CN113405718A - Ultrasonic probe for online measurement of high-temperature bolt axial force - Google Patents
Ultrasonic probe for online measurement of high-temperature bolt axial force Download PDFInfo
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- CN113405718A CN113405718A CN202110549336.3A CN202110549336A CN113405718A CN 113405718 A CN113405718 A CN 113405718A CN 202110549336 A CN202110549336 A CN 202110549336A CN 113405718 A CN113405718 A CN 113405718A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/24—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for determining value of torque or twisting moment for tightening a nut or other member which is similarly stressed
- G01L5/246—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for determining value of torque or twisting moment for tightening a nut or other member which is similarly stressed using acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Abstract
The invention relates to an integrated and split type ultrasonic probe for measuring axial force of a high-temperature bolt. The integrated ultrasonic probe for measuring the axial force of the high-temperature bolt can respectively excite and receive SH0 waves and A0 waves; the split ultrasonic probe for measuring the axial force of the high-temperature bolt comprises an SH0 probe capable of exciting and receiving SH0 waves and an A0 probe capable of exciting and receiving A0 waves, and the two probes need to be matched for use. Based on the characteristics that the acoustic wave energy is concentrated in the center of the bolt when SH0 waves and A0 waves are transmitted, and the wave speed changes of SH0 waves and A0 waves are different when the axial force of the bolt changes, the waveguide rod is introduced to serve as a transmission medium between the high-temperature bolt and the ultrasonic transducer which is easily affected by temperature, so that the ultrasonic transducer can be ensured to stably work in a comfortable environment for a long time, and the purpose of measuring the axial force of the bolt in the high-temperature environment is achieved.
Description
Technical Field
The invention relates to an ultrasonic probe for online measurement of axial force of a high-temperature bolt, in particular to an integrated ultrasonic probe and a split ultrasonic probe for online measurement of axial force of a high-temperature bolt. Belongs to the field of ultrasonic nondestructive detection.
Background
Pressure-bearing special equipment such as pressure vessels, pipelines and the like are widely applied to the field of national economic pillars such as petrifaction, electric power, metallurgy and the like, and most of the equipment works in severe environments such as high temperature and high pressure. In recent years, with the increasing demand of carbon reduction and efficiency improvement, pressure-bearing equipment develops towards the extreme directions of high parameter, heavy duty, long service life and the like, bolts are key elements for assembling the pressure-bearing equipment, and leakage caused by the change of the axial force of the bolts is the largest potential safety hazard in the industry. The pretightening force applied to the bolt has great influence on the service condition, the performance and the service life of the bolt. The pretightening force is too small, so that the connection is unreliable, and phenomena of vibration relaxation, structural slippage and the like are generated during working; the load of the bolt can be increased when the pretightening force is too large, so that the bolt is easy to break, the bearing capacity of the node is weakened, and structural instability can be induced when the pretightening force is serious; bolt looseness caused by alternating load is difficult to detect, and finally huge damage and loss are caused. Therefore, monitoring the bolt axial force in real time is important to ensure the stability and reliability of the bolt assembly structure.
The commonly used method for measuring the axial force of the bolt comprises a torque pulling method, a strain gauge pasting method, a stress washer method, a strain gauge implanting method, a fiber grating implanting method, an ultrasonic measuring technology and the like. In engineering, constructors often control bolt axial force in a connection structure using a torque wrench method, and a manual torque wrench or a pneumatic, hydraulic or electric wrench is often used to indirectly control bolt preload by tightening torque. The method is simple to operate and low in cost, but the measurement accuracy of the axial force of the bolt is not high; the method of sticking strain gauges is a bolt axial force measuring method commonly used in engineering, and calculates the stress on the surface of a measured bolt by measuring the strain on the surface of the bolt, so as to realize the detection of the bolt axial force. However, the strain gauge can generate stress relaxation phenomenon at high temperature, and cannot meet the requirement of long-term monitoring; the stress washer method is to make the pressure sensor into the shape of a washer, mount the pressure sensor under the bolt head like a common washer, and monitor the axial force of the bolt. However, the mode changes the original installation standard of the connecting piece and cannot be used in large quantity; the strain gauge implanting method is similar to the fiber grating implanting method, a small hole needs to be machined in the top end of the bolt along the axial direction, a strain gauge (or a fiber grating strain sensor) is embedded in the small hole, the strain gauge (or the fiber grating strain sensor) senses the deformation of the bolt inside the bolt, and then the axial force of the bolt is measured in real time. This type of method changes the strength of the bolt and the sealing of the high temperature and pressure type of device does not allow this operation.
In order to find a bolt axial force measuring method without any change to the bolt, US2012222485a1 and EP1776571a1 patents issue bolt axial force measuring systems based on ultrasonic measuring technology, which improves the connection stability and reliability of components. CN109781332A, CN109668672A through the acoustic time difference of ultrasonic measurement bolt free state and fastening state, based on the extension of sound time difference calculation bolt, and then solve bolt axial force, reach the purpose to bolt axial force measurement. CN108387338A discloses a real-time high-precision detection method and system for bolt axial force based on a piezoelectric ultrasonic wafer. And establishing a high-precision fitting relation between the ultrasonic single-wave flight time difference and the bolt axial force by utilizing the change rule of the ultrasonic single-wave flight time difference along with the stress value, and realizing the real-time detection of the bolt axial force. These methods, however, do not allow long term monitoring of the bolt axial force during high temperature bolt service.
