CN113395447B

CN113395447B - Anti-shake mechanism, image pickup device, and electronic apparatus

Info

Publication number: CN113395447B
Application number: CN202110605037.7A
Authority: CN
Inventors: 申成哲; 马忠科; 陈小凤
Original assignee: Jiangxi Jinghao Optical Co Ltd
Current assignee: Jiangxi Jinghao Optical Co Ltd
Priority date: 2021-05-31
Filing date: 2021-05-31
Publication date: 2023-04-04
Anticipated expiration: 2041-05-31
Also published as: CN113395447A

Abstract

The application discloses anti-shake mechanism, camera device and electronic equipment. The anti-shake mechanism comprises a base, a micro-electro-mechanical system, a photosensitive chip, an anti-shake motor, a displacement adjusting assembly and a circuit board. The micro electro mechanical system is positioned above the base and comprises a fixed part and a movable part, and the movable part is used for moving relative to the fixed part according to the shaking condition; the photosensitive chip is positioned on one side of the micro-electro-mechanical system far away from the base and is fixedly connected with the movable part; the anti-shake motor is positioned on one side of the photosensitive chip far away from the micro-electro-mechanical system and comprises a fixed part and a driving part, the driving part is used for moving relative to the fixed part according to the shaking condition, and the driving part is fixedly connected with the fixed part; the displacement adjusting assembly is positioned on one side of the base, which faces the anti-shake motor, and is used for suspending the micro-electro-mechanical system on the base; the circuit board is positioned above the base and is electrically connected with the photosensitive chip, the micro-electromechanical system and the displacement adjusting assembly. The anti-shake mechanism can realize large-stroke displacement adjustment and has high movement precision.

Description

Anti-shake mechanism, image pickup device, and electronic apparatus

Technical Field

The application relates to the technical field of camera device anti-shake, in particular to an anti-shake mechanism, a camera device and an electronic device.

Background

The mems refers to a high-technology device with a size of several millimeters or less, and its internal structure is usually in the order of micrometers or even nanometers, and is an independent intelligent system. In the technical field of camera shooting, when a micro-electromechanical system is applied to anti-shake, the micro-electromechanical system can drive a photosensitive chip to realize submicron-level movement, and has the characteristic of higher adjustment precision. However, the mems is mainly used only for fine displacement adjustment, and if the large stroke displacement of the photo sensor chip is to be adjusted, the manufacturing cost of the mems needs to be greatly increased, and the size of the mems also increases.

Disclosure of Invention

The application discloses anti-shake mechanism, camera device and electronic equipment to solve the problem that it is difficult to big stroke and the higher adjustment sensitization chip of precision at present.

In order to achieve the above object, in a first aspect, the present application provides an anti-shake mechanism comprising:

a base;

the micro electro mechanical system is positioned above the base and comprises a fixed part and a movable part, and the movable part is used for moving relative to the fixed part according to the shaking condition;

the photosensitive chip is positioned on one side of the micro-electro-mechanical system, which is far away from the base, and the photosensitive chip is fixedly connected with the movable part;

the anti-shake motor is positioned on one side of the photosensitive chip, which is far away from the micro-electro-mechanical system, and comprises a fixed part and a driving part, the driving part is used for moving relative to the fixed part according to the shaking condition, and the driving part is directly or indirectly fixedly connected with the fixed part of the micro-electro-mechanical system;

the displacement adjusting assembly is positioned above the base and used for suspending the micro electro mechanical system and the anti-shake motor on the base;

and the circuit board is positioned above the base and is respectively and electrically connected with the photosensitive chip, the micro-electro-mechanical system and the displacement adjusting assembly.

The embodiment of the application provides an anti-shake mechanism with a new structure, which combines a micro electro mechanical system and an anti-shake motor in the same anti-shake mechanism. Therefore, according to the degree of shaking, the anti-shaking motor can drive the micro-electromechanical system and the photosensitive chip which are fixedly connected with the anti-shaking motor to perform large-stroke displacement compensation adjustment, and the micro-electromechanical system can also perform small-stroke displacement adjustment with higher accuracy on the photosensitive chip. Therefore, the micro-electromechanical system and the anti-shake motor act together, so that the motion precision of the photosensitive chip can be greatly improved while the photosensitive chip is adjusted by large-stroke displacement.

Further, the displacement adjustment assembly includes:

the first hollow substrate is fixed on the base and provided with a first hollow area, and the first hollow substrate is used for electrically connecting an external circuit;

the planar flexible soft board is positioned between the base and the micro electro mechanical system and in the first hollowed-out area, is a planar spiral soft board and is provided with a first connecting end and a second connecting end, and the first connecting end is fixedly connected with the first hollowed-out substrate;

the movable hard board is positioned on one side, facing the anti-shake motor, of the base and is positioned in the first hollowed-out area, and the movable hard board is fixedly connected with the second connecting end, so that the movable hard board is suspended above the base; the movable hard board is also fixedly connected with the fixing part.

Above-mentioned displacement adjustment subassembly can be through first fretwork base plate and spiral helicine flexible soft board of planar, with the suspension of activity hardboard on the base, and then through the fixed connection of activity hardboard and fixed plate, all suspend whole micro-electromechanical system on the base, make things convenient for the anti-shake motor to carry out the long-stroke displacement to photosensitive chip and adjust.

Furthermore, the first connecting end is electrically connected with the first hollow substrate, the second connecting end is electrically connected with the movable hard board, and the movable hard board is electrically connected with the circuit board.

The displacement adjustment assembly of the embodiment of the application can realize the integral anti-shaking of the anti-shaking motor and the micro electro mechanical system through the suspension arrangement of the movable hard plate, and can ensure the effective and stable electric connection of the circuit board with the photosensitive chip and the micro electro mechanical system respectively through the electric connection arrangement between the structures of the displacement adjustment assembly. That is to say, through above-mentioned displacement adjustment assembly, can realize two kinds of functions of electricity connection and suspension simultaneously, just so need not to use two sets of different functional component to realize electricity connection, suspension function respectively, do benefit to and simplify structural design, reduce anti-shake mechanism size.

Further, the anti-shake mechanism still includes the shell, the shell with pass through between the base first fretwork base plate fixed connection, so that the shell, first fretwork base plate with the base encloses jointly into first holding chamber, micro-electro-mechanical system, sensitization chip, the anti-shake motor, displacement adjustment assembly and the circuit board all encapsulates in first holding chamber.

Carry out the mode of modularized assembly with anti-shake mechanism, can conveniently load and unload with other spare part structures, can also play the above-mentioned spare part of encapsulation inside simultaneously with external isolated guard action.

Further, the displacement adjustment assembly includes:

the second hollow substrate is fixed on the base and is used for electrically connecting an external circuit;

the cantilever type flexible soft board comprises a cantilever part, a first transverse connecting part and a second transverse connecting part, wherein the first transverse connecting part and the second transverse connecting part extend from the cantilever part to the base direction and are formed by bending;

the circuit board is also fixedly connected with the micro-electro-mechanical system and the driving piece respectively.

