CN113428598B - Silicon wafer circulating receiving system and receiving method - Google Patents
Silicon wafer circulating receiving system and receiving method Download PDFInfo
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- CN113428598B CN113428598B CN202110650058.0A CN202110650058A CN113428598B CN 113428598 B CN113428598 B CN 113428598B CN 202110650058 A CN202110650058 A CN 202110650058A CN 113428598 B CN113428598 B CN 113428598B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 227
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 227
- 239000010703 silicon Substances 0.000 title claims abstract description 227
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 356
- 235000012431 wafers Nutrition 0.000 claims abstract description 234
- 239000000463 material Substances 0.000 claims abstract description 180
- 238000010992 reflux Methods 0.000 claims abstract description 10
- 230000007723 transport mechanism Effects 0.000 claims description 26
- 230000003139 buffering effect Effects 0.000 claims description 10
- 125000004122 cyclic group Chemical group 0.000 claims description 10
- 238000004064 recycling Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 description 10
- 230000003028 elevating effect Effects 0.000 description 5
- 230000007704 transition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G37/00—Combinations of mechanical conveyors of the same kind, or of different kinds, of interest apart from their application in particular machines or use in particular manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G41/00—Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames
- B65G41/001—Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames with the conveyor adjustably mounted on the supporting frame or base
- B65G41/002—Pivotably mounted
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G65/00—Loading or unloading
- B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
- B65G65/32—Filling devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G69/00—Auxiliary measures taken, or devices used, in connection with loading or unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a silicon wafer circulating receiving system and a receiving method, wherein the silicon wafer circulating receiving system comprises a silicon wafer conveying mechanism, a receiving conveying mechanism and a reflux conveying mechanism, and the silicon wafer circulating receiving system comprises the following components: a plurality of silicon wafer collecting stations are arranged on a conveying path of the silicon wafer conveying mechanism, and the silicon wafer conveying mechanism is configured to convey silicon wafers into a material box positioned at the silicon wafer collecting stations; the full material box fully receiving the silicon wafer is reversed from the silicon wafer receiving station to the material receiving and conveying mechanism, and the material receiving and conveying mechanism is configured to convey the full material box to the material receiving station positioned at the discharge end of the material receiving and conveying mechanism; the empty material box at the material receiving station is reversed to a reflow station at the feeding end of the reflow conveying mechanism, and the reflow conveying mechanism is configured to convey the empty material box at the reflow station towards the silicon wafer receiving station so that the empty material box reflows to the silicon wafer receiving station. The invention realizes automatic receiving of the silicon wafer, realizes the circulating reflux of the material box between the receiving station and the receiving station, and improves the receiving efficiency.
Description
Technical Field
The invention relates to the field of battery production, in particular to a silicon wafer circulating receiving system and a receiving method.
Background
After the silicon wafer is sorted, the silicon wafer needs to be timely taken away from a main conveying line of silicon wafer sorting equipment, and then the silicon wafer is collected. The traditional receiving mode is that a special silicon wafer receiving mechanism is arranged on the side edge of the main conveying line or a silicon wafer is picked up from the main conveying line manually to receive the silicon wafer, and the receiving efficiency of the traditional silicon wafer receiving mode is low.
Disclosure of Invention
In order to solve the technical problems, the invention provides a silicon wafer circulating and receiving system, which adopts the following technical scheme:
the utility model provides a silicon chip circulation material receiving system, includes silicon chip conveying mechanism, receives material conveying mechanism and backward flow conveying mechanism, wherein:
a plurality of silicon wafer collecting stations are arranged on a conveying path of the silicon wafer conveying mechanism, and the silicon wafer conveying mechanism is configured to convey silicon wafers into a material box positioned at the silicon wafer collecting stations;
The receiving and conveying mechanism is positioned at the first side of the silicon wafer conveying mechanism, a full material box full of silicon wafers is reversed from a silicon wafer receiving station to the receiving and conveying mechanism, and the receiving and conveying mechanism is configured to convey the full material box to a receiving station positioned at the discharging end of the receiving and conveying mechanism;
The reflow conveying mechanism is positioned on the second side of the silicon wafer conveying mechanism, the empty material box which is carried out at the material receiving station is reversed to the reflow station positioned at the feeding end of the reflow conveying mechanism, and the reflow conveying mechanism is configured to convey the empty material box positioned at the reflow station towards the silicon wafer receiving station so that the empty material box flows back to the silicon wafer receiving station.
By matching the silicon wafer conveying mechanism, the receiving conveying mechanism and the reflux conveying mechanism, the automatic receiving of the silicon wafer is realized, and particularly, in the receiving process, the circulating reflux of the material box between the receiving station and the receiving station is realized, so that the receiving efficiency is further improved.
