CN113442563B - Screen printing system and screen printing method - Google Patents
Screen printing system and screen printing method Download PDFInfo
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- CN113442563B CN113442563B CN202110872243.4A CN202110872243A CN113442563B CN 113442563 B CN113442563 B CN 113442563B CN 202110872243 A CN202110872243 A CN 202110872243A CN 113442563 B CN113442563 B CN 113442563B
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- 238000007650 screen-printing Methods 0.000 title claims abstract description 180
- 238000000034 method Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 126
- 230000008569 process Effects 0.000 claims abstract description 26
- 238000007639 printing Methods 0.000 claims abstract description 17
- 238000009826 distribution Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a screen printing method and a screen printing system, wherein the screen printing method comprises the following steps: providing a movable carrying platform; when the movable carrying table is at an initial position, arranging a screen printing plate around the movable carrying table, wherein the screen printing plate is provided with a pattern to be printed, placing the semiconductor device on the movable carrying table, contacting a first grid line with the movable carrying table, and acquiring first relative position information from the semiconductor device to the screen printing plate by adopting an image sensing device; acquiring second position information of the first grid line in the semiconductor device by adopting a laser emitting component and an infrared light receiving component in the moving process of the movable carrying platform; according to the first relative position information and at least second position information in the second position information, the moving part is adopted to drive the silk screen printing plate to move, so that the pattern to be printed is aligned with the first grid line; and printing a second grid on the surface of the semiconductor device by taking the screen printing plate as a mask. The screen printing method is easy to realize the alignment of the second grid line and the first grid line, and the alignment efficiency is high.
Description
Technical Field
The invention relates to the technical field of solar cells, in particular to a screen printing system and a screen printing method.
Background
The solar photovoltaic power generation technology is one of the most promising renewable energy technologies for solving the energy crisis and the environmental pollution problem at present. Solar cells can be classified into: the solar cell comprises a silicon solar cell, a multi-component compound thin-film solar cell, a nanocrystalline solar cell, an organic solar cell and the like, wherein the silicon solar cell is the most mature in development and is dominant in application. In recent years, heterojunction cells (HJT or SHJ) in silicon solar cells have been rapidly developed by virtue of their characteristics of low fabrication process temperature, simple process flow, high open-circuit voltage, high conversion efficiency, low temperature coefficient, excellent high-temperature/low-light power generation characteristics, low attenuation, and the like.
The heterojunction cell is a double-sided solar cell taking an n-type monocrystalline silicon wafer as a substrate, wherein an intrinsic amorphous silicon thin film, an n-type doped amorphous silicon thin film, a transparent conducting layer and a front metal electrode are prepared on the front side of the silicon wafer, and an intrinsic amorphous silicon thin film, a p-type doped amorphous silicon thin film, a transparent conducting layer and a back metal electrode are prepared on the back side of the silicon wafer. The metal electrode is generally composed of a fine grid and a main grid, and the main component is silver or aluminum. Photogenerated carriers generated by the heterojunction cell are firstly collected and converged to the main gate through the fine gate and are transmitted to the outside from the main gate. The larger the number of the main grids is, the lower the series resistance is, but the light shielding area on the surface of the battery is increased, which affects the improvement of the conversion efficiency of the battery. Therefore, in order not to increase the light-shielding area of the battery, the width of the main grid is generally controlled to be in the range of 30 μm to 60 μm.
In order to ensure the environmental tolerance of the heterojunction cell, and to have certain mechanical properties, and also to enable large-scale power applications, the heterojunction cell is usually formed into a heterojunction cell assembly. One of the necessary processes for forming a heterojunction cell assembly is to connect a plurality of heterojunction cells in series using metal interconnection bars or solder ribbons to form a heterojunction cell assembly. Specifically, one metal interconnection strip comprises a first covering section, a connecting section and a second covering section which are sequentially connected, the first covering section covers the front main grid of one heterojunction cell, and the second covering section covers the back main grid of the adjacent heterojunction cell. In order to facilitate the connection of the metal interconnection bars or solder strips, the front main grid and the back main grid of the heterojunction cell are usually positioned corresponding to each other. The metal electrodes of the heterojunction battery are usually prepared by adopting a screen printing process, and the requirement on the alignment of the metal electrodes on two sides is high.
However, the existing screen printing system and screen printing method have low alignment efficiency, and the front main grid and the back main grid cannot be aligned with high precision easily, and the efficiency is low.
Disclosure of Invention
Therefore, the technical problem to be solved by the present invention is to overcome the defects that the alignment of the front main grid and the back main grid of the semiconductor device is easy to fail and the alignment efficiency is low in the existing screen printing system and screen printing method, thereby providing a screen printing system and a screen printing method.
The invention provides a screen printing method, which is used for positioning and printing a pattern of a semiconductor device, wherein the pattern of the semiconductor device comprises a first grid line, and the method comprises the following steps: providing a movable carrying platform; when the movable carrying platform is at an initial position, arranging a screen printing plate around the movable carrying platform, wherein the screen printing plate is provided with a pattern to be printed; when the movable carrying platform is at an initial position, the semiconductor device is placed on the movable carrying platform, the first grid line is in contact with the movable carrying platform, the semiconductor device is located on the side portion of the screen printing plate, and first relative position information from the semiconductor device to the screen printing plate is obtained by adopting an image sensing device; the movable carrying platform moves from an initial position to a target position, in the process that the movable carrying platform moves from the initial position to the target position, a laser emitting component is adopted to emit laser towards the movable carrying platform, and an infrared light receiving component is adopted to receive an infrared light signal emitted by the semiconductor device so as to obtain second position information of the first grid line in the semiconductor device; according to at least the second position information in the first relative position information and the second position information, a moving part is adopted to drive the screen printing plate to move, so that the pattern to be printed is aligned with the first grid line; and printing a second grid electrode on the surface of the semiconductor device, which is far away from the first grid line, by taking the aligned screen printing plate as a mask.
