CN113372850A - Packaging adhesive film, manufacturing method thereof and photovoltaic module - Google Patents
Packaging adhesive film, manufacturing method thereof and photovoltaic module Download PDFInfo
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- CN113372850A CN113372850A CN202110609702.XA CN202110609702A CN113372850A CN 113372850 A CN113372850 A CN 113372850A CN 202110609702 A CN202110609702 A CN 202110609702A CN 113372850 A CN113372850 A CN 113372850A
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- adhesive film
- pid
- layer
- film layer
- packaging adhesive
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 226
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 107
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005507 spraying Methods 0.000 claims description 33
- 239000000178 monomer Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 13
- 230000004069 differentiation Effects 0.000 claims description 9
- 230000010354 integration Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 claims description 6
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- PFNQVRZLDWYSCW-UHFFFAOYSA-N (fluoren-9-ylideneamino) n-naphthalen-1-ylcarbamate Chemical compound C12=CC=CC=C2C2=CC=CC=C2C1=NOC(=O)NC1=CC=CC2=CC=CC=C12 PFNQVRZLDWYSCW-UHFFFAOYSA-N 0.000 claims description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 229910052981 lead sulfide Inorganic materials 0.000 claims description 3
- 229940056932 lead sulfide Drugs 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- NCOPCFQNAZTAIV-UHFFFAOYSA-N cadmium indium Chemical compound [Cd].[In] NCOPCFQNAZTAIV-UHFFFAOYSA-N 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 2
- 239000003431 cross linking reagent Substances 0.000 description 10
- 150000002500 ions Chemical class 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000005012 migration Effects 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 7
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 239000004611 light stabiliser Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 150000002978 peroxides Chemical class 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 230000002401 inhibitory effect Effects 0.000 description 4
- 239000003595 mist Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- -1 titanium oxide compound Chemical class 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- KZJDGXQASNWKSW-UHFFFAOYSA-N [In].[Cd].[In] Chemical compound [In].[Cd].[In] KZJDGXQASNWKSW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 229920006213 ethylene-alphaolefin copolymer Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- YOBAEOGBNPPUQV-UHFFFAOYSA-N iron;trihydrate Chemical compound O.O.O.[Fe].[Fe] YOBAEOGBNPPUQV-UHFFFAOYSA-N 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a packaging adhesive film, a manufacturing method thereof and a photovoltaic module, and relates to the technical field of photovoltaics. The packaging adhesive film is applied to a photovoltaic module and comprises a first adhesive film layer and an anti-PID layer, wherein the anti-PID layer is coated on the first adhesive film layer. The packaging adhesive film and the manufacturing method thereof, and the photovoltaic module are used for manufacturing the photovoltaic module.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a packaging adhesive film, a manufacturing method of the packaging adhesive film and a photovoltaic module.
Background
Under the warm and humid condition, the packaging adhesive film of the photovoltaic module is easy to hydrolyze to generate acetic acid, and the acetic acid can corrode the glass of the photovoltaic module to precipitate sodium ions. In the presence of a negative bias between the cell and the glass, sodium ions migrate from the glass to the cell surface, causing cell performance degradation, a phenomenon primarily due to Potential Induced Degradation (PID). In the prior art, although the anti-PID material can be doped in the packaging adhesive film, the anti-PID component and the packaging adhesive film material are stirred and mixed, so that the anti-PID component is unevenly distributed in the packaging adhesive film, and the problems of uneven anti-PID performance of the packaging adhesive film and uneven anti-PID performance of the battery piece in the photovoltaic module are caused.
Disclosure of Invention
The invention aims to provide a packaging adhesive film, a manufacturing method thereof and a photovoltaic module so as to improve the uniformity of PID (proportion integration differentiation) resistance of the packaging adhesive film.
In a first aspect, the present invention provides a packaging adhesive film. The packaging adhesive film is applied to a photovoltaic module and comprises a first adhesive film layer and an anti-PID layer, wherein the anti-PID layer is coated on the first adhesive film layer.
