CN113391525A - Photoetching plate copying machine and photoetching plate copying system - Google Patents
Photoetching plate copying machine and photoetching plate copying system Download PDFInfo
- Publication number
- CN113391525A CN113391525A CN202110635723.9A CN202110635723A CN113391525A CN 113391525 A CN113391525 A CN 113391525A CN 202110635723 A CN202110635723 A CN 202110635723A CN 113391525 A CN113391525 A CN 113391525A
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- plate
- plate frame
- frame
- photoetching
- exposure unit
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- 238000001259 photo etching Methods 0.000 title claims abstract description 45
- 239000000428 dust Substances 0.000 claims abstract description 9
- 238000000206 photolithography Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 238000013022 venting Methods 0.000 claims 2
- 230000007547 defect Effects 0.000 abstract description 8
- 238000011109 contamination Methods 0.000 abstract description 5
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The application discloses photoetching version reprinting machine and photoetching version reprinting system, photoetching version reprinting machine includes: the device comprises a bottom plate, an upper plate frame, a lower plate frame, a hinge assembly structure and an exposure unit; the lower plate frame is positioned on one side of the bottom plate, the upper plate frame is movably connected with the lower plate frame through a hinge assembly structure, and the exposure unit is positioned on one side of the upper plate frame, which is far away from the lower plate frame; the lower plate frame and the upper plate frame are used for accommodating a photoetching plate to be manufactured; the exposure unit is used for providing a light source to expose the master plate graph to be exposed to the photoetching plate in a contact mode, the photoetching plate with the graph shape and the size line width consistent with the master plate can be manufactured through the arrangement, the problems that the master plate has dust, scratches, contamination and the like, the defects existing on the surface of the exposed chip seriously affect the product qualification rate, the electrical parameters and the quality are solved, and meanwhile, the cost of raw materials of the photoetching plate is greatly reduced.
Description
Technical Field
The application relates to the field of semiconductor manufacturing, in particular to a photoetching plate copying machine and a photoetching plate copying system.
Background
In a conventional semiconductor manufacturing process, when a process such as line etching is involved, a master is required to acquire a line image. Because the production quantity of semiconductor products is more, the master mask can be used in a large quantity, so that the master mask can have the defects of dust, scratch, contamination and the like, and further the defects existing on the surface of the exposed chip can seriously influence the product qualification rate, the electrical parameters and the quality. Moreover, the master plate is expensive to manufacture, which increases the production raw material cost to some extent.
Disclosure of Invention
The application provides a photoetching plate copying machine and a photoetching plate copying system.
In a first aspect, an embodiment of the present application provides a lithographic plate copying machine, including a base plate, an upper plate frame, a lower plate frame, a hinge assembly structure, and an exposure unit;
the lower plate frame is positioned on one side of the bottom plate, the upper plate frame is movably connected with the lower plate frame through a hinge assembly structure, and the exposure unit is positioned on one side of the upper plate frame, which is far away from the lower plate frame;
the lower plate frame and the upper plate frame are used for accommodating a photoetching plate to be manufactured;
the exposure unit is used for providing a light source to expose the master plate pattern to be exposed onto the photoetching plate in a contact mode.
In one possible embodiment, the upper chase includes an upper groove and the lower chase includes a lower groove;
the upper and lower groove shapes match each other, and the dimensions of the upper and lower grooves match the master pattern.
In one possible embodiment, the upper groove comprises an annular sealing gasket, a through hole and a limiting strip;
the annular sealing gasket is positioned in the upper groove;
the through hole is opened in one side of upper groove, and spacing strip runs through the through hole, and spacing strip is used for fixed annular sealing pad.
In a possible embodiment, the device further comprises a support rod;
one side of the supporting rod is movably connected with the bottom plate, and the supporting rod is used for providing supporting force when the upper chase and the lower chase are in an open state.
In one possible embodiment, one side of the hinge assembly structure is located at an edge of the upper chase and the other side is located at an edge of the lower chase.
In one possible embodiment, the exposure unit includes a light emitting subunit for providing a light source of a preset wavelength to irradiate onto the upper plate frame.
