CN113385447B - Integrated circuit encapsulation glue overflow removing equipment - Google Patents
Integrated circuit encapsulation glue overflow removing equipment Download PDFInfo
- Publication number
- CN113385447B CN113385447B CN202110678702.5A CN202110678702A CN113385447B CN 113385447 B CN113385447 B CN 113385447B CN 202110678702 A CN202110678702 A CN 202110678702A CN 113385447 B CN113385447 B CN 113385447B
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- scraping
- plate
- block
- integrated circuit
- glue
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- 239000003292 glue Substances 0.000 title claims abstract description 65
- 238000005538 encapsulation Methods 0.000 title claims description 4
- 238000007790 scraping Methods 0.000 claims abstract description 60
- 238000004140 cleaning Methods 0.000 claims description 14
- 239000000084 colloidal system Substances 0.000 claims 6
- 239000007787 solid Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000005491 wire drawing Methods 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
- B08B1/165—Scrapers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses integrated circuit packaging glue overflow removing equipment, which structurally comprises a main body, a control panel and an alarm lamp, wherein the control panel is arranged at the front end of the main body, the alarm lamp is arranged at the top end of the main body, the main body comprises a conveying belt, a shell, a dustproof curtain and removing equipment, the removing equipment comprises a lifting seat, a mounting seat, a telescopic arm, a scraping plate and a carrier plate device, the scraping plate comprises a fixed plate, an empty groove, a reset spring and a buffer plate, the buffer plate comprises a glue scraping plate, a storage groove, a storage block and a scraping head, and the scraping head comprises a scraping body, a glue removing block, a supporting seat and a rubber layer.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to integrated circuit packaging glue overflow removing equipment.
Background
In the process of packaging an integrated circuit, the problem of glue overflow on the end face of the package often exists, and the reasons for glue overflow are numerous, for example, the situation that the glue overflow is caused by deformation of a lead frame and the situation that the glue overflow is caused by protrusion of a frame band is serious, and the glue overflow is possibly scrapped directly to reduce the yield of the package of the integrated circuit, so that the glue overflow in the integrated circuit needs to be cleaned by using glue overflow cleaning equipment.
Based on the above findings of the present inventors, the existing integrated circuit package flash cleaning apparatus mainly has the following drawbacks, for example: in the process of scraping the overflow glue on the end face of the integrated circuit by the glue scraping device, as the overflow glue has certain viscosity, when the glue scraping device is separated from the end face of the integrated circuit board, one end of the overflow glue can be stuck with the glue scraping device, and the other end of the overflow glue is stuck with the tail end of the integrated circuit, so that the scraped overflow glue is in a wiredrawing condition in the integrated circuit.
Disclosure of Invention
In view of the above problems, the present invention provides an integrated circuit package flash cleaning apparatus.
In order to achieve the above object, the present invention is realized by the following technical scheme: the utility model provides an integrated circuit encapsulation glue overflow equipment of cleaing away, its structure includes main part, control panel, warning light, the main part front end is equipped with control panel, the top at the main part is installed to the warning light, the main part includes conveyer belt, casing, dustproof curtain, cleaing away equipment, the conveyer belt is transversely installed in the upper end of main part, the casing is located the top of main part and is in the middle of, dustproof curtain is equipped with two, and sets up both ends around the casing respectively, the inside in the middle of the main part is installed to the clearance equipment.
Further, the cleaning equipment comprises a lifting seat, a mounting seat, a telescopic arm, a scraping plate and a carrier plate device, wherein the lifting seat is clamped at the side end of the shell, the mounting seat is arranged at the upper end of the side face of the lifting seat, the telescopic arm is transversely arranged on the right side of the inside of the mounting seat, the scraping plate is embedded at the tail end of the telescopic arm, the carrier plate device is arranged at the lower end of the lifting seat, and the carrier plate device is clamped at the lower end of the side face of the lifting seat.
Further, strike-off board includes fixed plate, empty slot, reset spring, buffer board, the inside bottom of fixed plate is equipped with the empty slot, reset spring installs the inside at the empty slot, the buffer board block is in the inside of empty slot, reset spring and buffer board clearance fit.
Further, the buffer plate comprises a scraping plate, a storage groove, a storage block and a scraping head, the storage groove is formed in the left side end face of the scraping plate, the end face of the storage groove is arc-shaped, the storage block is provided with two upper end faces which are respectively embedded in the storage groove, the scraping head is embedded in the bottom end of the scraping plate, and an included angle formed between the storage block and the end face of the storage groove is 90 degrees.
