CN113451284B - Micro LED display structure and manufacturing method thereof - Google Patents
Micro LED display structure and manufacturing method thereof Download PDFInfo
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- CN113451284B CN113451284B CN202111026253.2A CN202111026253A CN113451284B CN 113451284 B CN113451284 B CN 113451284B CN 202111026253 A CN202111026253 A CN 202111026253A CN 113451284 B CN113451284 B CN 113451284B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011347 resin Substances 0.000 claims description 114
- 229920005989 resin Polymers 0.000 claims description 114
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005457 optimization Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention provides a micro LED display structure and a manufacturing method thereof. In addition, in the manufacturing method, the protrusion structures with different heights or sections and different eccentricities can be formed so as to realize different light emitting areas and realize optimization of light mixing effect.
Description
Technical Field
The invention relates to the field of micro light-emitting diode display manufacturing, in particular to a micro LED display structure and a manufacturing method thereof.
Background
Micro LED (mini-LED) display screens have the advantages of low current, stable performance and long life, and are therefore widely studied. The light-emitting angle of the existing micro LED display screen is narrow, the problems that the green light of a pixel point is too bright and the blue light is insufficient easily occur, and the cost is too high during large-area display manufacturing are solved.
Disclosure of Invention
In order to solve the above problems, the present invention provides a micro LED display structure, which includes:
a substrate;
the micro LED chips are fixed on the substrate and comprise a plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips;
the first protrusions are arranged in a plurality of rows along a first direction and respectively cover the red LED chips, each first protrusion comprises a first resin convex part in a half first ellipsoid shape and a first light reflecting layer, each first resin convex part comprises a first side surface in an ellipsoid shape and a first flat top surface, and each first light reflecting layer is arranged on the first side surface and is provided with a first opening exposing the first top surface;
a plurality of second protrusions arranged in a plurality of rows along a first direction and respectively covering the plurality of green LED chips, wherein the second protrusions include a second resin protrusion in a shape of a half second ellipsoid and a second light-reflecting layer, the second resin protrusion includes a second side surface in an ellipsoid shape and a second top surface, and the second light-reflecting layer is disposed on the second side surface and has a second opening exposing the second top surface;
a resin part filled between the first protrusion and the second protrusion and covering the plurality of blue LED chips;
wherein the first top surface and the second top surface are coplanar with the top surface of the resin part.
According to an embodiment of the present invention, the first protrusions and the second protrusions are alternately arranged in sequence in a second direction, wherein the first direction is perpendicular to the second direction.
According to the embodiment of the invention, the projections of the first protrusions and the second protrusions on the substrate are circular and have the same area, and the projections of the adjacent two first protrusions, the adjacent two second protrusions, and the adjacent first protrusions and the adjacent second protrusions on the substrate are tangent.
According to an embodiment of the present invention, the blue LED chip is disposed in a gap defined between two adjacent first protrusions and two adjacent second protrusions, and has a light exit opening on a top surface of the resin portion, an area of the light exit opening is larger than an area of the first opening, and an area of the first opening is larger than an area of the second opening.
The invention also provides a manufacturing method of the micro LED display structure, which comprises the following steps:
(1) providing a substrate, and fixing a plurality of micro LED chips on the substrate, wherein the micro LED chips comprise a plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips;
(2) injection-molding a plurality of first resin projections and a plurality of second resin projections on the substrate; the plurality of first resin convex parts are arranged in a plurality of rows along a first direction and respectively cover the plurality of red LED chips, and the plurality of first resin convex parts are in a half first ellipsoid shape; a plurality of second resin convex parts are arranged in a plurality of rows along the first direction and respectively cover the green LED chips, and the second resin convex parts are in a half second ellipsoid shape; wherein the height of the plurality of first resin projections is greater than the height of the plurality of second resin projections;
(3) depositing a first light reflecting layer and a second light reflecting layer on the surfaces of the first resin convex parts and the second resin convex parts respectively, wherein the plurality of first resin convex parts and the first light reflecting layer form a plurality of first protrusions, and the plurality of second resin convex parts and the second light reflecting layer form a plurality of second protrusions;
(4) covering the substrate with a resin portion having a height greater than the height of the plurality of first resin projections;
(5) grinding the upper surface of the resin part until part of the plurality of first resin convex parts and the plurality of second resin convex parts are removed; the first resin convex part comprises an ellipsoid-shaped first side surface and a flat first top surface, the first light reflecting layer is arranged on the first side surface and is provided with a first opening exposed out of the first top surface, the second resin convex part comprises an ellipsoid-shaped second side surface and a flat second top surface, the second light reflecting layer is arranged on the second side surface and is provided with a second opening exposed out of the second top surface, and the first top surface, the second top surface and the top surface of the resin part are coplanar.