In some embodiments, the silicon wafer cycle receiving system further comprises a first cartridge reversing mechanism, a second cartridge reversing mechanism, a third cartridge reversing mechanism, a fourth cartridge reversing mechanism, and a fifth cartridge reversing mechanism, wherein: the first material box reversing mechanism is arranged at a silicon wafer collecting station, the second material box reversing mechanism is arranged on a conveying path of the collecting conveying mechanism, the third material box reversing mechanism is arranged at the collecting station, the fourth material box reversing mechanism is arranged at a reflow station, and the fifth material box reversing mechanism is arranged on the conveying path of the reflow conveying mechanism. The first material box reversing mechanism is configured to bear and jack the material box at the silicon wafer collecting station so as to collect the silicon wafers by the material box, and the first material box reversing mechanism is also configured to reverse the full material box full of the silicon wafers to the second material box reversing mechanism. The second magazine reversing mechanism is configured to reverse the full magazine onto the accept delivery mechanism. The third magazine reversing mechanism is configured to reverse an empty magazine at the receiving station onto the fourth magazine reversing mechanism. The fourth cartridge reversing mechanism is configured to reverse the empty cartridge onto the return transport mechanism. The fifth cartridge reversing mechanism is configured to reverse the empty cartridge on the return transport mechanism onto the first cartridge reversing mechanism.
The conveying paths of the silicon wafer conveying mechanism, the receiving conveying mechanism and the reflux conveying mechanism are completely staggered, and the reversing switching of the material box among the three conveying mechanisms can be realized by arranging the material box reversing mechanism. Specific: the first material box reversing mechanism and the second material box reversing mechanism are mutually matched to switch the material box from the silicon wafer conveying mechanism to the material receiving conveying mechanism in a reversing way. The third material box reversing mechanism and the fourth material box reversing mechanism are mutually matched to change the material box from the material receiving and conveying mechanism to the backflow conveying mechanism. And the fifth material box reversing mechanism is used for reversing and switching the material box from the reflow conveying mechanism to a silicon wafer collecting station under the silicon wafer conveying mechanism.
In some embodiments, the silicon wafer conveying mechanism comprises a plurality of conveying units, the conveying units comprise a first conveying belt and a second conveying belt, a gap is reserved between the first conveying belt and the second conveying belt, the silicon wafer collecting station is located below the gap, and the first conveying belt is configured to be capable of overturning downwards towards the silicon wafer collecting station. When the first conveyor belt turns downwards, the silicon wafers carried on the first conveyor belt slide from the first conveyor belt into a material box positioned at a silicon wafer collecting station.
Through setting up silicon chip conveying mechanism, need not to additionally set up receipts piece mechanism, silicon chip on the silicon chip conveying mechanism can automatic slide to be located in the magazine under the silicon chip conveying mechanism to receive piece efficiency has been promoted.
In some embodiments, the second conveyor belt is configured to be capable of flipping up away from the wafer receiving station. When the first conveyor belt turns downwards towards the silicon wafer collecting station, the second conveyor belt turns upwards away from the silicon wafer collecting station.
Through setting up the second conveyer belt into convertible structure, receive the piece in-process, control second conveyer belt keeps away from the silicon chip and receive piece station upset upwards, realized that the second conveyer belt dodges the silicon chip on the first conveyer belt, guarantee that the silicon chip is smooth to slide to in the magazine.
In some embodiments, the silicon wafer cyclic material receiving system further comprises a full-box buffer conveying mechanism arranged below the material receiving conveying mechanism, wherein the full-box buffer conveying mechanism is used for buffering full boxes.
When the material box exists at the material receiving station, the full material box on the material receiving conveying mechanism can be buffered in the full material box buffering conveying mechanism, so that the material receiving conveying mechanism is prevented from being fully loaded.
In some embodiments, the silicon wafer cyclic material receiving system further comprises an empty material box buffering and conveying mechanism arranged below the backflow conveying mechanism, wherein the empty material box buffering and conveying mechanism is used for buffering empty material boxes.
When a material box exists at the silicon wafer collecting station, the empty material box on the reflow conveying mechanism is cached to the empty material box caching conveying mechanism, so that the reflow conveying mechanism is prevented from being fully loaded.
In some embodiments, the fourth cartridge reversing mechanism is further configured to reverse an empty cartridge on the empty cartridge cache transport mechanism onto the return transport mechanism.
When empty material boxes are in shortage on the reflow conveying mechanism, the empty material boxes on the empty material box buffer conveying mechanism are supplemented to the reflow conveying mechanism, so that the timely supply of the empty material boxes of the silicon wafer collecting station is ensured.
In some embodiments, the second cartridge reversing device, the fifth cartridge reversing device, and the third cartridge reversing device comprise a first base plate, a first lifting mechanism, a first lifting plate, a first conveyor belt mounting bracket, and a first conveyor belt, wherein: the first lifting mechanism is arranged on the first bottom plate, the first lifting plate is connected to the driving end of the first lifting mechanism, the first lifting mechanism drives the first lifting plate to lift, the first conveyor belt installation frame is arranged on the first lifting plate, and the first conveyor belt is installed on the first conveyor belt installation frame.
Through carrying out specific setting to first magazine switching-over mechanism, second magazine switching-over mechanism, fifth magazine switching-over mechanism, realized: and switching the material box from the silicon wafer conveying mechanism to the receiving conveying mechanism in a reversing way, and switching the material box from the reflow conveying mechanism to a silicon wafer receiving station under the silicon wafer conveying mechanism in a reversing way.
