CN113135952B - Light-cured monomer, light-cured composition, packaging film and display device - Google Patents
Light-cured monomer, light-cured composition, packaging film and display device Download PDFInfo
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- CN113135952B CN113135952B CN202110358383.XA CN202110358383A CN113135952B CN 113135952 B CN113135952 B CN 113135952B CN 202110358383 A CN202110358383 A CN 202110358383A CN 113135952 B CN113135952 B CN 113135952B
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- 239000000178 monomer Substances 0.000 title claims abstract description 38
- 239000000203 mixture Substances 0.000 title claims abstract description 32
- 239000012785 packaging film Substances 0.000 title abstract description 11
- 229920006280 packaging film Polymers 0.000 title abstract description 11
- 238000000016 photochemical curing Methods 0.000 claims abstract description 32
- 238000005538 encapsulation Methods 0.000 claims abstract description 29
- 239000012044 organic layer Substances 0.000 claims abstract description 22
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 6
- 125000000732 arylene group Chemical group 0.000 claims abstract description 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims abstract description 4
- 125000001033 ether group Chemical group 0.000 claims abstract description 4
- -1 acrylic compound Chemical class 0.000 claims description 139
- 239000010410 layer Substances 0.000 claims description 34
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 125000003545 alkoxy group Chemical group 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 12
- 150000002431 hydrogen Chemical class 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000003999 initiator Substances 0.000 claims description 10
- 125000001072 heteroaryl group Chemical group 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 7
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 claims description 6
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 5
- 238000004132 cross linking Methods 0.000 claims description 5
- 244000028419 Styrax benzoin Species 0.000 claims description 3
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 3
- 229960002130 benzoin Drugs 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 235000019382 gum benzoic Nutrition 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000000686 lactone group Chemical group 0.000 claims description 3
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 14
- 238000001723 curing Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 238000002834 transmittance Methods 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 39
- 150000001993 dienes Chemical class 0.000 description 25
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 24
- 239000010408 film Substances 0.000 description 24
- 125000004386 diacrylate group Chemical group 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 13
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- ZZAGLMPBQOKGGT-UHFFFAOYSA-N [4-[4-(4-prop-2-enoyloxybutoxy)benzoyl]oxyphenyl] 4-(4-prop-2-enoyloxybutoxy)benzoate Chemical compound C1=CC(OCCCCOC(=O)C=C)=CC=C1C(=O)OC(C=C1)=CC=C1OC(=O)C1=CC=C(OCCCCOC(=O)C=C)C=C1 ZZAGLMPBQOKGGT-UHFFFAOYSA-N 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 238000005303 weighing Methods 0.000 description 5
- RHNJVKIVSXGYBD-UHFFFAOYSA-N 10-prop-2-enoyloxydecyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCCOC(=O)C=C RHNJVKIVSXGYBD-UHFFFAOYSA-N 0.000 description 4
- AAXRSWGYLGOFQP-UHFFFAOYSA-N 2-butoxy-1-(2-butoxyphenyl)ethanone Chemical compound CCCCOCC(=O)C1=CC=CC=C1OCCCC AAXRSWGYLGOFQP-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- BUZYGTVTZYSBCU-UHFFFAOYSA-N 1-(4-chlorophenyl)ethanone Chemical compound CC(=O)C1=CC=C(Cl)C=C1 BUZYGTVTZYSBCU-UHFFFAOYSA-N 0.000 description 3
- BIFLVOKTTMOXNC-UHFFFAOYSA-N 2,2-dichloro-3,3-dimethyl-1-phenylbutan-1-one Chemical compound CC(C)(C)C(Cl)(Cl)C(=O)C1=CC=CC=C1 BIFLVOKTTMOXNC-UHFFFAOYSA-N 0.000 description 3
- TWPIKXWELNESPK-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCSc1ccc(cc1)-c1ccccc1 TWPIKXWELNESPK-UHFFFAOYSA-N 0.000 description 3
- PIRCYMNYKHCLBR-UHFFFAOYSA-N OC(=O)C(=C)CCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCSc1ccc(cc1)-c1ccccc1 PIRCYMNYKHCLBR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- NYLVBERZLWFORK-UHFFFAOYSA-N 11-(2-methylprop-2-enoyloxy)undecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCOC(=O)C(C)=C NYLVBERZLWFORK-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QHRWHCYMIDWSKJ-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCCOc1ccc2ccccc2c1 QHRWHCYMIDWSKJ-UHFFFAOYSA-N 0.000 description 2
- IZYQSSOXIVEWPQ-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCSc1ccc(cc1)-c1ccccc1 IZYQSSOXIVEWPQ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- IYDQUNGWLDBKOF-UHFFFAOYSA-N 1-(4-butylphenyl)-2,2,2-trichloroethanone Chemical compound CCCCC1=CC=C(C(=O)C(Cl)(Cl)Cl)C=C1 IYDQUNGWLDBKOF-UHFFFAOYSA-N 0.000 description 1
