CN113458630B

CN113458630B - Turnover mechanism, IC (integrated circuit) carrier plate processing equipment and turnover method

Info

Publication number: CN113458630B
Application number: CN202110484952.5A
Authority: CN
Inventors: 王建刚; 刘伟; 周松文; 杜星宇
Original assignee: Wuhan Huagong Laser Engineering Co Ltd
Current assignee: Wuhan Huagong Laser Engineering Co Ltd
Priority date: 2021-04-30
Filing date: 2021-04-30
Publication date: 2023-03-10
Anticipated expiration: 2041-04-30
Also published as: CN113458630A

Abstract

The invention relates to the technical field of laser processing, and provides a turnover mechanism which comprises two working platforms and a driving assembly, wherein the two working platforms can suck or release materials, and the driving assembly can adjust the positions of the two working platforms so that the adsorption surfaces of the two working platforms are opposite to each other; before the turnover, one of the working platforms adsorbs one side of the material, and after the turnover, the other working platform adsorbs the other side of the material. The IC carrier plate processing equipment comprises the turnover mechanism. A turn-over method is also provided. The invention can not occupy excessive space of the whole IC carrier plate processing equipment, for example, when the turnover moves downwards, the space above the frame can not be occupied from the beginning of turnover to the end of turnover, and when the turnover moves upwards, the space below the frame can not be occupied from the beginning of turnover to the end of turnover; in addition, the design does not influence the operation of material grabbing or other station mechanisms, and the working efficiency of the equipment can be obviously improved.

Description

Turnover mechanism, IC (integrated circuit) carrier plate processing equipment and turnover method

Technical Field

The invention relates to the technical field of laser processing, in particular to a turnover mechanism, IC carrier plate processing equipment and a turnover method.

Background

The laser marking device is a device for marking a corresponding marking pattern on a material at a designated position by laser.

Most of the existing equipment has complex structure, can not realize full-automatic marking work, and has overhigh cost. In addition, the existing marking equipment aims at marking targets which are mostly one side, and if other sides are marked, manual auxiliary turning is needed; in the aspects of feeding and discharging, manual feeding is also adopted, so that the working efficiency is influenced; the conventional manipulator has low material feeding and discharging adaptability, and is complex because different types of grabbing structures need to be replaced according to different material sizes; the existing feeding mechanism can only feed once every time, so that the efficiency is low, and the condition of material falling is easy to occur in the feeding process; the conventional visual identification module can only shoot a picture at one visual angle, and the adaptability is low; in addition, the conventional laser marking system is inconvenient to adjust the coaxiality of the light beam and an optical device and is often accompanied by errors.

Disclosure of Invention

The invention aims to provide a turnover mechanism, IC carrier plate processing equipment and a turnover method, which can at least solve part of defects in the prior art.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions: a turnover mechanism comprises two working platforms which can tightly suck or loosen materials and a driving component which can adjust the positions of the two working platforms so that the adsorption surfaces of the two working platforms are opposite to each other; before the turnover, one of the working platforms adsorbs one side of the material, and after the turnover, the other working platform adsorbs the other side of the material.

Further, the two working platforms are rotatably mounted on the frame, and the driving assembly drives the two working platforms to rotate so that the adsorption surfaces of the two working platforms are opposite to each other.

Furthermore, the position that the frame is connected with each work platform all is equipped with the recess, two the recess uses the perpendicular bisector of the line between them to set up as symmetry axis symmetry, and each at least one section cell body of recess and another at least one section cell body of recess just to setting up, work platform pass through the cam group with the groove connection, the cam group slide set up in the recess.

Further, each the recess all is the L type, the cam group includes at least three cam, two when work platform's adsorption plane was just to setting up, it was three the cam all is in the L type in the vertical section of recess.

Further, drive assembly includes first cylinder, the drive direction of first cylinder is vertical, and it orders about two work platform synchronous rotation.

And the driving part is used for pushing the working platforms when the two adsorption surfaces are arranged oppositely so as to enable the two working platforms to clamp the materials between the two working platforms.

Furthermore, the driving parts are two, the two working platforms are respectively pushed by the two driving parts, and the driving directions of the two driving parts are just opposite to each other.

Further, the frame has a through hole through which the driving assembly passes.

The embodiment of the invention provides another technical scheme: an IC carrier plate processing device comprises the turnover mechanism.

The embodiment of the invention provides another technical scheme: a method of turn-over comprising the steps of:

s1, preparing two working platforms in advance, wherein the two working platforms can adsorb materials;

s2, one side of the material is sucked tightly by one working platform;

s3, after the materials are tightly sucked by the working platforms, the positions of the two working platforms are adjusted by the driving assembly until the adsorption surfaces of the two working platforms are arranged opposite to each other;

s4, another working platform is used for tightly sucking the other surface of the material, and the working platform which is firstly sucked loosens the adsorption of the material;

and S5, adjusting the positions of the two working platforms by adopting the driving assembly again until the initial states of the two working platforms are returned, so as to complete the turnover of the material.

Compared with the prior art, the invention has the beneficial effects that: the turnover mechanism does not occupy excessive space of the whole IC carrier processing equipment, for example, when the turnover is moved downwards, the turnover mechanism does not occupy the space above the frame from the beginning to the end of turnover, and when the turnover is moved upwards, the turnover mechanism does not occupy the space below the frame from the beginning to the end of turnover; in addition, due to the design, the operation of material grabbing or other station mechanisms cannot be influenced, and the working efficiency of the equipment can be obviously improved.

