CN113459389B

CN113459389B - Mould device

Info

Publication number: CN113459389B
Application number: CN202011557499.8A
Authority: CN
Inventors: 石井努; 木村勇一; 岩桥正博
Original assignee: Sumitomo Heavy Industries Ltd
Current assignee: Sumitomo Heavy Industries Ltd
Priority date: 2020-03-30
Filing date: 2020-12-25
Publication date: 2023-08-04
Anticipated expiration: 2040-12-25
Also published as: CN113459389A; JP7379252B2; JP2021154695A

Abstract

The invention provides a technology for molding a hollow molded product by using a mold rotating together with a rotary table. A mold device for molding a hollow molded article including a 1 st divided article, a 2 nd divided article, and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold device including a 1 st punch, a 2 nd punch, a 1 st die, and a 2 nd die, the 1 st punch and the 2 nd die being attached to a platen of an injection molding machine, the 2 nd punch and the 1 st die being attached to a turntable of the injection molding machine disposed opposite to the platen, the 1 st die and the 2 nd die forming a 3 rd cavity space for molding the joining layer in a state in which the 1 st divided article and the 2 nd divided article are accommodated inside, the 1 st punch being attached to the 2 nd die so as to be movable or/and the 2 nd punch being attached to the 1 st die so as to be movable.

Description

Mould device

Technical Field

The present application claims priority based on japanese patent application No. 2020-059913 filed on 3 months of the year 2020. The entire contents of this japanese application are incorporated by reference into the present specification.

The present invention relates to a mold device.

Background

Patent document 1 discloses a mold device for molding a hollow molded article. The mold device has a fixed mold, a sliding mold, and a movable mold. The fixed mold is fixed to a fixed stage of the injection molding machine. The sliding die slides up and down in a state of being closely attached to the fixed die. The movable mold is mounted on a movable table of the injection molding machine. A male die and a female die are arranged on the contact surface of the sliding die and the movable die. In addition, a male die and a female die are also provided on the contact surface of the movable die with the slide die.

In the one-shot molding, a cavity is formed between a male die of a slide die and a female die of a movable die, and a cavity is formed between a female die of a slide die and a male die of a movable die. The 2 cavities are each filled with a molten resin, and the divided bodies of the hollow molded article are molded in each of the 2 cavities.

Then, the mold is opened. At this time, each of the 2 divided bodies was separated from the male mold and remained in the female mold. Then, the slide mold is slid, and the 2 divided bodies are opposed to each other. Then, the mold is closed, and the 2 divided bodies are butted with each other. A cavity is formed around the abutting surface of the 2 divided bodies.

In the secondary molding, a cavity is formed around the abutting surface of the 2 divided bodies, and the cavity is filled with a molten resin. As a result, 2 divided bodies were welded to each other, and 1 hollow molded article was molded. Then, the mold is opened, and the hollow molded article is taken out from the mold device.

Patent document 1: japanese patent publication No. 2-38377

As an injection molding machine, there is an injection molding machine having a rotary table. The mold is mounted on the rotary table, and rotates together with the rotary table.

Patent document 1 does not disclose molding a hollow molded article using a mold that rotates together with a rotary table.

Disclosure of Invention

An embodiment of the present invention provides a technique for molding a hollow molded article using a mold that rotates together with a turntable.

The mold device according to one embodiment of the present invention is a mold device for molding a hollow molded article including a 1 st divided article, a 2 nd divided article, and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold device including a 1 st punch, a 2 nd punch, a 1 st die, and a 2 nd die,

the 1 st male die and the 2 nd female die are arranged on a pressing plate of an injection molding machine,

the 2 nd male die and the 1 st female die are arranged on a rotary table of the injection molding machine, which is arranged opposite to the pressing plate,

the 1 st male die and the 1 st female die form a 1 st cavity space for forming the 1 st divided product,

the 2 nd male die and the 2 nd female die form a 2 nd cavity space for forming the 2 nd divided product,

the 1 st die and the 2 nd die form a 3 rd cavity space for forming the joint layer in a state that the 1 st divided product and the 2 nd divided product are accommodated in the inside,

the 1 st punch is movably mounted relative to the 2 nd die or/and the 2 nd punch is movably mounted relative to the 1 st die.

Effects of the invention

According to one embodiment of the present invention, a hollow molded article can be molded using a mold that rotates together with a turntable.

Drawings

Fig. 1 is a flowchart showing a method for manufacturing a hollow molded article using a mold device according to an embodiment.

Fig. 2 (a) is a cross-sectional view showing a state before S101 of the mold device according to one embodiment, and fig. 2 (B) is a cross-sectional view showing a state of S101 of the mold device according to one embodiment.

Fig. 3 (a) is a cross-sectional view showing a state of S102 of the mold device according to one embodiment, and fig. 3 (B) is a cross-sectional view showing a state of S103 of the mold device according to one embodiment.

Fig. 4 (a) is a cross-sectional view showing a state of S104 of the mold device according to one embodiment, and fig. 4 (B) is a cross-sectional view showing a state of S105 of the mold device according to one embodiment.

Fig. 5 (a) is a cross-sectional view showing a state of S106 of the mold device according to one embodiment, and fig. 5 (B) is a cross-sectional view showing a state of S107 of the mold device according to one embodiment.

