CN113380685A - But automatically regulated's integrated circuit chip manufacture equipment - Google Patents
But automatically regulated's integrated circuit chip manufacture equipment Download PDFInfo
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- CN113380685A CN113380685A CN202110437625.4A CN202110437625A CN113380685A CN 113380685 A CN113380685 A CN 113380685A CN 202110437625 A CN202110437625 A CN 202110437625A CN 113380685 A CN113380685 A CN 113380685A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 230000001105 regulatory effect Effects 0.000 title abstract description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 31
- 230000005389 magnetism Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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Abstract
The invention discloses an integrated circuit chip manufacturing equipment capable of automatically adjusting, comprising: a base; the quick clamping mechanism is fixedly arranged at the top of the base; the air pressure control mechanism is arranged at the bottom of the inner cavity of the base; the PLC controller is arranged on the left side of the bottom end of the inner cavity of the base, and the rapid clamping mechanism and the air pressure control mechanism are electrically connected with the PLC controller; the operation panel is arranged at the top end of the front side of the base and is electrically connected with the PLC; two groups of air exchange ports are respectively arranged at the left end and the right end of the rear side of the base. This but automatically regulated's integrated circuit chip manufacture equipment can carry out the centre gripping of centering to the chip, improves the positioning accuracy in the chip course of working to can control and open and shut and the centre gripping dynamics, a large amount of costs of labor can be saved to the automatically regulated scheme, and labour saving and time saving can avoid the too big chip damage that causes of clamping-force simultaneously.
Description
Technical Field
The invention relates to the technical field of chip manufacturing, in particular to an integrated circuit chip manufacturing device capable of being automatically adjusted.
Background
The whole chip manufacturing process comprises the steps of chip design, wafer manufacturing, packaging manufacturing, testing and the like, wherein the chip manufacturing process is particularly complicated, the raw material wafer of the chip comprises silicon refined by quartz sand, the wafer is purified by silicon element (99.999%), then, the pure silicon is made into a silicon crystal bar which becomes the material of the quartz semiconductor for manufacturing the integrated circuit, the slicing is the wafer which is needed for manufacturing the chip, the thinner the wafer is, the lower the production cost is, but the higher the requirement for the process, the higher the wafer photoetching development and etching, the process is that a layer of photoresist is coated on the surface of the wafer (or the substrate) and dried, the developing solution is sprayed on the photoresist on the surface of the wafer, developing the exposed pattern, the plurality of processes are generally operated on-line, and the raw material and the semi-finished product are transferred between each unit and the machine by a manipulator;
but current automatically regulated's integrated circuit chip manufacture equipment is the manipulator and goes up unloading in the course of working, the material loading precision of manipulator is limited, and the chip course of working is very accurate, this centre gripping that needs higher precision, the chip is most square, current clamping device is mostly to use one end as the benchmark, this makes the direction precision of keeping away from the benchmark reduce gradually, in addition, this process very easily leads to certain damage to the chip, this process adopts manual regulation mostly at present, so that the control pretightning force, avoid the chip damage, but consume a large amount of costs of labor, waste time and energy.
Disclosure of Invention
The invention aims to provide an integrated circuit chip manufacturing device capable of being automatically adjusted, so as to at least solve the problems that clamping is not centered and pretightening force is difficult to control in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: an apparatus for manufacturing an automatically adjustable integrated circuit chip, comprising: a base; the quick clamping mechanism is fixedly arranged at the top of the base; the air pressure control mechanism is arranged at the bottom of the inner cavity of the base; the PLC controller is arranged on the left side of the bottom end of the inner cavity of the base, and the rapid clamping mechanism and the air pressure control mechanism are electrically connected with the PLC controller; the operation panel is arranged at the top end of the front side of the base and is electrically connected with the PLC; two groups of air exchange ports are respectively arranged at the left end and the right end of the rear side of the base;
quick clamping mechanism includes: the base is fixedly arranged on the top of the base; the shell is fixedly arranged at the top of the base; the clamping assembly is arranged at the top of the shell; and the pneumatic assembly is arranged at the right front end of the shell.