- HYQASEVIBPSPMK-UHFFFAOYSA-N 12-(2-methylprop-2-enoyloxy)dodecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCCCOC(=O)C(C)=C HYQASEVIBPSPMK-UHFFFAOYSA-N 0.000 description 1
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- MRDMGGOYEBRLPD-UHFFFAOYSA-N 2-ethoxy-1-(2-ethoxyphenyl)ethanone Chemical compound CCOCC(=O)C1=CC=CC=C1OCC MRDMGGOYEBRLPD-UHFFFAOYSA-N 0.000 description 1
- CEJINNSYZFLSCS-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)ethanone Chemical compound CC1=CC=CC=C1C(=O)CO CEJINNSYZFLSCS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- GUTHNTIYIINTNB-UHFFFAOYSA-N 2-methyl-5-(2-phenoxyethoxy)pent-2-enoic acid Chemical compound OC(=O)C(C)=CCCOCCOC1=CC=CC=C1 GUTHNTIYIINTNB-UHFFFAOYSA-N 0.000 description 1
- LZAFXJNIHMSMBG-UHFFFAOYSA-N 2-methyl-6-naphthalen-2-yloxyhex-2-enoic acid Chemical compound CC(=CCCCOC1=CC2=CC=CC=C2C=C1)C(=O)O LZAFXJNIHMSMBG-UHFFFAOYSA-N 0.000 description 1
- YZFQAGVDQHROCY-UHFFFAOYSA-N 2-methylidene-4-phenoxybutanoic acid Chemical compound OC(=O)C(=C)CCOC1=CC=CC=C1 YZFQAGVDQHROCY-UHFFFAOYSA-N 0.000 description 1
- DKOFDDPIELNLDR-UHFFFAOYSA-N 2-methylidene-5-(4-phenylphenoxy)pentanoic acid Chemical compound C1=CC(OCCCC(=C)C(=O)O)=CC=C1C1=CC=CC=C1 DKOFDDPIELNLDR-UHFFFAOYSA-N 0.000 description 1
- JDVQPDVVINVPNR-UHFFFAOYSA-N 2-methylidene-5-naphthalen-2-yloxypentanoic acid Chemical compound C1=CC=CC2=CC(OCCCC(=C)C(=O)O)=CC=C21 JDVQPDVVINVPNR-UHFFFAOYSA-N 0.000 description 1
- UGDIXIBCGVTIFA-UHFFFAOYSA-N 2-methylidene-5-naphthalen-2-ylsulfanylpentanoic acid Chemical compound C1=CC=CC2=CC(SCCCC(=C)C(=O)O)=CC=C21 UGDIXIBCGVTIFA-UHFFFAOYSA-N 0.000 description 1
- XYCOIUGDAJORBK-UHFFFAOYSA-N 2-methylidene-5-phenoxypentanoic acid Chemical compound OC(=O)C(=C)CCCOC1=CC=CC=C1 XYCOIUGDAJORBK-UHFFFAOYSA-N 0.000 description 1
- AVOYQFVUKGBTEG-UHFFFAOYSA-N 2-methylidene-5-phenylsulfanylpentanoic acid Chemical compound OC(=O)C(=C)CCCSC1=CC=CC=C1 AVOYQFVUKGBTEG-UHFFFAOYSA-N 0.000 description 1
- ZQTNHZHZSGBHCV-UHFFFAOYSA-N 2-methylidene-6-phenoxyhexanoic acid Chemical compound OC(=O)C(=C)CCCCOC1=CC=CC=C1 ZQTNHZHZSGBHCV-UHFFFAOYSA-N 0.000 description 1
- FRIXCIPXTGZTQF-UHFFFAOYSA-N 2-methylidene-7-phenoxyheptanoic acid Chemical compound OC(=O)C(=C)CCCCCOC1=CC=CC=C1 FRIXCIPXTGZTQF-UHFFFAOYSA-N 0.000 description 1
- FZKSNEBYWROKGW-UHFFFAOYSA-N 2-methylidene-8-naphthalen-2-yloxyoctanoic acid Chemical compound C1=CC=CC2=CC(OCCCCCCC(=C)C(=O)O)=CC=C21 FZKSNEBYWROKGW-UHFFFAOYSA-N 0.000 description 1
- KXHSOGOYAVRRCD-UHFFFAOYSA-N 2-methylidene-9-phenoxynonanoic acid Chemical compound OC(=O)C(=C)CCCCCCCOC1=CC=CC=C1 KXHSOGOYAVRRCD-UHFFFAOYSA-N 0.000 description 1
- DEDAWPIVFBLZMB-UHFFFAOYSA-N 2-methylideneundecanoic acid Chemical compound CCCCCCCCCC(=C)C(O)=O DEDAWPIVFBLZMB-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- SSXKEHJBNBEPEG-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCCCOc1ccc2ccccc2c1 SSXKEHJBNBEPEG-UHFFFAOYSA-N 0.000 description 1
- RRVUIOWBDBSZRN-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCOc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCCOc1ccccc1 RRVUIOWBDBSZRN-UHFFFAOYSA-N 0.000 description 1
- VSDDKSRFYPEEQP-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCCSc1ccc(cc1)-c1ccccc1 VSDDKSRFYPEEQP-UHFFFAOYSA-N 0.000 description 1
- DYVBMOGPQIHUGZ-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCCCSc1ccc2ccccc2c1 DYVBMOGPQIHUGZ-UHFFFAOYSA-N 0.000 description 1
- WDERPYAIJXUULT-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCCSc1ccccc1 WDERPYAIJXUULT-UHFFFAOYSA-N 0.000 description 1
- AHFVLXXVUOGPFX-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCOc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCOc1ccccc1 AHFVLXXVUOGPFX-UHFFFAOYSA-N 0.000 description 1
- YFXHNEYLAFGFND-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCSc1ccc(cc1)-c1ccccc1 YFXHNEYLAFGFND-UHFFFAOYSA-N 0.000 description 1
- JLWSPVDCNFKFMM-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCCSc1ccc2ccccc2c1 JLWSPVDCNFKFMM-UHFFFAOYSA-N 0.000 description 1
- BYKANGDWNVRDRK-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCCSc1ccccc1 BYKANGDWNVRDRK-UHFFFAOYSA-N 0.000 description 1
- MOUFPEOURCEPMI-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCOc1ccc2ccccc2c1 MOUFPEOURCEPMI-UHFFFAOYSA-N 0.000 description 1
- CKPSMVFDXYWVBN-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCOc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCOc1ccccc1 CKPSMVFDXYWVBN-UHFFFAOYSA-N 0.000 description 1
- HJKXKISHFMFPOQ-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCCSc1ccc2ccccc2c1 HJKXKISHFMFPOQ-UHFFFAOYSA-N 0.000 description 1
- OAKWFIVAACPYGG-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCCSc1ccccc1 OAKWFIVAACPYGG-UHFFFAOYSA-N 0.000 description 1
