CN113400497A - Monocrystalline silicon evolution cutting operation mechanism and monocrystalline silicon evolution cutting machine - Google Patents
Monocrystalline silicon evolution cutting operation mechanism and monocrystalline silicon evolution cutting machine Download PDFInfo
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- CN113400497A CN113400497A CN202110619176.5A CN202110619176A CN113400497A CN 113400497 A CN113400497 A CN 113400497A CN 202110619176 A CN202110619176 A CN 202110619176A CN 113400497 A CN113400497 A CN 113400497A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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Abstract
The invention relates to a monocrystalline silicon squaring and cutting running mechanism and a monocrystalline silicon squaring and cutting machine, wherein the cutting running mechanism comprises a cutting wheel train and a cutting line, and the cutting wheel train comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set and a second guide wheel set; the first cutting wheel set comprises a first cutting wheel and a second cutting wheel; the second cutting wheel group comprises a third cutting wheel and a fourth cutting wheel; the first guide wheel set is used for guiding the cutting line on the first cutting line to the third cutting wheel; the second guide wheel set is used for guiding the cutting line on the second cutting line to the fourth cutting wheel; the cutting lines respectively form mutually perpendicular cutting sections between the first cutting wheel and the second cutting wheel and between the third cutting wheel and the fourth cutting wheel. The bending angle of the diamond cutting line is reduced, the cutting line is prevented from working under the condition of being at a larger bending angle for a long time, and the service life of the cutting line is prolonged.
Description
Technical Field
The invention relates to the technical field of hard material cutting, in particular to a monocrystalline silicon squaring and cutting operation mechanism and a monocrystalline silicon squaring and cutting machine.
Background
In the prior art, brittle and hard materials such as stone, silicon crystal and the like are cut by adopting diamond. The cutting wheel train comprises a plurality of cutting wheels, and the diamond wire is in the wire casing of locating on the cutting wheel train for the closed annular line structure of cutting of head and the tail, and the diamond wire of drive is linear motion after the cutting wheel train is rotatory. In the existing annular diamond wire squaring cutting machine, two cutting operation mechanisms are usually adopted, wherein the cutting operation mechanisms only adopt two cutting wheels and one annular diamond wire, only 2 surfaces of the single crystal silicon rod can be cut at one time, or a cutting wheel train with a plurality of multi-wheel system mechanisms for bending and distributing the annular diamond wire is adopted, so that the cutting of the single crystal silicon rod is realized; the annular diamond wires are arranged in a bending mode in the existing cutting operation mechanism, and due to the limitation of the size of the single crystal silicon rod, the bending angle of the diamond wires on the cutting wheel is large, and the service life of the diamond wires is further shortened.
Disclosure of Invention
Therefore, a monocrystalline silicon evolution cutting operation mechanism and a monocrystalline silicon evolution cutting machine are needed to be provided, and the problem that the service life is shortened due to the fact that a diamond wire is bent greatly in the existing annular diamond wire evolution cutting machine is solved.
In order to achieve the above object, the inventor provides a monocrystalline silicon squaring and cutting operation mechanism, which comprises a cutting wheel train and a cutting line, wherein the cutting wheel train comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set and a second guide wheel set;
the first cutting wheel set comprises a first cutting wheel and a second cutting wheel which are arranged oppositely;
the second cutting wheel group comprises a third cutting wheel and a fourth cutting wheel which are oppositely arranged;
the cutting direction of the first cutting wheel is vertical to that of the third cutting wheel;
the cutting line is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set and the second guide wheel set;
the first guide wheel set is arranged between the first cutting wheel and the third cutting wheel and is used for guiding the cutting line on the first cutting line to the third cutting wheel;
the second guide wheel set is arranged between the second cutting wheel and the fourth cutting wheel and is used for guiding the cutting line on the second cutting line to the fourth cutting wheel;
the cutting lines respectively form mutually perpendicular cutting sections between the first cutting wheel and the second cutting wheel and between the third cutting wheel and the fourth cutting wheel.
Further optimize, the cutting train is two, and two cutting trains set up relatively, and the cutting section of two cutting trains becomes the groined type along the projection of cutting direction.