In some embodiments, the third cartridge reversing mechanism, the fourth cartridge reversing mechanism, comprises a second floor, a second lifting mechanism, a second lifting plate, a second conveyor belt mount, a second conveyor belt, a third conveyor belt mount, and a third conveyor belt, wherein: the second elevating system sets up on the bottom plate, and the second lifter plate is connected on second elevating system's driving end, and second elevating system drives the second lifter plate and goes up and down, and second conveyer belt mounting bracket sets up on the second lifter plate, and the second conveyer belt is installed on the second conveyer belt mounting bracket, and the second conveyer belt is carried along first horizontal direction. The third conveyer belt mounting bracket sets up on the second bottom plate, and the third conveyer belt is installed on the third conveyer belt mounting bracket, and the third conveyer belt is along carrying with first horizontal direction vertically second horizontal direction. When the second lifting mechanism drives the second lifting plate to ascend to a high position, the conveying bearing surface of the second conveying belt is higher than the conveying bearing surface of the third conveying belt, and when the second lifting mechanism drives the second lifting plate to descend to a low position, the conveying bearing surface of the second conveying belt is lower than the conveying bearing surface of the third conveying belt.
By arranging the third material box reversing mechanism and the fourth material box reversing mechanism, the reversing of the material box from the material receiving and conveying mechanism to the silicon wafer receiving station is realized.
The invention also provides a silicon wafer cyclic material receiving method, which comprises the following steps: and conveying and collecting the silicon wafer into a material box at a silicon wafer collecting station by utilizing a silicon wafer conveying mechanism. After the silicon wafer is fully received by the material box at the silicon wafer receiving station, the full material box is moved out from the silicon wafer receiving station and is reversed to the receiving and conveying mechanism, and the full material box is conveyed to the receiving station by the receiving and conveying mechanism. And reversing the empty material box which is positioned at the material receiving station to a reflow station of the reflow conveying mechanism. And the reflow conveying mechanism conveys and commutates the empty material box at the reflow station to the silicon wafer collecting station.
The silicon wafer circulating receiving method realizes automatic receiving of the silicon wafer, particularly realizes circulating reflux of the material box between the receiving station and the receiving station in the receiving process, thereby further improving the receiving efficiency.
Drawings
FIG. 1 is a schematic diagram of a silicon wafer cyclic material receiving system;
FIG. 2 is a schematic view of the silicon wafer transport mechanism in a first operating state according to the present invention;
FIG. 3 is a schematic view of the silicon wafer transport mechanism in the second operating state of the present invention;
FIG. 4 is a schematic structural view of the silicon wafer transport mechanism in a third operating state according to the present invention;
FIG. 5 is an assembly view of the return transport mechanism and empty magazine buffer transport mechanism of the present invention;
FIG. 6 is a schematic diagram of a second cartridge reversing mechanism according to the present invention;
fig. 7 is a schematic structural view of a third battery case reversing mechanism according to the present invention;
Fig. 1 to 7 include:
The silicon wafer conveying mechanism 10, the material receiving conveying mechanism 20, the backflow conveying mechanism 30, the first material box reversing mechanism 40, the second material box reversing mechanism 50, the third material box reversing mechanism 60, the fourth material box reversing mechanism 70 and the fifth material box reversing mechanism 80;
an empty magazine buffer transport mechanism 31;
a first bottom plate 51, a first lifting mechanism 52, a first lifting plate 53, a first conveyor belt mounting bracket 54, and a first conveyor belt 55;
The second floor 61, the second elevating mechanism 62, the second elevating plate 63, the second conveyor mounting frame 64, the second conveyor 65, the third conveyor mounting frame 66, and the third conveyor 67.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
Traditional silicon wafer material collection sets up special silicon wafer material collection mechanism or picks up the silicon wafer through the manual work from main conveying line in order to implement the receipts material to the silicon wafer at main conveying line side, and its receipts material inefficiency.
In view of the defects of the traditional silicon wafer receiving mode, the invention provides a silicon wafer circulating receiving system, which realizes automatic receiving of silicon wafers and improves receiving efficiency.
As shown in fig. 1, the silicon wafer circulating and receiving system of the invention comprises a silicon wafer conveying mechanism 10, a receiving and conveying mechanism 20 and a reflux conveying mechanism 30. Wherein:
a plurality of silicon wafer collecting stations are arranged on the conveying path of the silicon wafer conveying mechanism 10, and in the embodiment of fig. 1, two silicon wafer collecting stations are arranged in total, namely a silicon wafer collecting station a and a silicon wafer collecting station B. The silicon wafer transport mechanism 10 is configured to transport silicon wafers into cassettes located at a wafer receiving station.
The receiving and conveying mechanism 20 is located on a first side (e.g., right side) of the silicon wafer conveying mechanism 10, and a full magazine full of silicon wafers is reversed from a silicon wafer receiving station to the receiving and conveying mechanism 20. The accept conveyor 20 is configured to convey full cartridges to an accept station C at the discharge end of the accept conveyor 20.
The reflow conveyor 30 is located on a second (e.g., left) side of the wafer conveyor 10 and the empty cassettes being carried at the receiving station C are diverted to a reflow station D at the feed end of the reflow conveyor 30. The reflow conveyor 30 is configured to convey an empty magazine located at the reflow station D toward the wafer receiving station such that the empty magazine is reflowed to the wafer receiving station.
With continued reference to fig. 1, the silicon wafer recycling and receiving system in an embodiment of the present invention has the following receiving process,
The silicon wafer conveying mechanism 10 conveys and receives silicon wafers into a material box at the silicon wafer receiving station A or the silicon wafer receiving station B.
