CN113441412A - Using method of LED equipment with detecting and picking functions - Google Patents
Using method of LED equipment with detecting and picking functions Download PDFInfo
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- CN113441412A CN113441412A CN202110622515.5A CN202110622515A CN113441412A CN 113441412 A CN113441412 A CN 113441412A CN 202110622515 A CN202110622515 A CN 202110622515A CN 113441412 A CN113441412 A CN 113441412A
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000003384 imaging method Methods 0.000 claims abstract description 59
- 230000002194 synthesizing effect Effects 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 7
- 238000005424 photoluminescence Methods 0.000 claims description 7
- 238000003491 array Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000003786 synthesis reaction Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 abstract 2
- 238000011179 visual inspection Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a using method of an LED device with detecting and picking functions, which comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: photographing through the second imaging part under the independent irradiation of the light source for reflecting light; step three: photographing through the first imaging part and the third imaging part under the single irradiation of the light source for absorbing light; step four: synthesizing the three pictures shot in the three steps into one picture through a computer, and identifying and positioning the damaged LED chip; step five: controlling a picking part on the moving part to pick out the damaged LEDs one by one; step six: the blue membrane that will take the LED array that does not have the damage takes away from the platform part, and this scheme has the LED of damage and fixes a position through two light source system to LED array imaging resolution, picks up out the LED of the damage of fixing a position through picking up the part, avoids the LED on the blue membrane to carry out the secondary and selects separately the damage that probably brings, replaces artificial visual inspection simultaneously, has improved work efficiency.
Description
Technical Field
The invention relates to the technical field of photoelectricity, in particular to a using method of an LED device with detecting and picking functions.
Background
The LED point sorting equipment sorts the LED arrays on the blue film according to the LEDs with the same optical parameter and electrical parameter, and because the LEDs are subjected to various mechanical operations in the manufacturing process or point sorting, some damage is inevitably caused. In order to select the damaged LED chips, the damaged LED chips need to be located by manual or optical detection, and then secondary sorting is performed, wherein the secondary sorting brings some mechanical operation processes and new damage, so that more than two times of point sorting and optical detection are required, and in order to avoid multiple repetition, and the existing optical detection cannot identify damaged LEDs by 100%, the detection efficiency needs to be improved, so the existing solving method is generally solved by a manual method at the last time, and the manual time efficiency is very low and uneconomical. The existing LED equipment with optical detection and damage pickup has a structure which is more complicated than that of the existing LED equipment, two light sources are provided, three times of photographing are needed, photographed pictures are processed to obtain data, and then the data are picked up.
In order to solve the technical problems, the invention provides a using method of an LED device with detecting and picking functions.
Disclosure of Invention
The invention aims to provide a using method of an LED device with detecting and picking functions, so as to solve the problems that the existing optical detection efficiency proposed by the background technology is low, and damaged LEDs cannot be picked at the same time.
In order to achieve the purpose, the invention provides the following technical scheme: a use method of an LED device with detection and pickup functions is characterized in that: the using method comprises the following steps: the method comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: photographing through the second imaging part under the independent irradiation of the light source for reflecting light; step three: photographing through the first imaging part and the third imaging part under the single irradiation of the light source for absorbing light; step four: synthesizing the three pictures shot in the last three steps into one picture through a computer, and identifying and positioning the damaged LED chip; step five: controlling a picking part on the moving part to pick out the damaged LEDs one by one; step six: the blue film with undamaged LED arrays is removed from the platform assembly.
Further, the first step: the blue film with the LED array is laid on the platform component, and the distance between the positioning components on the platform component is at least one group larger than the diameter of the LED array.
Further, the second step: the light source used for reflecting light is independently irradiated, the second imaging part is used for photographing, the imaging part is used for photographing under the conditions that the light source used for reflecting light is turned on and the light source used for absorbing light is turned off, the positioning part on the platform part needs to be completely photographed on a picture, and at the moment, the picture images are the electrode of the LED, the blue film, the positioning part and the damaged LED.
Further, step three: the positioning part, the electrode and the damaged LED can scatter light emitted by the light source for absorbing light into the imaging part, and the photo imaging is performed by the positioning part, the electrode and the damaged LED; the crystal of the LED is irradiated by the light source for absorbing light to cause photoluminescence, the positioning component is irradiated by the light source for absorbing light to cause photoluminescence, the blue film and the crystal of the LED can absorb light emitted by the light source for absorbing light, the positioning component on the platform component needs to be completely shot on a picture for shooting, when the picture is shot for the third time, the relative position relation of a shot object, the first imaging component, the second imaging component and the third imaging component is unchanged, and at the moment, the positioning component and all the LEDs are imaged through the third imaging component.