Drawings

Fig. 1 is a schematic view of a first viewing angle of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic view of a second perspective view of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 3 is a schematic view of a first viewing angle of an IC carrier processing apparatus according to an embodiment of the present invention after a housing is removed;

fig. 4 is a schematic view of a second viewing angle of the IC carrier processing apparatus according to the embodiment of the present invention after the housing is removed;

fig. 5 is a schematic top view of an IC carrier processing apparatus according to an embodiment of the present invention with a housing removed;

fig. 6 is a schematic view of a first viewing angle of the IC carrier processing apparatus according to the embodiment of the present invention after the housing is removed;

fig. 7 is a schematic view of a first view angle partial structure of an upper bin of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 8 is a schematic view of a second view angle partial structure of an upper bin of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 9 is a schematic view of a first top view partial structure of an upper bin of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 10 is a schematic diagram of a second top view partial structure of a loading bin of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 11 is a schematic view of a material taking mechanism of an IC carrier processing apparatus according to a first embodiment of the present invention;

FIG. 12 is an enlarged partial schematic view of FIG. 11;

fig. 13 is a schematic structural diagram of a feeding mechanism of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 14 is a schematic view of a first viewing angle of a clapper plate structure of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 15 is a schematic diagram of a second view angle of a clapper plate structure of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 16 is a schematic diagram of a scanning system of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 17 is a schematic view of a marking system of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 18 is a schematic view illustrating an initial state of a flipping mechanism of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 19 is a schematic diagram illustrating an inverted state of a flipping mechanism of an IC carrier processing apparatus according to an embodiment of the present invention;

fig. 20 is a schematic diagram illustrating a turning-over completed state of a turning-over mechanism of an IC carrier processing apparatus according to an embodiment of the present invention;

FIG. 21 is a perspective schematic view of the side view of FIG. 18;

FIG. 22 is a perspective schematic view of the side view of FIG. 19;

fig. 23 is a perspective schematic view from a side view of fig. 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

referring to fig. 1 to 23, an embodiment of the invention provides an IC carrier processing apparatus, which includes an upper bin 1, a material taking mechanism 2, a feeding mechanism 3, a marking system 4, a turnover mechanism 5, and a lower bin 6. The feeding bin 1 is used for temporarily storing IC carrier plates, the material taking mechanism 2 is used for taking the IC carrier plates out of the feeding bin 1 and conveying the processed IC carrier plates to the discharging bin 6, the feeding mechanism 3 is used for conveying the IC carrier plates taken out of the feeding bin 1 by the material taking mechanism 2 to the marking system 4 for processing, the marking system 4 is used for processing the IC carrier plates, the overturning mechanism 5 is used for overturning the IC carrier plates and then conveying the IC carrier plates to the marking system 4 for continuous processing, and the discharging bin 6 is used for temporarily storing the processed IC carrier plates. In this embodiment, the full-automatic operation of a series of processes such as feeding, identifying, marking, turning over, blanking and the like can be realized by adopting the feeding bin 1, the material taking mechanism 2, the feeding mechanism 3, the marking system 4, the turning-over mechanism 5 and the discharging bin 6, and the automation degree is high.

Referring to fig. 3, 4 and 5 as an optimized scheme of the embodiment of the present invention, the upper bin 1, the feeding mechanism 3, the turnover mechanism 5 and the lower bin 6 are enclosed to form a U-shaped structure, and the marking system 4 is in the U-shaped structure. In this embodiment, the above-mentioned parts are designed into a U-shaped layout, which can facilitate the cooperation between the parts and reduce the occupied space. Preferably, the marking system 4 is perpendicular to the feeding mechanism 3, the upper material bin 1 is located on one side of the marking system 4, and the lower material bin 6 and the turnover mechanism 5 are located on the other side of the marking system 4. For example, the marking system 4 is arranged in the middle, marking can be performed after feeding and feeding are completed, blanking can be performed after marking is completed, and the working efficiency is improved.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 3, fig. 4, and fig. 5, the apparatus further includes a non-processing bin 7 for storing materials that need not to be added, and the non-processing bin 7 is located at a side 16 of the upper bin 1 away from the feeding mechanism 3. In this embodiment, material identified as not requiring processing is placed in this non-processing bin 7. The storage bin is arranged on one side of the upper storage bin 1, and is convenient to place after finding.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 3, fig. 4 and fig. 5, the apparatus further includes a scanning system 8 for identifying the IC carrier which is defective or needs to be scrapped, and the scanning system 8 is suspended above the marking system 4. In this embodiment, the scanning system 8 may be used to identify the material blocks on the IC carrier that have defects or need to be discarded during the operation, and transmit the information such as the position to the system as a record. The scanning system 8 is refined and comprises a visual recognition module 80, the visual recognition module 80 scans and recognizes the condition of the IC carrier plate, and transmits the recognized condition and the position information into the system as records, and the visual recognition module 80 can be adopted for scanning.

