CN113459389A

CN113459389A - Die device

Info

Publication number: CN113459389A
Application number: CN202011557499.8A
Authority: CN
Inventors: 石井努; 木村勇一; 岩桥正博
Original assignee: Sumitomo Heavy Industries Ltd
Current assignee: Sumitomo Heavy Industries Ltd
Priority date: 2020-03-30
Filing date: 2020-12-25
Publication date: 2021-10-01
Anticipated expiration: 2040-12-25
Also published as: CN113459389B; JP7379252B2; JP2021154695A

Abstract

The invention provides a technology for molding a hollow molded product by using a mold rotating together with a rotary table. A mold device for molding a hollow molded article including a 1 st divided article, a 2 nd divided article, and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold device comprising a 1 st punch, a 2 nd punch, a 1 st die, and a 2 nd die, the 1 st punch and the 2 nd die being attached to a platen of an injection molding machine, the 2 nd punch and the 1 st die being attached to a turntable of the injection molding machine disposed opposite to the platen, the 1 st die and the 2 nd die forming a 3 rd cavity space for molding the joining layer in a state where the 1 st divided article and the 2 nd divided article are accommodated therein, the 1 st punch being movably attached to the 2 nd die or/and the 2 nd punch being movably attached to the 1 st die.

Description

Die device

Technical Field

The present application claims priority based on japanese patent application No. 2020-. The entire contents of this Japanese application are incorporated by reference into this specification.

The present invention relates to a mold apparatus.

Background

Patent document 1 discloses a mold device for molding a hollow molded article. The mold device has a fixed mold, a sliding mold, and a movable mold. The fixed die is fixed to a fixed table of an injection molding machine. The sliding die slides up and down while being in close contact with the fixed die. The movable mold is mounted on a movable table of an injection molding machine. A male die and a female die are provided on the contact surface of the sliding die with the movable die. In addition, a male die and a female die are also provided on the contact surface of the movable die with the sliding die.

In the one-shot molding, a cavity is formed between a male die of the slide die and a female die of the movable die, and a cavity is formed between the female die of the slide die and the male die of the movable die. Molten resin was filled into each of the 2 cavities, and the split body of the hollow molded article was molded in each of the 2 cavities.

Then, the mold is opened. At this time, each of the 2 divided bodies was separated from the male mold and remained in the female mold. Next, the slide die was slid, and the 2 split bodies were opposed to each other. Next, the mold was closed, and 2 divided bodies were butted against each other. A cavity is formed around the abutting surfaces of the 2 divided bodies.

In the secondary molding, a cavity is formed around the abutting surfaces of the 2 divided bodies, and the cavity is filled with a molten resin. As a result, 2 pieces of the divided bodies were welded to form 1 hollow molded article. Then, the mold is opened, and the hollow molded article is taken out from the mold apparatus.

Patent document 1: japanese examined patent publication (Kokoku) No. 2-38377

As an injection molding machine, there is an injection molding machine having a rotary table. The mold is mounted on a turntable, and the mold rotates together with the turntable.

In patent document 1, molding of a hollow molded article using a mold that rotates together with a rotary table is not studied.

Disclosure of Invention

One embodiment of the present invention provides a technique for molding a hollow molded article using a mold that rotates together with a rotary table.

A mold device according to an embodiment of the present invention is a mold device for molding a hollow molded article including a 1 st divided article, a 2 nd divided article, and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold device including a 1 st punch, a 2 nd punch, a 1 st die, and a 2 nd die,

the 1 st male die and the 2 nd female die are arranged on a pressure plate of an injection molding machine,

the 2 nd male die and the 1 st female die are attached to a rotating table of the injection molding machine disposed opposite to the platen,

the 1 st punch and the 1 st die form a 1 st cavity space for molding the 1 st divided product,

the 2 nd male die and the 2 nd female die form a 2 nd cavity space for molding the 2 nd divided product,

the 1 st die and the 2 nd die form a 3 rd cavity space for molding the joining layer in a state where the 1 st divided product and the 2 nd divided product are accommodated therein,

the 1 st punch is movably mounted with respect to the 2 nd die or/and the 2 nd punch is movably mounted with respect to the 1 st die.

Effects of the invention

According to one embodiment of the present invention, a hollow molded article can be molded using a mold that rotates together with a rotary table.

Drawings

Fig. 1 is a flowchart showing a method for manufacturing a hollow molded article using a mold device according to an embodiment.

Fig. 2(a) is a cross-sectional view showing a state before S101 of the mold apparatus according to the embodiment, and fig. 2(B) is a cross-sectional view showing a state of S101 of the mold apparatus according to the embodiment.

In fig. 3, fig. 3(a) is a cross-sectional view showing a state of S102 of the mold apparatus according to the embodiment, and fig. 3(B) is a cross-sectional view showing a state of S103 of the mold apparatus according to the embodiment.

In fig. 4, fig. 4(a) is a cross-sectional view showing a state of S104 of the mold apparatus according to the embodiment, and fig. 4(B) is a cross-sectional view showing a state of S105 of the mold apparatus according to the embodiment.

In fig. 5, fig. 5(a) is a cross-sectional view showing a state of S106 of the mold apparatus according to the embodiment, and fig. 5(B) is a cross-sectional view showing a state of S107 of the mold apparatus according to the embodiment.

