CN113385467A

CN113385467A - Cleaning device, cleaning equipment and wafer processing loading platform

Info

Publication number: CN113385467A
Application number: CN202110623874.2A
Authority: CN
Inventors: 李长城; 衣忠波
Original assignee: CETC Beijing Electronic Equipment Co
Current assignee: CETC Beijing Electronic Equipment Co
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2021-09-14
Anticipated expiration: 2041-06-04
Also published as: CN113385467B

Abstract

The invention provides a cleaning device, a cleaning device and a wafer processing loading platform, wherein the cleaning device comprises: the base plate and the pressing plate are mutually closed; a first accommodating space is formed between the substrate and the pressing plate, and a first opening communicated with the outside is formed in one end face of the first accommodating space; the substrate and/or the pressure plate are/is provided with a protrusion which divides the first accommodating space into three cavities which are spaced from each other; the first cavity is communicated with the first opening, the second cavity is positioned between the first cavity and the third cavity, the first openings are communicated with the third cavity through the first side face of the protrusion, and the second openings are communicated with the first cavity through the second side face of the protrusion. The gas-water mixture passing through the second hole has a large flow velocity, so that the wafer loading platform can be cleaned, the cleanness of the wafer loading platform is guaranteed, the grinding precision of the wafer is prevented from being influenced, and the yield of the wafer in the processing process is improved.

Description

Cleaning device, cleaning equipment and wafer processing loading platform

Technical Field

The invention relates to the field of integrated circuits, in particular to a cleaning device, cleaning equipment and a wafer processing loading platform.

Background

The trend of packaging integrated circuit chips is toward miniaturization, higher density, higher performance and more functions, and thinning of chips becomes an important process in semiconductor post-packaging. In the process of thinning the wafer, the wafer loading platform must be clean and free of dust particles, otherwise, the grinding precision is affected, and even the wafer is broken.

Therefore, it is necessary to provide a cleaning apparatus to clean the wafer loading platform.

Disclosure of Invention

The invention aims to provide a cleaning device, cleaning equipment and a wafer processing loading platform so as to clean the wafer loading platform.

In order to achieve the above object, the present invention provides a cleaning apparatus comprising: the base plate and the pressing plate are mutually closed; a first accommodating space is formed between the substrate and the pressing plate, and a first opening communicated with the outside is formed in one end face of the first accommodating space; the substrate and/or the pressure plate are/is provided with a protrusion which divides the first accommodating space into three cavities which are spaced from each other; the first cavity is communicated with the first opening, the second cavity positioned between the first cavity and the third cavity is communicated with the third cavity through a plurality of first openings arranged on the first side surface of the protrusion, and is communicated with the first cavity through a plurality of second openings arranged on the second side surface of the protrusion; the first side is opposite the second side; the base plate is provided with a vent hole and a limber hole, the vent hole is communicated with the third cavity, and the limber hole is communicated with the second cavity; the high-pressure gas entering the third cavity through the vent hole enters the second cavity through the first opening and is mixed with the water introduced into the second cavity through the water through hole to form a gas-water mixture, and the gas-water mixture enters the external environment through the second opening and the first opening.

Optionally, the cleaning device further comprises: the cover body is provided with a second accommodating space, and the substrate and the pressing plate are both arranged in the second accommodating space and connected with the cover body; the cover body is provided with a second opening, and the second opening is located below the first opening.

Optionally, the cover body includes two baffles, and the two baffles are disposed on a side of the second accommodating space away from the second opening and connected to the cover body; the two baffles are arranged in parallel, and the substrate and the pressing plate are both positioned between the two baffles.

Optionally, the cleaning device further comprises: the sealing rubber strip is arranged at the edge of the lower end face of the cover body; and the sealing rubber strip is connected with the cover body in an adhesion manner.

Optionally, the cleaning device further comprises: the collecting device comprises a pipeline penetrating through the cover body, and the pipeline is connected with the cover body; one end of the pipeline is connected with a power generation device, the other end of the pipeline is connected with a storage device, and when the cleaning device performs cleaning work, the power generation device pumps out part of the gas-water mixture splashed in the second accommodating space into the storage device.