In order to design an ultrasonic probe for measuring the axial force of a high-temperature bolt on line, the ultrasonic probe utilizes the characteristic that sound wave energy is concentrated in the center of the bolt when SH0 waves and A0 waves are transmitted, and a wave guide rod is designed to serve as a sound wave transmission medium between the high-temperature bolt and a transducer which is easily influenced by temperature, so that the ultrasonic transducer can stably work for a long time, and the purpose of accurately measuring the axial force of the bolt in a high-temperature environment is achieved.
Disclosure of Invention
The invention aims to solve the technical problem of providing a reliable and convenient ultrasonic measuring probe for online monitoring of the bolt axial force in a high-temperature environment.
The invention is realized by the following technical scheme:
an integrated ultrasonic probe for online measurement of high-temperature bolt axial force, characterized in that the integrated ultrasonic probe comprises: the piezoelectric chip I17, the piezoelectric chip II 7 and the piezoelectric chip III 6 are embedded in the upper damping block 5, the upper surface of the upper damping block 5 is provided with a circuit board 16 which is matched with the piezoelectric chip I17, the piezoelectric chip II 7 and the piezoelectric chip III 6 in impedance, the circuit board is sealed on the upper damping block 5 by a glue layer, and three positive leads and three negative leads are respectively connected with the positive pole and the negative pole of the three piezoelectric chips, penetrate through the upper damping block 5 to be connected with the circuit board 16 and then are connected with the threaded connector 12 positioned on the outer side of the cover-shaped shell 1; the upper damping block 5 is tightly attached to the lower damping block 8 with the same diameter and tightly fixed by the inner shell 18, the upper end of the inner shell 18 is embedded in the cover-shaped outer shell 1, and the lower end of the inner shell is embedded in the cylindrical outer shell 9; the upper ends of the waveguide rod I19 and the waveguide rod II11 sequentially penetrate through the circular back cover 10 and the lower damping block 8 and are connected with corresponding piezoelectric wafers, and the lower end faces of the waveguide rod I19 and the waveguide rod II11 are in close contact with the top of the tested bolt; the upper end face of the waveguide rod I19 is connected with the piezoelectric chip I17, and SH0 waves in a single mode are excited; the left side surface of the waveguide rod II11 is connected with the piezoelectric chip II 7, the right side surface of the waveguide rod II11 is connected with the piezoelectric chip III 6, and the piezoelectric chip II 7 and the piezoelectric chip III 6 are excited together to generate a single-mode A0 wave.
The waveguide rod I19 and the waveguide rod II11 are strip-shaped thin plates, and the cross sections of the strip-shaped thin plates are rectangular; the width of the waveguide rod is related to the wavelength lambda of the ultrasonic signal propagated therein, and the width of the waveguide rod is equal to 5 lambda; based on the research of the heat dissipation capability and the wave propagation truncation theory of the waveguide rod, the thickness of the waveguide rod can be selected to be 1 mm; and calculating the length value required for reducing the temperature t to the ambient temperature under the condition of air cooling by adopting ANSYS software according to the temperature t of the tested bolt.
The piezoelectric crystal plate I17, the piezoelectric crystal plate II 7 and the piezoelectric crystal plate III 6 are all cuboids, the length of each cuboid is 0.9 times of the width of each waveguide rod, the width of each cuboid is equal to the thickness of the waveguide rod installed on each cuboid, and the thickness t of each piezoelectric crystal plate is determined by calculation according to a required excitation frequency and by using a formula t as N/f (wherein f is the frequency of the piezoelectric crystal plate, and N is a piezoelectric material system); the electrode surface of the piezoelectric wafer I17 is the upper surface and the lower surface of the piezoelectric wafer I17 or any side surface of the piezoelectric wafer I17; the polarization direction of the piezoelectric wafer I17 is parallel to the electrode surface; the electrode surfaces of the piezoelectric wafers II 7 and III 6 are the left and right side surfaces or any adjacent side surface contacted with the waveguide rod; the polarization directions of the piezoelectric chip II 7 and the piezoelectric chip III 6 are vertical to the electrode surface, the piezoelectric chip II 7 and the piezoelectric chip III 6 which are used for exciting A0 waves are used simultaneously, and the piezoelectric chip II 7 receives A0 waves; the connection mode between the waveguide rod and the piezoelectric wafer can be bonding or welding.
The diameter of the upper damping block 5 is larger than the lengths of the piezoelectric wafer I17, the piezoelectric wafer II 7 and the piezoelectric wafer III 6, and the lower surface of the upper damping block 5 is flush with the lower surfaces of the three piezoelectric wafers;
the upper end surface of the waveguide rod I19 is flush with the upper surface of the lower damping block 8, and the upper end surface of the waveguide rod II11 is 2mm higher than the upper surface of the lower damping block 8; the lower surfaces of the waveguide rod I19 and the waveguide rod II11 are positioned on the same plane, and the total length of the waveguide rod II11 is 3mm longer than that of the waveguide rod I19; the through groove of the lower damping block 8 and the through groove of the circular back cover 10 can clamp the upper parts of the waveguide rod I19 and the waveguide rod II 11.
