CN113449393A - Array hole machining method - Google Patents

Array hole machining method Download PDF

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CN113449393A
CN113449393A CN202110708830.XA CN202110708830A CN113449393A CN 113449393 A CN113449393 A CN 113449393A CN 202110708830 A CN202110708830 A CN 202110708830A CN 113449393 A CN113449393 A CN 113449393A
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CN113449393B (en
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王春喜
郝栋
安俊玲
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Xi'an Qunjian Aviation Precision Manufacturing Co ltd
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Xi'an Qunjian Aviation Precision Manufacturing Co ltd
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    • G06F30/17—Mechanical parametric or variational design
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    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
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Abstract

The application discloses an array hole machining method, belongs to the technical field of electric spark machining, and can solve the problem of poor accuracy of machining array holes. The array hole processing method comprises the following steps: acquiring N first coordinate values and N second coordinate values corresponding to N array holes, wherein each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer; respectively determining N deviation values according to N target coordinate values based on M corresponding relations, wherein each corresponding relation is a corresponding relation between one coordinate value and one deviation value, and one target coordinate value comprises at least one of the following items: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer; respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value, and one second coordinate value corresponds to one third coordinate value; and machining the N array holes according to the N first coordinate values and the N third coordinate values.

Description

Array hole machining method
Technical Field
The application belongs to the technical field of array hole machining, and particularly relates to an array hole machining method.
Background
Generally, on a side wall of a combustor part of an aircraft engine, a plurality of array holes for film cooling may be provided to dissipate heat of the combustor part through the plurality of array holes. Generally, when a plurality of array holes are machined in a combustion chamber part by using a spark erosion small hole machining process, a scribing line is firstly carried out on the combustion chamber part according to machining parameters of the plurality of array holes to add a scribing line, then a machining electrode is aligned with the scribing line, and each array hole is machined one by one to carry out machining operation of the plurality of array holes.
However, the alignment of the machining electrode to the scribe line may not be performed, which may result in a large error in the machined array holes.
Thus, the precision of processing the array holes is poor.
Disclosure of Invention
The embodiment of the application aims to provide a method for processing array holes, which can solve the problem of poor accuracy of processing the array holes.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a method for processing an array hole, where the method includes: acquiring N first coordinate values and N second coordinate values corresponding to N array holes, wherein each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer: respectively determining N deviation values according to N target coordinate values based on M corresponding relations, wherein each corresponding relation is a corresponding relation between one coordinate value and one deviation value, and one target coordinate value comprises at least one of the following items: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer; respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value, and one second coordinate value corresponds to one third coordinate value; and machining the N array holes according to the N first coordinate values and the N third coordinate values.
In a second aspect, an embodiment of the present application provides an array hole processing apparatus, including: the device comprises an acquisition module, a determination module and an operation module. The acquisition module is used for acquiring N first coordinate values and N second coordinate values corresponding to N array holes, each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer. A determining module, configured to determine N offset values according to N target coordinate values based on M corresponding relationships, where each corresponding relationship is a corresponding relationship between one coordinate value and one offset value, and one target coordinate value includes at least one of the following: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer; and respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value and one second coordinate value corresponds to one third coordinate value. And the operation module is used for processing the N array holes according to the N first coordinate values and the N third coordinate values determined by the determination module.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instructions stored on the memory and executable on the processor, and when executed by the processor, the program or instructions implement the steps of the method according to the first aspect.
In a fourth aspect, embodiments of the present application provide a readable storage medium, on which a program or instructions are stored, which when executed by a processor implement the steps of the method according to the first aspect.
In a fifth aspect, an embodiment of the present application provides a chip, where the chip includes a processor and a communication interface, where the communication interface is coupled to the processor, and the processor is configured to execute a program or instructions to implement the method according to the first aspect.
In this embodiment, the array hole processing apparatus may obtain N first coordinate values and N second coordinate values corresponding to N array holes, respectively determine N offset values according to the N first coordinate values (and/or one second coordinate value) based on M correspondence relationships (each correspondence relationship is a correspondence relationship between one coordinate value and one offset value), respectively determine N third coordinate values based on the N offset values and the N second coordinate values, and perform processing operations on the N array holes according to the N first coordinate values and the N third coordinate values. Because the array hole processing device can acquire the first coordinate value and the second coordinate value of the N array holes firstly, and respectively determine the N deviation values according to the first coordinate value (and/or the second coordinate value) of the N array holes based on the M corresponding relation so as to determine the N third coordinate values, and process the N array holes according to the N first coordinate values and the N third coordinate values, therefore, the situation that the processing electrode is not aligned with the scribed line can be avoided, the error of the processed array hole can be reduced, and thus, the precision of processing the array hole can be improved.