Further, the scraping head comprises a scraping body, a stripping block, a supporting seat and a rubber layer, wherein the stripping block is arranged at the right end of the scraping body, the end face of the stripping block is gradually bent from the bottom end to the upper end, the supporting seat is embedded in the middle of the bottom of the scraping body, the rubber layer is embedded in the outer end face of the supporting seat, and a certain gap exists between the rubber layer and the supporting seat.
Further, the support plate device comprises a support plate, fixing blocks, rollers and a degumming device, wherein the support plate is hollow, the fixing blocks are four and are respectively arranged at the top ends of the support plate, the rollers are eight and are transversely arranged at the bottom ends of the support plate, the degumming device is fixedly embedded at the rear end of the support plate, and the rollers are movably matched with the bottom ends of the support plate.
Further, the degumming device comprises a movable groove, a rubber ring and a rubber pulling block, wherein the movable groove is arranged in the degumming device, the rubber ring is embedded and fixed at the bottom of the movable groove, the rubber pulling block is clamped at the left side of the movable groove, and the rubber ring is in movable fit with the rubber pulling block.
Further, the glue pulling block comprises a glue pulling body, a clamping block, a contact layer, a shaking groove and a wire breaking block, wherein the upper end face of the glue pulling body is arc-shaped, the clamping block is embedded and fixed at the rear end of the glue pulling body, the contact layer is attached to the upper end face of the glue pulling body, the shaking groove is provided with more than five parts and is transversely arranged on the upper end face of the glue pulling body, the wire breaking block is embedded and fixed at the bottom of the front end of the glue pulling body, and the wire breaking block is in a reverse hook shape.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the scraped overflow glue is blocked by the storage block, so that the overflow glue can drop downwards along the end face of the storage block, the overflow glue is prevented from being stuck on the scraping plate, the end face of the stripping block is gradually bent from the bottom end to the upper end, and the glue overflow can be removed from the end face of the integrated circuit board by the stripping block, so that the situation of wiredrawing caused by overflow glue is avoided.
2. According to the invention, the rubber tearing block is driven to reset upwards through the reset of the rubber ring to impact the top of the movable groove, so that the end face of the rubber tearing block shakes to shake the overflow glue end, and then the overflow glue adhered to the bottom end of the scraping plate is torn off through friction between the broken wire block and the scraping plate.
Drawings
Fig. 1 is a schematic diagram of a front view structure of an integrated circuit package flash cleaning apparatus according to the present invention.
Fig. 2 is a schematic front view of the main body of the present invention.
Fig. 3 is a schematic front view of the cleaning apparatus of the present invention.
Fig. 4 is a schematic front view of the scraper plate according to the present invention.
FIG. 5 is a schematic diagram of the front view of the baffle of the present invention.
Fig. 6 is a schematic front view of the scraper head according to the present invention.
Fig. 7 is a schematic front view of a carrier device according to the present invention.
Fig. 8 is a schematic front view of the degumming device of the present invention.
Fig. 9 is a schematic front view of the pulling block of the present invention.
In the figure: the main body 1, the control panel 2, the warning light 3, the conveyor belt 11, the housing 12, the dust curtain 13, the cleaning device 14, the lifting seat 141, the mounting seat 142, the telescopic arm 143, the scraping plate 144, the carrier plate device 145, the fixing plate a1, the empty slot a2, the return spring a3, the buffer plate a4, the scraping plate a41, the storage slot a42, the storage block a43, the scraping head a44, the scraping body b1, the degluing block b2, the supporting seat b3, the rubber layer b4, the carrier plate c1, the fixing block c2, the roller c3, the degluing device c4, the movable slot c41, the rubber ring c42, the rubber tearing block c43, the rubber tearing body d1, the clamping block d2, the contact layer d3, the shaking slot d4 and the wire breaking block d5.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
Embodiment one: referring to fig. 1-6, the following are specific embodiments of the present invention:
the structure of the anti-dust alarm device comprises a main body 1, a control panel 2 and an alarm lamp 3, wherein the control panel 2 is arranged at the front end of the main body 1, the alarm lamp 3 is arranged at the top end of the main body 1, the main body 1 comprises a conveying belt 11, a shell 12, a dust-proof curtain 13 and a cleaning device 14, the conveying belt 11 is transversely arranged at the upper end of the main body 1, the shell 12 is positioned in the middle of the top of the main body 1, the dust-proof curtain 13 is provided with two parts and respectively arranged at the front end and the rear end of the shell 12, and the cleaning device 14 is arranged in the middle of the inner part of the main body 1.