Optionally, the movable stage has a first area and a second area; the step of placing the semiconductor device on the movable stage includes: placing the semiconductor device on the first region; the step of disposing a screen plate around the movable stage includes: fixedly connecting the fixed end of the moving member with the second area, and connecting the moving end of the moving member with the screen printing plate, wherein the screen printing plate is positioned above the second area; the step of driving the screen printing plate to move by adopting the moving member comprises the following steps: and the moving member drives the screen printing plate to move according to the first relative position information and the second relative position information.
Optionally, the step of moving the movable stage from the initial position to the target position includes: outputting a first moving signal to a driving assembly by using a control module, wherein the driving assembly receives the first moving signal and drives the movable carrying platform to move from an initial position to a target position; the step of the moving member driving the screen printing plate to move comprises the following steps: and outputting a second moving signal to the moving element by adopting a control module according to the first relative position information and the second position information, and driving the screen printing plate to move by the moving element according to the second moving signal so as to align the pattern to be printed with the first grid line.
Optionally, the screen printing method further includes: providing a bearing platform; the step of disposing a screen plate around the movable stage includes: fixedly connecting the fixed end of the moving part to the bearing platform, and connecting the moving end of the moving part to the screen printing plate, wherein the screen printing plate is positioned on the side part of the movable carrying platform; the step of moving the movable stage from the initial position to the target position comprises: the movable carrying platform moves from an initial position to a target position according to the first relative position information; the step of driving the screen printing plate to move by adopting the moving piece comprises the following steps: and the moving member drives the screen printing plate to move according to the second position information.
Optionally, the step of moving the movable stage from the initial position to the target position includes: outputting a third moving signal to a driving assembly by adopting a control module according to the first relative position, wherein the driving assembly receives the third moving signal and drives the movable carrying platform to move from the initial position to the target position; the step of the moving member driving the screen printing plate to move comprises the following steps: and outputting a fourth moving signal to the moving part by adopting a control module according to the second position information, and driving the screen printing plate to move by the moving part according to the fourth moving signal so as to align the pattern to be printed with the first grid line.
Optionally, the movable stage moves from the initial position to the target position to move horizontally, the laser emitting component is a line laser, the moving direction of the movable stage is perpendicular to the extending direction of the line laser emitted by the laser emitting component, and the extending direction of the line laser is perpendicular to the emitting direction of the line laser.
The present invention also provides a screen printing system for localized printing of a pattern of a semiconductor device, the pattern of the semiconductor device including a first gate line, comprising: a movable stage adapted to carry a semiconductor device, the first gate line adapted to contact the movable stage; a screen plate adapted to be positioned above the movable stage, the semiconductor device being adapted to be positioned on a side of the screen plate when the movable stage is in an initial position, the screen plate having a pattern to be printed; an image sensing device positioned above the movable stage, the image sensing device being adapted to acquire first relative positional information of the semiconductor device to the screen plate; the laser emitting component and the infrared light receiving component are positioned above the movable carrying platform, the laser emitting component is suitable for emitting laser towards the movable carrying platform in the process that the movable carrying platform moves from an initial position to a target position, and the infrared light receiving component is suitable for receiving an infrared light signal emitted by the side area of the first grid line in the semiconductor device in the process that the movable carrying platform moves from the initial position to the target position so as to acquire second position information of the first grid line in the semiconductor device; the moving piece comprises a fixed end and a moving end, and the moving end is connected with the screen printing plate; the moving member is suitable for driving the screen printing plate to move according to at least second position information in the first relative position information and the second position information, so that the pattern to be printed is aligned to the first grid line.
Optionally, the movable carrier has a first region and a second region, the semiconductor device is suitable for being placed on the first region, and a fixed end of the moving element is fixedly connected to the second region; when the movable stage is in an initial position, the screen printing plate is located above the second area; or, the screen printing system further comprises a bearing platform, the fixed end of the moving member is fixedly connected to the bearing platform, and when the movable carrier is at the initial position, the screen printing plate is located on the side of the movable carrier.
Optionally, the screen printing system further comprises a control module and a driving assembly, wherein the driving assembly is adapted to drive the movable stage to move; the input end of the control module is electrically connected with the image sensing device and the infrared light receiving component, and the output end of the control module is electrically connected with the driving component and the moving member.
Optionally, the driving assembly includes: the device comprises a frame, a driving motor and a plurality of rollers penetrating through the side wall of the frame; the movable stage is adapted to be placed on the roller; the driving motor is suitable for driving the roller to rotate around the central shaft of the roller so as to drive the movable carrying platform to move horizontally; the laser emitting component is a line laser.
Optionally, the laser emitting component is adapted to generate laser light with a wavelength of 700nm-1000 nm.
Optionally, the semiconductor device is a solar cell.
Optionally, the moving member comprises a mechanical arm; the image sensing device includes a CCD camera.
Optionally, the first region is provided with a plurality of adsorption holes; the screen printing system further comprises a vacuum pump communicated with the adsorption hole.
