CN113234100B - Silicon-containing monomer, packaging composition, packaging structure and photoelectric device - Google Patents
Silicon-containing monomer, packaging composition, packaging structure and photoelectric device Download PDFInfo
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- CN113234100B CN113234100B CN202110491255.2A CN202110491255A CN113234100B CN 113234100 B CN113234100 B CN 113234100B CN 202110491255 A CN202110491255 A CN 202110491255A CN 113234100 B CN113234100 B CN 113234100B
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- 239000000178 monomer Substances 0.000 title claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000000203 mixture Substances 0.000 title claims abstract description 31
- 125000003118 aryl group Chemical group 0.000 claims abstract description 3
- 239000012044 organic layer Substances 0.000 claims description 27
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 5
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000012957 2-hydroxy-2-methyl-1-phenylpropanone Substances 0.000 claims description 3
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 2
- 125000001072 heteroaryl group Chemical group 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 125000000686 lactone group Chemical group 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- NWWQVENFTIRUMF-UHFFFAOYSA-N diphenylphosphanyl 2,4,6-trimethylbenzoate Chemical compound CC1=CC(C)=CC(C)=C1C(=O)OP(C=1C=CC=CC=1)C1=CC=CC=C1 NWWQVENFTIRUMF-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 239000010409 thin film Substances 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 39
- 239000010410 layer Substances 0.000 description 33
- 238000000034 method Methods 0.000 description 20
- 238000005229 chemical vapour deposition Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000002156 mixing Methods 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 10
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 8
- 238000001914 filtration Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 238000005303 weighing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- -1 2,4, 6-trimethylbenzoyl diphenyl phosphonite Chemical compound 0.000 description 4
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical class C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 125000004386 diacrylate group Chemical group 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- IGGZRGUPRFINQE-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxy-3-propoxypropyl) prop-2-enoate Chemical compound CCCOC(OC(=O)C=C)C(C)(C)COC(=O)C=C IGGZRGUPRFINQE-UHFFFAOYSA-N 0.000 description 1
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- JOWLLZXFBDTISW-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol methyl prop-2-eneperoxoate Chemical class C(C=C)(=O)OOC.OCC(C)(CO)C JOWLLZXFBDTISW-UHFFFAOYSA-N 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- LELKUNFWANHDPG-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;prop-2-enoic acid Chemical compound OC(=O)C=C.C1OC1COCC1CO1 LELKUNFWANHDPG-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VALXVSHDOMUUIC-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phosphoric acid Chemical compound OP(O)(O)=O.CC(=C)C(O)=O VALXVSHDOMUUIC-UHFFFAOYSA-N 0.000 description 1
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical class C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- XAHHPYJTLUQPKK-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)O.C(C)O.C(C)O.C(C=1C(C(=O)O)=CC=CC1)(=O)O Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.C(C)O.C(C)O.C(C=1C(C(=O)O)=CC=CC1)(=O)O XAHHPYJTLUQPKK-UHFFFAOYSA-N 0.000 description 1
- 241000948268 Meda Species 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- 229920002582 Polyethylene Glycol 600 Polymers 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- NBTQSAHFCNTNFP-UHFFFAOYSA-N [4-hydroxy-3,3-bis(hydroxymethyl)-1,1-di(prop-2-enoyloxy)butyl] prop-2-enoate Chemical compound C(C=C)(=O)OC(CC(CO)(CO)CO)(OC(C=C)=O)OC(C=C)=O NBTQSAHFCNTNFP-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 150000002009 diols Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packages (AREA)
Abstract
The invention discloses a silicon-containing monomer, a packaging composition, a packaging structure and a photoelectric device, belonging to the technical field of light-cured materials and thin film packaging, wherein the silicon-containing monomer has a structural general formula as follows:
Description
Technical Field
The invention relates to the technical field of light-cured materials and thin film packaging, in particular to a silicon-containing monomer, a packaging composition, a packaging structure and a photoelectric device.
Background
Organic Light-Emitting Diodes (OLEDs) can be fabricated on flexible, lightweight, durable plastic substrates, can achieve truly flexible display, and can be widely applied to high-performance displays.
