the 5 th pin of the first MCU operation processing unit U1, the 2 nd pin of a nineteenth single-bus temperature sensor RS19 is connected with the 4 th pin of the first MCU operation processing unit U1, the 2 nd pin of a twentieth single-bus temperature sensor RS20 is connected with the 3 rd pin of the first MCU operation processing unit U1, the 2 nd pin of the first MCU operation processing unit U1 is connected with the data input port of a second MCU operation processing unit U3 of a previous stage battery unit temperature detection assembly, and the Ct pin of a clock operation processing unit U1-01-k interface detection unit MCU operation processing unit U1 and a second stage detection unit MCU detection unit.
Furthermore, as shown in fig. 2, a first clock circuit capacitor C1, a second clock circuit capacitor C2, and a first quartz crystal oscillator Y1 are respectively connected to the 9 th pin and the 10 th pin of the first MCU arithmetic processing unit U1 to form a first crystal oscillation circuit with a frequency of 8MHz, a second electrolytic capacitor E2 and a fourth power management circuit pulse filter capacitor C4 are connected to the 3 rd pin of the first DC/DC power management unit U2 to form an output filter circuit, and a first electrolytic capacitor E1 and a third power management circuit pulse filter capacitor C3 are connected to the 1 st pin of the first DC/DC power management unit U2 to form an input filter circuit.
The working principle of the battery pack temperature detection assembly (layer C) 1 is that the single-bus temperature sensors RS1-RS20 adopt single-bus distributed temperature sensors of national Beijing Zhongke Galaxy core science and technology Limited company, the temperature measurement range of the single-bus temperature sensors is from-60 ℃ to +175 ℃, the precision is from 0.1 ℃ to 1 ℃, the resolution is from 9 bits to 16 bits, the 1 st pin GNG is connected with reference ground, the 3 rd pin VDD is connected with the 3 rd pin voltage stabilizing output end of the first DC/DC power supply management unit U2, the 2 nd pin of the first single-bus distributed temperature sensor RS1 is connected with the 27 th pin of the I/O port of the first MCU operation processing unit U1, the 2 nd pin of the second single-bus distributed temperature sensor RS2 is connected with the 26 th pin of the I/O port of the first MCU operation processing unit U1, the 2 nd pin of the third single-bus distributed temperature sensor RS3 is connected with the 25 th pin of the I/O port of the U1, a pin 2 of a fourth single-bus distributed temperature sensor RS4 is connected with a pin 24 of an I/O port of a first MCU operation processing unit U1, a pin 2 of a fifth single-bus distributed temperature sensor RS5 is connected with a pin 23 of an I/O port of the first MCU operation processing unit U1, a pin 2 of a sixth single-bus distributed temperature sensor RS6 is connected with a pin 22 of an I/O port of the first MCU operation processing unit U1, a pin 2 of a seventh single-bus distributed temperature sensor RS7 is connected with a pin 21 of an I/O port of the first MCU operation processing unit U1, a pin 2 of an eighth single-bus distributed temperature sensor RS8 is connected with a pin 18 of an I/O port of the first MCU operation processing unit U1, a pin 2 of a ninth single-bus distributed temperature sensor RS9 is connected with a pin 17 of an I/O port of the U1, a pin 2 of a tenth single-bus distributed temperature sensor RS10 is connected with a pin 16 of an I/O port of the first MCU operation processing unit U1, the 2 nd pin of an eleventh single-bus distributed temperature sensor RS11 is connected with the 15 th pin of an I/O port of U1, the 2 nd pin of a twelfth single-bus distributed temperature sensor RS12 is connected with the 14 th pin of an I/O port of a first MCU operation processing unit U1, the 2 nd pin of a thirteenth single-bus distributed temperature sensor RS13 is connected with the 13 th pin of an I/O port of the first MCU operation processing unit U1, the 2 nd pin of a fourteenth single-bus distributed temperature sensor RS14 is connected with the 12 th pin of an I/O port of the first MCU operation processing unit U1, the 2 nd pin of a fifteenth single-bus distributed temperature sensor RS15 is connected with the 11 th pin of an I/O port of the first MCU operation processing unit U1, the 2 nd pin of a sixteenth single-bus distributed temperature sensor RS16 is connected with the 7 th pin of an I/O port of the first MCU operation processing unit U1, the 2 nd pin of a seventeenth single-bus distributed temperature sensor RS17 is connected with the 6 th pin of an I/O port of the first MCU operation processing unit U1, a pin 2 of an eighteenth single-bus distributed temperature sensor RS18 is connected with a pin 5 of an I/O port of a first MCU operation processing unit U1, a pin 2 of a nineteenth single-bus distributed temperature sensor RS19 is connected with a pin 4 of an I/O port of the first MCU operation processing unit U1, a pin 2 of a twentieth single-bus distributed temperature sensor RS20 is connected with a pin 3 of an I/O port of the first MCU operation processing unit U1, a first clock circuit capacitor C1, a second clock circuit capacitor C2 and a first quartz crystal oscillator Y1 are respectively connected with a pin 9 and a pin 10 of the first MCU operation processing unit U1 to form an 8MHz crystal oscillator (namely a first clock circuit), a second electrolytic capacitor E2 and a fourth clock circuit capacitor C4 are connected with a pin 3 of a first DC/DC power supply management unit U2, an output filter circuit is formed, a first electrolytic capacitor E1 and a third clock circuit capacitor C3 are connected with a pin 1 of a first DC/DC power management unit U2 to form an input filter circuit, a pin 28 Ct1-01clock of the first MCU arithmetic processing unit U1 outputs a clock signal to the upper level (layer B), and a pin 2 Ct1-01data of the first MCU arithmetic processing unit U1 outputs a data signal to the upper level (layer B).