Still provide another technical scheme: a monocrystalline silicon squaring cutting machine comprises an underframe, a cutting work bench, a cutting operation mechanism and a cutting head frame;
the cutting workbench rack is arranged on the bottom frame and used for placing a silicon single crystal rod to be cut;
the cutting operation mechanism comprises a cutting wheel train, a cutting line, a fixing plate, a sliding seat plate and a wheel train bracket;
the bottom of the fixing plate is provided with a through hole for the silicon single crystal rod to be cut to pass through;
the fixed plate is connected with the sliding seat plate, and the sliding seat plate is arranged on the cutting head frame in a sliding manner;
the cutting wheel train is arranged on the wheel train support and comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set and a second guide wheel set;
the first cutting wheel set comprises a first cutting wheel and a second cutting wheel which are arranged oppositely;
the second cutting wheel group comprises a third cutting wheel and a fourth cutting wheel which are oppositely arranged;
the cutting direction of the first cutting wheel is vertical to that of the third cutting wheel;
the cutting line is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set and the second guide wheel set;
the first guide wheel set is arranged between the first cutting wheel and the third cutting wheel and is used for guiding the cutting line on the first cutting line to the third cutting wheel;
the second guide wheel set is arranged between the second cutting wheel and the fourth cutting wheel and is used for guiding the cutting line on the second cutting line to the fourth cutting wheel;
the cutting lines respectively form mutually vertical cutting sections on the through holes of the fixing plate between the first cutting wheel and the second cutting wheel and between the third cutting wheel and the fourth cutting wheel;
the cutting head frame is arranged on the bottom frame.
Further optimize, the cutting train is two, and two cutting trains set up relatively, and the cutting section of two cutting trains becomes the groined type along the projection of cutting direction.
Further preferably, the cutting head frame comprises a running support and a driving mechanism;
the sliding seat plate is arranged on the running bracket in a sliding manner;
the driving mechanism is arranged between the sliding seat plate and the operation support and is used for driving the sliding seat plate to move up and down along the operation support.
Further optimizing, the driving mechanism comprises a transmission screw rod and a driving motor;
the driving motor is arranged on the operation support and is in transmission connection with the transmission screw rod, and the driving motor is used for driving the transmission screw rod to rotate;
the sliding seat plate is provided with a guide hole, and the guide hole is in threaded connection with the transmission screw rod.
Further optimize, driving motor passes through the speed reducer transmission and connects in the transmission lead screw.
Further optimization, guide rails are arranged on two sides of the operation support;
the two sides of the sliding seat board are provided with sliding blocks, and the sliding seat board is arranged on a guide rail of the operation support in a sliding mode through the sliding blocks.
Further optimizing, the device also comprises a tensioning mechanism, wherein one guide wheel in the first guide wheel set or the second guide wheel set is a tensioning wheel;
the tensioning mechanism is in transmission connection with the tensioning wheel and is used for tensioning the cutting line.
Further preferably, one of the first cutting wheel, the second cutting wheel, the third cutting wheel and the fourth cutting wheel is a driving wheel.
Different from the prior art, in the above technical scheme, the cutting line is arranged between the first cutting wheel group, the second cutting wheel group, the first guide wheel group and the second guide wheel group, and mutually perpendicular cutting sections are respectively formed on the first cutting wheel group and the second cutting wheel group for cutting the single crystal silicon rod, and because the first cutting wheel and the second cutting wheel are oppositely arranged, the third cutting wheel and the fourth cutting wheel are oppositely arranged, and the cutting direction of the first cutting wheel is mutually perpendicular to the cutting direction of the third cutting wheel, the distance between the first cutting wheel and the third cutting wheel and the distance between the second cutting wheel and the fourth cutting wheel are not influenced by the size of the single crystal silicon rod, and then the first guide wheel group guides the cutting line between the first cutting wheel and the third cutting wheel and the second guide wheel group guides the cutting line between the second cutting wheel and the fourth cutting wheel, the bending angle of the diamond cutting line is reduced, the cutting line is prevented from working under the condition of being at a larger bending angle for a long time, and the service life of the cutting line is prolonged.