Through adopting the flexible soft board of cantilever type, can directly make the circuit board hang in the fly leaf of base in, because the circuit board respectively with driving piece, micro-electromechanical system fixed connection, that is to say can all hang in the base top with circuit board fixed connection's whole through adopting the flexible soft board of cantilever type, and then make the anti-shake motor can drive relevant spare part and remove.

Further, the cantilever portion surrounds the periphery of the micro electro mechanical system, the circuit board and the anti-shake motor.

The cantilever part is arranged in a surrounding way, so that the gaps at the peripheries of the micro-electromechanical system, the circuit board and the anti-shake motor can be fully utilized, the space is saved, and the volume of the anti-shake mechanism is reduced.

Furthermore, the first transverse connecting portion is electrically connected with the second hollow substrate, and the second transverse connecting portion is electrically connected with the circuit board.

The circuit board can realize both electrical connection and suspension, i.e. can realize related functions with further saving of parts.

Further, the anti-shake assembly is used for being assembled in a camera device, and the camera device further comprises a casing and a lens assembly located in the casing;

the casing and the base are fixedly connected through the second hollow substrate, so that the casing, the outer peripheral wall of the lens assembly, the second hollow substrate and the base are enclosed together to form a second accommodating cavity, and the micro-electro-mechanical system, the photosensitive chip, the anti-shake motor, the cantilever part, the second transverse connecting part and the circuit board are accommodated in the second accommodating cavity;

the cantilever part is accommodated in a gap between the shell and the outer peripheral wall of the lens assembly in a surrounding mode.

The structure can make full use of the camera device which combines the anti-shake component and the lens component in the camera device in an open and unsealed way to form a whole. The structure can make full use of the gap between the casing and the peripheral wall of the lens component to accommodate part of the cantilever type flexible soft board, so that the overall structural design of the camera device is more reasonable, and the structure is more compact.

Further, the lens assembly is provided with an assembly bottom plate opposite to the base, and a fixing piece of the anti-shake motor is fixedly arranged on one surface, facing the base, of the assembly bottom plate.

The fixing part of the anti-shake motor is fixedly arranged on the component bottom plate of the lens component, so that the use of parts is further reduced, the space is saved, and the size of the camera device is reduced.

Furthermore, the circuit board is a hollow circuit board with a second hollow area, and the circuit board is arranged between the anti-shake motor and the micro electro mechanical system and is respectively fixedly connected with the driving part and the fixing part;

the second hollow area corresponds to the photosensitive chip in position, so that the photosensitive chip is accommodated in the second hollow area.

The circuit board is arranged to be the circuit board corresponding to the position of the photosensitive chip in the hollow area and is fixed between the driving piece of the anti-shake motor and the fixing portion of the micro-electromechanical system, so that when incident light is imaged on the photosensitive chip by utilizing the hollow area, the compactness of the whole structure of the anti-shake mechanism is facilitated, and the design of electric connection between the circuit board and other structures is more convenient.

Further, the anti-shake mechanism still includes infrared filter box, infrared filter box sets up between anti-shake motor and the micro-electro-mechanical system.

Through setting up infrared filter subassembly between anti-shake motor and micro electromechanical system for this anti-shake mechanism can enough carry out displacement control to sensitization chip, also can be to infrared filter subassembly.

Further, the circuit board is arranged between the infrared filter component and the micro electro mechanical system, the circuit board is fixedly connected with the infrared filter component and the fixing portion respectively, and the infrared filter component is further fixedly connected with the driving piece.

Can drive infrared filter subassembly and sensitization chip simultaneously through the anti-shake motor and remove, can guarantee like this that infrared filter is more fixed with the relative position of sensitization chip, have better anti-shake regulation effect. Simultaneously, above-mentioned structural design is more reasonable to the utilization in space, and structural integrity is strong, does benefit to the anti-shake motor and drives infrared filter subassembly and photosensitive chip and carry out the displacement compensation motion.

Further, the anti-shake motor is a suspension wire structure anti-shake motor, a memory alloy anti-shake motor, a magnet structure anti-shake motor or a piezoelectric structure anti-shake motor.

In a second aspect, an embodiment of the present application provides an image pickup apparatus, including:

the lens assembly comprises a lens and a focusing motor arranged on the periphery of the lens, and the focusing motor is used for focusing the lens;

the anti-shake mechanism according to the first aspect, wherein the anti-shake mechanism is disposed below the lens assembly, or one part of the anti-shake mechanism is disposed below the lens assembly, and another part of the anti-shake mechanism is disposed around the lens assembly.

Optionally, the focus motor has a motor base, and the anti-shake mechanism has a housing, and the housing is fixedly connected to the motor base, so that the anti-shake mechanism is disposed below the lens assembly.

In this structure, anti-shake mechanism is connected with the motor base of focusing motor through the shell, so anti-shake mechanism can regard as a modular structure, can conveniently load and unload, be convenient for maintain with the camera lens subassembly, also can set up through modular structure simultaneously, plays effectual guard action to the inside spare part structure of anti-shake mechanism.

Optionally, the camera device has a housing, the focus motor and the anti-shake mechanism are both disposed in the housing, the focus motor has a motor base, the motor base and the base are disposed opposite to each other, and a fixing member of the anti-shake motor is fixed on a surface of the motor base facing the base.

In this structure, the anti-shake mechanism and the focus motor are both assembled in the housing of the image pickup apparatus, and the fixing member of the anti-shake motor can be fixed by the motor base of the focus motor, so that the image pickup apparatus is more compact in overall structure and smaller in size.

Further, a portion of the displacement adjustment assembly is received circumferentially in a gap between the housing and the outer peripheral wall of the motor base.

Partial structure holding with displacement adjustment assembly can make full use of the space that the camera lens occupy between the periphery wall of casing and motor base to further improve camera device's space utilization, make camera device size littleer. In a third aspect, an embodiment of the present application provides an electronic apparatus, which includes the image pickup device according to the second aspect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an image pickup apparatus according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an anti-shake mechanism according to an embodiment of the present application;

FIG. 3 is an exploded view of the anti-shake mechanism according to an embodiment of the present application;

FIG. 4 is a front view of an image pickup apparatus according to an embodiment of the present application;

FIG. 5 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 4;

FIG. 6 is a schematic structural diagram of a displacement adjustment assembly in the anti-shake mechanism according to the embodiment of the present application;

fig. 7 is an exploded view of an image pickup apparatus according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of an image capturing apparatus according to an embodiment of the present application (including a second displacement adjustment assembly);

fig. 9 is a schematic structural view of the image pickup apparatus in fig. 8 (the upper cover of the casing is omitted);

FIG. 10 is an exploded view of the imaging device of FIG. 8;

FIG. 11 is a front view of the camera of FIG. 8;