- AEVKNHBIYHOXAJ-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCOc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCOc1ccc(cc1)-c1ccccc1 AEVKNHBIYHOXAJ-UHFFFAOYSA-N 0.000 description 1
- MQANWZFATDENKV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCCOc1ccc2ccccc2c1 MQANWZFATDENKV-UHFFFAOYSA-N 0.000 description 1
- LKRRTLFVXCYPCY-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCCSc1ccccc1 LKRRTLFVXCYPCY-UHFFFAOYSA-N 0.000 description 1
- RNLARNJVPFTRPF-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCOc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCOc1ccc(cc1)-c1ccccc1 RNLARNJVPFTRPF-UHFFFAOYSA-N 0.000 description 1
- MFXLAEXKGSUXKV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCOc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCOc1ccccc1 MFXLAEXKGSUXKV-UHFFFAOYSA-N 0.000 description 1
- IVKVLVRHTIUQGC-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCSc1ccc(cc1)-c1ccccc1 IVKVLVRHTIUQGC-UHFFFAOYSA-N 0.000 description 1
- XFKXRHOFYXSGLN-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCCSc1ccc2ccccc2c1 XFKXRHOFYXSGLN-UHFFFAOYSA-N 0.000 description 1
- DUOBTCTWHTWCME-UHFFFAOYSA-N OC(=O)C(=C)CCCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCCSc1ccccc1 DUOBTCTWHTWCME-UHFFFAOYSA-N 0.000 description 1
- UIJHKNZZQUOBJC-UHFFFAOYSA-N OC(=O)C(=C)CCCCCOc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCOc1ccc(cc1)-c1ccccc1 UIJHKNZZQUOBJC-UHFFFAOYSA-N 0.000 description 1
- DGYFFMWBSGAKLU-UHFFFAOYSA-N OC(=O)C(=C)CCCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCOc1ccc2ccccc2c1 DGYFFMWBSGAKLU-UHFFFAOYSA-N 0.000 description 1
- KENFGKFYXILXAV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCCSc1ccc(cc1)-c1ccccc1 KENFGKFYXILXAV-UHFFFAOYSA-N 0.000 description 1
- OAGWUNRVEJEVMV-UHFFFAOYSA-N OC(=O)C(=C)CCCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCCSc1ccc2ccccc2c1 OAGWUNRVEJEVMV-UHFFFAOYSA-N 0.000 description 1
- CSNQHLGETBTHAF-UHFFFAOYSA-N OC(=O)C(=C)CCCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCCSc1ccccc1 CSNQHLGETBTHAF-UHFFFAOYSA-N 0.000 description 1
- UADGBPVRRBBFLR-UHFFFAOYSA-N OC(=O)C(=C)CCCCOc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCCOc1ccc(cc1)-c1ccccc1 UADGBPVRRBBFLR-UHFFFAOYSA-N 0.000 description 1
- ZFQZAYGTHPLUNB-UHFFFAOYSA-N OC(=O)C(=C)CCCCOc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCOc1ccc2ccccc2c1 ZFQZAYGTHPLUNB-UHFFFAOYSA-N 0.000 description 1
- WDLUQTVXVZJYGE-UHFFFAOYSA-N OC(=O)C(=C)CCCCSc1ccc2ccccc2c1 Chemical compound OC(=O)C(=C)CCCCSc1ccc2ccccc2c1 WDLUQTVXVZJYGE-UHFFFAOYSA-N 0.000 description 1
- FTZFEPXTKFKSQX-UHFFFAOYSA-N OC(=O)C(=C)CCCCSc1ccccc1 Chemical compound OC(=O)C(=C)CCCCSc1ccccc1 FTZFEPXTKFKSQX-UHFFFAOYSA-N 0.000 description 1
- XDUSRFRPUJYOIU-UHFFFAOYSA-N OC(=O)C(=C)CCCSc1ccc(cc1)-c1ccccc1 Chemical compound OC(=O)C(=C)CCCSc1ccc(cc1)-c1ccccc1 XDUSRFRPUJYOIU-UHFFFAOYSA-N 0.000 description 1
- GSJNBCZKEUYYLK-UHFFFAOYSA-N [phenoxy(phenyl)methyl] prop-2-enoate Chemical compound C=1C=CC=CC=1C(OC(=O)C=C)OC1=CC=CC=C1 GSJNBCZKEUYYLK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- CKFBFQHBUCDOHL-UHFFFAOYSA-N phenoxy(phenyl)methanol Chemical compound C=1C=CC=CC=1C(O)OC1=CC=CC=C1 CKFBFQHBUCDOHL-UHFFFAOYSA-N 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/301—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and one oxygen in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
- C08F220/302—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety and two or more oxygen atoms in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Abstract
The invention discloses a photocuring monomer, a photocuring composition, a packaging film and a display device, belonging to the technical field of photocuring materials and film packaging, wherein the photocuring monomer has the structural general formula:wherein X is CR9Or SiR10(ii) a Y is O, S, NR11Any one of (a); n is any integer from 0 to 20; r1、R2Each independently selected from any one of a single bond, a substituted or unsubstituted alkylene group, a substituted or unsubstituted cycloalkylene group, a substituted or unsubstituted alkylene group, a substituted or unsubstituted ether group, a substituted or unsubstituted arylene group, and a substituted or unsubstituted arylalkylene group. The photo-curing monomer provided by the embodiment of the invention can be used as an organic layer of an encapsulation film, and can effectively isolate moisture and reduce the transmittance of water vapor and gas after curing and encapsulation, so that the service life of a display device is prolonged.
Description
Technical Field
The invention relates to the technical field of photocuring materials and film packaging, in particular to a photocuring monomer, a photocuring composition, a packaging film and a display device.