When the technical scheme is adopted, the packaging adhesive film applied to the photovoltaic module comprises the first adhesive film layer and the anti-PID layer. Because the anti PID layer is coated on the first adhesive film layer, the coating process can be utilized, the anti PID component contained in the anti PID layer is easily and uniformly dispersed on the surface of the first adhesive film layer, and on the basis, the packaging adhesive film with uniform anti PID performance can be manufactured, so that the anti PID performance of the photovoltaic module using the packaging adhesive film can be improved, and the performance of the photovoltaic module is improved. In addition, in the prior art, the anti-PID layer is arranged on the glass, so that the problems that the glass is mutually adsorbed, the anti-PID layer adsorbs dust and the like easily occur in the storage environment of the glass. Compared with the situation, when the anti-PID layer is coated on the first adhesive film layer, the first adhesive film layer and the anti-PID layer both have certain viscosity, the property of the first adhesive film layer is similar to that of the first adhesive film layer, and the storage condition is similar. In the storage environment of the first adhesive film layer, the probability that the anti-PID layer is polluted can be reduced, the stability of the anti-PID performance of the packaging adhesive film is improved, and the storage cost is reduced. Meanwhile, the material properties of the anti-PID layer and the first adhesive film layer are close. When the anti-PID layer is coated on the first adhesive film layer, the anti-PID layer can be firmly attached to the first adhesive film layer due to certain viscosity of the anti-PID layer and the first adhesive film layer, and the stability of the anti-PID performance is ensured. In addition, even if the packaging adhesive film is manufactured, the PID resistant layer can be coated on the packaging adhesive film again, so that the PID resistant performance of the packaging adhesive film is locally improved. In conclusion, the packaging adhesive film can improve the uniformity of the PID resistance, ensure the stability of the PID resistance and locally improve the PID resistance.
In some implementations, the coating is applied by spraying. At this moment, spraying equipment can be utilized to carry out spraying of different degrees aiming at each part of the first adhesive film layer, so that the distribution of the PID resistant layer on the first adhesive film layer is convenient to adjust, and the uniformity of the PID resistant performance of the packaging adhesive film is improved. And the adhesive force of the PID resistant layer on the first adhesive film layer can be adjusted by adjusting the spraying pressure, so that the bonding strength of the PID resistant layer and the first adhesive film layer is improved.
In some implementations, the coating is applied by air-assisted airless spraying or air spraying. When the air-assisted airless spraying process is adopted, the atomized particles are smaller, the atomization effect of the PID-resistant layer material can be improved, and the uniformity of the sprayed PID-resistant layer is further improved. The air spraying is not only suitable for spraying the anti-PID layer material with certain viscosity, but also can better form the anti-PID layer material into glue mist with fine particles, thereby forming a fine and uniform anti-PID layer on the first glue film layer.
In some implementations, the coating material of the anti-PID layer includes a monomer and an anti-PID component, and the mass ratio of the monomer to the anti-PID component is 100 (4-25); wherein the monomer comprises one or more of dimethyl sulfoxide, tetrahydrofuran, acrylate, ethylene glycol and butyl acetate; the anti-PID component comprises one or more of a metal oxide, a metal sulfide, a complex containing a group IV a element. When the mass ratio of the monomer to the anti-PID component is within the range, the anti-PID component can be connected in the monomer to form a barrier net, so that the ion migration is effectively blocked, and the packaging adhesive film has better anti-PID performance. When the monomer is made of the materials, the anti-PID layer material can be provided with proper viscosity, on one hand, the anti-PID layer can be firmly adhered to the first adhesive film layer, on the other hand, the anti-PID layer material can be well atomized, and uniform spraying of the anti-PID layer is facilitated. When the anti-PID component is combined with the monomer, the anti-PID component with better insulating property and the function of inhibiting ion migration can be easily dispersed in the monomer, so that the anti-PID component forms an ion blocking net, and the anti-PID property is improved.