As an optimized solution of the embodiment of the present invention, please refer to fig. 3, fig. 4, and fig. 5, the apparatus further includes an NG bin 9 for temporarily storing the IC carrier identified by the scanning system 8, wherein the NG bin 9 is disposed on a side of the discharging bin 6 away from the flipping mechanism 5. In this embodiment, when the identified IC carrier is an IC carrier that needs to be scrapped, the IC carrier is put into the storage bin, and the IC carrier is slowed down and then is prompted to be taken away manually. Preferably, the blanking bin 6 can give a prompt after slowing down to remind people to take the materials away. Of course, besides manual removal, an automatic carrying cart may be provided, which has a manipulator for picking up the whole stack of IC carriers, a placing table for placing the IC carriers, and wheels moving along a predetermined path, thereby further improving the full-automatic operation.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 3, 4 and 5, the material taking mechanism 2 includes a feeding assembly and a discharging assembly, a feeding path of the feeding assembly covers the feeding bin 1 and the feeding mechanism 3 and is used for material handling between the feeding bin 1 and the feeding mechanism 3, and a discharging path of the discharging assembly covers the feeding mechanism 3, the turn-over mechanism 5 and the discharging bin 6 and is used for material handling between the feeding mechanism 3, the turn-over mechanism 5 and the discharging bin 6. In this embodiment, the above material taking mechanism 2 is divided into feeding and discharging, in the above U-shaped structure, the feeding portion and the discharging portion are respectively located at two sides of the U-shaped structure, wherein the feeding path of the feeding assembly includes the feeding bin 1 and part of the feeding mechanism 3, and certainly includes the non-processing bin 7. The blanking path of the blanking assembly comprises the turn-over mechanism 5, the blanking bin 6 and part of the feeding mechanism 3, and certainly comprises the NG bin 9. It can be said that the material taking mechanism 2 is associated with other parts.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 1, fig. 2, fig. 3, fig. 4, and fig. 5, the apparatus further includes a machine body a, the upper bin 1, the material taking mechanism 2, the feeding mechanism 3, the marking system 4, the turn-over mechanism 5, and the lower bin 6 are all disposed in the machine body a, one opposite side of the machine body a is respectively provided with a first window a1 and a second window a2, and the first window a1 and the second window a2 respectively correspond to the upper bin 1 and the lower bin 6. In the present embodiment, the above components are all embedded in the body a, so as to avoid exposure. A first window a1 and a second window a2 can be arranged on the machine body a to correspondingly feed and discharge materials. Of course, the machine body a is also provided with more openable windows to facilitate the overhaul of the equipment.

Referring to fig. 1 to 23, an embodiment of the invention provides a method for processing an IC carrier, including the following steps: s1, placing an IC (integrated circuit) support plate in an upper bin 1, S2, taking out the IC support plate in the upper bin 1 by a material taking mechanism 2 and placing the IC support plate in a feeding mechanism 3, S3, after the feeding mechanism 3 receives the IC support plate, conveying the IC support plate to a marking system 4 for processing, S4, after the marking system 4 processes one surface of the IC support plate, overturning the IC support plate to the other surface by an overturning mechanism 5, continuously processing the surface by the marking system 4, S5, and after the IC support plate is processed, conveying the processed IC support plate to a lower bin 6 by the material taking mechanism 2. In this embodiment, the full-automatic operation of a series of processes such as feeding, identifying, marking, turning over, blanking and the like can be realized by adopting the feeding bin 1, the material taking mechanism 2, the feeding mechanism 3, the marking system 4, the turning-over mechanism 5 and the discharging bin 6, and the automation degree is high.

Progress is made to refine each of the above.

The second embodiment:

referring to fig. 3 to 10, an embodiment of the present invention provides a loading bin, which includes a bearing plate 17 for placing stacked materials, a sensor 10 for sensing a height of the stacked materials, and a driving mechanism 11 for driving the bearing plate 17 to ascend and descend according to a signal fed back by the sensor 10, wherein the driving mechanism 11 includes a driving shaft, the bearing plate 17 is horizontally disposed, and the driving shaft is located below the bearing plate 17 and perpendicular to the bearing plate 17. In this embodiment, the height of the stacking plate 17 can be sensed to automatically adjust the height of the stacking plate, so as to realize automatic feeding. Specifically, after a plurality of IC carriers are stacked in the feeding and discharging bin, regardless of the stacking height of the IC carriers, the IC carriers are lifted to the highest position by the cooperation of the driving mechanism 11 and the sensor 10, i.e. it is ensured that the uppermost IC carrier can be most conveniently picked up by the feeding mechanism 2. The sensor 10 can sense the stacking height of the IC carrier, and then transmit the signal to the driving mechanism 11, and the driving mechanism 11 can control the carrier 17 to ascend or descend. Preferably, the sensor 10 may be disposed at the highest position of the storage bin, and when the IC carrier is lifted up, the sensor 10 may be touched, and the position of the uppermost IC carrier may be known by adjusting the touch margin. The purpose can also be achieved by emitting horizontal infrared light, when the infrared light is blocked, the IC carrier exceeds the highest position, the driving mechanism 11 controls to descend, and when the infrared light is not blocked, the position of the IC carrier is smaller than or equal to the highest position, and the purpose can be achieved by adjustment. The driving mechanism 11 may be a cylinder, and the driving shaft is a piston and is disposed below the bearing plate 17.