Drawings
Fig. 1 is a schematic diagram of an array hole processing method provided in an embodiment of the present application;
fig. 2 is a second schematic diagram of a method for processing array holes according to an embodiment of the present disclosure;
fig. 3 is a third schematic diagram of an array hole processing method provided in the embodiment of the present application;
FIG. 4 is a fourth schematic diagram illustrating an array hole processing method according to an embodiment of the present disclosure;
FIG. 5 is a schematic view of a work piece with a work table corresponding to N array holes;
fig. 6 is a schematic structural diagram of an array hole processing apparatus provided in an embodiment of the present application;
fig. 7 is a second schematic structural diagram of an array hole processing apparatus provided in an embodiment of the present application;
fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and the terms "first", "second", and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, and the character "/", generally means that the objects related to each other before and after are in a relationship of "or".
The array hole processing method provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
Fig. 1 shows a flowchart of an array hole processing method provided in an embodiment of the present application. As shown in fig. 1, the array hole processing method provided in the embodiment of the present application may include steps 101 to 104 described below.
Step 101, the array hole processing device acquires N first coordinate values and N second coordinate values corresponding to N array holes.
Optionally, in this embodiment of the application, after a user inputs N pieces of coordinate information of N array holes in the array hole processing device (each piece of coordinate information corresponds to one array hole, respectively), the array hole processing device may obtain the N pieces of coordinate information according to the input of the user to the array hole processing device, so as to obtain N first coordinate values and N second coordinate values.
Further optionally, in this embodiment of the application, for each coordinate information in the N coordinate information, one coordinate information may include a first coordinate value and a second coordinate value, where the first coordinate value is used to represent a motion parameter of the stage, and the second coordinate value is used to represent a distance from the target point to an array hole. Wherein, the motion parameter may specifically be any one of the following: angle of rotation, distance of movement, etc.
Further optionally, in this embodiment of the application, each of the N first coordinate values is different. Each of the N second coordinate values may be the same, or some of the N second coordinate values may be the same.
For example, if a first coordinate value is used to characterize the rotation angle of the table, a second coordinate value is used to characterize the distance of an array aperture from the center of rotation (gyration).
In this embodiment, each array hole of the N array holes corresponds to a first coordinate value, each array hole corresponds to a second coordinate value, and N is a positive integer.
It can be understood that the array hole machining device can control the workbench to move according to a first coordinate value and a second coordinate value of one array hole, so that the machining electrode can be aligned to the position to be machined corresponding to the array hole.
Optionally, in this embodiment of the present application, the N array holes may be any one of: annular array holes, rectangular array holes, etc.
And 102, respectively determining N deviation values by the array hole machining device according to the N target coordinate values based on the M corresponding relations.
In an embodiment of the present application, each of the M corresponding relationships is a corresponding relationship between a coordinate value and an offset value, and a target coordinate value includes at least one of the following: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer.
Optionally, in this embodiment of the application, the M corresponding relationships may specifically be: and (4) pre-storing the corresponding relation in the array hole processing device.
Optionally, in this embodiment of the application, for each coordinate value in the M coordinate values, one coordinate value is used to characterize a motion parameter of the stage, and one offset value is used to characterize an offset value between the array hole and the target point.
In the embodiment of the application, because the workpiece corresponding to the N array holes (i.e., the workpiece to be processed with the N array holes) may deform, if the programming processing is still performed according to the theoretical perfect circle position, the N coordinate information of the N array holes may be inaccurate, that is, the included angle between adjacent array holes of the N array holes and the size of the hole center distance end face do not meet the requirements, and therefore, the offset value of each array hole can be determined according to the M corresponding relations, so that the position of the processing electrode can be adjusted.
Optionally, in this embodiment of the application, the M target coordinate values may specifically be any one of the following: a first coordinate value; a first coordinate value and a second coordinate value.
Optionally, in a possible implementation manner of the embodiment of the present application, the one target coordinate value is a second coordinate value. Specifically, referring to fig. 1, as shown in fig. 2, the step 102 may be implemented by a step 102a and a step 102b described below.