Drawings
FIG. 1 is a schematic structural diagram of a single crystal silicon squaring and cutting operation mechanism according to an embodiment;
FIG. 2 is another schematic structural diagram of a single crystal silicon squaring and cutting operating mechanism according to an embodiment;
FIG. 3 is a schematic structural diagram of a single crystal silicon squaring and cutting machine according to an embodiment;
FIG. 4 is another schematic structural diagram of a monocrystalline silicon squaring and cutting machine according to an embodiment;
FIG. 5 is another schematic structural diagram of a single crystal silicon squaring and cutting machine according to an embodiment;
FIG. 6 is a schematic diagram of a cutting mechanism according to an embodiment;
fig. 7 is another schematic structural diagram of the cutting operation mechanism according to the embodiment.
Description of reference numerals:
100. a cutting operation mechanism;
111. a first cutting wheel 112, a second cutting wheel 113, a third cutting wheel 114 and a fourth cutting wheel;
121. a first guide wheel set 122 and a second guide wheel set;
130. a cutting line, 131, a cutting segment;
140. a fixing plate 141, a through hole;
150. a sliding seat plate 151, a sliding block 152 and a guide hole;
160. a gear train bracket;
200. a bottom frame,
300. Cutting the working table frame;
400. a cutting head frame;
410. a running carriage 411, a guide rail;
420. the driving mechanism 421, the driving motor 422, the transmission screw rod 423 and the speed reducer.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1-2, the present embodiment provides a single crystal silicon squaring and cutting operation mechanism, which includes a cutting wheel train and a cutting line 130, wherein the cutting wheel train includes a first cutting wheel set, a second cutting wheel set, a first guiding wheel set 121 and a second guiding wheel set 122;
the first cutting wheel set comprises a first cutting wheel 111 and a second cutting wheel 112, and the first cutting wheel 111 and the second cutting wheel 112 are oppositely arranged;
the second cutting wheel group comprises a third cutting wheel 113 and a fourth cutting wheel 114, and the third cutting wheel 113 and the fourth cutting wheel 114 are oppositely arranged;
the cutting direction of the first cutting wheel 111 is perpendicular to the cutting direction of the third cutting wheel 113;
the cutting line 130 is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set 121 and the second guide wheel set 122;
the first guide wheel set 121 is arranged between the first cutting wheel 111 and the third cutting wheel 113, and the first guide wheel set 121 is used for guiding the cutting line 130 on the first cutting line 130 to the third cutting wheel 113;
the second guiding wheel set 122 is disposed between the second cutting wheel 112 and the fourth cutting wheel 114, the second guiding wheel set 122 is used for guiding the cutting line 130 on the second cutting line 130 to the fourth cutting wheel 114;
the cutting lines 130 form mutually perpendicular cutting segments 131 between the first cutting wheel 111 and the second cutting wheel 112 and between the third cutting wheel 113 and the fourth cutting wheel 114, respectively.
The cutting lines 130 are arranged between the first cutting wheel set, the second cutting wheel set, the first guide wheel set 121 and the second guide wheel set 122, and a cutting section 131 between the third cutting wheel 113 and the fourth cutting wheel 114 of the second cutting wheel set are respectively formed between the first cutting wheel 111 and the second cutting wheel 112 of the first cutting wheel set, wherein the cutting section 131 on the first cutting wheel set is perpendicular to the cutting section 131 on the second cutting wheel set, so that two sides of the single crystal silicon rod can be cut simultaneously to form right-angled sides, and the distance between the first cutting wheel 111 and the second cutting wheel 112, the distance between the first cutting wheel 111 and the third cutting wheel 113, the distance between the second cutting wheel 111 and the third cutting wheel 113, and the distance between the second cutting wheel 111 and the third cutting wheel 113 are formed by the first cutting wheel 111 and the second cutting wheel 112 of the first cutting wheel set being opposite to each other, and the cutting section 131 on the second cutting wheel set being perpendicular to each other, The distance between the third cutting wheel 113 and the fourth cutting wheel 114 and the distance between the second cutting wheel 112 and the fourth cutting wheel 114 are not affected by the size of the single crystal silicon rod, and then the first guide wheel set 121 guides the cutting line 130 between the first cutting wheel 111 and the third cutting wheel 113 and the second guide wheel set 122 guides the cutting line 130 between the second cutting wheel 112 and the fourth cutting wheel 114, so that the bending angle of the diamond cutting line 130 is reduced, the cutting line 130 is prevented from working under the condition of a large bending angle for a long time, and the service life of the cutting line 130 is prolonged.
