CN113410760A - Double-chip TO-CAN package - Google Patents
Double-chip TO-CAN package Download PDFInfo
- Publication number
- CN113410760A CN113410760A CN202110664954.2A CN202110664954A CN113410760A CN 113410760 A CN113410760 A CN 113410760A CN 202110664954 A CN202110664954 A CN 202110664954A CN 113410760 A CN113410760 A CN 113410760A
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- China
- Prior art keywords
- chip
- light
- aln substrate
- super
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 41
- 239000012788 optical film Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000010287 polarization Effects 0.000 claims description 11
- 230000009977 dual effect Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 230000005496 eutectics Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910017083 AlN Inorganic materials 0.000 description 19
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 19
- 239000010409 thin film Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/30—Collimators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Abstract
The invention discloses a double-chip TO-CAN (transistor-area network) package which is applied TO the field of TO-Can packages and aims at solving the problems that the package of a multi-port rear section is complex, the rate of finished products is low and the difficulty in batch manufacturing is increased because only one laser chip CAN be packaged by the TO-Can TO form a single optical path system under the condition that the existing TO space is limited; the light combining system improved by adopting the super-plane optical film lens is applied TO TO-CAN packaging, so that two laser chips CAN be integrally packaged in the same TO, and combined light output is realized.
Description
Technical Field
The invention belongs TO the field of TO-Can packaging, and particularly relates TO a double-chip TO-Can packaging technology.
Background
The traditional TO-Can Can only package one laser chip TO form a single optical path system, but along with the increase of the integration degree of the optical communication industry, the multi-port optical device is more and more applied, but the multi-port Can cause the complexity of back-end packaging, the yield is low, and the difficulty of batch manufacturing is increased.
Disclosure of Invention
In order TO solve the technical problem, the invention provides a dual-chip TO-CAN package, which is used for packaging two chips in a TO and realizing the effect of light combination output.
The technical scheme used only by the invention is as follows: two laser chips are integrally packaged in the same TO, and divergent light emitted by the two laser chips is converged by a light converging system 8 TO be output from one port.
The method specifically comprises the following steps: an inner structure and an outer structure, the inner structure comprising: l type metal support 4, MPD 5(Multiple Plastic Dual, porous way Plastic transmission pipe), first ALN (aluminium nitride) substrate 6, optical chip 7 including two laser chips, optical system 8, second ALN substrate 9 close, the exterior structure includes: a TO base 10, a flat window cap 11;
MPD 5 is attached to a horizontal bracket of the L-shaped metal bracket 4; the second ALN substrate 9 is attached to the vertical support of the L-shaped metal support 4; an optical chip 7 comprising two laser chips is attached to the first ALN substrate 6; the first ALN substrate 6 and the optical chip 7 become COC and then are pasted on the second ALN substrate 9; the light combining system 8 is coupled with the optical chip 7 and then fixed on the second ALN substrate 9;
the internal structure is assembled TO the base 10 of the external structure TO by means of the horizontal support of the L-shaped metal support 4, the flat-window cap 11 being fixed TO the base 10 of the TO by welding.
The optical chip 7 comprising the two laser chips is attached to the first ALN substrate 6 by means of a eutectic machine.
The light combining system 8 is fixed on the second ALN substrate 9 by using UV glue.
The flat window tube cap 11 is resistance welded TO the base 10 of the TO by a capping machine.
The light combining system 8 includes: a super-plane optical thin film lens array 81, two polarization beam splitters 82, and a super-plane optical thin film lens 83; the two laser chips are respectively marked as a light source 1 and a light source 2, divergent light emitted by the light source 1 from the light source 2 is converted into collimated light after passing through a super-plane optical film lens array 81, the collimated light of the light source 1 continues to transmit waves along an optical axis, the polarized direction of the collimated light of the light source 2 rotates by 90 degrees after passing through the super-plane optical film lens array 81, then the collimated light is bent by two polarization splitting prisms 82 and then is superposed with the collimated light path of the light source 1, and the two combined collimated light beams are converged at a focus after passing through a super-plane optical film lens 83.