And (3) moving the full material box full of the silicon wafer out of the silicon wafer receiving station A or the silicon wafer receiving station B, reversing the full material box to the receiving and conveying mechanism 20, and conveying the full material box to the receiving station C by utilizing the receiving and conveying mechanism 20. The silicon wafer in the full material box is moved away at the material receiving station C.
The empty magazine at the receiving station C is then diverted to a reflow station D at the end of the reflow conveyor 30.
The reflow conveying mechanism 30 conveys and reverses the empty material box at the reflow station D to the silicon wafer collecting station A or the silicon wafer collecting station B so as to collect the silicon wafer in the next round.
Therefore, the silicon wafer circulating receiving system realizes automatic receiving of the silicon wafers and improves receiving efficiency. Particularly, the invention realizes the circulation reflux of the material box between the sheet receiving station and the material receiving station, thereby further improving the material receiving efficiency.
Two silicon wafer collecting stations are arranged below the silicon wafer conveying mechanism 10 in the embodiment of fig. 1, namely a silicon wafer collecting station A and a silicon wafer collecting station B.
In order to enable the silicon wafer on the silicon wafer conveying mechanism 10 to automatically slide into the material boxes at the silicon wafer collecting station A and the silicon wafer collecting station B, as shown in fig. 2 to 4, the silicon wafer conveying mechanism 10 comprises two conveying units, wherein each conveying unit comprises a first conveying belt 11 and a second conveying belt 12, and a gap is reserved between the first conveying belt 11 and the second conveying belt 12. The silicon wafer collecting station A is positioned below the gap of the conveying unit of the front channel, and the silicon wafer collecting station B is positioned below the gap of the conveying unit of the rear channel.
In particular, the first conveyor belt 11 of each conveyor unit is configured to be able to turn down towards the wafer receiving station. When the first conveyor belt 11 turns downwards, the silicon wafers carried on the first conveyor belt 11 slide from the first conveyor belt 11 into a material box at a silicon wafer collecting station. Specifically, as shown in fig. 3, when the first conveyor belt 11 of the front conveyor unit is turned down, the silicon wafer carried thereon slides down into the magazine 101 at the silicon wafer receiving station a. As shown in fig. 4, when the first conveyor belt 11 of the following conveyor unit is turned down, the silicon wafer carried thereon slides down into the magazine 102 at the wafer receiving station B.
It is considered that when the first conveyor belt 11 tilts downward to collect the silicon wafer, the second conveyor belt 12 may block the silicon wafer during the sliding down process. Thus, optionally, the second conveyor belt 12 is configured to be capable of being flipped up away from the wafer receiving station. Specific:
Taking the previous conveying unit as an example, as shown in fig. 3, when the first conveying belt 11 turns downwards towards the silicon wafer collecting station a, the second conveying belt 12 turns upwards away from the silicon wafer collecting station a, so that the silicon wafer on the first conveying belt 11 is ensured to smoothly slide into the material box 101 at the silicon wafer collecting station a.
Of course, as shown in fig. 2, when the first conveyor belt 11 and the second conveyor belt 12 of both conveyor units are in a horizontal state, at this time, the silicon wafer conveyor mechanism 10 may be used as a general conveyor mechanism for carrying out conveyance of silicon wafers only.
In other embodiments, the silicon wafer conveying mechanism 10 may include three, four, or other numbers of conveying units, and a corresponding number of silicon wafer receiving stations and cassettes are disposed below the silicon wafer conveying mechanism 10.
Since the conveyance paths of the silicon wafer conveyance mechanism 10, the material collection conveyance mechanism 20, and the reflow conveyance mechanism 30 are offset, as in fig. 1, the conveyance paths of the silicon wafer conveyance mechanism 10, the material collection conveyance mechanism 20, and the reflow conveyance mechanism 30 are parallel to each other. Therefore, in order to realize the reversing and switching of the material box among the silicon wafer conveying mechanism 10, the material receiving conveying mechanism 20 and the reflow conveying mechanism 30, the circulation reflow of the material box is finally completed. Optionally, the silicon wafer circulation receiving system of the present invention further includes a first magazine reversing mechanism 40, a second magazine reversing mechanism 50, a third magazine reversing mechanism 60, a fourth magazine reversing mechanism 70, and a fifth magazine reversing mechanism 80, wherein:
The first magazine reversing mechanism 40 is disposed at a silicon wafer receiving station, and in the embodiment of fig. 1, a silicon wafer receiving station a and a silicon wafer receiving station B are respectively provided with a first magazine reversing mechanism 40.
The second magazine reversing mechanism 50 is disposed on the conveying path of the receiving and conveying mechanism 20, and in the embodiment of fig. 1, two second magazine reversing mechanisms 50 are correspondingly disposed, where the two second magazine reversing mechanisms 50 are disposed on the first sides of the silicon wafer receiving station a and the silicon wafer receiving station B respectively.
The third magazine reversing mechanism 60 is disposed at the take-up station C.
The fourth cartridge reversing device 70 is disposed at the reflow station D.