And 102a, determining a third coordinate value matched with the ith target coordinate value from M coordinate values in the M corresponding relations by the array hole machining device according to the ith target coordinate value in the N target coordinate values.
In the embodiment of the application, i is a positive integer.
It should be noted that the above "matching" can be understood as: the difference is equal to or smaller than the preset threshold.
And 102b, determining the offset value corresponding to the third coordinate value as the ith offset value by the array hole machining device.
In this embodiment, the ith offset value corresponds to an ith target coordinate value.
It is understood that the above-mentioned ith offset value corresponds to the ith second coordinate value.
Exemplarily, let the coordinate information (central theoretical point) of the ith array well of the N array wells be P0(C0，X0) Wherein, C0Is the coordinate value of the rotation angle of the worktable corresponding to the ith array hole, X0The distance of the ith array aperture from the target point (centre of gyration).
The array hole processing device may be according to C0From the M coordinate values, C is determined0A third coordinate value (e.g. C) matchedn) And mixing the CnCorresponding offset value (e.g. X)n) And determined as the ith offset value.
In this embodiment, the array hole processing apparatus may determine the N offset values by using the step 102a and the step 102b according to each target coordinate value of the N target coordinate values.
Therefore, the condition that workpieces corresponding to the N array holes (namely the workpieces of the N array holes to be processed) deform can occur, if programming processing is still performed according to the theoretical perfect circle position, the condition that N coordinate information of the N array holes is inaccurate can be caused, namely, the included angle of the N array holes adjacent to each other and the size of the hole center distance end face do not meet the requirement, therefore, the deviation value of each array hole can be determined according to the M corresponding relations, the position of a processing electrode can be adjusted, and therefore the accuracy of the determined position of the array hole can be improved.
Optionally, in another possible implementation manner of the embodiment of the present application, the one target coordinate value includes a first coordinate value and a second coordinate value. Specifically, referring to fig. 1, as shown in fig. 3, the step 102 may be implemented by a step 102c and a step 102d described below.
Step 102c, the array hole machining device determines a fourth coordinate value and a fifth coordinate value corresponding to the ith first coordinate value from the M coordinate values in the M correspondence relations according to the ith first coordinate value in the N target coordinate values.
In the embodiment of the application, i is a positive integer.
In an embodiment of the present invention, the fourth coordinate value is smaller than the ith first coordinate value, and the fifth coordinate value is larger than the ith first coordinate value.
Optionally, in this embodiment of the application, the fourth coordinate value may specifically be: the largest coordinate value in the M coordinate values which is smaller than the ith first coordinate value; the fifth coordinate value may be specifically: and the minimum coordinate value in the coordinate values of the M coordinate values is larger than the ith first coordinate value.
Illustratively, assuming that M coordinate values are {1, 3, 5, 7, 9, 11}, the ith first coordinate value is {6}, and the fourth coordinate value is the largest coordinate value among the M coordinate values smaller than {6} (i.e., {1, 3, 5}), i.e., {5 }; the fifth coordinate value is the smallest coordinate value of the M coordinate values larger than {6} (i.e., {7, 9, 11}), i.e., {7 }.
And 102d, determining the ith offset value by the array hole machining device based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value.
In this embodiment of the present application, the ith offset value corresponds to an ith first coordinate value, and the ith offset value corresponds to an ith second coordinate value.
Alternatively, the array hole processing device may determine the ith offset value based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value by using the first algorithm.
As will be described in detail below, the array hole processing apparatus determines the ith offset value based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value using the first algorithm.
Optionally, in this embodiment of the application, the step 102d may be specifically implemented by the following steps 102d1 to 102d 4.
Step 102d1, the array hole processing device determines the first value according to the difference between the fifth coordinate value and the fourth coordinate value.
Step 102d2, the array hole processing device determines the second numerical value according to the difference between the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value.
Step 102d3, the array hole processing device determines a third numerical value according to the fourth coordinate value and the ith first coordinate value.
Step 102d4, the array hole processing device determines the ith offset value according to the offset value corresponding to the fourth coordinate value, the first numerical value, the second numerical value and the third numerical value.