The invention has the beneficial effects that: according TO the invention, through the design that two laser chips are integrally packaged in the same TO and the light combination output is realized, the problems of complicated rear-section packaging, low yield and large batch manufacturing difficulty of a multi-port optical device of which the conventional TO-Can only Can package one laser chip are effectively solved; the optical device rear-section packaging based on the double-chip TO-CAN packaging is simpler.
Drawings
FIG. 1 is a TO-CAN package structure of the present invention;
wherein, fig. 1(a) is an internal structure diagram, and fig. 1(b) is an external structure diagram;
FIG. 2 is a schematic diagram of the optical path employed in the present invention;
reference numerals: the device comprises a super-plane optical thin film lens array 1, a polarization beam splitter prism 2, a super-plane optical thin film lens 3, an L-shaped metal support 4, an MPD 5, an ALN substrate 6, an optical chip 7, an optical combination system 8, a large ALN substrate 9, a TO base 10, a flat window tube cap 11, a super-plane optical thin film lens array 81, a polarization beam splitter prism 82 and a super-plane optical thin film lens 83.
Detailed Description
In order to facilitate the understanding of the technical contents of the present invention by those skilled in the art, the present invention will be further explained with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a TO-CAN package structure according TO the present invention, which includes: an L-shaped metal support 4, an MPD 5(Multiple Plastic Dual, multi-porous Plastic transmission pipe), a first ALN (aluminum nitride) substrate 6, an optical chip 7, an optical combination system 8, a second ALN substrate 9, a base 10 of TO and a flat window pipe cap 11; MPD 5 pastes on L type metal support 4 through the chip mounter, and second ALN substrate 9 pastes on L type metal support 4 through the silver glue, and two chips 7 paste on first ALN substrate 6 through the eutectic machine, and first ALN substrate 6 becomes COC with optical chip 7 and pastes on second ALN substrate 9 again, use and close optical system 8 and optical chip 7 and carry out the coupling back UV glue and fix on second ALN substrate 9. The whole is assembled on a TO base 10, then electrodes of the laser chip and corresponding pins on the TO base, MPD electrodes and corresponding pins on the TO base are mutually connected through gold wire bonding, and finally the flat window tube cap 11 is electrically welded on the TO base 10 through a cap sealing machine.
In the TO-CAN packaging structure, the optical chips 7 comprising the two laser chips are packaged in the same TO, and divergent light emitted by the two laser chips is converged by the light converging system 8 TO be output from one port.
The light path adopted by the light combination system 8 of the invention is shown in fig. 2, the light chip 7 comprises two divergent light source chips, divergent light emitted by the two divergent light sources passes through the super-plane optical film lens array 81 and then becomes collimated light, wherein the collimated light of the light source 1 continues to be transmitted along the optical axis, the light source 2 passes through the super-plane optical film lens array 81, the polarization direction of the light source 2 rotates by 90 degrees, the light is converted by the polarization beam splitter 82 and then is superposed with the collimated light path of the light source 1, the light combination is completed, and the two combined collimated light beams are converged at the focus after passing through the super-plane optical film lens 83.
It should be noted by those skilled in the art that the above-mentioned super-plane thin film lens is coated for different wavelengths, and the present invention designs the wavelength of the light source 1 to not change the polarization direction after passing through the super-plane thin film lens array, and designs the wavelength of the light source 2 to change the polarization direction by 90 ° after passing through the super-plane thin film lens array.
The super-plane optical thin film lens is realized on a glass substrate or a silicon substrate by a photoetching coating mode.
The super-plane thin film lens array 21 and the super-plane optical thin film lens 23 are mounted by a mounting machine, and the super-plane optical thin film lens 23 and the polarization splitting prism 22 are mounted by the mounting machine. The optical system can complete the operation of the optical system only by carrying out 1-time active power coupling with the two laser chips.