According to different requirements of installation space, the invention also provides a split type ultrasonic probe for measuring the axial force of the high-temperature bolt, which is characterized in that the split type ultrasonic probe comprises an SH0 probe 30 and an A0 probe 31, and the two probes are matched for use;
the SH0 probe 30 includes: the piezoelectric wafer I17 is embedded in the SH0 probe upper damping block 21, the upper surface of the upper damping block 21 is provided with an SH0 probe circuit board 20 matched with the impedance of the piezoelectric wafer I17, the upper damping block is sealed on the SH0 probe upper damping block 21 through an adhesive layer, and two leads are respectively connected with the positive pole and the negative pole of the piezoelectric wafer I17, penetrate through the SH0 probe upper damping block 21 to be communicated with the SH0 probe circuit board 20 and are connected with the threaded connector 12 positioned on the outer side of the shell 1; the SH0 probe upper damping block 21 is tightly attached to the SH0 probe lower damping block 22 with the same diameter and tightly fixed by the inner shell 18, the upper end of the inner shell 18 is embedded in the cover-shaped outer shell 1, and the lower end of the inner shell is embedded in the cylindrical outer shell 9; the upper end face of the waveguide rod I19 penetrates through the SH0 probe circular back cover 23 and the SH0 probe lower damping block 22 and is connected with the piezoelectric chip I17;
the A0 probe 31 comprises: the piezoelectric wafer II 7 and the piezoelectric wafer III 6 are embedded in the circular A0 probe upper damping block 25, the A0 probe circuit board 24 matched with the piezoelectric wafer II 7 and the piezoelectric wafer III 6 in impedance is arranged on the upper surface of the A0 probe upper damping block 25 and is sealed on the A0 probe upper damping block 25 through a glue layer, four wires are respectively connected with the positive electrode and the negative electrode of the piezoelectric wafer II 7 and the piezoelectric wafer III 6, and then penetrate through the A0 probe upper damping block 25 to pass through the A0 probe circuit board 24 and are connected with the screwed joint 12 positioned on the outer side of the cover-shaped shell 1; the A0 probe upper damping block 25 is closely attached to the A0 probe lower damping block 26 with the same diameter, and is closely fixed by the inner shell 18, the upper end of the inner shell 18 is embedded in the cover-shaped outer shell 1, and the lower end is embedded in the cylindrical outer shell 9; the upper end face of the waveguide rod II11 penetrates through the A0 probe circular back cover 27 and the A0 probe lower damping block 26, the left side face of the waveguide rod II is connected with the piezoelectric chip II 7, and the right side face of the waveguide rod II is connected with the piezoelectric chip III 6.
The diameter of the damping block 21 on the SH0 probe is larger than the length of the piezoelectric wafer I17, and the lower surface of the damping block 21 on the SH0 probe is flush with the lower surface of the piezoelectric wafer I17.
The upper end surface of the waveguide rod I19 is flush with the upper surface of the SH0 probe lower damping block 22, and the through groove of the SH0 probe lower damping block 22 and the through groove of the SH0 probe circular back cover 23 can clamp the upper part of the waveguide rod I19.
The diameter of the damping block 25 on the A0 probe is larger than the lengths of the piezoelectric wafers II 7 and III 6, and the lower surfaces of the damping block 25 on the A0 probe are flush with the lower surfaces of the piezoelectric wafers II 7 and III 6.
The upper end surface of the waveguide rod II11 is 2mm higher than the upper surface of the A0 probe lower damping block 26; the through groove of the damping block 26 under the A0 probe and the through groove of the circular back cover 27 of the A0 probe can be clamped on the upper part of the waveguide rod II 11.
The waveguide rod I19 and the waveguide rod II11 are bent along an axis parallel to the cross-sectional direction of the waveguide rods.
The invention has the advantages that:
1. the ultrasonic probe can simultaneously excite SH0 waves and A0 waves in a single mode, and the axial force of the bolt is determined by a speed ratio method of the A0 waves and the SH0 waves. When SH0 wave and A0 wave are propagated, sound wave energy is concentrated in the center of the bolt, interference of the threads of the bolt on sound wave propagation is reduced, and accurate measurement of high-temperature bolt axial force can be achieved.
2. The ultrasonic probe can be integrated, and can also be divided into an SH0 probe and an A0 probe split type structure according to the requirement of the actual installation space. The integrated structure saves the manufacturing cost and is convenient to install; the split structure can be bent according to the installation environment of the tested piece, so that the usability of the split structure on the environment is improved.
3. The waveguide rod is introduced into the probe to serve as a sound wave propagation medium between the high-temperature bolt and the piezoelectric wafer which is easily influenced by temperature, so that the piezoelectric wafer is not influenced by high temperature, and long-term monitoring of the axial force of the high-temperature bolt is possible.
4. The ultrasonic probe for measuring the axial force of the high-temperature bolt can effectively reduce the complex auxiliary work of dismantling the heat-insulating layer, building a scaffold and the like.
5. The wave guide rod leads the monitoring signal of the tested piece from a high-temperature region (50-650 ℃) to a normal-temperature region for sensing, improves the working environment of temperature sensitive parts such as a piezoelectric wafer and a circuit of the probe, and can perform online long-term measurement on the axial force of a bolt in the high-temperature environment.