According to an embodiment of the present invention, the first protrusions and the second protrusions are alternately arranged in sequence in a second direction, wherein the first direction is perpendicular to the second direction.
According to the embodiment of the invention, the projections of the first protrusions and the second protrusions on the substrate are circular and have the same area, and the projections of the adjacent two first protrusions, the adjacent two second protrusions, and the adjacent first protrusions and the adjacent second protrusions on the substrate are tangent.
According to an embodiment of the present invention, the blue LED chip is disposed in a gap defined between two adjacent first protrusions and two adjacent second protrusions, and has a light exit opening on a top surface of the resin portion, an area of the light exit opening is larger than an area of the first opening, and an area of the first opening is larger than an area of the second opening.
According to an embodiment of the present invention, the first and second light reflecting layers are metal layers, which are formed by a vapor deposition method.
The invention has the following beneficial effects: the first protrusion and the second protrusion are used as sub pixel points, the light emitting collimation and the light emitting singleness are achieved by the aid of the light reflecting layer arranged on the outer side of the first protrusion and the second protrusion, and the other sub pixel point is designed at the position among the plurality of protrusions, so that sufficient light mixing can be achieved. In addition, in the manufacturing method, the protrusion structures with different heights or sections and different eccentricities can be formed so as to realize different light emitting areas and realize optimization of light mixing effect.
Drawings
FIG. 1 is a top view of a micro LED display structure according to the present invention;
FIG. 2 is a cross-sectional view taken along line C1C2 of FIG. 1;
fig. 3-7 are schematic diagrams of methods of fabricating micro LED display structures according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure.
The invention aims to provide a micro LED packaging structure which is simple in manufacturing method and good in light mixing effect. Referring to fig. 1-2, the micro LED display structure of the present invention first includes a substrate 25, and the substrate 25 may be a driving circuit board including at least a driving circuit and an electrical interconnection circuit, etc. (not shown).
A plurality of micro LED chips, which may be GaN-based LED chips including at least three LED chips of different colors, are fixed and electrically connected on the substrate 25, and a plurality of red LED chips 22, a plurality of green LED chips 23, and a plurality of blue LED chips 24 are shown. In which three adjacent LED chips of different colors constitute one pixel, such as P1 and P2 shown in fig. 1, although fig. 1 shows two red LED chips 22 and two green LED chips 23 each surrounding one blue LED chip 24, the blue LED chips 24 may have a neutral position, i.e., one column of blue LED chips 24 is disposed to separate one column of red LED chips 22 and one column of green LED chips 23, depending on the constitution of an actual pixel.
Referring to fig. 1 again, the plurality of red LED chips 22 and the plurality of green LED chips 23 are arranged in multiple rows and are sequentially arranged at intervals, the interval between two adjacent red LED chips 22 is the same as the interval between two adjacent green LED chips 23 in the row direction, and the interval between two adjacent red LED chips 22 and green LED chips 23 is the same in the row direction.
Further, a plurality of protrusions 10 are provided on the substrate 25, wherein a plurality of first protrusions 14 are covered on a plurality of red LED chips 22, and a plurality of second protrusions 15 are covered on a plurality of green LED chips 23. The projections of the first protrusions 14 and the second protrusions 15 on the substrate are circular and have the same area, and the projections of two adjacent first protrusions 14, two adjacent second protrusions 15, and two adjacent first protrusions 14 and second protrusions 15 on the substrate are tangent.