Further, step four: synthesizing the three pictures shot in the last three steps into one picture through a computer, and identifying and positioning the damaged LED chip; the positioning components of the three shot pictures are imaged, the relative positions and parameters on the pictures are unchanged, the three pictures are used as the calibration of the three pictures, and the three pictures are combined into one picture; the synthesized photo images the electrodes of the LED, the blue film, the positioning component, the damaged LED and the undamaged LED; and coordinates are established through the positioning component, and the damaged LED is positioned.
Further, step five: and controlling a picking part on the moving part to pick up the damaged LEDs one by one, sending the positioning information obtained in the previous step to the moving part, controlling the picking part to pick up the damaged LEDs, and not operating the undamaged LEDs.
Further, step six: and taking the blue film with the undamaged LED array away from the platform part, storing the LED array positioning information picked up by the damaged LED, and taking the blue film with the undamaged LED array away from the platform part.
Compared with the prior art, the invention has the beneficial effects that:
(1) the method adopts three-time comparison, and has the characteristics of high resolution and accurate positioning compared with single imaging (scattered light of dead spots of the single imaging is difficult to distinguish due to background light noise of reflected light and has low contrast).
(2) The LED that has the damage according to the photo location of comparing, then will have the LED chip of damage to pick up out through pickup apparatus, owing to do not select separately with the secondary, so good LED need not be selected separately once more, and pickup apparatus only picks up the LED that has the damage, has avoided the damage that secondary mechanical operation probably brought, and this pickup apparatus can replace artifical the sorting simultaneously, has saved manpower and time, has improved efficiency.
Drawings
Fig. 1 is a schematic structural diagram of an LED device with both detecting and picking functions according to the present invention.
Fig. 2 is a top view of the platform assembly of the present invention.
Fig. 3 is a schematic flow chart of a method for using an LED device with both probing and picking functions according to the present invention.
In the figure: the image processing device comprises a computer 1, a first imaging part 21, a second imaging part 22, a third imaging part 23, a light source 3 for reflecting light, a light source 4 for absorbing light, a pickup part 5, a moving part 6, a positioning part 7, an optical isolation part 8, a supporting part 9, a platform part 10, a shell 11, an image recognition system 12 of the computer, a control system 13 of the computer, an electrode 14 of the LED, a blue film 15, a damaged LED16, a non-damaged LED17, a light beam 18 of the light source for reflecting light, and light 19 which is subjected to diffuse reflection.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: an LED device with both detection and pick-up functions comprises a computer 1, a first imaging component 21, a second imaging component 22, a third imaging component 23, a light source 3 for reflecting light, a light source 4 for absorbing light, a pick-up component 5, a moving component 6, a positioning component 7, an optical isolation component 8, a supporting component 9, a platform component 10, a shell 11, an image recognition system 12 of the computer and a control system 13 of the computer.
A use method of an LED device with detection and pickup functions is characterized in that: the using method comprises the following steps: the method comprises the following steps: tiling the blue film 15 with the LED array on top of the platform part 10; step two: photographing by the second imaging part 22 under the illumination of the light source 3 for reflecting light alone; step three: the third imaging part 23 takes a picture through the first imaging part 21 under the irradiation of the light source 4 for absorbing light alone; step four: combining the three pictures taken in the last three steps into one picture by a computer and identifying and positioning the damaged LED 16; step five: controlling the picking part 5 on the moving part 6 to pick out the damaged LEDs 16 one by one; step six: the blue film 15 with the undamaged array of LEDs 17 is removed from the platform member 10.
Further, the first step: the blue film 15 with the LED array is laid on the platform part 10, and the distance between the positioning parts 7 on the platform part 10 is at least one group larger than the diameter of the LED array.
Further, the second step: the picture is taken by the second imaging part 22 under the condition that the light source 3 for reflecting light is singly irradiated, the imaging part is taken with the light source 3 for reflecting light switched on and the light source 4 for absorbing light switched off, and the positioning part 7 on the platform part 10 is completely taken on the picture, and the picture is imaged on the electrode 14 of the LED, the blue film 15, the positioning part 7 and the damaged LED 16.