As an optimized scheme of the embodiment of the present invention, please refer to fig. 6 to 10, a plurality of material placement positions are provided on the bearing plate 17, and the material placement positions are sequentially arranged in a straight line shape. Preferably, a vertical baffle 12 is arranged on one side of the bearing plate 17. Be equipped with on vertical baffle 12 and be used for preventing the separator 13 of two adjacent material adhesions, adjacent two all be equipped with one between the material arrangement position separator 13. In this embodiment, the carrier board 17 and the material placement position are not shown in the figure, and vertical baffles 12 are arranged on the sides of the carrier board 17 and the material placement position to facilitate the alignment of a plurality of stacked IC carrier boards. And the separator 13 can prevent the adhesion of two adjacent materials.

As an optimized solution of the embodiment of the present invention, please refer to fig. 6 to 10, the upper bunker 1 further includes a bottom plate 14912 for mounting the driving mechanism 11, an initial resting plate 15 is disposed between the bottom plate 14912 and the bearing plate 17, and the initial resting plate 15 has a gap for the driving shaft to pass through. Preferably, the initial placement plate 15 is block-shaped, and the length and the width of the block-shaped initial placement plate 15 are both adjustable. In this embodiment, the initial placement board 15 is provided to facilitate the installation of the driving mechanism 11, and to facilitate the loading of the IC carrier board in cooperation with the carrier board 17, wherein the length and width of the initial placement board are adjustable.

As an optimized solution of the embodiment of the present invention, please refer to fig. 6 to 10, the upper bunker 1 further includes a plurality of bunkers 16, and each bunker 16 is configured with the carrier plate 17 and the driving mechanism 11. In this embodiment, the upper silo 1 may be a double silo as shown, or a silo with more bins 16. Therefore, the material can be conveniently taken by matching with multiple stations. Preferably, each of the bins 16 is also provided with the sensor 10, and each of the bins 16 may be provided with the sensor 10, or may share one sensor. Preferably, each bin 16 is sequentially distributed in a straight line shape, and in this embodiment, each bin 16 is arranged in a straight line shape, so that the space can be saved.

As an optimized solution of the embodiment of the present invention, please refer to fig. 1 to 10, in the embodiment, the upper bin 1 is detachably mounted on the machine body a, and has a pull handle capable of being pulled.

The lower silo 6 has the same structure as the upper silo 1.

Example three:

referring to fig. 11 and 12, an embodiment of the present invention provides a material taking mechanism, including two upright columns 20 arranged oppositely and a cross beam 21 arranged between the two upright columns 20, where the cross beam 21 is provided with a gripper assembly 22 for gripping a material, the gripper assembly 22 includes a plurality of gripper heads 23 capable of gripping the material, a plurality of mounting rods 24 for mounting the gripper heads 23, and a combination rod 25 for mounting the mounting rods 24, the combination rod 25 is provided with a plurality of mounting positions for connecting the mounting rods 24, a distance between each two mounting positions is adjustable, and the gripper heads 23 enclose a material gripping area for gripping the material. In this embodiment, the cross beam 21 is supported by the columns 20 to suspend the gripper assembly 22. The gripper assembly 22 is driven to move downwards during gripping to complete the gripping action. Specifically, the gripper assembly 22 can adjust the size of the material gripping area, so that materials with different sizes can be gripped without replacing the gripper. The mode of regulation adopts and establishes a plurality of installation positions on installation pole 24, can adjust the interval between the adjacent installation pole 24 through the interval of adjusting between the installation position, and then has adjusted the interval between the grapple 23 of establishing on installation pole 24.

Referring to fig. 11 and 12, as an optimized solution of the embodiment of the present invention, the combined rod 25 is a long strip, the installation positions are sequentially arranged along the length direction of the combined rod 25, each installation rod 24 is vertically installed on the installation position, and the combined rod 25 and each installation rod 24 are located in the same horizontal plane. In the embodiment, the plurality of mounting rods 24 and the combined rod 25 form a rake shape, so that the position of each mounting rod 24 can be conveniently adjusted according to needs.

As an optimized solution of the embodiment of the present invention, please refer to fig. 11 and 12, each of the mounting rods 24 is provided with a plurality of the gripping heads 23. In this embodiment, the number of the gripping heads 23 can be selected according to actual situations, so as to conveniently correspond to the gripping positions of the IC carrier. Preferably, the distance between two adjacent gripping heads 23 is adjustable. Specifically, each of the mounting bars 24 is in an elongated shape, each of the mounting bars 24 has a through slot 26, the through slots 26 are arranged along the length direction of the mounting bar 24, the gripper 23 passes through the through slots 26, and the head end of the gripper 23 is suspended on the upper surface of the through slot 26. In this embodiment, in addition to the adjustable distance between the mounting rods 24, the distance between the gripping heads 23 can be designed to be adjustable, so that the length and width of the plane formed by the gripping heads can be adjusted, and the flexibility is higher. The adjustment can be achieved by providing the mounting rod 24 with a through slot 26, and then sliding the gripper therein to a desired position.

As an optimized solution of the embodiment of the present invention, please refer to fig. 11 and 12, the material taking mechanism 2 further includes a blowing assembly 27 capable of blowing air. In the present embodiment, the blowing assembly 27 is provided to prevent the two IC carriers from being adhered during the material taking process. Preferably, the blowing assembly 27 includes a blowing head for guiding out the air, the blowing head is disposed on the mounting rod 24, and the blowing head can be directly disposed on the mounting rod 24 and can move along with the gripper assembly 22, although it is also possible that the blowing head is not mounted together with the gripper assembly, and the embodiment is not limited thereto.

