CN113438821A - Processing method for eliminating color difference of nickel-gold plating process - Google Patents
Processing method for eliminating color difference of nickel-gold plating process Download PDFInfo
- Publication number
- CN113438821A CN113438821A CN202110590826.8A CN202110590826A CN113438821A CN 113438821 A CN113438821 A CN 113438821A CN 202110590826 A CN202110590826 A CN 202110590826A CN 113438821 A CN113438821 A CN 113438821A
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- China
- Prior art keywords
- circuit board
- nickel
- gold
- color difference
- processing method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a processing method for eliminating color difference of a nickel-gold plating process, which comprises the following steps: pickling the circuit board; and carrying out nickel plating on the circuit board under the condition of meeting specific conditions. The specific conditions are as follows: cleaning the circuit board; and/or, after a preset time, electrifying the nickel groove. Therefore, the phenomena of blackening and fogging of the nickel layer after the circuit board is electroplated are avoided.
Description
Technical Field
The invention relates to the technical field of nickel and gold plating, in particular to a processing method for eliminating color difference of a nickel layer by a nickel and gold plating process.
Background
In the prior art, a copper bar is adopted as a cathode bar in nickel-gold electroplating equipment, a stainless steel top clamp is arranged on the copper bar, the top clamp is used for conducting current conduction with the edge of a copper plate of a board to be electroplated, and a crown block is used for hoisting the copper bar hung with a printed board into an electroplating bath to form a loop; and electroplating the circuit pattern exposed outside the dry film on the circuit board, and finally electroplating nickel and gold on the copper surface.
However, in the process of processing the nickel-gold electroplating device, the quality defect of poor color difference of the surface of the nickel-gold layer often occurs, that is, the nickel-gold layer after electroplating becomes black and foggy.
Therefore, the technical personnel in the field need to solve the problem of how to design a processing method for eliminating the color difference of the nickel layer.
Disclosure of Invention
The invention provides a processing method for eliminating color difference of a nickel-gold plating process, which avoids the phenomena of blackening and fogging of a nickel layer after electroplating of a circuit board.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the invention provides a processing method for eliminating color difference of a nickel-gold plating process, which comprises the following steps: pickling the circuit board;
under the condition of meeting specific conditions, carrying out nickel plating on the circuit board;
the specific conditions are as follows: cleaning the circuit board;
and/or, after a preset time, electrifying the nickel groove.
Optionally, in the present invention, the cleaning of the circuit board specifically includes:
and cleaning the circuit board by using a deionized water solution.
Optionally, in the present invention, before the acid washing of the circuit board, the method further includes:
s11, removing oil on the surface of the circuit board by using an oil removing agent;
s12, washing residues on the surface of the circuit board by tap water;
s13, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
s14, washing residues on the surface of the circuit board by the tap water
Optionally, in the present invention, after the nickel plating is performed on the circuit board, the method further includes:
s21, removing oil on the surface of the circuit board by using an oil removing agent;
s22, washing residues on the surface of the circuit board by tap water;
s23, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
s24, washing residues on the surface of the circuit board by the tap water;
s25, cleaning the circuit board by using a deionized water solution, and/or electrifying the gold groove after a preset time;
and S26, carrying out gold plating on the circuit board.
Alternatively, in the present invention, the preset time is set to 15 seconds to 25 seconds.
The invention has the advantages and positive effects that:
because the surface of the circuit board is provided with the acid solution and the current is supplied to the nickel groove in advance, the current can paste and mist the copper surface of the circuit board. Based on the method, after the circuit board is subjected to acid cleaning, the circuit board is cleaned by using a deionized water solution to wash away an acid solution on the circuit board, and after a preset time is delayed, a current is supplied to a nickel groove (a gold groove) to carry out nickel plating (or gold plating) on the circuit board; therefore, the quality defect of the surface color difference of the nickel-gold layer is eliminated, and the product quality is comprehensively improved.
Drawings
FIG. 1 is a flow chart of a processing method for eliminating color difference of a nickel layer by a nickel and gold plating process provided by the invention;
FIG. 2 is a schematic diagram of the countdown of current to a nickel bath provided by the present invention.