When the light source 3 for reflecting light irradiates and the light emitted from the light source irradiates the LED, the electrode 14, the blue film 15 and the damaged LED16 of the LED are diffusely reflected, the undamaged LED17 (having a good specular effect due to the material deposited by the deposition method on the surface of the LED) is reflected, the first imaging member 21, the second imaging member 22 and the third imaging member 23 are located in the region outside the reflected light beam, so that the emitted light beam cannot enter the first imaging member 21, the second imaging member 22 or the third imaging member 23, the electrode 14, the blue film 15, the positioning member 7 and the damaged LED16 of the LED are diffusely reflected due to the rough surface, the diffusely reflected light is emitted in all directions, so that the diffusely reflected light 19 can enter the second imaging member 22, and the electrode 14, the blue film 15, the positioning member 7 and the damaged LED16 of the LED are imaged, the portion of the LED17 not damaged except for the electrode 14 cannot be imaged, and the scattered light of the damaged LED16 sometimes does not have background light noise of the reflected light at that position, and has higher resolution and contrast.
Further, step three: the light source 4 for absorbing light is singly irradiated to take a picture through the first imaging part 21, the imaging part is used for taking a picture when the light source 3 for reflecting light is turned off and the light source 4 for absorbing light is turned on, the positioning part 7 on the platform part 10 is integrally taken on the picture, the relative position relationship between the object to be taken and the imaging part is unchanged during the picture taking, the positioning part 7, the electrode 14 and the damaged LED16 can scatter the light emitted by the light source 4 for absorbing light into the imaging part, and the picture imaging is carried out by the positioning part 7, the electrode 14 and the damaged LED 16; the light source 4 for absorbing light irradiates the crystal of the LED to make the crystal photoluminescence, the light source 4 for absorbing light irradiates the positioning component 7 to make the positioning component photoluminescence, at the moment, the blue film 15 and the crystal of the LED can absorb the light emitted by the light source for absorbing light, the positioning component 7 on the platform component 10 needs to be completely photographed on a picture, when the picture is photographed for the third time, the relative position relation of the photographed object and the first imaging component 21, the second imaging component 22 and the third imaging component 23 is unchanged, and at the moment, the positioning component 7 and all the LEDs are imaged through the third imaging component.
When the light source 4 with the absorbed light is illuminated, the light emitted by the light source is absorbed by the semiconductor material of the LED except the electrodes, and photoluminescence occurs by absorption of this semiconductor material, and the positioning part 7 and all the LEDs are imaged.
Further, step four: synthesizing the three pictures shot in the last three steps into one picture by a computer, and identifying and positioning the damaged LED chip 16; the positioning components of the three shot pictures are imaged, the relative positions and parameters on the pictures are unchanged, the three pictures are used as the calibration of the three pictures, and the three pictures are combined into one picture; the synthesized photograph is imaged with the electrode 14 of the LED, the blue film 15, the positioning member 7, the damaged LED16 and the undamaged LED17, and coordinates are established by the positioning member 7 to position the damaged LED 16.
Because the positioning component 7 is made in a customized mode, the positioning component 7 has consistency and strongest diffuse reflection, the positioning component 7 has regularity, and the relative position relationship between the object to be photographed and the first imaging component 21, the second imaging component 22 and the third imaging component 23 is unchanged when three times of photographing is performed, the position relationship between the positioning component 7 and the pixel points of the images of the LEDs in the three-time photographed photos is unchanged, and the three-time photographed photos can be combined into one photo through the positioning component 7. Coordinates are established from the locating component 7 so that damaged LEDs 16 can be easily compared and located.
Further, step five: and controlling the picking-up component 5 on the moving component 6 to pick up the damaged LEDs 16 one by one, sending the positioning information obtained in the previous step to the moving component 6, controlling the picking-up component 5 to pick up the damaged LED16, and not operating the LED17 without damage. Because secondary sorting is not used, the LEDs 17 without damage are not sorted again, the picking component 5 only picks the LEDs 16 with damage, the damage possibly caused by secondary mechanical operation is avoided, meanwhile, the picking component 5 can replace manual sorting, manpower and time are saved, and the efficiency is improved.
Further, step six: the blue film 15 with damaged LED16 array is removed from the platform member 10, the LED array positioning information that has been picked up by damaged LED16 is preserved, and the blue film 15 with undamaged LED17 is removed from the platform member.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes, modifications, equivalents and improvements may be made without departing from the spirit and scope of the invention.