The technical scheme of the invention has the following advantages:
1. in the screen printing method provided by the invention, the laser emitting component can emit laser towards the semiconductor device, when the laser does not irradiate on the first grid line, the laser irradiating area is excited by photons to generate infrared light, and the infrared light is received by the infrared light receiving component; when laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line; the laser sequentially irradiates each area of the semiconductor device along with the movement of the movable carrying platform from the initial position to the target position, and the infrared light receiving component sequentially receives the infrared light generated by each area so as to acquire second position information of the first grid line in the semiconductor device; the image sensing device can acquire first relative position information from the semiconductor device to the screen printing plate, meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, the moving element moves according to the position information, the alignment of the pattern to be printed and the first grid line is achieved, and then the printing of the second grid line is conducted. The screen printing method is used for preparing the second grid line by taking the existing first grid line in the semiconductor device as a reference, so that the second grid line and the first grid line are easily and accurately aligned, the second grid line and the first grid line are prevented from being staggered or angularly offset, and the alignment efficiency is high.
2. The invention provides a screen printing system, wherein a laser emitting component is suitable for emitting laser towards a semiconductor device, when the laser does not irradiate on a first grid line, a laser irradiation area is excited by photons to generate infrared light, and the infrared light is received by an infrared light receiving component; when laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line; the laser sequentially irradiates each area of the semiconductor device along with the movement of the movable carrying platform from the initial position to the target position, and the infrared light receiving component sequentially receives the infrared light generated by each area so as to acquire second position information of the first grid line in the semiconductor device; the image sensing device is suitable for acquiring first relative position information of the semiconductor device to the screen printing plate, meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, and the moving element is suitable for moving according to the position information, so that the pattern to be printed is aligned with the first grid lines, and then, the second grid lines are printed. The screen printing system can prepare the second grid line by taking the existing first grid line in the semiconductor device as a reference, can easily realize the accurate alignment of the second grid line and the first grid line, avoids the dislocation or the angle deviation of the second grid line and the first grid line, and has higher alignment efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic flow chart of a screen printing method provided in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of a first screen printing system provided in an embodiment of the present invention;
FIG. 3 is a top view of the movable stage shown in FIG. 2;
FIG. 4 is a schematic diagram illustrating a moving process of the movable stage shown in FIG. 2;
fig. 5 is a schematic configuration diagram of a second screen printing system provided in embodiment 2 of the invention;
description of reference numerals:
1-a movable stage; 11-a first zone; 12-a second zone; 13-adsorption holes; 2-a laser emitting component; 3-infrared light receiving means; 4-screen printing plate; 5-a moving part; 6-a frame; 7-a roller; 8-a semiconductor device; 9-line laser.
Detailed Description
As described in the background, the conventional screen printing system and screen printing method are prone to cause misalignment between the front main grid and the back main grid of the semiconductor device.
When two heterojunction cells are connected in series, the extending direction of the metal interconnection bar is fixed. This requires that the direction of extension of the front side main grid of one heterojunction cell coincides with the direction of extension of the back side main grid of another heterojunction cell to ensure that the metal interconnection strip covers both the front side main grid of one heterojunction cell and the back side main grid of another heterojunction cell. Specifically, in the process of connecting two heterojunction cells in series, the two heterojunction cells are sequentially arranged, if the front main grids of the two heterojunction cells are aligned with each other, and the front main grid and the back main grid of one heterojunction cell are staggered, the extending direction of the front main grid of one heterojunction cell is staggered with the back main grid of the other heterojunction cell, so that the metal interconnection bar cannot simultaneously cover the front main grid of one heterojunction cell and the back main grid of the other heterojunction cell, the series connection effect of the two heterojunction cells is poor or completely ineffective, and the output power of the heterojunction cell assembly is further influenced; if the front main grids of two heterojunction cells are aligned with each other, and the front main grid and the back main grid of one heterojunction cell are angularly offset, while the first covering section covers the front main grid of one heterojunction cell, the second covering section cannot cover the back main grid of the adjacent heterojunction cell but is only in contact with the back main grid, so that photogenerated carriers converged to the back main grid are transmitted to the outside through the contact point, which causes large current transmitted by the contact point to form a hot spot, which not only adversely affects the performance of the heterojunction cell, but also may cause the heterojunction cell to fire. And if the front main grids of the two heterojunction cells are aligned with each other and the front main grids and the back main grids of the two heterojunction cells are also corresponding to each other, the metal interconnection strip can also cover the back main grid of another heterojunction cell when covering the front main grid of one heterojunction cell, so that the effective series connection between the adjacent heterojunction cells is ensured, the formation of welding hot spots is avoided, and the guarantee is provided for the normal work of the heterojunction cell assembly.
One existing screen printing system includes: the device comprises a silk-screen printing plate, a movable carrying platform, a scraper and a CCD camera, wherein the CCD camera is adopted to determine the position of the edge of the solar cell, and the distance between the edge of the solar cell and a main grid is a design value, so that the printing position of the main grid in the solar cell can be determined, and then the movable carrying platform is moved according to the relative position relation of the edge of the cell so as to align the solar cell with the silk-screen printing plate; the squeegee is then moved along the screen printing plate to print the paste (e.g., silver paste, aluminum paste, etc.) on the solar cell through the holes in the screen printing plate. However, since the width of the main grid is in the micrometer scale and the side length of the solar cell is 156mm-230mm, the position of the edge of the solar cell cannot be accurately measured to the micrometer scale by the ccd camera, which causes errors larger than the micrometer scale and slight angular offsets to be easily generated in the position of the edge of the solar cell determined in the process of preparing the front metal electrode and the position of the edge of the solar cell determined in the process of preparing the back metal electrode, thereby causing misalignment of the front main grid and the back main grid. Therefore, it takes a long time to ensure alignment of the front and back main gates, which results in a reduction in alignment efficiency.