Detailed Description
The following describes in detail a specific implementation of a method and an apparatus for allocating transmission resources according to an embodiment of the present invention with reference to the accompanying drawings. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Before the present invention is introduced, it should be noted that the inventors have found that:
after the surface of the nickel layer is found to generate color difference, the inventor tests the site air supply and exhaust, the working environment, the quality of the upper-sequence product, 17 working slots of the nickel and gold plating equipment and the like one by one, and the result is that the problems can not be solved;
however, in one experiment, the feiba product was not energized prior to entering the nickel bath, and after the discovery, the nickel bath was inputting current; the results of this experiment are: the flying bar product only leaks current and does not have the phenomena of nickel layer fogging and blacking;
the inventor finds that by repeatedly detecting with a multimeter: when the flying bus hangs the circuit board and carries a board signal which is input in advance, the flying bus starts to vertically fall above the nickel tank and does not completely fall on the saddle, the universal meter detects that voltage is generated, which shows that a transmission signal for controlling the electric box gives a working instruction to the high-frequency switching power supply in advance to cause the circuit board to start electroplating in the air, and at the moment, the surface of the circuit board is provided with an acid solution; under the strong acid and air environment, the copper surface is pasted and fogged by current; the color difference of the surface of the original nickel-gold layer is caused by that the bottom layer copper is electroplated and oxidized in the air in advance, and has no relation with a nickel groove and a gold groove.
Therefore, how to eliminate the color difference of the surface of the nickel-gold layer will be specifically described as follows.
The embodiments of the invention will be described in further detail below with reference to the accompanying drawings:
the processing method for eliminating the color difference of the nickel-gold plating process, as shown in figure 1, comprises the following steps: pickling the circuit board;
under the condition of meeting specific conditions, carrying out nickel plating on the circuit board;
the specific conditions are as follows: cleaning the circuit board;
and/or, after a preset time, electrifying the nickel groove.
Thus, after the circuit board is acid-washed, the circuit board is washed by deionized water solution to wash away acid solution on the circuit board, and after the preset time is delayed, current is supplied to the nickel groove (or the gold groove) to carry out nickel plating (or gold plating) on the circuit board; therefore, the quality defect of the surface color difference of the nickel-gold layer is eliminated, and the product quality is comprehensively improved.
Optionally, in an embodiment of the present invention, the cleaning of the circuit board specifically includes:
and cleaning the circuit board by using a deionized water solution.
Optionally, in an embodiment of the present invention, before the performing the acid cleaning on the circuit board, the method further includes:
s11, removing oil on the surface of the circuit board by using an oil removing agent;
s12, washing residues on the surface of the circuit board by tap water;
s13, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
and S14, washing residues on the surface of the circuit board by the tap water.
Therefore, the surface of the circuit board is ensured to be clean, and the subsequent nickel-gold plating on the circuit board is facilitated.
Optionally, in an embodiment of the present invention, after the nickel plating is performed on the circuit board, the method further includes:
s21, removing oil on the surface of the circuit board by using an oil removing agent;
s22, washing residues on the surface of the circuit board by tap water;
s23, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
s24, washing residues on the surface of the circuit board by the tap water;
s25, cleaning the circuit board by using a deionized water solution, and/or electrifying the gold groove after a preset time;
and S26, carrying out gold plating on the circuit board.
After the surface of the circuit board is plated with nickel, gold is further plated on the surface of the circuit board, thereby forming a nickel layer on the surface of the circuit board.
Optionally, in an embodiment of the present invention, the preset time is set to 15 seconds to 25 seconds.
It should be noted that the preset time may also be set to 19 seconds or 21 seconds, which is not specifically limited herein, that is, the preset time may be set according to actual conditions to meet the requirements of different scenarios, so as to improve the flexibility of design.
The first embodiment is as follows:
degreasing the surface of the circuit board by using a degreasing agent;
washing residues on the surface of the circuit board twice by using tap water;
soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
washing residues on the surface of the circuit board twice by using tap water;
acid washing is carried out on the circuit board;
cleaning the circuit board by using a deionized water solution to wash away an acid solution on the circuit board;
after delaying for 20 seconds, electrifying the nickel groove, and carrying out nickel plating on the circuit board;
washing residues on the surface of the circuit board twice by using tap water;
soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
washing residues on the surface of the circuit board twice by using tap water;
acid washing is carried out on the circuit board;
cleaning the circuit board by using a deionized water solution to wash away an acid solution on the circuit board;
after delaying for 20 seconds, the gold groove is electrified to perform gold plating on the circuit board, thereby forming a nickel-gold layer on the circuit board.