In a second aspect, an embodiment of the present application provides a lithographic plate copying system, including a control unit and a lithographic plate copying machine in at least one possible implementation manner of the first aspect, wherein the control unit is electrically connected to the lithographic plate copying machine;
the control unit is used for detecting whether the space between the upper plate frame and the lower plate frame is vacuum or not according to the received vacuum detection instruction; and controlling an exposure unit to expose the master plate graph to be exposed to a photoetching plate in a contact manner according to the received exposure instruction.
In a possible embodiment, the control unit is further configured to determine a material type of the reticle according to the received material detection instruction; and sending an exposure parameter configuration instruction to the exposure unit according to the type of the material so as to enable the exposure unit to configure the light source with the corresponding wavelength and the exposure time.
In a possible implementation mode, the device further comprises a laminar flow hood, the laminar flow hood is arranged around the control unit and the photoetching plate copying machine, and the laminar flow hood is used for forming a protection control unit and the photoetching plate copying machine.
In one possible embodiment, the laminar flow hood comprises a ventilation unit, a coarse filter and a high-efficiency filter, which are used to cooperate in the removal of dust from the laminar flow hood.
Compared with the prior art, the beneficial effects provided by the application comprise: the application provides a photoetching version plate-turning machine and photoetching version plate-turning system, photoetching version plate-turning machine includes: the device comprises a bottom plate, an upper plate frame, a lower plate frame, a hinge assembly structure and an exposure unit; the lower plate frame is positioned on one side of the bottom plate, the upper plate frame is movably connected with the lower plate frame through a hinge assembly structure, and the exposure unit is positioned on one side of the upper plate frame, which is far away from the lower plate frame; the lower plate frame and the upper plate frame are used for accommodating a photoetching plate to be manufactured; the exposure unit is used for providing a light source to expose the master plate graph to be exposed to the photoetching plate in a contact mode, the photoetching plate with the graph shape and the size line width consistent with the master plate can be manufactured through the arrangement, the problems that the master plate has dust, scratches, contamination and the like, the defects existing on the surface of the exposed chip seriously affect the product qualification rate, the electrical parameters and the quality are solved, and meanwhile, the cost of raw materials of the photoetching plate is greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the application and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
FIG. 1 is a schematic structural diagram of a lithographic plate copying machine according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a lithographic plate copying machine according to an embodiment of the present disclosure at another viewing angle;
FIG. 3 is a schematic view of a partial structure of a lithographic plate copying machine according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of another partial structure of a lithographic plate copying machine according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of a lithographic plate copying machine according to an embodiment of the present disclosure at another viewing angle.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "left", "right", and the like, refer to orientations or positional relationships that are based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the application conventionally position when in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The following detailed description of embodiments of the present application will be made with reference to the accompanying drawings.
In the existing semiconductor manufacturing process, a master mask produced by a manufacturer is generally used for drawing a chip circuit, and the master mask is frequently used due to the large scale of a semiconductor production line, so that the master mask is easy to have the defects of dust adhesion, scratch, contamination and the like, the surface of an exposed chip has the defects, and the qualification rate of a product and the electrical parameters and quality of the chip are seriously influenced.
To solve the technical problem in the background art, please refer to fig. 1 and fig. 2 in combination, in which fig. 1 is a schematic structural diagram of the lithographic plate copying machine provided in the embodiment of the present application at one viewing angle, fig. 2 is a schematic structural diagram of the lithographic plate copying machine provided in the embodiment of the present application at another viewing angle, and the lithographic plate copying machine will be described in detail below.
The embodiment of the application provides a photolithography plate copying machine, which comprises a bottom plate 10, an upper plate frame 20, a lower plate frame 30, a hinge assembly structure 40 and an exposure unit. The lower plate frame 30 is positioned on one side of the bottom plate 10, the upper plate frame 20 is movably connected with the lower plate frame 30 through a hinge assembly structure 40, and the exposure unit is positioned on one side of the upper plate frame 20 far away from the lower plate frame 30. The lower plate frame 30 and the upper plate frame 20 are used for accommodating a photoetching plate to be manufactured. The exposure unit is used for providing a light source to expose the master plate pattern to be exposed onto the photoetching plate in a contact mode.