Preferably, the clamping assembly includes: the number of the stop blocks is eight, and two stop blocks are arranged outside the top of the shell along the circumferential direction respectively; the first clamping blocks are two in number and are respectively installed on the inner sides of the two groups of stop blocks positioned at the left end and the right end in a sliding mode; the two second clamping blocks are respectively installed on the inner sides of the two groups of stop blocks positioned at the front end and the rear end in a sliding manner; the four sliding chutes are respectively arranged at the top of the shell along the circumferential direction and are positioned at the inner side of the stop block; the four limiting rods are respectively arranged at the bottoms of the two first clamping blocks and the two second clamping blocks and can be slidably arranged on the inner wall of the sliding chute; the first adjusting disc is rotatably arranged at the top of the inner cavity of the shell; the second adjusting disc is rotatably arranged at the bottom of the first adjusting disc; the limiting grooves are four in number and are respectively arranged at the left end and the right end of the top of the first adjusting plate and the front end and the rear end of the top of the second adjusting plate, and the limiting rods are slidably arranged on the inner wall of the limiting grooves.
Preferably, the limiting groove is arranged in an inclined manner, and the inclined directions of the limiting groove at the top of the first adjusting plate and the top of the second adjusting plate are opposite.
Preferably, the pneumatic assembly comprises: the pneumatic sliding table is arranged at the right front end of the shell; the pneumatic sliding table can control the position of the output end by adjusting the air pressure at the front end and the rear end, high-pressure air enters from the rear end of the pneumatic sliding table, and the output end of the pneumatic sliding table moves towards the front side; high-pressure gas enters from the front end of the pneumatic sliding table, and the output end of the pneumatic sliding table moves towards the rear side; the middle part of the linkage rod is rotatably connected with the output end of the pneumatic sliding table; the two driving rods are respectively arranged at the right end of the first adjusting disk and the front end of the second adjusting disk; and one end of each connecting rod is rotatably arranged at two ends of the linkage rod, and the other end of each connecting rod is rotatably arranged at the outer ends of the two driving rods.
Preferably, the air pressure control mechanism includes: the air pump is fixedly arranged in the middle of the bottom of the inner cavity of the base and is electrically connected with the PLC; the air pump comprises an air pump, an electromagnetic directional valve, a PLC controller and a pneumatic sliding table, wherein the air pump is connected with the front end of the air pump through a connecting pipe, the front end of the air pump is connected with the rear end of the pneumatic sliding table through a connecting pipe, the front end of the pneumatic sliding table is connected with the rear end of the pneumatic sliding table through a connecting pipe, and the front end of the pneumatic sliding table is connected with the rear end of the pneumatic sliding table through a connecting pipe.
The invention has the beneficial effects that: according to the integrated circuit chip manufacturing equipment capable of being automatically adjusted, the first adjusting disc rotates clockwise, the two limiting grooves of the first adjusting disc rotate anticlockwise, the two limiting grooves and the two sliding grooves at the left end and the right end act together to extrude the two limiting rods and drive the two first clamping blocks to move inwards at the same time, the chip is centered and positioned in the left direction and the right direction, the second adjusting disc rotates anticlockwise, the two limiting grooves of the second adjusting disc rotate anticlockwise, the two limiting grooves and the two sliding grooves at the front end and the rear end act together to extrude the two limiting rods and drive the two second clamping blocks to move inwards at the same time, the chip is centered and positioned in the front direction and the rear direction, the positioning base is the center of the chip, and the positioning accuracy is extremely high; the PLC controller drives the electromagnetic directional valve to control the flow direction of high-pressure air, the high-pressure air is injected into the rear end of the pneumatic sliding table through the connecting pipe at the front side, the output end of the pneumatic sliding table drives the linkage rod to move towards the front side, the first adjusting disc and the second adjusting disc are pulled outwards to rotate at the two ends of the linkage rod through the two connecting rods, the clamping force of the first clamping block and the second clamping block is further controlled through controlling the pressure of the high-pressure air, therefore, the chip can be centered and clamped, the positioning precision in the chip processing process is improved, the opening and closing and the clamping force can be controlled, a large amount of labor cost can be saved through the automatic adjusting scheme, time and labor are saved, and meanwhile, the phenomenon that the chip is damaged due to the overlarge clamping force can be avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a front view of the present invention;
FIG. 4 is a front sectional view of the present invention;
FIG. 5 is a right side view of the present invention;
FIG. 6 is a right side sectional view of the present invention;
FIG. 7 is a bottom view of the clamping assembly;
FIG. 8 is a schematic view of a first adjustment disk;
fig. 9 is a schematic view of a second adjusting plate.