The first protrusion 14 includes a first resin projection 16 in a half first ellipsoid shape and a first light reflecting layer 17, the first resin projection 16 includes a first side surface in an ellipsoid shape and a flat first top surface, and the first light reflecting layer 17 is disposed on the first side surface and has a first opening 18 exposing the first top surface. The first opening 18 is provided as a light exit port of the red LED chip 22.
The second protrusion 15 includes a second resin protrusion 19 in a shape of a half second ellipsoid and a second light-reflecting layer 20, the second resin protrusion 19 includes a second side surface in an ellipsoid shape and a flat second top surface, and the second light-reflecting layer 20 is disposed on the second side surface and has a second opening 21 exposing the second top surface. The second opening 21 is provided as a light exit port of the green LED chip 23.
Wherein the center of the first opening 18 is opposite to the center of the red LED chip 22, and the center of the second opening 21 is opposite to the center of the green LED chip 23. Also, since the light emitting intensity per unit area of the green LED chip is maximized, the area of the second opening 21 is smaller than that of the first opening 18 to reduce the light emitting area of the green LED chip.
Specifically, the first resin protrusion 16 and the second resin protrusion 19 may have a half-ellipsoid shape, wherein the eccentricity of the first resin protrusion 16 is greater than the eccentricity of the second resin protrusion 19, i.e., the ellipsoid of the first resin protrusion 16 is flatter, whereby different opening sizes can be obtained in the same grinding process, as will be described in detail in the following method.
The gaps 13 between the plurality of protrusions 10 are filled with resin portions 26, and the material of the resin portions 26 may be the same as the material of the first resin convex portions 16 and the second resin convex portions 19, and may be a resin or a polyimide material. The resin portion 26 has a flat top surface and is coplanar with the top surfaces of the first resin projection 16 and the second resin projection 19. Referring to fig. 2, the resin part 26 completely covers the plurality of blue LED chips 24, so that the blue LED chips can reflect light by means of the first and second reflective layers 17 and 20 when the light is emitted, thereby increasing collimation and unicity.
The following describes a method for manufacturing a micro LED display structure according to the present invention with reference to fig. 3 to 7, which specifically includes:
(1) providing a substrate, and fixing a plurality of micro LED chips on the substrate, wherein the micro LED chips comprise a plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips;
(2) injection-molding a plurality of first resin projections and a plurality of second resin projections on the substrate; the plurality of first resin convex parts are arranged in a plurality of rows along a first direction and respectively cover the plurality of red LED chips, and the plurality of first resin convex parts are in a half first ellipsoid shape; a plurality of second resin convex parts are arranged in a plurality of rows along the first direction and respectively cover the green LED chips, and the second resin convex parts are in a half second ellipsoid shape; wherein the height of the plurality of first resin projections is greater than the height of the plurality of second resin projections;
(3) depositing a first light reflecting layer and a second light reflecting layer on the surfaces of the first resin convex parts and the second resin convex parts respectively, wherein the plurality of first resin convex parts and the first light reflecting layer form a plurality of first protrusions, and the plurality of second resin convex parts and the second light reflecting layer form a plurality of second protrusions;
(4) covering the substrate with a resin portion having a height greater than the height of the plurality of first resin projections;
(5) grinding the upper surface of the resin part until part of the plurality of first resin convex parts and the plurality of second resin convex parts are removed; the first resin convex part comprises an ellipsoid-shaped first side surface and a flat first top surface, the first light reflecting layer is arranged on the first side surface and is provided with a first opening exposed out of the first top surface, the second resin convex part comprises an ellipsoid-shaped second side surface and a flat second top surface, the second light reflecting layer is arranged on the second side surface and is provided with a second opening exposed out of the second top surface, and the first top surface, the second top surface and the top surface of the resin part are coplanar.
Referring first to fig. 3, a substrate 25 is provided, and a plurality of micro LED chips including a plurality of red LED chips 22, a plurality of green LED chips 23, and a plurality of blue LED chips arranged in a row are fixed on the substrate 25, electrically connected at predetermined positions, and electrically connected to a circuit layer in the substrate 25.