It is to be understood that the first algorithm may specifically be:
Figure BDA0003132456010000081
cn＜c0＜cn+1
wherein Q isiIs the ith offset value, C0Is the rotation angle coordinate value of the workbench corresponding to the ith array hole, CnIs a fourth coordinate value, CnCorresponding offset value Xn，Cn+1Is a fifth coordinate value, Cn+1Corresponding offset value Xn+1。
Therefore, the condition that workpieces corresponding to the N array holes (namely the workpieces of the N array holes to be processed) deform can occur, if programming processing is still performed according to the theoretical perfect circle position, the condition that N coordinate information of the N array holes is inaccurate can be caused, namely, the included angle of the N array holes adjacent to each other and the size of the hole center distance end face do not meet the requirement, therefore, the deviation value of each array hole can be determined according to the M corresponding relations, the position of a processing electrode can be adjusted, and therefore the accuracy of the determined position of the array hole can be improved.
And 103, respectively determining N third coordinate values by the array hole machining device based on the N deviation values and the N second coordinate values.
In the embodiment of the present application, for each of the N offset values, one offset value corresponds to one third coordinate value, and one second coordinate value corresponds to one third coordinate value.
Alternatively, in this embodiment, the array hole machining device may determine the sum of the first offset value and the first second coordinate value as the first third coordinate value, determine the sum of the second offset value and the second coordinate value as the second third coordinate value, and so on to determine the N third coordinate values.
Alternatively, in this embodiment of the application, in a case that one target coordinate value is one second coordinate value, the array hole processing device may determine, by using a second algorithm, N third coordinate values according to the N offset values and the N second coordinate values, respectively.
Further optionally, in this embodiment of the application, the second algorithm may specifically be:
f(c0)＝x0+xn，c0＝cn
wherein, f (c)0) Is the ith third coordinate value, and the ith array hole coordinate information (the central theoretical point is) is P0(C0，X0)，C0Is the coordinate value of the rotation angle of the worktable corresponding to the ith array hole, X0Is the distance of the ith array hole from the target point (center of gyration), XnIs C0A third coordinate value (e.g. C) matchedn) The corresponding offset value.
Alternatively, in this embodiment, in a case where one target coordinate value includes one first coordinate value and one second coordinate value, the array hole machining device may determine N third coordinate values according to the N offset values and the N second coordinate values, respectively, by using a third algorithm.
Further optionally, in this embodiment of the application, the third algorithm may specifically be:
Figure BDA0003132456010000091
cn＜c0＜cn+1
wherein, f (c)0) Is the ith third coordinate value, and the ith array hole coordinate information (the central theoretical point is) is P0(C0，X0)，C0Is the coordinate value of the rotation angle of the worktable corresponding to the ith array hole, X0The distance of the ith array hole from the target point (center of gyration), CnIs a fourth coordinate value, CnCorresponding offset value Xn，Cn+1Is a fifth coordinate value, Cn+1Corresponding offset value Xn+1。
And 104, processing the N array holes by the array hole processing device according to the N first coordinate values and the N third coordinate values.
In this embodiment, since the workpiece corresponding to the N array holes may deform, which may cause the N second coordinate values to be inaccurate, the array hole processing apparatus may re-determine the N second coordinate values (i.e., the N third coordinate values) by using the steps 101 to 104, and perform the processing operation on the N array holes according to the N first coordinate values and the N third coordinate values.
In the array hole processing method provided in the embodiment of the present application, the array hole processing device may obtain N first coordinate values and N second coordinate values corresponding to N array holes, respectively determine N offset values according to the N first coordinate values (and/or one second coordinate value) based on M correspondence relationships (each correspondence relationship is a correspondence relationship between one coordinate value and one offset value), respectively determine N third coordinate values based on the N offset values and the N second coordinate values, and perform processing operations on the N array holes according to the N first coordinate values and the N third coordinate values. Because the array hole processing device can acquire the first coordinate value and the second coordinate value of the N array holes firstly, and respectively determine the N deviation values according to the first coordinate value (and/or the second coordinate value) of the N array holes based on the M corresponding relation so as to determine the N third coordinate values, and process the N array holes according to the N first coordinate values and the N third coordinate values, therefore, the situation that the processing electrode is not aligned with the scribed line can be avoided, the error of the processed array hole can be reduced, and thus, the precision of processing the array hole can be improved.
Optionally, in this embodiment of the application, with reference to fig. 1, as shown in fig. 4, before step 102, the array hole processing method provided in this embodiment of the application may further include step 201 and step 202 described above.