In the figure: 2. the device comprises a base, 3, a quick clamping mechanism, 31, a base, 32, a shell, 33, a clamping assembly, 331, a stop block, 332, a first clamping block, 333, a second clamping block, 334, a limiting rod, 335, a first adjusting disc, 336, a second adjusting disc, 337, a limiting groove, 338, a sliding groove, 34, a pneumatic assembly, 341, a pneumatic sliding table, 342, a linkage rod, 343, a connecting rod, 344, a driving rod, 4, an air pressure control mechanism, 41, an air pump, 42, an electromagnetic reversing valve, 43, a connecting pipe, 44, an electromagnet, 5, a PLC controller, 6, an operation panel, 7 and a scavenging port.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides a technical solution: an apparatus for manufacturing an automatically adjustable integrated circuit chip, comprising: the automatic clamping device comprises a base 2, a quick clamping mechanism 3, an air pressure control mechanism 4, a PLC (programmable logic controller) 5, an operation panel 6 and a ventilation port 7, wherein the quick clamping mechanism 3 is fixedly arranged at the top of the base 2, the quick clamping mechanism 3 is used for centering and clamping a chip and improving the positioning precision in the chip processing process, the air pressure control mechanism 4 is arranged at the bottom of an inner cavity of the base 2, the air pressure control mechanism 4 is used for controlling the opening and closing of the quick clamping mechanism 3 and the clamping force, the automatic adjustment scheme can save a large amount of labor cost, save time and labor and can avoid chip damage caused by overlarge clamping force, the PLC 5 is arranged at the left side of the bottom end of the inner cavity of the base 2, the quick clamping mechanism 3 and the air pressure control mechanism 4 are both electrically connected with the PLC 5, and the PLC 5 is modularized by an internal CPU, an instruction and data memory, an input and output unit, a power supply module, a digital simulation unit and the like, the air pressure control device comprises a base, an operation panel 6, air exchange ports 7, an air pressure control mechanism 4 and a control system, wherein instructions for executing operations such as logic operation, sequence control, timing, counting, arithmetic operation and the like are stored in the base, various types of mechanical equipment or production processes are controlled through digital or analog input and output, the operation panel 6 is arranged at the top end of the front side of the base 2 and is electrically connected with a PLC (programmable logic controller) 5, the number of the air exchange ports 7 is two, the two air exchange ports are respectively arranged at the left end and the right end of the rear side of the base 2, air is required to be extracted from the outside by the air pressure control mechanism 4 to adjust the air pressure in the system, and the air exchange ports 7 are used for balancing the air pressure in the base 2;
Preferably, the clamping assembly 33 further includes: the stop 331, the first clamp block 332, the second clamp block 333, the limiting rod 334, the first adjusting disk 335, the second adjusting disk 336, the limiting groove 337 and the sliding groove 338, wherein the number of the stop 331 is eight, two of the stop 331 are arranged at the outer side of the top of the shell 32 along the circumferential direction, the number of the first clamp block 332 is two, the stop 331 is slidably arranged at the inner sides of two sets of the stop 331 at the left end and the right end, the number of the second clamp block 333 is two, the stop 331 is slidably arranged at the inner sides of two sets of the stop 331 at the front end and the rear end, the number of the sliding groove 338 is four, the stop 338 is arranged at the top of the shell 32 along the circumferential direction and is arranged at the inner side of the stop 331, the number of the limiting rod 334 is four, the stop is respectively arranged at the bottoms of the two first clamp blocks 332 and the two second clamp blocks 333, the limiting rod 334 is slidably arranged at the inner wall of the sliding groove 338, the first adjusting disk 335 is arranged at the top of the inner cavity of the shell 32 in a rotatable manner, the second adjusting disk 336 is arranged at the bottom of the first adjusting disk 335, the number of the limiting grooves 337 is four, two ends and two ends around the top of the second adjusting disk 336 are opened at the top of the first adjusting disk 335 respectively, the limiting rods 334 are slidably installed on the inner wall of the limiting grooves 337, the limiting grooves 337 are arranged in an inclined manner, the inclined directions of the limiting grooves 337 at the top of the first adjusting disk 335 and the top of the second adjusting disk 336 are opposite, in the embodiment, the first adjusting disk 335 can control the two first clamping blocks 332 to synchronously move inwards or outwards and clamp the chip, the chip is centered and positioned at the left and right directions, the second adjusting disk 336 can control the two second clamping blocks 333 to synchronously move inwards or outwards and clamp the chip, the chip is centered and positioned at the front and back directions, specifically, the first adjusting disk 335 rotates clockwise, the two limiting grooves 337 of the first adjusting disk 335 rotate, the two limiting rods 334 are pressed under the combined action of the two limiting grooves 337 and the sliding grooves 338 at the left and right ends, and the two limiting rods 334 are pressed to simultaneously drive the two first limiting rods 334 to simultaneously The clamping block 332 moves inwards to center and position the chip in the left and right directions; the second adjusting disk 336 rotates counterclockwise, the two limiting grooves 337 of the second adjusting disk 336 rotate counterclockwise, and the two limiting grooves 337 and the two front and rear sliding grooves 338 act together to extrude the two limiting rods 334 to drive the two second clamping blocks 333 to move inward, so that the chip is centered and positioned in the front and rear directions.