As an optimized solution of the embodiment of the present invention, please refer to fig. 11 and 12, the gripping unit 22 is mounted on the cross beam 21 through a sliding unit capable of sliding on the cross beam 21. In this embodiment, the gripping position of the gripper elements 22 may be conveniently adjusted by the sliding element, and the adjustment direction is a horizontal direction.

As an optimized solution of the embodiment of the present invention, referring to fig. 11 and 12, a plurality of the gripper assemblies 22 are provided, and each of the gripper assemblies 22 is provided on the cross beam 21. In this embodiment, a plurality of gripper assemblies 22, such as a double gripper assembly 22, may be provided to improve the working efficiency. When the taking mechanism 2 is used in an IC carrier processing device, the structure of the embodiment can be used in a blanking assembly. Of course the loading assembly is also possible.

Example four:

referring to fig. 13, an embodiment of the present invention provides a feeding mechanism, including a plurality of feeding platforms 30 and a mounting seat 31 for slidably mounting each feeding platform 30, where feeding paths of the feeding platforms 30 are consistent, height positions of the feeding platforms 30 are different, the feeding platforms 30 are arranged in parallel, and an extending direction of the mounting seat 31 is consistent with a direction of the feeding path. In this embodiment, a plurality of feeding platforms 30 are used for feeding, and the plurality of feeding platforms 30 all operate at different heights without affecting each other, thereby improving the working efficiency. Specifically, the feeding platform 30 may be a suction platform, which can suck the IC carrier and then feed the IC carrier along the length direction of the mounting seat 31. The feeding platforms 30 are arranged and located in different height spaces, so that mutual interference and mutual influence among the feeding platforms can be avoided, and the working efficiency can be greatly improved. Preferably, the height position of each feeding platform 30 is adjustable, for example, the height of each feeding platform 30 can be adjusted by a height adjusting mechanism, and during operation, the feeding platforms 30 can be lifted and lowered alternately frequently to be fed to a position close to the material placing position of the material taking mechanism 2, for example, when material receiving is needed, one platform is lifted and controlled by the height adjusting mechanism, after the material is received, the material is fed out by translating in the height space, and at the moment, the other feeding platform 30 translates in the other height space without interference with the other feeding platform, and the feeding platform 30 is lifted and received when material receiving is needed, after the material receiving platform receives the material and moves away in the height space, the feeding platform 30 which receives the material in the first step can be lowered to the other height to prevent the two from colliding, so that the feeding in multiple stations can be continuous and efficient.

As an optimized solution of the embodiment of the present invention, please refer to fig. 13, each of the feeding platforms 30 is respectively disposed on an opposite side of the mounting seat 31. In this embodiment, the feeding platform 30 may be disposed on an opposite side of the mounting seat 31. If two feeding platforms 30 are illustrated in fig. 13, one feeding platform 30 may be provided at each side, and if there are more feeding platforms 30, more feeding platforms 30 may be provided at each side as needed, and feeding at more stations can be achieved by controlling the stroke length. Preferably, the mounting seat 31 has a driving member for driving the feeding platform 30 to slide thereon.

The feeding mechanism 3 is used in the IC carrier plate processing equipment to be matched with the material taking mechanism 2.

As an optimized solution of the embodiment of the present invention, please refer to fig. 3, fig. 4, fig. 5, and fig. 13, the material taking mechanism 2 includes a feeding assembly and a discharging assembly, and a feeding path of the feeding mechanism 3 crosses the feeding assembly and the discharging assembly. In this embodiment, the feeding path of the feeding mechanism 3 includes a feeding component and a discharging component, and can be linked with the feeding component and the feeding component.

In order to further optimize the above scheme, please refer to fig. 3, fig. 4, fig. 5, and fig. 13, the feeding assembly and the discharging assembly both include a cross beam 21, the cross beam 21 of the feeding assembly and the cross beam 21 of the discharging assembly are arranged in parallel, and the cross beam 21 of the feeding assembly and the cross beam 21 of the discharging assembly are perpendicular to the mounting seat 31. In this embodiment, the two beams 21 are parallel, and the mounting seat 31 is disposed between them, so as to facilitate the material receiving of the feeding mechanism 3 and the material receiving of the discharging assembly.

In order to further optimize the above scheme, please refer to fig. 3, fig. 4, fig. 5, and fig. 13, the cross beam 21 of the feeding assembly and the cross beam 21 of the discharging assembly are both located above the mounting seat 31, and the ends of the cross beam 21 of the feeding assembly and the cross beam 21 of the discharging assembly both extend out of the mounting seat 31. In this embodiment, two beams 21 are suspended above the mounting seat 31, so as to facilitate loading and unloading of the loading assembly and the unloading assembly. The end portions extend out to facilitate the placement of materials on the feeding platforms 30 on both sides.

In order to further optimize the above solution, referring to fig. 3, 4, 5 and 13, the apparatus further includes a marking system 4, and an output end of the marking system 4 is located above the mounting seat 31. In this embodiment, the output end is arranged above to facilitate processing of the material on the feeding platform 30.