Furthermore, as shown in fig. 3, the 2 nd pin GND of each battery pack temperature detection component CT01-CT20 is connected to the ground GND, the 1 st pin VDD of each battery pack temperature detection component CT01-CT20 is connected to the voltage stabilization output of the voltage stabilization integrated circuit, and is connected to the fourth electrolytic capacitor E4, the third resistor R3, the first inductor L1 and the 1 st, 32 th, 33 th and 34 th pins of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the first battery pack temperature detection component CT01 is connected to the 7 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the first battery pack temperature detection component CT01 is connected to the 6 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the second battery pack temperature detection component CT02 is connected to the 5 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the second battery pack temperature detection component CT02 is connected with the 4 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the third battery pack temperature detection component CT03 is connected with the 3 rd pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the third battery pack temperature detection component CT03 is connected with the 2 nd pin of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01data of the fourth battery pack temperature detection component CT04 is connected with the 63 rd pin of the second MCU arithmetic processing unit U3, the 63 th pin CT-01clock of the fourth battery pack temperature detection component CT04 is connected with the 62 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fifth battery pack temperature detection component CT05 is connected with the 61 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifth battery pack temperature detection component CT05 is connected with the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the sixth battery pack temperature detection component CT06 is connected with the 59 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixth battery pack temperature detection component CT06 is connected with the 58 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the seventh battery pack temperature detection component CT07 is connected with the 57 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the seventh battery pack temperature detection component CT07 is connected with the 56 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the eighth battery pack temperature detection component CT08 is connected with the 55 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the eighth battery pack temperature detection component CT08 is connected with the 54 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the ninth battery pack temperature detection component CT09 is connected with the 53 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the ninth battery pack temperature detection component CT09 is connected with the 52 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the tenth battery pack temperature detection component CT10 is connected with the 51 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the tenth battery pack temperature detection component CT10 is connected with the 50 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the eleventh battery pack temperature detection component CT11 is connected with the 40 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the eleventh battery pack temperature detection component CT11 is connected with the 39 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the twelfth battery pack temperature detection component CT12 is connected with the 38 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the twelfth battery pack temperature detection component CT12 is connected with the second MCU operation processing unit U3 The 37-pin connection, the 3 rd pin At1-01data of the thirteenth battery pack temperature detection component CT13 is connected with the 36 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the thirteenth battery pack temperature detection component CT13 is connected with the 35 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the fourteenth battery pack temperature detection component CT14 is connected with the 29 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the fourteenth battery pack temperature detection component CT14 is connected with the 28 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the fifteenth battery pack temperature detection component CT15 is connected with the 27 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the fifteenth battery pack temperature detection component CT15 is connected with the 26 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the sixteenth battery pack temperature detection component CT16 is connected with the 25 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixteenth battery pack temperature detection component CT16 is connected with the 24 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the seventeenth battery pack temperature detection component CT17 is connected with the 23 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the seventeenth battery pack temperature detection component CT17 is connected with the 22 nd pin of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01data of the eighteenth battery pack temperature detection component CT18 is connected with the 21 st pin of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the eighteenth battery pack temperature detection component CC18 is connected with the 12 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the nineteenth battery pack temperature detection component CT19 is connected with the 11 th pin At1-01data of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the nineteenth battery pack temperature detection component CT19 is connected with the 10 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the twentieth battery pack temperature detection component CT20 is connected with the 9 th pin of the second MCU arithmetic processing unit U3, and the 4 th pin CT-01clock of the twentieth battery pack temperature detection component CT20 is connected with the 8 th pin of the second MCU arithmetic processing unit U3.
Furthermore, as shown in fig. 3, a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a second quartz crystal oscillator Y2, a 17 th pin and a 18 th pin of the second MCU arithmetic processing unit U3 form a second clock circuit with a frequency of 8MHz, a 48 th pin of the second MCU arithmetic processing unit U3 is connected to the clock output interface terminal, a 49 th pin of the second MCU arithmetic processing unit U3 is connected to the data output interface terminal, a 3 rd pin of the second DC/DC power management unit U4, the first resistor R1, the third electrolytic capacitor E3, and the ninth clock circuit capacitor C9 form an input filter circuit, a 2 nd pin of the second DC/DC power management unit U4, the first inductor L1, and the tenth clock circuit capacitor C10 form a filter circuit, a third resistor R3, a fourth resistor R4, the second resistor R2, and a 4 th pin of the second DC/DC power management unit U4 form a voltage output adjustment circuit, and a fourth electrolytic capacitor E2 and an eighth clock circuit capacitor C8 form an output filter circuit.