Background
An OLED (Organic Light Emitting diode), also called Organic Electroluminescent Display (Organic Electroluminescent Display), is used to Display Light. The OLED is a current-type organic light emitting display device, and emits light by injection and recombination of carriers, and the intensity of light emission is proportional to the injected current. Under the action of an electric field, holes generated by an anode and electrons generated by a cathode move, are respectively injected into a hole transport layer and an electron transport layer, and migrate to a light emitting layer. When the two meet at the light emitting layer, energy excitons are generated, thereby exciting the light emitting molecules to finally generate visible light. An organic light emitting display device includes an Organic Light Emitting Device (OLED) composed of a hole injection electrode (anode), an organic light emitting layer, and an electron injection electrode (cathode). This organic light emitting device is generally provided on a glass substrate, and is covered with another substrate in order to prevent deterioration caused by inflow of moisture or oxygen from the outside. Currently, display devices including organic light emitting display devices are becoming thinner and thinner under consumer demand, and Thin Film Encapsulation (TFE) is applied to the cover of the organic light emitting devices in order to meet the demand.
Among other things, the encapsulation process may bond the glass cover plate to the display device through the use of an adhesive, for example, an adhesive with low moisture vapor transmission rate may be used between the substrate and the glass cover plate to extend the lifetime of the device. The cover glass encapsulation process is suitable for rigid devices, but it is clearly unsuitable for devices using flexible support units, such as flexible displays. Furthermore, glass cover plate packaging techniques using adhesives may not be suitable for devices where bare circuitry is present on the substrate, such as Complementary Metal Oxide Semiconductor (CMOS) microdisplays.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a photo-curable monomer to solve the problems in the background art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:
a photo-curable monomer having a general structural formula of formula 1:
wherein X is CR9Or SiR10;
Y is O, S, NR11Any one of (a);
n is any integer from 0 to 20;
R1、R2each independently selected from any one of a single bond, a substituted or unsubstituted alkylene group, a substituted or unsubstituted cycloalkylene group, a substituted or unsubstituted alkylene group, a substituted or unsubstituted ether group, a substituted or unsubstituted arylene group, and a substituted or unsubstituted arylalkylene group;
R3、R4、R5、R6each independently selected from any one of hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted cycloalkyl, substituted or unsubstituted aryl, substituted or unsubstituted heteroaryl, substituted or unsubstituted alkenyl, substituted or unsubstituted alkoxy, substituted or unsubstituted lactone group, substituted or unsubstituted carboxyl group, substituted or unsubstituted glycidyl ether group and hydroxyl group;
Z1and Z2Independently any of the following structures:
preferably, R1、R2Each independently selected from any one of a single bond, a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C3-C30 cycloalkylene group, a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C1-C30 ether group, a substituted or unsubstituted C6-C30 arylene group, and a substituted or unsubstituted C7-C50 arylalkylene group;
R3、R4、R5、R6each independently selected from any one of hydrogen, substituted or unsubstituted C1-C50 alkyl, substituted or unsubstituted C1-C50 cycloalkyl, substituted or unsubstituted C6-C50 aryl, substituted or unsubstituted 3-to 50-membered heteroaryl, substituted or unsubstituted C1-C50 alkenyl, substituted or unsubstituted C1-C30 alkoxy, substituted or unsubstituted lactone group, substituted or unsubstituted carboxyl group, substituted or unsubstituted glycidyl ether group and hydroxyl group.
Preferably, R9、R10Independently any of hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkoxy, aryl and heteroaryl;
R11is any one of hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted alkoxy, aryl and heteroaryl;
R7is hydrogen or methyl; r8Is any one of substituted or unsubstituted alkyl, substituted or unsubstituted alkoxy, substituted or unsubstituted aryl, and substituted or unsubstituted aralkyl; a. the1、A2Each independently selected from O, S or NR12Any one of (1), wherein R12Selected from any one of hydrogen, substituted or unsubstituted alkyl.
Preferably, R9、R10Independently any of hydrogen, substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, C6-C30 aryl, and 4-to 30-membered heteroaryl;
R11is any one of hydrogen, substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, C6-C30 aryl, and 4-to 30-membered heteroaryl;
R8is any one of substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, substituted or unsubstituted C6-C30 aryl, and substituted or unsubstituted C7-C30 aralkyl; r12Selected from any one of hydrogen, substituted or unsubstituted C1-C20 alkyl.
Preferably, the structural formula of the photo-curing monomer is any one of the following structural formulas:
another object of the embodiments of the present invention is to provide a photocurable composition, which comprises at least one acrylic compound and at least one photo-crosslinking initiator, wherein the photocurable composition further comprises the above-mentioned photocurable monomer.
Preferably, the weight percentage of the acrylic compound in the photo-curing composition is 9.5-90%, the weight percentage of the photo-curing monomer is 9.5-90%, and the weight percentage of the photo-crosslinking initiator is 0.5-10%.
