CN113394211A

CN113394211A - High-performance digital signal processing SiP circuit device based on FPGA and AD/DA converter

Info

Publication number: CN113394211A
Application number: CN202110660685.2A
Authority: CN
Inventors: 张文强; 李居强; 顾廷炜; 顾林
Original assignee: CETC 58 Research Institute
Current assignee: CETC 58 Research Institute
Priority date: 2021-06-15
Filing date: 2021-06-15
Publication date: 2021-09-14

Abstract

The invention discloses a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter, and belongs to the technical field of digital signal processing. The data signal processing device comprises an FPGA, a dual-channel ADC (analog to digital converter) and a dual-channel DAC (digital to analog converter), and the FPGA, the dual-channel ADC and the dual-channel DAC convert a Wire-Bond Chip into a Flip-Chip for connection through a rewiring process. The invention greatly reduces the volume of the data processing system, has wide use scenes and is safe and reliable.

Description

High-performance digital signal processing SiP circuit device based on FPGA and AD/DA converter

Technical Field

The invention relates to the technical field of digital signal processing, in particular to a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter.

Background

The traditional digital signal processing hardware design mode is that a signal processing core chip, an AD/DA converter chip and a corresponding configuration circuit are arranged on a PCB, so that the layout is complicated, the size is large, and the application scene is limited.

In integrated circuit packaging, traditional IC wire bonding has become increasingly unable to meet the requirements of modern packaging as the technology and design technology level of integrated circuits has improved. In addition, the traditional integrated circuit process based on ceramic packaging has various restrictions, including the problems that a bonding lead is easy to collapse and deform due to the fact that the size of a ceramic shell cavity is not matched with that of a chip, lead crossing and bonding can not be achieved between a chip bonding pad and a ceramic shell bonding finger, the corresponding relation between the corresponding requirement of the chip and a shell is inconsistent, and the like.

Disclosure of Invention

The invention mainly aims at the problems that a bonding lead is easy to collapse and deform, lead crossing cannot be bonded and the corresponding requirement of a chip and the corresponding relation of a shell are inconsistent and the like in a bonding finger of a chip pad and a ceramic shell, which are caused by the mismatching of the size of a cavity of the ceramic shell and the size of the chip in the prior art, and provides a high-performance digital signal processing (SiP) circuit device based on an FPGA (field programmable gate array) and an AD/DA (analog-to-digital) converter; by adopting the FPGA, the two-channel ADC converter and the two-channel DAC converter to carry out the design of the combined general data signal processing SiP device, the size of a data processing system is greatly reduced, and the device has wide use scenes, safety and reliability.

The invention discloses a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter, which comprises a data signal processing device and a switching substrate, wherein the data signal processing device comprises the FPGA, a double-channel ADC converter and a double-channel DAC converter, and the FPGA, the double-channel ADC converter and the double-channel DAC converter convert a Wire-Bond Chip into a Flip-Chip for connection through a rewiring process.

Preferably, the FPGA is configured to process received signal data, and signals between the FPGA and the dual-channel ADC converter and between the FPGA and the dual-channel DAC converter are transmitted through the Serdes interface and the LVDS interface, respectively.

Preferably, the configuration mode of the FPGA is a configuration circuit outside the SiP, and the SPI interface and the other interfaces are fanned out to the outside of the SiP in a mode of rewiring and FANOUT in combination with FANOUT and then connected to the FPGA.

Preferably, the adapter substrate is designed to be a ceramic-free substrate, and balls are planted on the lower surface of the adapter substrate by using an RDL (radio frequency identification) manufacturing process.

Preferably, the FPGA, the dual-channel ADC converter and the dual-channel DAC converter are reversely buckled on the upper surface of the adapter substrate in a flip-chip bonding mode and are packaged by using a plastic packaging process.

Preferably, the external interface of the FPGA includes GTX, JTAG, and a standard bus interface.

Preferably, the FPGA is a ten million gate-level FPGA.

The invention has the following beneficial effects:

the invention relates to a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter, which comprises a data signal processing device and a switching substrate, wherein the data signal processing device comprises the FPGA, a double-channel ADC converter and a double-channel DAC converter, and the FPGA, the double-channel ADC converter and the double-channel DAC converter convert a Wire-Bond Chip into a Flip-Chip for connection through a rewiring process; the invention adopts ten million gate-level FPGA as a core, a high-performance dual-channel ADC converter and a high-performance dual-channel DAC converter to carry out combined general data signal processing SiP device design, adopts a substrate-free scheme and an integrated packaging technology, greatly reduces the volume of a data processing system, has wide use scenes, and is safe and reliable.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic block diagram of a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter according to the present invention;

FIG. 2 is a schematic diagram of an integrated package of a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter according to the present invention;

fig. 3 is a schematic layout diagram of a transfer substrate of a high-performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter according to the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.