Fig. 6 (a) is a cross-sectional view showing a state of S108 of the mold device according to one embodiment, and fig. 6 (B) is a cross-sectional view showing a state of S109 of the mold device according to one embodiment.

Fig. 7 (a) is a cross-sectional view showing a state before S101 of the mold device according to the modification, and fig. 7 (B) is a cross-sectional view showing a state of S101 of the mold device according to the modification.

Fig. 8 (a) is a cross-sectional view showing a state of S102 of the mold device according to the modification, and fig. 8 (B) is a cross-sectional view showing a state of S103 of the mold device according to the modification.

Fig. 9 (a) is a cross-sectional view showing a state of S104 of the mold device according to the modification, and fig. 9 (B) is a cross-sectional view showing a state of S105 of the mold device according to the modification.

Fig. 10 (a) is a cross-sectional view showing a state of S106 of the mold device according to the modification, and fig. 10 (B) is a cross-sectional view showing a state of S107 of the mold device according to the modification.

Fig. 11 (a) is a cross-sectional view showing a state of S108 of the mold device according to the modification, and fig. 11 (B) is a cross-sectional view showing a state of S109 of the mold device according to the modification.

In the figure: 1-die set, 11-1 st punch, 12-2 nd punch, 13-1 st die, 14-2 nd die, 18-2 nd punch moving mechanism, 19-1 st punch moving mechanism, 2-hollow molded article, 21-1 st divided article, 22-2 nd divided article, 23-joint layer, 3-injection molding machine, 32-fixed platen (platen), 33-rotary table.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding structures are denoted by the same reference numerals, and description thereof may be omitted.

Fig. 1 is a flowchart showing a method for manufacturing a hollow molded article using a mold device according to an embodiment. Fig. 2 (a) is a cross-sectional view showing a state before S101 of the mold device according to the embodiment. Fig. 2 (B) is a cross-sectional view showing a state of S101 of the mold device according to the embodiment. Fig. 3 (a) is a cross-sectional view showing a state of S102 of the mold device according to the embodiment. Fig. 3 (B) is a cross-sectional view showing a state of S103 of the mold device according to the embodiment. Fig. 4 (a) is a cross-sectional view showing a state of S104 of the mold device according to the embodiment. Fig. 4 (B) is a cross-sectional view showing a state of S105 of the mold device according to the embodiment. Fig. 5 (a) is a cross-sectional view showing a state of S106 of the mold device according to the embodiment. Fig. 5 (B) is a cross-sectional view showing a state of S107 of the mold device according to the embodiment. Fig. 6 (a) is a cross-sectional view showing a state of S108 of the mold device according to the embodiment. Fig. 6 (B) is a cross-sectional view showing a state of S109 of the mold device according to the embodiment.

In the present specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and the Y-axis direction represent horizontal directions, and the Z-axis direction represents vertical directions. When the mold clamping device 31 of the injection molding machine 3 is horizontal, the X-axis direction is the mold opening/closing direction.

As shown in fig. 6 (B), the mold device 1 is used for molding a hollow molded article 2. The hollow molded article 2 includes a 1 st divided article 21, a 2 nd divided article 22, and a joining layer 23 joining the 1 st divided article 21 and the 2 nd divided article 22. The 1 st divided product 21 includes a concave portion 21b on a joint surface 21a with the 2 nd divided product 22. The 2 nd divided product 22 also includes a concave portion 22b at the abutting surface 22a with the 1 st divided product 21. The hollow structure is formed by the concave portion 21b of the 1 st divided article 21 and the concave portion 22b of the 2 nd divided article 22. The bonding layer 23 is formed in a ring shape on the outer edges of the abutting surfaces 21a, 22a of the 1 st divided article 21 and the 2 nd divided article 22. The joining layer 23 welds the 1 st division 21 and the 2 nd division 22.

The mold device 1 includes a 1 st punch 11, a 2 nd punch 12, a 1 st die 13, and a 2 nd die 14. As shown in fig. 2 (B), the 1 st punch 11 and the 1 st die 13 form a 1 st cavity space 15 in which the 1 st divided product 21 is molded. The 2 nd punch 12 and the 2 nd die 14 form a 2 nd cavity space 16 in which the 2 nd divided product 22 is molded. The 1 st cavity space 15 and the 2 nd cavity space 16 are arranged at intervals in the Y-axis direction, for example. As shown in fig. 5 (a), the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17 of the mold joint layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated inside.

As shown in fig. 2 (a), the 1 st punch 11 and the 2 nd die 14 are mounted on a fixed platen 32. The fixed platen 32 is fixed to a frame not shown. On the other hand, the 2 nd punch 12 and the 1 st die 13 are mounted on the turntable 33. The rotary table 33 is disposed opposite to the fixed platen 32. The rotation shaft 33a of the rotation table 33 is arranged parallel to the mold opening/closing direction and is held by the movable platen 34 via a bearing Br. The movable platen 34 is provided so as to be movable in the mold opening and closing direction with respect to the frame, and is advanced and retracted with respect to the fixed platen 32. The mold device 1 is opened and closed by the advance and retreat of the movable platen 34.