The cleaning device 14 comprises a lifting seat 141, a mounting seat 142, a telescopic arm 143, a scraping plate 144 and a carrier plate device 145, wherein the lifting seat 141 is clamped at the side end of the shell 12, the mounting seat 142 is mounted at the upper side of the side face of the lifting seat 141, the telescopic arm 143 is transversely mounted at the right side of the inside of the mounting seat 142, the scraping plate 144 is embedded at the tail end of the telescopic arm 143, the carrier plate device 145 is mounted at the lower end of the lifting seat 141, and the carrier plate device 145 is clamped at the lower side end of the side face of the lifting seat 141, so that the carrier plate device 145 is driven to rotate by an air pump, the carrier plate device 145 is attached to the end face of the conveyor belt 11, and an integrated circuit board arranged on the end face of the conveyor belt 11 is lifted.
The scraping plate 144 comprises a fixed plate a1, an empty slot a2, a reset spring a3 and a buffer plate a4, wherein the empty slot a2 is arranged at the bottom end of the inside of the fixed plate a1, the reset spring a3 is arranged in the empty slot a2, the buffer plate a4 is clamped in the empty slot a2, the reset spring a3 is movably matched with the buffer plate a4, the buffer plate a4 is driven to push downwards by resetting the reset spring a3, so that the buffer plate a4 can be buffered when being contacted with the end face of the integrated circuit board, the buffer plate a4 is prevented from excessively pressing the integrated circuit board, and the breakage condition of the integrated circuit board is prevented.
The buffer plate a4 comprises a scraping plate a41, a storage tank a42, a storage block a43 and a scraping head a44, wherein the storage tank a42 is arranged on the left side end face of the scraping plate a41, the end face of the storage tank a42 is arc-shaped, the storage block a43 is provided with two storage blocks and is respectively embedded and fixed on the upper end face of the storage tank a42, the scraping head a44 is embedded and fixed at the bottom end of the scraping plate a41, and an included angle formed by the storage block a43 and the end face of the storage tank a42 is 90 degrees, so that the scraped overflow glue is favorably blocked.
The scraping head a44 comprises a scraping body b1, a degumming block b2, a supporting seat b3 and a rubber layer b4, wherein the degumming block b2 is arranged at the right end of the scraping body b1, the end face of the degumming block b2 is gradually bent from the bottom end to the upper end, the supporting seat b3 is embedded in the middle of the bottom of the scraping body b1, the rubber layer b4 is embedded in the outer end face of the supporting seat b3, a certain gap exists between the rubber layer b4 and the supporting seat b3, so that the scraping head a44 can obtain buffering force, and the integrated circuit board is prevented from being scratched.
Based on the above embodiment, the specific working principle is as follows: when the scraping equipment hangs the spilled glue on the integrated circuit board and then the spilled glue is generated, the carrier plate device 145 can be driven by the air pump to rotate, so that the carrier plate device 145 is attached to the end face of the conveyor belt 11, the integrated circuit board arranged on the end face of the conveyor belt 11 is lifted up, the integrated circuit board is moved to the upper end of the carrier plate device 145, the scraping plate 144 is driven by the extension of the telescopic arm 143 to clean the spilled glue on the end face of the integrated circuit board, the reset spring a3 is movably matched with the buffer plate a4, the reset spring a3 can reset and drive the buffer plate a4 to push down, the buffer plate a4 can be buffered when contacting with the end face of the integrated circuit board, the buffer plate a4 is prevented from excessively pressing the integrated circuit board, the integrated circuit board is prevented from breaking, then the scraped overflow glue is blocked by utilizing the storage block a43, the overflow glue can drop downwards along the end face of the storage block a43, the overflow glue is prevented from being stuck on the scraping plate a41, finally, when the overflow glue on the end face of the integrated circuit is scraped by utilizing the gap between the rubber layer b4 and the supporting seat b3, the scraping head a44 is inwards sunken to be contacted with the supporting seat b3 through the rubber layer b4, the scraping head a44 can obtain buffering force, the integrated circuit board is prevented from being scratched, the end face of the stripping block b2 is gradually bent from the bottom end to the upper end, the overflow glue can be removed from the end face of the integrated circuit board by utilizing the stripping block b2, and the situation of wiredrawing caused by overflow glue is avoided.
Embodiment two: referring to fig. 7-9, the following are specific embodiments of the present invention:
the carrier plate device 145 comprises a carrier plate c1, fixing blocks c2, a roller c3 and a degumming device c4, wherein the carrier plate c1 is hollow in the inner part and the top end, the fixing blocks c2 are four and are respectively arranged at the top end of the carrier plate c1, the roller c3 is provided with eight rollers and is transversely arranged at the bottom end of the carrier plate c1, the degumming device c4 is fixedly embedded at the rear end of the carrier plate c1, and the roller c3 is movably matched with the bottom end of the carrier plate c1, so that an integrated circuit board can roll on the upper end surface of the roller c 3.