In some implementations, the anti-PID component includes one or more of titanium dioxide, indium tin oxide, aluminum-doped zinc oxide, copper oxide, chromium oxide, vanadium pentoxide, ferric oxide, cadmium sulfide, tin sulfide, lead sulfide, cadmium diindium tetrasulfide, wurtzite sulfide, carbon nanotubes, gallium nitride, silicon carbide, zinc selenide, silicon dioxide. These specific PID components can be well combined with monomers to exert a good effect of inhibiting ion migration.
In some implementations, the mass ratio of the monomer to the anti-PID component is 100:7, and the particle size of the anti-PID component is less than or equal to 600 nm; the thickness of the anti-PID layer is 10 nm-700 nm. At the moment, in the mass ratio, the best matching between the monomer and the PID resistant component can be realized, so that the packaging adhesive film has better PID resistant performance. The anti-PID component has a small particle size, so that the light transmittance of the packaging adhesive film is improved, the anti-PID layer material can form a fine spraying mist material conveniently, and uniform spraying is facilitated. The anti PID layer of this thickness not only ensures that the encapsulation glued membrane has better light transmissivity also, ensures moreover that the encapsulation glued membrane has better anti PID effect.
In some implementations, the above encapsulation adhesive film further includes a second adhesive film layer, and the anti-PID layer is located between the first adhesive film layer and the second adhesive film layer. At this time, the anti-PID layer can be prevented from being exposed to the air, and the stability of the performance of the anti-PID layer can be ensured. Moreover, the two adhesive film layers can improve the adhesion firmness of the PID resistant layer and improve the stability of the packaging adhesive film. The thickness of the first adhesive film layer and the second adhesive film layer is less than 900 μm. At this time, the light transmittance of the packaging adhesive film can be ensured.
In a second aspect, the present invention provides a photovoltaic module. The photovoltaic module comprises the packaging adhesive film described in the first aspect or any implementation manner of the first aspect.
The advantages of the photovoltaic module provided by the second aspect can refer to the advantages of the encapsulating adhesive film described in the first aspect or any implementation manner of the first aspect, which is not further described herein.
In some implementations, the photovoltaic module further includes a battery string set and a glass cover plate, when the photovoltaic module packaging adhesive film includes a first adhesive film layer and a PID-resistant layer, the battery string set contacts the first adhesive film layer, and the PID-resistant layer contacts the glass cover plate; or the battery string group is contacted with the PID resistance layer, and the first adhesive film layer is contacted with the glass cover plate; when the photovoltaic module packaging adhesive film comprises a first adhesive film layer, a PID (proportion integration differentiation) resistant layer and a second adhesive film layer, the battery string group is in contact with the first adhesive film layer, and the glass cover plate is in contact with the second adhesive film layer. When the anti-PID layer is in contact with the glass cover plate, the effect of blocking ion migration can be achieved, and adverse effects on the battery string can be avoided.
In a third aspect, the present invention provides a method for manufacturing a packaging adhesive film. The manufacturing method of the packaging adhesive film comprises the following steps:
providing a first adhesive film layer;
and coating a PID (proportion integration differentiation) resistant layer on the first adhesive film layer.
The advantages of the method for manufacturing the packaging adhesive film provided by the third aspect can refer to the advantages of the packaging adhesive film described in the first aspect or any implementation manner of the first aspect, which will not be described again.
In some implementations, coating the anti-PID layer on the first adhesive film layer includes: the anti-PID layer was irradiated with ultraviolet rays.
In some implementations, after coating the PID resistant layer on the first adhesive film layer, the method for manufacturing the packaging adhesive film further includes: and determining that the PID resistance of the packaging adhesive film is lower than a limited condition, and coating a PID resistance layer on the first adhesive film layer again. At this time, the first glue film layer can be sprayed for multiple times or partially coated, so that the uniformity and the PID resistance of the PID resistant layer are improved. Meanwhile, local PID resistance performance improvement and personalized PID resistance performance setting are conveniently carried out on the packaging adhesive film.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a first schematic structural diagram of a packaging adhesive film according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a packaging adhesive film according to an embodiment of the invention.