One of the biggest problems of the current stage of OLEDs is short lifetime, which is prone to failure. One of the main factors influencing the service life of the OLED is that moisture and oxygen exist inside the OLED device after long-term use, and the existing photoelectric device has the problem of high moisture transmittance. Therefore, in order to increase the lifespan of the OLED, improving the encapsulation process of the OLED is the most direct and effective method.
The existing structure for packaging the OLED is generally formed by bonding a glass or metal packaging cover plate with an OLED substrate through epoxy resin, and the epoxy resin can play a certain role in blocking, but still has the problems of high water vapor transmission rate, low light transmittance and the like.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a silicon-containing monomer to solve the above problems in the background art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:
a silicon-containing monomer has a general structural formula of formula 1:
in the formula, R 3 ～R 8 Wherein at least one group has a formula 2, and each of the remaining groups is independently at least one of hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted hydroxyalkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heteroaryl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted lactone group, a substituted or unsubstituted carboxyl group, a substituted or unsubstituted glycidyl ether group, and a hydroxyl group:
n 1 、n 2 、n 3 、n 4 、n 5 are all natural numbers;
R 1 、R 2 and R 11 Independently alkyl of the same or different number of carbon atoms;
R 9 、R 10 and R 12 Independently hydrogen or methyl, is a binding site;
A 1 and A 2 Independently a group of any one of the formulae A001 to A003:
preferably, n is 2 、n 3 、n 4 Are not more than 1.
Preferably, R 11 Is C1-C10 alkyl.
Preferably, the structure of the silicon-containing monomer is at least one of the following structural formulas:
it is another object of an embodiment of the present invention to provide an encapsulating composition, which includes a photo-curable monomer and a photo-crosslinking initiator, and further includes the above silicon-containing monomer.
Preferably, the weight percentage of the photocuring monomer in the packaging composition is 15-75%, the weight percentage of the silicon-containing monomer is 15-80%, and the weight percentage of the photocrosslinking initiator is 1-10%.
Preferably, the photo-crosslinking initiator is at least one of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide (TPO), 2-hydroxy-2-methyl-1-phenylpropanone (1173), 2,4, 6-trimethylbenzoyl diphenyl phosphonite.
Preferably, the photo-curable monomer is an acrylate.
Specifically, the photo-curable monomer is at least one of monofunctional (meth) acrylate of C1 to C30 monohydric or polyhydric alcohol, difunctional (meth) acrylate of C2 to C30 monohydric or polyhydric alcohol, and polyfunctional (meth) acrylate of C3 to C30 monohydric or polyhydric alcohol.
Preferably, the monofunctional (meth) acrylate may be Lauryl Acrylate (LA), ethoxyethoxyethyl acrylate [ (EOEOEA) -KPX A007], Butyl Acrylate (BA), hydroxyethyl acrylate and isobornyl acrylate, ethoxylated tetrahydrofurfuryl acrylate [ (THF (EO) A) -KPX A015], methacrylate phosphate and isobornyl methacrylate, and the like.
The bifunctional (meth) acrylates are mostly diol structures, and mainly include ethylene glycol diacrylates, propylene glycol diacrylates and other diol diacrylates. The concrete structure is as follows: diethylene glycol diacrylate (DEGDA), triethylene glycol diacrylate (TEGDA), ethylene glycol diacrylate, polyethylene glycol (200) diacrylate [ PEG (200) DA ], polyethylene glycol (400) diacrylate [ PEG (400) DA ], polyethylene glycol (600) diacrylate [ PEG (600) DA ], neopentyl glycol diacrylate, propoxy neopentyl glycol diacrylate, 1, 6-hexanediol diacrylate (HDDA), 1, 4-butanediol diacrylate (BDDA), 20 (ethoxy) bisphenol a diacrylate [ bpa (eo)20DA ], glycerol diacrylate (TPGDA).