Preferably, the acrylic compound is 2-phenoxyethylacrylic acid, 2-phenoxyethyl (meth) acrylic acid, 3-phenoxypropylacrylic acid, 3-phenoxypropyl (meth) acrylic acid, 4-phenoxybutylacrylic acid, 4-phenoxybutyl (meth) acrylic acid, 5-phenoxypentylacrylic acid, 5-phenoxypentyl (meth) acrylic acid, 6-phenoxyhexylacrylic acid, 6-phenoxyhexyl (meth) acrylic acid, 7-phenoxyheptylacrylic acid, 7-phenoxyheptyl (meth) acrylic acid, 8-phenoxyoctylacrylic acid, 8-phenoxyoctyl (meth) acrylic acid, 9-phenoxynonylacrylic acid, 10-phenoxydecylacrylic acid, 10-phenoxydecyl (meth) acrylic acid, 2- (phenylthio) ethacrylic acid, 2- (phenylthio) ethyl (meth) acrylic acid, 3- (phenylthio) propylacrylic acid, 3- (phenylthio) propyl (meth) acrylic acid, 4- (phenylthio) butylacrylic acid, 4- (phenylthio) butyl (meth) acrylic acid, 5- (phenylthio) pentylacrylic acid, 5- (phenylthio) pentyl (meth) acrylic acid, 6- (phenylthio) hexylacrylic acid, 6- (phenylthio) hexyl (meth) acrylic acid, 7- (phenylthio) heptylacrylic acid, 7- (phenylthio) heptylmeth) acrylic acid, 8- (phenylthio) octylacrylic acid, 9- (phenylthio) nonylacrylic acid, 9- (phenylthio) nonyl (meth) acrylic acid, 10- (phenylthio) decylacrylic acid, 10- (phenylthio) decyl (meth) acrylic acid, 2- (naphthalen-2-yloxy) ethacrylic acid, 2- (naphthalen-2-yloxy) ethyl (meth) acrylic acid, 3- (naphthalen-2-yloxy) propylacrylic acid, 3- (naphthalen-2-yloxy) propyl (meth) acrylic acid, 4- (naphthalen-2-yloxy) butylacrylic acid, 4- (naphthalen-2-yloxy) butyl (meth) acrylic acid, 5- (naphthalen-2-yloxy) pentylacrylic acid, 5- (naphthalen-2-yloxy) pentyl (meth) acrylic acid, 6- (naphthalen-2-yloxy) hexylacrylic acid, 6- (naphthalen-2-yloxy) hexyl (meth) acrylic acid, 7- (naphthalen-2-yloxy) heptylacrylic acid, 8- (naphthalen-2-yloxy) octylacrylic acid, 9- (naphthalen-2-yloxy) nonylacrylic acid, 9- (naphthalen-2-yloxy) nonyl (meth) acrylic acid, 10- (naphthalen-2-yloxy) decylacrylic acid, 10- (naphthalen-2-yloxy) decyl (meth) acrylic acid, 2- (naphthalen-2-ylthio) ethacrylic acid, 2- (naphthalen-2-ylthio) ethyl (meth) acrylic acid, 3- (naphthalen-2-ylthio) propylacrylic acid, 3- (naphthalen-2-ylthio) propyl (meth) acrylic acid, 4- (naphthalen-2-ylthio) butylacrylic acid, 4- (naphthalen-2-ylthio) butyl (meth) acrylic acid, 5- (naphthalen-2-ylthio) pentylacrylic acid, 5- (naphthalen-2-ylthio) pentyl (meth) acrylic acid, 6- (naphthalen-2-ylthio) hexylacrylic acid, 6- (naphthalen-2-ylthio) hexyl (meth) acrylic acid, 7- (naphthalen-2-ylthio) heptyl, acrylic acid, 7- (naphthalen-2-ylthio) heptyl (meth) acrylic acid, 8- (naphthalen-2-ylthio) octylacrylic acid, 8- (naphthalen-2-ylthio) octyl (meth) acrylic acid, 9- (naphthalen-2-ylthio) nonylacrylic acid, 9- (naphthalen-2-ylthio) nonyl (meth) acrylic acid, 10- (naphthalen-2-ylthio) decylacrylic acid, 10- (naphthalen-2-ylthio) decyl (meth) acrylic acid, 2- ([1,1 '-biphenyl ] -4-yloxy) ethacrylic acid, 2- ([1,1' -biphenyl ] -4-yloxy) ethyl (meth) acrylic acid, 3- ([1,1 '-biphenyl ] -4-yloxy) propylacrylic acid, 3- ([1,1' -biphenyl ] -4-yloxy) propyl (meth) acrylic acid, 4- ([1,1' -biphenyl ] -4-yloxy) butylacrylic acid, 4- ([1,1' -biphenyl ] -4-yloxy) butyl (meth) acrylic acid, 5- ([1,1' -biphenyl ] -4-yloxy) pentylacrylic acid, 5- ([1,1' -biphenyl ] -4-yloxy) pentyl (meth) acrylic acid, 6- ([1,1' -biphenyl ] -4-yloxy) hexylacrylic acid, 6- ([1,1' -biphenyl ] -4-yloxy) hexyl (meth) acrylic acid, 7- ([1,1' -biphenyl ] -4-yloxy) heptylacrylic acid, 7- ([1,1' -biphenyl ] -4-yloxy) heptyl (meth) acrylic acid, 8- ([1,1' -biphenyl ] -4-yloxy) octyl (meth) acrylic acid, 9- ([1,1' -biphenyl ] -4-yloxy) nonyl (meth) acrylic acid, 10- ([1,1' -biphenyl ] -4-yloxy) decyl (meth) acrylic acid, 2- ([1,1' -biphenyl ] -4-ylthio) ethacrylic acid, 2- ([1,1 '-biphenyl ] -4-ylthio) ethyl (meth) acrylic acid, 3- ([1,1' -biphenyl ] -4-ylthio) propylacrylic acid, 3- ([1,1 '-biphenyl ] -4-ylthio) propyl (meth) acrylic acid, 4- ([1,1' -biphenyl ] -4-ylthio) butylacrylic acid, 5- ([1,1 '-biphenyl ] -4-ylthio) pentylacrylic acid, 5- ([1,1' -biphenyl ] -4-ylthio) pentyl (meth) acrylic acid, 6- ([1,1 '-biphenyl ] -4-ylthio) hexylacrylic acid, 6- ([1,1' -biphenyl ] -4-ylthio) hexyl (meth) acrylic acid, 7- ([1,1 '-biphenyl ] -4-ylthio) heptylacrylic acid, 7- ([1,1' -biphenyl ] -4-ylthio) heptylpropenoic acid, 8- ([1,1 '-biphenyl ] -4-ylthio) octylacrylic acid, 9- ([1,1' -biphenyl ] -4-ylthio) nonylacrylic acid, 10- ([1,1' -biphenyl ] -4-ylthio) decylacrylic acid, 2-hydroxy-2-phenoxyethacrylic acid, 2-hydroxy-2-phenoxyethyl (meth) acrylic acid, 2-hydroxy-2- (naphthalen-2-yloxy) ethacrylic acid, 2-hydroxy-2- (naphthalen-2-yloxy) ethyl (meth) acrylic acid, 2- ([1,1' -biphenyl ] -4-yloxy) ethacrylic acid, 2- ([1,1' -biphenyl ] -4-yloxy) ethyl (meth) acrylic acid, 2- (2-phenoxyethoxy) ethacrylic acid, 2- (2-phenoxyethoxy) ethyl (meth) acrylic acid, 2- (phenoxymethoxy) ethacrylic acid, 2- (phenoxymethoxy) ethyl (meth) acrylic acid, 2- (([1,1 '-biphenyl ] -4-yloxy) methoxy) ethacrylic acid, 2- (([1,1' -biphenyl ] -4-yloxy) methoxy) ethyl (meth) acrylic acid, 2- ((naphthalen-2-yloxy) methoxy) ethacrylic acid, 2- ((naphthalen-2-yloxy) methoxy) ethyl (meth) acrylic acid, 2- ((phenylthio) methoxy) ethacrylic acid, 2- ((phenylthio) methoxy) ethyl (meth) acrylic acid, 2- ((naphthalen-2-ylthio) methoxy) ethacrylic acid, 2- ((naphthalen-2-ylthio) methoxy) ethyl (meth) acrylic acid, 2,2'- (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2'- (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 