CN113423200A - Method for improving lamination quality of multilayer board - Google Patents
Method for improving lamination quality of multilayer board Download PDFInfo
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- CN113423200A CN113423200A CN202110728183.9A CN202110728183A CN113423200A CN 113423200 A CN113423200 A CN 113423200A CN 202110728183 A CN202110728183 A CN 202110728183A CN 113423200 A CN113423200 A CN 113423200A
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- hot melting
- improving
- multilayer board
- heads
- improved
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- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000003475 lamination Methods 0.000 title claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 129
- 230000008018 melting Effects 0.000 claims abstract description 128
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 36
- 239000010949 copper Substances 0.000 claims abstract description 36
- 239000003292 glue Substances 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000009826 distribution Methods 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 230000004927 fusion Effects 0.000 claims abstract description 8
- 239000012943 hotmelt Substances 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 15
- 238000013461 design Methods 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 230000020169 heat generation Effects 0.000 claims 1
- 230000037303 wrinkles Effects 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012549 training Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
The invention provides a method for improving the lamination quality of a multilayer board, which comprises the following steps: A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads; B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved; C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved. The invention solves the dilemma that the short scrap in the rivet scrap of the PCB enterprise is high, can obviously improve the partial laminated layer and the poor copper wrinkle and saves the quality cost for the enterprise; meanwhile, the laminating quality of the multilayer board is guaranteed on the premise of low cost and high efficiency, the maximum quality improvement is obtained, and the scrapping cost is saved.
Description
Technical Field
The invention belongs to the technical field of PCBs, and particularly relates to a method for improving lamination quality of a multilayer board.
Background
At present, most of electronic products are developed in the direction of miniaturization and high precision, and the requirements of circuit densification, layout centralization and high hierarchy are correspondingly put forward on the used PCB. Meanwhile, in order to improve the competitiveness of manufacturing enterprises, the multi-layer board is more and more large in makeup. In the prior art of pre-stacking the multilayer PCB, the problem of rivet scrap falling exists in rivet riveting, and attempts in the industry are made to improve the problems by improving rivet materials, increasing dust collection of a riveting machine, increasing cleaning frequency and other countermeasures, but the effect is very little, and the labor and the people are hurt.
If a pure electric hot melting machine is used for producing a high-layer plate, the bonding force of an inner layer is poor under the condition that an outer layer is burnt, if rivets are not added for reinforcement, the requirements on production and quality cannot be met completely, and loose melting points or deviation of a laminated layer easily occurs due to the influence of a heat transfer mode of the high-layer plate and the conventional design that only long sides are fused; the problem of low bonding force between hot melt layers can be well solved by using a conventional electromagnetic hot melting machine due to a specific heating mode, but the short edge of the electromagnetic hot melting machine needs to be reinforced by using a rivet, otherwise, the poor pressing sliding plate cannot be maintained in a controllable range. There is a strong need in the art for a highly reliable apparatus and method to address this problem. The purposes of high level, large size, high efficiency and high yield are achieved.
Disclosure of Invention
In view of the above, the present invention provides a method for improving lamination quality of a multi-layer board.
The technical scheme of the invention is as follows:
a method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 80-100 mm.
Further, the maximum distance of left and right adjustment is 40-60 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 0.5-10 mm.
The method for improving the lamination quality of the multilayer board mainly comprises three large blocks, namely hot-melting head four-side design, heating copper block design and PP drilling anti-flowing glue hole design, and can obviously improve the lamination quality of the multilayer board by adopting the method provided by the invention, and comprises the following steps:
1. after application, the partial defect of the laminated layer is obviously reduced. The partial defective rate of the laminated layer is reduced to be within 0.3 percent from the original 0.54 percent after lamination.
2. After the application, the influence of the internal shortness of the rivet scraps on the internal shortness of the whole body is obviously improved. The short defect in the finished product yield is reduced to be within 0.20% from the original 0.38%.
3. After application, the poor copper wrinkle after pressing is obviously reduced. The copper wrinkle defective rate after pressing is reduced to be within 0.10 percent from the original 0.18 percent.
The method for improving the lamination quality of the multilayer board is obtained through a large number of creative tests, and the purposes of being simple, convenient and safe to operate and improving the lamination quality of the multilayer board are achieved. Practical application verifies that the production method for improving the lamination quality of the multilayer board is introduced, and measures such as design optimization of edge patterns of the core board of the inner layer of the PCB and the like are adopted, so that the defect of short rivet bits in the multilayer board is basically eliminated, and the risks of deflection of the lamination layer and copper wrinkle of the rivet position are reduced.
The method has low operation difficulty and easy process control. The operator can master after one to two times of training exercises, and the training device is suitable for popularization and application.
The invention has the beneficial effects that:
1. by applying the production method for improving the lamination quality of the multilayer board, the dilemma that short scrap in rivet scraps of PCB enterprises is high is solved.
2. By applying the production method for improving the lamination quality of the multilayer board, the defects of uneven layers and poor copper wrinkles after lamination can be obviously improved, and the quality cost of enterprises is saved.
3. The laminating quality of the multilayer board is guaranteed on the premise of low cost and high efficiency, the maximum quality improvement is obtained, and the scrapping cost is saved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 90 mm.
Further, the maximum distance of the left-right adjustment is 50 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 4 mm.
Example 2
A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 80 mm.
Further, the maximum distance of the left-right adjustment is 40 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 1 mm.
Example 3
A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 100 mm.
Further, the maximum distance of the left-right adjustment is 60 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 8 mm.
Example 4
A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 85 mm.
Further, the maximum distance of the left-right adjustment is 45 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 2 mm.