Example five:

referring to fig. 16, an embodiment of the present invention provides a scanning system, including a visual recognition module 80, a light source 81, a frame 82 on which the visual recognition module 80 is mounted, and a mounting plate 83 which is movable along a height direction of the frame 82, wherein the light source 81 is mounted on the frame 82 through the mounting plate 83, a rotating disc 85 is further disposed between the light source 81 and the mounting plate 83, and the light source 81 is mounted on the mounting plate 83 through the rotating disc 85. In this embodiment, the height and angle of the light source 81 can be conveniently adjusted. In particular, the visual recognition module 80 is a conventional module, which may be a CCD camera. After the bracket body 82 is supported, the height of the light source 81 can be adjusted through the mounting plate 83, and the angle of the light source 81 is adjusted through the rotating disc 85, so that the height and the angle can be adjusted, and the integral structure is simple and easy to realize.

As an optimized solution of the embodiment of the present invention, referring to fig. 16, the frame body 82 and the mounting plate 83 are respectively provided with a plurality of first mounting holes 84, the frame body 82 and the mounting plate 83 are mounted together by passing screws through the respective first mounting holes 84, and the first mounting holes 84 on the frame body 82 and the first mounting holes 84 on the mounting plate 83 are arranged along the height direction. In this embodiment, the height adjustment can be made by screwing into corresponding apertures, i.e., the first mounting holes 84 are adjustment holes similar to the measurement. Preferably, the distance between two adjacent first installation holes 84 on the frame body 82 and the distance between two adjacent first installation holes 84 on the installation plate 83 are equal. By controlling the distance well, it is possible to know what the adjusted distance is.

As an optimized solution of the embodiment of the present invention, please refer to fig. 16, the rotating disc 85 is vertically installed on the mounting plate 83 by a rotating shaft. Preferably, the frame body 82 and the mounting plate 83 are both provided with a plurality of second mounting holes, and the rotating shaft penetrates through the second mounting holes on the frame body 82 and the second mounting holes on the mounting plate 83. In the present embodiment, the rotation is conventional, and the rotation is driven by a rotation shaft.

As an optimized solution of the embodiment of the present invention, referring to fig. 16, there are a plurality of the light sources 81, and each of the light sources 81 is installed on the installation plate 83 through the rotating disc 85. The mounting plate 83 has at least one portion offset from the frame 82, and the light source 81 is disposed at the portion. In this embodiment, a plurality of light sources 81 may be provided, and the positions thereof may be set as required, and if the mounting plate 83 has a position offset from the frame 82, it is not necessary to provide a second mounting hole on the frame 82 to match with the light source 81 provided at the position. Preferably, the light source 81 has a fan 86.

As an optimized solution of the embodiment of the present invention, referring to fig. 16, an adjusting assembly 87 for adjusting the shooting angle of the visual recognition module 80 is disposed on the frame 82. In this embodiment, the adjustment assembly 87 can be used to conveniently and stably adjust the shooting angle of the CCD camera. The adjustment assembly 87 includes a rotatable shaft through which rotation is driven.

The scanning system 8 can be used in the IC carrier processing equipment described above.

Example six:

referring to fig. 17, an embodiment of the invention provides a marking system, which includes a laser, a real-time power detection and adjustment module 40, a four-degree-of-freedom adjustable structure 41, a three-degree-of-freedom adjustable structure 42, and the like. The power real-time detection and adjustment module 40 can ensure stable output of laser power, the position of the beam expander can be adjusted with four degrees of freedom, so that the light beam is coaxial with the beam expander, and the position of the galvanometer can be adjusted with the three-degree-of-freedom adjustable structure 42, so that the light beam and the galvanometer can coaxially enter and exit. The real-time power detection and adjustment module 40, the four-degree-of-freedom adjustable structure 41, and the three-degree-of-freedom adjustable structure 42 are all conventional structures, and detailed working procedures thereof will not be described herein.

Example seven:

referring to fig. 14 and 15, an embodiment of the invention provides a flap plate structure, which includes a first push rod 320 capable of pushing a material to a predetermined area of the material, a pressing block 321 capable of pressing the material on the predetermined area, and a driving assembly for driving the first push rod 320 and the pressing block 321 to move, wherein the first push rod 320 is located at one side of the predetermined area. In this embodiment, this configuration can be used with the feeding platform 30 of fig. 13, both of which can be included in the feeding mechanism 3. This structure has two kinds of functions, and one is the clapper function, and it can prevent to get when blowing that material offset is too big to lead to the process processing position mistake at the back, and then leads to the waste material, and another is the clamp plate function, and it can prevent that some materials from having the warpage condition to take place, and if the warpage can lead to pay-off platform 30 not live in the absorption or adsorb insecurely, and then leads to processing to have the deviation. Specifically, the driving assembly drives the first push rod 320 and the pressing block 321 to move, firstly, the first push rod 320 moves to push the material into the predetermined area of the feeding platform 30, then, the pressing block 321 moves to press the material, and the two movements cooperate to ensure that the material is accurately and stably located in the predetermined area.

As an optimization scheme of the embodiment of the present invention, please refer to fig. 14 and fig. 15, the pressing block 321 is disposed on the first push rod 320. In this embodiment, the pressing piece 321 can be moved only by driving the first push rod 320. Preferably, there are a plurality of pressing blocks 321, and each pressing block 321 is mounted on the first push rod 320 at intervals. In the present embodiment, the plurality of pressing pieces 321 are provided to be pressed more stably.