Through above-mentioned photoetching version reprinting machine, can arrange the photoetching version in between last chase 20 and lower chase 30 to bottom plate 10 is as supporting, exposes the master matrix figure that the mother matrix that the exposure unit carried out the contact exposure and required the user to the photoetching version on, then can carry out operations such as follow-up etching development, and then can make the photoetching version unanimous with the master matrix. It should be understood that the manufacturing cost of the reticle thus manufactured is much less than that of the master, and the reticle capable of replacing the master is used to manufacture the circuit layer of the chip, so that the master can be ensured to be in a state of basically not being lost all the time, and the accuracy of the circuit of the manufactured chip can also be ensured. In order to facilitate the operation of the user, a handle may be further disposed on the upper chase 20, so that the user can conveniently lift the upper chase 20.
In one possible embodiment, the upper chase 20 includes an upper groove 201 and the lower chase 30 includes a lower groove. The upper 201 and lower 201 groove shapes match each other and the dimensions of the upper 201 and lower 201 grooves match the master pattern.
In the embodiment of the present application, in order to facilitate the opening of the upper chase 20 and the lower chase 30 by the user, the shapes of the upper chase 20 and the lower chase 30 may be circular, and the upper groove 201 and the small groove which are respectively opened on the upper chase 20 and the lower chase 30 may be square grooves, and the upper chase and the small groove are mutually matched to accommodate the photolithography mask. For example, if a four-inch master plate needs to be copied currently, the size of the upper groove 201 and the small groove may be five inches; if a five-inch master plate needs to be copied currently, the size of the upper groove 201 and the small groove can be six inches, which is not limited herein.
Referring to fig. 3, in one possible embodiment, the upper groove 201 includes an annular sealing gasket 202, a through hole and a stopper. An annular seal 202 is located in the upper groove 201. The through-hole is opened in one side of upper groove 201, and spacing strip runs through the through-hole, and spacing strip is used for fixed annular sealing pad 202.
In the process of exposing the photolithography mask, a sealed vacuum environment needs to be provided, and in order to ensure that the inner structures of the upper plate frame 20 and the lower plate frame 30 are sealed when the upper plate frame and the lower plate frame are closed, the annular gaskets 202 can be arranged in the upper groove 201 and the lower groove. Illustratively, the above groove 201 is taken as an example for explanation. Can set up annular seal pad 202 in last recess 201, in order to guarantee annular seal pad 202's gas tightness, can set up the through-hole on last chase 20, one side and the upper groove 201 intercommunication of through-hole, the opposite side communicates with the external world, place annular seal pad 202 in upper groove 201 after, annular seal pad 202 deformation fills each lateral wall of upper groove 201, it is hungry to one side near upper groove 201 to hide the through-hole simultaneously, can set up spacing through-hole, one side that spacing stretched into the through-hole supports annular seal pad 202, with fixed annular seal pad 202. The limiting strip can be an aluminum strip or a structure made of other metal materials.
Referring to fig. 4, it should be noted that, in order to ensure the close state between the upper plate frame 20 and the lower plate frame 30, an air exhaust hole may be formed on the upper plate frame, and a vacuum connector 203 is correspondingly disposed, one end of the vacuum connector 203 is connected to the air exhaust hole, and the other end is connected to an external air exhaust device, so that air between the upper plate frame 20 and the lower plate frame 30 is extracted by the vacuum connector 203 to form a vacuum state.
Referring to fig. 5, in one possible embodiment, a support bar 50 is further included. One side of the support bar 50 is movably connected to the base plate 10, and the support bar 50 is used to provide a supporting force when the upper chase 20 and the lower chase 30 are in an opened state.
In one possible embodiment, one side of the hinge assembly structure 40 is located at an edge of the upper chase 20 and the other side is located at an edge of the lower chase 30. To affect reticle input, hinge assembly structures 40 may be provided at the edges of the upper and lower chase 20 and 30, respectively, to enable articulation between the upper and lower chase 20 and 30 without affecting the reticle placement area.
In one possible embodiment, the exposure unit includes a light emitting subunit for providing a light source of a preset wavelength to irradiate onto the upper plate frame 20.
In order to be able to expose the master image onto the reticle in the form of a contact exposure, the light-emitting subunit may be arranged at a preset distance directly above the upper chase 20.
The embodiment of the application also provides a photoetching plate copying system which comprises a control unit and at least one photoetching plate copying machine in a possible implementation mode, wherein the control unit is electrically connected with the photoetching plate copying machine. The control unit is used for detecting whether the space between the upper plate frame 20 and the lower plate frame 30 is vacuum or not according to the received vacuum detection instruction; and controlling an exposure unit to expose the master plate graph to be exposed to a photoetching plate in a contact manner according to the received exposure instruction.