3,3'- (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) diacrylic acid, 3,3' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 3,3' - (4,4'- (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (diene) bis (propane-3, 1-diene) diacrylate, 3,3' - (4,4'- (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (diene) bis (propane-3, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4'- (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2'- (4,4' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 3,3' - (4,4' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) diacrylate, 3,3' - (4,4' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 3,3' - (4,4' - (4,4' - (9H-fluorene-9), 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) diacrylate, 3,3'- (4,4' - (4,4'- (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (propane-3, 1-diene) bis (2-methacrylic acid), 2,2' - (2,2'- (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene), -1 diene) diacrylic acid, 2,2' - (2,2' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, -1 diene) bis (2-methacrylic acid), 2,2' - (2,2' - (4,4' - (9H-fluorene-9, 9-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, -1 diene) diacrylic acid, 2,2' - (2,2' - (4,4' - (9H-fluorene-9), 9-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, -1 diene) bis (2-methacrylic acid), 2,2' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' -oxybis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' -oxybis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' -thiobis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' -thiobis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (3,3' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (3,3' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (3,3' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2), 1-diene) diacrylic acid, 2,2' - (3,3' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (3,3' - (4,4' -oxybis (4, 1-phenylene) bis (diene)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (3,3' - (4,4' -oxybis (4, 1-phenylene) bis (diene)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2'- (3,3' - (4,4 '-thiobis (4, 1-phenylene) bis (diene)) bis (propane-3, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (4,4'- (propane-2, 2-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene) diacrylate, 2,2' - (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene) bis (2-methacrylate), 2,2' - (2,2' - (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene)) bis (ethane-2, 1-diene) diacrylate, 2,2' - (2,2' - (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2'- (2,2' - (4,4'- (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (2,2'- (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2'- (2,2' - (2,2'- (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2'- (2,2' - (2,2'- (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (oxy) bis (ethane-2, 1-diene)), 1-diene) bis (2-methacrylic acid, 2,2'- (2,2' - (2,2'- (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2'- (2,2' - (2,2'- (4,4' - (propane-2, 2-diene) bis (4, 1-phenylene)) bis (diene) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene)), 1-diene) bis (2-methacrylic acid), 2,2' - (2,2' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2' - (2,2' - (2,2' - (4,4' -oxybis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylate), 2,2' - (2,2' - (2,2' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) diacrylate, 2,2' - (2,2' - (2,2' - (4,4' -thiobis (4, 1-phenylene) bis (oxy)) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), 2,2' - (2,2' - (2,2' - (4), 4 '-thiobis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) bis (oxy) bis (ethane-2, 1-diene) diacrylic acid, 2,2' - (2,2'- (4,4' -thiobis (4, 1-phenylene) bis (diene)) bis (ethane-2, 1-diene) bis (oxy) bis (ethane-2, 1-diene)) bis (oxy) bis (ethane-2, 1-diene) bis (2-methacrylic acid), polyester urethane diacrylate, sapropenyldiacrylate, polyester urethane, epoxyacrylic acid, phenylthioethyl (meth) acrylic acid, at least one of isononyl acrylate, phenoxy-2-methyl- (meth) acrylate, phenoxybenzyl acrylate, 3-pentyloxy-2-methyl-ethyl (meth) acrylate, phenoxybenzyl alcohol, 3-phenoxy-2-stearyloxy (meth) acrylate, 2-1-naphthyloxyethyl (meth) acrylate, 2-2-naphthyloxyethyl (meth) acrylate, 2-1-ethanediol acrylate, 2-2-ethanediol acrylate, trimethylolpropane acrylate, 1, 12-dodecanediol dimethacrylate, 1, 6-ethanediol diacrylate, 1, 10-decanediol diacrylate, 1, 11-undecanediol dimethacrylate, but is not limited thereto.
Preferably, the photo-crosslinking initiator is any one of an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, and a triazine-based compound.
Preferably, the acetophenone compound is at least one of 2,2' -diethoxyacetophenone, 2,2' -dibutoxyacetophenone, 2-hydroxy-2-methylacetophenone, p-butyltrichloroacetophenone, t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2' -dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butandin-1-one.
It is another object of an embodiment of the present invention to provide an encapsulation film including an inorganic layer and an organic layer partially or entirely containing the above-mentioned photocurable composition. The packaging film can be used for packaging the flexible OLED display device.
Preferably, the encapsulation film includes an inorganic layer, an organic layer, and an inorganic layer stacked in this order.
Preferably, the inorganic layer partially or entirely contains an inorganic material such as silicon nitride.