Drawings
FIG. 1 is a schematic view of an integrated structure of the present invention. Wherein, 1: lid-like housing, 2: piezoelectric chip ii positive electrode lead, 3: piezoelectric wafer iii positive electrode lead, 4: piezoelectric wafer iii negative electrode lead, 5: upper damping block, 6: piezoelectric wafer iii, 7: piezoelectric wafers ii, 8: lower damping block, 9: cylindrical case, 10: circular back cover, 11: waveguide rod ii, 12: threaded joint, 13: piezoelectric chip i positive electrode lead, 14: piezoelectric chip i negative electrode lead, 15: negative electrode lead of piezoelectric chip II, 16: circuit board, 17: piezoelectric wafer i, 18: inner shell, 19: waveguide pole I.
Fig. 2 is a schematic structural diagram of a split SH0 probe according to the present invention. Wherein, 13: piezoelectric chip i positive electrode lead, 14: piezoelectric chip i negative electrode lead, 17: piezoelectric wafer i, 19: waveguide bar i, 1: lid-like housing, 12: threaded joint, 20: SH0 probe circuit board, 21: SH0 probe upper damping block, 18: inner shell, 22: SH0 probe lower damping block, 9: cylindrical case, 23: SH0 probe circular back cover.
Fig. 3 is a schematic structural diagram of a split-type a0 probe according to the present invention. Wherein, 2: piezoelectric chip ii positive electrode lead, 3: piezoelectric wafer iii positive electrode lead, 4: piezoelectric wafer iii negative electrode lead, 6: piezoelectric wafer iii, 7: piezoelectric wafers ii, 11: waveguide rod ii, 15: negative electrode lead of piezoelectric chip II, 1: lid-like housing, 12: threaded joint, 24: a0 probe circuit board, 25: damping block on a0 probe, 18: a0 probe inner shell, 26: a0 damping mass under probe, 9: cylindrical case, 27: the A0 probe is a circular back cover.
Fig. 4 is a perspective view of a waveguide sensor that can excite and receive SH0 waves. Wherein, 13: piezoelectric chip i positive electrode lead, 14: piezoelectric chip i negative electrode lead, 17: piezoelectric wafer i, 19: waveguide pole I.
Fig. 5 is a perspective view of a waveguide sensor that can excite and receive a0 wave. Wherein, 2: piezoelectric chip ii positive electrode lead, 3: piezoelectric wafer iii positive electrode lead, 4: piezoelectric wafer iii negative electrode lead, 6: piezoelectric wafer iii, 7: piezoelectric wafers ii, 11: waveguide rod ii, 15: and a negative electrode lead of the piezoelectric chip II.
Fig. 6 is a front view of a waveguide sensor exciting and receiving a0 waves. Wherein, 6: piezoelectric wafer iii, 7: piezoelectric wafers ii, 11: and a waveguide rod II.
Fig. 7 is a front view showing an example of mounting of the integrated ultrasonic probe when the axial mounting space for the bolt is sufficient. Wherein, 28: integrated ultrasonic probe for measuring high-temperature bolt axial force, 29: bolt I to be tested.
Fig. 8 is a left side view of an example of the mounting of the integrated ultrasonic probe when the axial mounting space for the bolt is sufficient. Wherein, 28: integrated ultrasonic probe for measuring high-temperature bolt axial force, 29: bolt I to be tested.
Fig. 9 is a front view showing an example of mounting of the ultrasonic probe of the split type when the axial mounting space for the bolt is limited. Wherein, 30: SH0 probe, 31: a0 probe, 32: and a bolt II to be tested.
Fig. 10 is a top view of an example of the installation of a split ultrasonic probe for a bolt with limited axial installation space. Wherein, 30: SH0 probe, 31: a0 probe, 32: and a bolt II to be tested.
Fig. 11 shows an example of installation of the split type ultrasonic probe. Wherein, 30: SH0 probe, 31: a0 probe, 33: bolt to be tested iii, 34: a flange plate.
Fig. 12 is a second top view of an example of installation of a split ultrasound probe. Wherein, 30: SH0 probe, 31: SH0 probe, 33: bolt to be tested iii, 34: a flange plate.
Fig. 13 is a working principle diagram of an embodiment of an ultrasonic probe for measuring wall thickness reduction in an extreme environment. Wherein, 28: integrated ultrasonic probe for measuring high-temperature bolt axial force, 29: bolt I, 35 to be tested: a high temperature box.