In fig. 6, fig. 6(a) is a cross-sectional view showing a state of S108 of the mold apparatus according to the embodiment, and fig. 6(B) is a cross-sectional view showing a state of S109 of the mold apparatus according to the embodiment.

In fig. 7, fig. 7(a) is a cross-sectional view showing a state before S101 of the mold apparatus according to the modification, and fig. 7(B) is a cross-sectional view showing a state of S101 of the mold apparatus according to the modification.

In fig. 8, fig. 8(a) is a cross-sectional view showing a state of S102 of the mold apparatus according to the modification, and fig. 8(B) is a cross-sectional view showing a state of S103 of the mold apparatus according to the modification.

In fig. 9, fig. 9(a) is a cross-sectional view showing a state of S104 of the mold apparatus according to the modification, and fig. 9(B) is a cross-sectional view showing a state of S105 of the mold apparatus according to the modification.

In fig. 10, fig. 10(a) is a cross-sectional view showing a state of S106 of the mold apparatus according to the modification, and fig. 10(B) is a cross-sectional view showing a state of S107 of the mold apparatus according to the modification.

In fig. 11, fig. 11(a) is a cross-sectional view showing a state of S108 of the mold apparatus according to the modification, and fig. 11(B) is a cross-sectional view showing a state of S109 of the mold apparatus according to the modification.

In the figure: 1-mould device, 11-1 st male mould, 12-2 nd male mould, 13-1 st female mould, 14-2 nd female mould, 18-2 nd male mould moving mechanism, 19-1 st male mould moving mechanism, 2-hollow formed product, 21-1 st divided product, 22-2 nd divided product, 23-jointing layer, 3-injection moulding machine, 32-fixed pressing plate (pressing plate) and 33-rotary table.

Detailed Description

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and description thereof may be omitted.

Fig. 1 is a flowchart showing a method for manufacturing a hollow molded article using a mold device according to an embodiment. Fig. 2(a) is a cross-sectional view showing a state before S101 of the mold apparatus according to the embodiment. Fig. 2(B) is a cross-sectional view showing a state of S101 of the mold apparatus according to the embodiment. Fig. 3(a) is a cross-sectional view showing a state of S102 of the mold apparatus according to the embodiment. Fig. 3(B) is a cross-sectional view showing a state of S103 of the mold apparatus according to the embodiment. Fig. 4(a) is a cross-sectional view showing a state of S104 of the mold apparatus according to the embodiment. Fig. 4(B) is a cross-sectional view showing a state of S105 of the mold apparatus according to the embodiment. Fig. 5(a) is a cross-sectional view showing a state of S106 of the mold apparatus according to the embodiment. Fig. 5(B) is a cross-sectional view showing a state of S107 of the mold apparatus according to the embodiment. Fig. 6(a) is a cross-sectional view showing a state of S108 of the mold apparatus according to the embodiment. Fig. 6(B) is a cross-sectional view showing a state of S109 of the mold apparatus according to the embodiment.

In the present specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular directions. The X-axis direction and the Y-axis direction indicate the horizontal direction, and the Z-axis direction indicates the vertical direction. When the mold clamping device 31 of the injection molding machine 3 is horizontal, the X-axis direction is the mold opening/closing direction.

As shown in fig. 6(B), the mold apparatus 1 is used for molding a hollow molded article 2. The hollow molded article 2 includes a 1 st divided article 21, a 2 nd divided article 22, and a joining layer 23 joining the 1 st divided article 21 and the 2 nd divided article 22. The 1 st divided article 21 includes a concave portion 21b on an abutting surface 21a with the 2 nd divided article 22. The 2 nd divided product 22 also includes a concave portion 22b on the abutting surface 22a with the 1 st divided product 21. The recess 21b of the 1 st divided article 21 and the recess 22b of the 2 nd divided article 22 form a hollow structure. Bonding layer 23 is formed in a ring shape on the outer edge of abutting

surfaces

21a and 22a of 1 st divided

article

21 and 2 nd divided article 22. The joining layer 23 fusion-bonds the 1 st divided article 21 and the 2 nd divided article 22.

The die device 1 includes a 1 st punch 11, a 2 nd punch 12, a 1 st die 13, and a 2 nd die 14. As shown in fig. 2(B), the 1 st punch 11 and the 1 st die 13 form the 1 st cavity space 15 in which the 1 st divided product 21 is molded. The 2 nd punch 12 and the 2 nd die 14 form a 2 nd cavity space 16 in which the 2 nd divided product 22 is molded. The 1 st cavity space 15 and the 2 nd cavity space 16 are disposed with a gap therebetween in the Y axis direction, for example. As shown in fig. 5(a), the 1 st die 13 and the 2 nd die 14 form a 3 rd cavity space 17 for molding the junction layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated therein.

As shown in fig. 2(a), the 1 st punch 11 and the 2 nd die 14 are attached to the stationary platen 32. The fixed platen 32 is fixed to a frame, not shown. On the other hand, the 2 nd punch 12 and the 1 st die 13 are attached to the rotary table 33. The rotary table 33 is disposed opposite to the fixed platen 32. The rotary shaft 33a of the rotary table 33 is disposed parallel to the mold opening/closing direction and is held by the movable platen 34 via a bearing Br. The movable platen 34 is provided to be movable back and forth in the mold opening and closing direction with respect to the frame, and is movable back and forth with respect to the fixed platen 32. The mold device 1 is opened and closed by the advance and retreat of the movable platen 34.