Preferably, further, the pneumatic assembly 34 comprises: the pneumatic sliding table 341 is arranged at the right front end of the shell 32, the pneumatic sliding table 341 can control the position of an output end by adjusting the air pressure at the front end and the rear end of the pneumatic sliding table 341, high-pressure air enters from the rear end of the pneumatic sliding table 341, and the output end of the pneumatic sliding table 341 moves towards the front side; high-pressure gas enters from the front end of the pneumatic sliding table 341, and the output end of the pneumatic sliding table 341 moves towards the rear side; the middle part of the linkage rod 342 is rotatably connected with the output end of the pneumatic sliding table 341, the number of the driving rods 344 is two, the two driving rods are respectively arranged at the right end of the first adjusting disc 335 and the front end of the second adjusting disc 336, one end of the connecting rod 343 is respectively rotatably arranged at the two ends of the linkage rod 342, the other end is respectively rotatably arranged at the outer ends of the two driving rods 344, in this embodiment, high pressure gas enters from the front end of the pneumatic sliding table 341, the output end of the pneumatic sliding table 341 drives the linkage rod 342 to move to the rear side, the two ends of the linkage rod 342 pull the first adjusting disc 335 to rotate clockwise and the second adjusting disc 336 to rotate counterclockwise through the two connecting rods 343, and when one of the first 335 or second 336 dials reaches an extreme position, the other can continue to rotate under the action of the linkage 342 until both the first 335 and second 336 adjustment discs reach an extreme position.
Preferably, the air pressure control mechanism 4 further includes: the air pump 41, the electromagnetic directional valve 42, connecting pipe 43 and electromagnet 44, the air pump 41 is fixedly installed in the middle position of the bottom of the inner cavity of the base 2, and is electrically connected with the PLC controller 5, the air pump 41 is used for providing high-pressure air to drive the pneumatic sliding table 342 to operate, the electromagnetic directional valve 42 is installed on the right side of the air pump 41, the front end and the rear end of the electromagnetic directional valve 42 are respectively connected with the front end and the rear end of the right side of the pneumatic sliding table 341 through the connecting pipe 43, the electromagnets 44 are installed on the front side and the rear side of the electromagnetic directional valve 42, and the PLC controller 5 controls the magnetic direction of the electromagnet 44 to switch the high-pressure air from the air pump 41 to enter the front end or the rear end of the pneumatic sliding table 341 through the connecting pipe 43.
The detailed connection means is a technique known in the art, and the following mainly describes the working principle and process, and the specific operation is as follows.