The injection molding machine 3 includes: a mold clamping device 31 for opening and closing the mold device 1; a 1 st injection device 35 that injects a molding material into the mold device 1; and a 2 nd injection device 39 for injecting a molding material into the mold device 1.

The mold clamping device 31 performs mold closing, pressure increasing, mold clamping, pressure reducing, and mold opening of the mold device 1. The mold clamping device 31 is, for example, horizontal, and the mold opening/closing direction is horizontal. In the description of the mold clamping device 31, the moving direction of the movable platen 34 (for example, the positive X-axis direction) at the time of mold closing is set to the front, and the moving direction of the movable platen 34 at the time of mold opening is set to the rear.

The mold clamping device 31 includes: a fixed platen 32 on which the 1 st male die 11 and the 2 nd female die 14 are mounted; a rotary table 33 on which the 2 nd punch 12 and the 1 st die 13 are mounted; a movable platen 34 rotatably mounted with a rotary table 33; a rotation mechanism that rotates the rotary table 33; and a moving mechanism for advancing and retreating the movable platen 34 with respect to the fixed platen 32.

The fixed platen 32 is fixed to the frame. The 1 st punch 11 and the 2 nd die 14 are mounted on the opposite surfaces of the fixed platen 32 to the turntable 33. As shown in fig. 2 (B), the 1 st punch 11 forms a part of the wall surface of the 1 st cavity space 15. On the other hand, the 2 nd die 14 forms a part of the wall surface of the 2 nd cavity space 16.

The rotary table 33 is rotatably attached to the movable platen 34. The rotation center line R of the rotary table 33 is parallel to the mold opening/closing direction. The 2 nd punch 12 and the 1 st die 13 are attached to the opposite surfaces of the turntable 33 to the fixed platen 32. As shown in fig. 2 (B), the 2 nd punch 12 forms a part of the wall surface of the 2 nd cavity space 16. On the other hand, the 1 st cavity 13 forms a part of the wall surface of the 1 st cavity space 15.

The rotary table 33 is rotated between the 1 st rotation angle and the 2 nd rotation angle by a rotation mechanism. For example, as shown in fig. 2 (B), the 1 st rotation angle is a rotation angle at which the 1 st punch 11 and the 1 st die 13 form a 1 st cavity space 15 and the 2 nd punch 12 and the 2 nd die 14 form a 2 nd cavity space 16. The 1 st rotation angle is, for example, 0 °. On the other hand, as shown in fig. 5 (a), the 2 nd rotation angle is the rotation angle at which the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17. The 2 nd rotation angle is 180 °, for example.

The rotation direction of the rotation table 33 may be reversely rotated every time the rotation table 33 is rotated 180 °. For example, the rotary table 33 is rotated 180 ° clockwise and then rotated 180 ° counterclockwise. Since the arrangement of the wiring and piping fixed to the turntable 33 is restored as it is, the wiring and piping can be handled easily.

The movable platen 34 is disposed so as to be movable in the mold opening and closing direction with respect to the frame. When the movable platen 34 is advanced, the turntable 33 is advanced, and the 2 nd punch 12 and the 1 st die 13 are advanced. As a result, mold closing, pressure boosting, and mold closing are performed. On the other hand, when the movable platen 34 is retracted, the rotary table 33 is retracted, and the 2 nd punch 12 and the 1 st die 13 are retracted. As a result, the pressure was reduced and the mold was opened.

The mold clamping device 31 of the present embodiment is a horizontal type in which the mold opening and closing direction is a horizontal direction, but may be a vertical type in which the mold opening and closing direction is a vertical direction.

As shown in fig. 2 (B), the 1 st injection device 35 is in contact with the 1 st punch 11 of the mold device 1, and fills the 1 st cavity space 15 in the mold device 1 with the molding material. On the other hand, the 2 nd injection device 39 is in contact with the 2 nd cavity 14 of the mold device 1, and fills the molding material in the 2 nd cavity space 16 in the mold device 1.

The 1 st injection device 35 and the 2 nd injection device 39 are arranged with a gap therebetween in the Y-axis direction. This is because the 1 st cavity space 15 and the 2 nd cavity space 16 are arranged with a gap therebetween in the Y-axis direction. The molding material filled in the 1 st cavity space 15 by the 1 st injection device 35 and the molding material filled in the 2 nd cavity space 16 by the 2 nd injection device 39 may be different materials or the same materials.

The 1 st injection device 35 and the 2 nd injection device 39 are identical in structure. Therefore, the structure of the 1 st injection device 35 will be described below, and the description of the structure of the 2 nd injection device 39 will be omitted. In the description of the 1 st injection device 35, the movement direction (for example, the X-axis negative direction) of the screw 38 during filling is set to the front, and the movement direction (for example, the X-axis positive direction) of the screw 38 during metering is set to the rear, unlike the description of the mold clamping device 31.

The 1 st injection device 35 has, for example: a cylinder 36 for heating the molding material; a nozzle 37 provided at the front end of the cylinder 36; and a screw 38 rotatably and retractably disposed in the cylinder 36.