Reference numerals:
in fig. 1-2, 11-the first glue film layer, 12-the anti-PID layer, 13-the second glue film layer.
Detailed Description
In order to facilitate clear description of technical solutions of the embodiments of the present invention, in the embodiments of the present invention, terms such as "first" and "second" are used to distinguish the same items or similar items having substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
It is to be understood that the terms "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.
In the present invention, "at least one" means one or more, "a plurality" means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a and b combination, a and c combination, b and c combination, or a, b and c combination, wherein a, b and c can be single or multiple.
The embodiment of the invention provides a packaging adhesive film. The packaging adhesive film is applied to a photovoltaic module and comprises a first adhesive film layer 11 and a PID (proportion integration differentiation) resistant layer 12, wherein the PID resistant layer 12 is coated on the first adhesive film layer 11.
Based on the above packaging adhesive film, the packaging adhesive film applied to the photovoltaic module includes a first adhesive film layer 11 and a PID resistant layer 12. Because the anti-PID layer 12 is coated on the first adhesive film layer 11, the coating process can be utilized, the anti-PID component contained in the anti-PID layer 12 can be easily and uniformly dispersed and coated on the surface of the first adhesive film layer 11, and on the basis, the packaging adhesive film with uniform anti-PID performance can be manufactured, so that the anti-PID performance of the photovoltaic module using the packaging adhesive film can be improved, and the performance of the photovoltaic module can be improved. In addition, in the prior art, the anti-PID layer 12 is arranged on the glass, and the problems that the glass is mutually adsorbed, the anti-PID layer 12 adsorbs dust and the like easily occur in the storage environment of the glass. Compared with the situation, when the anti-PID layer 12 is coated on the first adhesive film layer 11, the first adhesive film layer 11 and the anti-PID layer 12 both have certain viscosity, which is similar to the first adhesive film layer 11 in properties and storage conditions. In the storage environment of the first adhesive film layer 11, the probability of pollution to the PID resistant layer 12 can be reduced, the stability of the PID resistant performance of the packaging adhesive film is improved, and the storage cost is reduced. Meanwhile, the material properties of the anti-PID layer 12 and the first adhesive film layer 11 are close. When the anti-PID layer 12 is coated on the first adhesive film layer 11, since both have a certain viscosity, the anti-PID layer 12 can be firmly attached to the first adhesive film layer 11, ensuring the stability of the anti-PID performance. In addition, even if the packaging adhesive film is manufactured, the PID resistant layer 12 can be coated on the packaging adhesive film again, so that the PID resistant performance of the packaging adhesive film is locally improved. In summary, the packaging adhesive film of the embodiment of the invention can improve the uniformity of the PID resistance performance, ensure the stability of the PID resistance performance, and locally improve the PID resistance performance.
The coating method can be spraying, printing, blade coating and the like. Preferably, the coating is by spraying. The spraying is a method of dispersing a raw material into uniform fine droplets by a spray gun, a disc atomizer or the like by means of pressure or centrifugal force and applying the droplets to the surface of an object to be coated. During spraying, spraying equipment can be utilized to spray various parts of the first adhesive film layer 11 to different degrees, so that the distribution of the PID resistant layer 12 on the first adhesive film layer 11 is convenient to adjust, and the uniformity of the PID resistant performance of the packaging adhesive film is improved. In addition, the adhesive force of the anti-PID layer 12 on the first adhesive film layer 11 can be adjusted by adjusting the spraying pressure, so that the bonding strength of the anti-PID layer 12 and the first adhesive film layer 11 is improved.