Next, referring to fig. 4, a plurality of first resin projections 16 and a plurality of second resin projections 19 are formed on the base plate 25 by injection molding using a mold; the plurality of first resin projections 16 are arranged in a plurality of rows or a plurality of columns along the first direction and respectively cover the plurality of red LED chips 22, and the plurality of first resin projections 16 have a half first ellipsoid shape; the plurality of second resin protrusions 19 are arranged in a plurality of rows or columns along the first direction and respectively cover the plurality of green LED chips 23, the second resin protrusions 19 have a half second ellipsoid shape, wherein an eccentricity of the second ellipsoid shape is smaller than an eccentricity of the first ellipsoid shape, and a height of the plurality of first resin protrusions 16 is greater than a height of the plurality of second resin protrusions 19.
Referring to fig. 5, metal layers are formed on the surfaces of the first and second resin protrusions 16 and 19 by a vapor deposition method to constitute a first light reflecting layer 17 and a second light reflecting layer 20, respectively, wherein the plurality of first resin protrusions 16 and the first light reflecting layer 17 constitute a plurality of first protrusions 14, and the plurality of second resin protrusions 19 and the second light reflecting layer 20 constitute a plurality of second protrusions 15.
The projections of the first protrusions 14 and the second protrusions 15 on the substrate 25 are circular and have the same area, and the projections of two adjacent first protrusions 14, two adjacent second protrusions 15, and two adjacent first protrusions 14 and second protrusions 15 on the substrate are tangent.
Then, a resin portion 26 is covered on the substrate 25, and the height of the resin portion 26 is larger than the height of the plurality of first resin projections 16, see fig. 6 in particular.
Referring to fig. 7, the upper surface of the resin portion 26 is ground by a chemical mechanical polishing process until portions of the plurality of first resin projections 16 and the plurality of second resin projections 19 are removed; the first resin projection 16 includes an ellipsoid-shaped first side surface and a flat first top surface, the first light-reflecting layer 17 is disposed on the first side surface and has a first opening 18 exposing the first top surface, the second resin projection 19 includes an ellipsoid-shaped second side surface and a flat second top surface, the second light-reflecting layer 20 is disposed on the second side surface and has a second opening 21 exposing the second top surface, and the first top surface and the second top surface are coplanar with the top surface of the resin portion 26.
The invention uses the first projection and the second projection as the sub pixel points, and uses the reflecting layer arranged outside the first projection and the second projection to realize the collimation and the unicity of light outgoing, and the other sub pixel point is designed at the position among the plurality of projections, thereby realizing the full light mixing. In addition, in the manufacturing method, the protrusion structures with different heights or sections and different eccentricities can be formed so as to realize different light emitting areas and realize optimization of light mixing effect.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (9)
1. A micro LED display structure, comprising:
a substrate;
the micro LED chips are fixed on the substrate and comprise a plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips;
the first protrusions are arranged in a plurality of rows along a first direction and respectively cover the red LED chips, each first protrusion comprises a first resin convex part in a half first ellipsoid shape and a first light reflecting layer, each first resin convex part comprises a first side surface in an ellipsoid shape and a first flat top surface, and each first light reflecting layer is arranged on the first side surface and is provided with a first opening exposing the first top surface;
a plurality of second protrusions arranged in a plurality of rows along a first direction and respectively covering the plurality of green LED chips, wherein the second protrusions include a second resin protrusion in a shape of a half second ellipsoid and a second light-reflecting layer, the second resin protrusion includes a second side surface in an ellipsoid shape and a second top surface, and the second light-reflecting layer is disposed on the second side surface and has a second opening exposing the second top surface;
a resin part filled between the first protrusion and the second protrusion and covering the plurality of blue LED chips;
wherein the first top surface and the second top surface are coplanar with the top surface of the resin part.
2. The micro LED display structure of claim 1, wherein: the first protrusions and the second protrusions are alternately arranged in sequence in a second direction, wherein the first direction is perpendicular to the second direction.
3. The micro LED display structure of claim 2, wherein: the projections of the first protrusions and the second protrusions on the substrate are circular and have the same area, and the projections of the adjacent two first protrusions, the adjacent two second protrusions, and the adjacent first protrusions and the adjacent second protrusions on the substrate are tangent.