The cylinder 36 heats the molding material supplied to the inside. The molding material includes, for example, a resin. The molding material is formed into, for example, a pellet shape and supplied in a solid state. The cylinder 36 is divided into a plurality of regions in an axial direction (for example, an X-axis direction) of the cylinder 36. A heater and a temperature detector are provided in each of the plurality of areas. The heater is controlled so that the temperature detected by the temperature detector becomes the set temperature.

The nozzle 37 is provided at the front end of the cylinder 36 and is pressure-bonded to the die device 1. A heater and a temperature detector are provided on the outer periphery of the nozzle 37. The heater is controlled so that the detected temperature of the nozzle 37 becomes the set temperature.

The screw 38 is rotatably and retractably disposed in the cylinder 36. When the screw 38 is rotated, the molding material is conveyed forward along the spiral groove of the screw 38. The molding material is gradually melted by heat from the cylinder 36 while being conveyed forward. As the molding material in a liquid state is fed forward of the screw 38 and accumulated in the front portion of the cylinder 36, the screw 38 is retracted. When the screw 38 is advanced, the liquid molding material accumulated in front of the screw 38 is injected from the nozzle 37 and filled into the mold device 1.

The 1 st injection device 35 of the present embodiment is of a coaxial screw type, but may be of a screw type. The screw-type injection device supplies molding material melted in a plasticizing cylinder to an injection cylinder, and injects the molding material from the injection cylinder into a mold device. The screw is rotatably and non-advance and retreat disposed in the plasticizing cylinder, or rotatably and advance and retreat disposed. On the other hand, a plunger is disposed so as to be movable in and out of the injection cylinder.

The 1 st injection device 35 of the present embodiment is a horizontal type in which the axial direction of the cylinder 36 is horizontal, but may be a vertical type in which the axial direction of the cylinder 36 is vertical. The mold clamping device combined with the vertical type 1 st injection device 35 may be either vertical or horizontal. Similarly, the mold clamping device combined with the horizontal type 1 st injection device 35 may be horizontal or vertical.

Next, a method of manufacturing the hollow molded article 2 will be described with reference to fig. 1 to 6. The method for producing the hollow molded article 2 includes steps S101 to S109 shown in fig. 1. As shown in fig. 2 (a), before step S101, the mold opening of the mold device 1 is completed, the 1 st punch 11 is disposed to face the 1 st die 13, and the 2 nd punch 12 is disposed to face the 2 nd die 14. The rotation angle of the rotation table 33 is the 1 st rotation angle.

In step S101, as shown in fig. 2 (B), the movable platen 34 is advanced, and the 2 nd punch 12 and the 1 st die 13 are advanced, so that the mold is closed, boosted, and clamped. When the mold is closed, a 1 st cavity space 15 is formed by the 1 st punch 11 and the 1 st die 13, and a 2 nd cavity space 16 is formed by the 2 nd punch 12 and the 2 nd die 14.

The 1 st punch 11 has an abutment surface 11a for abutting against the 1 st die 13. The contact surface 11a is a flat surface perpendicular to the mold opening/closing direction. The 1 st punch 11 has a convex portion 11b on its abutment surface 11a. The size and shape of the concave portion 21b of the 1 st divided product 21 are determined by the size and shape of the convex portion 11b. The 1 st punch 11 has an annular portion 11c on its contact surface 11a. The partial size and shape of the bonding layer 23 are determined by the size and shape of the annular portion 11c.

On the other hand, the 1 st die 13 has an abutment surface 13a that abuts against the 1 st punch 11. The contact surface 13a is a flat surface perpendicular to the mold opening/closing direction. The 1 st die 13 has a concave portion 13b on its contact surface 13a. The recess 13b accommodates the protrusion 11b and the annular portion 11c of the 1 st punch 11.

The 2 nd punch 12 has an abutment surface 12a for abutting against the 2 nd die 14. The contact surface 12a is a flat surface perpendicular to the mold opening/closing direction. The 2 nd punch 12 has a convex portion 12b on its abutment surface 12a. The size and shape of the concave portion 22b of the 2 nd divided product 22 are determined by the size and shape of the convex portion 12b. The 2 nd punch 12 has an annular portion 12c on its contact surface 12a. The size and shape of the remaining portion of the bonding layer 23 are determined by the size and shape of the annular portion 12c.

On the other hand, the 2 nd die 14 has an abutment surface 14a with which the 2 nd punch 12 abuts. The contact surface 14a is a flat surface perpendicular to the mold opening/closing direction. The 2 nd die 14 has a concave portion 14b on its abutment surface 14a. The recess 14b accommodates the protrusion 12b and the annular portion 12c of the 2 nd punch 12.

In step S102, as shown in fig. 3 (a), the 1 st injection device 35 fills the 1 st cavity space 15 with the liquid molding material, and the 2 nd injection device 39 fills the 2 nd cavity space 16 with the liquid molding material. In the 1 st cavity space 15, the molding material is cooled and solidified, and the 1 st divided product 21 is molded. Then, the molding material is cooled and solidified in the 2 nd cavity space 16, and the 2 nd divided product 22 is molded. The molding of the 1 st divided product 21 and the molding of the 2 nd divided product 22 are also referred to as one-shot molding.