In practical applications, the coating mode can be air-assisted airless spraying or air spraying. When the air-assisted airless spraying process is adopted, the atomized particles are smaller, the atomization effect of the material of the anti-PID layer 12 can be improved, and the uniformity of spraying the anti-PID layer 12 is further improved. The air spraying is not only suitable for spraying the anti-PID layer 12 material with certain viscosity, but also can better form the anti-PID layer 12 material into glue mist with fine particles, so that the fine and uniform anti-PID layer 12 can be formed on the first glue film layer 11.
The anti-PID layer 12 may be coated on one side of the first adhesive film layer 11, or may be coated on both sides of the first adhesive film layer 11. The coating material of the anti-PID layer 12 comprises a monomer and an anti-PID component. The mass ratio of the monomer to the anti-PID component is 100 (4-25). For example, the mass ratio of monomer to anti-PID component can be 100:4, 100:6, 100:9, 100:10, 100:12, 100:15, 100:18, 100:20, 100:21, 100: 23, 100:25, and the like. When the mass ratio of the monomer to the anti-PID component is within the range, the anti-PID component can be connected in the monomer to form a barrier net, so that the ion migration is effectively blocked, and the packaging adhesive film has better anti-PID performance. Preferably, the mass ratio of the monomer to the anti-PID component can be 100:7, and the monomer and the anti-PID component can be optimally matched in the mass ratio, so that the packaging adhesive film has better anti-PID performance.
The monomer can comprise one or more of dimethyl sulfoxide, tetrahydrofuran, acrylate, glycol and butyl acetate. The anti-PID component may include one or more of a metal oxide, a metal sulfide, a complex containing a group IV a element. The monomers can provide proper viscosity for the coating material of the anti-PID layer 12, so that the anti-PID layer 12 can be firmly adhered to the first adhesive film layer 11 on one hand, and the drawing material of the anti-PID layer 12 can be well atomized on the other hand, thereby facilitating the realization of uniform spraying of the anti-PID layer 12. When the anti-PID component is combined with the monomer, the anti-PID component with better insulating property and the function of inhibiting ion migration can be easily dispersed in the monomer, so that the anti-PID component forms an ion blocking net, and the anti-PID property is improved.
Specifically, the anti-PID component may include one or more of titanium dioxide, indium tin oxide, aluminum-doped zinc oxide, copper oxide, chromium oxide, vanadium pentoxide, iron sesquioxide, cadmium sulfide, tin sulfide, lead sulfide, cadmium indium tetrasulfide, wurtzite, carbon nanotube, gallium nitride, silicon carbide, zinc selenide, and silicon dioxide. These specific PID components can be well combined with monomers to exert a good effect of inhibiting ion migration.
The anti-PID component can have a particle size of less than or equal to 600 nm. For example, the anti-PID component can have a particle size of 600nm, 590nm, 570nm, 540nm, 500nm, 450nm, 420nm, 400nm, 300nm, 200nm, 100nm, 50nm, and the like. At this time, the anti-PID component has a small particle size, which is beneficial to improving the light transmittance of the packaging adhesive film, and facilitates the coating material of the anti-PID layer 12 to form a fine spraying mist material, which is beneficial to uniform spraying.
The thickness of the anti-PID layer 12 may be 10nm to 700 nm. For example, the thickness of the anti-PID layer 12 can be 10nm, 70nm, 90nm, 100nm, 150nm, 200nm, 250nm, 300nm, 400nm, 500nm, 600nm, 700nm, and the like. The anti-PID layer 12 with the thickness not only ensures that the packaging adhesive film has better light transmission, but also ensures that the packaging adhesive film has better anti-PID effect.
The packaging adhesive film further comprises a second adhesive film layer 13, and the PID resistant layer 12 is located between the first adhesive film layer 11 and the second adhesive film layer 13. At this time, the anti-PID layer 12 can be prevented from being exposed to the air, and the stability of the performance of the anti-PID layer 12 can be ensured. Moreover, the two adhesive film layers can improve the adhesion firmness of the PID resistant layer 12 and improve the stability of the packaging adhesive film. The thickness of the first adhesive film layer 11 and the second adhesive film layer 13 is 900 μm or less. For example, the thickness of the adhesive film layer may be 900 μm, 800 μm, 750 μm, 700 μm, 600 μm, 500 μm, 300 μm, 100 μm, 50 μm, 30 μm, or the like. At this time, the light transmittance of the packaging adhesive film can be ensured.