In the embodiment, the first guide wheel set 121 and the second guide wheel set 122 are respectively composed of two guide wheels, and in the embodiment, the first guide wheel set 121 and the second guide wheel set 122 may be composed of three or more guide wheel sets.
In this embodiment, in order to provide tension to the cutting line, a tensioning mechanism is further included, and one of the first guide wheel set 121 or the second guide wheel set 122 is a tensioning wheel; the tensioning mechanism is in transmission connection with the tensioning wheel and is used for tensioning the cutting line. One guide wheel of the first guide wheel set 121 or the second guide wheel set 122 is a tension wheel, and the tension mechanism and the tension wheel provide tension force for the cutting line, so that the cutting line can conveniently cut the single crystal silicon rod. In other embodiments, instead of using the first guide wheel set 121 or the second guide wheel set 122 as a tensioning wheel, a tensioning wheel mechanism may be used to provide the tensioning force for the cutting line, where the tensioning wheel mechanism includes a tensioning wheel and a tensioning mechanism, the tensioning wheel is in transmission connection with the tensioning mechanism, and the tensioning wheel mechanism is used to drive the tensioning wheel to move to tension the cutting line. The tensioning mechanism can be a servo motor, an air cylinder, an oil cylinder or a heavy hammer assembly, taking the servo motor as an example, the tensioning mechanism can be an eccentric tensioning motor, and the tensioning wheel is rotatably sleeved on an eccentric shaft of the eccentric tensioning motor. Taking the weight assembly as an example, the tensioning mechanism includes a tensioning arm and a weight, the middle of the tensioning arm is hinged, the tensioning wheel and the weight are respectively disposed at two ends of the tensioning arm, the tensioning wheel is axially provided with a rotating shaft, and the rotating shaft is rotatably disposed at an end of the tensioning arm through a bearing.
In the embodiment, in order to improve the cutting efficiency of the cutting mechanism on the single crystal silicon rod, the number of the cutting wheel trains is two, the two cutting wheel trains are arranged oppositely, and the cutting segments 131 of the two cutting wheel trains are projected in a # -shape along the cutting direction.
Through setting up the cutting train into two, and two relative settings of cutting train make the cutting wheel of two cutting wheels put into use along the cutting direction and form the groined type, can realize cutting simultaneously the four sides of single crystal silicon rod, improve single crystal silicon rod's cutting efficiency simultaneously.
Wherein one of the first cutting wheel 111, the second cutting wheel 112, the third cutting wheel 113 and the fourth cutting wheel 114 is a driving wheel; when one of the first cutting wheel 111, the second cutting wheel 112, the third cutting wheel 113 and the fourth cutting wheel 114 is used as a driving wheel, the other cutting wheels are used as driven wheels, and the driving wheels drive the driven wheels to rotate through the cutting lines 130; further driving the cutting line 130 to rotate, and further realizing the cutting of the single crystal silicon rod by the cutting line 130; in this embodiment, there are two cutting wheel trains, the first cutting wheel 111 in one of the cutting wheel trains can be used as a driving wheel, the second cutting wheel 112 in the other cutting wheel train can be used as a driving wheel, the two driving wheels are coaxially arranged, and the two driving wheels are driven by the same motor; in other embodiments, other cutting wheels in the two cutting wheel trains may be coaxially disposed and driven by the same motor as the driving wheel, or the driving wheels in the two cutting wheel trains may be driven by the two motors, and when the driving wheels in the two cutting wheel trains are driven by the two motors, the driving wheels in the two cutting wheels may be two cutting wheels coaxially disposed in the two cutting wheels, or may be two cutting wheels disposed at different axes in the two cutting wheels. In other embodiments, one of the first guide wheel set or the second guide wheel set may be used as a driving wheel.