FIG. 12 is a cross-sectional view taken along line B-B of FIG. 11;

FIG. 13 is a cross-sectional view taken along line C-C of FIG. 11;

fig. 14 is a schematic view illustrating an assembly of the cantilever-type flexible printed circuit board and the circuit board in the anti-shake mechanism according to the embodiment of the disclosure;

FIG. 15 is a schematic view of the assembly of the second displacement adjustment assembly with the circuit board, the MEMS and the base of the anti-shake mechanism according to the embodiment of the present application;

fig. 16 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

900. A camera device; 91. a housing; 911. a second accommodating cavity;

10. a lens assembly;

1. a lens;

2. a focus motor; 21. a motor base;

3. an anti-shake mechanism;

31. a base;

32. a micro-electro-mechanical system; 321. a fixed part; 322. a movable portion;

33. a photosensitive chip;

34. an anti-shake motor; 341. a drive member;

35. a displacement adjustment assembly;

351. a first hollow substrate; 3511. a first hollowed-out region; 352. a flat flexible sheet; 3521. a first connection end; 3522. a second connection end; 353. a movable hard board;

354. a second hollow substrate; 355. a cantilever-type flexible soft board; 3551. a cantilever portion; 3552. a first transverse connecting portion; 3553. a second transverse connecting portion;

36. a circuit board; 361. a second hollowed-out region;

37. a housing; 371. a first accommodating cavity; 372. a top plate;

38. an infrared filter assembly.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as the case may be.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solutions of the present application will be further described with reference to the following specific embodiments and accompanying drawings.

In order to carry out anti-shake to camera device, the scheme before this application embodiment improves mainly has two kinds, one kind is that utilize micro-electromechanical system to carry out comparatively meticulous displacement adjustment to the sensitization chip in the camera device, can realize the shake of higher accuracy and adjust, but this kind of mode can only satisfy slight regulation, can't satisfy the sensitization chip of long stroke and adjust. The other method is to use an OIS anti-shake motor to adjust the photosensitive chip, which can realize displacement adjustment with larger stroke, but has the defect that the adjustment precision is not as high as that of a micro electro mechanical system. That is, the solution before the improvement is difficult to satisfy the requirements of large stroke and high precision adjustment of the photosensitive chip in the anti-shake process, and if the structure of the micro-electromechanical system is improved to realize the large stroke, the high manufacturing cost is required, and the size of the micro-electromechanical system is increased, which does not meet the trend of making the imaging device light and thin.

To solve these problems, the embodiment of the present application proposes a new anti-shake mechanism, an image pickup apparatus 900, and an electronic device.

As shown in fig. 1, an embodiment of the present application provides an image pickup apparatus 900, where the image pickup apparatus 900 includes: the image pickup apparatus 900 includes a lens assembly 10 and an anti-shake mechanism 3, and the lens assembly 10 includes a lens 1 and a focus motor 2, that is, the image pickup apparatus 900 specifically includes the lens 1, the focus motor 2, and the anti-shake mechanism 3. The focusing motor 2 is disposed on the periphery of the lens 1 and is used for focusing the lens 1. The arrangement mode between the anti-shake mechanism 3 and the lens assembly 10 may be: the anti-shake mechanism 3 is provided below the lens assembly 10, and may be: the anti-shake mechanism 3 has a portion of structure disposed below the lens assembly 10 and another portion of structure surrounding the outer periphery of the lens assembly 10. In addition, each structure in the anti-shake mechanism 3 can be packaged into a whole, so that the anti-shake mechanism 3 forms a modular structure with higher integration level; each structure in the anti-shake mechanism 3 may also be an open assembly manner, that is, the relevant structure in the anti-shake mechanism 3 is not separately and hermetically disposed from the lens assembly, but is assembled together with the lens assembly to form a highly integrated image capturing apparatus 900. The details will be further described later when describing the structure of the anti-shake mechanism 3.

Referring to fig. 2 to 5, fig. 2 isbase:Sub>A schematic structural diagram of an anti-shake mechanism 3 according to an embodiment of the present invention, fig. 3 is an exploded view of the structure in fig. 2, fig. 4 isbase:Sub>A front view of an image pickup apparatus 900 according to an embodiment of the present invention, and fig. 5 isbase:Sub>A cross-sectional view taken along linebase:Sub>A-base:Sub>A in fig. 4. The anti-shake mechanism 3 includes: the device comprises a base 31, a micro-electro-mechanical system 32, a photosensitive chip 33, an anti-shake motor 34, a displacement adjusting assembly 35 and a circuit board 36. The micro-electro-mechanical system 32 is located above the base 31, the micro-electro-mechanical system 32 includes a fixed portion 321 and a movable portion 322, and the movable portion 322 is used for moving relative to the fixed portion 321 according to a shaking condition; the photosensitive chip 33 is located on one side of the micro-electromechanical system 32 away from the base 31, and the photosensitive chip 33 is fixedly connected with the movable part 322; the anti-shake motor 34 is located on a side of the photo sensor chip 33 away from the mems 32, the anti-shake motor 34 includes a fixing component (not shown) and a driving component 341, the driving component 341 is configured to move relative to the fixing component according to the shaking condition, and the driving component 341 of the anti-shake motor 34 is directly or indirectly fixedly connected to the fixing component 321 of the mems 32; the displacement adjusting assembly 35 is located on a side of the base 31 facing the anti-shake motor (i.e. the displacement adjusting assembly 35 is located above the base in fig. 2), and the displacement adjusting assembly 35 is used for suspending the micro-electromechanical system 32 on the base 31; the circuit board 36 is located above the base 31, and the circuit board 36 is electrically connected to the photosensitive chip 33, the mems 32, and the displacement adjusting assembly 35.

The anti-shake mechanism 3 combines the micro electro mechanical system 32 and the anti-shake motor 34 to be arranged in the same anti-shake mechanism 3, and the two can be used for driving the photosensitive chip 33 to move so as to realize the anti-shake purpose through the displacement adjustment of the photosensitive chip 33. In this way, it is possible to adjust the large stroke displacement of the photosensitive chip 33 by the anti-shake motor 34 and to adjust the small stroke displacement of the photosensitive chip 33 with high accuracy by the micro-electro-mechanical system 32.

The Micro-electromechanical System 32 is also called a Micro-Electro-Mechanical System (MEMS) System, and is a structure capable of performing fine displacement motion. In the anti-shake mechanism 3, the mems 32 includes a fixed portion 321 and a movable portion 322, and when the image capturing device 900 shakes, the movable portion 322 can perform a movement with a high precision (which can reach a submicron level) according to a displacement compensation value calculated by a processor of the image capturing device 900, so that the photo sensor chip 33 is fixedly connected to the movable portion 322 of the mems 32, and the photo sensor chip 33 can be driven by the mems 32 to perform displacement compensation adjustment. That is, since the photo sensor chip 33 is fixed on the movable portion 322 of the mems 32, the mems 32 itself can drive the photo sensor chip 33 to perform a displacement compensation with a high precision. In other words, the displacement compensation adjustment of the photosensitive chip 33 driven by the micro-electromechanical system 32 has the advantage of high motion precision.