Detailed Description
The invention will be further described with reference to the accompanying drawings and detailed description:
as shown in fig. 1, the integrated ultrasonic probe for measuring the axial force of a high-temperature bolt includes: the lower end surfaces of the waveguide rod I19 and the waveguide rod II11 are in contact with the top of the tested bolt. The upper end face of the waveguide rod I19 penetrates through the circular back cover 10 and the lower damping block 8 and is tightly attached to the lower surface of the piezoelectric wafer I17; the upper end face of the wave guide rod II11 penetrates through the circular back cover 10 and the lower damping block 8 and is connected with the piezoelectric chip II 7 and the piezoelectric chip III 6. The three piezoelectric wafers are embedded in the upper damping block 5, and the lower surfaces of the piezoelectric wafers are flush with the lower surface of the upper damping block 5. Through grooves are formed in the center parts of the circular back cover 10 and the lower damping block 8, and the upper end parts of the waveguide rod I19 and the waveguide rod II11 are tightly clamped by the two through grooves; three positive wires are respectively connected with the positive electrodes of the three piezoelectric wafers, three negative wires are respectively connected with the negative electrodes of the three piezoelectric wafers, and six wires penetrate through the upper damping block 5 and are connected with a circuit board 16 glued on the upper damping block and are connected with the threaded connector 12; the threaded joint 12 is arranged outside the cap-shaped housing 1; the lower surface of the upper damping block 5 is tightly attached to the upper surface of the lower damping block 8 and fixed by the inner shell 18; the upper end of the inner shell 18 is embedded in the cover-shaped outer shell 1, and the lower end of the inner shell 18 is embedded in the cylindrical outer shell 9.
The SH0 probe shown by fig. 2, includes: the lower end face of the waveguide rod I19 is contacted with the top end of a tested bolt, and the upper end face of the waveguide rod I19 penetrates through the SH0 probe circular back cover 23 and the SH0 probe lower damping block 22 and is tightly attached to the lower surface of the piezoelectric wafer I17. The piezoelectric wafer I17 is embedded in the damping block 21 on the SH0 probe, and the lower surface of the piezoelectric wafer I17 is flush with the lower surface of the damping block 21 on the SH0 probe. The center parts of the SH0 probe circular back cover 23 and the SH0 probe lower damping block 22 are provided with through grooves, and the diameter of the SH0 probe lower damping block 22 is larger than the length of the through grooves. The two through grooves tightly clamp the upper end part of the waveguide rod I19; the piezoelectric chip I17 is connected with the SH0 probe circuit board 20 through a lead and is connected with the threaded connector 12; the lower surface of the SH0 probe upper damping block 21 is tightly attached to the upper surface of the SH0 probe lower damping block 22 and fixed by the inner shell 18; the upper end of inner shell 18 is embedded in outer shell 1, and the lower end of inner shell 18 is embedded in outer shell 9.
The a0 probe shown in fig. 3, comprising: the lower end face of the waveguide rod II11 is contacted with the top end of the tested bolt, and the upper end of the waveguide rod II11 penetrates through the A0 probe circular back cover 27 and the A0 probe lower damping block 26 to be closely attached to the right surface of the piezoelectric wafer II 7 and the left surface of the piezoelectric wafer III 6. The piezoelectric plate II 7 and the piezoelectric plate III 6 are embedded in the upper damping block 31, and the lower surfaces of the piezoelectric plates are flush with the lower surface of the damping block 25 on the A0 probe. A through groove is formed in the center of the A0 probe circular back cover 27 and the A0 probe lower damping block 26, and the diameter of the A0 probe lower damping block 26 is larger than the length of the through groove. The two through grooves tightly clamp the upper end of the waveguide rod II 11; the piezoelectric chip II 7 and the piezoelectric chip III 6 are communicated with the A0 probe circuit board 24 through leads and are connected with the threaded connector 12; the lower surface of the damping block 25 on the A0 probe is tightly attached to the upper surface of the damping block 26 under the A0 probe, and the damping block are fixed by the inner shell 18; the upper end of the inner shell 18 is embedded in the cover-shaped outer shell 1, and the lower end of the inner shell 18 is embedded in the cylindrical outer shell 9.
As shown in fig. 4, the upper and lower surfaces of the piezoelectric wafer i 17 are electrode surfaces, and the polarization direction is parallel to the electrode surfaces. The positive lead 13 of the piezoelectric chip I is connected with the positive electrode on the upper surface of the piezoelectric chip I17, and the negative lead 14 of the piezoelectric chip I is connected with the negative electrode on the front side. The center of the cross section of the piezoelectric wafer I17 coincides with the center of the upper end face of the waveguide rod I19, the lower surface of the piezoelectric wafer I17 is parallel to the upper end face of the waveguide rod I19, and the joint can be bonded or welded. The combination of the piezoelectric chip I17 and the waveguide I19 can excite and receive SH0 wave.
As shown in fig. 5 and 6, the left and right side surfaces of piezoelectric chip ii 7 and piezoelectric chip iii 6 are electrode surfaces, and the polarization direction is perpendicular to the electrode surfaces. The positive lead 2 of the piezoelectric chip II 7 is connected with the positive electrode on the left side surface of the piezoelectric chip II 7, and the negative lead 15 of the piezoelectric chip II is connected with the negative electrode on the front side of the piezoelectric chip II. The positive lead 3 of the piezoelectric wafer III 6 is connected with the positive electrode on the right side surface of the piezoelectric wafer III 6, and the negative lead 4 of the piezoelectric wafer III 6 is connected with the negative electrode on the front side of the piezoelectric wafer III 6. The right side surface of the piezoelectric chip II 7 is connected with the left side surface of the waveguide rod II11, the left side surface of the piezoelectric chip III 6 is connected with the right side surface of the waveguide rod II11, the connection part can be bonded or welded, and the piezoelectric chip II and the waveguide rod II are symmetrically arranged on the left side and the right side of the waveguide rod II11 and are 1mm away from the upper end surface of the waveguide rod II 11. The piezoelectric chip II 7, the piezoelectric chip III 6 and the waveguide rod II11 can be combined to excite and receive A0 waves.