In another embodiment, a single crystal silicon squaring and cutting machine comprises a base frame 200, a cutting worktable 300, a cutting operation mechanism 100 and a cutting head frame 400;
the cutting work bench 300 is arranged on the bottom frame 200, and the cutting work bench 300 is used for placing a silicon single crystal rod to be cut;
the cutting operation mechanism 100 includes a cutting wheel train, a cutting line 130, a fixing plate 140, a slide seat plate 150 and a wheel train bracket 160;
the bottom of the fixing plate 140 is provided with a through hole 141 for the silicon single crystal rod to be cut to pass through;
the fixing plate 140 is connected to a sliding seat plate 150, and the sliding seat plate 150 is slidably disposed on the cutting head frame 400;
the cutting wheel train is arranged on the wheel train bracket 160 and comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set 121 and a second guide wheel set 122;
the first cutting wheel set comprises a first cutting wheel 111 and a second cutting wheel 112, and the first cutting wheel 111 and the second cutting wheel 112 are oppositely arranged;
the second cutting wheel group comprises a third cutting wheel 113 and a fourth cutting wheel 114, and the third cutting wheel 113 and the fourth cutting wheel 114 are oppositely arranged;
the cutting direction of the first cutting wheel 111 is perpendicular to the cutting direction of the third cutting wheel 113;
the cutting line 130 is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set 121 and the second guide wheel set 122;
the first guide wheel set 121 is arranged between the first cutting wheel 111 and the third cutting wheel 113, and the first guide wheel set 121 is used for guiding the cutting line 130 on the first cutting line 130 to the third cutting wheel 113;
the second guiding wheel set 122 is disposed between the second cutting wheel 112 and the fourth cutting wheel 114, the second guiding wheel set 122 is used for guiding the cutting line 130 on the second cutting line 130 to the fourth cutting wheel 114;
the cutting lines 130 respectively form mutually perpendicular cutting segments 131 on the through holes 141 of the fixing plate 140 between the first cutting wheel 111 and the second cutting wheel 112 and between the third cutting wheel 113 and the fourth cutting wheel 114;
the cutter head frame 400 is disposed on the base frame 200.
When the silicon single crystal rod to be cut needs to be cut, the silicon single crystal rod to be cut is fixed on a cutting workbench on the bottom frame 200, the cutting wheel train is installed on the fixing plate 140 through the wheel train support 160, the fixing plate 140 is installed on the cutting head frame 400 through the sliding base in a sliding mode, so that the cutting operation mechanism 100 can move along the cutting head frame 400, when the silicon single crystal rod to be cut is cut, the silicon single crystal rod to be cut moves towards the silicon single crystal rod to be cut through the cutting operation mechanism 100, the silicon single crystal rod to be cut penetrates through the through hole 141 in the bottom of the fixing plate 140, and the cutting line 130 on the cutting operation mechanism 100 cuts the silicon single crystal rod to be cut; in the cutting operation mechanism 100, the cutting line 130 is disposed between the first cutting wheel set, the second cutting wheel set, the first guide wheel set 121 and the second guide wheel set 122, and the cutting segments 131 perpendicular to each other are formed on the first cutting wheel set and the second cutting wheel set, respectively, for cutting the single crystal silicon rod, while the first cutting wheel 111 and the second cutting wheel 112 are disposed opposite to each other, the third cutting wheel 113 and the fourth cutting wheel 114 are disposed opposite to each other, and the cutting direction of the first cutting wheel 111 is perpendicular to the cutting direction of the third cutting wheel 113, so that the distance between the first cutting wheel 111 and the third cutting wheel 113 and the distance between the second cutting wheel 112 and the fourth cutting wheel 114 are not affected by the size of the single crystal silicon rod, and then the first guide wheel set 121 guides the cutting line 130 between the first cutting wheel 111 and the third cutting wheel 113 and the guide of the second guide wheel set 122 to the cutting line 130 between the second cutting wheel 112 and the fourth cutting wheel 114, the bending angle of the diamond cutting line 130 is reduced, the cutting line 130 is prevented from working under the condition of a large bending angle for a long time, and the service life of the cutting line 130 is prolonged. Wherein, in the cutting wheel train, the first guide wheel set 121 and the second guide wheel set 122 are arranged in parallel, the first guide wheel set 121 is arranged above the first cutting wheel 111 and the third cutting wheel 113, the second guide wheel set 122 is arranged above the second cutting wheel 112 and the fourth cutting wheel 114, in the projection direction facing to the cutting surface, the projection of the first guide wheel set 121 and the second guide wheel is staggered in the first cutting wheel set and the second cutting wheel set, wherein, the staggered angle of the first guide wheel set 121 and the first cutting wheel 111 as well as the third cutting wheel 113 is 45 degrees, the staggered angle of the second guide wheel set 122 and the second cutting wheel 112 as well as the fourth cutting wheel 114 is 45 degrees, the first guide wheel set 121 is along the maximum contour and parallel to the outermost wheel groove section center of the cutting surface and the outermost wheel groove section center of the first cutting wheel 111 and the third cutting wheel 113 below along the maximum contour and parallel to the outermost wheel groove section center of the cutting surface, overlapping in the direction projected on the cut surface; the outermost wheel groove section centers of the second guide wheel set 122 along the maximum contour and parallel to the cutting surface coincide with the outermost wheel groove section centers of the lower second cutting wheel 112 and the fourth cutting wheel 114 along the maximum contour and parallel to the cutting surface in the direction of projection on the cutting surface, respectively.