The materials of the first adhesive film layer 11 and the second adhesive film layer 13 may be the same or different. The materials of the adhesive film layers (the first adhesive film layer 11, the second adhesive film layer 13, the first adhesive film layer 11 and the second adhesive film layer 13) comprise matrix resin, peroxide crosslinking agent, assistant crosslinking agent, light stabilizer, antioxidant and coupling agent. The matrix resin is composed of any one or more of ethylene-vinyl acetate copolymer, ethylene-alpha olefin copolymer, ethylene-methyl methacrylate copolymer and polyvinyl butyral according to any proportion. The mass ratio of the matrix resin, the peroxide crosslinking agent, the auxiliary crosslinking agent, the light stabilizer, the antioxidant and the coupling agent is 100 (0.01-2): (0.1-10): (0.01-5): 0.05-5): 0.1-1.
The embodiment of the invention provides a photovoltaic module. The photovoltaic module comprises the packaging adhesive film. The beneficial effects of the photovoltaic module can be referred to the beneficial effects of the packaging adhesive film, which is not described herein.
The photovoltaic module further comprises a battery string group and a glass cover plate, when the photovoltaic module packaging adhesive film comprises a first adhesive film layer 11 and a PID (proportion integration differentiation) resistant layer 12, the battery string group is in contact with the first adhesive film layer 11, and the PID resistant layer 12 is in contact with the glass cover plate; or the battery string group is contacted with the PID resistant layer 12, and the first adhesive film layer 11 is contacted with the glass cover plate. When the anti-PID layer 12 is in contact with the glass cover plate, it can not only play a role of blocking ion migration, but also avoid adverse effects on the battery string.
When the photovoltaic module packaging adhesive film comprises the first adhesive film layer 11, the PID resistant layer 12 and the second adhesive film layer 13, the battery string group is in contact with the first adhesive film, and the glass cover plate is in contact with the second adhesive film layer 13.
The embodiment of the invention also provides a manufacturing method of the packaging adhesive film. The manufacturing method of the packaging adhesive film comprises the following steps:
step S100: a first adhesive film layer 11 is provided. The first adhesive film layer 11 can be obtained by a commercially available method or can be prepared by itself. The manufacturing method of the first adhesive film layer 11 includes: mixing the matrix resin, the peroxide crosslinking agent, the auxiliary crosslinking agent, the light stabilizer, the antioxidant and the coupling agent in proportion, and then extruding and casting the mixture into a film or rolling the mixture into a film by using a single-screw extruder to obtain a first film layer 11.
Step S200: an anti-PID layer 12 is coated on the first adhesive film layer 11. The monomers of the anti-PID layer 12 and the anti-PID component are mixed to form a mixed solution. For example, butyl acetate and nano titanium dioxide are mixed in a mass ratio of 100:7 to form a mixed solution. The mixed solution is then coated on the first adhesive film layer 11 using a coating process. Then irradiating by ultraviolet with wavelength of 300nm for 2min-7min to form the anti-PID layer 12. Specifically, the ultraviolet irradiation time may be 2min, 2.5min, 3min, 3.5min, 4min, 5min, 6min, 7min, etc.
When the packaging adhesive film further includes a second adhesive film layer 13, the anti-PID layer 12 may be covered with the second adhesive film layer 13. The second adhesive film layer 13 is prepared in the same manner as the first adhesive film layer 11.