The injection molding machine 3 includes: a mold clamping device 31 for opening and closing the mold device 1; a 1 st injection device 35 that injects the molding material into the mold device 1; and a 2 nd injection device 39 for injecting the molding material into the mold device 1.

The mold clamping device 31 performs mold closing, pressure raising, mold clamping, pressure reduction, and mold opening of the mold device 1. The mold clamping device 31 is, for example, horizontal, and the mold opening and closing direction is horizontal. In the description of the mold clamping device 31, the moving direction of the movable platen 34 (for example, the positive X-axis direction) when the mold is closed is defined as the front side, and the moving direction of the movable platen 34 when the mold is opened is defined as the rear side.

The mold clamping device 31 includes: a fixed press plate 32 provided with a 1 st male die 11 and a 2 nd female die 14; a rotary table 33 on which the 2 nd punch 12 and the 1 st die 13 are mounted; a movable platen 34 to which a rotary table 33 is rotatably attached; a rotation mechanism for rotating the rotation table 33; and a moving mechanism for moving the movable platen 34 forward and backward with respect to the fixed platen 32.

The stationary platen 32 is fixed to the frame. The 1 st punch 11 and the 2 nd die 14 are mounted on the opposite surface of the fixed platen 32 from the rotary table 33. As shown in fig. 2(B), the 1 st punch 11 forms a part of the wall surface of the 1 st cavity space 15. On the other hand, the 2 nd die 14 forms a part of the wall surface of the 2 nd cavity space 16.

The rotary table 33 is rotatably attached to the movable platen 34. The rotation center line R of the rotary table 33 is parallel to the mold opening and closing direction. The 2 nd punch 12 and the 1 st die 13 are mounted on the surface of the rotary table 33 opposite to the fixed platen 32. As shown in fig. 2(B), the 2 nd punch 12 forms a part of the wall surface of the 2 nd cavity space 16. On the other hand, the 1 st die 13 forms a part of the wall surface of the 1 st cavity space 15.

The rotation table 33 is rotated between the 1 st rotation angle and the 2 nd rotation angle by the rotation mechanism. For example, as shown in fig. 2(B), the 1 st rotation angle is a rotation angle at which the 1 st punch 11 and the 1 st die 13 form the 1 st cavity space 15 and the 2 nd punch 12 and the 2 nd die 14 form the 2 nd cavity space 16. The 1 st rotation angle is, for example, 0 °. On the other hand, as shown in fig. 5(a), the 2 nd rotation angle is a rotation angle at which the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17. The 2 nd rotation angle is, for example, 180 °.

The rotation direction of the rotation stage 33 may be reversed every time the rotation stage 33 rotates by 180 °. For example, after rotating the rotary table 33 clockwise by 180 °, it rotates counterclockwise by 180 °. Since the arrangement of the wiring and the piping fixed to the turntable 33 is restored, the wiring and the piping can be easily handled.

The movable platen 34 is disposed to be movable forward and backward in the mold opening and closing direction with respect to the frame. When the movable platen 34 is moved forward, the rotary table 33 is moved forward, and the 2 nd punch 12 and the 1 st die 13 are moved forward. As a result, mold closing, pressure raising, and mold clamping are performed. On the other hand, when the movable platen 34 is retreated, the rotary table 33 is retreated, and the 2 nd punch 12 and the 1 st die 13 are retreated. As a result, the mold is opened under reduced pressure.

The mold clamping device 31 of the present embodiment is a horizontal type in which the mold opening and closing direction is the horizontal direction, but may be a vertical type in which the mold opening and closing direction is the vertical direction.

As shown in fig. 2(B), the 1 st injection device 35 is brought into contact with the 1 st punch 11 of the mold device 1, and fills the 1 st cavity space 15 in the mold device 1 with the molding material. On the other hand, the 2 nd injection device 39 is in contact with the 2 nd cavity 14 of the mold device 1, and fills the 2 nd cavity space 16 in the mold device 1 with the molding material.

The 1 st injection device 35 and the 2 nd injection device 39 are disposed with a gap in the Y axis direction. This is because the 1 st cavity space 15 and the 2 nd cavity space 16 are arranged with a gap in the Y axis direction. The molding material filled into the 1 st cavity space 15 by the 1 st injection device 35 may be different from or the same as the molding material filled into the 2 nd cavity space 16 by the 2 nd injection device 39.

The 1 st injection device 35 and the 2 nd injection device 39 are identical in construction. Therefore, the structure of the 1 st injection device 35 will be described below, and the structure of the 2 nd injection device 39 will not be described. In the explanation of the 1 st injection device 35, unlike the explanation of the mold clamping device 31, the moving direction of the screw 38 (for example, the X-axis negative direction) at the time of filling is set to the front, and the moving direction of the screw 38 (for example, the X-axis positive direction) at the time of metering is set to the rear.

The 1 st injection device 35 includes, for example: a cylinder 36 for heating the molding material; a nozzle 37 provided at the front end of the cylinder 36; and a screw 38 rotatably disposed in the cylinder 36 to be advanced and retracted.