Preferably, the thickness of the encapsulation film is 0.3 to 20 μm.
Another object of an embodiment of the present invention is to provide a display device, which is packaged with the packaging film according to claim 9.
Specifically, the display device may be an organic light emitting device such as an organic light emitting diode.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
the photo-curing monomer provided by the embodiment of the invention can be used as an organic layer of an encapsulation film, can effectively isolate moisture and reduce the transmittance of water vapor and gas after curing and encapsulation, prolongs the service life of a display device, and realizes the purpose of no deviation because the shrinkage stress of a photo-curing composition containing the photo-curing monomer is low after curing. In addition, the light-curing composition can enable various designs of display devices after curing and packaging, and most importantly, can enable thinning.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
The embodiment provides a preparation method of an encapsulation film, which comprises the following steps:
s1, weighing 20g of light-cured monomer L001 (component A), 75g of 3- (naphthalene-2-yloxy) propyl (methyl) acrylic acid (component B) and 5g of 2,2' -dibutoxyacetophenone (component C), mixing together, stirring for 80h at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a light-cured composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein, the structural formula of the photo-curing monomer L001 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the photo-curing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and using the intensity of 100mW/cm2The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
And S4, coating the inorganic layer material on the organic layer by a CVD method to form another inorganic layer, thus obtaining the packaging film.
Example 2
The embodiment provides a preparation method of an encapsulation film, which comprises the following steps:
s1, weighing 20g of light-cured monomer L002 (component A), 75g of 9- (naphthalene-2-oxyl) nonyl acrylic acid and 5g of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butandin-1-one (component C), mixing together, stirring for 80h at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a light-cured composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein the structural formula of the photocuring monomer L002 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the photo-curing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and using the intensity of 100mW/cm2The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the packaging film.
Example 3
The embodiment provides a preparation method of an encapsulation film, which comprises the following steps:
s1, weighing 20g of photocuring monomer L003 (component A), 75g of 2- (2-phenoxyethoxy) ethyl (methyl) acrylic acid (component B) and 5g of 4-chloroacetophenone (component C), mixing, stirring for 80h at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a photocuring composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein the structural formula of the photocuring monomer L003 is as follows:
and S2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the photo-curing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and using the intensity of 100mW/cm2The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the packaging film.
Example 4
The embodiment provides a preparation method of an encapsulation film, which comprises the following steps:
s1, weighing 20g of photo-curing monomer L004 (component A), 75g of 4- ([1,1' -biphenyl ] -4-yl thio) butyl acrylic acid (component B) and 5g of tert-butyl dichloroacetophenone (component C), mixing, stirring for 80h at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a photo-curing composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein the structural formula of the photocuring monomer L004 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the photo-curing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and using the intensity of 100mW/cm2The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the packaging film.
Example 5
This example provides a method for preparing an encapsulation film, which is only different from example 1 in that step S1 is: 30g of a photocurable monomer L001 (component A), 60g of 3- (naphthalen-2-yloxy) propyl (meth) acrylic acid (component B) and 10g of 2,2' -dibutoxyacetophenone (component C) were weighed, mixed together, stirred at 50 ℃ under vacuum for 80 hours, then filtered with a syringe filter, and detected using a particle counter, and when it was detected that the number of particles having a particle size of more than 0.5 μm was not more than 50, a photocurable composition was obtained for use.
Example 6
This example provides a method for preparing an encapsulation film, which is only different from example 2 in that step S1 is: 30g of a photocurable monomer L002 (component A), 60g of 9- (naphthalen-2-yloxy) nonyl acrylic acid and 10g of 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one (component C) were weighed, mixed together, stirred at 50 ℃ under vacuum for 80h, then filtered with a syringe filter, checked with a particle counter, and when no more than 50 particles with a particle size of more than 0.5 μm were detected, a photocurable composition was obtained for use.
Example 7
This example provides a method for preparing an encapsulation film, which is different from example 3 only in that step S1 is: 30g of photocurable monomer L003 (component A), 60g of 2- (2-phenoxyethoxy) ethyl (meth) acrylic acid (component B) and 10g of 4-chloroacetophenone (component C) were weighed out, mixed together, stirred at 50 ℃ under vacuum for 80 hours, then filtered with a syringe filter, and detected using a particle counter, and when no more than 50 particles with a particle size of more than 0.5 μm were detected, a photocurable composition was obtained for use.
Example 8
This example provides a method for preparing an encapsulation film, which is different from example 4 only in that step S1 is: 30g of photocurable monomer L004 (component A), 60g of 4- ([1,1' -biphenyl ] -4-ylthio) butyl acrylic acid (component B) and 10g of tert-butyl dichloroacetophenone (component C) are weighed, mixed together, stirred for 80h under vacuum at 50 ℃, filtered by a syringe filter, detected by a particle counter, and when no more than 50 particles with a particle size of more than 0.5 mu m are detected, a photocurable composition is obtained for later use.
Example 9
This example provides a method for manufacturing an encapsulation film, which is different from example 1 only in that step S1 is: 9.5g of a photocurable monomer L001, 40g of 8- ([1,1 '-biphenyl ] -4-ylthio) octylacrylic acid, 30g of 8- ([1,1' -biphenyl ] -4-ylthio) octylacrylic acid, 20g of 2-2-naphthyloxyethyl (meth) acrylic acid and 0.5g of a commercially available benzophenone compound type photocrosslinking initiator were weighed out and mixed together, stirred under vacuum at 50 ℃ for 80 hours, then filtered with a syringe filter, checked with a particle counter, and when the number of particles having a particle diameter of more than 0.5 μm was detected to be not more than 50, a photocurable composition was obtained for use.