Among them, the anti-shake motor 34, i.e., the OIS motor, is a type of motor that can adjust the displacement of the photosensitive chip 33 largely, and the accuracy of this type of motor is not high although the adjustable displacement is large. The anti-shake motor 34 may be a suspension wire structure anti-shake motor 34, a memory alloy anti-shake motor 34, a magnet structure anti-shake motor 34, or a piezoelectric structure anti-shake motor 34, and these types of anti-shake motors 34 may drive the optical sensor chip 33 to perform a large-stroke displacement movement. Preferably, the anti-shake motor 34 in the embodiment of the present application may adopt a magnet structure, and the anti-shake motor 34 includes a fixing element and a driving element 341, where the fixing element may be a fixed magnetic element (e.g., a magnet), and the driving element 341 may be, for example, a driving coil, and after the driving coil is powered on, the driving coil can move relative to the fixing element under the action of a magnetic field generated by the magnet, so as to further drive the mems fixedly connected to the driving element 341 to move. It can be understood, in order to support the drive coil, and make things convenient for and carry out fixed connection between drive coil and other structures, move with other structures through the drive coil drive, can also set up bearing structure such as backup pad in the drive coil below, as long as can guarantee that driving piece 341 is when realizing the drive function, can also move with other structures of drive with other structure fixed connection can, do not restrict the form of driving piece 341 here.

In order to improve the motion accuracy of the photosensitive chip 33 and satisfy the advantage of a large displacement stroke, the embodiment of the present application is provided with the micro electro mechanical system 32 in the anti-shake mechanism 3, and also provided with the anti-shake motor 34 capable of moving according to the shake condition and the displacement adjusting assembly 35. The displacement adjusting assembly 35 can suspend the mems 32 on the base 31, and the fixing portion 321 of the mems 32 is fixedly connected to the driving member 341 of the anti-shaking motor 34, so that when the driving member 341 of the anti-shaking motor 34 moves relative to the fixing member according to the shaking condition, the mems 32 and the photosensitive chip 33 can be driven to move, thereby more accurately compensating the shaking displacement. In other words, since the fixing portion 321 of the displacement adjusting assembly 35 is disposed on the base 31 in a suspension manner, that is, there is no fixed connection relationship between the mems and the base 31, but the displacement adjusting assembly is similar to the displacement adjusting assembly which is only supported on the base 31 and can move relative to the base 31, the movement of the driving member 341 of the anti-shake motor 34 can necessarily drive the entire mems 32 to move, and the motion of the anti-shake motor 34 can finally drive the motion of the photo sensor 33 because the photo sensor 33 is fixed on the mems 32. In addition, the circuit board 36 can realize the electrical signal conduction among the photosensitive chip 33, the micro-electromechanical system 32, the displacement adjusting assembly 35 and other structures, so that the photosensitive chip 33 and the micro-electromechanical system 32 can conveniently realize corresponding functional functions.

Therefore, in the embodiment of the present application, the anti-shake mechanism 3 can drive the photosensitive chip 33 to perform shake displacement compensation adjustment with a small stroke but higher accuracy through the micro electro mechanical system 32, and can drive the photosensitive chip 33 to perform shake displacement compensation adjustment with a large stroke through the anti-shake motor 34, so that the movement accuracy of the photosensitive chip 33 can be improved while the photosensitive chip 33 performs large stroke movement through the effective combination of the two displacement compensation modes of the anti-shake motor 34 and the micro electro mechanical system 32.

In addition, the mems 32 of the present embodiment can adopt the mems 32 of the prior art, that is, the mems 32 does not need to be structurally modified to achieve the above-mentioned purpose, so the present embodiment does not need to increase the manufacturing cost and size of the mems 32.

In the embodiment of the present application, "upper" refers to an object side direction of a lens in an imaging device, and "lower" refers to an image side direction of the lens in the imaging device. In the embodiment of the present application, the photosensitive surface of the photosensitive chip 33 is the surface of the photosensitive chip 33 away from the base 31, and the photosensitive surface is disposed toward the object side of the lens 1 in the image capturing apparatus 900, so as to realize a photosensitive function.

In the embodiment of the present application, the shake situation refers to a situation in which when the anti-shake mechanism 3 is applied to a product, for example, when the anti-shake mechanism 3 is applied to the image pickup apparatus 900, a user may shake the image pickup apparatus 900 due to instability of holding the image pickup apparatus 900 by the user when using the image pickup apparatus 900. The anti-shake mechanism 3 is used to perform optical anti-shake compensation on an optical structure such as the photosensitive chip 33 when a shake occurs.

In addition, in the embodiments of the present application, the connection should be understood in a broad sense, for example, direct or indirect fixed connection means that two structures may be directly and fixedly connected, and may also be indirectly and fixedly connected through a third structure. For example, the driving element 341 of the anti-shake motor 34 is directly or indirectly fixedly connected to the mems 32, which means that the driving element 341 of the anti-shake motor 34 may be directly connected to the mems 32, for example, directly and fixedly connected by gluing, welding, or fixedly connected by the circuit board 36 between the driving element 341 of the anti-shake motor 34 and the mems 32, that is, the circuit board 36 is respectively connected to the driving element 341 of the anti-shake motor 34 and the mems 32, thereby indirectly fixing the driving element 341 of the anti-shake motor 34 and the mems 32; the driving member 341 of the anti-shake motor 34 may be indirectly and fixedly connected to the mems 32 through a plurality of structures such as the ir filter assembly 38 and the circuit board 36. In addition, the fixed connection in the embodiment of the application may adopt, for example, a plurality of fixed connection methods such as gluing, welding, riveting, interference fit, and preferably adopt a method of adhering by an adhesive to fixedly connect the relevant components.

In addition, in the embodiments of the present application, the suspension should be understood in a broad sense, and the suspension refers to that one or more structures and another structure have relative position relationship, but do not have fixed connection relationship, but have movable connection relationship, or that one or more structures can be supported on another structure and can move relative to another structure, without necessarily requiring a clearance gap between one or more structures and another structure. For example, the mems 32 is suspended on the base 31, which means that the mems 32 is supported above the base 31 but not connected to the base 31, so that the mems 32 can move relative to the base 31. It is not required that the mems 32 and the base 31 have a clearance therebetween, that is, even if the mems 32 is placed on the base 31, it can still move relative to the base 31 as long as it is not fixedly connected to the base 31. It will be mentioned later that the circuit board 36 or other structure is suspended from the base 31 as well.

The displacement adjustment assembly 35 of the present application can be implemented in a variety of ways.