Example 5
A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
Further, the distribution mode of the hot melting heads is as follows: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
Further, the maximum distance of the back and forth movement is 95 mm.
Further, the maximum distance of the left-right adjustment is 55 mm.
Further, the distribution mode of the hot melting heads is as follows: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads. All there is the hot melt head to consolidate on four sides when guaranteeing PCB board hot melt, and the fastness of whole hot melt obtains great promotion. Meanwhile, the hot melting head is provided with a buffer spring, so that the problem of glue overflow at a melting point can be reduced.
Further, the method for improving the heating efficiency of the single hot melting head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
Further, if a thick copper plate of 2OZ or more is pressed, the copper is correspondingly drawn into a grid shape. So as to ensure that the heating value is not too large to cause plate burning.
Further, the solution of the melting point flash is as follows: and (3) PP drilling, namely, adding 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a standby riveting positioning hole so as to reduce the glue overflowing amount of the plate edge during hot melting.
Furthermore, resin is filled in the glue filling holes, so that the bonding force of the melting point can be improved to a certain degree.
Further, the aperture of the PP drilling hole is 6 mm.
By combining the actual production conditions of enterprises, the production method for improving the lamination quality of the multilayer board can achieve the following economic indexes:
by applying the production method for improving the lamination quality of the multilayer board, the layer partial defect rate is reduced to be within 0.3% from the original 0.54%, the copper wrinkle defect rate is reduced to be within 0.10% from the original 0.18%, and the internal short defect rate is reduced to be within 0.20% from the original 0.38%;
the method can reduce the discard of the layer deviation of 20 square meters per month, reduce the discard of copper wrinkles of 10 square meters per month, reduce the discard of the internal short square meters per month, and calculate according to 800RMB per square meter, and can save the quality discard cost of 56000RMB per month.
By applying the production method for improving the lamination quality of the multilayer board, the use amount of rivets can be saved by 200000 rivets per month. Calculated according to 0.05 RMB/particle, the material cost can be reduced by 10000 RMB/month every month.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A method for improving the lamination quality of a multilayer board is characterized by comprising the following steps:
A. the bonding force of the whole PCB after fusion is improved by controlling the distribution of the hot melting heads;
B. the heating efficiency of a single hot melting head is improved, and the production efficiency and the binding force are improved;
C. the problem of melting point glue overflow caused by too small plate edges when a plurality of pieces of PP are fused is solved.
2. The method for improving the lamination quality of a multilayer board according to claim 1, wherein the thermal melting heads are distributed in a manner that: the left and right sides and the middle hot melting heads are fixed, 2 hot melting heads on the sides can move back and forth, and the positions of the two groups of hot melting heads on the front and the rear sides can be adjusted left and right.
3. The method of improving the lamination quality of a multilayer board according to claim 2, wherein the maximum distance of the back and forth movement is 80-100 mm.
4. The method of improving the lamination quality of a multilayer board according to claim 3, wherein the maximum distance of the left-right adjustment is 40-60 mm.
5. The method for improving the lamination quality of a multilayer board according to claim 4, wherein the thermal melting heads are distributed in a manner that: the short sides are distributed with 8, the long sides are distributed with 4, and the total number is 12 hot melting heads.
6. The method for improving the lamination quality of the multilayer board as claimed in claim 1, wherein the method for improving the heat generation efficiency of the single hot melt head comprises the following steps: the hot melting point position of the inner layer plate edge is designed into a heating copper sheet, and the design width of the copper sheet is 5mm x 20 mm.
7. The method of claim 6, wherein if the laminate is a thick copper plate of 2OZ or more, the copper is correspondingly formed into a grid.
8. The method for improving the lamination quality of the multilayer board according to claim 1, wherein the solution of the melting point flash is as follows: and (3) PP drilling, namely, additionally arranging 2 glue filling holes below each hot melting block except for a necessary hot melting positioning hole and a spare riveting positioning hole.
9. The method of claim 8, wherein the glue filling holes are filled with resin.
10. The method of claim 8, wherein the hole diameter of the PP drilling is 0.5-10 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110728183.9A CN113423200A (en) | 2021-06-29 | 2021-06-29 | Method for improving lamination quality of multilayer board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110728183.9A CN113423200A (en) | 2021-06-29 | 2021-06-29 | Method for improving lamination quality of multilayer board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128275A (en) * | 2004-10-27 | 2006-05-18 | Hitachi Chem Co Ltd | Method for manufacturing multilayer board |
| CN207224616U (en) * | 2017-09-30 | 2018-04-13 | 定颖电子（昆山）有限公司 | A kind of gauge of the levelness for the hot melt head for being used to detect fuse machine |
| CN109587975A (en) * | 2018-11-23 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A method of improving pressing fusion bit stream glue |
| CN111669903A (en) * | 2020-06-19 | 2020-09-15 | 奥士康精密电路（惠州）有限公司 | Production method of PCB (printed circuit board) ultra-thick dielectric layer |
-
2021
- 2021-06-29 CN CN202110728183.9A patent/CN113423200A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128275A (en) * | 2004-10-27 | 2006-05-18 | Hitachi Chem Co Ltd | Method for manufacturing multilayer board |
| CN207224616U (en) * | 2017-09-30 | 2018-04-13 | 定颖电子（昆山）有限公司 | A kind of gauge of the levelness for the hot melt head for being used to detect fuse machine |
| CN109587975A (en) * | 2018-11-23 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A method of improving pressing fusion bit stream glue |
| CN111669903A (en) * | 2020-06-19 | 2020-09-15 | 奥士康精密电路（惠州）有限公司 | Production method of PCB (printed circuit board) ultra-thick dielectric layer |
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Application publication date: 20210921 |
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