The cylinder 36 heats the molding material supplied to the inside. The molding material includes, for example, resin. The molding material is, for example, formed into a granular shape and supplied in a solid state. The cylinder 36 is divided into a plurality of regions in the axial direction (for example, X-axis direction) of the cylinder 36. Heaters and temperature detectors are provided in the plurality of regions, respectively. The set temperatures are set for the respective plurality of zones, and the heater is controlled so that the temperature detected by the temperature detector becomes the set temperature.

The nozzle 37 is provided at the tip end of the cylinder 36 and is pressed against the die apparatus 1. A heater and a temperature detector are provided on the outer periphery of the nozzle 37. The heater is controlled so that the detected temperature of the nozzle 37 becomes the set temperature.

The screw 38 is disposed in the cylinder 36 so as to be freely rotatable and movable forward and backward. When the screw 38 is rotated, the molding material is conveyed forward along the spiral groove of the screw 38. The molding material is gradually melted by heat from the cylinder 36 while being conveyed forward. The screw 38 is retracted as the liquid molding material is transported forward of the screw 38 and accumulated in the front of the cylinder 36. When the screw 38 is advanced, the liquid molding material accumulated in front of the screw 38 is injected from the nozzle 37 and filled into the mold apparatus 1.

The 1 st injection device 35 of the present embodiment is of a coaxial screw type, but may be of a screw preplasticizing type or the like. The screw preplasticizing type injection device supplies the molding material melted in the plasticizing cylinder to the injection cylinder, and injects the molding material from the injection cylinder into the mold device. The screw is rotatably and non-reciprocatingly disposed in the plasticizing cylinder, or rotatably and reciprocatingly disposed in the plasticizing cylinder. On the other hand, a plunger is disposed in the injection cylinder so as to be movable forward and backward.

Further, although the 1 st injection device 35 of the present embodiment is a horizontal type in which the axial direction of the cylinder 36 is the horizontal direction, it may be a vertical type in which the axial direction of the cylinder 36 is the vertical direction. The mold clamping device combined with the vertical 1 st injection device 35 may be vertical or horizontal. Similarly, the mold clamping device combined with the horizontal type 1 st injection device 35 may be horizontal or vertical.

Next, a method for manufacturing the hollow molded article 2 will be described with reference to fig. 1 to 6. The method of manufacturing the hollow molded article 2 has steps S101 to S109 shown in fig. 1. As shown in fig. 2(a), before step S101, the mold opening of the mold apparatus 1 is completed, and the 1 st punch 11 and the 1 st die 13 are disposed to face each other, and the 2 nd punch 12 and the 2 nd die 14 are disposed to face each other. The rotation angle of the rotation table 33 is the 1 st rotation angle.

In step S101, as shown in fig. 2(B), the movable platen 34 is advanced, the 2 nd punch 12 and the 1 st die 13 are advanced, and mold closing, pressure raising, and mold clamping are performed. During mold closing, a 1 st cavity space 15 is formed by the 1 st punch 11 and the 1 st die 13, and a 2 nd cavity space 16 is formed by the 2 nd punch 12 and the 2 nd die 14.

The 1 st punch 11 has a contact surface 11a that contacts the 1 st die 13. The abutment surface 11a is a flat surface perpendicular to the mold opening and closing direction. The 1 st punch 11 has a convex portion 11b on its abutment surface 11 a. The size and shape of the concave portion 21b of the 1 st divided product 21 are determined by the size and shape of the convex portion 11 b. The 1 st punch 11 has an annular portion 11c on its abutment surface 11 a. The local size and shape of the bonding layer 23 are determined by the size and shape of the annular portion 11 c.

On the other hand, the 1 st die 13 has an abutment surface 13a which abuts against the 1 st punch 11. The abutment surface 13a is a flat surface perpendicular to the mold opening and closing direction. The 1 st die 13 has a recess 13b on its abutment surface 13 a. The concave portion 13b accommodates the convex portion 11b and the annular portion 11c of the 1 st punch 11.

The 2 nd punch 12 has a contact surface 12a that contacts the 2 nd die 14. The abutment surface 12a is a flat surface perpendicular to the mold opening and closing direction. The 2 nd punch 12 has a convex portion 12b at its abutment surface 12 a. The size and shape of the concave portion 22b of the 2 nd divided product 22 are determined by the size and shape of the convex portion 12 b. The 2 nd punch 12 has an annular portion 12c on its abutment surface 12 a. The size and shape of the remaining portion of the bonding layer 23 are determined by the size and shape of the annular portion 12 c.

On the other hand, the 2 nd die 14 has an abutment surface 14a which abuts against the 2 nd punch 12. The abutment surface 14a is a flat surface perpendicular to the mold opening and closing direction. The 2 nd die 14 has a concave portion 14b on its abutment surface 14 a. The concave portion 14b accommodates the convex portion 12b and the annular portion 12c of the 2 nd punch 12.

In step S102, as shown in fig. 3(a), the 1 st injection device 35 fills the 1 st cavity space 15 with the molding material in a liquid state, and the 2 nd injection device 39 fills the 2 nd cavity space 16 with the molding material in a liquid state. In the 1 st cavity space 15, the molding material is cooled and solidified, and the 1 st divided product 21 is molded. Then, the molding material is cooled and solidified in the 2 nd cavity space 16, and the 2 nd divided product 22 is molded. The molding of the 1 st divided article 21 and the molding of the 2 nd divided article 22 are also referred to as primary molding.