As shown in figures 7 and 8, under the condition that the axial installation space of the bolt is sufficient, an integrated ultrasonic probe 28 for measuring the axial force of the high-temperature bolt is selected, and the bottoms of two waveguide rods are in contact with the top of a bolt I29 to be measured.
As shown in fig. 9 and 10, under the condition that the axial installation space of the bolt is limited, two split ultrasonic probes for measuring the axial force of the high-temperature bolt can be selected, the lower end surfaces of the waveguide rod I19 and the waveguide rod II11 are contacted with the top of the bolt II 32 to be measured, and the SH0 probe 30 and the A0 probe 31 are bent towards two sides. As shown in fig. 11 and 12, when the temperature is high near the center of the flange 34, the SH0 probe 30 and the a0 probe 31 can be bent outward to reduce the temperature effect on the probes.
The two mounting structures of the ultrasonic probe for measuring the high-temperature bolt force have the same working principle. Taking an integrated structure as an example, the working principle is explained as follows:
under the excitation of voltage, the piezoelectric chip I17 generates vibration, so that SH0 waves are excited, and the waves are transmitted to the bolt I29 to be tested through the waveguide rod I19. The reflected echo at the bottom of the bolt returns through the waveguide rod I19 and is converted into an electric signal after being sensed by the piezoelectric chip I17;
under the excitation of voltage, the piezoelectric chip II 7 and the piezoelectric chip III 6 vibrate simultaneously to excite an A0 wave, the A0 wave is transmitted to the bolt I29 to be tested through the wave guide rod II11, and a reflected echo returns through the wave guide rod II11 and is converted into an electric signal after being sensed by the piezoelectric chip II 7 and the piezoelectric chip III 6. And calculating the pretightening force of the bolt by using SH0 waves received by the piezoelectric chip I17 and A0 waves received by the piezoelectric chip II 7 and adopting a speed ratio method of A0 waves and SH0 waves.
Because the sound wave can be transmitted to the periphery after the piezoelectric wafer is electrically excited, part of the sound wave is incident to the waveguide rod for monitoring, and part of the sound wave is incident to the waveguide rod after encountering the interface in the probe for reflection, and the waves are clutter for monitoring. Therefore, the damping block is designed in the probe to absorb the interference clutter; in addition, when the piezoelectric wafer is subjected to electric excitation, the piezoelectric wafer starts to vibrate, and the upper damping block plays a damping role on the piezoelectric wafer, so that the piezoelectric wafer stops as soon as possible, aftershock is reduced, the pulse width of ultrasonic waves is reduced, and the ultrasonic detection resolution is improved; the upper damping block and the lower damping block are mainly made of sound absorption materials prepared by epoxy resin, curing agent, rubber, calcium powder, lead tetraoxide and the like according to a proportion, and the sound absorption materials are directly poured around the piezoelectric wafer after being prepared. The lower damping block is harder than the upper damping block, plays a role in fixing the piezoelectric wafer and the waveguide rod, and the upper damping block is softer and can play a role in protecting the lead.
The circular back cover 10, the SH0 probe circular back cover 23 and the A0 probe circular back cover 27 can be made of aluminum oxide (corundum) films, are common probe hard protective films and protect the damping block from being polluted and damaged by the working environment.
The screwed joint 12 is externally connected with a lead and is connected with a signal acquisition device.
The implementation case is as follows:
according to two different working conditions of sufficient installation space and narrow installation space, an integrated ultrasonic probe, a split SH0 probe and an A0 probe are respectively designed and processed. The piezoelectric wafer I17, the piezoelectric wafer II 7 and the piezoelectric wafer III 6 are made of 2-2 composite materials, the circular sealing bottom 10, the SH0 probe circular sealing bottom 23 and the A0 probe circular sealing bottom 27 are made of aluminum oxide (corundum), the inner shell 18 is made of polytetrafluoroethylene, the upper damping block 5, the SH0 probe upper damping block 21 and the A0 probe upper damping block 25 are made of cement materials, the lower damping block 8, the SH0 probe lower damping block 22 and the A0 probe lower damping block 26 are made of cement materials added with silicon powder, and the cover-shaped shell 1 is made of hard aluminum alloy 2219.
The waveguide rod I19 and the waveguide rod II11 are made of 42CrMo stainless steel, the thickness is 1mm, the width is 20mm, the length of the waveguide rod I19 is 300mm, and the length of the waveguide rod II11 is 303 mm.
The thickness of the piezoelectric chip I17, the width of the piezoelectric chip II 7 and the length of the piezoelectric chip III 6 are 1mm, the width of the piezoelectric chip II 7 and the length of the piezoelectric chip III 6 are 18mm, and the circuit board 16 is matched with the impedance of the piezoelectric chip I17, the piezoelectric chip II 7 and the piezoelectric chip III 6 and is assembled by components such as a resistor, a capacitor and the like which are sold in the market. We choose the following specifications of Guangdong Fenghua high-tech science and technology company Limited: the capacitor model is as follows: CC4-0805N200J500F3, resistance type: RC-MTO8W512JT, inductance type: LGA0204-221KP 52E.