The multifunctional (meth) acrylate may be trimethylolpropane triacrylate (TMPTA), pentaerythritol triacrylate (PETA), trimethylolpropane triol triacrylate (TMPTMA), trimethylolpropane triacrylate, propoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate and propoxylated pentaerythritol triacrylate, ditrimethylolpropane tetraacrylate, triethylene glycol dimethacrylate, long chain aliphatic glycidyl ether acrylate, dipentaerythritol hexaacrylate, tripropylene glycol diacrylate, phthalic acid diethanol diacrylate (PDDA), ethoxylated trimethylolpropane triacrylate [ TMP (EO) TMA ], propoxylated trimethylolpropane triacrylate [ TMP PO) TMA ], propoxylated glycerol triacrylate [ G (PO) TA ], Tris (2-hydroxyethyl) isocyanurate triacrylate, ethoxylated neopentyl glycol methoxy monoacrylate [ TMP (PO) MEDA ], and the like.
It is another object of the embodiments of the present invention to provide an encapsulation structure, which includes an organic layer, wherein the organic layer partially or completely contains the above encapsulation composition.
It is another object of embodiments of the present invention to provide an optoelectronic device, which includes a functional structure and the above-mentioned package structure.
Preferably, the optoelectronic device may be any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor, and a photodetector.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
compared with a monomer without benzene ring and silicon atom, the silicon-containing monomer provided by the embodiment of the invention has better heat resistance and transparency, and lower water vapor transmission rate and oxygen transmission rate, and on the other hand, the excessive shrinkage volume generated when the packaging composition is cured is reduced.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1
The embodiment provides a method for manufacturing a package structure, which includes the following steps:
s1, weighing 20g of silicon-containing monomer 001, 75g of lauryl acrylate and 5g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, mixing, stirring for 80 hours at 50 ℃ in vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein, the structural formula of the silicon-containing monomer 001 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the sealing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and mixing the organic layer and the inorganic layer at an intensity of 100mW/cm 2 The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the thin film type packaging structure.
Example 2
The embodiment provides a method for manufacturing a package structure, which includes the following steps:
s1, weighing 20g of silicon-containing monomer 002, 75g of 1, 6-hexanediol diacrylate and 5g of 2-hydroxy-2-methyl-1-phenyl acetone, mixing, stirring for 80h at 50 ℃ under vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein, the structural formula of the silicon-containing monomer 002 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the sealing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and mixing the organic layer and the inorganic layer at an intensity of 100mW/cm 2 The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
And S4, coating the inorganic layer material on the organic layer by a CVD method to form another inorganic layer, thus obtaining the thin film type packaging structure.
Example 3
The embodiment provides a method for manufacturing a package structure, which includes the following steps:
s1, weighing 20g of silicon-containing monomer 003, 75g of diethylene glycol diacrylate and 5g of 2,4, 6-trimethylbenzoyl diphenyl phosphonite, mixing together, stirring for 80 hours at 50 ℃ under vacuum, then filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50; wherein, the structural formula of the silicon-containing monomer 003 is as follows:
s2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the sealing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and mixing the organic layer and the inorganic layer at an intensity of 100mW/cm 2 The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the thin film type packaging structure.
Example 4
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 1 only in that step S1 is: 30g of silicon-containing monomer 001, 60g of lauryl acrylate and 10g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide are weighed, mixed together, stirred for 80 hours at 50 ℃ under vacuum, then filtered by a syringe filter, detected by using a particle counter, and when the number of particles with the particle size of more than 0.5 μm is detected to be not more than 50, a packaged composition is obtained for later use.
Example 5
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 2 only in that step S1 is: weighing 30g of silicon-containing monomer 002, 60g of 1, 6-hexanediol diacrylate and 10g of 2-hydroxy-2-methyl-1-phenyl acetone, mixing together, stirring for 80h at 50 ℃ under vacuum, then filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50.
Example 6
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 3 only in that step S1 is: 30g of silicon-containing monomer 003, 60g of diethylene glycol diacrylate and 10g of 2,4, 6-trimethylbenzoyl diphenyl phosphonite are weighed out, mixed together, stirred for 80h at 50 ℃ under vacuum, filtered by means of a syringe filter, checked by means of a particle counter, and when no more than 50 particles with a particle size of more than 0.5 μm are detected, a packaged composition is obtained and ready for use.
