CN113402539B - Compound for packaging film, composition containing compound and preparation method of packaging film - Google Patents
Compound for packaging film, composition containing compound and preparation method of packaging film Download PDFInfo
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- CN113402539B CN113402539B CN202110679800.0A CN202110679800A CN113402539B CN 113402539 B CN113402539 B CN 113402539B CN 202110679800 A CN202110679800 A CN 202110679800A CN 113402539 B CN113402539 B CN 113402539B
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0896—Compounds with a Si-H linkage
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Abstract
The invention discloses a compound and a package for packaging a filmA method for preparing a composition and a packaging film containing the same; the compound for the encapsulation film has a general structural formula as follows:
Description
Technical Field
The invention relates to the technical field of film packaging, in particular to a compound for packaging a film, a composition containing the compound and a preparation method of the packaging film.
Background
An OLED (Organic Light Emitting Diode) is also called an Organic Electroluminescent Display or an Organic Light Emitting semiconductor (OLED). An organic light emitting device belonging to a current type is a phenomenon of light emission by injection and recombination of carriers, and the light emission intensity is in direct proportion to the injected current. Under the action of an electric field, holes generated by an anode and electrons generated by a cathode move, are respectively injected into a hole transport layer and an electron transport layer, and migrate to a light emitting layer. When the two meet at the light emitting layer, energy excitons are generated, thereby exciting the light emitting molecules to finally generate visible light. An organic light emitting display apparatus includes an Organic Light Emitting Device (OLED) composed of a hole injection electrode (anode), an organic light emitting layer, and an electron injection electrode (cathode). This organic light emitting device is generally provided on a glass substrate, and is covered with another substrate in order to prevent deterioration caused by inflow of moisture or oxygen from the outside.
Currently, display devices including organic light emitting display devices are becoming thinner and thinner under consumer demand, and Thin Film Encapsulation (TFE) is applied to cover organic light emitting devices in order to meet the demand.
The encapsulation process may bond the glass cover plate to the display device by using an adhesive, which may have a low moisture vapor transmission rate between the substrate and the glass cover plate to extend the life of the device. The glass cover plate encapsulation process is suitable for rigid devices, but it is clearly unsuitable for devices using flexible support units, such as flexible displays. Furthermore, glass cover plate packaging techniques using adhesives may not be suitable for devices where bare circuitry is present on the substrate, such as Complementary Metal Oxide Semiconductor (CMOS) microdisplays.
Therefore, it is an urgent need to provide a compound capable of reducing the permeability of water vapor and gas, prolonging the service life of a display device, and reducing the shrinkage stress of the composition after curing, thereby realizing an encapsulation film without generating any misalignment, and a composition comprising the same.
Disclosure of Invention
In view of the above, the present invention provides a compound for an encapsulation film, a composition including the same, and a method for preparing an encapsulation film, which can reduce the transmittance of water vapor and gas, prolong the service life of a display device, and reduce the shrinkage stress of the composition after curing, thereby preventing any deviation from occurring.
In order to achieve the purpose, the invention adopts the following technical scheme: a compound for an encapsulation film, wherein the compound for an encapsulation film has a general structural formula as shown in formula 1 below:
chemical formula 1;
wherein X 1 -X 2 、R 3 -R 4 Each independently selected from the group consisting of hydrogen, alkyl groups having less than 20 carbon atoms, alkoxy groups having less than 20 carbon atoms, and substituted or unsubstituted aryl groups having less than 20 carbon atoms, and at least one of which has the following structure 2:
* Is a connection location;
Y 1 -Y 2 each independently selected from substituted or unsubstituted acrylate groups having the general structural formula any one of the following formulas:
Y 3 -Y 10 each independently selected from hydrogen, substituted or unsubstituted C1-C50 alkyl;
R 1 -R 2 each independently selected from the group consisting of a single bond, an alkyl group having less than 20 carbon atoms, an alkoxy group having less than 20 carbon atoms, and a fluoroalkyl group having less than 20 carbon atoms;
A 1 -A 2 each independently selected from the group consisting of a single bond, oxygen, an amino group substituted or unsubstituted with an alkyl group, sulfur,
or, selected from any one of the following structural formulae 7 to 9:
the invention has the beneficial effects that:
preferably, each of said R1-R2 is independently selected from: a single bond, a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C3-C30 cycloalkylene group, a substituted or unsubstituted C1-C30 alkylene ether group, a substituted or unsubstituted C6-C30 arylene group, or a substituted or unsubstituted C7-C50 arylalkylene group.