The working principle of the battery unit temperature detection assembly (B layer) 2 is that the 2 nd pin GND of the battery pack temperature detection assembly CT01-CT20 is connected with the reference ground, the 1 st pin VDD of the battery pack temperature detection assembly CT01-CT20 is connected with the 1 st pin, the 32 th pin, the 33 th pin and the 34 th pin of the second MCU arithmetic processing unit U3, the voltage stabilization output of the second DC/DC power supply management unit U4 passes through the other end of an inductor L1 ripple filter inductor, the 3 rd pin At1-01data of the first battery pack temperature detection assembly CT01 is connected with the 7 th pin of an I/O port of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the first battery pack temperature detection assembly CT01 is connected with the 6 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the second battery pack temperature detection assembly CT02 is connected with the 5 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the second battery pack temperature detection component CT02 is connected with the 4 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the third battery pack temperature detection component CT03 is connected with the 3 rd pin of the I/O port of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the third battery pack temperature detection component CT03 is connected with the 2 nd pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01 of the fourth battery pack temperature detection component CT04 is connected with the 63 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fourth battery pack temperature detection component CT04 is connected with the 62 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01 clock of the fifth battery pack temperature detection component CT05 is connected with the 61 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifth battery pack temperature detection component CT05 is connected with the 60 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the sixth battery pack temperature detection component CT06 is connected with the 59 th pin of the I/O port of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the sixth battery pack temperature detection component CT06 is connected with the 58 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin At1-01 of the seventh battery pack temperature detection component CT07 is connected with the 57 th pin of the I/O port of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the seventh battery pack temperature detection component CT07 is connected with the 56 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the eighth battery pack temperature detection component CT08 is connected with the 55 th pin of the I/O port of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the eighth battery pack temperature detection component CT08 is connected with the 54 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the ninth battery pack temperature detection component CT09 is connected with the 53 th pin of the I/O port of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the ninth battery pack temperature detection component CT09 is connected with the 52 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin At1-01 of the tenth battery pack data detection component CT10 is connected with the 51 th pin of the I/O port of the second MCU operation processing unit U3, the 3 rd pin CT-01clock of the tenth battery pack temperature detection component CT10 is connected with the 50 th pin of the I/O port of the second MCU operation processing unit U3, the 2 nd pin CT1-01clock of the eleventh battery pack temperature detection component CT11 is connected with the 40 th pin of the I/O port of the second MCU operation processing unit U3, a 3 rd pin CT-01clock of an eleventh battery pack temperature detection component CT11 is connected with a 39 th pin of an I/O port of the second MCU operation processing unit U3, a 2 nd pin At1-01data of a twelfth battery pack temperature detection component CT12 is connected with a 38 th pin of an I/O port of the second MCU operation processing unit U3, a 3 rd pin CT-01clock of a twelfth battery pack temperature detection component CT12 is connected with a 37 th pin of an I/O port of the second MCU operation processing unit U3, a 2 nd pin At1-01 of a thirteenth battery pack temperature detection component CT13 is connected with a 36 th pin of an I/O port of the second MCU operation processing unit U3, a 3 rd pin CT-01clock of the thirteenth battery pack temperature detection component CT13 is connected with a 35 th pin of an I/O port of the second MCU operation processing unit U3, a 2 nd pin CT1-01data of a fourth battery pack temperature detection component CT14 is connected with a 29 th pin of the I/O port of the second MCU operation processing unit U3, a 3 rd pin CT-01clock of a fourteenth battery pack temperature detection component CT14 is connected with a 28 th pin of an I/O port of the second MCU arithmetic processing unit U3, a 2 nd pin At1-01data of a fifteenth battery pack temperature detection component CT15 is connected with a 27 th pin of an I/O port of the second MCU arithmetic processing unit U3, a 3 rd pin CT-01clock of a fifteenth battery pack temperature detection component CT15 is connected with a 26 th pin of an I/O port of the second MCU arithmetic processing unit U3, a 2 nd pin At1-01 of a sixteenth battery pack temperature detection component CT16 is connected with a 25 th pin of an I/O port of the second MCU arithmetic processing unit U3, a 3 rd pin CT-01clock of a sixteenth battery pack temperature detection component CT16 is connected with a 24 th pin of an I/O port of the second MCU arithmetic processing unit U3, a 2 nd pin At1-01 clock of a seventeenth battery pack temperature detection component CT17 is connected with a 23 th pin of an I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the seventeenth battery pack temperature detection component CT17 is connected with the 22 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01DATA of the eighteenth battery pack temperature detection component CT18 is connected with the 21 st pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the eighteenth battery pack temperature detection component CT18 is connected with the 12 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01DATA of the nineteenth battery pack temperature detection component CT19 is connected with the 11 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the CT19 battery pack is connected with the 10 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01DATA of the twentieth battery pack temperature detection component CT20 is connected with the 9 th pin of the I/O port of the second MCU arithmetic processing unit U3, the 3 rd pin CT-01clock of the twentieth battery pack temperature detection component CT20 is connected with the 8 th pin of the I/O port of the second MCU arithmetic processing unit U3, the fifth clock circuit capacitor C5, the sixth clock circuit capacitor C6 and the second quartz crystal oscillator Y2 are respectively connected with the 17 th pin and the 18 th pin of the second MCU arithmetic processing unit U3 to form an 8MHz crystal oscillator (i.e., a second clock circuit), the 49 th pin BT _ DATA of the I/O port of the second MCU arithmetic processing unit U3 transmits a DATA signal to the upper stage (layer a), and the 48 th pin BT _ clock of the I/O port of the second MCU arithmetic processing unit U3 transmits a clock signal to the upper stage.
Further, as shown in fig. 4, the 2 nd pin BT _ GND of each of the battery unit temperature detection assemblies BT-D1-BT-D5 is connected to the ground GND, the 1 st pin BT _ VCC of each of the battery unit temperature detection assemblies BT-D1-BT-D5 is connected to the voltage stabilization output of the voltage stabilization integrated circuit, the sixth electrolytic capacitor E6, the seventh resistor R7, the second inductor L2 and the 1 st, 32 th, 33 th and 34 th pins of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the first battery unit temperature detection assembly BT-D1 is connected to the 12 th pin of the third MCU arithmetic processing unit U5, the 4 th pin BC _ clock of the first battery unit temperature detection assembly BT-D1 is connected to the 11 th pin of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the second battery unit temperature detection assembly BT-D2 is connected to the 22 th pin BT _ DATA of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the second battery unit BT-D2 is connected to the third MCU arithmetic processing unit BT-D5, the third MCU 3 rd pin BC _ DATA of the third MCU arithmetic processing unit BT-D5 is connected to the third MCU 3 th pin BT-BC 3 th pin BT-D5, the third MCU arithmetic processing unit BT-BC 3 detection assembly BT-D5 is connected to the third MCU 3 th pin BC 3 detection unit BT-D5, the 4 th pin BC _ clock of the fifth battery cell temperature detection unit BT-D5 is connected to the 27 th pin of the third MCU arithmetic processing unit U5.