In step S103, as shown in fig. 3 (B), the movable platen 34 is retracted, and the 2 nd punch 12 and the 1 st die 13 are retracted, so that the pressure is reduced and the die is opened. The 1 st divided product 21 is retracted together with the 1 st die 13 in a state of being attached to the 1 st die 13, and is released from the 1 st punch 11. On the other hand, the 2 nd divided product 22 is fixed in a state of being attached to the 2 nd die 14, and is released from the 2 nd punch 12.

The mold device 1 may have a suction hole for sucking the 1 st divided product 21 on the wall surface of the 1 st die 13 forming the 1 st cavity space 15. When the air pressure in the suction hole is negative by a vacuum pump or the like, the 1 st divided product 21 is sucked to the 1 st die 13. The 1 st divided product 21 can be reliably left in the 1 st die 13.

The mold device 1 may have injection holes for injecting a gas such as air on the wall surface of the 1 st punch 11 forming the 1 st cavity space 15. When the gas is injected through the injection hole, the 1 st divided product 21 is released from the 1 st punch 11. The 1 st divided product 21 can be reliably released from the 1 st punch 11.

The mold device 1 may have a suction hole for sucking the 2 nd divided product 22 on the wall surface of the 2 nd die 14 forming the 2 nd cavity space 16. When the air pressure in the suction hole is negative by a vacuum pump or the like, the 2 nd divided product 22 is sucked to the 2 nd die 14. The 2 nd divided product 22 can be reliably left in the 2 nd die 14.

The mold device 1 may have injection holes for injecting a gas such as air on the wall surface of the 2 nd cavity space 16 where the 2 nd punch 12 is formed. When the gas is injected from the injection hole, the 2 nd divided product 22 is released from the 2 nd punch 12. The 2 nd divided product 22 can be reliably released from the 2 nd punch 12.

In step S104, as shown in fig. 4 (a), the rotary table 33 is rotated from the 1 st rotation angle to the 2 nd rotation angle. As a result, the 1 st punch 11 is disposed to face the 2 nd punch 12, and the 1 st die 13 is disposed to face the 2 nd die 14.

If the movable platen 34 is advanced in this state, the convex portion 12b of the 2 nd punch 12 is caused to abut against the convex portion 11b of the 1 st punch 11 before the abutment surface 13a of the 1 st die 13 abuts against the abutment surface 14a of the 2 nd die 14. As a result, the mold closing, the pressure increasing, and the mold closing of the 1 st die 13 and the 2 nd die 14 are hindered, and the formation of the 3 rd cavity space 17 is hindered.

Therefore, in step S105, as shown in fig. 4 (B), the 2 nd punch moving mechanism 18 of the die device 1 moves the 2 nd punch 12 with respect to the 1 st die 13 in the die opening and closing direction (for example, X-axis direction). The 2 nd punch moving mechanism 18 moves the 2 nd punch 12 backward to a position where it does not interfere with closing, boosting and closing of the 1 st die 13 and the 2 nd die 14. The 2 nd punch 12 moves in a direction away from the 1 st punch 11.

The 2 nd punch moving mechanism 18 includes: a guide block 18a for guiding the 2 nd punch 12 in the die opening/closing direction; and a driver 18b for moving the 2 nd punch 12 in the die opening and closing direction. The actuator 18b may be mechanical or hydraulic.

In addition, the die apparatus 1 may have a 1 st punch moving mechanism described later instead of the 2 nd punch moving mechanism 18. The 1 st punch moving mechanism moves the 1 st punch 11 relative to the 2 nd die 14 in the die opening and closing direction. The 1 st punch 11 is mounted to be movable relative to the fixed platen 32.

The 1 st punch moving mechanism moves the 1 st punch 11 to a position that does not interfere with closing, boosting and clamping of the 1 st die 13 and the 2 nd die 14. The 1 st punch 11 moves away from the 2 nd punch 12. The 1 st injection device 35 can be advanced and retracted in response to the advance and retreat of the 1 st punch 11.

In the case where the die apparatus 1 has the 2 nd punch moving mechanism 18 and does not have the 1 st punch moving mechanism, the 2 nd punch 12 is moved, and the 1 st punch 11 is not moved. Since the nozzle 37 of the 1 st injection device 35 is not in contact with the 2 nd punch 12, the 1 st injection device 35 does not need to be advanced or retracted in response to the advance or retraction of the 2 nd punch 12.

On the other hand, in the case where the die apparatus 1 has the 1 st punch moving mechanism and does not have the 2 nd punch moving mechanism 18, the 1 st punch 11 is moved, and the 2 nd punch 12 is not moved. Since it is not necessary to supply energy to move the 2 nd punch 12, the number of wires or pipes to be fixed to the turntable 33 can be reduced.

Further, the die apparatus 1 may have both the 2 nd punch moving mechanism 18 and the 1 st punch moving mechanism. At this time, the movement distance of the 1 st punch 11 is short compared with the case where the die apparatus 1 has only the 1 st punch movement mechanism, and the movement distance of the 2 nd punch 12 is short compared with the case where the die apparatus 1 has only the 2 nd punch movement mechanism 18. Therefore, if the 1 st punch 11 and the 2 nd punch 12 are moved simultaneously, the step S105 can be performed in a short time, and throughput can be improved.