As a first embodiment, further referring to fig. 6, fig. 6 is a schematic structural diagram of a displacement adjusting assembly 35 in this embodiment, the displacement adjusting assembly 35 includes:

the first hollow substrate 351 is fixed on the base 31, and the first hollow substrate 351 is used for electrically connecting an external circuit;

the planar flexible board 352 is located between the base 31 and the mems 32 and located in the first hollow region 3511, the planar flexible board 352 is a planar spiral flexible board and has a first connection end 3521 and a second connection end 3522, and the first connection end 3521 is fixedly connected to the first hollow substrate 351;

the movable hard board 353 is positioned on one side of the base 31 facing the anti-shake motor 34 (i.e., the movable hard board 353 is positioned above the base in fig. 6) and is positioned in the first hollow-out area 3511, and the movable hard board 353 is fixedly connected with the second connecting end 3522, so that the movable hard board 353 is suspended above the base 31 through the flexible soft board; the movable hard plate 353 is also fixedly connected to the fixing portion 321.

The displacement adjusting assembly 35 with the above structure can suspend the movable hard board 353 above the base 31 by using the first hollow substrate 351 and the planar flexible soft board 352, and suspend the mems 32 and the driving element 341 of the anti-shake motor 34 above the base 31 through the fixed connection between the movable hard board 353 and the fixing portion 321 of the mems 32. Namely: suspension of the movable hard plate 353, the micro-electromechanical system 32, and the driving member 341 of the anti-shake motor 34 entirely above the base 31 is realized. Thus, when the driving member 341 of the anti-shake motor 34 moves for anti-shake, the micro-electromechanical system 32 can be effectively driven to move, and in this process, the displacement adjusting assembly 35 assembly can meet the requirement of a larger displacement stroke through the movable hard plate 353 and the planar flexible soft plate 352.

The flexible flat plate 352 is the flexible circuit board 36 having a flat plate shape, and has a certain flexibility and a certain deformation, and can generate a certain movement amount along with the movement of the movable hard plate 353. More specifically, the planar flexible board 352 is a spiral flexible circuit board 36 formed by gradually bending and winding from the center of the first hollow area 3511 to the direction of the first hollow substrate 351, and two oppositely arranged first connection ends 3521 and two oppositely arranged second connection ends 3522 are respectively led out from the outer edge of the spiral flexible circuit board 36. The spiral design is beneficial to provide more displacement variation for the movement of the movable hard plate 353, and ensure that the movement of the movable hard plate 353 does not damage the planar flexible soft plate 352.

In the embodiment of the present application, the first connection end 3521 of the spiral flexible flat plate 352 is fixedly connected to the first hollow substrate 351, the second connection end 3522 is fixedly connected to the movable hard plate 353, the first hollow substrate 351 is fixed to the base 31, and the movable hard plate 353 is only located in the first hollow region 3511 and is not connected to the first hollow substrate 351 or the base 31. Due to the connection manner and the flexible circuit board 36 having a certain flexibility and being deformable as described in the previous paragraph, the movable hard board 353 can be located above the base 31 and in the hollow area of the first hollow substrate 351 in a suspended manner. That is, the movable hard board 353 only has a connection relationship with the spiral planar flexible soft board 352, and the flexible soft board has a certain deformability, so that the flexible soft board can suspend the movable hard board 353 above the base 31, and ensure that the movable hard board 353 has a certain movable space, that is, the movable hard board 353 corresponds to the movable circuit board 36.

Therefore, when the movable hard board 353 is fixedly connected to the fixing portion 321 of the mems 32, the movable hard board 353 can be indirectly fixedly connected to the driving member 341 of the anti-vibration motor 34 through the fixing portion 321. When the driving member 341 of the anti-shake motor 34 moves according to the shake condition, the micro-electromechanical system 32 and the movable hard plate 353 can be driven to move, the micro-electromechanical system 32 can drive the photosensitive chip 33 to move while moving, the movable hard plate 353 can be moved by the spiral planar flexible soft plate 352, and in addition, the movable hard plate 353 is only located in the first hollow-out region 3511, so that the movable hard plate 353 can provide a larger stroke guarantee for the movement of the anti-shake motor 34.

Further, in this embodiment, as shown in fig. 6, the displacement adjusting assembly 35 includes two strip-shaped movable hard plates 353, the two movable hard plates 353 are disposed opposite to each other, any one movable hard plate 353 is fixedly connected to one second connecting end 3522, and a gap is formed between an edge of any one movable hard plate 353 and an edge of the first hollow substrate 351.

The movable hard board 353 is two strip-shaped hard circuit boards 36 which are arranged oppositely, and a gap is formed between the two movable hard boards 353 and the edge of the first hollow substrate 351, so that the spiral planar flexible soft board 352 in the middle of the first hollow area 3511 is conveniently connected with the first hollow substrate 351 and the movable hard board 353, namely the two movable hard boards 353 are arranged oppositely, more space is reserved in the middle, the planar flexible soft board 352 can extend out of the first connecting end 3521 to be connected with the first hollow substrate 351, and when the movable hard board 353 is suspended, the movable hard board 353 can move in a certain displacement stroke through the gap between the movable hard board 353 and the edge of the first hollow substrate 351.

In the embodiment of the present application, the first connection end 3521 is further electrically connected to the first hollow substrate 351, the second connection end 3522 is further electrically connected to the movable hard board 353, and the movable hard board 353 is further electrically connected to the circuit board 36.

The displacement adjustment assembly 35 of the embodiment of the present application can realize the integral anti-shake of the anti-shake motor 34 and the micro electro mechanical system 32 through the suspension arrangement of the movable hard plate 353, and can ensure the effective and stable electrical connection between the circuit board 36 and the photosensitive chip 33 and the micro electro mechanical system 32 through the electrical connection arrangement between the structures of the displacement adjustment assembly 35. That is to say, through above-mentioned displacement adjustment assembly, can realize two kinds of functions of electricity connection and suspension simultaneously, just so need not to use two sets of different functional component to realize electricity connection, suspension function respectively, do benefit to and simplify structural design, reduce anti-shake mechanism size.

Specifically, the first hollow substrate 351 and the movable hard board 353 in this embodiment are both PCB boards, that is, both hard circuit boards 36, and the flat flexible board 352 is an FPC board, that is, a flexible circuit board 36. The first hollow substrate 351 is used for being electrically connected with an external circuit, two connecting ends of the planar flexible soft board 352 are respectively electrically connected with the first hollow substrate 351 and the movable hard board 353, the movable hard board 353 is electrically connected with the circuit board 36 through a gold wire or an ACF (Anisotropic Conductive Film) process and the like, and the circuit board 36 is electrically connected with the photosensitive chip 33 and the micro electro mechanical system 32. That is to say, after entering the anti-shake mechanism 3 from the external circuit, the electrical signal is sequentially transmitted through the first hollow substrate 351, the flexible circuit board 36, the movable hard board 353 and the circuit board 36, and then is respectively transmitted to the photosensitive chip 33 and the mems 32 from the circuit board 36.