The control unit may be an electronic device including a display screen on which a user may input or trigger a vacuum detection instruction for detecting whether the upper chase 20 and the lower chase 30 are in a vacuum-sealed state. The user may also start the operation of exposing the master pattern to the photolithography mask located between the upper and lower frames 20 and 30 by inputting or triggering an exposure instruction on the display screen.
In a possible embodiment, the control unit is further configured to determine a material type of the reticle according to the received material detection instruction; and sending an exposure parameter configuration instruction to the exposure unit according to the type of the material so as to enable the exposure unit to configure the light source with the corresponding wavelength and the exposure time.
In the embodiment of the present application, the exposure time and the wavelength of the exposure light source of the reticles made of different materials are different, and can be set by a user. After exposure is completed, the photoetching plate can be taken out, and subsequent operations such as development, cleaning, blow-drying and the like are carried out to complete the copying of the master plate pattern.
In a possible implementation mode, the device further comprises a laminar flow hood, the laminar flow hood is arranged around the control unit and the photoetching plate copying machine, and the laminar flow hood is used for forming a protection control unit and the photoetching plate copying machine.
In order to prevent impurities such as indoor dust from falling on the photoetching plate and affecting the quality of the photoetching plate, a laminar flow cover can be arranged, so that the dust-free environment in the plate copying process is ensured.
In one possible embodiment, the laminar flow hood comprises a ventilation unit, a coarse filter and a high-efficiency filter, which are used to cooperate in the removal of dust from the laminar flow hood.
In summary, the photolithography plate copying machine and the photolithography plate copying system provided by the embodiment of the application can be used for manufacturing a photolithography plate with the shape, size and line width of the pattern consistent with those of the master plate, solve the problems that the master plate has dust, scratch, contamination and other defects, and the defects existing on the surface of the exposed chip seriously affect the product yield, electrical parameters and quality, and greatly reduce the cost of raw materials of the photolithography plate.
The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and various embodiments with various modifications as are suited to the particular use contemplated. The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the application to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and its practical application, to thereby enable others skilled in the art to best utilize the application and various embodiments with various modifications as are suited to the particular use contemplated.
Claims (10)
1. A photolithography plate copying machine is characterized by comprising a bottom plate, an upper plate frame, a lower plate frame, a hinge assembly structure and an exposure unit;
the lower plate frame is positioned on one side of the bottom plate, the upper plate frame is movably connected with the lower plate frame through the hinge assembly structure, and the exposure unit is positioned on one side, far away from the lower plate frame, of the upper plate frame;
the lower plate frame and the upper plate frame are used for accommodating a photoetching plate to be manufactured;
the exposure unit is used for providing a light source to expose the master plate graph to be exposed to the photoetching plate in a contact mode.
2. The lithographic plate flipper according to claim 1, wherein the upper frame includes an upper groove and the lower frame includes a lower groove;
the upper groove and the lower groove are matched in shape, and the sizes of the upper groove and the lower groove are matched with the master plate pattern.
3. The lithographic plate reproducer of claim 2, wherein the upper groove comprises an annular seal, a through hole, and a stop bar;
the annular sealing gasket is positioned in the upper groove;
the through hole is arranged on one side of the upper groove, the limiting strip penetrates through the through hole, and the limiting strip is used for fixing the annular sealing gasket.
4. The lithographic plate flipper according to claim 1, further comprising a support bar;
one side of the supporting rod is movably connected with the bottom plate, and the supporting rod is used for providing supporting force when the upper chase and the lower chase are in an open state.
5. The lithographic plate flipper according to claim 1, wherein one side of the hinge assembly structure is located at an edge of the upper frame and the other side is located at an edge of the lower frame.
6. The lithographic plate flipper according to claim 1, wherein the exposure unit comprises a light emitting subunit for providing a light source of a predetermined wavelength to illuminate the upper plate frame.
7. A lithographic plate copying system comprising a control unit and the lithographic plate copying machine of any one of claims 1-6, wherein the control unit is electrically connected to the lithographic plate copying machine;
the control unit is used for detecting whether the space between the upper plate frame and the lower plate frame is vacuum or not according to the received vacuum detection instruction; and controlling the exposure unit to expose the master plate graph to be exposed to the photoetching plate in a contact manner according to the received exposure instruction.