In the present embodiment, the 2 nd punch moving mechanism 18 is a part of the die apparatus 1, but may be provided separately from the die apparatus 1 or may be a part of the injection molding machine 3. Similarly, the 1 st punch moving mechanism may be a part of the die device 1 or a part of the injection molding machine 3.

Step S105 may be performed after the primary molding (S102) and before the secondary molding (S107), and may be performed, for example, during the mold opening (S103), the rotation (S104), or the mold closing (S106).

In step S106, as shown in fig. 5 (a), the movable platen 34 is advanced, and the 2 nd punch 12 and the 1 st die 13 are advanced, so that the mold is closed, boosted, and clamped. At the time of mold clamping, the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17 of the mold joint layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated inside. The 3 rd cavity space 17 is formed in a ring shape at the outer edges of the abutting surfaces 21a, 22a of the 1 st divided article 21 and the 2 nd divided article 22. When the 1 st die 13 and the 2 nd die 14 are clamped, the 1 st punch 11 and the 2 nd punch 12 may not be in contact.

The 2 nd die 14 includes: a 1 st flow path C1 for feeding the molding material injected by the 2 nd injection device 39 to an inlet of the 2 nd cavity space 16; and a 2 nd flow path C2 for feeding the molding material injected by the 2 nd injection device 39 to the inlet of the 3 rd cavity space 17. The 2 nd flow path C2 branches from the middle of the 1 st flow path C1, and a direction switching portion C3 is provided at a branching point thereof.

The direction switching unit C3 switches the flow direction of the molding material between a direction toward the inlet of the 2 nd cavity space 16 and a direction toward the inlet of the 3 rd cavity space 17. The inlet of the 2 nd cavity space 16 is provided, for example, at the bottom surface of the recess 14b, and the inlet of the 3 rd cavity space 17 is provided, for example, at the inner edge of the contact surface 14a. As shown in fig. 3 (a), when the 2 nd injection device 39 fills the 2 nd cavity space 16 with resin, the direction switching part C3 directs the molding material to the inlet of the 2 nd cavity space 16. On the other hand, as shown in fig. 5 (B), when the 2 nd injection device 39 fills the 3 rd cavity space 17 with resin, the direction switching part C3 directs the molding material to the inlet of the 3 rd cavity space 17.

In step S107, as shown in fig. 5 (B), the 2 nd injection device 39 fills the 3 rd cavity space 17 with the molding material in a liquid state. In the 3 rd cavity space 17, the molding material is cooled and solidified, and the joining layer 23 is molded. The molding of the joining layer 23 is also referred to as overmolding. The bonding layer 23 is formed in a ring shape on the outer edges of the abutting surfaces 21a, 22a of the 1 st divided article 21 and the 2 nd divided article 22. The joining layer 23 welds the 1 st division 21 and the 2 nd division 22. As a result, the hollow molded article 2 is molded.

In step S108, as shown in fig. 6 (a), the movable platen 34 is retracted, and the 2 nd punch 12 and the 1 st die 13 are retracted, so that the pressure is reduced and the die is opened. The hollow molded article 2 is retracted together with the 1 st die 13 in a state of being attached to the 1 st die 13, and released from the 2 nd die 14.

In step S109, as shown in fig. 6 (B), a non-illustrated extractor extracts the hollow molded article 2 from the mold device 1. The hollow molded article 2 is taken out from the 1 st die 13. Thus, the hollow molded article 2 can be obtained.

In step S108, the hollow molded article 2 is attached to the 1 st die 13 in the present embodiment, but may be attached to the 2 nd die 14 and released from the 1 st die 13. In the latter case, in step S109, the hollow molded article 2 is taken out from the 2 nd die 14.

Next, a modified example of the method for producing the hollow molded article 2 will be described with reference to fig. 7 to 11. Fig. 7 (a) is a cross-sectional view showing a state before S101 of the mold device according to the modification. Fig. 7 (B) is a cross-sectional view showing a state of S101 of the mold device according to the modification. Fig. 8 (a) is a cross-sectional view showing a state of S102 of the mold device according to the modification. Fig. 8 (B) is a cross-sectional view showing a state of S103 of the mold device according to the modification. Fig. 9 (a) is a cross-sectional view showing a state of S104 of the mold device according to the modification. Fig. 9 (B) is a cross-sectional view showing a state of S105 of the mold device according to the modification. Fig. 10 (a) is a cross-sectional view showing a state of S106 of the mold device according to the modification. Fig. 10 (B) is a cross-sectional view showing a state of S107 of the mold device according to the modification. Fig. 11 (a) is a cross-sectional view showing a state of S108 of the mold device according to the modification. Fig. 11 (B) is a cross-sectional view showing a state of S109 of the mold device according to the modification. Hereinafter, the differences between the present modification and the above-described embodiments will be mainly described.

The method for producing the hollow molded article 2 includes steps S101 to S109 shown in fig. 1. As shown in fig. 7 (a), before step S101, the mold opening of the mold device 1 is completed, the 1 st punch 11 is arranged to face the 1 st die 13, and the 2 nd punch 12 is arranged to face the 2 nd die 14. The rotation angle of the rotation table 33 is the 1 st rotation angle.