Firstly, sending an instruction to a PLC (programmable logic controller) 5 through an operation panel 6, starting an air pump 41 by the PLC 5, injecting high-pressure air into an electromagnetic directional valve 42 by the air pump 41, controlling the magnetic direction of an electromagnet 44 by the PLC 5 to switch the flow direction of the high-pressure air from the air pump 41, and when the operation panel 6 sends an opening instruction, driving the electromagnet 44 positioned on the front side by the PLC 5 to drive a piston of the electromagnetic directional valve 42 to move towards the front side so as to discharge the high-pressure air from a connecting pipe 43 on the front side of the electromagnetic directional valve 42; when the operation panel 6 sends a clamping instruction, the PLC controller 5 drives the electromagnet 44 located at the rear side to drive the piston of the electromagnetic directional valve 42 to move to the rear side, so that the high-pressure air is discharged from the connecting pipe 43 at the rear side of the electromagnetic directional valve 42;
step two, high-pressure gas is injected into the rear end of the pneumatic sliding table 341 through the connecting pipe 43 at the front side, the output end of the pneumatic sliding table 341 drives the linkage rod 342 to move towards the front side, the two ends of the linkage rod 342 pull the first adjusting disc 335 to rotate clockwise and the second adjusting disc 336 to rotate anticlockwise through the two connecting rods 343, and when one of the first adjusting disc 335 or the second adjusting disc 336 reaches the limit position, the other one can continue to rotate under the action of the linkage rod 342 until both the first adjusting disc 335 and the second adjusting disc 336 reach the limit position; high-pressure gas is injected into the front end of the pneumatic sliding table 341 through the connecting pipe 43 at the rear side, the output end of the pneumatic sliding table 341 drives the linkage rod 342 to move towards the rear side, the two ends of the linkage rod 342 push the first adjusting disc 335 to rotate anticlockwise and the second adjusting disc 336 to rotate clockwise through the two connecting rods 343 towards the rear side;
step three, the first adjusting disc 335 rotates clockwise, the two limiting grooves 337 of the first adjusting disc 335 rotates counterclockwise, the two limiting grooves 337 and the two sliding grooves 338 at the left and right ends act together to extrude the two limiting rods 334 and drive the two first clamping blocks 332 to move inward, so as to center and position the chip in the left and right directions; the second adjusting disk 336 rotates anticlockwise, the two limiting grooves 337 of the second adjusting disk 336 rotate anticlockwise, the two limiting grooves 337 and the two sliding grooves 338 at the front end and the rear end act together to extrude the two limiting rods 334 and drive the two second clamping blocks 333 to move inwards, and the chip is centered and positioned in the front-rear direction;
this device can carry out the centre gripping of centering to the chip, improves the positioning accuracy in the chip course of working to can control and open and shut and the centre gripping dynamics, a large amount of costs of labor can be saved to the automatically regulated scheme, and labour saving and time saving can avoid the too big chip damage that causes of clamping-force simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An apparatus for manufacturing an automatically adjustable integrated circuit chip, comprising:
a base (2);
the quick clamping mechanism (3) is fixedly arranged at the top of the base (2);
the air pressure control mechanism (4) is arranged at the bottom of the inner cavity of the base (2);
the PLC (5) is installed on the left side of the bottom end of the inner cavity of the base (2), and the quick clamping mechanism (3) and the air pressure control mechanism (4) are electrically connected with the PLC (5);
the operation panel (6) is arranged at the top end of the front side of the base (2) and is electrically connected with the PLC (5);
two groups of air exchange ports (7) are respectively arranged at the left end and the right end of the rear side of the base (2);
the quick clamping mechanism (3) comprises:
the base (31) is fixedly arranged on the top of the base (2);
the shell (32) is fixedly arranged on the top of the base (31);
a clamping assembly (33) arranged on the top of the shell (32);
a pneumatic assembly (34) disposed at a right front end of the housing (32).
2. The apparatus of claim 1, wherein: the clamping assembly (33) comprises:
the number of the stop blocks (331) is eight, and two stop blocks are arranged on the outer side of the top of the shell (32) along the circumferential direction respectively;
the number of the first clamping blocks (332) is two, and the first clamping blocks are respectively installed on the inner sides of the two groups of stop blocks (331) positioned at the left end and the right end in a sliding manner;
the number of the second clamping blocks (333) is two, and the second clamping blocks are respectively installed on the inner sides of the two groups of the stop blocks (331) positioned at the front end and the rear end in a sliding manner;
the number of the sliding grooves (338) is four, the sliding grooves are respectively arranged at the top of the shell (32) along the circumferential direction and are positioned on the inner side of the stop block (331).
3. The apparatus of claim 2, wherein: the clamping assembly (33) further comprises:
the four limiting rods (334) are respectively arranged at the bottoms of the two first clamping blocks (332) and the two second clamping blocks (333), and the limiting rods (334) are slidably arranged on the inner wall of the sliding groove (338);
a first adjusting disk (335) rotatably mounted on the top of the inner cavity of the housing (32);
a second adjusting disk (336) rotatably mounted on the bottom of the first adjusting disk (335);
limiting grooves (337) with four numbers are respectively arranged at the left end and the right end of the top of the first adjusting disc (335) and the front end and the rear end of the top of the second adjusting disc (336), and a limiting rod (334) is slidably arranged on the inner wall of the limiting grooves (337).
4. The apparatus of claim 3, wherein: the limiting groove (337) is obliquely arranged and is positioned at the top of the first adjusting disc (335) and the limiting groove (337) at the top of the second adjusting disc (336) in opposite oblique directions.