As an optimized solution of the embodiment of the present invention, please refer to fig. 14 and fig. 15, the structure further includes a second push rod 322 disposed parallel to the first push rod 320, and a distance between the first push rod 320 and the second push rod 322 is greater than a width of the material. Preferably, the distance between the first push rod 320 and the second push rod 322 is 5mm larger than the width of the material. In this embodiment, the positions of the first push rod 320 and the second push rod 322 can be adjusted in advance according to the size of the IC carrier by the first push rod 320 and the second push rod 322, and then the IC carrier is taken away. After the adjustment is completed, the size of the area enclosed by the first push rod 320 and the second push rod 322 is just 5mm larger than the IC carrier.

As an optimization solution of the embodiment of the present invention, please refer to fig. 14 and 15, the driving assembly includes a first cylinder group capable of providing a thrust force in a horizontal direction and a second cylinder group capable of providing a thrust force in a height direction, the first push rod 320 is driven by the first cylinder group, and the press block 321 is driven by the second cylinder group. In the present embodiment, the driving is performed by a first cylinder group and a second cylinder group, wherein the first cylinder group comprises a first cylinder 323, a second cylinder 324 and a third cylinder 325, the second cylinder group comprises a fourth cylinder 326 and a fifth cylinder 327, the first cylinder 323, the second cylinder 324 and the third cylinder 325 are in a retraction state at the beginning, the fourth cylinder 326 and the fifth cylinder 327 are in an extension state, when in operation, the first cylinder 323, the second cylinder 324 and the third cylinder 325 are extended to shoot the IC to a predetermined area, then the fourth cylinder 326 and the fifth cylinder 327 are retracted, the plate is pressed on the feeding platform 30 by the pressing block 321 on the first push rod 320, and then the feeding platform 30 opens its vacuum device to completely fix the IC carrying plate. This can significantly improve the stability of the device.

As a preferred solution of the embodiment of the present invention, referring to fig. 14 and 15, a spacer 328 capable of covering the material extends from one side of the first push rod 320 toward the predetermined area. In this embodiment, a spacer 328 is disposed on one side of the first push rod 320, so that when a smaller board is processed, a portion not required to be vacuum-absorbed is covered, and vacuum pressure below the actual board is increased, so that material absorption is firmer, and failure in absorption or infirm absorption is prevented, which causes deviation in recognition and processing.

The flap plate structure 32 is used in the feeding mechanism 3, the feeding platform 30 has the predetermined area, and the feeding platform 30 is disposed on one side of the first push rod 320. The predetermined region has a vacuum suction port. Of course, the flap plate structure 32 can also be used in an IC carrier board processing device, or in an IC carrier board processing device with the feeding mechanism 3.

Example eight:

referring to fig. 18 and 23, an embodiment of the present invention provides a turnover mechanism, including two working platforms 50 capable of tightly sucking or releasing a material, and a driving assembly capable of adjusting positions of the two working platforms 50 to make suction surfaces of the two working platforms face each other; before turning over, one of the working platforms 50 adsorbs one side of the material, and after turning over, the other working platform 50 adsorbs the other side of the material. In the present embodiment, such a turn-over mechanism 5 does not occupy too much space of the whole IC carrier processing equipment, for example, when the turn-over is moving downwards, the space above the frame 51 is not occupied from the beginning to the end of the turn-over, and when the turn-over is moving upwards, the space below the frame 51 is not occupied from the beginning to the end of the turn-over; in addition, the design does not influence the operation of material grabbing or other station mechanisms, and the working efficiency of the equipment can be obviously improved. Specifically, the two working platforms 50 are used in cooperation, before turning, the material is tightly sucked through one of the working platforms 50, then the position of the working platform 50 is adjusted through the driving assembly to enable the working platform 50 to be opposite to the adsorption surface of the other working platform 50, at the moment, the second working platform 50 can tightly suck the other surface of the material, at the moment, the first working platform 50 releases the material, and the second working platform 50 completes the turning action. In addition, the form of the suction can be various, for example, vacuum suction, or magnetic suction, etc., as long as it can actively suck and release the air bubbles, etc., can be used in the present embodiment.

As an optimized solution of the embodiment of the present invention, please refer to fig. 18 and 23, the turn-over mechanism 5 further includes a frame 51 for installing the two working platforms 50, both the two working platforms 50 can be rotatably installed on the frame 51, and the driving assembly drives the two working platforms 50 to rotate so that the suction surfaces of the two working platforms are opposite to each other. In this embodiment, the frame 51 is provided, the limited adjustment mode is the turnover of the working platforms 50, and the turnover mode can be more beneficial to the adhesion of the adsorption surfaces of the two working platforms 50. Of course, except for the form of turning, the existing form that only two adsorption surfaces can be arranged opposite to each other is a feasible technical solution, and the form of turning is not necessarily required, and the embodiment is not limited to this.

Further optimizing the above solution, referring to fig. 18 and 23, grooves 52 are provided at the connection portion of the frame 51 and each of the working platforms 50, the two grooves 52 are symmetrically arranged with the perpendicular bisector of the connection line therebetween as a symmetry axis, at least one section of the groove body of each of the grooves 52 is opposite to at least one section of the groove body of the other groove 52, the working platform 50 is connected with the grooves 52 through a cam set, and the cam set is slidably disposed in the grooves 52. In this embodiment, the overturning is performed by sliding the working platform 50 in the groove 52 of the frame 51 with the cam set. In particular, the movement paths of the working platform 50 and the cam set can be clearly seen in fig. 21 to 23. Preferably, each of the grooves 52 is L-shaped, the cam set includes at least three cams, and when the suction surfaces of the two work platforms 50 are disposed opposite to each other, the three cams are located in a vertical section of the L-shaped groove 52. The cam set here can be subdivided into a first cam 530, a second cam 531 and a third cam 532.