In step S101, as shown in fig. 7 (B), the movable platen 34 is advanced, and the 2 nd punch 12 and the 1 st die 13 are advanced, so that the mold is closed, boosted, and clamped. When the mold is closed, a 1 st cavity space 15 is formed by the 1 st punch 11 and the 1 st die 13, and a 2 nd cavity space 16 is formed by the 2 nd punch 12 and the 2 nd die 14.

In step S102, as shown in fig. 8 (a), the 1 st injection device 35 fills the 1 st cavity space 15 with the liquid molding material, and the 2 nd injection device 39 fills the 2 nd cavity space 16 with the liquid molding material. In the 1 st cavity space 15, the molding material is cooled and solidified, and the 1 st divided product 21 is molded. Then, the molding material is cooled and solidified in the 2 nd cavity space 16, and the 2 nd divided product 22 is molded.

In step S103, as shown in fig. 8 (B), the movable platen 34 is retracted, and the 2 nd punch 12 and the 1 st die 13 are retracted, so that the pressure is reduced and the die is opened. The 1 st divided product 21 is retracted together with the 1 st die 13 in a state of being attached to the 1 st die 13, and is released from the 1 st punch 11. On the other hand, the 2 nd divided product 22 is fixed in a state of being attached to the 2 nd die 14, and is released from the 2 nd punch 12.

In step S104, as shown in fig. 9 (a), the rotary table 33 is rotated from the 1 st rotation angle to the 2 nd rotation angle. As a result, the 1 st punch 11 is disposed to face the 2 nd punch 12, and the 1 st die 13 is disposed to face the 2 nd die 14.

Therefore, in step S105, as shown in fig. 9 (B), the 1 st punch moving mechanism 19 of the die device 1 moves the 1 st punch 11 relative to the 2 nd die 14 in a direction (for example, Y-axis direction) orthogonal to the die opening/closing direction. The 1 st punch moving mechanism 19 moves the 1 st punch 11 in the Y-axis direction to a position where it does not interfere with closing, boosting and clamping of the 1 st die 13 and the 2 nd die 14. The 1 st punch moving mechanism 19 can move the 1 st punch 11 in the Z-axis direction.

The 1 st punch 11 has a concave portion 11d in addition to the convex portion 11b and the annular portion 11c on the contact surface 11a. The recess 11d accommodates the protrusion 12b of the 2 nd punch 12. The 1 st punch 11 is moved to a position where the convex portion 12b of the 2 nd punch 12 is arranged to face the concave portion 11d of the 1 st punch 11.

The 1 st punch moving mechanism 19 includes a driver 19a that moves the 1 st punch 11 in a direction orthogonal to the die opening and closing direction. The actuator 19a may be mechanical or hydraulic.

The 1 st injection device 35 may be retracted before the 1 st punch 11 is moved, and the nozzle 37 of the 1 st injection device 35 is separated from the 1 st punch 11. Friction between the 1 st punch 11 and the nozzle 37 can be prevented when the 1 st punch 11 moves.

In addition, the die apparatus 1 may have a 2 nd punch moving mechanism instead of the 1 st punch moving mechanism 19. The 2 nd punch moving mechanism moves the 2 nd punch 12 relative to the 1 st die 13 in a direction orthogonal to the die opening and closing direction. The 2 nd punch moving mechanism moves the 2 nd punch 12 to a position that does not interfere with closing, boosting and clamping of the 1 st die 13 and the 2 nd die 14. For example, the 2 nd punch 12 is moved to a position where the convex portion 12b of the 2 nd punch 12 is arranged to face the concave portion 11d of the 1 st punch 11.

In the case where the die apparatus 1 has the 2 nd punch moving mechanism and does not have the 1 st punch moving mechanism 19, the 2 nd punch 12 is moved, and the 1 st punch 11 is not moved. Since the nozzle 37 of the 1 st injection device 35 is not in contact with the 2 nd punch 12, the operation of retracting the 1 st injection device 35 before the 2 nd punch 12 moves is not required.

On the other hand, in the case where the die apparatus 1 has the 1 st punch moving mechanism 19 and does not have the 2 nd punch moving mechanism, the 1 st punch 11 is moved, and the 2 nd punch 12 is not moved. Since it is not necessary to supply energy to move the 2 nd punch 12, the number of wires or pipes to be fixed to the turntable 33 can be reduced.

The die device 1 may have both the 1 st punch moving mechanism 19 and the 2 nd punch moving mechanism. At this time, the movement distance of the 1 st punch 11 is short compared with the case where the die apparatus 1 has only the 1 st punch movement mechanism 19, and the movement distance of the 2 nd punch 12 is short compared with the case where the die apparatus 1 has only the 2 nd punch movement mechanism. Therefore, if the 1 st punch 11 and the 2 nd punch 12 are moved simultaneously, the step S105 can be performed in a short time, and throughput can be improved.

In the present modification, the 1 st punch moving mechanism 19 is a part of the die apparatus 1, but may be provided separately from the die apparatus 1 or may be a part of the injection molding machine 3. Similarly, the 2 nd punch moving mechanism may be a part of the die device 1 or a part of the injection molding machine 3.