The degumming device c4 comprises a movable groove c41, a rubber ring c42 and a rubber tearing block c43, the movable groove c41 is arranged in the degumming device c4, the rubber ring c42 is embedded and fixed at the bottom of the movable groove c41, the rubber tearing block c43 is clamped at the left side of the movable groove c41, the rubber ring c42 is movably matched with the rubber tearing block c43, and surplus glue on the integrated circuit board is scraped by the scraping plate 144.
The glue pulling block c43 comprises a glue pulling body d1, a clamping block d2, a contact layer d3, a shaking groove d4 and a broken wire block d5, wherein the upper end face of the glue pulling body d1 is arc-shaped, the clamping block d2 is embedded and fixed at the rear end of the glue pulling body d1, the contact layer d3 is attached to the upper end face of the glue pulling body d1, the shaking groove d4 is provided with more than five, and is transversely arranged on the upper end face of the glue pulling body d1, the broken wire block d5 is embedded and fixed at the bottom of the front end of the glue pulling body d1, and the broken wire block d5 is of a reverse hook shape and is favorable for sliding on the shaking groove d4 through the scraping plate 144.
Based on the above embodiment, the specific working principle is as follows: utilize cylinder c3 and the bottom clearance fit who carries dish c1, can let the integrated circuit board roll at the up end of cylinder c3, thereby reduce the frictional force between integrated circuit board and the year dish c1, avoid the integrated circuit board to take place the condition of fish tail on carrying dish c1, reuse rubber circle c42 and tear the clearance fit of glue piece c43, can let strike off the board 144 and scrape unnecessary glue on the integrated circuit board, reuse strike off the board 144 and tear the terminal surface of glue piece c43 and contact, will link to carry out the pulling at the terminal glue of integrated circuit board, when strike off the board 144 break away from and tear the terminal surface of glue piece c43, drive the top that is reset striking movable groove c41 through rubber circle c42 reset, make the terminal surface that pulls the glue piece c43 take place to shake the glue that overflows, avoid the condition that the wire drawing appears in the integrated circuit board, finally utilize to set up the wire break piece d5 to fall to collude the form, can let strike off the board 144 slide on shake the groove d4, make strike off the board 144 and tear off the glue piece 144 repeatedly, again use wire break piece 144 to tear the glue piece d with the wire break piece d5 to glue that is glued to be used to shake the bottom.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The utility model provides an integrated circuit encapsulation glue overflow cleaning device, its structure includes main part (1), control panel (2), warning light (3), main part (1) front end is equipped with control panel (2), the top at main part (1) is installed in warning light (3), its characterized in that:
the main body (1) comprises a conveying belt (11), a shell (12), a dustproof curtain (13) and cleaning equipment (14), wherein the conveying belt (11) is transversely arranged at the upper end of the main body (1), the shell (12) is positioned in the middle of the top of the main body (1), the dustproof curtain (13) is arranged in two and respectively arranged at the front end and the rear end of the shell (12), and the cleaning equipment (14) is arranged in the middle of the inner part of the main body (1);
the cleaning device (14) comprises a lifting seat (141), a mounting seat (142), a telescopic arm (143), a scraping plate (144) and a carrier plate device (145), wherein the lifting seat (141) is clamped at the side end of the shell (12), the mounting seat (142) is arranged at the upper end of the side face of the lifting seat (141), the telescopic arm (143) is transversely arranged on the right side of the inside of the mounting seat (142), the scraping plate (144) is fixedly embedded at the tail end of the telescopic arm (143), and the carrier plate device (145) is arranged at the lower end of the lifting seat (141);
the scraping plate (144) comprises a fixed plate (a 1), an empty slot (a 2), a return spring (a 3) and a buffer plate (a 4), wherein the empty slot (a 2) is arranged at the bottom end of the inside of the fixed plate (a 1), the return spring (a 3) is arranged in the empty slot (a 2), and the buffer plate (a 4) is clamped in the empty slot (a 2);
the buffer plate (a 4) comprises a rubber scraping plate (a 41), a storage groove (a 42), storage blocks (a 43) and scraping heads (a 44), wherein the storage groove (a 42) is arranged on the left side end face of the rubber scraping plate (a 41), the end faces of the storage grooves (a 42) are arc-shaped, the number of the storage blocks (a 43) is two, the two storage blocks are respectively embedded and fixed on the upper end face of the storage groove (a 42), and the scraping heads (a 44) are embedded and fixed at the bottom end of the rubber scraping plate (a 41);
the scraping head (a 44) comprises a scraping body (b 1), a degumming block (b 2), a supporting seat (b 3) and a rubber layer (b 4), wherein the degumming block (b 2) is arranged at the right end of the scraping body (b 1), the end face of the degumming block (b 2) is gradually bent from the bottom end to the upper end, the supporting seat (b 3) is fixedly embedded in the middle of the bottom of the scraping body (b 1), and the rubber layer (b 4) is nested on the outer end face of the supporting seat (b 3).