5. The apparatus of claim 1, wherein: the pneumatic assembly (34) comprises:
a pneumatic sliding table (341) provided at the front right end of the housing (32);
the position of the output end of the pneumatic sliding table (341) can be controlled by adjusting the air pressure at the front end and the rear end, high-pressure air enters from the rear end of the pneumatic sliding table (341), and the output end of the pneumatic sliding table (341) moves towards the front side; high-pressure gas enters from the front end of the pneumatic sliding table (341), and the output end of the pneumatic sliding table (341) moves towards the rear side.
6. The apparatus of claim 5, wherein: the pneumatic assembly (34) further comprises:
the middle part of the linkage rod (342) is rotatably connected with the output end of the pneumatic sliding table (341);
two driving rods (344) respectively arranged at the right end of the first adjusting disc (335) and the front end of the second adjusting disc (336);
and one end of the connecting rod (343) is rotatably arranged at two ends of the linkage rod (342) respectively, and the other end of the connecting rod (343) is rotatably arranged at the outer ends of the two driving rods (344) respectively.
7. The apparatus of claim 1, wherein: the air pressure control mechanism (4) includes:
the air pump (41) is fixedly arranged in the middle of the bottom of the inner cavity of the base (2) and is electrically connected with the PLC (5);
solenoid directional valve (42), install in the right side of air pump (41), both ends are connected around both ends are passed through connecting pipe (43) and the right side of pneumatic slip table (341) respectively around solenoid directional valve (42), electro-magnet (44) are installed to both sides around solenoid directional valve (42), the magnetism direction of PLC controller (5) control electro-magnet (44) can switch the high-pressure air that comes from air pump (41) and pass through connecting pipe (43) and get into the front end or the rear end of pneumatic slip table (341).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110437625.4A CN113380685B (en) | 2021-04-22 | 2021-04-22 | Automatic adjustable integrated circuit chip manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110437625.4A CN113380685B (en) | 2021-04-22 | 2021-04-22 | Automatic adjustable integrated circuit chip manufacturing equipment |
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| Publication Number | Publication Date |
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| CN113380685A true CN113380685A (en) | 2021-09-10 |
| CN113380685B CN113380685B (en) | 2024-06-21 |
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| CN202110437625.4A Active CN113380685B (en) | 2021-04-22 | 2021-04-22 | Automatic adjustable integrated circuit chip manufacturing equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4915564A (en) * | 1986-04-04 | 1990-04-10 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
| US20040005212A1 (en) * | 2002-07-03 | 2004-01-08 | Wu Kung Chris | Wafer aligner |
| KR20040076733A (en) * | 2003-02-26 | 2004-09-03 | 삼성전자주식회사 | Apparatus for aligning a wafer |
| DE202012004576U1 (en) * | 2012-05-10 | 2012-08-17 | Frank Günter Fischer | Workpiece carrier for centering and fixing workpieces of various shapes, contours and diameters |
| CN105944890A (en) * | 2016-06-28 | 2016-09-21 | 宁晋昌隆电子材料制造有限公司 | Self-expanding protection disc |
| KR20190001530U (en) * | 2017-12-13 | 2019-06-21 | 노바 메주어링 인스트루먼츠 엘티디. | Wafer aligning assembly |
-
2021
- 2021-04-22 CN CN202110437625.4A patent/CN113380685B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4915564A (en) * | 1986-04-04 | 1990-04-10 | Materials Research Corporation | Method and apparatus for handling and processing wafer-like materials |
| US20040005212A1 (en) * | 2002-07-03 | 2004-01-08 | Wu Kung Chris | Wafer aligner |
| KR20040076733A (en) * | 2003-02-26 | 2004-09-03 | 삼성전자주식회사 | Apparatus for aligning a wafer |
| DE202012004576U1 (en) * | 2012-05-10 | 2012-08-17 | Frank Günter Fischer | Workpiece carrier for centering and fixing workpieces of various shapes, contours and diameters |
| CN105944890A (en) * | 2016-06-28 | 2016-09-21 | 宁晋昌隆电子材料制造有限公司 | Self-expanding protection disc |
| KR20190001530U (en) * | 2017-12-13 | 2019-06-21 | 노바 메주어링 인스트루먼츠 엘티디. | Wafer aligning assembly |
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| CN113380685B (en) | 2024-06-21 |
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