On this basis, the invention provides a screen printing method for positioning printing of a pattern of a semiconductor device, the pattern of the semiconductor device including a first gate line, the method comprising the steps of: providing a movable carrying platform; when the movable carrying platform is at an initial position, arranging a screen printing plate around the movable carrying platform, wherein the screen printing plate is provided with a pattern to be printed; when the movable carrying table is at an initial position, the semiconductor device is placed on the movable carrying table, the first grid line is in contact with the movable carrying table, the semiconductor device is located on the side portion of the screen printing plate, and first relative position information from the semiconductor device to the screen printing plate is obtained by adopting an image sensing device; the movable carrying table moves from an initial position to a target position, in the process that the movable carrying table moves from the initial position to the target position, a laser emitting component is adopted to emit laser towards the movable carrying table, and an infrared light receiving component is adopted to receive an infrared light signal emitted by the semiconductor device, so that second position information of the first grid line in the semiconductor device is obtained; according to at least the second position information in the first relative position information and the second position information, a moving part is adopted to drive the screen printing plate to move, so that the pattern to be printed is aligned with the first grid line; and printing a second grid electrode on the surface of the semiconductor device, which is far away from the first grid line, by taking the aligned screen printing plate as a mask. The screen printing method is easy to realize the accurate alignment of the second grid line and the first grid line, and the alignment efficiency is high.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Example 1
The present embodiment provides a screen printing method for positioning printing of a pattern of a semiconductor device including a first gate line, see fig. 1 and 2, comprising the steps of:
providing a movable carrying platform 1;
when the movable carrying platform 1 is at an initial position, arranging a screen printing plate 4 around the movable carrying platform, wherein the screen printing plate 4 is provided with a pattern to be printed;
when the movable carrying platform 1 is at an initial position, the semiconductor device 8 is placed on the movable carrying platform 1, the first grid line is in contact with the movable carrying platform 1, the semiconductor device 8 is positioned on the side of the screen printing plate 4, and the image sensing device is adopted to acquire first relative position information from the semiconductor device 8 to the screen printing plate 4;
the movable carrying platform 1 moves from an initial position to a target position, in the process that the movable carrying platform 1 moves from the initial position to the target position, a laser emitting component 2 is adopted to emit laser towards the movable carrying platform 1, and an infrared light receiving component 3 is adopted to receive an infrared light signal emitted by the semiconductor device 8 so as to obtain second position information of the first grid line in the semiconductor device 8;
according to at least second position information in the first relative position information and the second position information, a moving part is adopted to drive the screen printing plate 4 to move, so that the pattern to be printed is aligned with the first grid line;
and printing a second grid electrode on the surface of the semiconductor device 8, which is far away from the first grid line, by taking the screen printing plate 4 after alignment as a mask.
In the above screen printing method, the laser emitting means 2 is capable of emitting laser light toward the semiconductor device, and when the laser light is not irradiated on the first gate line, the laser irradiated region is excited by photons to generate infrared light, which is received by the infrared light receiving means 3; when laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line; as the movable carrier 1 moves from the initial position to the target position, the laser light is sequentially irradiated on each region of the semiconductor device, and the infrared light receiving component 3 sequentially receives the infrared light generated by each region, so as to acquire second position information of the first grid line in the semiconductor device; the image sensing device can acquire first relative position information from the semiconductor device to the screen printing plate 4, meanwhile, the relative position of the pattern to be printed in the screen printing plate 4 is known, the screen printing plate 4 moves according to the position information, the pattern to be printed is aligned with the first grid lines, and then the second grid lines are printed. The screen printing method combines the laser, the infrared light receiving component and the image sensor, realizes the comprehensive positioning effect on the grid line by utilizing the property of the semiconductor device which is reacted by the laser, and carries out the preparation of the second grid line by taking the existing first grid line in the semiconductor device as a reference, thereby easily realizing the accurate alignment of the second grid line and the first grid line, avoiding the dislocation or the angle deviation of the second grid line and the first grid line, and having higher alignment efficiency.
Specifically, when laser light is irradiated to a semiconductor device, the semiconductor device is excited by the laser light to generate electrons and holes, and the electrons and the holes are recombined to generate infrared light; the quantity of electrons and holes trapped by defects in the semiconductor material above the first grid line is large, so that the intensity of infrared light transmitted to the outside is weak and even zero; the number of electrons and holes trapped by defects in the semiconductor material above the region between adjacent first gate lines is small, so that the intensity of infrared light transmitted to the outside is high; the position of the first gate line in the semiconductor device can be judged from the intensity distribution of the infrared light received by the infrared light receiving section 3.
In the present embodiment, referring to fig. 3, the movable stage 1 has a first area 11 and a second area 12; the step of placing the semiconductor device on the movable stage includes: placing the semiconductor device on the first region 11; the step of disposing the screen plate 4 around the movable stage 1 includes: fixedly connecting the fixed end of the moving member 5 with the second zone 12, and connecting the moving end of the moving member with the screen plate, wherein the screen plate 4 is positioned above the second zone 12; the step of moving the screen printing forme 4 by the moving member 5 comprises the following steps: the moving member 5 drives the screen plate 4 to move according to the first relative position information and the second relative position information. The screen printing method can acquire the second position information of the first grid line in the semiconductor device and the first relative position information from the semiconductor device to the screen printing plate 4, and meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, so that the relative position information of the first grid line and the pattern to be printed can be acquired, and the moving element 5 moves according to the relative position information of the first grid line and the pattern to be printed, so as to realize the alignment of the pattern to be printed and the first grid line.