Preferably, the compound for encapsulation film is selected from the following chemical formula 001-006:
the invention also provides a photocuring composition for packaging, which comprises the following raw materials in percentage by weight:
9.5-90% of the component A, 9.5-90% of the component B and 0.5-10% of the component C;
the component A is the compound for packaging the film, the component B is one or a combination of several of light-curable monofunctional methacrylate of C1 to C30 monohydric alcohol or polyalcohol, light-curable difunctional methacrylate of C2 to C30 monohydric alcohol or polyalcohol and light-curable multifunctional methacrylate of C3 to C30 monohydric alcohol or polyalcohol, and the component C is a light crosslinking initiator.
The invention has the beneficial effects that: the present invention uses the compound for encapsulating the film for preparing the photocurable composition, which can reduce the permeability of water vapor and gas after curing and encapsulating, so that the service life of the display device is prolonged, and the shrinkage stress of the composition after curing is low, so that no deviation can be generated.
Preferably, the photo-crosslinking initiator is any one or a combination of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone and 2,4, 6-trimethylbenzoyl diphenylphosphinate.
Preferably, the photocurable monofunctional methacrylate of a C1 to C30 mono-or polyol is any one or a combination of lauryl acrylate, ethoxyethoxyethyl acrylate, butyl acrylate, hydroxyethyl acrylate and isobornyl acrylate, ethoxylated tetrahydrofuran acrylate, methacrylate phosphate and isobornyl methacrylate.
Preferably, the photo-curable difunctional methacrylate of a C2 to C30 mono-or polyol is any one or combination of diethylene glycol diacrylate, triethylene glycol diacrylate, ethylene glycol diacrylate, polyethylene glycol diacrylate, neopentyl glycol diacrylate, propoxy neopentyl glycol diacrylate, 1, 6-hexanediol diacrylate, 1, 4-butanediol diacrylate, 20 (ethoxy) bisphenol A diacrylate and glycerol diacrylate.
Preferably, the photocurable multifunctional methacrylate of a C3 to C30 mono-or polyol is any one or combination of trimethylolpropane triacrylate, pentaerythritol triacrylate, trimethylolpropane triol triacrylate, trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate and propoxylated pentaerythritol acrylate, ditrimethylolpropane tetraacrylate, triethylene glycol dimethacrylate, long chain aliphatic glycidyl ether acrylate, dipentaerythritol hexaacrylate, tripropylene glycol diacrylate, diethanol diacrylate phthalate, ethoxylated trimethylolpropane triol triacrylate, propoxylated glycerol triacrylate, tris (2-hydroxyethyl) isocyanurate triacrylate and ethoxylated neopentyl glycol methoxy monoacrylate.
The invention also provides a preparation method of the photocuring composition for packaging, which comprises the following steps:
(1) Weighing the raw materials according to the weight percentage of the packaging photocuring composition for later use;
(2) And (3) stirring the component A, the component B and the component C in vacuum, and filtering to obtain the packaging photocuring composition.
Preferably, the vacuum stirring temperature is 50 ℃ and the time is 80h.
The invention also provides a packaging film, which is formed by laminating the inorganic layer and the organic layer for more than 1 time, wherein the outermost layer is the inorganic layer;
wherein the material of the organic layer is a photocurable composition for encapsulation;
the inorganic layer is made of any one or a combination of more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide and zinc oxide, and has a thickness of 8-12 μm.
The material of the organic layer is printing photocurable composition ink.
The invention also provides a preparation method of the packaging film, which comprises the following steps: the organic layer is deposited on the object to be packaged in an ink-jet printing mode, then an organic film is obtained through ultraviolet curing film forming, and the inorganic layer is deposited on the surface of the organic film through a CVD method to obtain the packaging film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Example 1
A photocurable composition for encapsulation, comprising the following raw materials: 20g of component A is selected from composition monomer 001, 70g of component B is selected from trimethylolpropane triacrylate, and 10g of component C is selected from 2,4, 6-trimethylbenzoyl diphenyl phosphonite;
the component A has the following structure:
the preparation method of the packaging photocuring composition comprises the following steps: the component A and the component B were mixed uniformly under vacuum at 50 ℃ for 80 hours, and then filtered with a syringe filter, and when the number of particles having a particle diameter of more than 0.5 μm detected by a particle counter was not more than 50, a treated photocurable composition for encapsulation was obtained.