In the embodiment, the first guide wheel set 121 and the second guide wheel set 122 are respectively composed of two guide wheels, and in the embodiment, the first guide wheel set 121 and the second guide wheel set 122 may be composed of three or more guide wheel sets.
In this embodiment, in order to provide tension to the cutting line, a tensioning mechanism is further included, and one of the first guide wheel set 121 or the second guide wheel set 122 is a tensioning wheel; the tensioning mechanism is in transmission connection with the tensioning wheel and is used for tensioning the cutting line. One guide wheel of the first guide wheel set 121 or the second guide wheel set 122 is a tension wheel, and the tension mechanism and the tension wheel provide tension force for the cutting line, so that the cutting line can conveniently cut the single crystal silicon rod. In other embodiments, instead of using the first guide wheel set 121 or the second guide wheel set 122 as a tensioning wheel, a tensioning wheel mechanism may be used to provide the tensioning force for the cutting line, where the tensioning wheel mechanism includes a tensioning wheel and a tensioning mechanism, the tensioning wheel is in transmission connection with the tensioning mechanism, and the tensioning wheel mechanism is used to drive the tensioning wheel to move to tension the cutting line. The tensioning mechanism can be a servo motor, an air cylinder, an oil cylinder or a heavy hammer assembly, taking the servo motor as an example, the tensioning mechanism can be an eccentric tensioning motor, and the tensioning wheel is rotatably sleeved on an eccentric shaft of the eccentric tensioning motor. Taking the weight assembly as an example, the tensioning mechanism includes a tensioning arm and a weight, the middle of the tensioning arm is hinged, the tensioning wheel and the weight are respectively disposed at two ends of the tensioning arm, the tensioning wheel is axially provided with a rotating shaft, and the rotating shaft is rotatably disposed at an end of the tensioning arm through a bearing.
Wherein one of the first cutting wheel 111, the second cutting wheel 112, the third cutting wheel 113 and the fourth cutting wheel 114 is a driving wheel; when one of the first cutting wheel 111, the second cutting wheel 112, the third cutting wheel 113 and the fourth cutting wheel 114 is used as a driving wheel, the other cutting wheels are used as driven wheels, and the driving wheels drive the driven wheels to rotate through the cutting lines 130; further driving the cutting line 130 to rotate, and further realizing the cutting of the single crystal silicon rod by the cutting line 130; in this embodiment, there are two cutting wheel trains, the first cutting wheel 111 in one of the cutting wheel trains can be used as a driving wheel, the second cutting wheel 112 in the other cutting wheel train can be used as a driving wheel, the two driving wheels are coaxially arranged, and the two driving wheels are driven by the same motor; in other embodiments, other cutting wheels in the two cutting wheel trains may be coaxially disposed and driven by the same motor as the driving wheel, or the driving wheels in the two cutting wheel trains may be driven by the two motors, and when the driving wheels in the two cutting wheel trains are driven by the two motors, the driving wheels in the two cutting wheels may be two cutting wheels coaxially disposed in the two cutting wheels, or may be two cutting wheels disposed at different axes in the two cutting wheels. In other embodiments, one of the first guide wheel set or the second guide wheel set may be used as a driving wheel.
In the embodiment, in order to improve the cutting efficiency of the cutting mechanism on the single crystal silicon rod, the number of the cutting wheel trains is two, the two cutting wheel trains are arranged oppositely, and the cutting segments 131 of the two cutting wheel trains are projected in a # -shape along the cutting direction.