The invention simultaneously packages 2 laser chips in one TO and combines the chips into 1 path of output, thereby solving the problem of high packaging difficulty of a multi-port device and simplifying the rear-section packaging of the optical device.
It will be appreciated by those of ordinary skill in the art that the embodiments described herein are intended to assist the reader in understanding the principles of the invention and are to be construed as being without limitation to such specifically recited embodiments and examples. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. A double-chip TO-CAN package is characterized in that two laser chips are packaged in the same TO in an integrated mode, and divergent light emitted by the two laser chips is converged through a light combining system (8) TO be output from one port.
2. The dual-chip TO-CAN package according TO claim 1, specifically comprising: an inner structure and an outer structure, the inner structure comprising: l type metal support (4), MPD (5), first ALN substrate (6), optical chip (7) including two laser chip, close optical system (8), second ALN substrate (9), the exterior structure includes: a TO base (10) and a flat window pipe cap (11);
MPD (5) is attached to a horizontal bracket of the L-shaped metal bracket (4); a second ALN substrate (9) is attached to a vertical support of the L-shaped metal support (4); an optical chip (7) comprising two laser chips is attached to the first ALN substrate (6); the first ALN substrate (6) and the optical chip (7) become COC and then are pasted on the second ALN substrate (9); the light combining system (8) is coupled with the light chip (7) and then fixed on the second ALN substrate (9);
the internal structure is assembled on a base (10) of the external structure TO through a horizontal bracket of an L-shaped metal bracket (4), and a flat window tube cap (11) is fixed on the base (10) of the TO through welding.
3. A dual chip TO-CAN package according TO claim 2, wherein the optical chip (7) comprising two laser chips is mounted on the first ALN substrate (6) by means of a eutectic machine.
4. A dual chip TO-CAN package according TO claim 2, wherein the light combining system (8) is fixed on the second ALN substrate (9) with UV glue.
5. A dual chip TO-CAN package according TO claim 2, wherein the flat window cap (11) is resistance welded TO the TO base (10) by a capping machine.
6. A dual-chip TO-CAN package according TO claim 2, wherein the light combining system (8) comprises: a super-plane optical film lens array (81), two polarization beam splitting prisms (82) and a super-plane optical film lens (83); the two laser chips are respectively marked as a light source 1 and a light source 2, divergent light emitted by the light source 1 from the light source 2 becomes collimated light after passing through a super-plane optical film lens array (81), the collimated light of the light source 1 continues to transmit waves along an optical axis, the polarized direction of the collimated light of the light source 2 rotates by 90 degrees after passing through the super-plane optical film lens array (81), then the collimated light is turned by two polarization beam splitting prisms (82) and then is superposed with the collimated light path of the light source 1, and the two combined collimated light beams are converged at a focus after passing through a super-plane optical film lens (83).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110664954.2A CN113410760A (en) | 2021-06-16 | 2021-06-16 | Double-chip TO-CAN package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110664954.2A CN113410760A (en) | 2021-06-16 | 2021-06-16 | Double-chip TO-CAN package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113410760A true CN113410760A (en) | 2021-09-17 |
Family