Another embodiment of the present invention provides a cleaning apparatus including the cleaning device as described above.

Optionally, the cleaning apparatus further comprises: the air supply device is connected with the air inlet through a first pipeline; and the water supply device is connected with the water inlet hole through a second pipeline.

Optionally, the cleaning apparatus further comprises: and the movement mechanism is connected with the cleaning device and is used for driving the cleaning device to be close to or far away from the device to be cleaned.

Another embodiment of the present invention provides a wafer processing apparatus carrier, which is characterized by comprising the above cleaning device.

Optionally, the cleaning device is located above the wafer processing loading platform, and an opening of the cleaning device is opposite to the wafer processing loading platform.

The technical scheme of the invention has the following beneficial effects:

according to the cleaning device provided by the embodiment of the invention, the first accommodating space is divided into three cavities, and the plurality of first openings are arranged between the second cavity and the third cavity, so that the flow velocity of high-pressure gas can be further increased when the high-pressure gas in the third cavity enters the second cavity through the plurality of first openings. After entering the second cavity, the high-pressure gas with the increased flow velocity can impact water in the second cavity, so that a gas-water mixture is formed. When the gas-water mixture enters the outside through the second opening, the gas-water mixture has a larger flow velocity, so that a device to be cleaned, such as a wafer loading table, can be cleaned, the cleanness of the wafer loading table is ensured, the grinding precision of the wafer is prevented from being influenced, and the yield of the wafer in the processing process is improved.

Drawings

Fig. 1 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;

fig. 2 is a second schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;

fig. 3 is a third schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention;

FIG. 4 is a fourth schematic structural view of a cleaning apparatus according to an embodiment of the present invention;

FIG. 5 is a fifth schematic view of a cleaning apparatus according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a cleaning apparatus according to an embodiment of the present invention.

Description of the symbols:

1 pressing plate 11, first cavity 12, second cavity 13, first opening 15 of third cavity 14, second opening 2, base 21, vent 22, water hole 3, cover 31, baffle 32, sealing rubber strip 4, collecting device 5 and moving mechanism 6 connecting plate

Detailed Description

In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help the full understanding of the embodiments of the present invention. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the embodiments provided herein, it should be understood that "B corresponding to A" means that B is associated with A from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.

Referring to fig. 1 to 4, an embodiment of the present invention provides a cleaning apparatus including:

a substrate 2 and a pressing plate 1 which are mutually butted; a first accommodating space is formed between the substrate 2 and the pressing plate 1, and a first opening communicated with the outside is formed in one end face of the first accommodating space; the substrate 2 and/or the pressing plate 1 are/is provided with a protrusion which divides the first accommodating space into three cavities which are spaced from each other; wherein the first cavity 11 is communicated with the opening, the second cavity 12 located between the first cavity 11 and the third cavity 13 is communicated with the third cavity 13 through a plurality of first openings 14 arranged on the first side surface of the protrusion, and is communicated with the first cavity 11 through a plurality of second openings 15 arranged on the second side surface of the protrusion; the first side is opposite the second side; a vent hole 21 and a water through hole 22 are formed in the substrate 2, the vent hole 21 is communicated with the third cavity 13, and the water through hole 22 is communicated with the second cavity 12; the high-pressure gas entering the third cavity 13 through the vent hole 21 enters the second cavity 12 through the first opening 14, and is mixed with the water introduced into the second cavity 12 through the water through hole 22 to form a gas-water mixture, and the gas-water mixture enters the external environment through the second opening 15 and the first opening.

The base plate 2 and the pressing plate 1 may be connected by bolts or may be connected by clamping. The assembly of the base plate 2 and the pressing plate 1 can be called as an air knife.

The direction of the first opening is the same as the direction of the gas-water mixture flowing out of the second opening 15, and the size of the first opening is far larger than that of the second opening 15. Thus, the air-water mixture can directly enter the outside after passing through the second opening 15, and therefore, the flow rate of the air-water mixture is not reduced.