Step S300: and detecting the PID resistance of the packaging adhesive film. When the PID resistance of the packaging adhesive film reaches the limit condition, the packaging adhesive film can be stored for later use. And when the PID resistance of the packaging adhesive film is determined to be lower than the defined condition, coating a PID resistance layer 12 on the first adhesive film layer 11 again. The recoated anti-PID layer 12 may completely cover the first adhesive film layer 11 or may partially cover the first adhesive film layer 11. In this case, the first adhesive film layer 11 may be sprayed or partially coated to improve the uniformity and PID resistance of the PID resistant layer 12. Meanwhile, local PID resistance performance improvement and personalized PID resistance performance setting are conveniently carried out on the packaging adhesive film.
In order to further explain the above-mentioned packaging adhesive film in detail, embodiments of the present invention further provide specific embodiments of the above-mentioned packaging adhesive film.
Example one
The packaging adhesive film of the embodiment comprises a first adhesive film layer and a PID (proportion integration differentiation) resistant layer. The coating material of the PID resistant layer comprises acrylate, a titanium oxide compound and carbon nanotubes, and the mass ratio of the components is 100:7: 7. The first adhesive film layer is made of ethylene-vinyl acetate copolymer, peroxide crosslinking agent, assistant crosslinking agent, light stabilizer, antioxidant and coupling agent, and the mass ratio of the components is 100:0.4:0.5:0.5: 0.5.
The manufacturing method of the packaging adhesive film of the embodiment comprises the following steps:
the method comprises the following steps: mixing the matrix resin, the peroxide crosslinking agent, the auxiliary crosslinking agent, the light stabilizer, the antioxidant and the coupling agent in proportion, and then extruding, namely calendering and film-forming by using a single-screw extruder to obtain a first film layer. The thickness of the first adhesive film layer is 500 μm.
Step two: mixing acrylic ester, titanium oxide compound and carbon nano tube according to a proportion to form a mixed solution. And then spraying the mixed solution on the first adhesive film layer by using an air-assisted airless spraying process, and irradiating for 3min by using ultraviolet rays with the wavelength of 300nm to form a PID (potential induced degradation) resistant layer. The anti-PID layer thickness was 120 nm.
Example two
The packaging adhesive film of the present embodiment is substantially the same as the packaging adhesive film of the first embodiment, except that: and spraying two anti-PID layers on the first adhesive film layer. The total thickness of the anti-PID layer was 240 nm.
Comparative example 1
The packaging adhesive film of the present comparative example is a commercially available polyethylene-polyvinyl acetate copolymer (EVA) adhesive film.
Three types of packaging adhesive films of the first embodiment, the second embodiment and the first embodiment are subjected to a material volume resistivity test, a PID test and an aging test. The properties of the packaging adhesive film are shown in Table 1.
TABLE 1 Properties of packaging adhesive films
As can be seen from table 1, compared with the conventional EVA encapsulant film, the encapsulant film provided in the embodiments of the present invention has a large volume resistivity and a good PID resistance. After the PID test and the aging test, the volume resistivity of the packaging adhesive film implemented by the invention is at least twice of the volume resistivity of the conventional EVA. After aging for 48 hours, the volume resistivity of the packaging adhesive film of the embodiment of the invention is at least 1.5 times of the volume resistivity of the conventional EVA.
It can be seen from the comparison between the first and second examples that the volume resistivity of the adhesive packaging film of the second example is greater than that of the adhesive packaging film of the first example. Therefore, the PID resistant layer is sprayed for multiple times, and the PID resistant performance of the packaging adhesive film can be improved.
The photovoltaic modules were fabricated using the encapsulant films of examples one, two and comparative example one. The three photovoltaic modules are different only in packaging adhesive films, and the other structures and processes are the same. The power of the three photovoltaic modules was measured and is shown in table 2.
Table 2 photovoltaic module performance comparison
As can be seen from table 2, after 96h of PID test, the power loss of the photovoltaic module fabricated by using the encapsulant film of the comparative example one is 4.57%, and the power loss of the photovoltaic module fabricated by using the encapsulant films of the embodiments one and two is 2.82% and 2.22%. After 96h, the power loss of the photovoltaic module manufactured by the packaging adhesive film is less than 62% of that of the comparative example I. Therefore, the anti-PID performance of the packaging adhesive film is superior to that of an EVA packaging adhesive film.