Through setting up the cutting train into two, and two relative settings of cutting train make the cutting wheel of two cutting wheels put into use along the cutting direction and form the groined type, can realize cutting simultaneously the four sides of single crystal silicon rod, improve single crystal silicon rod's cutting efficiency simultaneously.
Wherein the cutter head carriage 400 includes a travel carriage 410 and a drive mechanism 420;
the sliding seat plate 150 is slidably arranged on the operation bracket 410;
the driving mechanism 420 is disposed between the sliding seat plate 150 and the operating bracket 410, and the driving mechanism 420 is used for driving the sliding seat plate 150 to move up and down along the operating bracket 410.
Through setting up operation support 410 and actuating mechanism 420 on cutting head frame 400, lack the east through actuating mechanism 420 and slide bedplate 150 and move along operation support 410, and then drive cutting operating mechanism 100 and treat the monocrystalline silicon rod of examining and cut, improve the cutting efficiency and the stability of treating the monocrystalline silicon rod of cutting. The driving mechanism 420 comprises a transmission screw 422 and a driving motor 421; the driving motor 421 is arranged on the operation bracket 410, the driving motor 421 is in transmission connection with the transmission screw rod 422, and the driving motor 421 is used for driving the transmission screw rod 422 to rotate; the sliding seat plate 150 is provided with a guide hole 152, and the guide hole 152 on the sliding seat plate 150 is in threaded connection with a transmission screw 422. The driving mechanism 420 drives the transmission screw rod 422 to rotate through the driving motor 421, and the transmission screw rod 422 is in threaded connection with the guide hole 152 on the sliding seat plate 150, so that when the transmission screw rod 422 rotates, the cutting operation mechanism 100 can move along the operation support 410, and the cutting operation mechanism 100 can cut the silicon single crystal rod to be cut. In order to ensure that the transmission screw 422 can rotate at a stable speed, the driving motor 421 is connected to the transmission screw 422 through the speed reducer 423 in a transmission manner. In other embodiments, the driving mechanism 420 may also drive the cutting operation mechanism 100 to move in other manners, for example, the cutting operation mechanism 100 is driven to move by an electric push rod, the cutting operation mechanism 100 is disposed at one end of the electric push rod, and the cutting operation mechanism 100 is driven to operate along with the extension and retraction of the push rod on the electric push rod. Wherein, guide rails 411 are arranged on two sides of the operation bracket 410; the sliding blocks 151 are disposed on two sides of the sliding seat plate 150, and the sliding seat plate 150 is slidably disposed on the guide rails 411 of the operating bracket 410 through the sliding blocks 151. The sliding seat plate 150 is slidably disposed on the guide rail 411 of the operation bracket 410 through the slider 151, so that the cutting operation mechanism 100 can move along the guide rail 411 of the operation bracket 410, and the stability of the cutting operation mechanism 100 is ensured.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present patent.
Claims (10)
1. A monocrystalline silicon squaring cutting operation mechanism is characterized by comprising a cutting wheel train and cutting lines, wherein the cutting wheel train comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set and a second guide wheel set;
the first cutting wheel set comprises a first cutting wheel and a second cutting wheel which are arranged oppositely;
the second cutting wheel group comprises a third cutting wheel and a fourth cutting wheel which are oppositely arranged;
the cutting direction of the first cutting wheel is vertical to that of the third cutting wheel;
the cutting line is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set and the second guide wheel set;
the first guide wheel set is arranged between the first cutting wheel and the third cutting wheel and is used for guiding the cutting line on the first cutting line to the third cutting wheel;
the second guide wheel set is arranged between the second cutting wheel and the fourth cutting wheel and is used for guiding the cutting line on the second cutting line to the fourth cutting wheel;
the cutting lines respectively form mutually perpendicular cutting sections between the first cutting wheel and the second cutting wheel and between the third cutting wheel and the fourth cutting wheel.
2. The single crystal silicon squaring and cutting running mechanism according to claim 1, wherein the number of the cutting wheel trains is two, the two cutting wheel trains are arranged oppositely, and the cutting segments of the two cutting wheel trains are projected into a groined shape along the cutting direction.