It should be understood here that in the present embodiment, the order of acquiring the first relative position information and the second position information is flexible, that is, the movable stage 1 may be moved first to enable the infrared light receiving part 3 to acquire the second position information, and then the image sensing device may be used to acquire the first relative position information; alternatively, the image sensing device may be used to acquire the first relative position information, and then the movable stage 1 may be moved to allow the infrared light receiving unit 3 to acquire the second position information. The moving mode of the screen printing plate 4 comprises translation and rotation, namely, when the screen printing plate 4 is translated, the pattern to be printed and the first grid line have angular offset, and the screen printing plate 4 also needs to rotate to realize angular adjustment; when the pattern to be printed does not have angular offset with the first grid line after the screen printing plate 4 is translated, the screen printing plate 4 does not need to be rotated to realize angular adjustment.
In this embodiment, the step of moving the movable stage 1 from the initial position to the target position includes: outputting a first moving signal to a driving assembly by using a control module, wherein the driving assembly receives the first moving signal and drives the movable carrying platform 1 to move from an initial position to a target position; the step of moving the screen plate 4 by the moving member 5 includes: the first relative position information acquired by the image sensing device and the second position information acquired by the infrared light receiving part 3 are transmitted to the control module, the control module is adopted to output a second moving signal to the moving member 5 according to the first relative position information and the second position information, and the moving member 5 drives the silk screen printing plate 4 to move according to the second moving signal, so that the pattern to be printed is aligned with the first grid line.
Further, referring to fig. 4, the movable stage 1 moves horizontally from an initial position to a target position, the laser emitting component 2 is a line laser 9, the moving direction of the movable stage 1 is perpendicular to the extending direction of the line laser 9 emitted by the laser emitting component, and the extending direction of the line laser 9 is perpendicular to the emitting direction of the line laser 9. In the process that the movable carrying platform 1 moves horizontally, the linear laser 9 emitted by the laser emitting component 2 irradiates each linear area on the surface of the semiconductor device in sequence, and the infrared light receiving component 3 receives the infrared light signals generated by each linear area in sequence so as to acquire the second position information of the first grid line in the semiconductor device.
Specifically, the process that the driving assembly drives the movable carrying platform 1 to move from the initial position to the target position includes: referring to fig. 2, a roller 7 is driven to rotate around the central axis of the roller 7 by a driving motor, and the roller 7 drives the movable stage 1 to move horizontally.
In this embodiment, after the pattern to be printed is aligned with the first gate line, the screen printing plate 4 is located right above the semiconductor device, and the screen printing plate 4 is in contact with the semiconductor device; the step of printing a second grid electrode on the surface of the semiconductor device, which is far away from the first grid line, by taking the screen printing plate 4 after alignment as a mask comprises the following steps: and horizontally moving the scraper along the screen printing plate 4, and printing the slurry (such as silver paste, aluminum paste and the like) above the screen printing plate 4 on the semiconductor device through the holes in the screen printing plate under the extrusion of the scraper so as to obtain a second grid line.
Specifically, the semiconductor device is a solar cell, and the solar cell comprises a heterojunction solar cell. The material of the semiconductor device comprises monocrystalline silicon, and the materials of the first grid line and the second grid line are metal materials or alloy materials, such as silver or aluminum. In one embodiment, the first gate line includes only the first main gate line, and the second gate line includes only the second main gate line. In other embodiments, the first gate line includes a first main gate line and a first thin gate line connected to the first main gate line, the second gate line includes a second main gate line and a second main gate line connected to the second main gate line, and the alignment of the pattern to be printed and the first gate line is mainly performed to obtain the position information of the first main gate line in the semiconductor device.
Further, the side length of the solar cell is 156-230 mm; the width of the first main grid line is 30-60 mu m. In one embodiment, the first gate line is located on the front side of the semiconductor device, and the second gate line is located on the back side of the semiconductor device; in other embodiments, the first gate line is located on the back side of the semiconductor device and the second gate line is located on the front side of the semiconductor device.
Referring to fig. 2, the present embodiment also provides a screen printing system for positioning printing of a pattern of a semiconductor device, the pattern of the semiconductor device including a first gate line, comprising: the movable carrying platform 1, the movable carrying platform 1 is suitable for carrying a semiconductor device, and the first grid line is suitable for being in contact with the movable carrying platform 1; a screen plate 4, the screen plate 4 being adapted to be positioned above the movable stage 1, the semiconductor device being adapted to be positioned on a side of the screen plate 4 when the movable stage 1 is in an initial position, the screen plate 4 having a pattern to be printed; an image sensing device located above the movable stage 1, the image sensing device being adapted to acquire first relative positional information of the semiconductor device to the screen plate 4; a laser emitting component 2 and an infrared light receiving component 3 which are positioned above the movable stage 1, wherein the laser emitting component 2 is suitable for emitting laser towards the movable stage 1 in the process that the movable stage 1 moves from an initial position to a target position, and the infrared light receiving component 3 is suitable for receiving an infrared light signal emitted by the side area of the first grid line in the semiconductor device in the process that the movable stage 1 moves from the initial position to the target position so as to acquire second position information of the first grid line in the semiconductor device; the moving piece 5 comprises a fixed end and a moving end, and the moving end is connected with the screen printing plate 4; the moving member 5 is adapted to drive the screen printing plate 4 to move according to at least second position information of the first relative position information and the second position information, so that the pattern to be printed is aligned with the first grid line.