In step S103, as shown in fig. 3(B), the movable platen 34 is retracted, the 2 nd punch 12 and the 1 st die 13 are retracted, and the pressure is reduced and the die is opened. The 1 st divided product 21 retreats together with the 1 st die 13 in a state of being attached to the 1 st die 13, and is released from the 1 st punch 11. On the other hand, the 2 nd divided product 22 is fixed in a state of being attached to the 2 nd die 14, and is released from the 2 nd punch 12.

The mold apparatus 1 may have a suction hole for sucking the 1 st divided product 21 in a wall surface of the 1 st die 13 forming the 1 st cavity space 15. When the air pressure in the suction hole is negative by a vacuum pump or the like, the 1 st divided product 21 is sucked to the 1 st die 13. The 1 st divided product 21 can be reliably left in the 1 st die 13.

The die apparatus 1 may have a jet hole for jetting a gas such as air on the wall surface of the 1 st punch 11 forming the 1 st cavity space 15. When the gas is injected from the injection hole, the 1 st divided product 21 is released from the 1 st punch 11. The 1 st divided product 21 can be reliably released from the 1 st punch 11.

The molding apparatus 1 may have a suction hole for sucking the 2 nd divided product 22 in a wall surface of the 2 nd die 14 forming the 2 nd cavity space 16. When the air pressure in the suction hole becomes negative by a vacuum pump or the like, the 2 nd divided product 22 is sucked to the 2 nd die 14. The 2 nd divided product 22 can be reliably left in the 2 nd die 14.

The die apparatus 1 may have a jet hole for jetting a gas such as air on a wall surface of the 2 nd cavity space 16 forming the 2 nd punch 12. When the gas is injected from the injection hole, the 2 nd divided product 22 is released from the 2 nd punch 12. The 2 nd divided product 22 can be reliably released from the 2 nd punch 12.

In step S104, as shown in fig. 4(a), the turntable 33 rotates from the 1 st rotation angle to the 2 nd rotation angle. As a result, the 1 st punch 11 and the 2 nd punch 12 are disposed to face each other, and the 1 st die 13 and the 2 nd die 14 are disposed to face each other.

If the movable platen 34 is advanced in this state, the convex portion 12b of the 2 nd punch 12 comes into contact with the convex portion 11b of the 1 st punch 11 before the contact surface 13a of the 1 st die 13 comes into contact with the contact surface 14a of the 2 nd die 14. As a result, the mold closing, pressure raising, and mold clamping of the 1 st die 13 and the 2 nd die 14 are prevented, and the formation of the 3 rd cavity space 17 is prevented.

Therefore, in step S105, as shown in fig. 4(B), the 2 nd punch moving mechanism 18 of the die apparatus 1 moves the 2 nd punch 12 relative to the 1 st die 13 in the die opening and closing direction (for example, the X-axis direction). The 2 nd punch moving mechanism 18 retreats the 2 nd punch 12 to a position not interfering with the mold closing, pressure raising, and mold clamping of the 1 st die 13 and the 2 nd die 14. The 2 nd punch 12 is moved away from the 1 st punch 11.

The 2 nd punch moving mechanism 18 includes: a guide block 18a that guides the 2 nd punch 12 in the die opening and closing direction; and an actuator 18b for moving the 2 nd punch 12 in the die opening/closing direction. The actuator 18b may be mechanical or hydraulic.

In addition, the die apparatus 1 may have a 1 st punch moving mechanism described later instead of the 2 nd punch moving mechanism 18. The 1 st punch moving mechanism moves the 1 st punch 11 relative to the 2 nd die 14 in the die opening and closing direction. The 1 st punch 11 is attached to the fixed platen 32 so as to be able to advance and retreat.

The 1 st punch moving mechanism moves the 1 st punch 11 to a position where it does not interfere with the mold closing, pressure raising, and mold clamping of the 1 st die 13 and the 2 nd die 14. The 1 st punch 11 is moved away from the 2 nd punch 12. The 1 st injection device 35 can be advanced and retracted in accordance with the advance and retraction of the 1 st punch 11.

In the case where the die device 1 has the 2 nd punch moving mechanism 18 and does not have the 1 st punch moving mechanism, the 2 nd punch 12 is moved while the 1 st punch 11 is not moved. Since the nozzle 37 of the 1 st injection device 35 is not in contact with the 2 nd punch 12, the 1 st injection device 35 does not need to be advanced and retracted in response to the advance and retraction of the 2 nd punch 12.

On the other hand, in the case where the die device 1 has the 1 st punch moving mechanism and does not have the 2 nd punch moving mechanism 18, the 1 st punch 11 is moved while the 2 nd punch 12 is not moved. Since it is not necessary to supply energy for moving the 2 nd punch 12, the number of wires and pipes fixed to the rotary table 33 can be reduced.

Also, the die device 1 may have both the 2 nd punch moving mechanism 18 and the 1 st punch moving mechanism. At this time, the moving distance of the 1 st punch 11 is shorter than the case where the die apparatus 1 has only the 1 st punch moving mechanism, and the moving distance of the 2 nd punch 12 is shorter than the case where the die apparatus 1 has only the 2 nd punch moving mechanism 18. Therefore, if the 1 st punch 11 and the 2 nd punch 12 are moved simultaneously, step S105 can be performed in a short time, and throughput can be improved.

