CN113422655A - Optical signal processing module and optical module - Google Patents
Optical signal processing module and optical module Download PDFInfo
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- CN113422655A CN113422655A CN202110695975.0A CN202110695975A CN113422655A CN 113422655 A CN113422655 A CN 113422655A CN 202110695975 A CN202110695975 A CN 202110695975A CN 113422655 A CN113422655 A CN 113422655A
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- signal processing
- module
- optical signal
- optical
- thermoelectric generator
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- 230000003287 optical effect Effects 0.000 title claims abstract description 70
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 11
- 235000011449 Rosa Nutrition 0.000 claims description 4
- 239000013589 supplement Substances 0.000 abstract 1
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/806—Arrangements for feeding power
- H04B10/808—Electrical power feeding of an optical transmission system
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to an optical signal processing assembly and an optical module, wherein the optical signal processing assembly comprises an optical signal processing module, a PCBA board and a thermoelectric generator, and the thermoelectric generator is used for converting heat energy generated by the optical signal processing module into electric energy and outputting the electric energy to the PCBA module so as to provide the electric energy for the PCBA module. The invention also provides an optical module applying the optical signal processing assembly. The optical signal processing assembly provided by the invention can convert the heat energy generated by the optical signal processing module into electric energy by arranging the thermoelectric generator, can supplement the energy for the PCBA, realizes effective utilization of the energy, and is energy-saving and environment-friendly.
Description
Technical Field
The present invention relates to the field of optical communication technologies, and in particular, to an optical signal processing module and an optical module.
Background
The optical module is a device capable of converting an optical signal into an electrical signal and converting the electrical signal into an optical signal, and the main components are a ROSA, a TOSA and a PCBA board, and the ROSA, the TOSA or other high-power-consumption chips all generate heat during operation, especially the heat generated by products with faster transmission rates is larger. In order to guarantee the working stability, a semiconductor cooler (TEC) is designed to dissipate heat as much as possible, so that the performance of an optical module and the service life of components can be guaranteed, but energy waste is also considered from another point of view, and the more the optical module with a high transmission rate is, the more heat energy is wasted.
Disclosure of Invention
The invention aims to provide an optical signal processing assembly and an optical module, which can convert heat generated by the working of the optical module into electric energy, compensate the electric energy required by the working of the optical module, further integrally reduce the electric energy consumption of the optical module, save energy and protect environment.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
in one aspect, an embodiment of the present invention provides an optical signal processing component, which includes an optical signal processing module, a PCBA board, and a thermoelectric generator, where the thermoelectric generator is configured to convert thermal energy generated by the optical signal processing module into electrical energy, and output the electrical energy to the PCBA module, so as to provide the electrical energy to the PCBA module.
In the above scheme, increased thermoelectric generator's setting, utilized thermoelectric generator to carry out the electrical energy with the poor heat energy conversion who produces of light signal processing module to export and carry out the electrical energy compensation for the PCBA module, can reduce the demand of light signal processing subassembly to external electric energy from this, realized the recycle of heat energy, energy-concerving and environment-protective.
In a further optimized scheme, the system further comprises a DC-DC module which is used for converting the voltage of the electric energy output by the thermoelectric generator and then outputting the electric energy to the PCBA module. In the scheme, the DC-DC module is arranged for voltage conversion, so that the requirements of different power utilization parts in the PCBA board can be met.
In a further preferred embodiment, the thermoelectric generator is a sheet-like structure or a film-like structure. In the scheme, the thermoelectric generator is designed into a sheet structure or a film structure, so that the thermoelectric generator is more suitable for the precise and miniaturized product requirement of the optical module, and the product size is not obviously increased.
In a further optimized scheme, the thermoelectric generator is arranged inside the shell of the optical signal processing module. The thermoelectric generator can also be arranged outside the shell of the optical signal processing module, but the thermoelectric generator is arranged inside the shell to absorb the generated heat more timely, so that the heat is prevented from being dissipated through the shell, and more heat energy can be absorbed.