In the above screen printing system, the laser light emitting means 2 is adapted to emit laser light toward the semiconductor device, the laser light irradiated region is excited by photons to generate infrared light when the laser light is not irradiated on the first gate line, the infrared light being received by the infrared light receiving means 3; when laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line; as the movable carrier 1 moves from the initial position to the target position, the laser light is sequentially irradiated on each region of the semiconductor device, and the infrared light receiving component 3 sequentially receives the infrared light generated by each region, so as to acquire second position information of the first grid line in the semiconductor device; the image sensing device is suitable for acquiring first relative position information of the semiconductor device to the screen printing plate 4, meanwhile, the relative position of the pattern to be printed in the screen printing plate 4 is known, and the moving member 5 is suitable for moving according to the position information, so that the pattern to be printed is aligned with the first grid lines, and then, the second grid lines are printed. The screen printing system can prepare the second grid line by taking the existing first grid line in the semiconductor device as a reference, can easily realize the accurate alignment of the second grid line and the first grid line, avoids the dislocation or the angle deviation of the second grid line and the first grid line, and has higher alignment efficiency.
Specifically, in the present embodiment, referring to fig. 3, the movable stage 1 has a first area 11 and a second area 12, the semiconductor device is adapted to be placed on the first area 11, and the fixed end of the moving member 5 is fixedly connected to the second area 12; when the movable stage 1 is in the initial position, the screen plate 4 is located above the second section 12. The screen printing system can acquire the second position information of the first grid line in the semiconductor device and the first relative position information from the semiconductor device to the screen printing plate 4, and meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, so that the relative position information of the first grid line and the pattern to be printed can be acquired, the moving member 5 moves according to the relative position information of the first grid line and the pattern to be printed, the alignment of the pattern to be printed and the first grid line is realized, and then the printing of the second grid line is performed. For example, the moving member 5 includes a robot arm.
In the present embodiment, referring to fig. 2 and 3, the first zone 11 is provided with a plurality of adsorption holes 13; the screen printing system further includes a vacuum pump communicating with the adsorption hole 13. The semiconductor device is sucked through the suction hole 13 to be fixed to the first region 11.
In this embodiment, the image sensing device includes a CCD camera, and the property of the semiconductor device that reacts to the laser light is utilized to achieve a comprehensive positioning effect on the gate line in conjunction with the laser light, the infrared light receiving part, and the image sensor.
In this embodiment, the screen printing system further includes: a control module (not shown in the figure) and a driving component, wherein the input end of the control module is electrically connected with the image sensing device and the infrared light receiving component 3, and the output end of the control module is electrically connected with the driving component and the moving member 5; the control module is suitable for outputting a first moving signal to the driving assembly and outputting a second moving signal to the moving member 5 according to the first relative position information and the second position information, the driving assembly is suitable for receiving the first moving signal and driving the movable carrying platform 1 to move from an initial position to a target position, and the moving member 5 is suitable for driving the screen printing plate 4 to move according to the second moving signal so that the pattern to be printed is aligned with the first grid line.
Further, referring to fig. 2, the driving assembly includes: a frame 6, a driving motor (not shown in the figure) and a plurality of rollers 7 penetrating through the side wall of the frame 6; said movable stage 1 is suitable to be placed on said roller 7; the driving motor is suitable for driving the roller 7 to rotate around the central axis of the roller 7 so as to drive the movable carrying platform 1 to move horizontally. The laser emitting component 2 is a line laser 9, and the laser emitting component 2 is suitable for generating laser with the wavelength of 700nm-1000 nm. In the process that the movable carrying platform 1 moves horizontally, the linear laser 9 emitted by the laser emitting component 2 irradiates each linear area on the surface of the semiconductor device in sequence, and the infrared light receiving component 3 receives the infrared light signals generated by each linear area in sequence so as to acquire the second position information of the first grid line in the semiconductor device. Specifically, the output end of the control module is electrically connected with a driving motor in the driving assembly.
In the present embodiment, the screen printing system further includes a squeegee (not shown in the figure) that is positioned directly above the semiconductor device when the movable stage 1 is moved to the target position; after the pattern to be printed is aligned with the first grid line, the scraper horizontally moves along the screen printing plate 4, and slurry (such as silver paste and aluminum paste) above the screen printing plate 4 is printed on the semiconductor device through holes in the screen printing plate under the extrusion of the scraper, so that a second grid line is obtained.
Example 2
The present embodiment also provides a screen printing method which is different from the screen printing method provided in embodiment 1 in that: referring to fig. 5, the screen printing method provided by the present embodiment further includes: providing a bearing platform; the step of disposing a screen plate around the movable stage includes: fixedly connecting the fixed end of the moving member 5 to the bearing platform, and connecting the moving end of the moving member to the screen printing plate, wherein the screen printing plate 4 is positioned on the side part of the movable carrying platform 1; the step of moving the movable stage from an initial position to a target position comprises: the movable carrying platform is suitable for moving from an initial position to a target position according to the first relative position information; the step of driving the screen printing plate to move by adopting the moving piece comprises the following steps: and according to the second position information, the moving member 5 drives the screen printing plate to move. The frame 6 of the drive assembly can be used as a carrying platform for supporting the movable carrying platform 1 and the moving part 5.