Claims (7)
1. A use method of an LED device with detection and pickup functions is characterized in that: the using method comprises the following steps: the method comprises the following steps: tiling a blue film with an array of LEDs onto a platform member; step two: photographing through the second imaging part under the independent irradiation of the light source for reflecting light; step three: photographing through the first imaging part and the third imaging part under the single irradiation of the light source for absorbing light; step four: synthesizing the three pictures shot in the last three steps into one picture through a computer, and identifying and positioning the damaged LED chip; step five: controlling a picking part on the moving part to pick out the damaged LEDs one by one; step six: the blue film with undamaged LED arrays is removed from the platform assembly.
2. The use method of the LED device with the functions of detection and pickup as claimed in claim 1, wherein: the method comprises the following steps: the blue film with the LED array is laid on the platform component, and the distance between the positioning components on the platform component is at least one group larger than the diameter of the LED array.
3. The use method of the LED device with the functions of detection and pickup as claimed in claim 2, wherein: step two: the light source used for reflecting light is independently irradiated, the second imaging part is used for photographing, the imaging part is used for photographing under the conditions that the light source used for reflecting light is turned on and the light source used for absorbing light is turned off, the positioning part on the platform part needs to be completely photographed on a picture, and at the moment, the picture is imaged on an electrode, a blue film, the positioning part and a damaged LED of the LED.
4. The use method of the LED device with the functions of detection and pickup as claimed in claim 3, wherein: step three: the positioning part, the electrode and the damaged LED can scatter light emitted by the light source for absorbing light into the imaging part, and the photo imaging is performed by the positioning part, the electrode and the damaged LED; the crystal of the LED is irradiated by the light source for absorbing light to cause photoluminescence, the positioning component is irradiated by the light source for absorbing light to cause photoluminescence, the blue film and the crystal of the LED can absorb light emitted by the light source for absorbing light, the positioning component on the platform component needs to be completely shot on a picture for shooting, when the picture is shot for the third time, the relative position relation of a shot object, the first imaging component, the second imaging component and the third imaging component is unchanged, and at the moment, the positioning component and all the LEDs are imaged through the third imaging component.
5. The use method of the LED device with the functions of detection and pickup as claimed in claim 4, wherein: step four: synthesizing the three pictures shot in the last three steps into one picture through a computer, and identifying and positioning the damaged LED chip; the positioning components of the three shot pictures are imaged, the relative positions and parameters on the pictures are unchanged, the three pictures are used as the calibration of the three pictures, and the three pictures are combined into one picture; and (3) after the synthesis, imaging the electrode, the blue film, the positioning part, the damaged LED and the undamaged LED of the LED on the picture, and establishing coordinates through the positioning part to position the damaged LED.
6. The use method of the LED device with the functions of detection and pickup as claimed in claim 5, wherein: step five: and controlling a picking part on the moving part to pick up the damaged LEDs one by one, sending the positioning information obtained in the previous step to the moving part, controlling the picking part to pick up the damaged LEDs, and not operating the undamaged LEDs.
7. The use method of the LED device with the functions of detection and pickup as claimed in claim 6, wherein: step six: and taking the blue film with the undamaged LED array away from the platform part, storing the LED array positioning information picked up by the damaged LED, and taking the blue film with the undamaged LED array away from the platform part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110622515.5A CN113441412B (en) | 2021-06-04 | 2021-06-04 | Using method of LED equipment with detection and pickup functions |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110622515.5A CN113441412B (en) | 2021-06-04 | 2021-06-04 | Using method of LED equipment with detection and pickup functions |
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| CN113441412A true CN113441412A (en) | 2021-09-28 |
| CN113441412B CN113441412B (en) | 2022-12-16 |
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| CN209520071U (en) * | 2018-12-21 | 2019-10-22 | 义乌臻格科技有限公司 | It is a kind of for picking up the nozzle unit and sorting unit of microchip |
| JP6679188B1 (en) * | 2018-10-19 | 2020-04-15 | 株式会社御池鐵工所 | Waste sorting device and waste sorting method |
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2021
- 2021-06-04 CN CN202110622515.5A patent/CN113441412B/en active Active
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| US20120179290A1 (en) * | 2009-09-22 | 2012-07-12 | Chung Fai Lo | Diamond sorting system |
| US20130126399A1 (en) * | 2010-07-02 | 2013-05-23 | Strube Gmbh & Co. Kg | Method for classifying objects contained in seed lots and corresponding use for producing seed |
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| CN203281518U (en) * | 2013-03-15 | 2013-11-13 | 旺矽科技股份有限公司 | Crystal grain selecting equipment |
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| CN113441412B (en) | 2022-12-16 |
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