In a further optimized scheme, the transmission rate of the optical signal processing module is 400Gbps or more. The larger the transmission rate, the more power the device has, and the more heat is generated, and especially for products with high-speed transmission, the heat energy needs to be recycled, so that the cost of the recycled heat energy is far greater than that of the thermoelectric generator.
On the other hand, an embodiment of the present invention further provides an optical module, including the optical signal processing component according to any one of the embodiments of the present invention.
Compared with the prior art, the invention has the beneficial effects that: through the setting of thermoelectric generator, utilize thermoelectric generator to carry out the electric energy with the heat energy conversion of the poor heat energy of optical signal processing module difference life to export and carry out the electric energy compensation for PCBA module, can reduce the demand of optical signal processing subassembly to external electric energy from this, realized the recycle of heat energy, energy-concerving and environment-protective.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a block diagram of an optical signal processing module according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of an installation of a TEG in a TOSA according to an embodiment of the invention.
FIG. 3 is another schematic diagram of the TEG installed in a TOSA according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
In the conventional process of the optical module, the TEC is designed to conduct heat generated by a heat source point to the air, however, the inventor finds that, in operation, a local area of the optical module where heat is generated forms a large temperature difference with other areas, and particularly, the faster the transmission rate is, the larger the power consumption of the product is, the larger the formed temperature difference is, and if the heat can be effectively utilized, for example, for compensating for electric energy required by the operation of the optical module, the overall electric energy consumption is reduced. Based on this, the invention proposes different optical module designs.
Referring to fig. 1 to 3, the optical signal processing assembly provided in this embodiment includes an optical signal processing module, a thermoelectric generator, a DC-DC module and a PCBA board, which are connected in sequence, wherein the optical signal processing module is mainly used for converting between optical signals, the optical signal processing module generates a large amount of heat energy during operation, the thermoelectric generator is used for converting the heat energy generated by the optical signal processing module into electric energy, and the DC-DC module is mainly used for performing voltage conversion on the electric energy output by the thermoelectric generator and outputting the electric energy to the PCBA module to provide electric energy for the PCBA module. Of course, it should be understood that the limited electrical power converted from thermal energy herein may not be sufficient to fully enable the PCBA, and therefore may only be a compensation for electrical power, reducing the electrical power drawn by the PCBA from an external power source.
The DC-DC module has a main function of voltage conversion so that the requirements of various electric devices in the PCBA board can be satisfied, and thus the DC-DC module can be used as an optional component.
The optical signal processing module may be a TOSA that converts an electrical signal into an optical signal, a ROSA that converts an optical signal into an electrical signal, or an integrated transceiver module.
Since the optical signal processing module is small in size, the electrical generator is preferably configured in a sheet-like structure or a film-like structure, so that the overall size of the optical module is reduced, and the optical module is prevented from being significantly increased in size due to the arrangement of the thermoelectric generator.
Theoretically, the design of the invention can be applied to various optical module products, such as products with the transmission rate of 40G \100G \400G \800G and above. However, if the cost performance is considered, i.e. the proportional relationship between the cost of the thermoelectric generator and the cost of the saved electric energy is considered, the design of the present invention is preferably applied to high-speed products, such as optical modules with transmission rate of 400Gbps and above. The higher the transmission rate, the higher the power consumption and the more heat generated, and thus the more electrical energy converted, sufficient to offset and outweigh the cost of the thermoelectric generator over long term use.
As shown in fig. 2 and fig. 3, as two application examples, for the TOSA, in fig. 1, a thermoelectric generator (TEG) is disposed outside a housing of the TOSA, specifically below a base; in fig. 2, the TEG is disposed inside a housing of the TOSA and integrated with a submount (submount), for example, a ceramic-based circuit wiring, and the TEG also employs the ceramic body as the housing. The arrows in the figure indicate the transmission direction of energy, and the electric energy obtained by TEG conversion is transmitted to a DC-DC module, is subjected to voltage conversion and then is transmitted to a PCBA board.