As an optimized solution of the embodiment of the present invention, please refer to fig. 18 and 23, the driving assembly includes a first cylinder 54, the driving direction of the first cylinder 54 is vertical, and the first cylinder drives the two working platforms 50 to rotate synchronously. In this embodiment, the driving mode may be the first cylinder 54, and the turning-over and returning-to-home are realized by the expansion and contraction of the cylinder. Of course, besides this driving form, other existing linear driving forms are also feasible, and this embodiment does not limit this. When the two adsorption surfaces are arranged oppositely, the two adsorption surfaces are in a turnover state, and when the two adsorption surfaces are horizontally arranged, the two adsorption surfaces are in an initial state or a turnover completion state.

As an optimized solution of the embodiment of the present invention, please refer to fig. 18 and 23, the turnover mechanism 5 further includes a driving member for pushing the working platforms 50 when the two adsorption surfaces are oppositely disposed, so that the two working platforms 50 clamp the material therebetween. The number of the driving parts is two, the two working platforms 50 are respectively pushed by the two driving parts, and the driving directions of the two driving parts are just opposite to each other. In this embodiment, a driving member, which may be the second cylinder 55, may also be used to enhance the clamping effect.

As an optimized solution of the embodiment of the present invention, please refer to fig. 18 and 23, the frame 51 has a through hole 56 for the driving assembly to pass through. The through hole 56 facilitates the passage of the first cylinder 54 through the frame 51 in this embodiment.

The turnover mechanism 5 can be used in an IC carrier processing device.

Referring to fig. 18 to 23, an embodiment of the present invention further provides a flipping method for flipping materials such as an IC carrier, including the following steps: s1, preparing two working platforms 50 in advance, wherein both the two working platforms 50 can adsorb materials; s2, one working platform 50 is used for tightly sucking one surface of the material; s3, after the materials are tightly sucked by the working platforms 50, the positions of the two working platforms 50 are adjusted by the driving assembly until the adsorption surfaces of the two working platforms 50 are arranged opposite to each other; s4, another working platform 50 is used for tightly sucking the other side of the material, and the working platform 50 which is firstly sucked loosens the adsorption of the material; and S5, adjusting the positions of the two working platforms 50 by adopting the driving assembly again until the initial states of the two working platforms 50 are returned, so as to complete the turning over of the material. In the present embodiment, such a turn-over mechanism 5 does not occupy too much space of the whole IC carrier processing apparatus, for example, when the turn-over is moving downward, the space above the frame 51 is not occupied from the beginning to the end of the turn-over, and when the turn-over is moving upward, the space below the frame 51 is not occupied from the beginning to the end of the turn-over; in addition, due to the design, the operation of material grabbing or other station mechanisms cannot be influenced, and the working efficiency of the equipment can be obviously improved. Specifically, two working platforms 50 are adopted to be matched for use, before turning, the material is tightly sucked through one of the working platforms 50, then the position of the working platform 50 is adjusted through the driving assembly to enable the working platform 50 to be opposite to the adsorption surface of the other working platform 50, at the moment, the second working platform 50 can tightly suck the other surface of the material, at the moment, the first working platform 50 releases the material, and the second working platform 50 completes the turning action.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A turn-over mechanism is characterized in that: the device comprises two working platforms which can tightly suck or release materials and a driving component which can adjust the positions of the two working platforms so as to enable the adsorption surfaces of the two working platforms to be arranged oppositely; before turning over, one of the working platforms adsorbs one side of the material, and after turning over, the other working platform adsorbs the other side of the material; the two working platforms can be rotatably arranged on the frame, and the driving assembly drives the two working platforms to rotate so that the adsorption surfaces of the two working platforms are arranged oppositely; grooves are formed in the positions, connected with each working platform, of the frame, the two grooves are symmetrically arranged by taking the perpendicular bisector of the connecting line between the grooves as a symmetry axis, at least one section of groove body of each groove is opposite to at least one section of groove body of the other groove, the working platforms are connected with the grooves through cam sets, and the cam sets are arranged in the grooves in a sliding mode; each recess all is the L type, the cam group includes at least three cam, two when work platform's adsorption plane is just to setting up, three the cam all is in the L type in the vertical one section of recess.

2. The turn-over mechanism of claim 1, wherein: the driving assembly comprises a first air cylinder, the driving direction of the first air cylinder is vertical, and the first air cylinder drives the two working platforms to synchronously rotate.

3. The turn-over mechanism of claim 1, wherein: the material clamping device further comprises a driving piece used for pushing the working platforms when the two adsorption surfaces are arranged oppositely so that the two working platforms clamp the materials between the two adsorption surfaces.

4. The turn-over mechanism of claim 3, wherein: the driving parts are two, the two working platforms are respectively pushed by the two driving parts, and the driving directions of the two driving parts are just opposite to each other.

5. The turn-over mechanism of claim 1, wherein: the frame has a through hole for the driving assembly to pass through.

6. The utility model provides a IC support plate processing equipment which characterized in that: comprising a turn-over mechanism as claimed in any one of claims 1-5.

7. A turn-over method, characterized by comprising the steps of:

s2, one side of the material is sucked tightly by one working platform;