Referring to fig. 1 to 3, an embodiment of the present invention provides a high performance digital signal processing SiP circuit device based on an FPGA and an AD/DA converter, including a data signal processing device and a switch substrate, where the data signal processing device includes an FPGA, a dual-channel ADC converter, and a dual-channel DAC converter, and the FPGA, the dual-channel ADC converter, and the dual-channel DAC converter convert a Wire-Bond Chip into a Flip-Chip for connection through a rewiring process.

The FPGA is used for processing received signal data, and signals between the FPGA and the two-channel ADC converter and between the FPGA and the two-channel DAC converter are transmitted through the Serdes interface and the LVDS interface respectively.

The configuration mode of the FPGA is a configuration circuit outside the SiP, and the SPI interface and other interfaces are fanned out to the outside of the SiP in a mode of rewiring and FANOUT and then connected with the FPGA.

The adapter substrate is designed to be a ceramic-free substrate, and balls are planted on the lower surface of the adapter substrate by using an RDL (radio frequency identification) manufacturing process.

The FPGA, the double-channel ADC converter and the double-channel DAC converter are reversely buckled on the upper surface of the adapter substrate in a flip-chip welding mode and are packaged by using a plastic packaging process.

The external interface of the FPGA comprises GTX, JTAG and standard bus interface.

The FPGA is a million-gate-level FPGA or a million-gate-level FPGA.

The two-channel ADC converter is a high-performance two-channel ADC converter, the two-channel DAC converter is a high-performance two-channel DAC converter, the conversion rates of the high-performance two-channel DAC converter and the high-performance two-channel ADC converter are both larger than 12 bits, and the conversion speed is 10-100 nanoseconds.

The invention has been described in detail hereinabove with reference to specific exemplary embodiments thereof. It will, however, be understood that various modifications and changes may be made without departing from the scope of the invention as defined in the appended claims. The detailed description and drawings are to be regarded as illustrative rather than restrictive, and any such modifications and variations are intended to be included within the scope of the present invention as described herein. Furthermore, the background is intended to be illustrative of the state of the art as developed and the meaning of the present technology and is not intended to limit the scope of the invention or the application and field of application of the invention.

More specifically, although exemplary embodiments of the invention have been described herein, the invention is not limited to these embodiments, but includes any and all embodiments modified, omitted, combined, e.g., between various embodiments, adapted and/or substituted, as would be recognized by those skilled in the art from the foregoing detailed description. The limitations in the claims are to be interpreted broadly based the language employed in the claims and not limited to examples described in the foregoing detailed description or during the prosecution of the application, which examples are to be construed as non-exclusive. Any steps recited in any method or process claims may be executed in any order and are not limited to the order presented in the claims. The scope of the invention should, therefore, be determined only by the appended claims and their legal equivalents, rather than by the descriptions and examples given above.

Claims

1. The high-performance digital signal processing SiP circuit device based on the FPGA and the AD/DA converter is characterized by comprising a data signal processing device and a switching substrate, wherein the data signal processing device comprises the FPGA, a double-channel ADC (analog to digital converter) and a double-channel DAC (digital to analog converter), and the FPGA, the double-channel ADC and the double-channel DAC convert a Wire-Bond Chip into a Flip-Chip for connection through a rewiring process.

2. The high-performance digital signal processing SiP circuit device according to claim 1, wherein the FPGA is configured to process received signal data, and signals between the FPGA and the two-channel ADC converter and the two-channel DAC converter are transmitted through a Serdes interface and a LVDS interface, respectively.

3. The high-performance digital signal processing SiP circuit device based on FPGA and AD/DA converter according to claim 1, wherein the FPGA is configured in a manner of an external configuration circuit of the SiP, and the SPI interface and other interfaces are fanned out to the outside of the SiP by a rewiring and FANOUT in a manner of combining FANOUT and then connected to the FPGA.

4. The high-performance digital signal processing SiP circuit device based on FPGA and AD/DA converter of claim 1, wherein said interposer substrate is designed without ceramic substrate, and said interposer substrate lower surface is ball-mounted using RDL manufacturing process.

5. The high-performance digital signal processing SiP circuit device based on the FPGA and the AD/DA converter as claimed in claim 1, wherein the FPGA, the dual-channel ADC and the dual-channel DAC are flip-chip bonded on the upper surface of the interposer substrate and packaged by a plastic package process.

6. The circuit device of claim 1, wherein the external interface of the FPGA includes GTX, JTAG, and standard bus interfaces.

7. The high-performance digital signal processing SiP circuit apparatus based on FPGA and AD/DA converter according to claim 1, wherein the FPGA is a ten million gate-level FPGA.