Thus, after the circuit board is acid-washed, the circuit board is washed by deionized water solution to wash away acid solution on the circuit board, and after the preset time is delayed, current is applied to the nickel groove (or the gold groove) to carry out nickel plating (or gold plating) on the circuit board; therefore, the quality defect of the surface color difference of the nickel-gold layer is eliminated, and the product quality is comprehensively improved.
In addition, referring to fig. 2, the specific process of fig. 2 is: the timer is started, timing is started, the time is prolonged for 20 seconds, and after 20 seconds, current is supplied to the nickel groove (or the gold groove) to realize nickel plating (or gold plating) on the circuit board.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (5)
1. The processing method for eliminating the color difference of the nickel-gold plating process is characterized by comprising the following steps:
pickling the circuit board;
under the condition of meeting specific conditions, carrying out nickel plating on the circuit board;
the specific conditions are as follows: cleaning the circuit board;
and/or, after a preset time, electrifying the nickel groove.
2. The processing method for eliminating the color difference of the nickel-gold layer by the nickel-gold plating process according to claim 1, wherein the step of cleaning the circuit board specifically comprises the following steps:
and cleaning the circuit board by using a deionized water solution.
3. The processing method for eliminating color difference of a nickel-gold layer by a nickel-gold plating process according to claim 1, characterized by further comprising the following steps before the circuit board is subjected to acid cleaning:
s11, removing oil on the surface of the circuit board by using an oil removing agent;
s12, washing residues on the surface of the circuit board by tap water;
s13, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
and S14, washing residues on the surface of the circuit board by the tap water.
4. The processing method for eliminating color difference of a nickel-gold layer by a nickel-gold plating process according to claim 1, further comprising the following steps after the circuit board is plated with nickel:
s21, removing oil on the surface of the circuit board by using an oil removing agent;
s22, washing residues on the surface of the circuit board by tap water;
s23, soaking the circuit board in the micro-etching solution to slightly etch the surface of the circuit board;
s24, washing residues on the surface of the circuit board by the tap water;
s25, cleaning the circuit board by using a deionized water solution, and/or electrifying the gold groove after a preset time;
and S26, carrying out gold plating on the circuit board.
5. The processing method for eliminating color difference of a nickel-gold layer by a nickel-gold plating process according to claim 4, wherein the preset time is set to 15 seconds to 25 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110590826.8A CN113438821A (en) | 2021-05-28 | 2021-05-28 | Processing method for eliminating color difference of nickel-gold plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110590826.8A CN113438821A (en) | 2021-05-28 | 2021-05-28 | Processing method for eliminating color difference of nickel-gold plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113438821A true CN113438821A (en) | 2021-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110590826.8A Pending CN113438821A (en) | 2021-05-28 | 2021-05-28 | Processing method for eliminating color difference of nickel-gold plating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113438821A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090139870A1 (en) * | 2007-12-04 | 2009-06-04 | Mizuki Nagai | Plating apparatus and plating method |
| CN101824634A (en) * | 2009-03-06 | 2010-09-08 | 深圳市正基电子有限公司 | Process for manufacturing circuit board |
| JP2013112842A (en) * | 2011-11-28 | 2013-06-10 | Yamaichi Electronics Co Ltd | Electroplating apparatus and plating method |
| CN104532307A (en) * | 2014-12-22 | 2015-04-22 | 泰州市博泰电子有限公司 | Method for electroplating matte nickel on microwave high-frequency plate |
| US20170073830A1 (en) * | 2015-09-10 | 2017-03-16 | Kabushiki Kaisha Toshiba | Electroplating apparatus, electroplating method, and method of manufacturing semiconductor device |
-
2021
- 2021-05-28 CN CN202110590826.8A patent/CN113438821A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090139870A1 (en) * | 2007-12-04 | 2009-06-04 | Mizuki Nagai | Plating apparatus and plating method |
| CN101824634A (en) * | 2009-03-06 | 2010-09-08 | 深圳市正基电子有限公司 | Process for manufacturing circuit board |
| JP2013112842A (en) * | 2011-11-28 | 2013-06-10 | Yamaichi Electronics Co Ltd | Electroplating apparatus and plating method |
| CN104532307A (en) * | 2014-12-22 | 2015-04-22 | 泰州市博泰电子有限公司 | Method for electroplating matte nickel on microwave high-frequency plate |
| US20170073830A1 (en) * | 2015-09-10 | 2017-03-16 | Kabushiki Kaisha Toshiba | Electroplating apparatus, electroplating method, and method of manufacturing semiconductor device |
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Application publication date: 20210924 |
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| RJ01 | Rejection of invention patent application after publication |