The design of the invention is that a semiconductor device temperature difference power generation chip (TEG) is used to generate electric energy through heat energy conversion from a main heat source point (such as TOSA) of the high-power-consumption optical module in the working process by using the Seebeck effect principle, and the electric energy is supplied to a power consumption circuit in the PCBA for use, so that the electric energy consumption of the high-power-consumption module in the working process is compensated. Although TEG is a relatively mature technology and has applications in other fields, it does not have such an application in optical modules, and heat dissipation is currently performed by designing TEC. Through the design of the invention, the heat dissipation problem can be solved, and the heat can be reused, thereby saving energy and protecting environment.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.
Claims (7)
1. An optical signal processing assembly comprises an optical signal processing module and a PCBA board, and is characterized by further comprising a thermoelectric generator, wherein the thermoelectric generator is used for converting thermal energy generated by the optical signal processing module into electric energy, outputting the electric energy to the PCBA module, and providing the electric energy for the PCBA module.
2. The optical signal processing module of claim 1, further comprising a DC-DC module for voltage converting the electrical energy output by the thermoelectric generator and outputting the converted electrical energy to the PCBA module.
3. An optical signal processing assembly as claimed in claim 1, wherein the thermoelectric generator is a sheet-like structure or a film-like structure.
4. An optical signal processing assembly as claimed in claim 1, wherein the thermoelectric generator is disposed within the housing of the optical signal processing module.
5. The optical signal processing module of claim 1, wherein the optical signal processing module is a ROSA or TOSA.
6. The optical signal processing module of claim 1, wherein the transmission rate of the optical signal processing module is 400Gbps or more.
7. A light module comprising an optical signal processing assembly according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110695975.0A CN113422655A (en) | 2021-06-23 | 2021-06-23 | Optical signal processing module and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110695975.0A CN113422655A (en) | 2021-06-23 | 2021-06-23 | Optical signal processing module and optical module |
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| Publication Number | Publication Date |
|---|---|
| CN113422655A true CN113422655A (en) | 2021-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110695975.0A Pending CN113422655A (en) | 2021-06-23 | 2021-06-23 | Optical signal processing module and optical module |
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| Country | Link |
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| CN (1) | CN113422655A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770242A (en) * | 2009-01-04 | 2010-07-07 | 瑞鼎科技股份有限公司 | Temperature control device and operating method thereof |
| CN102434817A (en) * | 2010-09-29 | 2012-05-02 | 展晶科技(深圳)有限公司 | Backlight module and LED (light emitting diode) module |
| CN104282687A (en) * | 2013-07-10 | 2015-01-14 | 株式会社半导体能源研究所 | Semiconductor Device, Driver Circuit, and Display Device |
| US20170184802A1 (en) * | 2014-10-28 | 2017-06-29 | Sumitomo Electric Industries, Ltd. | Method of assembling the optical module implementing mach-zehnder modulator |
| CN110391586A (en) * | 2018-04-17 | 2019-10-29 | 住友电工光电子器件创新株式会社 | Emitter assemblies |
-
2021
- 2021-06-23 CN CN202110695975.0A patent/CN113422655A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770242A (en) * | 2009-01-04 | 2010-07-07 | 瑞鼎科技股份有限公司 | Temperature control device and operating method thereof |
| CN102434817A (en) * | 2010-09-29 | 2012-05-02 | 展晶科技(深圳)有限公司 | Backlight module and LED (light emitting diode) module |
| CN104282687A (en) * | 2013-07-10 | 2015-01-14 | 株式会社半导体能源研究所 | Semiconductor Device, Driver Circuit, and Display Device |
| US20170184802A1 (en) * | 2014-10-28 | 2017-06-29 | Sumitomo Electric Industries, Ltd. | Method of assembling the optical module implementing mach-zehnder modulator |
| CN110391586A (en) * | 2018-04-17 | 2019-10-29 | 住友电工光电子器件创新株式会社 | Emitter assemblies |
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Application publication date: 20210921 |
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| RJ01 | Rejection of invention patent application after publication |