The tested sample is a bolt with the size of M24mm × 95mm, the tested bolt is placed in the high-temperature box 35, two slotted holes are formed in the upper part of the high-temperature box 35, and under different working conditions, an integrated ultrasonic probe, a split SH0 probe and an A0 probe are respectively used: the lower end faces of the waveguide rod I19 and the waveguide rod II11 of the probe are inserted into the slotted hole of the high-temperature box 35 from top to bottom, and the waveguide rod I19 and the waveguide rod II11 are welded to the top of the bolt. Except for the lower half parts of the waveguide rod I19 and the waveguide rod II11, other parts of the ultrasonic probe are placed outside the high-temperature box 35 and are connected with a signal acquisition instrument through electric wires. The temperature of the high-temperature box is heated to 300 ℃, the temperature is kept for 20 minutes, then the measurement results of the integrated probe and the split probe are the same and are 95.2mm, the error is 2%, and the engineering requirements are met.
Claims (9)
1. An integrated ultrasonic probe for online measurement of high-temperature bolt axial force, characterized in that the integrated ultrasonic probe comprises: the piezoelectric chip I (17), the piezoelectric chip II (7) and the piezoelectric chip III (6) are embedded in the upper damping block (5), the upper surface of the upper damping block (5) is provided with a circuit board (16) which is matched with the piezoelectric chip I (17), the piezoelectric chip II (7) and the piezoelectric chip III (6) in impedance, the circuit board is sealed on the upper damping block (5) through an adhesive layer, and after three positive leads and three negative leads are respectively connected with the positive pole and the negative pole of the three piezoelectric chips, the circuit board (16) is connected through the upper damping block (5) and then is connected with a threaded connector (12) positioned on the outer side of the cover-shaped shell (1); the upper damping block (5) is tightly attached to the lower damping block (8) with the same diameter and tightly fixed by the inner shell (18), the upper end of the inner shell (18) is embedded in the cover-shaped outer shell (1), and the lower end of the inner shell is embedded in the cylindrical outer shell (9); the upper ends of the waveguide rod I (19) and the waveguide rod II (11) sequentially penetrate through the circular back cover (10) and the lower damping block (8) and are connected with corresponding piezoelectric wafers, and the lower end faces of the waveguide rod I (19) and the waveguide rod II (11) are in close contact with the top of the tested bolt; the upper end face of the waveguide rod I (19) is connected with the piezoelectric chip I (17) to excite the SH0 wave of a single mode; the left side surface of the waveguide rod II (11) is connected with the piezoelectric chip II (7), the right side surface of the waveguide rod II (11) is connected with the piezoelectric chip III (6), and the piezoelectric chip II (7) and the piezoelectric chip III (6) are excited together to generate single-mode A0 waves.
2. The integrated ultrasonic probe of claim 1, wherein the waveguide I (19) and waveguide II (11) are thin strips with rectangular cross-sections; the width of the waveguide rod is related to the wavelength lambda of the ultrasonic signal propagated therein, and the width of the waveguide rod is equal to 5 lambda; the thickness of the waveguide rod is 1 mm; and calculating the length value required for reducing the temperature t to the ambient temperature under the condition of air cooling by adopting ANSYS software according to the temperature t of the tested bolt.
3. The integrated ultrasonic probe according to claim 1, wherein the piezoelectric wafer i (17), the piezoelectric wafer ii (7) and the piezoelectric wafer iii (6) are cuboids, the lengths of the cuboids are 0.9 times the width of the waveguide rods, the widths of the cuboids are equal to the thickness of the respectively installed waveguide rods, the thickness t of the piezoelectric wafer is determined according to the required excitation frequency by calculation by using the formula t-N/f, wherein f is the piezoelectric wafer frequency, and N is a piezoelectric material system; the electrode surface of the piezoelectric wafer I (17) is the upper surface and the lower surface of the piezoelectric wafer I (17) or any side surface of the piezoelectric wafer I (17); the polarization direction of the piezoelectric chip I (17) is parallel to the electrode surface; the electrode surfaces of the piezoelectric wafers II (7) and III (6) are the left and right side surfaces or any adjacent side surface contacted with the waveguide rod; the polarization directions of the piezoelectric chip II (7) and the piezoelectric chip III (6) are vertical to the electrode surface, the piezoelectric chip II (7) and the piezoelectric chip III (6) used for exciting A0 waves are used simultaneously, and the piezoelectric chip II (7) receives A0 waves; the wave guide rod and the piezoelectric wafer are connected in an adhesion or welding mode.
4. The integrated ultrasonic probe according to claim 1, wherein the diameter of the upper damping block (5) is larger than the lengths of the piezoelectric wafer i (17), the piezoelectric wafer ii (7) and the piezoelectric wafer iii (6), and the lower surface of the upper damping block (5) is flush with the lower surfaces of the three piezoelectric wafers.
5. The integrated ultrasonic probe of claim 1, wherein the upper end surface of the waveguide rod I (19) is flush with the upper surface of the lower damping block (8), and the upper end surface of the waveguide rod II (11) is 2mm higher than the upper surface of the lower damping block (8); the lower surfaces of the waveguide rod I (19) and the waveguide rod II (11) are positioned on the same plane, and the total length of the waveguide rod II (11) is 3mm longer than that of the waveguide rod I (19); the through groove of the lower damping block (8) and the through groove of the circular back cover (10) can clamp the upper parts of the waveguide rod I (19) and the waveguide rod II (11).