According to the cleaning device provided by the embodiment of the invention, the first accommodating space is divided into three cavities, and the plurality of first openings 14 are arranged between the second cavity 12 and the third cavity 13, so that the flow rate of high-pressure gas can be further increased when the high-pressure gas in the third cavity 13 enters the second cavity 12 through the plurality of first openings 14. After entering the second chamber 12, the high pressure gas with increased flow rate can impact the water in the second chamber 12, so as to form a gas-water mixture. When the gas-water mixture enters the outside through the second opening 15, the gas-water mixture has a relatively large flow velocity, so that a device to be cleaned, such as a wafer loading table, can be cleaned, the cleanness of the wafer loading table is ensured, the grinding precision of the wafer is prevented from being influenced, and the yield of the wafer in the processing process is improved.

And because the gas-water mixture has a larger flow velocity, the dust cleaning device can also have a better cleaning effect on the dust on the wafer loading platform.

Preferably, the first opening 14 and the second opening 15 may respectively include 18 elongated holes having a diameter of 2mm, and the first opening 14 and the second opening 15 may be located in one-to-one correspondence. The diameter of the elongated hole is 2mm and the diameters of the third cavity 13 and the second cavity 12 are much larger than 2 mm. Thus, the flow rate of the high-pressure gas can be increased when the high-pressure gas passes through the first opening 14. The flow rate of the gas-water mixture may be increased as the gas-water mixture passes through the second opening 15. Therefore, the gas-water mixture can clean the wafer loading platform at a high flow rate, and the cleaning effect is improved.

Next, referring to fig. 5, a cleaning apparatus according to an embodiment of the present invention further includes: the cover body 3 is provided with a second accommodating space, and the substrate 2 and the pressing plate 1 are both arranged in the second accommodating space and connected with the cover body 3; wherein the cover 3 is provided with a second opening, which is located below the first opening.

It should be noted that the opening size of the second opening is larger than that of the first opening, and the second opening is located below the first opening, so that the gas-water mixture passing through the first opening can smoothly enter the outside through the second opening.

It should be noted that, in the process of cleaning the device to be cleaned by the air-water mixture, water mist or water drops may be splashed around. Because base plate 2 and clamp plate 1 all set up in the second accommodation space of the cover body 3, so, the water smoke that splashes or can receive blocking of the cover body 3 with the drop of water, can't splash to around. By blocking the cover body 3, splashed water mist or water drops can be prevented from entering mechanical parts of surrounding equipment, so that the accuracy of the surrounding equipment is prevented from being influenced.

Alternatively, the base plate 2 and the pressure plate 1 may be connected to the cover 3 by bolts.

Optionally, the housing 3 is rectangular, such as a cuboid or a cube. The cover 3 may also be cylindrical. In the embodiments mentioned later, the case 3 is exemplified as a rectangular parallelepiped.

In the cleaning device according to the embodiment of the present invention, the cover body 3 includes two baffles 31, and the two baffles 31 are disposed on one side of the second accommodating space away from the second opening 15 and connected to the cover body 3; the two baffles 31 are arranged in parallel, and the substrate 2 and the pressing plate 1 are both located between the two baffles 31.

It should be noted that the two baffles 31 are disposed on a side of the second accommodating space away from the second opening 15, which can be understood that the baffle 31 is disposed on the side of the second opening, for example, the lower end surface of the baffle 31 is as high as or close to the plane where the second opening is located, and the upper end surface of the baffle 31 can be close to the upper end surface of the cover 3. In this way, the blocking effect of the baffle 31 can be improved.

Further, the baffle 31 is disposed along the length direction of the cover 3, and the length of the baffle 31 is the same as that of the cover 3 in the second accommodating space. After the two baffles 31 are arranged, because the substrate 2 and the pressing plate 1 are arranged between the two baffles 31, the baffles 31 can block water mist or water drops splashed by the cleaning device in the process of cleaning devices from splashing to the areas except the area between the two baffles 31 or from splashing to the areas except the cover body 3, thereby avoiding influencing surrounding equipment.

