CN113451282B - LED packaging structure and display - Google Patents

LED packaging structure and display Download PDF

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Publication number
CN113451282B
CN113451282B CN202111025834.4A CN202111025834A CN113451282B CN 113451282 B CN113451282 B CN 113451282B CN 202111025834 A CN202111025834 A CN 202111025834A CN 113451282 B CN113451282 B CN 113451282B
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China
Prior art keywords
led chips
top surface
transparent
lead frame
package structure
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CN202111025834.4A
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Chinese (zh)
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CN113451282A (en
Inventor
罗雪方
陈文娟
罗子杰
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Luohuaxin Display Technology Development Jiangsu Co ltd
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Luohuaxin Display Technology Development Jiangsu Co ltd
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Publication of CN113451282A publication Critical patent/CN113451282A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an LED packaging structure and a display, comprising: the LED chips are welded on the lead frame and at least comprise three LED chips; the transparent protruding parts are arranged on the lead frame and respectively cover the LED chips; the transparent convex parts respectively comprise an inclined first top surface, and the first top surface and the lead frame form an acute included angle; the reflecting layer is covered on the side surfaces of the transparent convex parts and exposes out of the first top surface. The collimation of the light can be ensured, and the purpose of adjusting the light-emitting angle is realized.

Description

LED packaging structure and display
Technical Field
The invention relates to the field of light emitting diode packaging display, in particular to an LED packaging structure and a display.
Background
The LED display is widely applied to display modules such as instrument equipment, intelligent equipment and communication equipment, the packaging reliability of the LED display and the light emitting uniformity of a single pixel point influence the display effect. The existing LED display is often formed by arranging a plurality of pixel module arrays integrating sub-pixel LEDs, each pixel module may include a plurality of LED chips, and the plurality of LED chips emit light of different colors to form a color-adjustable pixel point.
Disclosure of Invention
The invention provides an LED packaging structure, which comprises: a lead frame; the LED chips are welded on the lead frame and at least comprise three LED chips; the transparent protruding parts are arranged on the lead frame and respectively cover the LED chips; the transparent convex parts respectively comprise an inclined first top surface, and the first top surface and the lead frame form an acute included angle; the reflecting layer is covered on the side surfaces of the transparent convex parts and exposes out of the first top surface; and the sealing part wraps the transparent convex parts and is provided with a second top surface coplanar with the first top surface.
According to an embodiment of the present invention, the second top surface is a tapered surface with an upward opening, and the plurality of transparent protrusions have a central axis for emitting light.
According to an embodiment of the present invention, the central axes of the first top surfaces of the transparent protrusions are all directed toward the central axis.
According to the embodiment of the invention, the central axis passes through the fixed point of the conical surface and is perpendicular to the plane of the lead frame.
According to the embodiment of the invention, the central shaft passes through the fixed point of the conical surface and forms a non-right-angle included angle with the plane of the lead frame.
According to an embodiment of the present invention, the plurality of LED chips include red LED chips, green LED chips, and blue LED chips, wherein areas of first top surfaces of the transparent protrusions corresponding to the red LED chips, the green LED chips, and the blue LED chips are different from each other, an area of the first top surface of the transparent protrusion corresponding to the blue LED chip is larger than an area of the first top surface of the transparent protrusion corresponding to the red LED chip, and an area of the first top surface of the transparent protrusion corresponding to the red LED chip is larger than an area of the first top surface of the transparent protrusion corresponding to the green LED chip.
According to an embodiment of the present invention, further comprising a lens structure on the sealing part, the lens structure forming a convex lens structure by injection molding.
According to an embodiment of the present invention, the lead frame includes a plurality of lead portions, lower surfaces of which are exposed from the sealing portion.
The invention also provides a display which comprises a plurality of LED packaging structures arranged in an array.
The invention has the following advantages:
the LED light source device realizes different light emitting areas of the LED chips with different colors by utilizing the plurality of transparent convex parts, and realizes the light emitting collimation of the sub-pixels (namely the LED chips with single color) by combining the reflection of the reflecting layer, thereby realizing the light emitting collimation of each pixel; moreover, the viewing angle of the display can be adjusted by adjusting the orientation of the top surfaces of the plurality of transparent protrusions and adjusting the light-emitting angle of a single pixel.
Drawings
FIG. 1 is a top view of an LED package structure of the present invention;
FIG. 2 is a cross-sectional view taken along line C1C2 of FIG. 1;
FIG. 3 is a cross-sectional view of another embodiment taken along line C1C2 of FIG. 1;
fig. 4-11 are schematic diagrams of methods of fabricating LED package structures of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
An LED package structure and a method of manufacturing the same according to the disclosed embodiments of the invention will be described in detail below with reference to the accompanying drawings.
Referring to fig. 1-2, the LED package structure 100 of this embodiment includes a lead frame 10, and the lead frame 10 is disposed in the same plane and may be made of copper or copper alloy. The lead frame 10 includes a plurality of lead portions including a carrier portion for carrying the LED chip and lead terminal portions for electrically connecting only the lead terminals.
A plurality of LED chips are soldered and fixed on the lead frame 10, and as shown in fig. 1, the plurality of LED chips include a red LED chip 11, a green LED chip 12, and a blue LED chip 13, but of course, the plurality of LED chips may include more LED chips as long as they can realize a pixel function, and may further include, for example, a white LED chip. Each of the plurality of LED chips is LED out by a separate terminal to enable separate control of the LED chips of different colors. The plurality of LED chips may be conventional GaN-based LED chips, or micro LED chips.