Example 10
This example provides a method for preparing an encapsulation film, which is only different from example 1 in that step S1 is: 90g of a photocurable monomer L001, 5.5g of 1, 10-decanedioldiacrylate, 4g of 1, 11-undecanedioldimethacrylate and 0.5g of a commercially available thioxanthone compound type photocrosslinking initiator were weighed out, mixed together, stirred at 50 ℃ under vacuum for 80 hours, filtered with a syringe filter, and examined with a particle counter, to obtain a photocurable composition for later use when it was detected that the number of particles having a particle size of more than 0.5 μm was not more than 50.
Example 11
This example provides a method for preparing an encapsulation film, which is only different from example 1 in that step S1 is: weighing 45g of a photo-curing monomer L001, 45g of 1, 10-decanediol diacrylate and 10g of a commercially available benzoin compound type photo-crosslinking initiator, mixing together, stirring at 50 ℃ under vacuum for 80h, then filtering with a syringe filter, detecting with a particle counter, and obtaining the photo-curing composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50.
Example 12
This example provides a method for preparing an encapsulation film, which is only different from example 1 in that step S1 is: 40g of a photocurable monomer L001, 55g of 1, 10-decanediol diacrylate and 5g of a commercially available triazine compound type photocrosslinking initiator were weighed out, mixed together, stirred at 50 ℃ under vacuum for 80 hours, then filtered with a syringe filter, checked with a particle counter, and when it was detected that the number of particles having a particle size of more than 0.5 μm was not more than 50, a photocurable composition was obtained for use.
Comparative example 1
This comparative example provides a method for producing an encapsulation film, which is different from example 1 only in that step S1 is: 98g of 3- (naphthalen-2-yloxy) propyl (meth) acrylic acid (component B) and 2g of 2,2' -dibutoxyacetophenone (component C) were weighed out, mixed together, stirred under vacuum at 50 ℃ for 80 hours, then filtered with a syringe filter, examined using a particle counter, and when it was detected that the number of particles having a particle size of more than 0.5 μm was not more than 50, a photocurable composition was obtained for use.
Performance evaluation:
first, the water vapor transmission rates of the sealing films obtained in examples 1 to 8 and comparative example 1 were measured, and the measurement results are shown in table 1. Wherein, the detecting instrument: the manufacturer is a high-precision water vapor transmission rate tester with model number of AQUARAN2, manufactured by MOCON corporation (American Membrane health corporation); detection conditions are as follows: the temperature is 85 ℃, and the relative humidity is 85%; detection duration: for 24 hours.
Second, the light transmittance of the sealing films prepared in examples 1 to 8 and comparative example 1 was measured, and the measurement results are shown in table 1. Wherein, the detecting instrument: a light transmittance tester; detection conditions are as follows: the temperature was 40 ℃ and the relative humidity was 85%.
TABLE 1
As can be seen from table 1, examples 1 to 8 are different from comparative example 1 in that the photocurable monomers provided in examples 1 to 8 are added, and a comparison shows that the water vapor transmission rate of the encapsulation film after the addition of the photocurable monomers provided in examples of the present invention is significantly lower than that of the encapsulation film without the addition of the photocurable monomers provided in examples of the present invention; therefore, the display device packaged by the packaging film can effectively isolate moisture, so that the service life of the display device can be prolonged.
In another embodiment of the present invention, there is also provided a display device which encapsulates the above encapsulation film. Specifically, the display device may be an organic light emitting device such as an organic light emitting diode, and may include a substrate (which may be indium tin oxide or the like), an organic light emitting diode formed on the substrate, and the encapsulation film provided in the above embodiment encapsulated on the organic light emitting diode.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. A photo-curing monomer, wherein the general structural formula of the photo-curing monomer is formula 1:
wherein X is CR9;
Y is O, S, NR11Any one of (a);
n is any integer from 0 to 20;
R1、R2each independently selected from a single bond, a substituted or unsubstituted C1-C30 alkylene group, a substituted or unsubstituted C3-C30 cycloalkylene group, a substituted or unsubstituted C1-C30 ether group, a substituted or unsubstituted C6-C30 arylene group, and a substituted or unsubstituted C7-C50 arylalkylene group;
R3、R4、R5、R6each independently selected from hydrogen, substituted or unsubstituted C1-C50 alkyl, substituted or unsubstituted C1-C50 cycloalkyl, substituted or unsubstituted C6-C50 aryl, substituted or unsubstituted 3-to 50-membered heteroaryl, substituted or unsubstituted C1-C50 alkenyl, substituted or unsubstituted C1-C30 alkoxy, substituted or unsubstitutedAny one of a substituted lactone group, a substituted or unsubstituted carboxyl group, a substituted or unsubstituted glycidyl ether group, and a hydroxyl group;
Z1and Z2Independently any of the following structures:
R9is any one of hydrogen, substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, C6-C30 aryl, and 4-to 30-membered heteroaryl;
R11is any one of hydrogen, substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, C6-C30 aryl, and 4-to 30-membered heteroaryl;
R7is hydrogen or methyl; a. the1、A2Each independently selected from O, S or NR12Any one of (a); r8Is any one of substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 alkoxy, substituted or unsubstituted C6-C30 aryl, and substituted or unsubstituted C7-C30 aralkyl; r12Selected from any one of hydrogen, substituted or unsubstituted C1-C20 alkyl.
3. a photocurable composition comprising at least one acrylic compound and at least one photocrosslinking initiator, characterized in that it further comprises a photocurable monomer according to any one of claims 1-2.
4. The photo-curable composition according to claim 3, wherein the photo-curable composition comprises 9.5 to 90 wt% of the acrylic compound, 9.5 to 90 wt% of the photo-curable monomer, and 0.5 to 10 wt% of the photo-crosslinking initiator.
5. The photocurable composition according to claim 3, wherein the photocrosslinking initiator is any one of an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, and a triazine-based compound.
6. An encapsulation film comprising an inorganic layer and an organic layer, wherein the organic layer partially or entirely contains the photocurable composition according to any one of claims 3 to 5.
7. A display device, wherein the encapsulation film according to claim 6 is encapsulated over the display device.
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