Alternatively, the number of the baffles 31 may be 4, that is, the baffles 31 are arranged in both the length direction and the width direction of the cover 3. Here, the two baffles 31 in the longitudinal direction are parallel to each other, and the two baffles 31 in the width direction are also parallel to each other.

The cleaning device of the embodiment of the invention further comprises: the sealing rubber strip 32 is arranged at the edge of the lower end face of the cover body 3; wherein, the sealing rubber strip 32 is connected with the cover body 3 in an adhesion way.

Note that, in order to improve the sealing effect, the sealing strips may be provided all around the lower end surface of the cover 3. Optionally, a sealing strip may be disposed on a lower end surface of each baffle 31, and the sealing strip may be connected to the baffle 31 in an adhesive manner.

Typically, the bead 32 is made of rubber or other flexible material. In the cleaning process, the sealing rubber strip 32 can contact with the cleaned wafer loading platform, and the sealing rubber strip 32 is softer, so that scratches on the wafer loading platform can be avoided.

The cleaning device of the embodiment of the invention further comprises: a collecting device 4, wherein the collecting device 4 comprises a pipeline penetrating through the cover 3, and the pipeline is connected with the cover 3; one end of the pipeline is connected with a power generation device, the other end of the pipeline is connected with a storage device, and when the cleaning device performs cleaning work, the power generation device pumps out part of the gas-water mixture splashed in the second accommodating space into the storage device.

It should be noted that after the pipeline of the collecting device 4 penetrates through the cover 3 and extends to the second accommodating space, the pipeline is located above the substrate 2 and the pressing plate 1. So, can be better take out the partial air water mixture that splashes in the second accommodation space from storage device in, avoid taking out the air water mixture from the second opening outflow, and then avoid influencing the cleaning performance.

The power generating device may be, for example, a pump body, and the storage device may be, for example, a tank or a bottle. The power generation device can be fixed in the second accommodating space, optionally, can also be arranged outside the cover body 3, when the power generation device is arranged outside the cover body 3, one end of the power generation device is connected with the storage device, the other end of the power generation device is connected with the pipeline, and then part of the air-water mixture splashed in the second accommodating space is pumped out of the storage device through the pipeline.

The cleaning equipment provided by the embodiment of the invention further comprises: the air supply device is connected with the air inlet through a first pipeline; and the water supply device is connected with the water inlet hole through a second pipeline.

It should be noted that, when the gas supply device supplies the high-pressure gas to the third chamber 13 through the first pipe, the flow rate of the high-pressure gas may be controlled. Similarly, the water supply device can also control the flow rate of water when delivering water to the second chamber 12 through the second pipe. Therefore, the flow speed of the gas-water mixture flowing out of the second opening 15 can be adjusted according to actual requirements, and different cleaning effects are achieved.

Referring to fig. 6, the cleaning apparatus provided in the embodiment of the present invention further includes: and the movement mechanism 5 is connected with the cleaning device and is used for driving the cleaning device to be close to or far away from the device to be cleaned.

It should be noted that the moving mechanism 5 may be a cylinder. The moving mechanism 5 can be connected with the cover 3 and the air knife (i.e. the above-mentioned combination of the base plate 2 and the pressure plate 1) through bolts through the connecting plate 6.

In preparation for cleaning, the movement means 5 can bring the cleaning device close to the component to be cleaned. When cleaning is completed, the moving mechanism 5 can drive the cleaning device to be far away from the device to be cleaned.

Another embodiment of the present invention provides a wafer processing apparatus carrier, including the cleaning apparatus as described above.

The wafer processing loading platform can be in a clean state by adopting the cleaning equipment, so that the grinding precision of the wafer is prevented from being influenced, and the yield of the wafer in the processing process is improved.

According to the wafer processing loading platform provided by the embodiment of the invention, the cleaning equipment is positioned above the wafer processing loading platform, and the opening of the cleaning equipment is opposite to the wafer processing loading platform.