In the present embodiment, the 2 nd punch moving mechanism 18 is a part of the mold apparatus 1, but may be provided separately from the mold apparatus 1 or may be a part of the injection molding machine 3. Likewise, the 1 st punch moving mechanism may be a part of the mold apparatus 1 or a part of the injection molding machine 3.

Step S105 may be performed after the primary molding (S102) and before the secondary molding (S107), and may be performed, for example, during opening of the mold (S103), during rotation (S104), or during closing of the mold (S106).

In step S106, as shown in fig. 5(a), the movable platen 34 is advanced, the 2 nd punch 12 and the 1 st die 13 are advanced, and mold closing, pressure raising, and mold clamping are performed. When the dies are closed, the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17 for molding the joining layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated therein. The 3 rd cavity space 17 is formed in an annular shape on the outer edge of the abutting

surfaces

21a, 22a of the 1 st divided part 21 and the 2 nd divided part 22. When the 1 st concave die 13 and the 2 nd concave die 14 are clamped, the 1 st punch 11 and the 2 nd punch 12 may not be in contact with each other.

The 2 nd die 14 includes: a 1 st flow path C1 for feeding the molding material injected by the 2 nd injection device 39 to the inlet of the 2 nd cavity space 16; and a 2 nd flow path C2 for conveying the molding material injected by the 2 nd injection device 39 to the inlet of the 3 rd cavity space 17. The 2 nd flow path C2 branches from the 1 st flow path C1, and a direction switching unit C3 is provided at the branch point.

The direction switching portion C3 switches the flow direction of the molding material between a direction toward the inlet of the 2 nd cavity space 16 and a direction toward the inlet of the 3 rd cavity space 17. The entrance of the 2 nd cavity space 16 is provided, for example, at the bottom surface of the recess 14b, and the entrance of the 3 rd cavity space 17 is provided, for example, at the inner edge of the contact surface 14 a. As shown in fig. 3(a), when the 2 nd injection device 39 fills the 2 nd cavity space 16 with resin, the direction switching portion C3 directs the molding material toward the entrance of the 2 nd cavity space 16. On the other hand, as shown in fig. 5(B), when the 2 nd injection device 39 fills the 3 rd cavity space 17 with resin, the direction switching portion C3 directs the molding material toward the entrance of the 3 rd cavity space 17.

In step S107, as shown in fig. 5(B), the 2 nd injection device 39 fills the molding material in a liquid state into the 3 rd cavity space 17. In the 3 rd cavity space 17, the molding material is cooled and solidified, and the junction layer 23 is molded. The molding of the junction layer 23 is also referred to as overmolding. Bonding layer 23 is formed in a ring shape on the outer edge of abutting

surfaces

21a and 22a of 1 st divided

article

21 and 2 nd divided article 22. The joining layer 23 fusion-bonds the 1 st divided article 21 and the 2 nd divided article 22. As a result, the hollow molded article 2 is molded.

In step S108, as shown in fig. 6(a), the movable platen 34 is retracted, the 2 nd punch 12 and the 1 st die 13 are retracted, and the pressure is reduced and the die is opened. The hollow molded article 2 retreats together with the 1 st die 13 in a state of being adhered to the 1 st die 13, and is released from the 2 nd die 14.

In step S109, as shown in fig. 6(B), the unshown extractor extracts the hollow molded article 2 from the mold apparatus 1. The hollow molded article 2 is taken out from the 1 st die 13. Thus, a hollow molded article 2 can be obtained.

In step S108, the hollow molded article 2 is attached to the 1 st die 13 in the present embodiment, but may be attached to the 2 nd die 14 and released from the 1 st die 13. In the latter case, in step S109, the hollow molded article 2 is taken out from the 2 nd die 14.

Next, a modified example of the method for producing the hollow molded article 2 will be described with reference to fig. 7 to 11. Fig. 7(a) is a cross-sectional view showing a state before S101 of the mold apparatus according to the modification. Fig. 7(B) is a cross-sectional view showing a state of S101 of the mold apparatus according to the modification. Fig. 8(a) is a cross-sectional view showing a state of S102 of the mold apparatus according to the modification. Fig. 8(B) is a cross-sectional view showing a state of S103 of the die apparatus according to the modification. Fig. 9(a) is a cross-sectional view showing a state of S104 of the mold apparatus according to the modification. Fig. 9(B) is a cross-sectional view showing a state of S105 of the mold apparatus according to the modification. Fig. 10(a) is a cross-sectional view showing a state of S106 of the die apparatus according to the modification. Fig. 10(B) is a cross-sectional view showing a state of S107 of the mold apparatus according to the modification. Fig. 11(a) is a cross-sectional view showing a state of S108 of the mold apparatus according to the modification. Fig. 11(B) is a cross-sectional view showing a state of S109 of the mold apparatus according to the modification. Hereinafter, differences between the present modification and the above-described embodiment will be mainly described.

The method of manufacturing the hollow molded article 2 has steps S101 to S109 shown in fig. 1. As shown in fig. 7(a), before step S101, the mold opening of the mold apparatus 1 is completed, and the 1 st punch 11 and the 1 st die 13 are disposed to face each other, and the 2 nd punch 12 and the 2 nd die 14 are disposed to face each other. The rotation angle of the rotation table 33 is the 1 st rotation angle.