6. A split type ultrasonic probe for measuring the axial force of a high-temperature bolt is characterized by comprising an SH0 probe 30 and an A0 probe 31 which are matched for use;
the SH0 probe (30) includes: the piezoelectric wafer I (17) is embedded in an SH0 probe upper damping block (21), the upper surface of the upper damping block (21) is provided with an SH0 probe circuit board (20) matched with the piezoelectric wafer I (17) in impedance, the upper damping block is sealed on the SH0 probe upper damping block (21) through an adhesive layer, and two leads are respectively connected with the positive electrode and the negative electrode of the piezoelectric wafer I (17), penetrate through the SH0 probe upper damping block (21) to be connected with the SH0 probe circuit board (20) and are connected with a threaded connector (12) positioned on the outer side of the shell 1; an SH0 probe upper damping block (21) is tightly attached to an SH0 probe lower damping block (22) with the same diameter and tightly fixed by an inner shell (18), the upper end of the inner shell (18) is embedded in a cover-shaped outer shell (1), and the lower end of the inner shell is embedded in a cylindrical outer shell (9); the upper end face of the waveguide rod I (19) penetrates through the SH0 probe circular back cover (23) and the SH0 probe lower damping block (22) and is connected with the piezoelectric chip I (17);
the A0 probe (31) comprises: the piezoelectric wafer II (7) and the piezoelectric wafer III (6) are embedded in a damping block (25) on a circular A0 probe, an A0 probe circuit board (24) matched with the piezoelectric wafer II (7) and the piezoelectric wafer III (6) in impedance is arranged on the upper surface of the damping block (25) on the A0 probe and is sealed on the damping block (25) on the A0 probe through a glue layer, four wires are respectively connected with the positive pole and the negative pole of the piezoelectric wafer II (7) and the piezoelectric wafer III (6), and then penetrate through the damping block (25) on the A0 probe to be communicated with the A0 probe circuit board (24) and are connected with a threaded connector (12) positioned on the outer side of the cover-shaped shell (1); an A0 probe upper damping block (25) is tightly attached to an A0 probe lower damping block (26) with the same diameter and tightly fixed by an inner shell (18), the upper end of the inner shell (18) is embedded in a cover-shaped outer shell (1), and the lower end of the inner shell is embedded in a cylindrical outer shell (9); the upper end face of the wave guide rod II (11) penetrates through the A0 probe circular back cover (27) and the A0 probe lower damping block (26), the left side face of the wave guide rod II is connected with the piezoelectric chip II (7), and the right side face of the wave guide rod II is connected with the piezoelectric chip III (6).
7. The split-type ultrasonic probe of claim 6, wherein the diameter of the damping block (21) on the SH0 probe is larger than the length of the piezoelectric chip I (17), and the lower surface of the damping block (21) on the SH0 probe is flush with the lower surface of the piezoelectric chip I (17); the diameter of the damping block (25) on the A0 probe is larger than the lengths of the piezoelectric wafer II (7) and the piezoelectric wafer III (6), and the lower surface of the damping block (25) on the A0 probe is flush with the lower surfaces of the piezoelectric wafer II (7) and the piezoelectric wafer III (6).
8. The split type ultrasonic probe according to claim 6, wherein the upper end surface of the waveguide rod I (19) is flush with the upper surface of the SH0 probe lower damping block (22), and the through groove of the SH0 probe lower damping block (22) and the through groove of the SH0 probe circular back cover (23) clamp the upper part of the waveguide rod I (19); the upper end surface of the waveguide rod II (11) is 2mm higher than the upper surface of the A0 probe lower damping block (26); the through groove of the damping block 26 under the A0 probe and the through groove of the circular back cover 27 of the A0 probe clamp the upper part of the waveguide rod II (11).
9. The split-type ultrasonic probe of claim 6, wherein the waveguide I (19) and waveguide II (11) are curved along an axis parallel to their cross-sectional direction.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110549336.3A CN113405718B (en) | 2021-05-20 | 2021-05-20 | Ultrasonic probe for online measurement of high-temperature bolt axial force |
| GB2317628.2A GB2621519A (en) | 2021-05-20 | 2021-06-04 | Ultrasonic probe for on-line measurement of axial force of high-temperature bolt |
| PCT/CN2021/098225 WO2022241855A1 (en) | 2021-05-20 | 2021-06-04 | Ultrasonic probe for on-line measurement of axial force of high-temperature bolt |
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| CN202110549336.3A CN113405718B (en) | 2021-05-20 | 2021-05-20 | Ultrasonic probe for online measurement of high-temperature bolt axial force |
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| CN113405718A true CN113405718A (en) | 2021-09-17 |
| CN113405718B CN113405718B (en) | 2022-11-11 |
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| Country | Link |
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| CN (1) | CN113405718B (en) |
| GB (1) | GB2621519A (en) |
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| GB2621519A (en) | 2024-02-14 |
| WO2022241855A1 (en) | 2022-11-24 |
| CN113405718B (en) | 2022-11-11 |
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