3. A monocrystalline silicon squaring cutting machine is characterized by comprising an underframe, a cutting work bench, a cutting operation mechanism and a cutting head frame;
the cutting workbench rack is arranged on the bottom frame and used for placing a silicon single crystal rod to be cut;
the cutting operation mechanism comprises a cutting wheel train, a cutting line, a fixing plate, a sliding seat plate and a wheel train bracket;
the bottom of the fixing plate is provided with a through hole for the silicon single crystal rod to be cut to pass through;
the fixed plate is connected with the sliding seat plate, and the sliding seat plate is arranged on the cutting head frame in a sliding manner;
the cutting wheel train is arranged on the wheel train support and comprises a first cutting wheel set, a second cutting wheel set, a first guide wheel set and a second guide wheel set;
the first cutting wheel set comprises a first cutting wheel and a second cutting wheel which are arranged oppositely;
the second cutting wheel group comprises a third cutting wheel and a fourth cutting wheel which are oppositely arranged;
the cutting direction of the first cutting wheel is vertical to that of the third cutting wheel;
the cutting line is arranged among the first cutting wheel set, the second cutting wheel set, the first guide wheel set and the second guide wheel set;
the first guide wheel set is arranged between the first cutting wheel and the third cutting wheel and is used for guiding the cutting line on the first cutting line to the third cutting wheel;
the second guide wheel set is arranged between the second cutting wheel and the fourth cutting wheel and is used for guiding the cutting line on the second cutting line to the fourth cutting wheel;
the cutting lines respectively form mutually vertical cutting sections on the through holes of the fixing plate between the first cutting wheel and the second cutting wheel and between the third cutting wheel and the fourth cutting wheel;
the cutting head frame is arranged on the bottom frame.
4. The monocrystalline silicon squaring cutting machine according to claim 3, wherein the number of the cutting wheel trains is two, the two cutting wheel trains are arranged oppositely, and the cutting segments of the two cutting wheel trains are projected into a groined shape along the cutting direction.
5. The single crystal silicon squaring and cutting machine of claim 3 wherein the cutting head frame includes a running carriage and a drive mechanism;
the sliding seat plate is arranged on the running bracket in a sliding manner;
the driving mechanism is arranged between the sliding seat plate and the operation support and is used for driving the sliding seat plate to move up and down along the operation support.
6. The single crystal silicon squaring and cutting machine according to claim 5, wherein the driving mechanism comprises a transmission screw and a driving motor;
the driving motor is arranged on the operation support and is in transmission connection with the transmission screw rod, and the driving motor is used for driving the transmission screw rod to rotate;
the sliding seat plate is provided with a guide hole, and the guide hole is in threaded connection with the transmission screw rod.
7. The single crystal silicon squaring and cutting machine according to claim 6, wherein the driving motor is in transmission connection with the transmission screw rod through a speed reducer.
8. The single crystal silicon squaring and cutting machine according to claim 5, wherein guide rails are arranged on two sides of the running support;
the two sides of the sliding seat board are provided with sliding blocks, and the sliding seat board is arranged on a guide rail of the operation support in a sliding mode through the sliding blocks.
9. The single crystal silicon squaring cutting machine according to claim 3, further comprising a tensioning mechanism, wherein one of the first guide wheel set or the second guide wheel set is a tensioning wheel;
the tensioning mechanism is in transmission connection with the tensioning wheel and is used for tensioning the cutting line.
10. The single crystal silicon squaring and cutting machine of claim 3 wherein one of the first cutting wheel, the second cutting wheel, the third cutting wheel and the fourth cutting wheel is a drive wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110619176.5A CN113400497A (en) | 2021-06-03 | 2021-06-03 | Monocrystalline silicon evolution cutting operation mechanism and monocrystalline silicon evolution cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110619176.5A CN113400497A (en) | 2021-06-03 | 2021-06-03 | Monocrystalline silicon evolution cutting operation mechanism and monocrystalline silicon evolution cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113400497A true CN113400497A (en) | 2021-09-17 |
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ID=77676152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110619176.5A Pending CN113400497A (en) | 2021-06-03 | 2021-06-03 | Monocrystalline silicon evolution cutting operation mechanism and monocrystalline silicon evolution cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113400497A (en) |
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2021
- 2021-06-03 CN CN202110619176.5A patent/CN113400497A/en active Pending
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