Next, a cleaning process of the wafer processing stage (i.e., the wafer stage described above, hereinafter referred to as a stage) will be described.

Firstly, the cleaning device is brought close to the loading platform by the movement mechanism 5. The distance between the cleaning device and the loading platform is small, for example, 5mm and 1cm, and the sealing rubber strip 32 is in contact with the loading platform.

Next, the loading table is started and rotated. The cleaning apparatus may remain stationary during rotation of the loading station.

Then, high pressure gas and water are respectively input to the third chamber 13 and the second chamber 12 through the inlet pipe and the inlet pipe, and the high pressure gas and the water are mixed in the second chamber 12. The air-water mixture flowing out of the second opening 15 can clean the loading platform, and splashed water mist or water drops can be prevented from splashing to surrounding equipment under the action of the baffle 31 and the sealing rubber strip 32. And the splashed water mist or water drops can be recycled into the storage device under the action of the collecting device 4, so that secondary splashing is avoided.

Finally, after the cleaning is finished, the moving mechanism 5 drives the cleaning equipment to be far away from the loading platform.

Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.

It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion.

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A cleaning device, comprising:

the base plate and the pressing plate are mutually closed; a first accommodating space is formed between the substrate and the pressing plate, and a first opening communicated with the outside is formed in one end face of the first accommodating space;

the substrate and/or the pressure plate are/is provided with a protrusion which divides the first accommodating space into three cavities which are spaced from each other; the first cavity is communicated with the first opening, the second cavity positioned between the first cavity and the third cavity is communicated with the third cavity through a plurality of first openings arranged on the first side surface of the protrusion, and is communicated with the first cavity through a plurality of second openings arranged on the second side surface of the protrusion; the first side is opposite the second side;

the base plate is provided with a vent hole and a limber hole, the vent hole is communicated with the third cavity, and the limber hole is communicated with the second cavity;

the high-pressure gas entering the third cavity through the vent hole enters the second cavity through the first opening and is mixed with the water introduced into the second cavity through the water through hole to form a gas-water mixture, and the gas-water mixture enters the external environment through the second opening and the first opening.

2. The cleaning device of claim 1, further comprising:

the cover body is provided with a second accommodating space, and the substrate and the pressing plate are both arranged in the second accommodating space and connected with the cover body;

the cover body is provided with a second opening, and the second opening is located below the first opening.

3. The cleaning device according to claim 2, wherein the cover comprises two baffles, and the two baffles are arranged on one side of the second accommodating space away from the second opening and connected with the cover;

the two baffles are arranged in parallel, and the substrate and the pressing plate are both positioned between the two baffles.

4. The cleaning device of claim 3, further comprising:

the sealing rubber strip is arranged at the edge of the lower end face of the cover body;

and the sealing rubber strip is connected with the cover body in an adhesion manner.

5. The cleaning device of claim 3, further comprising:

the collecting device comprises a pipeline penetrating through the cover body, and the pipeline is connected with the cover body;

one end of the pipeline is connected with a power generation device, the other end of the pipeline is connected with a storage device, and when the cleaning device performs cleaning work, the power generation device pumps out part of the gas-water mixture splashed in the second accommodating space into the storage device.

6. A cleaning apparatus comprising a cleaning device according to any one of claims 1 to 5.

7. The cleaning apparatus defined in claim 6, further comprising:

the air supply device is connected with the air inlet through a first pipeline;

and the water supply device is connected with the water inlet hole through a second pipeline.

8. The cleaning apparatus defined in claim 6, further comprising:

and the movement mechanism is connected with the cleaning device and is used for driving the cleaning device to be close to or far away from the device to be cleaned.

9. A wafer processing station comprising the cleaning apparatus of any one of claims 6 to 8.

10. The wafer processing load station of claim 9, wherein the cleaning apparatus is positioned above the wafer processing load station with the opening of the cleaning apparatus opposite the wafer processing load station.