Step 201, the array hole processing device places the workpieces corresponding to the N array holes on a workbench, and controls the workbench to move according to the M coordinate values.
Further optionally, in this embodiment of the application, the workbench may be a rotary workbench.
Specifically, in the embodiment of the present application, a workpiece corresponding to the N array holes may be placed on a rotary table of an electric discharge drilling machine, and a rotation center (target point) of the workpiece may be found to coincide with a rotation center of the rotary table 1. (because the workpiece has deformation, the workpiece can be roughly aligned in a mode of centering pairs of point pairs of four quadrant points of the workpiece in pairs).
Further optionally, in this embodiment of the application, after the array hole processing device places the workpiece corresponding to the N array holes on the workbench, the gauge head of the dial indicator may be attached to the first end surface of the workpiece, and then the workbench is controlled to rotate according to the M coordinate values.
Specifically, in the embodiment of the present application, the first end mask may be: close to the end face of the target point.
For example, as shown in fig. 5, a workpiece 2 corresponding to N array holes is placed on a rotary table 1, and the workpiece 2 is a rotary workpiece, a dial indicator holder 4 may be disposed on a machine tool spindle 3, a dial indicator 5 is fixed on the dial indicator holder 4, and a head of the dial indicator 5 is close to a first end surface of the workpiece, so that the rotary table 1 may be controlled to rotate around a machine tool rotary table rotation axis c (target point) according to M coordinate values.
Step 202, the array hole processing device obtains M deviation values during the movement of the worktable, and establishes M corresponding relationships according to M coordinate values and M deviation values, respectively.
Further alternatively, in this embodiment of the application, the array hole processing apparatus may first control the workbench to move according to a first coordinate value of the M coordinate values, then read a reading of the dial indicator to obtain a first deviation value, and establish a first corresponding relationship according to the first coordinate value and the first deviation value, then may control the workbench to move according to a second coordinate value of the M coordinate values, then read a reading of the dial indicator to obtain a second deviation value, and establish a second corresponding relationship according to the second coordinate value and the second deviation value, and so on, so as to establish the M corresponding relationships.
As can be appreciated, the first and second,the C shaft of the working table can be rotated, the rotary working table 1 drives the workpieces corresponding to the N array holes to perform rotary motion, and the rotation angle coordinate C of the rotary working table of the machine tool is recorded according to corresponding frequencyMAnd angle of revolution CMReading X of corresponding dial indicatorMAll correspondences are recorded in the measurement point set PM(CM，XM) To obtain M correspondences.
It should be noted that, in the array hole processing method provided in the embodiment of the present application, the execution main body may be an array hole processing device, or a control module in the array hole processing device for executing the array hole processing method. In the embodiment of the present application, an example in which an array hole processing device executes an array hole processing method is taken as an example, and the array hole processing method provided in the embodiment of the present application is described.
Fig. 6 shows a schematic diagram of a possible structure of an array hole processing apparatus involved in the embodiments of the present application. As shown in fig. 6, the array hole processing device 60 may include: an acquisition module 61, a determination module 62 and an operation module 63.
The obtaining module 61 is configured to obtain N first coordinate values and N second coordinate values corresponding to the N array holes, where each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer. A determining module 62, configured to determine N offset values according to N target coordinate values based on M corresponding relationships, where each corresponding relationship is a corresponding relationship between one coordinate value and one offset value, and one target coordinate value includes at least one of the following: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer; and respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value and one second coordinate value corresponds to one third coordinate value. And the operation module 63 is configured to perform machining operations on the N array holes according to the N first coordinate values and the N third coordinate values determined by the determination module 62.
In a possible implementation manner, the one target coordinate value is a second coordinate value. The determining module 62 is specifically configured to determine, according to an ith target coordinate value of the N target coordinate values, a third coordinate value matched with the ith target coordinate value from M coordinate values of the M corresponding relationships, where i is a positive integer; and determining the offset value corresponding to the third coordinate value as the ith offset value. Wherein, the ith offset value corresponds to the ith target coordinate value.
In a possible implementation manner, the one target coordinate value includes a first coordinate value and a second coordinate value. The determining module 62 is specifically configured to determine, according to an ith first coordinate value of the N target coordinate values, a fourth coordinate value and a fifth coordinate value corresponding to the ith first coordinate value from M coordinate values of the M corresponding relationships, where i is a positive integer; and determining the ith offset value based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value. Wherein, the fourth coordinate value is smaller than the ith first coordinate value, and the fifth coordinate value is larger than the ith first coordinate value; the ith offset value corresponds to an ith first coordinate value, and the ith offset value corresponds to an ith second coordinate value.