4. The micro LED display structure of claim 3, wherein: the blue LED chip is arranged in a gap defined by two adjacent first protrusions and two adjacent second protrusions, and is provided with a light outlet on the top surface of the resin part, the area of the light outlet is larger than that of the first opening, and the area of the first opening is larger than that of the second opening.
5. A method of fabricating a micro LED display structure, comprising:
(1) providing a substrate, and fixing a plurality of micro LED chips on the substrate, wherein the micro LED chips comprise a plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips;
(2) injection-molding a plurality of first resin projections and a plurality of second resin projections on the substrate; the plurality of first resin convex parts are arranged in a plurality of rows along a first direction and respectively cover the plurality of red LED chips, and the plurality of first resin convex parts are in a half first ellipsoid shape; a plurality of second resin convex parts are arranged in a plurality of rows along the first direction and respectively cover the green LED chips, and the second resin convex parts are in a half second ellipsoid shape; wherein the height of the plurality of first resin projections is greater than the height of the plurality of second resin projections;
(3) depositing a first light reflecting layer and a second light reflecting layer on the surfaces of the first resin convex parts and the second resin convex parts respectively, wherein the plurality of first resin convex parts and the first light reflecting layer form a plurality of first protrusions, and the plurality of second resin convex parts and the second light reflecting layer form a plurality of second protrusions;
(4) covering the substrate with a resin portion having a height greater than the height of the plurality of first resin projections;
(5) grinding the upper surface of the resin part until part of the plurality of first resin convex parts and the plurality of second resin convex parts are removed; the first resin convex part comprises an ellipsoid-shaped first side surface and a flat first top surface, the first light reflecting layer is arranged on the first side surface and is provided with a first opening exposed out of the first top surface, the second resin convex part comprises an ellipsoid-shaped second side surface and a flat second top surface, the second light reflecting layer is arranged on the second side surface and is provided with a second opening exposed out of the second top surface, and the first top surface, the second top surface and the top surface of the resin part are coplanar.
6. The method of manufacturing a micro LED display structure of claim 5, wherein: the first protrusions and the second protrusions are alternately arranged in sequence in a second direction, wherein the first direction is perpendicular to the second direction.
7. The method of manufacturing a micro LED display structure of claim 6, wherein: the projections of the first protrusions and the second protrusions on the substrate are circular and have the same area, and the projections of the adjacent two first protrusions, the adjacent two second protrusions, and the adjacent first protrusions and the adjacent second protrusions on the substrate are tangent.
8. The method of manufacturing a micro LED display structure of claim 7, wherein: the blue LED chip is arranged in a gap defined by two adjacent first protrusions and two adjacent second protrusions, and is provided with a light outlet on the top surface of the resin part, the area of the light outlet is larger than that of the first opening, and the area of the first opening is larger than that of the second opening.
9. The method of manufacturing a micro LED display structure of claim 5, wherein: the first light reflecting layer and the second light reflecting layer are metal layers and are formed by a vapor deposition method.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109411458A (en) * | 2018-11-14 | 2019-03-01 | 易美芯光（北京）科技有限公司 | A kind of MICRO light-emitting diode display part and preparation method thereof |
| CN110364555A (en) * | 2019-06-27 | 2019-10-22 | 昆山国显光电有限公司 | A kind of organic light emitting display panel and display device |
| CN113130461A (en) * | 2018-10-22 | 2021-07-16 | 海信视像科技股份有限公司 | Light emitting diode lamp panel, protection packaging method thereof, backlight module and display device |
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| US10304813B2 (en) * | 2015-11-05 | 2019-05-28 | Innolux Corporation | Display device having a plurality of bank structures |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130461A (en) * | 2018-10-22 | 2021-07-16 | 海信视像科技股份有限公司 | Light emitting diode lamp panel, protection packaging method thereof, backlight module and display device |
| CN109411458A (en) * | 2018-11-14 | 2019-03-01 | 易美芯光（北京）科技有限公司 | A kind of MICRO light-emitting diode display part and preparation method thereof |
| CN110364555A (en) * | 2019-06-27 | 2019-10-22 | 昆山国显光电有限公司 | A kind of organic light emitting display panel and display device |
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