A transparent protrusion is disposed on each of the LED chips, wherein a first transparent protrusion 14 covers the red LED chip 11, a second transparent protrusion 15 covers the green LED chip 12, and a third transparent protrusion 16 covers the blue LED chip. Wherein, when viewed from above, the plurality of transparent protrusions may have an elliptical shape with the same area.
The first to third transparent protrusions 14 to 16 respectively have a first top surface 21, a second top surface 22, and a third top surface 23 thereon, the first top surface 21, the second top surface 22, and the third top surface 23 are all inclined planes with respect to the plane of the lead frame 10, and the light-emitting directions of the first top surface 21, the second top surface 22, and the third top surface 23 intersect at a point on the central axis of light-emitting of a pixel composed of a plurality of LED chips. As shown in fig. 2, the central axis O is perpendicular to the plane of the lead frame 10, so that the light emitted from the plurality of LED chips is emitted toward the central axis O, where the light is mixed and emitted in the direction of the central axis O.
A plurality of transparent bellyings can be at its bottom butt to reduce the size and the light-emitting area of pixel, improve resolution ratio. As shown in FIG. 1, the first to third transparent protrusions 14-16 are abutted in pairs to define a hollow region.
In order to improve the collimation degree of light emission, a reflective layer is further arranged on the side surfaces of the plurality of transparent protrusions, and the reflective layer is a metal reflective coating, wherein the first reflective layer 17, the second reflective layer 18 and the third reflective layer 19 respectively expose the first top surface 21, the second top surface 22 and the third top surface 23, so that the first top surface 21, the second top surface 22 and the third top surface 23 are used as light emitting surfaces of each corresponding LED chip.
A sealing part 20 is disposed on the lead frame 10 and between the plurality of transparent protrusions, and the sealing part 20 is a resin material, which may be epoxy resin, polyimide, teflon, or the like. The sealing portion 20 has a top surface 24, the top surface 24 is a conical surface with an upward opening, and the central axis O passes through the apex of the conical surface. And, the top surface 24 is disposed coplanar with the first, second and third top surfaces 21, 22 and 23.
Referring to fig. 2, the LED package structure further includes a lens structure 25 on the sealing part 20, and the lens structure 25 forms a convex lens structure by injection molding, which is used to improve the transmission of light and increase the collimation of light outgoing.
In the above embodiment, the light-emitting angle of the package structure is substantially along the central axis O, but preferably, the direction of the central axis O can be realized by adjusting the top surface 24 of the sealing part 20. Referring specifically to fig. 3, the central axis O in fig. 2 is perpendicular to the plane of the lead frame 10, and the central axis O1 in fig. 3 forms a non-right angle with the plane of the lead frame 10, so that the light-emitting angle can be adjusted reasonably. The structure of fig. 3 can be easily formed, and particularly, referring to fig. 8, only the grinding tool 30 is required to be disposed obliquely to the plane of the lead frame 10 for performing the grinding process, and particularly, the manufacturing method of the LED package structure provided by the present invention is described in detail.
The LED package structure of the present invention can ensure the collimation of light, realize the adjustment of the viewing angle, and the manufacturing method is simple, and the manufacturing method of the LED package structure of the present invention will be described with reference to fig. 4 to 11.
Specifically, referring first to fig. 4, a lead frame 10 is provided, and a plurality of LED chips, i.e., a red LED chip 11, a green LED chip 12, and a blue LED chip 13 or more other LED chips, are fixed on the lead frame 10, and may be electrically connected and fixed by way of solder ball flip or lead-up.
A plurality of transparent protrusions are formed on each LED chip using a resin material and by an injection molding method and cured, see fig. 5. The plurality of transparent protrusions are formed on the lead frame 10 and may have different heights, as shown in fig. 5, the height of the first transparent protrusion 14 corresponding to the red LED chip 11 is greater than that of the second transparent protrusion 15 corresponding to the green LED chip 12, so that when a part of the transparent protrusions is removed by subsequent grinding, the first top surface 21 and the second top surface 22 having different areas may be obtained. Accordingly, the third transparent protrusions 16 corresponding to the blue LED chips 13 may have a higher height.
Referring to fig. 6, a layer of metal is formed on the lead frame 10 by plating or vapor deposition, and the layer of metal is formed on the side surfaces of the first to third convex portions 14 to 16 to serve as a reflective layer.
Then, a sealing part 20 is injection molded, which sealing part 20 should cover the upper surface of the lead frame 10, see fig. 7 in particular. However, for the subsequent splicing of the LED package structures to form a display panel, the lower surface of the lead frame 10 is exposed from the sealing part 20 to facilitate the bottom electrical connection with the driving module without being LED out from the side so that the adjacent LED package modules are spaced apart.
Next, referring to fig. 8, a grinding tool 30 is provided, the grinding tool 30 having a grinding surface 31, the grinding surface 31 being a downwardly protruding conical surface shaped to match the top surface 24 of the seal portion 20 in fig. 2 or 3. The grinding surface 31 of the grinding tool 30 is ground towards the sealing part 20 until part of the transparent protrusions are removed to form the top surface 24 of the sealing part 20 and the first, second and third top surfaces 21, 22, 23, see fig. 9.
Finally, a lens structure 25 is formed, which lens structure 25 may be formed by a transparent polymer material having a convex surface. Thus, the LED packaging structure is formed.
The LED package structure 100 of the present invention can be assembled into a display, as shown in fig. 11, a plurality of LED package structures 100 are assembled on a driving substrate (not shown) without any gap, which is beneficial to the package structure of the lead frame 20 with only its lower surface exposed.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.