With the prolonging of the PID test time, after 192 hours, the power loss of the photovoltaic module manufactured by the packaging adhesive film is less than 56% of that of the comparative example. Therefore, as the PID test time is increased, the PID durability resistance and the PID stability resistance of the packaging adhesive film are superior to those of the packaging adhesive film of the comparative example I.
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While the invention has been described in conjunction with specific features and embodiments thereof, it will be evident that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (12)
1. The packaging adhesive film is applied to a photovoltaic module and is characterized by comprising a first adhesive film layer and a PID (proportion integration differentiation) resistant layer, wherein the PID resistant layer is coated on the first adhesive film layer.
2. The packaging adhesive film of claim 1, wherein the coating is performed by spraying.
3. The packaging adhesive film of claim 1, wherein the coating is air-assisted airless spraying or air spraying.
4. The packaging adhesive film according to claim 1, wherein the coating material of the anti-PID layer comprises a monomer and an anti-PID component, and the mass ratio of the monomer to the anti-PID component is 100 (4-25); wherein the monomer comprises one or more of dimethyl sulfoxide, tetrahydrofuran, acrylate, glycol and butyl acetate; the anti-PID component comprises one or more of a metal oxide, a metal sulfide, a complex containing a group IV a element.
5. The packaging adhesive film of claim 4, wherein the anti-PID component comprises one or more of titanium dioxide, indium tin oxide, aluminum-doped zinc oxide, copper oxide, chromium oxide, vanadium pentoxide, ferric oxide, cadmium sulfide, tin sulfide, lead sulfide, cadmium indium tetrasulfide, CuZnite, carbon nanotube, gallium nitride, silicon carbide, zinc selenide, and silicon dioxide.
6. The packaging adhesive film according to claim 4, wherein the mass ratio of the monomer to the PID resistant component is 100:7, and the particle size of the PID resistant component is less than or equal to 600 nm; the thickness of the PID resistant layer is 10 nm-700 nm.
7. The packaging adhesive film according to any one of claims 1 to 5, further comprising a second adhesive film layer, wherein the PID resistant layer is located between the first adhesive film layer and the second adhesive film layer; the thickness of the first adhesive film layer and the second adhesive film layer is less than 900 micrometers.
8. A photovoltaic module comprising the encapsulant film of any one of claims 1 to 7.
9. The photovoltaic module according to claim 8, further comprising a battery string set and a glass cover plate, wherein when the photovoltaic module packaging adhesive film comprises a first adhesive film layer and a PID resistant layer, the battery string set is in contact with the first adhesive film layer, and the PID resistant layer is in contact with the glass cover plate; or the battery string group is contacted with the PID resistance layer, and the first adhesive film layer is contacted with the glass cover plate;
when the photovoltaic module packaging adhesive film comprises a first adhesive film layer, a PID (proportion integration differentiation) resistant layer and a second adhesive film layer, the battery string group is in contact with the first adhesive film layer, and the glass cover plate is in contact with the second adhesive film layer.
10. A manufacturing method of a packaging adhesive film is characterized by comprising the following steps:
providing a first adhesive film layer;
and coating a PID (proportion integration differentiation) resistant layer on the first adhesive film layer.
11. The method of claim 10, wherein coating the anti-PID layer on the first adhesive film layer comprises: irradiating the PID resistant layer with ultraviolet light.
12. The method for manufacturing a packaging adhesive film according to claim 10 or 11, wherein after coating the anti-PID layer on the first adhesive film layer, the method for manufacturing a packaging adhesive film further comprises:
and determining that the PID resistance of the packaging adhesive film is lower than a limited condition, and coating a PID resistance layer on the first adhesive film layer again.
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