The fifth magazine reversing mechanism 80 is disposed on the conveying path of the reflow conveying mechanism 30, and two fifth magazine reversing mechanisms 80 are correspondingly disposed in the embodiment of fig. 1, where the two fifth magazine reversing mechanisms 80 are disposed on the second sides of the silicon wafer collecting station a and the silicon wafer collecting station B respectively.
The first material box reversing mechanism 40 is used for bearing and jacking a material box at a silicon wafer collecting station to realize the collection of the silicon wafer by the material box, namely, the material box is borne on the first material box reversing mechanism 40 in the process of collecting the silicon wafer, and the first material box reversing mechanism 40 adjusts the interval between the material box and the silicon wafer conveying mechanism 10, so that the silicon wafer on the silicon wafer conveying mechanism 10 is ensured to safely enter the material box. In addition, the first magazine reversing mechanism 40 is further configured to reverse the full magazine full of silicon wafers to the corresponding second magazine reversing mechanism 50, for example, the first magazine reversing mechanism 40 located at the silicon wafer receiving station a reverses the full magazine full of silicon wafers to the second magazine reversing mechanism 50 located at the first side of the silicon wafer receiving station a.
The second magazine reversing mechanism 50 is used to reverse a full magazine onto the accept delivery mechanism 20.
The third magazine reversing mechanism 60 is configured to reverse the empty magazine at the receiving station C to the fourth magazine reversing mechanism 70 at the reflow station D.
The fourth cartridge reversing device 70 is used to reverse the empty cartridge to the return conveyor 30.
The fifth magazine reversing mechanism 80 is used for reversing the empty magazine on the reflow conveyor 30 to the first magazine reversing mechanism 40 at the corresponding silicon wafer receiving station. For example, a fifth magazine reversing mechanism 80 located on the second side of the wafer handling station a reverses the empty magazine to the first magazine reversing mechanism 40 located at the wafer handling station a.
Next, a detailed reversing process of the first cartridge reversing mechanism 40, the second cartridge reversing mechanism 50, the third cartridge reversing mechanism 60, the fourth cartridge reversing mechanism 70, and the fifth cartridge reversing mechanism 80 will be described with reference to fig. 1.
As shown in fig. 1, the silicon wafer conveying mechanism 10, the material receiving conveying mechanism 20 and the reflow conveying mechanism 30 all comprise two conveying belts which are arranged side by side, and the two conveying belts are matched to carry and convey silicon wafers or material boxes.
The second cartridge divert mechanism 50 is located between the two belts of the accept conveyor mechanism 20 and the fifth cartridge divert mechanism 80 is located between the two belts of the return conveyor mechanism 30.
We describe a complete cyclic material receiving process using the silicon wafer receiving station a as a starting point, as indicated by solid arrows in fig. 1:
first, the silicon wafer conveying mechanism 10 conveys the silicon wafer into a material box supported on the first material box reversing mechanism 40 at the silicon wafer collecting station A until the material box is fully filled with the silicon wafer.
Next, the first cassette reversing mechanism 40 reverses the full cassette to the second cassette reversing mechanism 50 located on the first side of the wafer receiving station a. The second magazine reversing mechanism 50 then reverses the full magazine onto the conveyor belt of the accept conveyor 20.
The accept feed mechanism 20 then feeds the full magazine onto the third magazine reversing mechanism 60 at the accept station C.
After all the silicon wafers in the full magazine are removed, the third magazine reversing mechanism 60 reverses and conveys the empty magazine to the fourth magazine reversing mechanism 70 at the reflow station D. The fourth cartridge reversing device 70 then reverses the empty cartridge onto the return conveyor 30.
The reflow conveyor 30 then conveys the empty cassettes to a fifth cassette reversing mechanism 80 located on the second side of wafer receiving station a or on the second side of wafer receiving station B. The empty material box specifically selects to reflux to the silicon wafer collecting station A or to flow to the silicon wafer collecting station B, and is determined by judging which silicon wafer collecting station is in an empty state currently (i.e. no material box exists currently). Of course, if the silicon wafer collecting station A and the silicon wafer collecting station B are both in the empty state, any one of the stations can be selected.
Finally, the fifth magazine reversing mechanism 80 reverses the empty magazine to the first magazine reversing mechanism 40 at the corresponding silicon wafer receiving station a or B, and starts a new round of wafer receiving.
The complete cyclic material receiving process is shown by a dotted arrow in the figure by taking the silicon wafer receiving station B as a starting point, and the detailed description is omitted.
Alternatively, the second cartridge reversing mechanism 50 and the fifth cartridge reversing mechanism 80 have the same structure. As shown in fig. 6, taking the second magazine reversing mechanism 50 as an example, it includes a first bottom plate 51, a first lifting mechanism 52, a first lifting plate 53, a first conveyor belt mounting bracket 54, and a first conveyor belt 55, wherein: the first lifting mechanism 52 is disposed on the first bottom plate 51, the first lifting plate 53 is connected to a driving end of the first lifting mechanism 52, the first lifting mechanism 52 drives the first lifting plate 53 to lift, the first conveyor belt mounting frame 54 is disposed on the first lifting plate 53, and the first conveyor belt 55 is mounted on the first conveyor belt mounting frame 54.