In a possible implementation manner, the determining module 62 is specifically configured to determine the first numerical value according to a difference between the fifth coordinate value and the fourth coordinate value; determining a second numerical value according to the difference value between the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value; determining a third numerical value according to the fourth coordinate value and the ith first coordinate value; and determining the ith offset value according to the offset value corresponding to the fourth coordinate value, the first numerical value, the second numerical value and the third numerical value.
In a possible implementation manner, referring to fig. 6, as shown in fig. 7, the array hole processing apparatus 60 provided in the embodiment of the present application may further include: a control module 64 and a setup module 65. The control module 64 is configured to place the workpieces corresponding to the N array holes on the workbench, and control the workbench to move according to the M coordinate values. The establishing module 65 is configured to obtain M deviation values during the process that the control module 64 controls the motion of the workbench, and establish M corresponding relationships according to the M coordinate values and the M deviation values, respectively.
The array hole processing device provided by the embodiment of the application can acquire the first coordinate value and the second coordinate value of the N array holes firstly, and respectively determine the N deviation values according to the first coordinate value (and/or the second coordinate value) of the N array holes based on the M corresponding relation so as to determine the N third coordinate values, so that the processing operation of the N array holes can be carried out according to the N first coordinate values and the N third coordinate values, therefore, the situation that a processing electrode is not aligned to a scribed line can be avoided, the error of the processed array holes can be reduced, and thus, the precision of processing the array holes can be improved.
The array hole processing device in the embodiment of the present application may be a device, or may be a component in a terminal, an integrated circuit, or a chip. The device can be mobile electronic equipment or non-mobile electronic equipment. For example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop ultra-mobile personal computer (UMPC), a netbook, or the like, and the non-mobile electronic device may be a server, a Personal Computer (PC), or the like, and the embodiments of the present application are not limited in particular.
The array hole processing device in the embodiment of the present application may be a device having an operating system. The operating system may be a windows operating system, an iOS operating system, or other possible operating systems, and the embodiment of the present application is not particularly limited.
The array hole processing device provided in the embodiment of the present application can implement each process implemented by the method embodiments of fig. 1 to 5, and is not described here again to avoid repetition.
Optionally, as shown in fig. 8, an electronic device 70 is further provided in this embodiment of the present application, and includes a processor 72, a memory 71, a program or an instruction stored in the memory 71 and capable of being executed on the processor 72, and when the program or the instruction is executed by the processor 72, the process of the embodiment of the array hole processing method is implemented, and the same technical effect can be achieved, and details are not repeated here to avoid repetition.
It should be noted that the electronic device in the embodiment of the present application includes the mobile electronic device and the non-mobile electronic device described above.
The embodiment of the present application further provides a readable storage medium, where a program or an instruction is stored on the readable storage medium, and when the program or the instruction is executed by a processor, the program or the instruction implements each process of the above array hole processing method embodiment, and can achieve the same technical effect, and in order to avoid repetition, details are not repeated here.
The processor is the processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and so on.
The embodiment of the present application further provides a chip, where the chip includes a processor and a communication interface, the communication interface is coupled to the processor, and the processor is configured to run a program or an instruction to implement each process of the above array hole processing method embodiment, and can achieve the same technical effect, and in order to avoid repetition, the description is omitted here.
It should be understood that the chips mentioned in the embodiments of the present application may also be referred to as system-on-chip, system-on-chip or system-on-chip, etc.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the statement "comprises a" or "comprising" a defined element does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present application.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A method of array hole machining, the method comprising:
acquiring N first coordinate values and N second coordinate values corresponding to N array holes, wherein each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer;
respectively determining N deviation values according to N target coordinate values based on M corresponding relations, wherein each corresponding relation is a corresponding relation between one coordinate value and one deviation value, and one target coordinate value comprises at least one of the following items: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer;
respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value, and one second coordinate value corresponds to one third coordinate value;
and processing the N array holes according to the N first coordinate values and the N third coordinate values.