8. The system of claim 7, wherein the control unit is further configured to determine a material type of the reticle according to the received material detection command; and sending an exposure parameter configuration instruction to the exposure unit according to the type of the material so as to enable the exposure unit to configure a light source with a corresponding wavelength and exposure time.
9. The lithographic plate copying system of claim 7, further comprising a laminar flow hood surrounding the control unit and the lithographic plate copying machine, the laminar flow hood configured to protect the control unit and the lithographic plate copying machine.
10. The lithographic plate copying system of claim 9, wherein the laminar flow hood comprises a venting unit, a coarse filter and a high efficiency filter, the venting unit, the coarse filter and the high efficiency filter being adapted to cooperate to expel dust from the laminar flow hood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110635723.9A CN113391525A (en) | 2021-06-08 | 2021-06-08 | Photoetching plate copying machine and photoetching plate copying system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110635723.9A CN113391525A (en) | 2021-06-08 | 2021-06-08 | Photoetching plate copying machine and photoetching plate copying system |
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| Publication Number | Publication Date |
|---|---|
| CN113391525A true CN113391525A (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110635723.9A Pending CN113391525A (en) | 2021-06-08 | 2021-06-08 | Photoetching plate copying machine and photoetching plate copying system |
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| CN (1) | CN113391525A (en) |
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|---|---|---|---|---|
| GB1287340A (en) * | 1969-06-23 | 1972-08-31 | Ibm | Method and apparatus for producing photographic reproductions by contact printing |
| JPH06282075A (en) * | 1993-03-29 | 1994-10-07 | Fujikura Ltd | Exposure device for forming circuit board |
| JP2007041478A (en) * | 2005-08-05 | 2007-02-15 | Ushio Inc | Vacuum contact exposure device |
| CN201060371Y (en) * | 2007-07-23 | 2008-05-14 | 深圳新飞通光电子技术有限公司 | Simple mask plate turnover fixture |
| CN204699526U (en) * | 2015-05-13 | 2015-10-14 | 东莞市长原科技实业有限公司 | Aluminium listens the airtight air draft dust trapping device of Cover-rolling machine |
| CN105045047A (en) * | 2015-09-07 | 2015-11-11 | 深圳市路维光电股份有限公司 | Circular-ring-piece-shaped chromium plate exposure fixture and exposure method |
| CN107875744A (en) * | 2017-11-13 | 2018-04-06 | 京华建设科技有限公司 | A kind of sealed purification laminar flow hood |
| CN208180500U (en) * | 2018-05-13 | 2018-12-04 | 保升机械（上海）有限公司 | Printing machine equipped with flush type blower |
| CN208382461U (en) * | 2018-06-04 | 2019-01-15 | 南京富伟环境净化有限公司 | The ultralow ultra-clean experimental system of background isotope chemistry |
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2021
- 2021-06-08 CN CN202110635723.9A patent/CN113391525A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1287340A (en) * | 1969-06-23 | 1972-08-31 | Ibm | Method and apparatus for producing photographic reproductions by contact printing |
| JPH06282075A (en) * | 1993-03-29 | 1994-10-07 | Fujikura Ltd | Exposure device for forming circuit board |
| JP2007041478A (en) * | 2005-08-05 | 2007-02-15 | Ushio Inc | Vacuum contact exposure device |
| CN201060371Y (en) * | 2007-07-23 | 2008-05-14 | 深圳新飞通光电子技术有限公司 | Simple mask plate turnover fixture |
| CN204699526U (en) * | 2015-05-13 | 2015-10-14 | 东莞市长原科技实业有限公司 | Aluminium listens the airtight air draft dust trapping device of Cover-rolling machine |
| CN105045047A (en) * | 2015-09-07 | 2015-11-11 | 深圳市路维光电股份有限公司 | Circular-ring-piece-shaped chromium plate exposure fixture and exposure method |
| CN107875744A (en) * | 2017-11-13 | 2018-04-06 | 京华建设科技有限公司 | A kind of sealed purification laminar flow hood |
| CN208180500U (en) * | 2018-05-13 | 2018-12-04 | 保升机械（上海）有限公司 | Printing machine equipped with flush type blower |
| CN208382461U (en) * | 2018-06-04 | 2019-01-15 | 南京富伟环境净化有限公司 | The ultralow ultra-clean experimental system of background isotope chemistry |
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