The preparation method of the packaging film comprises the following steps:
(1) Silicon nitride is selected as an inorganic layer material, and the photocuring composition for packaging is selected as an organic layer material;
(2) Preparing an inorganic layer, coating an inorganic layer material on the surface of an object to be packaged by a CVD method to form the inorganic layer;
(3) Preparation of organic layer the organic layer material was sprayed onto the surface of the inorganic layer using an ink jet printer to form an organic layer using 100mW/cm 2 Ultraviolet light irradiation for 10 seconds each time causes the organic layer to harden;
(4) And (3) forming the packaging film, and performing deposition coating on the surface of the object to be packaged according to the alternating form of the inorganic layer and the organic layer, wherein the inorganic layer and the organic layer which are finally deposited and coated on the surface of the object to be packaged are the packaging film.
Example 2:
a photocurable composition for encapsulation, comprising the following raw materials: 20g of component A adopts composition monomer 002, 70g of component B adopts triethylene glycol dimethacrylate, and 10g of component C adopts 2-hydroxy-2-methyl-1-phenyl acetone;
the component A has the following structure:
the preparation method of the light-curable composition for encapsulation is the same as that of example 1.
The preparation method of the encapsulation film was the same as in example 1.
Example 3
The packaging photocuring composition comprises the following raw materials: 20g of component A is selected from composition monomer 003, 75g of component B is selected from propoxylated glycerol triacrylate, and 5g of component B is selected from 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide;
the component A has the following structure:
the encapsulating photocurable composition was prepared in the same manner as in example 1.
The encapsulation film was prepared in the same manner as in example 1.
Example 4
The difference from example 1 is that 20g of the composition monomer 001 of component A was replaced with 30g and 70g of the trimethylolpropane triacrylate of component A was replaced with 60g.
Example 5
The difference from example 1 is that 20g of the composition monomer 002 of component A was replaced by 30g and 70g of the triethylene glycol dimethacrylate of component B was replaced by 60g.
Example 6
The difference from example 1 was that 20g of the composition monomer 003 of component A was replaced with 30g and 70g of the propoxylated glycerin triacrylate of component B was replaced with 60g.
Comparative example 1
The packaging photocuring composition comprises the following raw materials: 98g of component B is trimethylolpropane triacrylate, 2g of component C is 2,4, 6-trimethylbenzoyl diphenyl phosphonite;
the preparation method of the light-curable composition for encapsulation is the same as that of example 1.
Performance test experiment
The packaging films of examples 1 to 6 and comparative example 1 were subjected to water vapor transmission rate detection using a detection apparatus: the manufacturer is a high-precision water vapor transmission rate tester with a model of AQUARAN2, manufactured by MOCON corporation of America (American Membrane company); detection conditions are as follows: the temperature is 85 ℃, and the relative humidity is 85%; detection duration: 24 hours;
the encapsulation films of examples 1 to 6 and comparative example 1 were subjected to light transmittance measurement, and the measurement instrument: a light transmittance tester; detection conditions are as follows: the temperature is 40 ℃, and the relative humidity is 85%;
the above experimental results are shown in the following table 1:
TABLE 1 results of performance testing of examples 1-6 and comparative example 1
| Group of | Water vapor transmission rate (g/m) 2 ·d) | Light transmittance (%) |
| Example 1 | 4.0*10 -4 | 86 |
| Example 2 | 3.8*10 -4 | 86 |
| Example 3 | 3.8*10 -4 | 85 |
| Example 4 | 4.1*10 -4 | 87 |
| Example 5 | 4.0*10 -4 | 87 |
| Example 6 | 3.8*10 -4 | 85 |
| Example 7 | 4.1*10 -4 | 86 |
| Example 8 | 4.1*10 -4 | 85 |
| Comparative example 1 | 9.0*10 -3 | 86 |
The water vapor transmission rate of the packaging films of examples 1-6 and comparative example 1 is detected, wherein the difference between the examples 1-6 and the comparative example 1 is that the component A created by the invention is added into the examples 1-6, and the comparison shows that the water vapor transmission rate of the packaging film added with the component A created by the invention is obviously lower than that of the packaging film without the component A created by the invention; the organic light-emitting device is packaged by the packaging film, so that moisture can be effectively isolated, and the service life of the organic light-emitting device is prolonged.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A compound for an encapsulation film, wherein the compound for an encapsulation film is selected from the group consisting of the following chemical formulae 001-006:
2. the photocuring composition for packaging is characterized by comprising the following raw materials in percentage by weight:
9.5 to 90 percent of component A, 9.5 to 90 percent of component B and 0.5 to 10 percent of component C;
the component A is the compound for encapsulating films as claimed in claim 1, the component B is any one or a combination of several of photocurable monofunctional methacrylate of C1 to C30 monohydric alcohol or polyhydric alcohol, photocurable difunctional methacrylate of C2 to C30 monohydric alcohol or polyhydric alcohol and photocurable multifunctional methacrylate of C3 to C30 monohydric alcohol or polyhydric alcohol, and the component C is a photocrosslinking initiator.