Furthermore, as shown in fig. 4, the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12, the third quartz crystal oscillator Y3 and the 17 th pin and the 18 th pin of the third MCU arithmetic processing unit U5 form a third clock circuit with a frequency of 8MHz, the 48 th pin display _ DATA of the third MCU arithmetic processing unit U5 is connected to the display driving output interface terminal, the 47 th pin display _ clock of the third MCU arithmetic processing unit U5 is connected to the display clock interface terminal, the 46 th pin control _ DATA of the third MCU arithmetic processing unit U5 is connected to the control DATA port, the 45 th pin control _ clock of the third MCU arithmetic processing unit U5 is connected to the control clock terminal, the 44 th pin drive _ DATA of the third MCU arithmetic processing unit U5 is connected to the driving DATA port, and the 43 th pin drive _ clock of the third MCU arithmetic processing unit U5 is connected to the driving clock terminal.
The current sensing general control unit 3 operates on the principle that the 2 nd pin BT _ GND of the battery unit temperature sensing assembly BT-D1-BT-D5 is connected to ground, the 1 st pin BT _ VCC of the battery unit temperature sensing assembly BT-D1-BT-D5 is connected to the 1 st pin, the 32 nd, 33 th and 34 th pins of the third MCU arithmetic processing unit U5, the third DC/DC power management unit U6 outputs a regulated voltage via the other end of the second inductor L2 ripple filter inductor, the 3 rd pin BT _ DATA of the first battery unit temperature sensing assembly BT-D1 is connected to the 12 th pin of the I/O port of the third MCU arithmetic processing unit U5, the 4 th pin BT _ DATA of the first battery unit temperature sensing assembly BT-D1 is connected to the 11 th pin of the I/O port of the third MCU arithmetic processing unit U5, the 3 rd pin BT _ DATA of the first battery unit temperature sensing assembly BT-D2 is connected to the I/O port of the third MCU arithmetic processing unit U5, the 3 rd pin BT _ DATA of the third MCU port BT _ DATA of the first battery unit BT-D2 is connected to the I/O port of the third MCU arithmetic processing unit BT 4 _ DATA processing unit BT 3, the third MCU port BT _ DATA of the first battery unit BT-D5 is connected to the I/O port of the MCU arithmetic processing unit BT 4I/O port BT _ DATA of the MCU arithmetic processing unit 23, the third MCU arithmetic processing unit BT _ DATA of the MCU arithmetic processing unit BT 4 detection assembly BT _ DATA is connected to the third MCU temperature sensing unit BT _ DATA, the third MCU temperature sensing assembly BT _ D22, the third MCU temperature sensing assembly BT-D5 is connected to the third MCU temperature sensing unit BT _ DATA of the MCU temperature sensing assembly BT _ D22, the third MCU temperature sensing unit BT _ D22, the third MCU port BT _ DATA is connected to the MCU port BT _ D22, the third MCU port BT _ DATA of the MCU port BT _ D5 is connected to the MCU port of the MCU temperature sensing unit BT _ D5 is connected to the MCU port BT-D23, the MCU port of the MCU port BT _ D23, the MCU port of the MCU temperature sensing assembly BT _ DATA of the MCU temperature sensing unit BT _ D23, the MCU temperature sensing unit BT _ DATA of the MCU temperature sensing unit BT _ D22, the MCU port of the MCU temperature sensing assembly BT _ D24 is connected to the MCU temperature sensing unit BT _ D22, the MCU temperature sensing unit BT _ D21, a third pin BT _ DATA of the first battery unit temperature detection assembly BT-D5 is connected to a 28 th pin of an I/O port of the third MCU arithmetic processing unit U5, a fourth pin BT _ clock of the first battery unit temperature detection assembly BT-D5 is connected to a 27 th pin of an I/O port of the third MCU arithmetic processing unit U5, an eleventh clock circuit capacitor C11, a twelfth clock circuit capacitor C12, and a third quartz crystal oscillator Y3 are respectively connected to a 17 th pin and an 18 th pin of the third MCU arithmetic processing unit U5 to form an 8MHz crystal oscillator (i.e., a third clock circuit), a fifth electrolytic capacitor E5, a fifteenth clock circuit capacitor C15, and a third DC/DC power management unit U6 input filter, a sixth electrolytic capacitor E6, a fourteenth clock circuit capacitor C14, and a second inductor L2 output filter, a fifth pin display _ DATA of an I/O port of the third MCU arithmetic processing unit U5 is connected to a display module, a third pin DATA display module is connected to a DATA output driver of a third MCU output driver of an I/O port of the third MCU arithmetic processing unit U5, and a third clock circuit controller output driver of the MCU control unit U5 is connected to a display module 46.
As described above, in the embodiment of the present invention, one single battery pack (C layer) is composed of 20 single batteries, the B layer includes 20 single battery packs (20 × 20=400 single batteries), and the a layer includes 5 battery units (400 × 5=2000 single batteries), and the number of single batteries is actually increased or decreased according to the design situation. For example, the 12 th pins of the first MCU operation processing unit U1, the second MCU operation processing unit U3, and the third MCU operation processing unit U5 detect temperature abnormality, and at the same time, judge that a plurality of batteries in the single battery in the C layer have temperature abnormality according to the data coding sequence, and perform permission operation processing through the first MCU operation processing unit U1, the second MCU operation processing unit U3, and the third MCU operation processing unit U5 to control the driving output module to perform relevant decision control processing.