The screen printing method described above can acquire first relative position information of the semiconductor device to the screen plate 4 when the movable stage 1 is at an initial position, the movable stage 1 moving from the initial position to a target position according to the first relative position information; second position information of the first grid line in the semiconductor device can be acquired in the moving process of the movable carrying platform 1; meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, the relative position relation between the pattern to be printed and the first grid line when the movable carrying platform 1 is at the target position can be obtained by combining the second position information, and the moving part 5 moves according to the relative position information between the first grid line and the pattern to be printed, so that the alignment between the pattern to be printed and the first grid line is realized. The screen printing method provided by this embodiment needs to acquire first relative position information first, and acquire second position information in the process that the movable stage 1 moves according to the first relative position information.
Specifically, the step of moving the movable stage 1 from the initial position to the target position includes: outputting a third moving signal to a driving assembly by using a control module according to the first relative position, wherein the driving assembly receives the third moving signal and drives the movable carrying platform 1 to move from the initial position to the target position; the step of moving the screen plate 4 by the moving member 5 includes: and outputting a fourth moving signal to the moving member 5 by using a control module according to the second position information, wherein the moving member 5 drives the screen printing plate 4 to move according to the fourth moving signal, so that the pattern to be printed is aligned with the first grid line.
Referring to fig. 4, the present embodiment also provides a screen printing system which is different from the screen printing system provided in embodiment 1 in that: the screen printing system further comprises a bearing platform, the fixed end of the moving piece is fixedly connected to the bearing platform, and when the movable carrying platform is located at the initial position, the screen printing plate is located on the side portion of the movable carrying platform. The frame 6 of the drive assembly can be used as a carrying platform for supporting the movable stage 1 and the movable member 5.
The screen printing system described above is capable of acquiring first relative position information of the semiconductor device to the screen plate 4 when the movable stage 1 is at an initial position, the movable stage 1 moving from the initial position to a target position according to the first relative position information; second position information of the first grid line in the semiconductor device can be acquired in the moving process of the movable carrying platform 1; meanwhile, the relative position of the pattern to be printed in the screen printing plate is known, the relative position relationship between the pattern to be printed and the first grid line when the movable carrying platform 1 is at the target position can be obtained by combining the second position information, and the moving part 5 moves according to the relative position information between the first grid line and the pattern to be printed, so that the alignment between the pattern to be printed and the first grid line is realized. The screen printing method provided by this embodiment needs to acquire first relative position information first, and acquire second position information in the process that the movable stage 1 moves according to the first relative position information.
In this embodiment, the control module is adapted to output a third moving signal to the driving motor according to the first relative position and output a fourth moving signal to the moving member 5 according to the second position information, the driving motor is adapted to receive the third moving signal and drive the movable carrier 1 to move from the initial position to the target position, and the moving member 5 is adapted to drive the screen printing plate 4 to move according to the fourth moving signal, so that the pattern to be printed is aligned with the first gate line.
In the present embodiment, the screen printing system further includes a scraper (not shown in the figure) which is located directly above the semiconductor device when the movable stage 1 is moved to the target position; after the pattern to be printed is aligned with the first grid line, the scraper horizontally moves along the screen printing plate 4, and slurry (such as silver paste and aluminum paste) above the screen printing plate 4 is printed on the semiconductor device through holes in the screen printing plate under the extrusion of the scraper, so that a second grid line is obtained.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (12)
1. A screen printing method for positioning printing of a pattern of a semiconductor device, the pattern of the semiconductor device including a first gate line, comprising the steps of:
providing a movable carrying platform;
when the movable carrying platform is at an initial position, arranging a screen printing plate around the movable carrying platform, wherein the screen printing plate is provided with a pattern to be printed;
when the movable carrying platform is at an initial position, the semiconductor device is placed on the movable carrying platform, the first grid line is in contact with the movable carrying platform, the semiconductor device is located on the side portion of the screen printing plate, and first relative position information from the semiconductor device to the screen printing plate is obtained by adopting an image sensing device;
the movable carrying table moves from an initial position to a target position, a laser emitting component is adopted to emit laser towards the movable carrying table in the process that the movable carrying table moves from the initial position to the target position, and when the laser does not irradiate on the first grid line, a laser irradiation area is excited by photons to generate infrared light; when the laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line, and an infrared light receiving component is adopted to receive an infrared light signal sent by the semiconductor device so as to acquire second position information of the first grid line in the semiconductor device;
according to at least the second position information in the first relative position information and the second position information, a moving part is adopted to drive the screen printing plate to move, so that the pattern to be printed is aligned with the first grid line;
printing a second grid electrode on the surface of the semiconductor device, which is far away from the first grid line, by taking the aligned silk screen printing plate as a mask;
the semiconductor device is a solar cell, and a plurality of solar cells are connected in series through solder strips.
2. A screen printing method according to claim 1, wherein the movable stage has a first area and a second area;
the step of placing the semiconductor device on the movable stage includes: placing the semiconductor device on the first region;
the step of disposing a screen plate around the movable stage includes: fixedly connecting the fixed end of the moving member with the second area, and connecting the moving end of the moving member with the screen printing plate, wherein the screen printing plate is positioned above the second area;
the step of driving the screen printing plate to move by adopting the moving piece comprises the following steps: and the moving member drives the screen printing plate to move according to the first relative position information and the second relative position information.
3. The screen printing method according to claim 2, wherein the step of moving the movable stage from the initial position to the target position includes: outputting a first moving signal to a driving assembly by using a control module, wherein the driving assembly receives the first moving signal and drives the movable carrying platform to move from an initial position to a target position;
the step of the moving member driving the screen printing plate to move comprises the following steps: and outputting a second moving signal to the moving part by adopting a control module according to the first relative position information and the second position information, and driving the screen printing plate to move by the moving part according to the second moving signal so as to align the pattern to be printed with the first grid line.