Example 7
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 1 only in that step S1 is: 15g of silicon-containing monomer 001, 75g of lauryl acrylate, 5g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide and 5g of 2-hydroxy-2-methyl-1-phenylpropanone are weighed, mixed together, stirred for 80h at 50 ℃ under vacuum, filtered by a syringe filter, detected by a particle counter, and when no more than 50 particles with a particle size of more than 0.5 μm are detected, a packaged composition is obtained for use.
Example 8
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 1 only in that step S1 is: weighing 80g of silicon-containing monomer 001, 15g of lauryl acrylate and 5g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, mixing together, stirring for 80h at 50 ℃ under vacuum, then filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50.
Example 9
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 1 only in that step S1 is: 54g of silicon-containing monomer 001, 45g of lauryl acrylate and 1g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide are weighed and mixed together, stirred for 80 hours at 50 ℃ under vacuum, filtered by a syringe filter, detected by a particle counter, and when the number of particles with the particle size of more than 0.5 μm is detected to be not more than 50, a packaged composition is obtained for later use.
Example 10
This embodiment provides a method for manufacturing a package structure, which is different from embodiment 2 only in that step S1 is: 60g of silicon-containing monomer 002, 35g of lauryl acrylate and 5g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide are weighed and mixed together, stirred for 80 hours at 50 ℃ under vacuum, then filtered by a syringe filter, detected by a particle counter, and when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50, a packaging composition is obtained for later use.
Example 11
The embodiment provides a method for manufacturing a package structure, which includes the following steps:
s1, weighing 30g of silicon-containing monomer 002, 45g of 1, 6-hexanediol diacrylate, 20g of lauryl acrylate, 2g of 2-hydroxy-2-methyl-1-phenyl acetone, 2g of 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide and 1g of 2,4, 6-trimethylbenzoyl diphenyl phosphonite, mixing together, stirring for 70 hours at 45 ℃ under vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining an encapsulated composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50.
S2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3 ink-jet printing the sealing compositionSpraying onto the surface of the inorganic layer to form an organic layer, and applying an intensity of 90mW/cm 2 The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the thin film type packaging structure.
Example 12
The embodiment provides a method for manufacturing a package structure, which includes the following steps:
s1, weighing 55g of silicon-containing monomer 003, 40g of 1, 6-hexanediol diacrylate and 5g of 2-hydroxy-2-methyl-1-phenyl acetone, mixing together, stirring for 90 hours at 60 ℃ under vacuum, filtering by using a syringe filter, detecting by using a particle counter, and obtaining a packaging composition for later use when the number of particles with the particle size of more than 0.5 mu m is detected to be not more than 50.
S2, selecting silicon nitride as an inorganic layer material, and coating the inorganic layer material on the surface of the object to be packaged by a Chemical Vapor Deposition (CVD) method to form the inorganic layer.
S3, spraying the sealing composition on the surface of the inorganic layer by an ink-jet printer to form an organic layer, and using the intensity of 110mW/cm 2 The organic layer was irradiated with ultraviolet light for 10 seconds each time to harden the organic layer.
S4, coating the inorganic layer material on the organic layer by CVD method to form another inorganic layer, and obtaining the thin film type packaging structure.
Comparative example 1
This comparative example provides a method for manufacturing a package structure, which is different from example 1 only in that step S1 is: weighing 98g of lauryl acrylate and 2g of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, mixing together, stirring for 80h at 50 ℃ under vacuum, filtering with a syringe filter, detecting with a particle counter, and obtaining a packaging composition for later use when the number of particles with a particle size of more than 0.5 μm is not more than 50.