Further, data and clock signals are transmitted between the battery pack temperature detection assembly and the battery unit temperature detection assembly through the first MCU operation processing unit U1 and the second MCU operation processing unit U3, and data and clock signals are transmitted between the battery unit temperature detection assembly and the current detection general control assembly through the second MCU operation processing unit U3 and the third MCU operation processing unit U5.
In a charging mode, a 46 th pin data control interface and a 45 th pin clock interface of I/O ports of a first MCU operation processing unit U1, a second MCU operation processing unit U3 and a third MCU operation processing unit U5 receive a charging instruction sent by a whole vehicle controller when charging is started, 11 th pins, 12 th pins and 21 st pins to 28 th pins of the I/O ports of the third MCU operation processing unit U5 of a layer A detect temperature data information from a layer B, similarly, 2 nd pins to 12 th pins, 21 st pins to 29 th pins, 35 th pins to 40 th pins, 50 th pins to 63 th pins of the I/O ports of the second MCU operation processing unit U3 of the layer B detect temperature data information from the layer C, 3 rd pins to 7 th pins, 11 th pins to 18 th pins, 21 st pins to 27 th pins of the I/O ports of the first MCU operation processing unit U1 of the layer C acquire single-battery temperature data variable RS20 information embedded in a single-wire temperature sensor. And the third MCU operation processing unit U5 on the layer A performs operation, processing and decision making according to the condition that the temperature rise is influenced by the current, transmits a quick charging instruction in real time through a 43 th pin and a 44 th pin, simultaneously sends matrix display information of the real-time current and the temperature to the display module through a 47 th pin and a 48 th pin, can also display vector graphic information through operation processing, and can also quickly process and close the charging system for the abnormal condition generated in the middle.
In a running discharge mode, the monitoring and control principle of the electric vehicle battery matrix temperature monitoring and control system is that a vehicle control unit sends a running discharge command through a 46 th pin data control interface and a 45 th pin clock port of an I/O port of a third MCU operation processing unit U5 of a layer A, the 11 th pin, the 12 th pin, the 21 st pin to the 28 th pin of the I/O port of the third MCU operation processing unit U5 of the layer A detect temperature data information from the layer B, similarly, the 2 nd pin to the 12 th pin, the 21 st pin to the 29 th pin, the 35 th pin to the 40 th pin, the 50 th pin to the 63 th pin detect temperature data information from the layer C, and the 3 rd pin to the 7 th pin, the 11 th pin to the 18 th pin, the 21 st pin to the 27 th pin acquire temperature coding digital information of single bus temperature sensor variables RS1 to RS20 embedded in a single battery. The third MCU operation processing unit U5 of the A layer sends real-time current and temperature matrix display information to the display module through the 47 th pin and the 48 th pin according to the temperature rise condition caused by the current, and vector graphic information can also be displayed through operation processing, so that maximum guarantee is provided for safe driving.
Under a parking mode, the monitoring and controlling principle of the electric vehicle battery matrix temperature monitoring and controlling system is that a layer A can automatically enter a system monitoring and testing state, temperature data information from a layer B is detected through a pin 11, a pin 12, a pin 21 to a pin 28 of an I/O port of a third MCU operation processing unit U5 of the layer A, temperature data information from a layer C is detected through a pin 2 to a pin 12, a pin 21 to a pin 29, a pin 35 to a pin 40, a pin 50 to a pin 63 of an I/O port of a second MCU operation processing unit U3 of the layer B, and temperature coding digital information of single bus temperature sensor variables RS1 to RS20 embedded in a single battery is collected through a pin 3 to a pin 7, a pin 11 to a pin 18 and a pin 21 to a pin 27 of an I/O port of a first MCU operation processing unit U1 of the layer C. And the third MCU operation processing unit U5 on the layer A uploads data according to the current and temperature fluctuation conditions, and an E-Call rescue instruction can be automatically sent out for sudden short circuit, so that the loss is reduced to the maximum extent.
According to the temperature monitoring and controlling system for the battery matrix of the electric automobile, which is provided by the embodiment of the invention, the temperature of a single battery caused by current factors can be monitored and controlled for 24 hours in a charging mode, a discharging mode and a parking mode through the battery pack temperature detecting assembly, the battery unit temperature detecting assembly and the current detection master control assembly which are vertically arranged, so that the charging current can be adjusted in real time during quick charging, and the safety and the service life of the battery are ensured; the chips are all domestic chips, so that technical monopoly of other countries can be avoided.
It should be understood that the division of the components of the electric vehicle battery matrix temperature monitoring control system shown in fig. 1 is only a division of logical functions, and the actual implementation may be wholly or partially integrated into one physical entity or physically separated. And these components may all be implemented in software invoked by a processing element; or may be implemented entirely in hardware; and part of the components can be realized in the form of calling by the processing element in software, and part of the components can be realized in the form of hardware. For example, a certain module may be a separately established processing element, or may be integrated into a certain chip of the electronic device. Other components are implemented similarly. In addition, all or part of the components can be integrated together or can be independently realized. In implementation, the above components may be implemented by integrated logic circuits of hardware or instructions in the form of software in the processor element.
Thus, various embodiments of the present disclosure have been described in detail. Some details that are well known in the art have not been described in order to avoid obscuring the concepts of the present disclosure. It will be fully apparent to those skilled in the art from the foregoing description how to practice the presently disclosed embodiments.
Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that various changes may be made in the above embodiments or equivalents may be substituted for elements thereof without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims (9)

1. The utility model provides an electric automobile battery matrix temperature monitoring control system which characterized in that includes:
a plurality of battery package temperature detect subassembly, a plurality of battery unit temperature detect subassembly and the total subassembly of temperature detection, each battery unit temperature detect subassembly and a plurality of battery package temperature detect subassembly is connected, the total subassembly of temperature detection and each battery unit temperature detect subassembly is connected, wherein:
each battery pack temperature detection assembly comprises a first MCU (microprogrammed control unit) operation processing unit U1, a first DC/DC power supply management unit U2, a first electrolytic capacitor E1, a second electrolytic capacitor E2, a plurality of single batteries, a plurality of single bus temperature sensors embedded in the single batteries respectively, a first clock circuit capacitor C1, a second clock circuit capacitor C2, a first quartz crystal oscillator Y1, a first power supply management circuit pulse filter capacitor C3 and a second power supply management circuit pulse filter capacitor C4, wherein each single bus temperature sensor is connected with a reference ground, the first MCU operation processing unit U1 and the first DC/DC power supply management unit U2 respectively, the first clock circuit capacitor C1, the second clock circuit capacitor C2, the first quartz crystal oscillator Y1 and the first MCU operation processing unit U1 form a first clock circuit, the first DC/DC power supply management unit U2, the first electrolytic capacitor E1 and the first power supply management circuit capacitor C3 form an input power supply management circuit, the second DC/DC power supply management unit U2 and the second power supply management circuit output power supply management unit U4 form an output power supply management circuit;
each battery unit temperature detection assembly comprises a second MCU operation processing unit U3, a second DC/DC power supply management unit U4, a second quartz crystal oscillator Y2, a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a seventh clock circuit capacitor C7, an eighth clock circuit capacitor C8, a ninth clock circuit capacitor C9, a tenth clock circuit capacitor C10, a third electrolytic capacitor E3, a fourth electrolytic capacitor E4, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4 and a first inductor L1, the second MCU operation processing unit U3 is respectively connected with each battery pack temperature detection assembly, the fifth clock circuit capacitor C5, the sixth clock circuit capacitor C6, the second quartz crystal oscillator Y2 and the second MCU operation processing unit U3 constitute a second clock circuit, the second DC/DC power management unit U4, the first resistor R1, the third electrolytic capacitor E3 and the ninth clock circuit capacitor C9 constitute an input filter circuit, the second DC/DC power management unit U4, the first inductor L1 and the tenth clock circuit capacitor C10 constitute a filter circuit, the third resistor R3, the fourth resistor R4, the second resistor R2 and the second DC/DC power management unit U4 constitute a voltage output adjustment circuit, and the fourth electrolytic capacitor E4 and the eighth clock circuit capacitor C8 constitute an output filter circuit;
the temperature detection master control assembly comprises a third MCU operation processing unit U5, a third DC/DC power supply management unit U6, a third quartz crystal oscillator Y3, an eleventh clock circuit capacitor C11, a twelfth clock circuit capacitor C12, a thirteenth clock circuit capacitor C13, a fourteenth clock circuit capacitor C14, a fifteenth clock circuit capacitor C15, a sixteenth clock circuit capacitor C16, a fifth electrolytic capacitor E5, a sixth electrolytic capacitor E6, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8 and a second inductor L2, the third MCU operation processing unit U5 is respectively connected with the battery unit temperature detection assemblies, the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12, the third quartz crystal oscillator Y3, the third MCU operation processing unit U5, a third clock circuit, the third DC/DC power supply management unit U6, the fifth resistor R5, the fifth electrolytic capacitor E5, the fifteenth clock circuit capacitor C15, the sixth clock circuit capacitor C6, the sixteenth clock circuit capacitor R6, the eighth resistor R8 and the second inductor L2, the third DC/DC power supply management unit U6, the sixteenth DC/DC power supply management unit U6, the sixth DC/DC power supply management circuit, the sixth filter circuit output circuit, the sixth filter circuit R6, the sixth capacitor R6, the sixth filter circuit R6, the sixth capacitor R2 and the sixth filter circuit output circuit R6,
the battery pack temperature detection assembly and the battery unit temperature detection assembly transmit data and clock signals through the first MCU operation processing unit U1 and the second MCU operation processing unit U3, and the battery unit temperature detection assembly and the temperature detection master control assembly transmit data and clock signals through the second MCU operation processing unit U3 and the third MCU operation processing unit U5.
2. The system for monitoring and controlling the temperature of the battery matrix of the electric automobile according to claim 1, wherein the first MCU arithmetic processing unit U1 comprises a domestic Entrine 8-bit singlechip of type EN8P72, the second MCU arithmetic processing unit U3 and/or the third MCU arithmetic processing unit U5 comprises a domestic Hua big semiconductor integrated circuit 32-bit singlechip of type HC32F146 KATA; the first DC/DC power management unit U2, the second DC/DC power management unit U4 and/or the third DC/DC power management unit U6 comprise a Chinese large semiconductor integrated circuit DC/DC power manager with the model number of BL 8062; each single-bus temperature sensor comprises a single-bus temperature sensor of the Beijing Zhongke Galaxy Cornaceae with the model number GX18B20, and has 64-bit ID address codes.
3. The system according to claim 2, wherein the number of the single bus temperature sensors corresponding to each battery pack temperature detection assembly is 20, and is RS01-RS20, the number of the battery pack temperature detection assemblies corresponding to each battery unit temperature detection assembly is 20, and is CT01-CT20, and the number of the battery unit temperature detection assemblies is 5, and is BT-D1-BT-D5.