In this embodiment, referring back to fig. 5, the anti-shake mechanism 3 further includes a housing 37, the housing 37 is fixedly connected to the base 31 through the first hollow substrate 351, so that the housing 37, the first hollow substrate 351 and the base 31 enclose a first accommodating cavity 371, and the mems 32, the photo sensor chip 33, the anti-shake motor 34, the displacement adjusting module 35 and the circuit board 36 are all packaged in the first accommodating cavity 371. The mode of modularly packaging the anti-shake mechanism 3 can be conveniently assembled and disassembled with other part structures, and the integral integration level is high. In addition, because the circuit board 36, the displacement adjusting assembly 35 with electrical connection characteristic, and other electrical properties are packaged in the first receiving cavity 371, these components are packaged into an integrated modular structure, and the electrical components can be effectively isolated from the outside, so as to achieve the protection effects of water resistance, corrosion resistance, and the like.

Note that, when the anti-shake mechanism 3 of the above-described type is employed to include the housing 37 and the independent structure is realized by packaging, the housing 37 has the top plate 372 located opposite to the base, and the fixing member in the anti-shake motor 34 is fixedly disposed on a surface of the top plate 372 facing the base 31, that is, the fixing member (e.g., the fixed magnetic member) is disposed on a surface of the top plate 372 facing downward.

With further reference to fig. 7, fig. 7 is an exploded view of the focus motor 2 (with lens 1) and the anti-shake mechanism 3 of the image pickup apparatus 900 according to the embodiment of the present application. In the imaging apparatus 900 according to the embodiment of the present application, the anti-shake mechanism 3 is disposed below the lens assembly 10, specifically, the focus motor 2 has the motor base 21, and the housing 37 of the anti-shake mechanism 3 is fixedly connected to the motor base 21, so that the anti-shake mechanism 3 is disposed below the lens assembly 10, that is, the anti-shake mechanism 3 is located on the image side of the lens 1. Because the anti-shake mechanism 3 is through the shell 37, first fretwork base plate 351, the first holding chamber 371 that base 31 formed jointly encapsulates its spare part structure as an organic whole, so when needing to load and unload camera device 900, only need with the anti-shake mechanism 3 who encapsulates with assembled lens subassembly 10 carry out fixed connection can, so not only can effectively improve camera device 900's assembly efficiency, but also can be when needing the maintenance, only dismantle the maintenance to anti-shake mechanism 3, need not to disassemble whole camera device is whole.

As a second embodiment, referring to fig. 8 to 15, where fig. 8 and 9 are an image pickup apparatus 900 according to an embodiment of the present application, in order to show the internal structure more clearly, fig. 9 omits an upper cover of the housing 91. Fig. 10 is an exploded view of the image pickup apparatus 900 according to the embodiment of the present application. Fig. 11 to 13 are a front view and a cross-sectional view taken from two different directions of an image pickup apparatus 900 according to an embodiment of the present application. Fig. 14 and 15 are assembly views of the displacement adjusting unit 35 according to the present embodiment, respectively, assembled with other structures.

The displacement regulating assembly 35 includes:

the second hollow substrate 354, the second hollow substrate 354 is fixed on the base 31, and the second hollow substrate 354 is used for electrically connecting an external circuit;

the cantilever-type flexible board 355, the cantilever-type flexible board 355 includes a cantilever portion 3551, and a first transverse connecting portion 3552 and a second transverse connecting portion 3553 which are formed by extending and bending from the cantilever portion 3551 to the base 31, the first transverse connecting portion 3552 is fixedly connected with the second hollow substrate 354, and the second transverse connecting portion 3553 is fixedly connected with the circuit board 36, so that the circuit board 36 is arranged in a suspended manner relative to the base 31;

the circuit board 36 is also fixedly connected to the mems 32 and the driving member 341 of the anti-vibration motor 34.

By using the flexible cantilever-type flexible board 355, the circuit board 36 can be directly suspended on the movable board of the base 31, and the circuit board 36 is respectively fixedly connected to the driving member 341 of the anti-vibration motor 34 and the mems 32, that is, the flexible cantilever-type flexible board 355 can suspend the whole body fixedly connected to the circuit board 36 above the base 31, so that the anti-vibration motor 34 can drive the relevant components to move.

Further, the cantilever portion 3551 is disposed around the periphery of the mems 32, the circuit board 36 and the anti-shake motor 34. By the arrangement mode, the free space of the anti-shake mechanism 3 can be fully utilized, and the size of the camera device is favorably reduced. Specifically, in the first embodiment, the flexible printed circuit board has a planar structure, and the flexible printed circuit board is thin and is only assembled with a structure such as a mems in a stacked manner, so that the space occupied by the flexible printed circuit board is small. However, in the present embodiment, the flexible board is a cantilever structure, and there is a vertical cantilever portion extending along the optical axis direction of the lens 1, which occupies a large space, so that the peripheral spaces of the mems 32, the circuit board 36, the anti-shake motor 34, and the like are fully utilized in the present embodiment for accommodating the cantilever portion, thereby making the structural layout of the anti-shake mechanism 3 more compact, and making the space utilization higher, which is beneficial to reducing the product volume.

The cantilever portion 3551 of the cantilever-type flexible board 355 surrounds the periphery of the mems 32, the circuit board 36, the anti-shake motor 34, and the like, and is vertically disposed, and the whole structure is substantially rectangular; the first transverse connecting portions 3552 are bent transversely away from the photosensitive chip 33 (i.e., bent outwardly), and are located at two opposite sides of the rectangular cantilever portion 3551, and two first transverse connecting portions 3552 are respectively arranged at each side; the second transverse connecting portions 3553 are bent transversely toward the photosensitive chip 33 (i.e., inwardly), and are located at two opposite sides of the rectangular cantilever portion 3551, and two second transverse connecting portions 3553 are respectively disposed at each side. Due to the cantilever structure and the characteristics of flexibility and deformability of the flexible soft board, the circuit board 36 can be lifted up and suspended above the base 31, and a certain movement amount can be generated along with the movement of the circuit board 36.

In the embodiment of the present invention, the first transverse connecting portion 3552 is fixedly connected to the second hollow substrate 354, the second transverse connecting portion 3553 is fixedly connected to the circuit board 36, the second hollow substrate 354 is fixed on the base 31, and the circuit board 36 is fixed between the mems 32 and the anti-vibration motor 34. Due to the connection manner and the flexible board 36 having a certain flexibility and being deformable as described in the previous paragraph, the circuit board 36 can be located above the base 31 only in a suspension manner, and since the circuit board 36 is fixedly connected with the mems 32 and the driving member 341 of the anti-vibration motor 34, that is, the circuit board 36, the mems 32 and the anti-vibration motor 34 are all suspended above the base 31 and can move relative to the base 31. Thus, a large stroke guarantee can be provided for the movement of the anti-shake motor 34 by the displacement adjustment assembly 35 of the above-described structure.