In step S101, as shown in fig. 7(B), the movable platen 34 is advanced, the 2 nd punch 12 and the 1 st die 13 are advanced, and mold closing, pressure raising, and mold clamping are performed. During mold closing, a 1 st cavity space 15 is formed by the 1 st punch 11 and the 1 st die 13, and a 2 nd cavity space 16 is formed by the 2 nd punch 12 and the 2 nd die 14.

In step S102, as shown in fig. 8(a), the 1 st injection device 35 fills the 1 st cavity space 15 with the molding material in a liquid state, and the 2 nd injection device 39 fills the 2 nd cavity space 16 with the molding material in a liquid state. In the 1 st cavity space 15, the molding material is cooled and solidified, and the 1 st divided product 21 is molded. Then, the molding material is cooled and solidified in the 2 nd cavity space 16, and the 2 nd divided product 22 is molded.

In step S103, as shown in fig. 8(B), the movable platen 34 is retracted, the 2 nd punch 12 and the 1 st die 13 are retracted, and the pressure is reduced and the die is opened. The 1 st divided product 21 retreats together with the 1 st die 13 in a state of being attached to the 1 st die 13, and is released from the 1 st punch 11. On the other hand, the 2 nd divided product 22 is fixed in a state of being attached to the 2 nd die 14, and is released from the 2 nd punch 12.

In step S104, as shown in fig. 9(a), the turntable 33 rotates from the 1 st rotation angle to the 2 nd rotation angle. As a result, the 1 st punch 11 and the 2 nd punch 12 are disposed to face each other, and the 1 st die 13 and the 2 nd die 14 are disposed to face each other.

Therefore, in step S105, as shown in fig. 9(B), the 1 st punch moving mechanism 19 of the die apparatus 1 moves the 1 st punch 11 relative to the 2 nd die 14 in a direction (for example, Y-axis direction) orthogonal to the die opening and closing direction. The 1 st punch moving mechanism 19 moves the 1 st punch 11 in the Y axis direction to a position that does not interfere with the mold closing, pressure raising, and mold clamping of the 1 st die 13 and the 2 nd die 14. Further, the 1 st punch moving mechanism 19 can move the 1 st punch 11 in the Z-axis direction.

The 1 st punch 11 has a concave portion 11d in addition to the convex portion 11b and the annular portion 11c on its abutment surface 11 a. The concave portion 11d receives the convex portion 12b of the 2 nd punch 12. The 1 st punch 11 is moved to a position where the convex portion 12b of the 2 nd punch 12 is disposed to face the concave portion 11d of the 1 st punch 11.

The 1 st punch moving mechanism 19 includes an actuator 19a that moves the 1 st punch 11 in a direction orthogonal to the die opening and closing direction. The actuator 19a may be mechanical or hydraulic.

The 1 st injection device 35 may be retracted before the 1 st punch 11 is moved, the nozzle 37 of the 1 st injection device 35 being separated from the 1 st punch 11. When the 1 st punch 11 moves, friction between the 1 st punch 11 and the nozzle 37 can be prevented.

In addition, the die device 1 may have a 2 nd punch moving mechanism instead of the 1 st punch moving mechanism 19. The 2 nd punch moving mechanism moves the 2 nd punch 12 relative to the 1 st die 13 in a direction orthogonal to the die opening and closing direction. The 2 nd punch moving mechanism moves the 2 nd punch 12 to a position not interfering with the mold closing, pressure raising, and mold clamping of the 1 st die 13 and the 2 nd die 14. For example, the 2 nd punch 12 is moved to a position where the convex portion 12b of the 2 nd punch 12 is disposed to face the concave portion 11d of the 1 st punch 11.

In the case where the die device 1 has the 2 nd punch moving mechanism and does not have the 1 st punch moving mechanism 19, the 2 nd punch 12 is moved while the 1 st punch 11 is not moved. Since the nozzle 37 of the 1 st injection device 35 is not in contact with the 2 nd punch 12, there is no need for an operation to retract the 1 st injection device 35 before the 2 nd punch 12 moves.

On the other hand, in the case where the die device 1 has the 1 st punch moving mechanism 19 and does not have the 2 nd punch moving mechanism, the 1 st punch 11 is moved while the 2 nd punch 12 is not moved. Since it is not necessary to supply energy for moving the 2 nd punch 12, the number of wires and pipes fixed to the rotary table 33 can be reduced.

Also, the die device 1 may have both the 1 st punch moving mechanism 19 and the 2 nd punch moving mechanism. At this time, the moving distance of the 1 st punch 11 is shorter than the case where the die apparatus 1 has only the 1 st punch moving mechanism 19, and the moving distance of the 2 nd punch 12 is shorter than the case where the die apparatus 1 has only the 2 nd punch moving mechanism. Therefore, if the 1 st punch 11 and the 2 nd punch 12 are moved simultaneously, step S105 can be performed in a short time, and throughput can be improved.

In the present modification, the 1 st punch moving mechanism 19 is a part of the mold apparatus 1, but may be provided separately from the mold apparatus 1 or may be a part of the injection molding machine 3. Likewise, the 2 nd punch moving mechanism may be a part of the mold apparatus 1 or a part of the injection molding machine 3.