4. The system according to claim 3, wherein the 1 st pin GND of each of the single-bus temperature sensors RS01-RS20 is connected to ground GND, the 3 rd pin VDD of the single-bus temperature sensors RS01-RS20 is connected to the 3 rd pin power supply voltage stabilization output terminal of the first DC/DC power management unit U2, the 2 nd pin 2 of the first single-bus temperature sensor RS1 is connected to the 27 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin 2 of the second single-bus temperature sensor RS2 is connected to the 26 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin 2 of the third single-bus temperature sensor RS3 is connected to the 25 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin 2 of the fourth single-bus temperature sensor RS4 is connected to the 24 th pin of the first MCU arithmetic processing unit U1, the 2 nd pin 2 of the fifth single-bus temperature sensor RS5 is connected to the 23 th pin of the first MCU arithmetic processing unit U1, the thirteenth pin 2 of the sixth single-bus temperature sensor RS6 is connected to the eleventh pin RS1 of the first MCU arithmetic processing unit U1, the eleventh pin 18 th pin RS1 is connected to the first single-bus temperature sensor RS1, the ninth single-sixth pin RS10 of the first MCU arithmetic processing unit U1, the ninth single-sixth single-bus temperature sensor RS1 is connected to the fifth single-bus temperature sensor RS16, the 2 nd pin of a fourteenth single-bus temperature sensor RS14 is connected with the 12 th pin of a first MCU operation processing unit U1, the 2 nd pin of a fifteenth single-bus temperature sensor RS15 is connected with the 11 th pin of the first MCU operation processing unit U1, the 2 nd pin of a sixteenth single-bus temperature sensor RS16 is connected with the 7 th pin of the first MCU operation processing unit U1, the 2 nd pin of a seventeenth single-bus temperature sensor RS17 is connected with the 6 th pin of the first MCU operation processing unit U1, the 2 nd pin of an eighteenth single-bus temperature sensor RS18 is connected with the 5 th pin of the first MCU operation processing unit U1, the 2 nd pin of a nineteenth single-bus temperature sensor RS19 is connected with the 4 th pin of the first MCU operation processing unit U1, the 2 nd pin of a twentieth single-bus temperature sensor RS20 is connected with the 3 rd pin of the first MCU operation processing unit U1, the 2 nd pin of the first MCU operation processing unit U1 is connected with the data operation processing unit Ct input port of a second MCU operation processing unit U3-01-order MCU operation processing unit, and the data processing unit Ct interface U1-01-Ct data processing unit Ct interface unit Ct and a second MCU operation processing unit Ct interface 28.
5. The system for monitoring and controlling the temperature of the battery matrix of the electric automobile according to claim 4, wherein a first clock circuit capacitor C1, a second clock circuit capacitor C2 and a first quartz crystal oscillator Y1 are respectively connected with a pin 9 and a pin 10 of a first MCU arithmetic processing unit U1 to form a first crystal oscillation circuit with the frequency of 8MHz, a second electrolytic capacitor E2 and a fourth power management circuit pulse filter capacitor C4 are connected with a pin 3 of a first DC/DC power management unit U2 to form an output filter circuit, and a first electrolytic capacitor E1 and a third power management circuit pulse filter capacitor C3 are connected with a pin 1 of the first DC/DC power management unit U2 to form an input filter circuit.
6. The system for monitoring and controlling the battery matrix temperature of the electric vehicle according to claim 3, wherein the 2 nd pin GND of each battery pack temperature detecting component CT01-CT20 is connected to the ground GND, the 1 st pin VDD of each battery pack temperature detecting component CT01-CT20 is connected to the voltage stabilizing integrated circuit for stabilizing the voltage and outputting, and is connected to the fourth electrolytic capacitor E4, the third resistor R3, the first inductor L1 and the 1 st, 32 th, 33 th and 34 th pins of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01 of the first battery pack temperature detecting component CT01 is connected to the 7 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the first battery pack temperature detecting component CT01 is connected to the 6 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the second battery pack temperature detecting component CT02 is connected to the 5 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the second battery pack temperature detection component CT02 is connected with the 4 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the third battery pack temperature detection component CT03 is connected with the 3 rd pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the third battery pack temperature detection component CT03 is connected with the 2 nd pin of the second MCU arithmetic processing unit U3, the 2 nd pin At1-01data of the fourth battery pack temperature detection component CT04 is connected with the 63 rd pin of the second MCU arithmetic processing unit U3, the 63 th pin CT-01clock of the fourth battery pack temperature detection component CT04 is connected with the 62 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fifth battery pack temperature detection component CT05 is connected with the 61 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifth battery pack temperature detection component CT05 is connected with the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the sixth battery pack temperature detection component CT06 is connected with the 59 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixth battery pack temperature detection component CT06 is connected with the 58 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the seventh battery pack temperature detection component CT07 is connected with the 57 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the seventh battery pack temperature detection component CT07 is connected with the 56 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the eighth battery pack temperature detection component CT08 is connected with the 55 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the eighth battery pack temperature detection component CT08 is connected with the 54 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the ninth battery pack temperature detection component CT09 is connected with the 53 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the ninth battery pack temperature detection component CT09 is connected with the 52 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the tenth battery pack temperature detection component CT10 is connected with the 51 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the tenth battery pack temperature detection component CT10 is connected with the 50 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the eleventh battery pack temperature detection component CT11 is connected with the 40 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the eleventh battery pack temperature detection component CT11 is connected with the 39 th pin of the second MCU operation processing unit U3, the 3 rd pin At1-01data of the twelfth battery pack temperature detection component CT12 is connected with the 38 th pin of the second MCU operation processing unit U3, the 4 th pin CT-01clock of the twelfth battery pack temperature detection component CT12 is connected with the second MCU operation processing unit U3 37 pins are connected, the 3 rd pin At1-01data of the thirteenth battery pack temperature detection component CT13 is connected with the 36 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the thirteenth battery pack temperature detection component CT13 is connected with the 35 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fourteenth battery pack temperature detection component CT14 is connected with the 29 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fourteenth battery pack temperature detection component CT14 is connected with the 28 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the fifteenth battery pack temperature detection component CT15 is connected with the 27 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the fifteenth battery pack temperature detection component CT15 is connected with the 26 th pin of the second MCU arithmetic processing unit U3, the 4 th pin CT-01clock of the sixteenth battery pack temperature detection component CT16 is connected with the seventeenth battery pack temperature detection component CT1-01clock of the seventeenth battery pack temperature detection component CT 3, the seventeenth battery pack temperature detection component CT16 is connected with the seventeenth battery pack temperature detection component MCU arithmetic processing unit U3, the seventeenth pin CT 18-17, the seventeenth pin CT16 of the seventeenth battery pack temperature detection component CT16 is connected with the second MCU arithmetic processing unit U3, the seventeenth battery pack temperature detection component CT16 of the seventeenth battery pack CT16, the 4 th pin CT-01clock of the nineteenth battery pack temperature detection component CT19 is connected with the 10 th pin of the second MCU arithmetic processing unit U3, the 3 rd pin At1-01data of the twentieth battery pack temperature detection component CT20 is connected with the 9 th pin of the second MCU arithmetic processing unit U3, and the 4 th pin CT-01clock of the twentieth battery pack temperature detection component CT20 is connected with the 8 th pin of the second MCU arithmetic processing unit U3.