In connection with fig. 1 and 6, the reversing procedure of the second cartridge reversing mechanism 50 is as follows:
The second magazine reversing mechanism 50 is arranged between the two conveyor belts of the accept conveyor mechanism 20 such that the conveying direction of the first conveyor belt 55 of the second magazine reversing mechanism 50 is perpendicular to the conveying direction of the conveyor belt of the accept conveyor mechanism 20.
The first lifting mechanism 52 drives the first lifting plate 53 to rise to a high position, and at this time, the first conveyor belt 55 and the conveying bearing surface of the first magazine reversing mechanism 40 are at the same height. The first cartridge diverting mechanism 40 delivers full cartridges onto the first conveyor belt 55 of the second cartridge diverting mechanism 50.
The first conveyor belt 55 moves the full magazine until the full magazine reaches above the conveyor belt of the accept conveyor mechanism 20.
Then, the first lifting mechanism 52 drives the first lifting plate 53 to lower to the low position, and the full magazine carried on the first conveyor belt 55 falls onto the two conveyor belts of the receiving conveyor mechanism 20. To this end, the second cartridge reversing mechanism 50 completes the reversing of the full cartridge.
The reversing process of the fifth cartridge reversing device 80 is substantially:
The fifth cartridge reversing device 80 is disposed between the two conveyor belts of the return conveyor 30, and the conveying direction of the first conveyor belt of the fifth cartridge reversing device 80 is made perpendicular to the conveying direction of the conveyor belt of the return conveyor 30.
In the initial state, the first lifting plate of the fifth magazine reversing mechanism 80 is in the low position, and at this time, the first conveyor belt of the fifth magazine reversing mechanism 80 is located below the two conveyor belts of the return conveying mechanism 30.
When the empty magazine reaches the upper side of the fifth magazine reversing mechanism 80, the first lifting plate of the fifth magazine reversing mechanism 80 is lifted to the high position, and the empty magazine on the return conveying mechanism 30 is lifted onto the first conveying belt of the fifth magazine reversing mechanism 80. Finally, the first conveyor belt of the fifth cartridge changing over mechanism 80 conveys empty cartridges onto the first cartridge changing over mechanism 40.
Alternatively, the third cartridge reversing device 60 and the fourth cartridge reversing device 70 are configured identically. Taking the third magazine reversing mechanism 60 as an example, as shown in fig. 7, it includes a second bottom plate 61, a second lifting mechanism 62, a second lifting plate 63, a second conveyor belt mounting frame 64, a second conveyor belt 65, a third conveyor belt mounting frame 66 and a third conveyor belt 67, wherein: the second lifting mechanism 62 is disposed on the second bottom plate 61, the second lifting plate 63 is connected to a driving end of the second lifting mechanism 62, the second lifting mechanism 62 drives the second lifting plate 63 to lift, the second conveyor belt mounting frame 64 is disposed on the second lifting plate 63, the second conveyor belt 65 is mounted on the second conveyor belt mounting frame 64, and the second conveyor belt 64 is conveyed in the first horizontal direction. The third conveyor belt mounting frame 66 is provided on the second bottom plate 61, and the third conveyor belt 67 is mounted on the third conveyor belt mounting frame 66, and the third conveyor belt 67 is conveyed in a second horizontal direction perpendicular to the first horizontal direction. When the second lifting mechanism 62 drives the second lifting plate 63 to rise to the high position, the conveying bearing surface of the second conveying belt 65 is higher than the conveying bearing surface of the third conveying belt 67, and when the second lifting mechanism 62 drives the second lifting plate 63 to fall to the low position, the conveying bearing surface of the second conveying belt 65 is lower than the conveying bearing surface of the third conveying belt 67.
Referring to fig. 1, the reversing process of the third cartridge reversing device 60 and the fourth cartridge reversing device 70 is as follows:
The third cartridge divert facility 60 is positioned at the receiving station C such that the second conveyor belt 65 of the third cartridge divert facility 60 interfaces with the receiving conveyor 20.
The fourth cartridge reversing device 70 is positioned at the reflow station D such that the second conveyor 65 of the fourth cartridge reversing device 70 interfaces with the reflow conveyor 30.
The third conveyor belt 67 of the third cartridge diverting mechanism 60 interfaces with the third conveyor belt 67 of the fourth cartridge diverting mechanism 70. Of course, in order to ensure that the second conveyor belt 65 of the third cartridge reversing mechanism 60 and the fourth cartridge reversing mechanism 70 can be sufficiently brought close, it is necessary to adaptively set the lengths of the second conveyor belt 10 of the third cartridge reversing mechanism 60 and the fourth cartridge reversing mechanism 70 according to the distance between the collecting conveyor mechanism 20 and the return conveyor mechanism 30. Of course, it is also conceivable to additionally provide a transition conveyor between the third cartridge changing mechanism 60 and the fourth cartridge changing mechanism 70.
After the third cartridge reversing mechanism 60 and the fourth cartridge reversing mechanism 70 are arranged, the reversing and conveying of the cartridges can be realized, which is specifically as follows:
First, the second lifting plate 63 of the third cartridge reversing mechanism 60 is lifted to a high position so that the second conveying belt 65 of the third cartridge reversing mechanism 60 is at the same height as the conveying belt of the collecting conveying mechanism 20.
The full magazine is transported by the receiving transport mechanism 20 toward the third magazine reversing mechanism 60 until the full magazine transitions onto the second conveyor belt 65 of the third magazine reversing mechanism 60.