Claims (9)

1. An LED package structure, comprising:
a lead frame;
the LED chips are welded on the lead frame and at least comprise three LED chips;
the transparent protruding parts are arranged on the lead frame and respectively cover the LED chips; the transparent convex parts respectively comprise an inclined first top surface, and the first top surface and the lead frame form an acute included angle;
the reflecting layer is covered on the side surfaces of the transparent convex parts and exposes out of the first top surface;
and the sealing part wraps the transparent convex parts and is provided with a second top surface coplanar with the first top surface.
2. The LED package structure of claim 1, wherein: the second top surface is a conical surface with an upward opening, and the plurality of transparent protrusions are provided with a light-emitting central shaft.
3. The LED package structure of claim 2, wherein: the central axes of the first top surfaces of the transparent convex parts face the central axis.
4. The LED package structure of claim 3, wherein: the central shaft passes through the fixed point of the conical surface and is vertical to the plane of the lead frame.
5. The LED package structure of claim 3, wherein: the central shaft penetrates through the fixed point of the conical surface and forms a non-right-angle included angle with the plane where the lead frame is located.
6. The LED package structure of claim 4 or 5, wherein: the plurality of LED chips comprise red light LED chips, green light LED chips and blue light LED chips, wherein the areas of the first top surfaces of the transparent protrusions corresponding to the red light LED chips, the green light LED chips and the blue light LED chips are different from each other, the area of the first top surface of the transparent protrusion corresponding to the blue light LED chips is larger than the area of the first top surface of the transparent protrusion corresponding to the red light LED chips, and the area of the first top surface of the transparent protrusion corresponding to the red light LED chips is larger than the area of the first top surface of the transparent protrusion corresponding to the green light LED chips.
7. The LED package structure of claim 1, wherein: and the lens structure is arranged on the sealing part and is formed into a convex lens structure through injection molding.
8. The LED package structure of claim 7, wherein: the lead frame includes a plurality of lead portions, and lower surfaces of the plurality of lead portions are exposed from the sealing portion.
9. A display comprising a plurality of LED packages according to any one of claims 1 to 8 arranged in an array.
CN202111025834.4A 2021-09-02 2021-09-02 LED packaging structure and display Active CN113451282B (en)

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CN113451282B true CN113451282B (en) 2021-11-09

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113130461A (en) * 2018-10-22 2021-07-16 海信视像科技股份有限公司 Light emitting diode lamp panel, protection packaging method thereof, backlight module and display device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI220076B (en) * 2003-08-27 2004-08-01 Au Optronics Corp Light-emitting device
TWM397030U (en) * 2010-08-16 2011-01-21 Liang Meng Plastic Share Co Ltd LED packaging structure
US10304813B2 (en) * 2015-11-05 2019-05-28 Innolux Corporation Display device having a plurality of bank structures

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113130461A (en) * 2018-10-22 2021-07-16 海信视像科技股份有限公司 Light emitting diode lamp panel, protection packaging method thereof, backlight module and display device

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