7. The system for monitoring and controlling the temperature of the battery matrix of the electric automobile according to claim 6, wherein a fifth clock circuit capacitor C5, a sixth clock circuit capacitor C6, a second quartz crystal oscillator Y2, a 17 th pin and a 18 th pin of a second MCU arithmetic processing unit U3 form a second clock circuit with a frequency of 8MHz, a 48 th pin of the second MCU arithmetic processing unit U3 is connected to a clock output interface terminal, a 49 th pin of the second MCU arithmetic processing unit U3 is connected to a data output interface terminal, a 3 rd pin of a second DC/DC power management unit U4, a first resistor R1, a third electrolytic capacitor E3 and a ninth clock circuit capacitor C9 form an input filter circuit, a 2 nd pin of the second DC/DC power management unit U4, a first inductor L1, a tenth clock circuit capacitor C10 form a filter circuit, a third resistor R3, a fourth resistor R4, a second resistor R2, a 4 th pin of the second DC/DC power management unit U4, a fourth resistor R4, a fourth capacitor E4, and an eighth clock circuit capacitor C8.
8. The system as claimed in claim 3, wherein the 2 nd pin BT _ GND of each battery cell temperature detecting assembly BT-D1-BT-D5 is connected to ground GND, the 1 st pin BT _ VCC of each battery cell temperature detecting assembly BT-D1-BT-D5 is connected to the voltage stabilizing IC for voltage stabilizing output, and is connected to the sixth electrolytic capacitor E6, the seventh resistor R7, the second inductor L2 and the 1 st pin, the 32 nd pin, the 33 rd pin and the 34 th pin of the third MCU processing unit U5, the 3 rd pin BC _ DATA of the first battery cell temperature detecting assembly BT-D1 is connected to the 12 th pin of the third MCU processing unit U5, the 4 th pin BC _ clock of the first battery cell temperature detecting assembly BT-D1 is connected to the 11 th pin of the third MCU processing unit U5, the 3 rd pin BC _ DATA of the second battery cell temperature detecting assembly BT-D2 is connected to the MCU processing unit U5, the 4 th pin BC _ clock of the second battery unit temperature detection component BT-D2 is connected with the 21 st pin of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the third battery unit temperature detection component BT-D3 is connected with the 24 th pin of the third MCU arithmetic processing unit U5, the 4 th pin BC _ clock of the third battery unit temperature detection component BT-D3 is connected with the 23 rd pin of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the fourth battery unit temperature detection component BT-D4 is connected with the 26 th pin of the third MCU arithmetic processing unit U5, the 4 th pin BC _ clock of the fourth battery unit temperature detection component BT-D4 is connected with the 25 th pin of the third MCU arithmetic processing unit U5, the 3 rd pin BC _ DATA of the fifth battery unit temperature detection component BT-D5 is connected with the 28 th pin of the third MCU arithmetic processing unit U5 The 4 th pin BC _ clock of the fifth battery cell temperature detection unit BT-D5 is connected to the 27 th pin of the third MCU arithmetic processing unit U5.
9. The system as claimed in claim 8, wherein the eleventh clock circuit capacitor C11, the twelfth clock circuit capacitor C12 and the third quartz crystal oscillator Y3 form a third clock circuit with a frequency of 8MHz with the 17 th pin and the 18 th pin of the third MCU arithmetic processing unit U5, the 48 th pin display _ DATA of the third MCU arithmetic processing unit U5 is connected to the display driving output interface terminal, the 47 th pin display _ clock of the third MCU arithmetic processing unit U5 is connected to the display clock interface terminal, the 46 th pin control _ DATA of the third MCU arithmetic processing unit U5 is connected to the control DATA port, the 45 th pin control _ clock of the third MCU arithmetic processing unit U5 is connected to the control clock interface terminal, the 44 th pin drive _ DATA of the third MCU arithmetic processing unit U5 is connected to the driving DATA port, and the 43 th pin drive _ clock of the third MCU arithmetic processing unit U5 is connected to the driving clock interface terminal.
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