3. An encapsulating photocurable composition according to claim 2, characterized in that the photocrosslinking initiator is any one or a combination of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone and 2,4, 6-trimethylbenzoyl diphenylphosphinate.
4. A method for preparing a light-curable composition for encapsulation, comprising the steps of:
(1) Weighing the raw materials according to the weight percentage of the photocuring composition for packaging as claimed in claim 2 or 3 for later use;
(2) And (3) stirring the component A, the component B and the component C in vacuum, and filtering to obtain the packaging photocuring composition.
5. The method for preparing a photocurable composition for encapsulation as set forth in claim 4, wherein the temperature of the vacuum stirring is 40-60 ℃ and the time is 80-100h.
6. An encapsulation film, characterized in that the encapsulation film is formed by laminating an inorganic layer and an organic layer for 1 or more times, and the outermost layer is an inorganic layer;
wherein the material of the organic layer is the encapsulating photocurable composition according to claim 2 or 3 or the encapsulating photocurable composition prepared by the preparation method according to claim 4 or 5;
the inorganic layer is made of any one or a combination of more of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, zirconium oxide, titanium oxide and zinc oxide, and has a thickness of 8-12 μm.
7. The preparation method of the packaging film is characterized by comprising the following steps: depositing the organic layer as claimed in claim 6 on the object to be encapsulated by means of ink-jet printing, and then forming an organic film by ultraviolet curing, and depositing the inorganic layer on the surface of the organic film by a CVD method to obtain the encapsulating film.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6608126B2 (en) * | 2000-12-18 | 2003-08-19 | Dow Corning Corporation | Silicone liquid crystals, vesicles, and gels |
| CN101386678B (en) * | 2007-09-13 | 2013-03-13 | 道康宁（上海）有限公司 | Method for preparing organosilicon emulsion containing elastomer polysiloxane with quaternary ammonium radical |
| KR101596544B1 (en) * | 2012-06-15 | 2016-02-22 | 제일모직주식회사 | Photocurable composition, barrier layer comprising the same and encapsulated apparatus comprising the same |
| KR101534334B1 (en) * | 2012-10-11 | 2015-07-06 | 제일모직주식회사 | Photocurable composition and apparatus comprising a protective layer formed using the same |
| EP3406616B1 (en) * | 2016-01-22 | 2022-06-29 | Shin-Etsu Chemical Co., Ltd. | Novel isocyanide compound and hydrosilylation reaction catalyst |
| CN110357916B (en) * | 2019-07-23 | 2020-09-08 | 吉林奥来德光电材料股份有限公司 | Compound for packaging film, composition and film thereof, organic light-emitting device and packaging method |
| CN110894361B (en) * | 2019-12-12 | 2022-02-25 | 浙江福斯特新材料研究院有限公司 | Photocuring packaging composition, packaging structure and semiconductor device |
| CN111153922A (en) * | 2020-01-03 | 2020-05-15 | 吉林奥来德光电材料股份有限公司 | Compound, composition for packaging photoelectric device, preparation method, packaging film, electronic device and packaging method |
| CN112390820B (en) * | 2020-11-03 | 2022-07-19 | 吉林奥来德光电材料股份有限公司 | Composition monomer capable of being cured to form film, composition thereof and application of composition |
| CN112979690B (en) * | 2021-02-04 | 2022-06-17 | 吉林奥来德光电材料股份有限公司 | Ink monomer, photocuring composition, packaging film and organic light-emitting device |
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