In step S106, as shown in fig. 10(a), the movable platen 34 is advanced, the 2 nd punch 12 and the 1 st die 13 are advanced, and mold closing, pressure raising, and mold clamping are performed. When the dies are closed, the 1 st die 13 and the 2 nd die 14 form the 3 rd cavity space 17 for molding the joining layer 23 in a state where the 1 st divided product 21 and the 2 nd divided product 22 are accommodated therein. The 3 rd cavity space 17 is formed in an annular shape on the outer edge of the abutting

surfaces

21a, 22a of the 1 st divided part 21 and the 2 nd divided part 22.

When the 1 st die 13 and the 2 nd die 14 are clamped, the abutment surface 11a of the 1 st punch 11 and the abutment surface 12a of the 2 nd punch 12 are pressed against each other, and the convex portion 12b of the 2 nd punch 12 is received in the concave portion 11d of the 1 st punch 11. At this time, the recess 11d of the 1 st punch 11 also receives the annular portion 12c of the 2 nd punch 12.

In addition, the 2 nd punch 12 may have a recess at its abutment surface 12a instead of the 1 st punch 11 having a recess 11d at its abutment surface 11 a. This recess accommodates the convex portion 11b of the 1 st punch 11 and also accommodates the annular portion 11c of the 1 st punch 11. At this time, in step S105, the 1 st punch 11 and/or the 2 nd punch 12 are moved to a position where the convex portion 11b of the 1 st punch 11 is disposed to face the concave portion of the 2 nd punch 12.

When the 1 st die 13 and the 2 nd die 14 are clamped, the 1 st punch 11 and/or the 2 nd punch 12 can be moved so much that the 1 st punch 11 and the 2 nd punch 12 do not come into contact with each other. At this time, a concave portion that receives the other convex portion is not required in one of the 1 st punch 11 and the 2 nd punch 12. However, if the recess is provided, the moving distance can be shortened.

In step S107, as shown in fig. 10(B), the 2 nd injection device 39 fills the molding material in a liquid state into the 3 rd cavity space 17. In the 3 rd cavity space 17, the molding material is cooled and solidified, and the junction layer 23 is molded. Bonding layer 23 is formed in a ring shape on the outer edge of abutting

surfaces

21a and 22a of 1 st divided

article

In step S108, as shown in fig. 11(a), the movable platen 34 is retracted, the 2 nd punch 12 and the 1 st die 13 are retracted, and the pressure is reduced and the die is opened. The hollow molded article 2 retreats together with the 1 st die 13 in a state of being adhered to the 1 st die 13, and is released from the 2 nd die 14.

In step S109, as shown in fig. 11(B), the unshown extractor extracts the hollow molded article 2 from the mold apparatus 1. The hollow molded article 2 is taken out from the 1 st die 13. Thus, a hollow molded article 2 can be obtained.

In step S108, although the hollow molded article 2 is attached to the 1 st die 13 in the present modification, it may be attached to the 2 nd die 14 and released from the 1 st die 13. In the latter case, in step S109, the hollow molded article 2 is taken out from the 2 nd die 14.

Although the embodiments and the like of the mold apparatus according to the present invention have been described above, the present invention is not limited to the above embodiments and the like. Various changes, modifications, substitutions, additions, deletions, and combinations may be made within the scope of the claims. These matters also belong to the technical scope of the present invention.

The rotary table 33 is rotatably supported by the fixed platen 32 instead of the movable platen 34. At this time, the 1 st punch 11 and the 2 nd die 14 are mounted to the movable platen 34 instead of the fixed platen 32. In this case, the movable platen 34 corresponds to the platen described in the claims.

The 2 nd punch moving mechanism 18 moves the 2 nd punch 12 only in either one of the die opening and closing direction (for example, the X-axis direction) and the orthogonal direction (for example, the Y-axis direction or the Z-axis direction), but may move in both directions.

Similarly, the 1 st punch moving mechanism 19 moves the 1 st punch 11 only in either one of the die opening and closing direction (for example, the X-axis direction) and the orthogonal direction (for example, the Y-axis direction or the Z-axis direction), but may move in both directions.

Claims

1. A mold device for molding a hollow molded article comprising a 1 st divided article, a 2 nd divided article and a joining layer joining the 1 st divided article and the 2 nd divided article, the mold device comprising a 1 st punch, a 2 nd punch, a 1 st die and a 2 nd die,

2. The mold device according to claim 1, comprising at least 1 of a 1 st punch moving mechanism that moves the 1 st punch relative to the 2 nd die and a 2 nd punch moving mechanism that moves the 2 nd punch relative to the 1 st die.

3. The mold apparatus of claim 2,

the 1 st punch moving mechanism moves the 1 st punch in the mold opening and closing direction with respect to the 2 nd die.

4. The mold apparatus of claim 2 or 3,

the 2 nd punch moving mechanism moves the 2 nd punch in the die opening and closing direction with respect to the 1 st die.

5. The mold apparatus of any of claims 2 to 4,

the 1 st punch moving mechanism moves the 1 st punch relative to the 2 nd die in a direction orthogonal to the die opening and closing direction.

6. The mold apparatus of any of claims 2 to 5,

the 2 nd punch moving mechanism moves the 2 nd punch relative to the 1 st die in a direction orthogonal to the die opening and closing direction.