After the silicon wafer is carried empty, the second lifting plate 63 of the third magazine reversing mechanism 60 is lowered to a low position, and the empty magazine carried on the second conveyor belt 65 of the third magazine reversing mechanism 60 falls onto the third conveyor belt 67 of the third magazine reversing mechanism 60. At the same time, the second lifting plate 63 of the fourth cartridge reversing mechanism 70 is lowered to the low position.
The third conveyor belt 67 of the third cartridge diverting mechanism 60 is conveyed toward the fourth cartridge diverting mechanism 70 until an empty cartridge transitions from the third conveyor belt 67 of the third cartridge diverting mechanism 60 to the third conveyor belt 67 of the fourth cartridge diverting mechanism 70.
The second lifting plate 63 of the fourth cartridge reversing mechanism 70 is lifted to a high position, so that the second conveying belt 65 of the fourth cartridge reversing mechanism 70 is driven to lift the empty cartridge upwards, and the empty cartridge is separated from the third conveying belt 67 of the fourth cartridge reversing mechanism 70 and is carried on the second conveying belt 65 of the fourth cartridge reversing mechanism 70.
The second conveyor belt 65 of the fourth magazine reversing mechanism 70 is conveyed toward the return conveyor mechanism 30 until the empty magazine thereon transitions to the return conveyor mechanism 30.
To this end, the magazine is reversed and conveyed from the accept conveyor 20 to the return conveyor 30.
Optionally, the silicon wafer circulating material receiving system of the invention further comprises a full material box buffer conveying mechanism arranged below the material receiving conveying mechanism 20, wherein the full material box buffer conveying mechanism is used for buffering the full material box on the material receiving conveying mechanism 20. Thus, when the full material box is retained at the material receiving station C and is not carried out, the full material box can be buffered in the full material box buffering and conveying mechanism, so that the influence on the material receiving continuity due to the full loading of the material receiving and conveying mechanism 20 is avoided.
Alternatively, when a full cartridge on the receiving conveyor 20 is not timely supplied to the third cartridge reversing mechanism 60, the third cartridge reversing mechanism 60 retrieves a full cartridge from the full cartridge buffer conveyor.
Similarly, as shown in fig. 5, an empty magazine buffer transport mechanism 31 is also provided below the return transport mechanism 30. The empty magazine buffer transport mechanism 31 is used for buffering empty magazines on the reflow transport mechanism 30. Thus, when the supply of empty cartridges on the buffer return conveying mechanism 30 is greater than the demand, the empty cartridges are buffered to the empty cartridge buffer conveying mechanism 31, thereby avoiding the full loading of the return conveying mechanism 30.
Optionally, the fourth cartridge reversing mechanism 70 is further configured to reverse the empty cartridge on the empty cartridge cache transport mechanism 31 to the reflow transport mechanism 30. That is, when empty cartridge shortage occurs on the empty cartridge buffer transport mechanism 31, the fourth cartridge reversing mechanism 70 descends to the end of the empty cartridge buffer transport mechanism 31, and when the empty cartridge buffer transport mechanism 31 transports an empty cartridge onto the fourth cartridge reversing mechanism 70, the fourth cartridge reversing mechanism 70 ascends to reset, and then the empty cartridge is reversed onto the return transport mechanism 30.
The application has been described above in sufficient detail with a certain degree of particularity. It will be appreciated by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes that come within the true spirit and scope of the application are desired to be protected. The scope of the application is indicated by the appended claims rather than by the foregoing description of the embodiments. Moreover, the embodiments mentioned in the present application are not only implemented individually, but some embodiments can also be implemented in combination.
Claims (9)
1. The silicon wafer circulating and receiving system is characterized by comprising a silicon wafer conveying mechanism, a receiving and conveying mechanism and a reflux conveying mechanism, wherein:
a plurality of silicon wafer collecting stations are arranged on a conveying path of the silicon wafer conveying mechanism, and the silicon wafer conveying mechanism is configured to convey silicon wafers into a material box positioned at the silicon wafer collecting stations;
the receiving and conveying mechanism is positioned at the first side of the silicon wafer conveying mechanism, a full material box full of silicon wafers is reversed from the silicon wafer receiving station to the receiving and conveying mechanism, and the receiving and conveying mechanism is configured to convey the full material box to the receiving station positioned at the discharge end of the receiving and conveying mechanism;
The reflow conveying mechanism is positioned on the second side of the silicon wafer conveying mechanism, the empty material box which is carried out at the material receiving station is reversed to a reflow station positioned at the feeding end of the reflow conveying mechanism, and the reflow conveying mechanism is configured to convey the empty material box positioned at the reflow station towards the silicon wafer receiving station so that the empty material box flows back to the silicon wafer receiving station;
the silicon wafer circulating receiving system further comprises a first material box reversing mechanism, a second material box reversing mechanism, a third material box reversing mechanism, a fourth material box reversing mechanism and a fifth material box reversing mechanism, wherein:
The first material box reversing mechanism is arranged at the silicon wafer collecting station, the second material box reversing mechanism is arranged on a conveying path of the collecting conveying mechanism, the third material box reversing mechanism is arranged at the collecting station, the fourth material box reversing mechanism is arranged at the reflow station, and the fifth material box reversing mechanism is arranged on the conveying path of the reflow conveying mechanism;
The first material box reversing mechanism is configured to bear and jack the material box at the silicon wafer collecting station so as to collect the silicon wafers by the material box, and the first material box reversing mechanism is also configured to reverse the full material box which is fully collected with the silicon wafers to the second material box reversing mechanism;
The second magazine reversing mechanism is configured to reverse the full magazine onto the receiving and conveying mechanism;
The third material box reversing mechanism is configured to reverse the empty material box which is carried at the material receiving station to the fourth material box reversing mechanism;
the fourth cartridge reversing mechanism is configured to reverse the empty cartridge onto the return transport mechanism;
The fifth cartridge reversing mechanism is configured to reverse the empty cartridge on the return transport mechanism onto the first cartridge reversing mechanism.