In step S106, as shown in fig. 10 (a), the movable platen 34 is advanced, and the 2 nd punch 12 and the 1 st die 13 are advanced, so that the mold is closed, boosted, and clamped. At the time of mold clamping, the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17 of the mold joint layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated inside. The 3 rd cavity space 17 is formed in a ring shape at the outer edges of the abutting surfaces 21a, 22a of the 1 st divided article 21 and the 2 nd divided article 22.

When the 1 st die 13 and the 2 nd die 14 are clamped, the contact surface 11a of the 1 st punch 11 and the contact surface 12a of the 2 nd punch 12 are pressed against each other, and the concave portion 11d of the 1 st punch 11 accommodates the convex portion 12b of the 2 nd punch 12. At this time, the recess 11d of the 1 st punch 11 also accommodates the annular portion 12c of the 2 nd punch 12.

Instead of the 1 st punch 11 having the concave portion 11d on the abutment surface 11a, the 2 nd punch 12 may have the concave portion on the abutment surface 12a. The recess accommodates the convex portion 11b of the 1 st punch 11 and also accommodates the annular portion 11c of the 1 st punch 11. At this time, in step S105, the 1 st punch 11 and/or the 2 nd punch 12 are moved to a position where the convex portion 11b of the 1 st punch 11 is arranged to face the concave portion of the 2 nd punch 12.

When the 1 st die 13 and the 2 nd die 14 are clamped, the 1 st punch 11 and/or the 2 nd punch 12 can be moved so much that the 1 st punch 11 and the 2 nd punch 12 do not come into contact with each other. At this time, a concave portion that accommodates the other convex portion is not required in one of the 1 st punch 11 and the 2 nd punch 12. However, the concave portion can shorten the moving distance.

In step S107, as shown in fig. 10 (B), the 2 nd injection device 39 fills the 3 rd cavity space 17 with the molding material in a liquid state. In the 3 rd cavity space 17, the molding material is cooled and solidified, and the joining layer 23 is molded. The bonding layer 23 is formed in a ring shape on the outer edges of the abutting surfaces 21a, 22a of the 1 st divided article 21 and the 2 nd divided article 22. The joining layer 23 welds the 1 st division 21 and the 2 nd division 22. As a result, the hollow molded article 2 is molded.

In step S108, as shown in fig. 11 (a), the movable platen 34 is retracted, and the 2 nd punch 12 and the 1 st die 13 are retracted, so that the pressure is reduced and the die is opened. The hollow molded article 2 is retracted together with the 1 st die 13 in a state of being attached to the 1 st die 13, and released from the 2 nd die 14.

In step S109, as shown in fig. 11 (B), a non-illustrated extractor extracts the hollow molded article 2 from the mold device 1. The hollow molded article 2 is taken out from the 1 st die 13. Thus, the hollow molded article 2 can be obtained.

In step S108, the hollow molded article 2 is attached to the 1 st die 13 in the present modification, but may be attached to the 2 nd die 14 and released from the 1 st die 13. In the latter case, in step S109, the hollow molded article 2 is taken out from the 2 nd die 14.

The embodiments and the like of the mold device according to the present invention have been described above, but the present invention is not limited to the above embodiments and the like. Various changes, modifications, substitutions, additions, deletions and combinations can be made within the scope described in the claims. These matters are of course within the technical scope of the present invention.

The rotary table 33 may be rotatably supported by the fixed platen 32 instead of the movable platen 34. At this time, the 1 st punch 11 and the 2 nd die 14 are mounted to the movable platen 34 instead of the fixed platen 32. In this case, the movable platen 34 corresponds to the platen described in the claims.

The 2 nd punch moving mechanism 18 moves the 2 nd punch 12 in only one of the die opening and closing direction (for example, the X-axis direction) and the orthogonal direction thereof (for example, the Y-axis direction or the Z-axis direction), but may move in both directions.

Similarly, the 1 st punch moving mechanism 19 moves the 1 st punch 11 in only one of the opening and closing direction (for example, the X-axis direction) and the orthogonal direction (for example, the Y-axis direction or the Z-axis direction), but may move in both directions.

Claims

1. A mold apparatus for molding a hollow molded article comprising a 1 st divided article, a 2 nd divided article, and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold apparatus comprising a 1 st punch, a 2 nd punch, a 1 st die, and a 2 nd die,

2. The mold apparatus according to claim 1, comprising at least 1 of a 1 st punch moving mechanism that moves the 1 st punch relative to the 2 nd die and a 2 nd punch moving mechanism that moves the 2 nd punch relative to the 1 st die.

3. The mold apparatus of claim 2, wherein,

the 1 st punch moving mechanism moves the 1 st punch relative to the 2 nd die in a die opening and closing direction.

4. A mold apparatus according to claim 2 or 3, wherein,

the 2 nd punch moving mechanism moves the 2 nd punch relative to the 1 st die in a die opening and closing direction.

5. The mold device according to any one of claims 2 to 4, wherein,

the 1 st punch moving mechanism moves the 1 st punch relative to the 2 nd die in a direction orthogonal to a die opening/closing direction.

6. The mold device according to any one of claims 2 to 5, wherein,

the 2 nd punch moving mechanism moves the 2 nd punch relative to the 1 st die in a direction orthogonal to a die opening/closing direction.