2. The method of claim 1 wherein said one target coordinate value is a second coordinate value;
the determining N offset values based on the M correspondences according to the N target coordinate values includes:
according to the ith target coordinate value in the N target coordinate values, determining a third coordinate value matched with the ith target coordinate value from M coordinate values in the M corresponding relations, wherein i is a positive integer;
determining an offset value corresponding to the third coordinate value as an ith offset value;
wherein the ith offset value corresponds to the ith target coordinate value.
3. The method of claim 1 wherein said one target coordinate value comprises a first coordinate value and a second coordinate value;
the determining N offset values based on the M correspondences according to the N target coordinate values includes:
according to the ith first coordinate value in the N target coordinate values, determining a fourth coordinate value and a fifth coordinate value corresponding to the ith first coordinate value from M coordinate values in the M corresponding relations, wherein i is a positive integer;
determining an ith offset value based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value;
wherein the fourth coordinate value is smaller than the ith first coordinate value, and the fifth coordinate value is larger than the ith first coordinate value;
the ith offset value corresponds to the ith first coordinate value, and the ith offset value corresponds to the ith second coordinate value.
4. The method of claim 3, wherein determining the ith offset value based on the offset value corresponding to the fourth coordinate value and the offset value corresponding to the fifth coordinate value comprises:
determining a first numerical value according to a difference value between the fifth coordinate value and the fourth coordinate value;
determining a second numerical value according to a difference value between the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value;
determining a third numerical value according to the fourth coordinate value and the ith first coordinate value;
and determining the ith offset value according to the offset value corresponding to the fourth coordinate value, the first numerical value, the second numerical value and the third numerical value.
5. The method according to claim 1, wherein before determining the N offset values based on the M correspondences and based on the N target coordinate values, respectively, the method further comprises:
placing the workpieces corresponding to the N array holes on a workbench and controlling the workbench to move according to M coordinate values;
and in the process of the movement of the workbench, obtaining M deviation values, and establishing the M corresponding relations according to the M coordinate values and the M deviation values respectively.
6. An array hole processing apparatus, characterized in that the array hole processing apparatus comprises: the device comprises an acquisition module, a determination module and an operation module;
the acquisition module is used for acquiring N first coordinate values and N second coordinate values corresponding to N array holes, each array hole corresponds to one first coordinate value, each array hole corresponds to one second coordinate value, and N is a positive integer;
the determining module is configured to determine N offset values according to N target coordinate values based on M corresponding relationships, where each corresponding relationship is a corresponding relationship between one coordinate value and one offset value, and one target coordinate value includes at least one of the following: a first coordinate value, a second coordinate value; one target coordinate value corresponds to one offset value, and M is a positive integer; respectively determining N third coordinate values based on the N offset values and the N second coordinate values, wherein one offset value corresponds to one third coordinate value, and one second coordinate value corresponds to one third coordinate value;
and the operation module is used for processing the N array holes according to the N first coordinate values and the N third coordinate values determined by the determination module.
7. The array hole machining device according to claim 6, wherein the one target coordinate value is one second coordinate value;
the determining module is specifically configured to determine, according to an ith target coordinate value of the N target coordinate values, a third coordinate value matched with the ith target coordinate value from M coordinate values of the M correspondence relationships, where i is a positive integer; determining the offset value corresponding to the third coordinate value as the ith offset value;
wherein the ith offset value corresponds to the ith target coordinate value.
8. The array hole machining device according to claim 6, wherein the one target coordinate value includes a first coordinate value and a second coordinate value;
the determining module is specifically configured to determine, according to an ith first coordinate value of the N target coordinate values, a fourth coordinate value and a fifth coordinate value corresponding to the ith first coordinate value from M coordinate values of the M correspondence relationships, where i is a positive integer; determining an ith offset value based on the offset value corresponding to the fifth coordinate value and the offset value corresponding to the fourth coordinate value;
wherein the fourth coordinate value is smaller than the ith first coordinate value, and the fifth coordinate value is larger than the ith first coordinate value;
the ith offset value corresponds to the ith first coordinate value, and the ith offset value corresponds to the ith second coordinate value.
9. An electronic device comprising a processor, a memory, and a program or instructions stored on the memory and executable on the processor, the program or instructions when executed by the processor implementing the steps of the array hole machining method according to any one of claims 1 to 5.
10. A readable storage medium, storing thereon a program or instructions which, when executed by a processor, implement the steps of the array hole machining method according to any one of claims 1 to 5.
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