Test example:
first, the water vapor transmission rate of the package structures prepared in examples 1 to 6 and comparative example 1 was measured, and the measurement results are shown in table 1. Wherein, the detecting instrument: the manufacturer is a high-precision water vapor transmission rate tester with model number of AQUARAN2, manufactured by MOCON corporation (American Membrane health corporation); detection conditions are as follows: the temperature is 85 ℃, and the relative humidity is 85%; detection duration: for 24 hours.
Second, the light transmittance of the package structures prepared in examples 1 to 6 and comparative example 1 was measured, and the measurement results are shown in table 1. Wherein, the detecting instrument: a light transmittance tester; detection conditions are as follows: the temperature was 40 ℃ and the relative humidity was 85%.
TABLE 1
| Group of | Water vapor transmission rate (g/m) 2 ·d) | Light transmittance (%) |
| Example 1 | 4.8*10 -4 | 86 |
| Example 2 | 4.9*10 -4 | 85 |
| Example 3 | 4.3*10 -4 | 86 |
| Example 4 | 4.5*10 -4 | 87 |
| Example 5 | 4.8*10 -4 | 85 |
| Example 6 | 4.9*10 -4 | 87 |
| Comparative example 1 | 9.0*10 -3 | 86 |
As can be seen from table 1, examples 1 to 6 are different from comparative example 1 in that the silicon-containing monomers provided in examples 1 to 6 are added, and a comparison shows that the water vapor transmission rate of the package structure after the silicon-containing monomers provided in examples of the present invention are added is obviously lower than that of the package structure without the silicon-containing monomers provided in examples of the present invention; therefore, the photoelectric device packaged by the packaging structure can effectively isolate moisture, so that the service life of the photoelectric device can be prolonged.
In another embodiment of the present invention, there is also provided an optoelectronic device comprising a functional structure and the above-described encapsulation structure. Specifically, the optoelectronic device may be any one of an electroluminescent device, a photoluminescent device, a lighting device, a light emitting diode, a solar cell, a thin film transistor, and a photodetector, but is not limited thereto.
In light of the foregoing description of the preferred embodiment of the present invention, many modifications and variations will be apparent to those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (9)
1. A silicon-containing monomer, wherein the structural formula of the silicon-containing monomer is formula 1:
in the formula, R 3 ～R 8 Wherein at least one group has a formula 2, and each of the remaining groups is independently at least one of hydrogen, a substituted or unsubstituted alkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted hydroxyalkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted heteroaryl group, a substituted or unsubstituted alkenyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted lactone group, a substituted or unsubstituted carboxyl group, a substituted or unsubstituted glycidyl ether group, and a hydroxyl group:
n 1 、n 2 、n 3 、n 4 、n 5 all are natural numbers not greater than 1;
R 1 、R 2 and R 11 Independently alkyl of the same or different number of carbon atoms;
R 9 、R 10 and R 12 Independently hydrogen or methyl, is a binding site;
A 1 and A 2 Independently a group of any one of the formulae A001 to A003:
2. the silicon-containing monomer according to claim 1, wherein the monomer is selected from the group consisting of，R 11 Is C1-C10 alkyl.
3. The silicon-containing monomer according to claim 1, wherein the structure of the silicon-containing monomer is at least one of the following structural formulas:
4. an encapsulating composition comprising a photo-curable monomer and a photo-crosslinking initiator, characterized by further comprising a silicon-containing monomer according to any one of claims 1 to 3.
5. A packaging composition according to claim 4, wherein the photocurable monomer is present in an amount of 15-75% by weight, the silicon-containing monomer is present in an amount of 15-80% by weight, and the photo-crosslinking initiator is present in an amount of 1-10% by weight.
6. A packaging composition according to claim 4, wherein the photo-crosslinking initiator is at least one of 2,4, 6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenylpropanone, 2,4, 6-trimethylbenzoyl diphenylphosphinite.
7. A packaging composition according to claim 4, wherein the photocurable monomer is an acrylate.
8. An encapsulation structure comprising an organic layer, characterized in that said organic layer partially or totally comprises an encapsulation composition according to any one of claims 4 to 7.
9. An optoelectronic device comprising a functional structure, further comprising the encapsulation structure of claim 8.
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