2. The integrated circuit package flash removal apparatus of claim 1, wherein: the support plate device (145) comprises a support plate (c 1), fixing blocks (c 2), rollers (c 3) and a degumming device (c 4), wherein the support plate (c 1) is hollow in shape with the top end, the fixing blocks (c 2) are four and are respectively arranged at the top end of the support plate (c 1), the rollers (c 3) are eight and are transversely arranged at the bottom end of the support plate (c 1), and the degumming device (c 4) is fixedly embedded at the rear end of the support plate (c 1).
3. The integrated circuit package flash removal apparatus of claim 2, wherein: the degumming device (c 4) comprises a movable groove (c 41), a rubber ring (c 42) and a rubber pulling block (c 43), wherein the movable groove (c 41) is arranged in the degumming device (c 4), the rubber ring (c 42) is embedded at the bottom of the movable groove (c 41), and the rubber pulling block (c 43) is clamped at the left side of the movable groove (c 41).
4. The integrated circuit package flash removal apparatus of claim 3, wherein: the utility model discloses a tear gluey piece (c 43), including tearing colloid (d 1), block (d 2), contact layer (d 3), shake groove (d 4), broken silk piece (d 5), the up end of tearing colloid (d 1) is circular-arc, block (d 2) is inlayed and is solid in the rear end of tearing colloid (d 1), contact layer (d 3) laminating is in the up end of tearing colloid (d 1), shake groove (d 4) are equipped with five more, and transversely arrange in the up end of tearing colloid (d 1), broken silk piece (d 5) are inlayed and are solid in the front end bottom of tearing colloid (d 1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110678702.5A CN113385447B (en) | 2021-06-18 | 2021-06-18 | Integrated circuit encapsulation glue overflow removing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110678702.5A CN113385447B (en) | 2021-06-18 | 2021-06-18 | Integrated circuit encapsulation glue overflow removing equipment |
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| Publication Number | Publication Date |
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| CN113385447A CN113385447A (en) | 2021-09-14 |
| CN113385447B true CN113385447B (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110678702.5A Active CN113385447B (en) | 2021-06-18 | 2021-06-18 | Integrated circuit encapsulation glue overflow removing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116748184B (en) * | 2023-08-11 | 2023-11-03 | 山东汉芯科技有限公司 | Chip packaging glue overflow removing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3204651U (en) * | 2016-03-28 | 2016-06-09 | 株式会社 システムスクエア | Shielding curtain and foreign matter inspection device |
| CN206716552U (en) * | 2017-05-11 | 2017-12-08 | 李文龙 | One kind processing stock surface automatic cleaning device |
| CN107824490A (en) * | 2017-11-15 | 2018-03-23 | 李瑞蓉 | A kind of integrated antenna package excessive glue removes equipment |
| CN109127233A (en) * | 2018-10-17 | 2019-01-04 | 江门市慈美科技有限公司 | A kind of integrated circuit board excessive glue cleaning equipment |
| CN111530795B (en) * | 2020-05-14 | 2021-10-22 | 重庆电子工程职业学院 | Excessive glue clearing device for integrated circuit packaging |
| CN212703177U (en) * | 2020-07-15 | 2021-03-16 | 贵州富士亲旺光电制造有限公司 | Improved integrated circuit board production degumming device |
| CN112405970A (en) * | 2020-10-21 | 2021-02-26 | 郑州竹蜻蜓电子科技有限公司 | A excessive cleaning device that glues for integrated circuit board processing |
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Effective date of registration: 20230315 Address after: 523000 rooms 101, 201 and 301, building 2, No. 2, Keji 9 Road, Songshanhu Park, Dongguan City, Guangdong Province Applicant after: Guangdong Changxing Semiconductor Technology Co.,Ltd. Address before: 518100 longtengge 18B, Buji Longzhu garden, Longgang District, Shenzhen City, Guangdong Province Applicant before: Leng Xiangyi |
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| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A device for cleaning overflow glue in integrated circuit packaging Granted publication date: 20230425 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: Guangdong Changxing Semiconductor Technology Co.,Ltd. Registration number: Y2024980010986 |