2. The silicon wafer recycling and receiving system according to claim 1, wherein the silicon wafer conveying mechanism comprises a plurality of conveying units, the conveying units comprise a first conveying belt and a second conveying belt, a gap is reserved between the first conveying belt and the second conveying belt, the silicon wafer receiving station is located below the gap, and the first conveying belt is configured to be capable of overturning downwards towards the silicon wafer receiving station;
when the first conveyor belt turns downwards, the silicon wafers loaded on the first conveyor belt slide from the first conveyor belt to a material box positioned at the silicon wafer collecting station.
3. The wafer recycling delivery system of claim 2 wherein said second conveyor belt is configured to be capable of being flipped up away from said wafer delivery station;
When the first conveying belt turns downwards towards the silicon wafer collecting station, the second conveying belt turns upwards away from the silicon wafer collecting station.
4. The silicon wafer recycling bin receiving system of claim 1, further comprising a full bin buffer conveyor mechanism disposed below the bin receiving conveyor mechanism, the full bin buffer conveyor mechanism for buffering full bins on the bin receiving conveyor mechanism.
5. The silicon wafer recycling and receiving system according to claim 1, further comprising an empty magazine buffer and conveying mechanism arranged below the reflow conveying mechanism, wherein the empty magazine buffer and conveying mechanism is used for buffering empty magazines on the reflow conveying mechanism.
6. The wafer recycling system of claim 5 wherein said fourth cassette reversing mechanism is further configured to reverse an empty cassette on said empty cassette buffer transport mechanism onto said return transport mechanism.
7. The silicon wafer recycling and receiving system according to claim 1, wherein the second magazine reversing mechanism and the fifth magazine reversing mechanism comprise a first bottom plate, a first lifting mechanism, a first lifting plate, a first conveyor belt mounting frame and a first conveyor belt, wherein:
The first lifting mechanism is arranged on the first bottom plate, the first lifting plate is connected to the driving end of the first lifting mechanism, the first lifting mechanism drives the first lifting plate to lift, the first conveyer belt mounting frame is arranged on the first lifting plate, and the first conveyer belt is mounted on the first conveyer belt mounting frame.
8. The silicon wafer recycling and receiving system according to claim 1, wherein the third magazine reversing mechanism and the fourth magazine reversing mechanism comprise a second bottom plate, a second lifting mechanism, a second lifting plate, a second conveyor belt mounting frame, a second conveyor belt, a third conveyor belt mounting frame and a third conveyor belt, wherein:
The second lifting mechanism is arranged on the second bottom plate, the second lifting plate is connected to the driving end of the second lifting mechanism, the second lifting mechanism drives the second lifting plate to lift, the second conveyor belt mounting frame is arranged on the second lifting plate, the second conveyor belt is mounted on the second conveyor belt mounting frame, and the second conveyor belt is conveyed along the first horizontal direction;
The third conveyor belt installation frame is arranged on the second bottom plate, the third conveyor belt is installed on the third conveyor belt installation frame, and the third conveyor belt is conveyed along a second horizontal direction perpendicular to the first horizontal direction;
When the second lifting mechanism drives the second lifting plate to rise to a high position, the conveying bearing surface of the second conveying belt is higher than the conveying bearing surface of the third conveying belt, and when the second lifting mechanism drives the second lifting plate to descend to a low position, the conveying bearing surface of the second conveying belt is lower than the conveying bearing surface of the third conveying belt.
9. A silicon wafer cyclic material receiving method, characterized in that the silicon wafer cyclic material receiving method is implemented by the silicon wafer cyclic material receiving system according to any one of claims 1 to 8, and the silicon wafer cyclic material receiving method comprises the following steps:
conveying and collecting the silicon wafer into a material box at a silicon wafer collecting station by utilizing a silicon wafer conveying mechanism;
After the material box at the silicon wafer collecting station is fully filled with silicon wafers, the full material box is moved out from the silicon wafer collecting station and is reversed to a material collecting and conveying mechanism, and the full material box is conveyed to the material collecting station by utilizing the material collecting and conveying mechanism;
reversing the empty material box which is positioned at the material receiving station to a reflow station of a reflow conveying mechanism;
And the reflow conveying mechanism conveys and commutates the empty material box at the reflow station to the silicon wafer collecting station.
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| CN212085034U (en) * | 2020-06-10 | 2020-12-04 | 无锡奥特维科技股份有限公司 | Silicon wafer collecting box and silicon wafer grading collecting device |
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