In the embodiment of the present application, the first transverse connecting portion 3552 is further electrically connected to the second hollow substrate 354, and the second transverse connecting portion 3553 is further electrically connected to the circuit board 36.

The displacement adjustment assembly 35 of this application embodiment can realize through the suspension setting of circuit board 36 that anti-shake motor 34 and micro-electromechanical system 32 whole suspension, and then when the anti-shake, can also guarantee circuit board 36 respectively with sensitization chip 33, micro-electromechanical system 32's effective electric connection through the electric connection setting between each structure of displacement adjustment assembly 35.

Specifically, the second hollow substrate 354 and the circuit board 36 in this embodiment are both PCB boards, that is, both rigid circuit boards 36, and the cantilever type flexible board 355 is an FPC board, that is, the flexible circuit board 36. The second hollow substrate 354 is electrically connected to an external circuit, and two connection portions of the cantilever-type flexible board 355 are electrically connected to the second hollow substrate 354 and the circuit board 36, respectively, and then the circuit board 36 is electrically connected to the photosensitive chip 33 and the mems 32, respectively. That is, after entering the anti-shake mechanism 3 from the external circuit, the electrical signal is sequentially transmitted through the second hollow substrate 354, the cantilever-type flexible board 355, and the circuit board 36, and then is transmitted from the circuit board 36 to the photosensitive chip 33 and the mems 32, respectively.

In this embodiment, the circuit board 36 is used as a key component for electrical connection and a key component for suspending the displacement adjusting assembly 35, and the above-mentioned key structural connection and electrical connection can be realized only by one structure of the circuit board 36, so that this embodiment is also beneficial to saving the number of structural parts used by the product, reducing the volume and quality of the product, and reducing the cost.

When adopting this embodiment, owing to used flexible soft board 355 of cantilever type among the displacement adjusting part 35, it can occupy certain space, so in order to optimize product design, make full use of space, the camera device 900 of this application embodiment has carried out optimal design when adopting the anti-shake mechanism 3 of this embodiment, carries out structural assembly for open design thinking in order to prevent that shake mechanism 3 from accomplishing camera device's whole assembly. Referring back to fig. 10 to 13, the image pickup apparatus 900 has a chassis 91, and the anti-shake mechanism 3 no longer has a separate housing 37, and the anti-shake mechanism 3 and the lens assembly 10 are both located in the chassis 91. Specifically, the housing 91 is fixedly connected to the base 31 through the second hollow substrate 354, the top plate 372 of the housing 91 is connected to the top plate 372 of the base 91, so that the housing 91, the outer peripheral wall of the lens assembly 10, the second hollow substrate 354 and the base 31 together enclose a second accommodating cavity 911, the mems 32, the photo sensor chip 33, the anti-shake motor 34, the cantilever portion 3551 of the displacement adjustment assembly 35, the second transverse connecting portion 3553 and the circuit board 36 are accommodated in the second accommodating cavity 911, and the cantilever portion 3551 is accommodated in a gap between the housing 91 and the outer peripheral wall of the lens assembly 10 in a surrounding manner. Through the structural design, the space of the second accommodating cavity 911 can be fully utilized, and the size of the smaller camera device 900 can still be ensured under the condition that the displacement adjusting assembly 35 is added.

In the present embodiment, the focus motor 2 has the motor base 21, and the motor base 21 is actually the lens unit 10, and the outer peripheral wall of the motor base 21 is actually the outer peripheral wall of the lens unit 10. The present embodiment makes full use of the space of the second housing cavity 911 of the imaging apparatus 900 to reasonably house the cantilever portion 3551 of the cantilever-type flexible board 355. Specifically, a certain gap is formed between the stacked mems 32, the circuit board 36, and the anti-shake motor 34 and the side wall of the housing 91 of the image pickup apparatus 900, a certain gap is also formed between the outer peripheral wall of the motor base and the side wall of the housing 91, and the cantilever portion 3551 is disposed between the gaps in a surrounding manner, so that on one hand, the peripheral space formed by stacking and assembling the structures of the mems 32, the circuit board 36, and the anti-shake motor 34 is fully utilized, and on the other hand, the free space at the periphery of the lens 1 is fully utilized. Therefore, the displacement adjusting assembly 35 can minimize the space occupied by the camera device 900 while achieving the suspension and electrical connection functions, which is beneficial to reducing the size of the camera device 900 and making it thinner and lighter.

In the present embodiment, the lens unit 10 has a unit bottom plate that faces the base 31, and the fixture of the anti-shake motor 34 is fixed to a surface of the unit bottom plate facing the base 31. The assembly base plate is actually a plate of the motor base 21 of the focus motor 2, and one surface of the assembly base plate facing the base 31 is actually one surface of the motor base 21 of the focus motor 2 facing the base 31. In such a configuration, the housing of the anti-shake mechanism 3 is omitted, and the space of the imaging apparatus 900 can be further saved, and the size of the imaging apparatus 900 can be reduced.

In the embodiment of the present invention, the circuit board 36 is a hollow circuit board 36 having a second hollow area 361, the circuit board 36 is disposed between the anti-shake motor 34 and the mems 32, and is respectively and fixedly connected to the anti-shake motor 34 and the driving element 341 of the mems 32; the second hollow area 361 of the circuit board 36 corresponds to the position of the photosensitive chip 33, so that the photosensitive chip 33 is accommodated in the second hollow area 361.

Through setting up circuit board 36 into circuit board 36 that has the second fretwork area, and fix it between anti-shake motor 34 and micro-electromechanical system 32, firstly can make full use of the void space between anti-shake motor 34 and the micro-electromechanical system 32, secondly can utilize the fretwork area of circuit board 36 to hold the sensitization chip 33 of protrusion in micro-electromechanical system 32 fixed surface setting ingeniously, make incident light can form an image on the sensitization chip, guarantee sensitization chip 33's normal work, thirdly can more closely more conveniently realize circuit board 36 and sensitization chip 33, micro-electromechanical system 32's electricity is connected, make whole shake structure compacter reasonable like this, the size is littleer.

It can be understood that, in the embodiment of the present application, the driving element 341 of the anti-shake motor 34 and the micro electro mechanical system 32 can be fixedly connected through the circuit board 36, or the driving element 341 of the anti-shake motor 34 and the micro electro mechanical system 32 can be directly fixedly glued through an adhesive, and the purpose of fixedly connecting the two can also be achieved.

In the embodiment of the present application, the anti-shake mechanism 3 further includes an infrared filter assembly 38, and the infrared filter may be disposed at different positions. Optionally, the infrared filter assembly 38 is disposed between the anti-shake motor 34 and the mems 32, and when the anti-shake mechanism 3 includes the infrared filter assembly 38, the circuit board 36 may be disposed between the infrared filter assembly 38 and the mems 32, the circuit board 36 is respectively fixedly connected to the infrared filter assembly 38 and the fixing portion 321, and the infrared filter assembly 38 is fixedly connected to the driving member 341 of the anti-shake motor 34.