4. The screen printing method according to claim 1, further comprising:
providing a bearing platform;
the step of disposing a screen plate around the movable stage includes: fixedly connecting the fixed end of the moving piece to the bearing platform, and connecting the moving end of the moving piece to the screen printing plate, wherein the screen printing plate is positioned on the side part of the movable carrying platform;
the step of moving the movable stage from an initial position to a target position comprises: the movable carrying platform moves from an initial position to a target position according to the first relative position information;
the step of driving the screen printing plate to move by adopting the moving member comprises the following steps: and the moving member drives the screen printing plate to move according to the second position information.
5. The screen printing method according to claim 4, wherein the step of moving the movable stage from the initial position to the target position includes: outputting a third moving signal to a driving assembly by using a control module according to the first relative position, wherein the driving assembly receives the third moving signal and drives the movable carrying platform to move from the initial position to the target position;
the step of the moving member driving the screen printing plate to move comprises the following steps: and outputting a fourth moving signal to the moving part by using a control module according to the second position information, wherein the moving part drives the screen printing plate to move according to the fourth moving signal, so that the pattern to be printed is aligned with the first grid line.
6. The screen printing method according to any one of claims 1 to 5, wherein the movable stage is moved horizontally from an initial position to a target position, the laser emitting member is a line laser, the moving direction of the movable stage is perpendicular to the extending direction of the line laser light emitted from the laser emitting member, and the extending direction of the line laser light is perpendicular to the emitting direction of the line laser light.
7. A screen printing system for use in localized printing of a pattern of a semiconductor device, the pattern of the semiconductor device including a first gate line, comprising:
a movable stage adapted to carry a semiconductor device, the first gate line adapted to contact the movable stage;
a screen plate adapted to be positioned above the movable stage, the semiconductor device being adapted to be positioned on a side of the screen plate when the movable stage is in an initial position, the screen plate having a pattern to be printed;
an image sensing device located above the movable stage, the image sensing device being adapted to acquire first relative positional information of the semiconductor device to the screen plate;
the laser emitting component and the infrared light receiving component are positioned above the movable carrying platform, the laser emitting component is suitable for emitting laser towards the movable carrying platform in the process that the movable carrying platform moves from an initial position to a target position, and the infrared light receiving component is suitable for receiving an infrared light signal emitted by the side area of the first grid line in the semiconductor device in the process that the movable carrying platform moves from the initial position to the target position so as to acquire second position information of the first grid line in the semiconductor device; when the laser is not irradiated on the first grid line, a laser irradiation area is excited by photons to generate infrared light; when the laser irradiates on the first grid line, the laser irradiation area cannot be excited by photons to generate infrared light, so that the distribution condition of the infrared light can reflect the position of the first grid line;
the moving part comprises a fixed end and a moving end, and the moving end is connected with the screen printing plate;
the moving element is suitable for driving the screen printing plate to move according to at least second position information in the first relative position information and the second position information, so that the pattern to be printed is aligned to the first grid line;
the semiconductor device is a solar cell, and a plurality of solar cells are connected in series through solder strips.
8. The screen printing system according to claim 7, wherein the movable stage has a first area on which the semiconductor device is adapted to be placed and a second area to which a fixed end of the moving member is fixedly connected; when the movable stage is in an initial position, the screen printing plate is located above the second area;
or, the screen printing system further comprises a bearing platform, the fixed end of the moving member is fixedly connected to the bearing platform, and when the movable carrier is at the initial position, the screen printing plate is located on the side of the movable carrier.
9. The screen printing system of claim 7, further comprising a control module and a drive assembly adapted to drive the movable stage to move; the input end of the control module is electrically connected with the image sensing device and the infrared light receiving component, and the output end of the control module is electrically connected with the driving component and the moving member.
10. The screen printing system of claim 9, wherein the drive assembly comprises: the device comprises a frame, a driving motor and a plurality of rollers penetrating through the side wall of the frame; the movable stage is adapted to be placed on the roller; the driving motor is suitable for driving the roller to rotate around the central shaft of the roller so as to drive the movable carrying platform to move horizontally; the laser emitting component is a line laser.
11. The screen printing system according to claim 10, wherein the laser emitting member is adapted to generate laser light having a wavelength of 700nm to 1000 nm.
12. The screen printing system of claim 7, wherein the mover comprises a robotic arm; the image sensing device includes a CCD camera.
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| CN102963143A (en) * | 2011-08-28 | 2013-03-13 | 瑞世达科技(厦门)有限公司 | Stepping screen printing method and printing device for realizing stepping screen printing method |
| US9421755B2 (en) * | 2013-03-14 | 2016-08-23 | Telekom Malaysia Berhad | Screen printing system with positional alignment |
| CN103252983B (en) * | 2013-05-31 | 2016-02-03 | 中利腾晖光伏科技有限公司 | A kind of grid line printing equipment |
| CN104786633B (en) * | 2015-01-15 | 2015-12-09 | 江苏斯利浦睡眠产业科技有限公司 | Circular screen printer is to flower adjustment System |
| CN107104170B (en) * | 2017-03-03 | 2020-03-13 | 广东爱康太阳能科技有限公司 | Two-sided crystalline silicon solar cell printing system |
| CN112428714B (en) * | 2020-10-21 | 2022-09-09 | 浙江爱旭太阳能科技有限公司 | Alignment method of electrode printing system of SE (selective emitter) laminated cell |
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