ID=77684257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110664954.2A Pending CN113410760A (en) | 2021-06-16 | 2021-06-16 | Double-chip TO-CAN package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113410760A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1273415A (en) * | 1999-04-19 | 2000-11-15 | 三星电子株式会社 | Luminous module and compatible optical reading device using the luminous module |
| CN1662835A (en) * | 2002-05-30 | 2005-08-31 | 纳诺普托公司 | Optical polarization beam combiner/splitter |
| US20090279578A1 (en) * | 2008-05-08 | 2009-11-12 | Jin-Shan Pan | Dual wavelength laser device for optical communication |
| CN201466466U (en) * | 2009-08-17 | 2010-05-12 | 长春师凯科技产业有限责任公司 | Laser polarization beam-combination conduction cooling optical fiber coupling module of high-power semiconductor |
| US20130208332A1 (en) * | 2011-08-31 | 2013-08-15 | President And Fellows Of Harvard College | Amplitude, Phase and Polarization Plate for Photonics |
| CN104201557A (en) * | 2014-08-28 | 2014-12-10 | 青岛海信宽带多媒体技术有限公司 | Packaging structure of adjustable laser device and packaging method therefor |
| CN104716561A (en) * | 2013-12-12 | 2015-06-17 | 青岛海信宽带多媒体技术有限公司 | Laser |
| US20170031118A1 (en) * | 2015-07-31 | 2017-02-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optoelectronic components housed in a to-can package |
| US20170125972A1 (en) * | 2015-11-04 | 2017-05-04 | Electronics And Telecommunications Research Institute | Multi-channel optical module and manufacture method thereof |
| CN110718848A (en) * | 2019-09-18 | 2020-01-21 | 深圳市星汉激光科技有限公司 | Semiconductor laser device |
| CN210142189U (en) * | 2019-05-28 | 2020-03-13 | 杭州晟创激光科技有限公司 | Dual-wavelength laser radar light source |
| CN111162455A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | Laser diode packaging structure and electronic equipment |
| CN111466036A (en) * | 2017-10-17 | 2020-07-28 | 亮锐有限责任公司 | Nanostructured metamaterials and metamaterials to collimate light emission from L ED |
| CN112202046A (en) * | 2020-08-28 | 2021-01-08 | 武汉联特科技有限公司 | Novel TO packaging structure |
-
2021
- 2021-06-16 CN CN202110664954.2A patent/CN113410760A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1273415A (en) * | 1999-04-19 | 2000-11-15 | 三星电子株式会社 | Luminous module and compatible optical reading device using the luminous module |
| CN1662835A (en) * | 2002-05-30 | 2005-08-31 | 纳诺普托公司 | Optical polarization beam combiner/splitter |
| US20090279578A1 (en) * | 2008-05-08 | 2009-11-12 | Jin-Shan Pan | Dual wavelength laser device for optical communication |
| CN201466466U (en) * | 2009-08-17 | 2010-05-12 | 长春师凯科技产业有限责任公司 | Laser polarization beam-combination conduction cooling optical fiber coupling module of high-power semiconductor |
| US20130208332A1 (en) * | 2011-08-31 | 2013-08-15 | President And Fellows Of Harvard College | Amplitude, Phase and Polarization Plate for Photonics |
| CN104716561A (en) * | 2013-12-12 | 2015-06-17 | 青岛海信宽带多媒体技术有限公司 | Laser |
| CN104201557A (en) * | 2014-08-28 | 2014-12-10 | 青岛海信宽带多媒体技术有限公司 | Packaging structure of adjustable laser device and packaging method therefor |
| US20170031118A1 (en) * | 2015-07-31 | 2017-02-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optoelectronic components housed in a to-can package |
| US20170125972A1 (en) * | 2015-11-04 | 2017-05-04 | Electronics And Telecommunications Research Institute | Multi-channel optical module and manufacture method thereof |
| CN111466036A (en) * | 2017-10-17 | 2020-07-28 | 亮锐有限责任公司 | Nanostructured metamaterials and metamaterials to collimate light emission from L ED |
| CN210142189U (en) * | 2019-05-28 | 2020-03-13 | 杭州晟创激光科技有限公司 | Dual-wavelength laser radar light source |
| CN110718848A (en) * | 2019-09-18 | 2020-01-21 | 深圳市星汉激光科技有限公司 | Semiconductor laser device |
| CN111162455A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | Laser diode packaging structure and electronic equipment |
| CN112202046A (en) * | 2020-08-28 | 2021-01-08 | 武汉联特科技有限公司 | Novel TO packaging structure |
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Application publication date: 20210917 |
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