The infrared filter assembly 38 may specifically include an infrared filter and a support fixedly connected to the infrared filter, and the support is fixedly connected to the driving member 341 of the anti-shake motor 34, so that the driving member 341 of the anti-shake motor 34 drives the infrared filter to perform shake displacement compensation. Thus, the infrared filter assembly 38 and the photosensitive chip 33 can be driven by the anti-shake motor 34 to move synchronously, so that the relative position of the infrared filter and the photosensitive chip 33 is relatively fixed, and a better anti-shake adjusting effect can be ensured.

In addition, the driving member 341 of the anti-shake motor 34 is fixedly connected to the infrared filter assembly 38, the infrared filter assembly 38 is further fixedly connected to the circuit board 36, and the circuit board 36 is further fixedly connected to the mems 32, so that the driving member 341 of the anti-shake motor 34 is fixedly connected to the mems 32. On the basis, the displacement adjusting component 35 is used to connect the suspensible movable hard board 353 and the fixed portion 321, or directly suspend the circuit board 36, so as to finally realize that the mems 32 and the anti-shake motor 34 can move relative to the base 31 and realize the anti-shake function.

The infrared filter unit may be provided not in the anti-shake mechanism 3 but in another part of the image pickup apparatus 900. For example, the infrared filter assembly 38 may be disposed on the focus motor 2 and fixedly connected to the focus motor 2. With this structure, the infrared filter assembly 38 is driven by the focusing motor 2 and is not driven by the anti-shake motor 34, so that the energy consumption of the anti-shake motor 34 is reduced.

The embodiment of the present application further provides an electronic device, which has the anti-shake mechanism 3 and the image pickup apparatus 900. The electronic device may be a wearable electronic device such as a mobile phone or a smart phone, a telephone watch having the image pickup apparatus 900, or various electronic devices such as a computer, a camera, or a video recorder, and is not limited herein as long as the electronic device needs to have the image pickup apparatus 900.

The anti-shake mechanism, the camera device and the electronic device disclosed in the embodiments of the present application are introduced in detail, and specific examples are applied in the description to explain the principle and the implementation of the present application, and the description of the embodiments is only used to help understand the heat dissipation device and the electronic device and the core ideas thereof; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An anti-shake mechanism, characterized in that, anti-shake mechanism includes:

a base;

the anti-shake motor is positioned on one side of the photosensitive chip, which is far away from the micro-electro-mechanical system, and comprises a fixed part and a driving part, the driving part is directly or indirectly fixedly connected with the fixed part of the micro-electro-mechanical system, and the driving part is used for moving relative to the fixed part according to the shaking condition so as to drive the fixed part to move;

the displacement adjusting assembly is positioned on one side, facing the anti-shake motor, of the base and is used for suspending the micro-electro-mechanical system on the base;

and the circuit board is positioned above the base and is electrically connected with the photosensitive chip, the micro-electro-mechanical system and the displacement adjusting assembly respectively.

2. The anti-shake mechanism according to claim 1, wherein the displacement adjustment assembly comprises:

3. The anti-shake mechanism according to claim 2, wherein the first connection end is further electrically connected to the first hollow substrate, the second connection end is further electrically connected to the movable hard board, and the movable hard board is further electrically connected to the circuit board.

4. The anti-shake mechanism according to claim 2, further comprising a housing, wherein the housing and the base are fixedly connected through the first hollow substrate, so that the housing, the first hollow substrate and the base together enclose a first accommodating cavity, and the mems, the photo sensor chip, the anti-shake motor, the displacement adjusting assembly and the circuit board are all packaged in the first accommodating cavity.

5. The anti-shake mechanism according to claim 1, wherein the displacement adjustment assembly comprises:

the second hollow substrate is fixed on the base and used for being electrically connected with an external circuit;

the cantilever type flexible soft board comprises a cantilever part, a first transverse connecting part and a second transverse connecting part, wherein the first transverse connecting part and the second transverse connecting part extend from the cantilever part to the base direction and are formed by bending, the first transverse connecting part is fixedly connected with the second hollowed-out substrate, and the second transverse connecting part is fixedly connected with the circuit board so that the circuit board is suspended relative to the base;

6. The anti-shake mechanism according to claim 5, wherein the cantilever portion surrounds the periphery of the MEMS, the circuit board, and the anti-shake motor.

7. The anti-shake mechanism according to claim 5, wherein the first transverse connecting portion is further electrically connected to the second hollow substrate, and the second transverse connecting portion is further electrically connected to the circuit board.

8. The anti-shake mechanism according to claim 5, wherein the anti-shake mechanism is configured to fit in a camera device, the camera device further comprising a housing and a lens assembly located in the housing;

9. The anti-shake mechanism according to claim 8, wherein the lens assembly has an assembly base plate located opposite to the base, and the fixing member of the anti-shake motor is fixedly disposed on a side of the assembly base plate facing the base.

10. The anti-shake mechanism according to any one of claims 1 to 9, wherein the circuit board is a hollow circuit board having a second hollow area, and the circuit board is disposed between the anti-shake motor and the mems and is respectively fixedly connected to the driving element and the fixing element;

the photosensitive chip is accommodated in the second hollow area, and the second hollow area corresponds to the photosensitive chip in position.

11. The anti-shake mechanism according to any one of claims 1-9, further comprising an infrared filter pack disposed between the anti-shake motor and the micro-electromechanical system.

12. The anti-shake mechanism according to claim 11, wherein the circuit board is disposed between the infrared filter assembly and the mems, and the circuit board is fixedly connected to the infrared filter assembly and the fixing portion, respectively, and the infrared filter assembly is fixedly connected to the driving member.

13. The anti-shake mechanism according to any one of claims 1 to 9, wherein the anti-shake motor is a suspended wire structure anti-shake motor, a memory alloy anti-shake motor, a magnet structure anti-shake motor or a piezoelectric structure anti-shake motor.

14. An image pickup apparatus, characterized by comprising:

the anti-shake mechanism of any of claims 1 to 13, wherein the anti-shake mechanism is disposed below the lens assembly, or wherein one part of the anti-shake mechanism is disposed below the lens assembly and another part of the anti-shake mechanism surrounds the periphery of the lens assembly.

15. The imaging apparatus according to claim 14, wherein the focus motor has a motor base, and the anti-shake mechanism has a housing fixedly attached to the motor base so that the anti-shake mechanism is provided below the lens assembly.

16. The imaging apparatus according to claim 14, wherein the focus motor has a motor base provided opposite to the base, and a fixing member of the anti-shake mechanism is fixed to a surface of the motor base facing the base.

17. The camera device of claim 16, further comprising a housing, a portion of the displacement adjustment assembly being received around a gap between the housing and the outer peripheral wall of the motor base.

18. An electronic apparatus characterized by comprising the image pickup device according to any one of claims 14 to 17.